CN116760380A - Filtering device based on laminated busbar - Google Patents
Filtering device based on laminated busbar Download PDFInfo
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- CN116760380A CN116760380A CN202310717335.4A CN202310717335A CN116760380A CN 116760380 A CN116760380 A CN 116760380A CN 202310717335 A CN202310717335 A CN 202310717335A CN 116760380 A CN116760380 A CN 116760380A
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- busbar
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- magnetic ring
- filter
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- 238000001914 filtration Methods 0.000 title claims abstract description 15
- 239000003990 capacitor Substances 0.000 claims abstract description 184
- 239000002826 coolant Substances 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims abstract description 8
- 230000004308 accommodation Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 239000006223 plastic coating Substances 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 238000009434 installation Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Filters And Equalizers (AREA)
Abstract
The application belongs to the technical field of filtering equipment, and provides a filtering device based on a laminated busbar, which mainly comprises a busbar assembly, a capacitor device and a shell; the busbar assembly comprises a positive busbar, a grounding busbar and a negative busbar which are sequentially overlapped, wherein an insulating barrier is arranged between the positive busbar and the grounding busbar and between the grounding busbar and the negative busbar; the capacitor device comprises a filter capacitor and a busbar capacitor, and pins of the filter capacitor and the busbar capacitor are directly connected with the busbar assembly; the shell is provided with an outer cavity structure and an inner cavity structure into which cooling medium can be introduced, and the capacitor part is arranged in the outer cavity structure. The plastic coating and the corresponding die cost can be effectively saved, the overall integration level is high, and the application effect is better.
Description
Technical Field
The application belongs to the technical field of filtering equipment, and particularly relates to a filtering device based on a laminated busbar.
Background
The existing filter component structure is mainly composed of copper bar plastic-coated parts, the main body structure of the existing filter component structure is conductive copper bars, plastic coating is used outside the copper bars, the plastic coating is designed to be of a specific structure for supporting and fixing a filter capacitor and a magnetic ring, the filter capacitor is connected with the main copper bars by using a middle thin copper sheet in a switching mode, one end of each copper sheet is welded on the main copper bars, one end of each copper sheet is welded with the filter capacitor, the grounding of each filter capacitor is also welded to the thin copper sheet, and the thin copper sheets are fixed on a shell by using bolts. The whole filter assembly is connected with the copper bars of the bus capacitor in a bolt connection or welding mode.
The structural style of traditional wave filter subassembly is complicated, needs to design special plastics plastic-coated mould, increases the cost, and has certain influence to the heat dissipation of copper bar, often needs to set up extra cooling pad and leads the heat of copper bar to the casing. The connection of the filter assembly to the capacitor and the dc input also requires bolting or welding, increasing the reliability risk of the connection. In the conventional filter assembly, the structure of the filter capacitor connected to the main copper bar and the ground is generally complex, the paths are longer and unequal, and the EMC effect of the filter is greatly affected.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, an object of the present application is to provide a filtering device based on stacked busbar.
The application adopts the technical means for solving the technical problems that:
the application provides a filtering device based on a laminated busbar, which comprises:
the busbar assembly comprises an anode busbar, a grounding busbar and a cathode busbar which are sequentially overlapped, and an insulating barrier is arranged between the anode busbar and the grounding busbar and between the grounding busbar and the cathode busbar;
the capacitor device comprises a filter capacitor and a busbar capacitor, and pins of the filter capacitor and the busbar capacitor are directly connected with the busbar assembly;
the shell is provided with an outer cavity structure and an inner cavity structure into which cooling medium can be introduced, and the capacitor piece is arranged in the outer cavity structure.
Preferably, the positive electrode busbar, the grounding busbar and the negative electrode busbar are provided with a plurality of pin mounting holes and a plurality of avoidance holes;
and one of the pin mounting holes of any one of the positive electrode busbar, the grounding busbar and the negative electrode busbar falls into the coverage range of one of the avoidance holes of the other busbar.
In the implementation process, the pin mounting holes can be convenient for being in plug-in connection with pins of electric devices such as the filter capacitor and the busbar capacitor, so that the electric devices such as the filter capacitor and the busbar capacitor are directly mounted and connected on the busbar assembly. The avoidance holes can be matched with the pin mounting holes in use, so that enough creepage safety distance is provided, and application reliability is improved.
Preferably, the positive electrode busbar and the negative electrode busbar are sequentially provided with an electric connection region, a filter capacitor connection region and a busbar capacitor connection region;
the power connection area is provided with a terminal mounting hole, the filter capacitor is arranged in the filter capacitor connection area, and the busbar capacitor is arranged in the busbar capacitor connection area.
In the implementation process, the functional areas are divided on the positive electrode busbar and the negative electrode busbar, so that the electric devices can be installed and connected on the positive electrode busbar and the negative electrode busbar more orderly, and the design and the layout of an electric loop are facilitated; and meanwhile, the busbar assembly is convenient to install on the shell, so that the space layout is optimized.
Preferably, the device further comprises a magnetic ring, wherein the magnetic ring is sleeved on the busbar assembly, and the magnetic ring is arranged on the outer cavity structure.
In the implementation process, the magnetic force lines of the magnetic ring are more concentrated, so that resonance of the busbar capacitor at low frequency can be reduced or even avoided, voltage spikes or current spikes generated by switching of the switch can be reduced conveniently, and the use effect of the system is improved. The magnetic ring is arranged on the outer cavity structure, so that heat exchange and cooling of the part where the magnetic ring is located can be realized, and meanwhile, the magnetic ring can be installed and limited through the outer cavity structure.
Preferably, the magnetic ring comprises a first magnetic ring and a second magnetic ring, and the filter capacitor connecting area comprises a first connecting area and a second connecting area which are sequentially arranged;
along the setting direction of first connecting region, second connecting region, first magnetic ring set up in the front end of first connecting region, the second magnetic ring set up in the front end of second connecting region.
In the implementation process, the magnetic ring is arranged to comprise a first magnetic ring and a second magnetic ring, meanwhile, the filter capacitor connecting area is arranged to comprise a first connecting area and a second connecting area, the first magnetic ring is matched with the filter capacitor in the first connecting area, and the second magnetic ring is matched with the filter capacitor in the second connecting area, so that a two-stage LC filter loop can be formed, and the filter effect is better.
Preferably, a plurality of X capacitors and a plurality of first Y capacitors are arranged in the first connection region;
the X capacitor is connected between the positive electrode busbar and the negative electrode busbar;
the first Y capacitors are divided into a first capacitor group and a second capacitor group with equal capacitance values, the first capacitor group is connected between the positive electrode busbar and the grounding busbar, and the second capacitor group is connected between the negative electrode busbar and the grounding busbar.
Preferably, a plurality of second Y capacitors are arranged in the second connection region, and the plurality of second Y capacitors are divided into a third capacitor group and a fourth capacitor group which are equal in accommodation;
the third capacitor group is connected between the positive electrode busbar and the grounding busbar, and the fourth capacitor group is connected between the negative electrode busbar and the grounding busbar.
In the implementation process, the filter capacitor arranged in the first connection area comprises a plurality of X capacitors and a plurality of first Y capacitors, the filter capacitor arranged in the second connection area comprises a plurality of second Y capacitors, the filter capacitors are directly connected to the busbar assembly, the grounding impedance is small, and high-frequency noise passing through the filter capacitors can quickly return to the shell, so that the magnitude of common-mode voltage and the loop area of common-mode current can be reduced; meanwhile, loops of the first Y capacitor and the second Y capacitor on the positive electrode busbar and the negative electrode busbar are approximately symmetrical, and conversion from differential mode noise to common mode noise can be effectively reduced.
Preferably, the magnetic ring is of an integrated structure;
or, the magnetic ring is formed by assembling.
In the implementation process, according to the structural design of the busbar assembly and the installation mode of the busbar assembly on the shell, the magnetic ring can be set into an integrated structural mode, and can also be set into a mode formed by assembling.
Preferably, a flat installation area is arranged on the end face of the shell, a power module is arranged in the flat installation area, and the power module is directly connected with the busbar assembly.
In the implementation process, the flat installation area is arranged, so that the power module can be conveniently installed, and meanwhile, the cooling medium can be introduced into the inner cavity structure, so that the power module can be subjected to heat exchange and cooling.
Preferably, the filter capacitor connection area and the busbar capacitor connection area are arranged side by side, and the filter capacitor connection area and the power module are respectively positioned at two sides of the busbar capacitor connection area.
The application has the following beneficial effects:
the grounding busbar is arranged between the positive electrode busbar and the negative electrode busbar, so that common mode noise can be reduced conveniently; meanwhile, the mode of stacking between the busbar is adopted, the whole thickness can be thinner, the coverage area is wider, stray inductance of the system can be conveniently reduced, the skin effect of current is inhibited, and the whole temperature rise and heat dissipation effect are better.
The filter capacitor and the busbar capacitor are directly connected with the busbar assembly, so that the structure is simple, the arrangement is flexible and compact, and the plastic coating and the corresponding die cost can be saved; meanwhile, the assembly mode of direct connection effectively reduces unnecessary copper bar connection, reduces risks caused by connection reliability, greatly shortens the path of a loop and can facilitate enhancement of EMC effect.
The application is also provided with the shell, the shell is provided with the outer cavity structure and the inner cavity structure, and the inner cavity structure can be used for introducing cooling medium, so that when the shell is used, the parts arranged on the shell and in the outer cavity structure can be subjected to heat exchange and cooling by introducing cooling medium, and the application stability of corresponding electric parts can be improved conveniently, and the service life can be prolonged. Meanwhile, the busbar assembly and the capacitor device are integrally arranged on the shell, and the overall integration level is higher.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a filtering device according to the present application.
Fig. 2 is a schematic diagram of an installation structure of the filtering device of the present application.
Fig. 3 is a schematic structural diagram of a busbar assembly according to the present application.
Fig. 4 is a schematic structural diagram of an assembled busbar assembly according to the present application.
Fig. 5 is a schematic diagram of the disassembled structure in the state of fig. 4.
Fig. 6 is a schematic view of a mounting structure of a capacitive device according to the present application.
Marking:
the device comprises a 1-busbar assembly, a 11-positive busbar, a 111-pin mounting hole, a 112-avoiding hole, a 113-positive connecting terminal, a 12-grounding busbar, a 13-negative busbar, a 131-negative connecting terminal and a 14-insulating barrier;
2-capacitor device, 21-filter capacitor, 211-X capacitor, 212-first capacitor group, 213-second capacitor group, 214-third capacitor group, 215-fourth capacitor group, 22-busbar capacitor;
3-magnetic rings, 31-first magnetic rings, 32-second magnetic rings and 33-mounting covers;
4-a shell, 41-an outer cavity structure and 42-a flat installation area;
5-high voltage input plug-in connector;
6-power module.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. The embodiments of the present application and the features in the embodiments may be combined with each other without collision. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.
It should be noted that: unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-6, in this embodiment, a filtering device based on a laminated busbar is provided, where the filtering device may be used for predicting electromagnetic self-compatibility performance between electric networks of an electric vehicle, and mainly includes a busbar assembly 1, a capacitor device 2, a magnetic ring 3 and a housing 4.
The busbar assembly 1 includes a positive busbar 11, a ground busbar 12 and a negative busbar 13, wherein the positive busbar 11, the ground busbar 12 and the negative busbar 13 are sequentially overlapped from top to bottom, and an insulating barrier 14 is disposed between the positive busbar 11 and the ground busbar 12, and between the ground busbar 12 and the negative busbar 13, and is electrically blocked by the insulating barrier 14.
In a preferred embodiment, the insulating barrier 14 may be in the form of an insulating membrane or insulating paper, and in this case, the insulating barrier 14 is disposed on the surface of the positive electrode busbar 11, the ground electrode busbar 12 or the negative electrode busbar 13 in a covering manner, so as to electrically block between two adjacent busbars.
As a preferable solution, in this embodiment, a plurality of pin mounting holes 111 and a plurality of avoidance holes 112 are provided on each of the positive busbar 11, the ground busbar 12, and the negative busbar 13; and one of the pin mounting holes 111 of any one of the positive electrode busbar 11, the ground busbar 12 and the negative electrode busbar 13 falls into the coverage area of one of the avoiding holes 112 of the other busbar.
For example, if the pin mounting holes 111 are formed in the positive electrode busbar 11 at the same position along the vertical direction, the avoiding holes 112 are formed in the ground busbar 12 and the negative electrode busbar 13; if the pin mounting holes 111 are formed in the negative electrode busbar 13, the avoiding holes 112 are formed in the positive electrode busbar 11 and the ground busbar 12; if the pin mounting holes 111 are formed in the ground busbar 12, the avoiding holes 112 are formed in the positive busbar 11 and the negative busbar 13.
As a preferred solution, the avoidance hole 112 in this embodiment is disposed in the middle of the busbar by means of an opening; meanwhile, the device can also be arranged at the edge of the busbar in a way of forming a notch.
In this embodiment, the capacitor device 2 mainly includes a plurality of filter capacitors 21 and a plurality of busbar capacitors 22, and pins of the filter capacitors 21 and the busbar capacitors 22 are directly connected with the busbar assembly 1; at this time, the pins of the electric devices such as the filter capacitor 21 and the busbar capacitor 22 may be conveniently inserted and matched through the pin mounting holes 111, so as to realize direct mounting connection, such as welding, of the electric devices such as the filter capacitor 21 and the busbar capacitor 22 on the busbar assembly 1. And through the avoidance hole 112, the pin mounting hole 111 can be matched with the avoidance hole, so that a sufficient creepage safety distance is provided, and the application reliability is improved.
In this embodiment, an electrical connection area, a filter capacitor connection area and a busbar capacitor connection area are sequentially arranged on the positive busbar 11 and the negative busbar 13; at this time, the grounding busbar 12 is also partially sandwiched between the filter capacitor connection areas of the positive electrode busbar 11 and the negative electrode busbar 13, and partially sandwiched between the busbar capacitor connection areas of the positive electrode busbar 11 and the negative electrode busbar 13, so as to provide a direct grounding connection point.
Further, the positive electrode busbar 11 is provided with a positive electrode connection terminal 113 at the electrical connection area, the negative electrode busbar 13 is provided with a negative electrode connection terminal 131 at the electrical connection area, terminal mounting holes are respectively formed in the positive electrode connection terminal 113 and the negative electrode connection terminal 131, and the terminal mounting holes are used for mounting and fixing the high-voltage input plug-in connector 5. The filter capacitor 21 is disposed on the filter capacitor connection area, and the busbar capacitor 22 is disposed on the busbar capacitor connection area.
Here, by dividing the functional areas on the positive electrode busbar 11 and the negative electrode busbar 13, the installation connection of the electric devices and the like on the positive electrode busbar 11 and the negative electrode busbar 13 can be more orderly, so that the design and the layout of an electric circuit are facilitated.
Furthermore, the magnetic ring 3 is sleeved on the filter capacitor connecting area. The magnetic ring 3 may be in an integral structure, and at this time, the magnetic ring 3 may be sleeved from the power connection area of the busbar assembly 1, and sleeved on the filter capacitor connection area. In other application examples, in order to facilitate the installation layout of the capacitor device 2, the busbar assembly 1 located in the filter capacitor connection area is structurally designed, so that the magnetic ring 3 cannot be smoothly sleeved on the busbar assembly 1; at this time, the magnetic ring 3 may be assembled so as to be directly clamped at a predetermined position.
Here, the magnetic force lines of the magnetic ring 3 are more concentrated, so that resonance of the busbar capacitor 22 at low frequency can be reduced or even avoided, and meanwhile, when the busbar capacitor is connected with an IGBT or a SIC, voltage spikes or current spikes generated by switching of a switch can be conveniently reduced, and the use effect of a loop system is improved.
As a preferred solution, in this embodiment, the magnetic ring 3 includes a first magnetic ring 31 and a second magnetic ring 32, and a first connection area and a second connection area are sequentially disposed in the filter capacitor connection area, respectively; and along the arrangement direction of the first connection area and the second connection area, the first magnetic ring 31 is arranged at the front end of the first connection area, and the second magnetic ring 32 is arranged at the front end of the second connection area.
Further, the filter capacitor 21 includes a plurality of X capacitors 211, a plurality of first Y capacitors, and a plurality of second Y capacitors. In this embodiment, a plurality of X capacitors 211 and a plurality of first Y capacitors are disposed in the first connection region; and a plurality of second Y capacitors are arranged in the second connection region.
As an application example, in this embodiment, two X capacitors 211 are provided, and the capacitance values of the two X capacitors 211 are different, and the X capacitors 211 are connected between the positive electrode busbar 11 and the negative electrode busbar 13. The first Y capacitors are provided with four first capacitor groups 212 and second capacitor groups 213 with equal capacitance values, the first capacitor groups 212 are connected between the positive electrode busbar 11 and the ground busbar 12, and the second capacitor groups 213 are connected between the negative electrode busbar 13 and the ground busbar 12.
Further, the second Y capacitors are also provided with four capacitors and are divided into a third capacitor set 214 and a fourth capacitor set 215 with equal capacitors, the third capacitor set 214 is connected between the positive electrode busbar 11 and the ground busbar 12, and the fourth capacitor set 215 is connected between the negative electrode busbar 13 and the ground busbar 12.
Here, the magnetic ring 3 is set to include a first magnetic ring 31 and a second magnetic ring 32, and the filter capacitor connection area is set to include a first connection area and a second connection area, where the first magnetic ring 31 is matched with the filter capacitor in the first connection area, and the second magnetic ring 32 is matched with the filter capacitor in the second connection area, so that a two-stage LC filter loop can be formed, and the filtering effect is better.
In addition, the filter capacitor arranged in the first connection area comprises a plurality of X capacitors 211 and a plurality of first Y capacitors, the filter capacitor arranged in the second connection area comprises a plurality of second Y capacitors, the filter capacitors 21 are directly connected to the busbar assembly 1, the grounding impedance is small, and high-frequency noise passing through the filter capacitors 21 can quickly return to the shell 4, so that the magnitude of common-mode voltage and the loop area of common-mode current can be reduced; meanwhile, the loops of the first Y capacitor and the second Y capacitor on the positive electrode busbar 11 and the negative electrode busbar 13 are nearly symmetrical, so that conversion from differential mode noise to common mode noise can be effectively reduced.
In a preferred embodiment, the housing 4 is provided with an outer cavity structure 41 and an inner cavity structure. The outer cavity structure 41 is mainly used for mounting the filter capacitor 21, the busbar capacitor 22 and the magnetic ring 3; the inner cavity structure can be used for introducing cooling medium, so that the whole shell 4 can have the capability of heat exchange.
As an application example, when the filter capacitor 21, the busbar capacitor 22 and the magnetic ring 3 are mounted on the external cavity structure 41, a heat-conducting structural adhesive may be filled between the filter capacitor 21, the busbar capacitor 22, the magnetic ring 3 and the external cavity structure 41, for example, when the filter capacitor 21 and the busbar capacitor 22 are mounted, they are connected and disposed on the housing 4 through the heat-conducting structural adhesive, and then the busbar assembly 1 is welded above the filter capacitor 21 and the busbar capacitor 22. At this time, the filter capacitor 21, the busbar capacitor 22, the magnetic ring 3, and the like may be mounted and limited by the external cavity structure 41, and heat exchange cooling may be performed on the positions where the filter capacitor 21, the busbar capacitor 22, the magnetic ring 3, and the like are located.
In a preferred embodiment, a flat mounting area 42 is further provided on the end surface of the housing 4, and a power module 6 is disposed in the flat mounting area 42, and the power module 6 is directly connected, such as welded, with the busbar assembly 1. Through the arrangement of the flat installation area 42, the installation and arrangement of the power module 6 can be facilitated, and meanwhile, the heat exchange cooling of the power module 6 can be realized by introducing a refrigerant into the inner cavity structure.
Further, in this embodiment, the filter capacitor connection area and the busbar capacitor connection area are arranged side by side, and the filter capacitor connection area and the power module 6 are respectively located at two sides of the busbar capacitor connection area. So as to lay out the mounting of the busbar assembly 1 on the housing 4 to optimise the spatial layout arrangement.
As a preferable solution, in this embodiment, a mounting cover 33 is further provided to be matched with the first magnetic ring 31 and the second magnetic ring 32; at this time, the power module 6, the mounting cover 33 and the high-voltage input connector 5 are all fixed to the housing 4 by bolts, so that the busbar assembly 1 can be further mounted and fixed.
The technical scheme provided in the embodiment mainly has the following beneficial effects:
in this embodiment, the grounding busbar 12 is disposed between the positive electrode busbar 11 and the negative electrode busbar 13, so as to reduce common mode noise; meanwhile, the mode of stacking between the busbar is adopted, the whole thickness can be thinner, the coverage area is wider, stray inductance of the system can be conveniently reduced, the skin effect of current is inhibited, and the whole temperature rise and heat dissipation effect are better.
Secondly, the filter capacitor 21 and the busbar capacitor 22 in the embodiment are directly connected with the busbar assembly 1, so that the structure is simple, the arrangement is flexible and compact, and the plastic coating and the corresponding die cost can be saved; meanwhile, the assembly mode of direct connection effectively reduces unnecessary copper bar connection, reduces risks caused by connection reliability, greatly shortens the path of a loop and can facilitate enhancement of EMC effect.
In addition, in this embodiment, the housing 4 is further provided, the housing 4 is provided with an outer cavity structure 41 and an inner cavity structure, and the inner cavity structure can be supplied with cooling medium, so that when in use, the components mounted on the housing 4 and in the outer cavity structure 41 can be subjected to heat exchange and cooling by supplying cooling medium, thereby being convenient for improving the application stability of corresponding electric components and prolonging the service life. Meanwhile, the busbar assembly 1 and the capacitor device 2 are integrally arranged on the shell 4, and the overall integration level is higher.
The above description is only specific embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application. Variations and substitutions will be readily apparent to those skilled in the art within the scope of the present disclosure, and are intended to be encompassed within the scope of the present disclosure. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A stacked busbar-based filter device, comprising:
the busbar assembly comprises an anode busbar, a grounding busbar and a cathode busbar which are sequentially overlapped, and an insulating barrier is arranged between the anode busbar and the grounding busbar and between the grounding busbar and the cathode busbar;
the capacitor device comprises a filter capacitor and a busbar capacitor, and pins of the filter capacitor and the busbar capacitor are directly connected with the busbar assembly;
the shell is provided with an outer cavity structure and an inner cavity structure into which cooling medium can be introduced, and the capacitor piece is arranged in the outer cavity structure.
2. The filter device based on the laminated busbar according to claim 1, wherein a plurality of pin mounting holes and a plurality of avoiding holes are formed in each of the positive busbar, the ground busbar and the negative busbar;
and one of the pin mounting holes of any one of the positive electrode busbar, the grounding busbar and the negative electrode busbar falls into the coverage range of one of the avoidance holes of the other busbar.
3. The filter device based on the laminated busbar according to claim 1 or 2, wherein the positive busbar and the negative busbar are sequentially provided with an electric connection area, a filter capacitor connection area and a busbar capacitor connection area;
the power connection area is provided with a terminal mounting hole, the filter capacitor is arranged in the filter capacitor connection area, and the busbar capacitor is arranged in the busbar capacitor connection area.
4. The laminated busbar-based filter device of claim 3, further comprising a magnetic ring sleeved on the busbar assembly, the magnetic ring being disposed in the outer cavity structure.
5. The filtering device based on the laminated busbar of claim 4, wherein the magnetic ring comprises a first magnetic ring and a second magnetic ring, and the filter capacitor connection area comprises a first connection area and a second connection area which are sequentially arranged;
along the setting direction of first connecting region, second connecting region, first magnetic ring set up in the front end of first connecting region, the second magnetic ring set up in the front end of second connecting region.
6. The stacked busbar-based filter device of claim 5, wherein a plurality of X capacitors and a plurality of first Y capacitors are disposed within the first connection region;
the X capacitor is connected between the positive electrode busbar and the negative electrode busbar;
the first Y capacitors are divided into a first capacitor group and a second capacitor group with equal capacitance values, the first capacitor group is connected between the positive electrode busbar and the grounding busbar, and the second capacitor group is connected between the negative electrode busbar and the grounding busbar.
7. The filtering device based on the laminated busbar of claim 6, wherein a plurality of second Y capacitors are arranged in the second connection area, and the plurality of second Y capacitors are divided into a third capacitor group and a fourth capacitor group which are equal in accommodation;
the third capacitor group is connected between the positive electrode busbar and the grounding busbar, and the fourth capacitor group is connected between the negative electrode busbar and the grounding busbar.
8. The laminated busbar-based filter device of any of claims 4 to 7, wherein the magnetic ring is of unitary construction;
or, the magnetic ring is formed by assembling.
9. The laminated busbar-based filter device of claim 8, wherein a flat mounting area is provided on an end surface of the housing, and a power module is provided in the flat mounting area, and is directly connected to the busbar assembly.
10. The filter device based on stacked busbar of claim 9, wherein the filter capacitor connection area and the busbar capacitor connection area are arranged side by side, and the filter capacitor connection area and the power module are respectively located at two sides of the busbar capacitor connection area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310717335.4A CN116760380A (en) | 2023-06-15 | 2023-06-15 | Filtering device based on laminated busbar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310717335.4A CN116760380A (en) | 2023-06-15 | 2023-06-15 | Filtering device based on laminated busbar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116760380A true CN116760380A (en) | 2023-09-15 |
Family
ID=87947318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310717335.4A Pending CN116760380A (en) | 2023-06-15 | 2023-06-15 | Filtering device based on laminated busbar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116760380A (en) |
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2023
- 2023-06-15 CN CN202310717335.4A patent/CN116760380A/en active Pending
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