CN116761068B

CN116761068B - Camera module and electronic equipment

Info

Publication number: CN116761068B
Application number: CN202311039674.8A
Authority: CN
Inventors: 罗越; 焦晗; 王新权; 袁高炜
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-08-17
Filing date: 2023-08-17
Publication date: 2023-11-17
Anticipated expiration: 2043-08-17
Also published as: CN116761068A

Abstract

The embodiment of the application provides a camera module and electronic equipment, wherein the camera module comprises a lens; the image sensor is positioned on the light emitting side of the lens and comprises a photosensitive element; and the field lens is positioned between the lens and the photosensitive element. In the embodiment of the application, the field lens is arranged between the lens and the photosensitive element, and can turn the chief ray from the lens and change the angle of the chief ray so as to adapt to the chief ray angle of the image sensor, thereby being beneficial to improving the luminous flux, reducing the crosstalk among different pixel units, improving the adverse phenomena of dark edges, color cast and the like of pictures and improving the shooting quality.

Description

Camera module and electronic equipment

Technical Field

The present application relates to the field of electronic products, and in particular, to a camera module and an electronic device.

Background

At present, the camera is already a standard component of electronic products such as mobile phones, notebook computers and the like, and along with the increasing requirements of people on the performance of the electronic products, the shooting quality of the camera is also required to be continuously improved.

The lens and the image sensor are key components constituting the camera. In the process of shooting, incident light rays can pass through the lens and reach the pixel unit of the image sensor. In the related art, there is a Chief Ray Angle (CRA) between the lens and the image sensor, wherein, as shown in fig. 1a, the chief ray angle of the lens 90 refers to the angle between the light E from the edge of the field of view and the optical axis 901 of the lens, and the fields of view of the lens 90 are different, and the chief ray angles thereof are different. As shown in fig. 1b, the chief ray angle of the image sensor refers to the maximum angle of the ray E that can be incident on the light absorbing region 92 of the pixel unit 91. When shooting, the angle values of the principal rays of the two may be mismatched, so that the luminous flux is small, the edge of a shot picture is dark, or the light crosstalk is caused, and adverse phenomena such as color cast and the like occur, so that the shooting quality is poor.

Therefore, how to achieve matching of the chief ray angles of the lens and the image sensor and improve the shooting quality has become a problem to be solved by those skilled in the art.

Disclosure of Invention

The embodiment of the application aims to provide an image pickup module and electronic equipment so as to realize the matching of the principal ray angles of a lens and an image sensor and improve the shooting quality.

An embodiment of a first aspect of the present application provides an image capturing module, including a lens; the image sensor is positioned on the light emitting side of the lens and comprises a photosensitive element; and the field lens is positioned between the lens and the photosensitive element.

When the camera module provided by the embodiment of the application is used, light enters from the light-entering side of the lens, the lens is used for converging the light, the light exits from the light-exiting side of the lens and enters the field lens, the field lens is used for turning the main light, the turned light enters the photosensitive element of the image sensor, and the photosensitive element converts the received optical signal into an electrical signal and outputs the electrical signal. Compared with the related art, in the embodiment of the application, the field lens is arranged between the lens and the photosensitive element, and can turn the chief ray from the lens, change the angle of the chief ray, and adapt to the chief ray angle of the image sensor, thereby being beneficial to improving the luminous flux, reducing the crosstalk among different pixel units, improving the adverse phenomena of darkening, color cast and the like at the edge of the picture, and improving the shooting quality.

In some embodiments of the application, the field lens is a fresnel lens or a super-surface lens.

When the field lens is a Fresnel lens, the field lens can obtain a light modulation effect equivalent to that of a common convex lens and has a thinner size compared with the common lens. When the field lens is a super-surface lens, the field lens can realize accurate regulation and control of light rays.

In some embodiments of the application, the field lens is attached to a side of the image sensor near the lens, or the field lens is integrated with the image sensor. Thus, the field lens is convenient to be laid out.

In some embodiments of the present application, the image sensor further includes a microlens array, the microlens array being located between the field lens and the photosensitive element, the microlens array having a plurality of lens units arranged in an array, the photosensitive element including a plurality of pixel units, the lens units being disposed corresponding to the pixel units.

Therefore, the area of the photosensitive area of each pixel unit can be increased, so that the pixel filling factor is increased, more light can enter the pixel units, and further the shooting quality is improved.

In some embodiments of the application, the image sensor further comprises: a frame and a glass cover plate; the frame defines a mounting groove, and the micro lens array and the photosensitive element are sequentially mounted in the mounting groove along the light emergent direction of the lens; the glass cover plate is positioned on the light incident side of the micro lens array; the field lens is positioned on one side of the glass cover plate, which is away from the micro lens array, or is integrated in the image sensor, and is positioned on one side of the glass cover plate, which is close to the micro lens array. Therefore, the field lens is conveniently distributed in the camera module.

In some embodiments of the application, the glass cover plate is mounted on the frame, and the field lens is fixed on a surface of one side of the glass cover plate, which is away from the microlens array; or the field lens frame is arranged on one side of the glass cover plate, which is far away from the micro lens array, and a gap is arranged between the field lens frame and the glass cover plate. Thereby facilitating the connection of the field lens to the image sensor.

In some embodiments of the present application, the image sensor further includes a support frame connected to the frame, and the field lens holder is disposed on the support frame so as to be located on a side of the glass cover plate facing away from the microlens array and a gap is provided between the field lens holder and the glass cover plate.

Therefore, the field lens can be installed, and the influence on light transmission caused by fixation of optical glue between the field lens and the glass cover plate can be avoided.

In some embodiments of the application, the field lens is integrated in the image sensor, the field lens is mounted on the frame, and the glass cover plate is fixed on a surface of the field lens, which is away from the microlens array. Thereby, the field lens can be integrated inside the image sensor.

In some embodiments of the application, a side of the microlens array facing away from the photosensitive element is provided with a planarizing film; the glass cover plate is attached to the surface of one side, facing away from the micro lens array, of the planarization film, and the field lens is fixed on the surface of one side, facing away from the micro lens array, of the glass cover plate; or the field lens is integrated in the image sensor, the field lens is attached to the surface of one side of the planarization film, which is away from the micro lens array, and the glass cover plate is fixed on the surface of one side of the field lens, which is away from the micro lens array.

Therefore, no air gap exists between the glass cover plate or the field lens and the micro lens array, the influence on the light transmission path can be improved, and stray light is effectively controlled.

In some embodiments of the application, the image sensor further comprises: the frame is used for defining a mounting groove, and the micro lens array and the photosensitive element are sequentially mounted in the mounting groove along the light emergent direction of the lens; the field lens is integrated in the image sensor, is an integrated field lens, is installed on the frame and is positioned on the light incident side of the micro lens array, and one or two light transmitting surfaces of the integrated field lens have a field lens function.

Therefore, the integrated field lens not only has the field lens function, but also can replace the glass cover plate, so that the number of components of the image sensor can be reduced, and the assembly and the light and thin design of the image sensor are facilitated.

In some embodiments of the application, the integrated field lens has an infrared light absorbing function.

Thus, the integrated field lens can integrate the function of an infrared filter for absorbing infrared light.

In some embodiments of the present application, a planarization film is disposed on a side of the microlens array facing away from the photosensitive element, and the integrated field lens is attached to a surface of the planarization film on a side facing away from the microlens array.

Therefore, no air gap exists between the integrated field lens and the micro lens array, the influence on the light transmission path can be improved, and stray light is effectively controlled.

In some embodiments of the present application, the camera module further includes a circuit board, and the circuit board is located on a side of the photosensitive element, which is away from the lens, and is connected to the image sensor. Thus, the circuit board can transmit the electrical signal after photoelectric conversion of the image sensor to the main board of the electronic device.

In some embodiments of the present application, the camera module further includes: the motor is positioned on the light emitting side of the lens and is connected with the lens; the motor is fixed on one side of the base through a film, and the circuit board is positioned on the other side of the base; the center of the base is provided with a mounting hole, the peripheral wall of the mounting hole is provided with a partition plate, the partition plate divides the mounting hole into a first mounting cavity and a second mounting cavity, and the image sensor is positioned in the first mounting cavity and connected with the circuit board; the infrared filter is fixed on the partition plate and positioned in the second mounting cavity.

In the embodiment of the application, the focusing (also called focusing) and zooming functions of the lens can be realized by arranging the motor. Through setting up infrared light filter, can absorb infrared light to eliminate infrared light and to imaging influence, improve shooting quality. Through setting up the base, make things convenient for the installation of motor, infrared light filter, image sensor and circuit board.

An embodiment of a second aspect of the present application provides an electronic device, including the camera module of any one of the embodiments of the first aspect. Since the camera module of any embodiment of the first aspect is provided, the camera module of any embodiment of the first aspect also has the advantages of any embodiment of the first aspect, and will not be described herein.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1a is a chief ray angle illustration of a lens;

FIG. 1b is a chief ray angle illustration of an image sensor;

FIG. 2a is a rear view of an electronic device according to an embodiment of the application;

FIG. 2b is a side view of the electronic device of FIG. 2 a;

fig. 3 is a split schematic diagram of an image capturing module according to a first embodiment of the present application;

FIG. 4 is a schematic diagram of an image sensor of the camera module shown in FIG. 3;

FIG. 5a is a light path diagram of a camera module according to a first embodiment of the present application;

FIG. 5b is an enlarged schematic view of portion A of FIG. 5a in a first condition;

FIG. 5c is an enlarged schematic view of portion A of FIG. 5a in a second condition;

FIG. 6 is a schematic diagram illustrating connection between a field lens and an image sensor of the camera module shown in FIG. 3;

FIG. 7a is a schematic diagram of a pixel unit and a lens unit of the image sensor shown in FIG. 6;

FIG. 7b is a schematic diagram II of a pixel unit and a lens unit of the image sensor shown in FIG. 6;

FIG. 8a is a schematic view of a base of the camera module shown in FIG. 3;

FIG. 8B is a schematic cross-sectional view of FIG. 8a at B-B;

FIG. 9a is a schematic diagram illustrating the assembly of the base 360 and the IR filter 380 in FIG. 3;

FIG. 9b is a schematic cross-sectional view of FIG. 9a at C-C;

fig. 10 is a schematic diagram illustrating connection between a field lens of a camera module and an image sensor according to a second embodiment of the present application;

FIG. 11 is a schematic diagram illustrating connection between a field lens of a camera module and an image sensor according to a third embodiment of the present application;

fig. 12 is a schematic structural diagram of an image sensor of a camera module according to a fourth embodiment of the present application;

fig. 13 is a schematic structural diagram of an image sensor of a camera module according to a fifth embodiment of the present application;

fig. 14 is a schematic structural diagram of an image sensor of a camera module according to a sixth embodiment of the present application;

fig. 15 is a schematic structural diagram of an image sensor of a camera module according to a seventh embodiment of the present application;

fig. 16 is a schematic structural diagram of an image sensor of an image capturing module according to an eighth embodiment of the present application;

reference numerals illustrate:

in fig. 1a and 1 b: a lens 90; an optical axis 901; a pixel unit 91; a light absorbing region 92; light ray E;

in fig. 2a to 16: an electronic device 10; a fuselage 100; a screen 200; a camera module 300; a lens 310; an image sensor 320; a photosensitive element 321; a pixel unit 3211; a light receiving region 3212; a metal layer 3213; a frame 322; a mounting groove 323; a microlens array 324; a lens unit 3241; a glass cover plate 325; a support 326; optical glue 327; a planarization film 328; an integrated field lens 329; a light-passing surface 3291; a field lens 330; a motor 340; film 350; a base 360; partition plate 361; a mounting hole 362; a first mounting cavity 3621; a second mounting cavity 3622; a circuit board 370; an infrared filter 380; and light ray E.

Detailed Description

For a better understanding of the technical solution of the present application, the following detailed description of the embodiments of the present application refers to the accompanying drawings.

In order to clearly describe the technical solution of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same item or similar items having substantially the same function and effect. For example, the first connection portion and the second connection portion are for distinguishing different connection portions, and the sequence thereof is not limited. It will be understood by those skilled in the art that the words "first," "second," etc. do not limit the number and location, and that the words "first," "second," etc. do not necessarily differ.

In the present application, the words "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

Embodiments of the present application provide an electronic device 10, where the electronic device 10 includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant, or a wearable device. The electronic device 10 will be described below as a mobile phone.

Referring to fig. 2a and 2b, wherein fig. 2a shows a rear view of the electronic device 10 of an embodiment of the present application; fig. 2b shows a side view of the electronic device 10 of fig. 2 a.

The electronic device 10 may include a body 100 and a screen 200, the screen 200 overlying the body 100. A camera module 300 is disposed in the main body 100 to provide a photographing function for the electronic device 10.

The camera module 300 may be used for front-end camera shooting or rear-end camera shooting of the electronic device 10. In fig. 2a and 2b, taking the image capturing module 300 as a rear-mounted image capturing example, the lens 310 of the image capturing module 300 is exposed to the rear housing of the body 100 of the electronic device 10, and during capturing, an image is captured by the image capturing module 300 for capturing.

As described in the background art, in the related art, a lens and an image sensor are key components constituting an image capturing module. The chief ray angle exists for both the lens and the image sensor. When shooting, the angle of the chief rays of the two may be mismatched, so that the luminous flux is smaller, the edge of a shot picture is dark, or the light crosstalk is caused, the adverse phenomena such as color cast and the like occur, and the shooting quality is poor.

In view of this, referring to fig. 3 and 4, fig. 3 shows a split schematic diagram of an image capturing module 300 according to a first embodiment of the present application; fig. 4 shows a schematic structural diagram of the image sensor 320 in fig. 3.

As shown in fig. 3 and 4, a first embodiment of the present application provides an image capturing module 300 to achieve matching of principal ray angles of a lens 310 and an image sensor 320, so as to improve capturing quality.

The image capturing module 300 includes a lens 310, an image sensor 320 and a field lens 330, wherein the image sensor 320 is located on the light emitting side of the lens 310, and the image sensor 320 includes a photosensitive element 321. The field lens 330 is located between the lens 310 and the photosensitive element 321.

Referring to fig. 5a to 5c, fig. 5a shows an optical path diagram of an image capturing module 300 according to a first embodiment of the present application, and fig. 5b shows an enlarged schematic view of a portion a in fig. 5a in a first case; fig. 5c shows an enlarged schematic view of the part a of fig. 5a in a second situation.

When the image capturing module 300 of the embodiment of the present application is used, the chief ray enters from the light incident side of the lens 310, and the lens 310 is used for converging the chief ray. As shown in fig. 5a to 5c, the principal ray E enters the field lens 330 after being emitted from the light emitting side of the lens 310, the field lens 330 is used for turning the principal ray E, the turned principal ray E enters the photosensitive element 321 of the image sensor 320, and the photosensitive element 321 converts the optical signal into an electrical signal and outputs the electrical signal. Compared with the related art, in the embodiment of the application, the field lens 330 is disposed between the lens 310 and the photosensitive element 321, and the field lens 330 can turn the chief ray E from the lens 310 and change the angle thereof to adapt to the chief ray angle of the image sensor 320, thereby being beneficial to improving the luminous flux, reducing the crosstalk between different pixel units, improving the adverse phenomena such as darkening and color cast of the picture edge, and improving the shooting quality.

The field lens 330 is a lens placed near a focal plane in the optical system, and serves to turn the principal ray E.

It should be noted that fig. 5a to 5c are mainly used for illustrating the light path diagram of the image capturing module 300, wherein the lens 310, the field lens 330 and the image sensor 320 are all schematic diagrams.

In one embodiment of the present application, the field lens 330 may be a fresnel lens. The Fresnel lens is a condensing lens with a stepped surface, and is formed by cutting a continuous curved surface of a common convex lens into a discontinuous curved surface with a constant curvature, and removing materials of a linear propagation part inside the common convex lens, so that a light modulation effect equivalent to the common convex lens is obtained, and the Fresnel lens has a thinner size compared with the common lens. By adopting the fresnel lens, not only the turning of the chief ray can be realized, but also the thickness of the field lens 330 can be made thinner, which is beneficial to the light and thin design of the camera module 300.

In the first embodiment of the present application, the field lens 330 may also be a super-surface lens, where the super-surface lens has a plurality of super-surface units, and by changing the size or angle of the super-surface units, the phase mutation generated by the super-surface units at the position can be controlled, so as to realize static regulation and control of parameters such as phase and outgoing wavefront of the light E, and further realize regulation and control of the required light deflection angle, with higher regulation and control precision.

In the first embodiment of the present application, the field lens 330 may be attached to a side of the image sensor 320 near the lens 310. The image sensor 320 may be a conventional cmos sensor, thereby facilitating the attachment of the field lens 330 to existing image sensor 320 products.

Specifically, referring to fig. 6, fig. 6 shows a schematic diagram of connection between a field lens 330 and an image sensor 320 of the camera module 300 according to the first embodiment of the application.

As shown in fig. 6, the image sensor 320 may further include a frame 322. The image sensor 320 further includes a microlens array 324, and the frame 322 defines a mounting groove 323, and the microlens array 324 and the photosensitive element 321 are sequentially mounted in the mounting groove 323 along the light emitting direction of the lens 310. Specifically, the microlens array 324 may be attached to the light incident side surface of the photosensitive element 321. The microlens array 324 has a plurality of lens units 3241 arranged in an array, the photosensitive element 321 includes a plurality of pixel units 3211, and the lens units 3241 and the pixel units 3211 are disposed correspondingly.

Referring to fig. 7a and 7b, fig. 7a shows a corresponding schematic diagram one of a pixel unit 3211 and a lens unit 3241 of the photosensitive element 321 in fig. 6; fig. 7b shows a second schematic diagram of one pixel unit 3211 and a lens unit 3241 of the photosensitive element 321 in fig. 6.

As shown in fig. 7a, the lens unit 3241 may be located directly above the pixel unit 3211, or as shown in fig. 7b, the lens unit 3241 may be disposed offset from the pixel unit 3211. The lens unit 3241 may refract the light E. By providing the lens unit 3241, the photosensitive area of each pixel unit 3211 can be increased, so as to increase the pixel filling factor, and more light E can enter the pixel units 3211, thereby being beneficial to improving the shooting quality.

Specifically, as shown in fig. 7a and 7b, the periphery of each pixel unit 3211 is provided with a metal layer 3213 of a transistor or the like. When the microlens array 324 is not disposed, the light E in the edge area enters the pixel unit 3211 and is blocked by the metal layer 3213, so that the edge area of the pixel unit 3211 cannot be sensitized. In the embodiment of the present application, by arranging the microlens array 324, the lens unit 3241 of the microlens array 324 can refract the edge light E of the corresponding pixel unit 3211, so that the light E enters the light receiving region 3212 after being refracted, and thus the photosensitive area of each pixel unit 3211 can be increased, and the pixel filling factor is increased. The pixel fill factor refers to the ratio of the area of the photosensitive region in the pixel unit 3211 to the total area of the pixel unit 3211.

In other embodiments of the present application, the image sensor 320 may not include the microlens array 324, but refract the outgoing light of the lens 310 through the field lens 330 to enter the pixel units 3211, so that the photosensitive area of each pixel unit 3211 may be increased, thereby increasing the pixel filling factor.

As shown in fig. 6, the image sensor 320 further includes a glass cover plate 325, and the glass cover plate 325 is mounted on one end surface of the frame 322 and is positioned at the light incident side of the microlens array 324. The field lens 330 is fixed to the side of the glass cover plate 325 facing away from the microlens array 324 by optical glue 327. The optical glue 327 has good optical transmittance, and the refractive index can be similar to that of glass. Thereby facilitating the fixation of the field lens 330 and having less impact on the light E transmission.

In the first embodiment of the present application, the parameters of the field lens 330 are designed according to the chief ray angle value of the lens 310 and the chief ray angle value of the image sensor 320.

Specifically, first, an aperture is divided on the surface of the field lens 330, and coordinates (xi, yi) are given, and since the field lens 330 is located near the image plane, the coordinates on the surface of the field lens 330 can be approximated as coordinates on the surface of the image sensor 320.

Next, for the known coordinates (xi, yi), there must be a chief ray E corresponding to the coordinate, where the chief ray E has an incident angle pi and an exit angle qi on the field lens 330, the incident angle pi is obtained according to the chief ray angle value of the lens 310, and the exit angle qi is obtained according to the chief ray angle requirement of the image sensor 320.

Finally: according to Snell's lawThe normal vector Ni for that point on field lens 330 can be found.

If field lens 330 is a Fresnel lens, then any surface shape can be fitted based on the existing coordinates (xi, yi) and the calculated normal vector Ni. The fitting surface is translated in segments and the curvature change due to the thick lens is taken into account to obtain the required field lens 330 fabrication equation.

If the field lens 330 is a super-surface lens, then an arbitrary surface profile can be fitted according to the existing coordinates (xi, yi) and the calculated normal vector Ni, the fitted surface profile is converted into a phase profile, and the phase variation caused by the super-surface unit is considered to obtain the required super-surface profile. The design parameters obtained by the method comprise: the length, width, and height dimensions of the subsurface unit, and the period of the subsurface unit in two dimensions.

It should be noted that, in the first embodiment, the principal ray angle value of the lens 310 may be determined after the lens 310 is manufactured.

The chief ray angle requirement of the image sensor 320 is divided into two cases according to the relative positional relationship of the lens unit 3241 and the pixel unit 3211.

In the first case, in the image sensor 320, as shown in fig. 7a, the lens unit 3241 is located directly above the pixel unit 3211, for this purpose, as shown in fig. 5b, the exit angle qi of the field lens 330 may be 0 °, that is, the field lens 330 is configured to modulate all the chief rays E exiting from the lens 310 to 0 °, thereby not only increasing the luminous flux of the pixel unit 3211 to the greatest extent, reducing the crosstalk between different pixels, realizing the high-flux photoelectric signal conversion function, but also reducing the processing requirements on the field lens 330 and the image sensor 320.

In the second case, as shown in fig. 7b, in the image sensor 320, the lens unit 3241 is disposed offset with respect to the pixel unit 3211, whereby only the incident light E of a specific angle can be incident on the light receiving region 3212 of the pixel unit 3211 after passing through the lens unit 3241. In this regard, as shown in fig. 5c, the exit angle qi of the field lens 330 needs to reach the specific angle, that is, the field lens 330 is configured to calibrate all the light rays E exiting from the lens 310, so that the exit angle thereof is well matched with the image sensor 320, thereby improving the luminous flux of the pixel unit 3211, reducing the crosstalk between different pixels, and realizing the high-flux photoelectric signal conversion function.

In the image sensor 320 of the embodiment of the present application, it is preferable to adopt the first case, that is, as shown in fig. 7a, that the lens unit 3241 is located directly above the pixel unit 3211. Thereby, the luminous flux of the pixel unit 3211 can be maximized.

Of course, considering that the field lens 330 is attached to the surface of the image sensor 320 in the embodiment of the present application, the image sensor 320 may be an existing product, and thus, the microlens array 324 shown in fig. 7b may be set to be offset, so as to achieve matching with the lenses 310 with different chief ray angles.

Note that, the offset of the lens unit 3241 may result in a reduction in the coverage area of the lens unit 3241 on the corresponding pixel unit 3211, and thus, compared to fig. 7a, the photosensitive area of the pixel unit 3211 shown in fig. 7b is reduced, resulting in a reduction in luminous flux.

As shown in fig. 3, in the embodiment of the application, the camera module 300 further includes a motor 340, and the motor 340 is located on the light emitting side of the lens 310 and connected to the lens 310. The lens 310 is movable in the optical axis direction by driving of a motor 340 to achieve optical focusing (also referred to as focusing) and zooming. The optical zooming is to change the focal position by moving the relative position of the lenses inside the lens 310, so as to change the focal length of the lens 310 and change the view angle of the lens 310, thereby realizing the enlargement and reduction of the image. The optical focusing refers to adjusting the position of the entire lens 310 relative to the photosensitive element 321 to control the image distance, so as to make the imaging clearer.

As shown in fig. 3, the camera module 300 further includes a base 360, and the motor 340 may be fixed to one side of the base 360 through a film 350.

Referring to fig. 8a and 8b, wherein fig. 8a shows a schematic structural view of the base 360 of fig. 4; fig. 8B shows a schematic cross-sectional view of fig. 8a at B-B.

As shown in fig. 8a and 8b, a mounting hole 362 is provided at the center of the base 360. The peripheral wall of the mounting hole 362 is provided with a partition plate 361, and the partition plate 361 divides the mounting hole 362 into a first mounting chamber 3621 and a second mounting chamber 3622.

Referring to fig. 9a and 9b, fig. 9a shows a schematic assembly of the base 360 and the ir filter 380 in fig. 3; fig. 9b shows a schematic cross-sectional view of fig. 9a at C-C.

As shown in fig. 3, 9a and 9b, the camera module 300 further includes a circuit board 370, the circuit board 370 is mounted on a side of the base 360 facing away from the motor 340, the field lens 330 and the image sensor 320 are located in the first mounting cavity 3621, the image sensor 320 is connected to the circuit board 370, and the circuit board 370 transmits the electrical signals photoelectrically converted by the image sensor 320 to a motherboard of the electronic device 10.

The camera module 300 further includes an infrared filter 380, where the infrared filter 380 is fixed on the partition 361 and located in the second installation cavity 3622. The principal ray emitted from the lens 310 is emitted to the field lens 330 after passing through the infrared filter 380, and the infrared filter 380 is used for absorbing infrared light, so as to eliminate the influence of the infrared light on imaging and improve shooting quality.

Referring to fig. 10, fig. 10 is a schematic diagram showing connection between a field lens 330 and an image sensor 320 of an image capturing module 300 according to a second embodiment of the present application.

In the second embodiment of the present application, unlike the first embodiment, the field lens 330 is not fixed on the surface of the glass cover plate 325 facing away from the microlens array 324 by the optical glue 327, but is mounted on the side of the glass cover plate 325 facing away from the microlens array 324, and a gap is provided between the field lens and the glass cover plate 325.

Specifically, the image sensor 320 further includes a support 326, and the support 326 is connected to the frame 322. Specifically, the support bracket 326 may be attached to the frame 322 by adhesive or other attachment means, or the support bracket 326 may be integrally formed with the frame 322.

The field lens 330 may be mounted on the support frame 326 by glue such that the field lens 330 is located on a side of the glass cover plate 325 facing away from the microlens array 324 and an air gap is present between the field lens 330 and the glass cover plate 325. Therefore, the field lens 330 can be installed, and the influence on the transmission of the light E caused by the fixation of the field lens 330 and the glass cover plate 325 through the optical glue 327 can be avoided.

Referring to fig. 11, fig. 11 is a schematic diagram showing connection between a field lens 330 and an image sensor 320 of an image capturing module 300 according to a third embodiment of the present application.

In the third embodiment of the present application, unlike the first embodiment, in the image sensor 320, a planarization film 328 is disposed on a side of the microlens array 324 facing away from the photosensitive element 321, and the glass cover plate 325 is not mounted on the frame 322 but is adhered to a surface of the planarization film 328 facing away from the microlens array 324 by optical glue (not shown). Therefore, no air gap exists between the glass cover plate 325 and the micro lens array 324, so that the influence on the transmission path of the light E can be improved, and stray light can be effectively controlled.

Referring to fig. 12, fig. 12 is a schematic diagram showing the structure of an image sensor 320 of an image capturing module 300 according to a fourth embodiment of the present application.

In the fourth embodiment of the present application, unlike the first embodiment, the field lens 330 is not attached to the side of the image sensor 320 near the lens 310, but is integrated with the image sensor 320, that is, the field lens 330 is a part of the image sensor 320.

Specifically, the field lens 330 is located on the side of the glass cover plate 325 that is adjacent to the microlens array 324, i.e., the field lens 330 is located between the glass cover plate 325 and the microlens array 324. The field lens 330 may be mounted at one end of the frame 322 and the glass cover plate 325 is secured to the side of the field lens 330 facing away from the microlens array 324 by optical glue 327. Thereby, the field lens 330 can be integrated inside the image sensor 320.

It will be appreciated that in the embodiment of the present application, since the field lens 330 is integrated inside the image sensor 320, the image sensor 320 is not yet a complete product when the parameter design of the field lens 330 is performed, and the requirement of the chief ray angle is not met, where the exit angle qi of the field lens 330 may be set to 0 °. In this way, each lens unit 3241 of the microlens array 324 can be positioned directly above the corresponding pixel unit 3211, and offset arrangement is not required, so that the field lens 330 can be manufactured conveniently, and the luminous flux of the pixel unit 3211 can be improved to the greatest extent.

Referring to fig. 13, fig. 13 is a schematic diagram showing a structure of an image sensor 320 of an image capturing module 300 according to a fifth embodiment of the present application.

In the fifth embodiment of the present application, unlike the fourth embodiment, in the image sensor 320, a planarization film 328 is disposed on a side of the microlens array 324 facing away from the photosensitive element 321, and the field lens 330 is not mounted on the frame 322 but is adhered to a surface of the planarization film 328 facing away from the microlens array 324 by optical glue (not shown). Thus, there is no air gap between the field lens 330 and the microlens array 324, which can further improve the turning control of the chief ray E and, at the same time, can effectively control stray light.

Referring to fig. 14, fig. 14 shows a schematic structural diagram of an image sensor 320 of an image capturing module 300 according to a sixth embodiment of the present application.

In the sixth embodiment of the present application, unlike the fourth embodiment, the image sensor 320 does not include the glass cover plate 325, the field lens 330 is an integrated field lens 329, and the integrated field lens 329 may replace the glass cover plate 325. The material of the integrated field lens 329 is mainly silicon oxide, and can be mixed with oxides of boron, sodium, potassium, zinc, lead, magnesium, calcium, barium and the like according to requirements, so that the integrated field lens 329 has good optical permeability.

The integrated field lens 329 is mounted on top of the frame 322 and has an upper light-permeable surface 3291 and a lower light-permeable surface 3291, wherein one or both light-permeable surfaces 3291 have a field lens function, i.e. can be used for turning the light E. Therefore, the integrated field lens 329 not only has a field lens function, but also can replace the glass cover plate 325, so that the number of components of the image sensor 320 can be reduced, and the assembly and the light and thin design of the image sensor 320 are facilitated.

In practice, the light-passing surface 3291 of the integrated field lens 329 may perform a field lens function according to fresnel principles, i.e., the light-passing surface 3291 has a discontinuous curvature, which may be formed by, but not limited to, direct injection molding of the integrated field lens 329 in one piece, finishing on the finished integrated field lens 329 surface, and the like.

The light-transmitting surface 3291 of the integrated field lens 329 may also perform a field lens function according to the principle of a super-surface lens, i.e., by arranging different surface units to form a surface with a specific phase adjusting effect, and the forming method includes, but is not limited to, ion beam etching, chemical etching, nanoimprint lithography, and the like.

Referring to fig. 15, fig. 15 shows a schematic structural diagram of an image sensor 320 of an image capturing module 300 according to a seventh embodiment of the present application.

In the seventh embodiment of the present application, unlike the sixth embodiment, the integrated field lens 329 also has an infrared light absorbing function. Thus, the integrated field lens 329 may integrate the function of the infrared filter 380 for absorbing infrared light. To this end, methods that can be used include, but are not limited to, replacing the material of the integrated field lens 329 with an infrared absorbing resin, an infrared absorbing glass, or other infrared absorbing material, which does not affect its function as the integrated field lens 329 in embodiment six.

Further, since the integrated field lens 329 has an infrared light absorbing function, the image capturing module 300 may not include the infrared filter 380 and the base 360 for mounting the infrared filter 380, and the motor 340 may be directly fixed to the frame 322 of the image sensor 320 through the film 350. Therefore, the number of components of the camera module 300 can be reduced, the height of the camera module 300 can be reduced, and the light and thin design of the camera module 300 is facilitated.

Referring to fig. 16, fig. 16 shows a schematic structural diagram of an image sensor 320 of an image capturing module 300 according to an eighth embodiment of the present application.

In the eighth embodiment of the present application, unlike the sixth embodiment, in the image sensor 320, the side of the microlens array 324 facing away from the photosensitive element 321 is provided with a planarization film 328, and the integrated field lens 329 is not mounted on the frame 322 but is adhered to the surface of the side of the planarization film 328 facing away from the microlens array 324 by optical glue (not shown). Therefore, no air gap exists between the integrated field lens 329 and the micro lens array 324, the turning control of the main light ray E can be further improved, and meanwhile, stray light can be effectively controlled.

The electronic device in the embodiment of the present application includes the camera module in any of the above embodiments, so that the electronic device also has the beneficial effects of any of the above embodiments, and the disclosure is not repeated herein.

It should be noted that in the examples and descriptions of this patent, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

While the application has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the application.

Claims

1. A camera module, comprising:

a lens;

the image sensor is positioned on the light emitting side of the lens and comprises a photosensitive element; the image sensor further comprises a micro lens array, the micro lens array is provided with a plurality of lens units which are arranged in an array mode, the photosensitive element comprises a plurality of pixel units, and the lens units are arranged corresponding to the pixel units;

a field lens located between the lens and the photosensitive element; the field lens is a Fresnel lens or a super-surface lens; the field lens is attached to one side of the image sensor, which is close to the lens, or is integrated in the image sensor; the microlens array is positioned between the field lens and the photosensitive element; the field lens is configured to modulate all the chief rays emitted by the lens, so that all the chief rays are emitted into a light receiving area of the pixel unit after passing through the lens unit of the micro lens array; when the lens unit is positioned right above the pixel unit, the field lens is configured to modulate all chief rays emitted by the lens to be perpendicular to the lens unit, and when the lens unit is arranged in an offset manner relative to the pixel unit, the field lens is configured to calibrate all chief rays emitted by the lens, so that the emitting angles of all chief rays reach a specific angle.

2. The camera module of claim 1, wherein the camera module comprises a camera module,

the image sensor further includes: a frame and a glass cover plate; the frame defines a mounting groove, and the micro lens array and the photosensitive element are sequentially mounted in the mounting groove along the light emergent direction of the lens; the glass cover plate is positioned on the light incident side of the micro lens array;

the field lens is positioned on one side of the glass cover plate, which is away from the micro lens array, or is integrated in the image sensor, and is positioned on one side of the glass cover plate, which is close to the micro lens array.

3. The camera module of claim 2, wherein the glass cover plate is mounted on the frame, and the field lens is fixed on a surface of the glass cover plate on a side facing away from the microlens array; or the field lens frame is arranged on one side of the glass cover plate, which is far away from the micro lens array, and a gap is arranged between the field lens frame and the glass cover plate.

4. The camera module of claim 3, wherein the image sensor further comprises a support frame, the support frame is connected to the frame, and the field lens frame is arranged on the support frame so as to be located on a side of the glass cover plate facing away from the microlens array and a gap is provided between the field lens frame and the glass cover plate.

5. The camera module of claim 2, wherein the field lens is integrated into the image sensor, the field lens is mounted on the frame, and the glass cover plate is fixed to a surface of the field lens on a side facing away from the microlens array.

6. The camera module according to claim 2, wherein a side of the microlens array facing away from the photosensitive element is provided with a planarization film;

the glass cover plate is attached to the surface of one side, facing away from the micro lens array, of the planarization film, and the field lens is fixed on the surface of one side, facing away from the micro lens array, of the glass cover plate; or the field lens is integrated in the image sensor, the field lens is attached to the surface of one side of the planarization film, which is away from the micro lens array, and the glass cover plate is fixed on the surface of one side of the field lens, which is away from the micro lens array.

7. The camera module of claim 1, wherein the camera module comprises a camera module,

the image sensor further includes: the frame is used for defining a mounting groove, and the micro lens array and the photosensitive element are sequentially mounted in the mounting groove along the light emergent direction of the lens;

the field lens is integrated in the image sensor, is an integrated field lens, is installed on the frame and is positioned on the light incident side of the micro lens array, and one or two light transmitting surfaces of the integrated field lens have a field lens function.

8. The camera module of claim 7, wherein the integrated field lens has an infrared light absorbing function.

9. The camera module of claim 7, wherein a side of the microlens array facing away from the photosensitive element is provided with a planarization film, and the integrated field lens is attached to a surface of the planarization film facing away from the microlens array.

10. The camera module of claim 1, further comprising a circuit board positioned on a side of the photosensitive element facing away from the lens and coupled to the image sensor.

11. The camera module of claim 10, wherein the camera module further comprises:

the motor is positioned on the light emitting side of the lens and is connected with the lens;

the motor is fixed on one side of the base through a film, and the circuit board is positioned on the other side of the base; the center of the base is provided with a mounting hole, the peripheral wall of the mounting hole is provided with a partition plate, the partition plate divides the mounting hole into a first mounting cavity and a second mounting cavity, and the image sensor is positioned in the first mounting cavity and connected with the circuit board;

the infrared filter is fixed on the partition plate and positioned in the second mounting cavity.

12. An electronic device comprising the camera module of any one of claims 1-11.