CN116759376B - Piezoelectric driving clamping device, motion system and substrate detection method - Google Patents
Piezoelectric driving clamping device, motion system and substrate detection method Download PDFInfo
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- CN116759376B CN116759376B CN202311055148.0A CN202311055148A CN116759376B CN 116759376 B CN116759376 B CN 116759376B CN 202311055148 A CN202311055148 A CN 202311055148A CN 116759376 B CN116759376 B CN 116759376B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention provides a piezoelectric driving clamping device, a motion system and a substrate detection method, wherein the piezoelectric driving clamping device comprises a base, supporting legs, at least one piezoelectric driving module group and a plurality of clamping units, wherein the base comprises a substrate placing area and a driving module installing area; the support legs are positioned in the substrate placement area and used for bearing the substrate; the piezoelectric driving module group is positioned in the driving module installation area, one piezoelectric driving module group comprises two piezoelectric motors which are arranged at two sides of the substrate placement area in a mirror image mode, and each piezoelectric motor comprises a stator and a rotor; the clamping units are arranged on the movers in a one-to-one correspondence mode, and can be driven to clamp the substrate or release the substrate when two movers belonging to the same piezoelectric driving module group move in opposite directions or in opposite directions. The invention adopts a piezoelectric driving clamping mode, and the piezoelectric motor drives the clamping unit to clamp the substrate, so that high clamping precision is realized; and the adjustment and correction of the pose of the clamped substrate can be realized through the mutual cooperation of the piezoelectric driving module groups.
Description
Technical Field
The invention belongs to the field of integrated circuit manufacturing, and relates to a piezoelectric driving clamping device, a motion system and a substrate detection method.
Background
In the technical field of integrated circuit manufacturing, a precision measurement technology is an extremely important link, and patterns and marks processed on a substrate such as a wafer or a plate are accurately identified and judged through an image identification system, so that a necessary basis is provided for quality control and yield rate control. With the increase of the process requirements, the precision requirements of the equipment manufacturing system on the precision measurement technology are higher and higher, so that the positioning precision and stability of the substrate are more and more important, and the design of the clamping movement system of the substrate is dependent.
The traditional substrate clamping mode adopts the structural design of mechanical transmission such as an air cylinder or a screw rod, and the principle of the air cylinder transmission is that the clamping rod is pushed to extend or retract to clamp the substrate by ventilation in the forward direction and the reverse direction of the air cylinder, and the air cylinder transmission mechanism has simple structure and low cost, only needs an air and air switching system, but has poor positioning precision, can cause larger impact and is generally suitable for an automatic motion system with low precision requirement. The principle of screw rod transmission is that a servo motor drives a screw rod to drive a clamping head to advance or retreat to clamp a substrate, the servo motor drives a screw rod transmission mechanism to have self-locking capability, higher positioning precision can be realized through closed loop servo control, but the precision is hardly further improved under the influence of processing precision and back clearance of the screw rod transmission, and the mechanism occupies a considerable space size and is generally suitable for a motion system with medium and low precision requirements.
The existing substrate clamping mode depends on the structural design of vacuum adsorption, namely the mode of contact adsorption between a vacuum pore canal and the edge area of a substrate, so that the substrate is subjected to adsorption clamping operation, the adsorption force of the vacuum adsorption is distributed uniformly, the surface bending deformation of the substrate is not easy to cause, the protectiveness is good, and the vacuum adsorption device is generally applied to a motion system with high precision requirements. However, the design of the vacuum adsorption pore canal is complex, the technical difficulty is high, the vacuum adsorption force depends on the vacuum pressure and the adsorption contact area, the reliability of the vacuum adsorption depends on the material selection or the surface treatment process of the contact surface, the positioning precision of the vacuum adsorption is greatly affected by the transmission and handover precision of the substrate, the vacuum adsorption pore canal does not have a position adjusting mechanism, and the vacuum adsorption pore canal does not have the position adjusting capability, so that an attached motion system is required to provide the position detecting and correcting operation capability.
Therefore, how to provide a piezoelectric driving clamping device, a motion system and a substrate detection method, which can improve the clamping precision of the substrate, realize the self-adjustment and correction of the substrate position, and adapt to the clamping requirement of the high-precision semiconductor process on the substrate, is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a piezoelectric driving clamping device, a motion system and a substrate detection method, which are used for solving the problems of low clamping precision of a substrate, failure to correct a position by itself and the like in the prior art.
To achieve the above and other related objects, the present invention provides a piezoelectric driven clamping device comprising:
the base comprises a substrate placing area and a driving module installing area, wherein the driving module installing area is arranged on the periphery of the substrate placing area in a surrounding mode;
the support legs are positioned in the substrate placement area and used for bearing a substrate;
the piezoelectric motor comprises a stator and a rotor, the stator is fixed in the driving module installation area, and the rotor can move along the direction facing to or along the direction far away from the substrate placement area;
the clamping units are arranged at the end parts of the movers, which are close to the substrate placing area, in a one-to-one correspondence mode, wherein when the two movers belonging to the same piezoelectric driving module group move oppositely or reversely, the clamping units can be driven to clamp the substrate or release the substrate.
Optionally, the clamping unit includes a clamping main board and a clamping head, the clamping main board is mounted on the mover, the clamping head is mounted on an end portion of the clamping main board, which is close to the substrate placement area, and the clamping head is disposed in a horizontal direction along a direction towards the substrate placement area.
Optionally, the device further comprises a displacement sensor, wherein the displacement sensor comprises an induction part and a receiving part, the induction part is arranged on the clamping main board and linearly extends along the moving direction of the mover, and the receiving part is arranged on the base.
Optionally, in the clamping units installed in the same piezoelectric driving module group, a force sensor is disposed between the clamping main board and the clamping head of at least one clamping unit.
Optionally, a space is provided in the piezoelectric motor, a displacement sensor is installed in the space, the displacement sensor includes an induction part and a receiving part, the induction part is arranged on the rotor and linearly extends along the moving direction of the rotor, and the receiving part is arranged on the stator.
Optionally, the piezoelectric driving module group includes a first piezoelectric driving module group and a second piezoelectric driving module group, where the first piezoelectric driving module group includes a first piezoelectric motor and a second piezoelectric motor, and the second piezoelectric driving module group includes a third piezoelectric motor and a fourth piezoelectric motor, where the first piezoelectric motor and the second piezoelectric motor are located at two sides of the substrate placement area in the X direction, the third piezoelectric motor and the fourth piezoelectric motor are located at two sides of the substrate placement area in the X direction, and the first piezoelectric driving module group and the second piezoelectric driving module group are spaced by a preset distance in the Y direction.
Optionally, the piezoelectric driving module group further includes a third piezoelectric driving module group, and the third piezoelectric driving module group includes a fifth piezoelectric motor and a sixth piezoelectric motor, where the fifth piezoelectric motor and the sixth piezoelectric motor are located at two sides of the substrate placement area in the Y direction.
The invention also provides a motion system, which comprises the piezoelectric driving clamping device according to any one of the above, and further comprises a two-dimensional macro-moving table, wherein the piezoelectric driving clamping device is arranged on the two-dimensional macro-moving table.
The invention also provides a substrate detection method, which comprises the following steps:
s1: providing the above-described exercise system;
s2: at a handover station, a transmission manipulator places a substrate to be detected on the support legs, and the movers of the piezoelectric driving module group move oppositely to drive the clamping unit to clamp the substrate;
s3: the two-dimensional macro-moving table drives the piezoelectric driving clamping device and the substrate to move to a detection station, wherein the substrate is positioned below the image acquisition system at the detection station;
s4: based on the identification of the substrate acquired by the image acquisition system, judging whether the substrate is in a detection range, if the substrate is in the detection range, executing the next step, and if the substrate is not in the detection range, driving the substrate to continuously move by the piezoelectric driving module group until the substrate moves to the detection range;
s5: based on the image acquisition system to acquire the graph of the substrate, judging whether the substrate is in a target posture, if the substrate is in the target posture, executing the next step, and if the substrate is not in the target posture, driving the substrate to continuously rotate by the piezoelectric driving module group until the substrate rotates into the target posture;
s6: at a detection station, controlling the two-dimensional macro-moving table to move along the X direction and the Y direction respectively, and identifying and acquiring the pattern on the surface of the substrate by the image acquisition system;
s7: the two-dimensional macro-moving table drives the piezoelectric driving clamping device and the substrate to move to a handover station, the mover of the piezoelectric driving module group moves reversely to drive the clamping unit to release the substrate, and the substrate is moved away from the piezoelectric driving clamping device by the transmission manipulator.
Optionally, in step S2, first motion data of the piezoelectric driving clamping device is acquired, where the first motion data is used as position reference correction data of a next cycle; and/or, in step S3, acquiring second motion data of the two-dimensional macro-moving platform, wherein the second motion data is used as position reference correction data of a next cycle.
As described above, in the piezoelectric driving clamping device, the moving system and the substrate detection method, the piezoelectric driving clamping mode is adopted, and the piezoelectric motor drives the clamping unit to clamp the substrate, so that high clamping precision is realized, and deformation of the surface of the substrate caused by overlarge clamping force is avoided; and the adjustment and correction of the pose of the clamped substrate can be realized through the mutual cooperation of the piezoelectric driving module groups. In addition, by assembling the displacement sensor and the force sensor, the clamping precision of the substrate and the position and posture adjusting precision of the substrate are further improved.
Drawings
Fig. 1 is a schematic structural view of a piezoelectric driving clamping device according to the present invention.
Fig. 2 is a schematic structural view showing that the clamping unit is mounted on the piezoelectric motor in the present invention.
Fig. 3 is a schematic structural diagram of a displacement sensor of the present invention externally arranged on a piezoelectric motor.
Fig. 4 is a schematic diagram showing the structure of the piezoelectric motor with the displacement sensor built in the present invention.
Fig. 5 is a schematic view showing a structure of the piezoelectric driving clamping device provided with a displacement sensor according to the present invention.
Fig. 6 is a schematic structural view of a force sensor disposed between a clamping main board and a clamping head in the present invention.
Fig. 7 is a schematic view showing a structure of a force sensor installed in the piezoelectric driving clamping device according to the present invention.
Fig. 8 is a schematic structural view of a second piezoelectric driving clamping device according to the present invention.
Fig. 9 shows a schematic diagram of the movement system according to the invention.
Fig. 10 is a schematic view of a transfer robot for placing a substrate on a piezoelectric driven clamping device according to the present invention.
FIG. 11 is a schematic diagram of an image acquisition system for acquiring a pattern on a surface of a substrate in accordance with the present invention.
Description of element numbers: 1-a base, 100-a substrate placement area, 101-a driving module installation area; 2-supporting legs; 3-piezoelectric motor, 30-stator, 31-rotor, 300-first piezoelectric motor, 301-second piezoelectric motor, 302-third piezoelectric motor, 303-fourth piezoelectric motor, 304-fifth piezoelectric motor, 305-sixth piezoelectric motor; 4-clamping unit, 40-clamping main board, 41-clamping head, 400 first clamping unit, 401-second clamping unit, 402-third clamping unit, 403-fourth clamping unit, 404-fifth clamping unit, 405-sixth clamping unit; 5-displacement sensor, 50-sensing part, 51-receiving part, 500-first displacement sensor, 501-second displacement sensor, 502-third displacement sensor, 503-fourth displacement sensor; 6-force sensor, 600-first force sensor, 601-second force sensor; 7-a two-dimensional macro-moving platform; 8-a substrate; 9-a transmission manipulator; 10-an image acquisition system.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 1 to 11. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Example 1
The present embodiment provides a piezoelectric driving clamping device, please refer to fig. 1 and 2, which are respectively shown as a structural schematic diagram of the piezoelectric driving clamping device and a structural schematic diagram of a clamping unit mounted on a piezoelectric motor, the piezoelectric driving clamping device includes a base 1, a supporting leg 2, at least one piezoelectric driving module group and a plurality of clamping units 4, wherein the base 1 includes a substrate placing area 100 and a driving module mounting area 101, and the driving module mounting area 101 is annularly arranged at the periphery of the substrate placing area 100; the support legs 2 are positioned in the substrate placement area 100 for carrying a substrate; the piezoelectric driving module group is positioned in the driving module installation area 101, one piezoelectric driving module group comprises two piezoelectric motors 3 which are arranged at two sides of the substrate placing area 100 in a mirror image mode, each piezoelectric motor 3 comprises a stator 30 and a rotor 31, the stator 30 is fixed in the driving module installation area 101, and the rotor 31 can move along the direction facing to or away from the substrate placing area 100; the clamping units 4 are correspondingly arranged at the ends of the movers 31, which are close to the substrate placing area 100, and can drive the clamping units 4 to clamp or release the substrate when the two movers 31 belonging to the same piezoelectric driving module group move in opposite directions or in opposite directions.
As an example, the substrate placement area 100 and the driving module mounting area 101 are parallel to the horizontal plane, wherein the substrate placement area 100 and the driving module mounting area 101 may or may not be coplanar, and are set according to actual requirements.
As an example, the number of the supporting legs 2 is four, and the supporting legs are arranged on the substrate placing area 100 in a four-corner array manner so as to provide uniform vertical (Z-direction) supporting force for the carried substrate; of course, in other examples, more than four or less than four feet 2 may be provided.
As an example, the piezoelectric driving module group includes a first piezoelectric driving module group including a first piezoelectric motor 300 and a second piezoelectric motor 301, and a second piezoelectric driving module group including a third piezoelectric motor 302 and a fourth piezoelectric motor 303, the first piezoelectric motor 300 and the second piezoelectric motor 301 being located at both sides of the substrate placement area 100 in the X direction, the third piezoelectric motor 302 and the fourth piezoelectric motor 303 being located at both sides of the substrate placement area 100 in the X direction, the first piezoelectric driving module group and the second piezoelectric driving module group being spaced apart by a preset distance in the Y direction.
As an example, the piezo motors belonging to the same piezo drive module group are arranged mirror-image, so that the operation of the piezo drive module group in the motion control belongs to a centering displacement, which arrangement is advantageous for the actual positioning operation.
As an example, the piezoelectric motor 3 has high displacement precision, and the precision adjustment of the substrate position is realized through the displacement adjustment capability of the piezoelectric motor 3, that is, the clamping of the substrate and the self-adjustment and correction of the substrate position are realized, for example, the first piezoelectric motor 300 and the second piezoelectric motor 301 move in opposite directions, the third piezoelectric motor 302 and the fourth piezoelectric motor 303 move in opposite directions, the clamping of the substrate is realized, and the clamping force between the first piezoelectric motor 300 and the second piezoelectric motor 301 and the clamping force between the third piezoelectric motor 302 and the fourth piezoelectric motor 303 can be accurately controlled due to the high displacement precision of the piezoelectric motors, so that the surface bending deformation of the substrate caused by the overlarge clamping force is avoided; after the substrate is clamped, the first piezoelectric motor 300 and the second piezoelectric motor 301 move along the X direction, the third piezoelectric motor 302 and the fourth piezoelectric motor 303 move along the X direction, so that the X-direction displacement adjustment and positioning of the substrate are realized, or the first piezoelectric motor 300 and the second piezoelectric motor 301 move along the-X direction, and the third piezoelectric motor 302 and the fourth piezoelectric motor 303 move along the-X direction, so that the-X-direction displacement adjustment and positioning of the substrate are realized; after the substrate is clamped, the first piezoelectric motor 300 and the second piezoelectric motor 301 move along the X direction, and the third piezoelectric motor 302 and the fourth piezoelectric motor 303 move along the-X direction, or the first piezoelectric motor 300 and the second piezoelectric motor 301 move along the-X direction, and the third piezoelectric motor 302 and the fourth piezoelectric motor 303 move along the X direction, so that the rotation, adjustment and positioning of the substrate are realized.
As an example, the piezoelectric motor 3 adopts a stick-slip type piezoelectric motor, and the maximum driving force is only a few newtons through the viscous slip working principle, so that the device has extremely strong overload prevention capability, has certain self-locking capability, protects the substrate from the surface bending deformation caused by the large clamping force, and ensures the stability of the surface type.
As an example, the number of the piezoelectric motors 3 is four, and the number of the clamping units 4 is four, wherein the clamping units 4 mounted on the same piezoelectric driving module group are arranged in a mirror image manner along the X direction, the clamping units 4 comprise a clamping main board 40 and clamping heads 41, the clamping main board 40 is mounted on the mover 31, the clamping heads 41 are mounted at the end part of the clamping main board 40, which is close to the substrate placing area 100, the clamping heads 41 are arranged in the direction towards the substrate placing area 100 in the horizontal direction, and when the mover 31 moves in the direction towards the substrate, the clamping heads 41 are driven to move, so that the clamping heads 41 are contacted with the side wall of the substrate and are tightly clamped, and the problems of scratches and the like caused by direct contact of the clamping heads 41 with the upper surface and the lower surface of the substrate are avoided. Preferably, the clamping main plate 40 and the clamping head 41 are in a separated combination form, and are easy to maintain and replace.
As an example, referring to fig. 3, the device further includes a displacement sensor 5 for detecting the motion displacement of the mover 31 in the piezoelectric motor 3 relative to the stator 30, and providing a piezoelectric driving module group with precise displacement positioning capability, so as to realize precise pose adjustment of the clamped substrate through the mutual cooperation mode of the piezoelectric driving module group; the displacement sensor 5 includes a sensing portion 50 provided on the chucking main plate 40 and linearly extending along the moving direction of the mover 31, and a receiving portion 51 provided on the base 1 and located at a central region of the stator 30 in the moving direction. In another example, as shown in fig. 4, the displacement sensor 5 is embedded inside the piezoelectric motor 3, a space is provided in the piezoelectric motor 3, the displacement sensor 5 is installed in the space, the sensing part 50 is provided on the mover 31 and linearly extends along the moving direction of the mover 31, and the receiving part 51 is provided on the stator 30 and is located at the center region of the stator 30 in the moving direction.
As an example, referring to fig. 5, a schematic structural diagram of a piezoelectric driving clamping device with displacement sensors is shown, and the number of the displacement sensors 5 is four, including a first displacement sensor 500, a second displacement sensor 501, a third displacement sensor 502 and a fourth displacement sensor 503, to detect the movement displacement of the first piezoelectric motor 300, the second piezoelectric motor 301, the third piezoelectric motor 302 and the fourth piezoelectric motor 303, respectively.
As an example, the grip head 41 is made of a high-rigidity material, or the head of the grip head 41 is coated with a layer of a high-rigidity material; referring to fig. 6, a schematic structure of a force sensor disposed between a clamping main board and a clamping head is shown, that is, a clamping main board 40 and a clamping head 41 are connected by the force sensor 6. Referring to fig. 7, a schematic structural diagram of a piezoelectric driving clamping device with a force sensor is shown, the force sensor 6 includes a first force sensor 600 and a second force sensor 601, wherein the first force sensor 600 is installed on the first clamping unit 400, and is used for detecting and feeding back a clamping force between the first clamping unit 400 and the second clamping unit 401; a second force sensor 601 is mounted to the third clamping unit 402 for detecting and feeding back a clamping force between the third clamping unit 402 and the fourth clamping unit 403. Of course, in other examples, the force sensors are disposed on the first clamping unit 400, the second clamping unit 401, the third clamping unit 402 and the fourth clamping unit 403, which also falls within the scope of the present invention.
As an example, referring to fig. 8, a schematic structural diagram of a second piezoelectric driving clamping device according to the present invention is shown, where the piezoelectric driving clamping device includes not only a first piezoelectric driving module group and a second piezoelectric driving module group, but also a third piezoelectric driving module group, where the third piezoelectric driving module group includes a fifth piezoelectric motor 304 and a sixth piezoelectric motor 305, and the fifth piezoelectric motor 304 and the sixth piezoelectric motor 305 are located on two sides of the substrate placement area 100 in the Y direction, where the fifth piezoelectric motor 304 is provided with a fifth clamping unit 404, and the sixth piezoelectric motor 305 is provided with a sixth clamping unit 405, and the fifth clamping unit 404 and the sixth clamping unit 405 are mirror-arranged in the Y direction, and the third piezoelectric driving module group drives the fifth clamping unit 404 and the sixth clamping unit 405 to move in opposite directions to clamp the substrate in the Y direction, and implement precise adjustment of the position centering of the substrate in the Y direction through the displacement adjustment capability of the third piezoelectric driving module group; of course, the third piezoelectric driving module group mounts the displacement sensor and the force sensor as required.
As an example, when three piezoelectric driving module groups are provided, the position adjustment step for the substrate includes:
firstly, clamping a substrate by a first piezoelectric driving module group and a second piezoelectric driving module group to provide power for the position adjustment of the substrate, wherein a third piezoelectric driving module group is not contacted with the substrate;
secondly, after the first piezoelectric driving module group and the second piezoelectric driving module group finish the first position adjustment of the substrate, the third piezoelectric driving module group intervenes to clamp the substrate so as to realize the position adjustment of the substrate in the Y direction, and the first piezoelectric driving module group and the second piezoelectric driving module group do not limit the position adjustment of the substrate in the Y direction at the moment because the contact areas of the first piezoelectric driving module group and the second piezoelectric driving module group and the substrate are small;
thirdly, the third piezoelectric driving module group is separated from contact with the substrate, and the position of the substrate is adjusted by the first piezoelectric driving module group and the second piezoelectric driving module group;
then, after the first piezoelectric driving module group and the second piezoelectric driving module group finish secondary position adjustment on the substrate, the third piezoelectric driving module group intervenes to clamp the substrate so as to realize position adjustment on the substrate in the Y direction;
and finally, repeating the steps until the substrate is adjusted to a proper position for multiple times, and clamping the substrate by the first piezoelectric driving module group, the second piezoelectric driving module group and the third piezoelectric driving module group together to finish the position adjustment of the substrate.
When three piezoelectric driving module groups are provided, the first piezoelectric driving module group and the second piezoelectric driving module group provide power for the rotation of the substrate, and the third piezoelectric driving module group does not limit the rotation of the substrate under any condition because the contact area between the third piezoelectric driving module group and the substrate is small and the rotation angle of the substrate is small.
As described above, the invention adopts a piezoelectric driving clamping mode, and the piezoelectric motor drives the clamping unit to clamp the substrate, so that high clamping precision is realized, and deformation of the surface of the substrate caused by overlarge clamping force is avoided; and the adjustment and correction of the pose of the clamped substrate can be realized through the mutual cooperation of the piezoelectric driving module groups. In addition, by assembling the displacement sensor and the force sensor, the clamping precision of the substrate and the position and posture adjusting precision of the substrate are further improved.
Example two
The present embodiment provides a motion system, please refer to fig. 9, which is a schematic structural diagram of the motion system, and includes a piezoelectric driving clamping device and a two-dimensional macro-moving platform 7 according to the first embodiment, wherein the piezoelectric driving clamping device is installed on the two-dimensional macro-moving platform 7.
As an example, the two-dimensional macro table 7 can perform large displacement motion in the X direction and the Y direction, and further drive the piezoelectric driving clamping device to move.
As an example, referring to fig. 10 and 11, the present embodiment further provides a method for detecting a substrate, including the following steps:
s1: providing the above-described exercise system;
s2: at the handover station, the substrate 8 to be detected is placed on the support legs 2 by the transmission manipulator 9, and the movers 31 of the piezoelectric driving module group move oppositely to drive the clamping unit 4 to clamp the substrate 8;
s3: the two-dimensional macro-moving table 7 drives the piezoelectric driving clamping device and the substrate 8 to move to a detection station, wherein the substrate 8 is positioned below the image acquisition system 10 at the detection station;
s4: based on the identification of the substrate 8 acquired by the image acquisition system 10, judging whether the substrate 8 is in a detection range, if the substrate 8 is in the detection range, executing the next step, and if the substrate 8 is not in the detection range, driving the substrate 8 to continuously move by the piezoelectric driving module group until the substrate 8 moves to the detection range;
s5: based on the image acquisition system 10, acquiring the graph of the substrate 8, judging whether the substrate 8 is in the target posture, if the substrate 8 is in the target posture, executing the next step, and if the substrate 8 is not in the target posture, driving the substrate 8 to continuously rotate by the piezoelectric driving module group until the substrate 8 rotates into the target posture;
s6: at the detection station, the two-dimensional macro-moving table 7 is controlled to move along the X direction and the Y direction respectively, and the image acquisition system 10 is used for identifying and acquiring the patterns on the surface of the substrate 8;
s7: the two-dimensional macro-moving table 7 drives the piezoelectric driving clamping device and the substrate 8 to move to the handover station, the mover 31 of the piezoelectric driving module group moves reversely to drive the clamping unit 4 to release the substrate 8, and the substrate 8 is moved away from the piezoelectric driving clamping device by the transmission manipulator 9.
As an example, in step S2, first motion data of the piezoelectric driven gripping device is acquired, the first motion data being used as position reference correction data for the next cycle, and the pose adjustment time of the substrate in the operation flow for the next cycle is reduced.
As an example, in step S3, second motion data of the two-dimensional macro table 7 is acquired, the second motion data being position reference correction data of the next cycle, and the position adjustment time of the subsequent piezoelectric driven gripping device with the substrate 8 is reduced.
As an example, in step S4, the image capturing system 10 first captures the mark on the substrate 8, determines the current actual position of the substrate 8, and obtains a corresponding position difference by comparing the current actual position with the set target position, and then moves the substrate 8 to the target position by controlling the piezoelectric driving module group of the piezoelectric driving clamping device to move the substrate 8, and enters the detection range.
As an example, in step S5, the image capturing system 10 captures the pattern on the substrate 8 again, determines the current actual posture of the substrate 8, and obtains a corresponding posture difference value by comparing with the set target posture, and further rotates the substrate 8 to the target posture by controlling the piezoelectric driving module group of the piezoelectric driving clamping device to rotate the substrate 8.
As an example, in step S6, the two-dimensional macro-stage 7 is controlled to move with the piezoelectric driving clamping device and the substrate 8 at a constant speed in the X direction and the Y direction, and the image acquisition system 10 recognizes and acquires all the patterns and the marks on the surface of the substrate 8 one by one, so as to complete the detection data acquisition work of the substrate 8.
As an example, in step S7, the two-dimensional macro-stage 7 carries the piezoelectric driving clamping device and the substrate 8 to a transfer station, performs transfer and replacement of the substrate, transfers the inspected substrate out, receives a new substrate to be inspected in, and performs the next cycle.
As an example, in the process that the two-dimensional macro-moving table 7 drives the piezoelectric driving clamping device and the substrate 8 to accelerate or decelerate along the X direction and the Y direction, the clamping force of the piezoelectric motor 3 can be subjected to necessary dynamic adjustment under the monitoring and feedback of the force sensor 6, so that the situations of slipping, flying out and the like of the substrate 8 caused by insufficient clamping and holding force are avoided, and the stability of the position of the substrate 8 is ensured.
In summary, in the piezoelectric driving clamping device, the motion system and the substrate detection method, the piezoelectric driving clamping mode is adopted, the piezoelectric motor drives the clamping unit to clamp the substrate, so that high clamping precision is realized, and deformation of the surface of the substrate caused by overlarge clamping force is avoided; and the adjustment and correction of the pose of the clamped substrate can be realized through the mutual cooperation of the piezoelectric driving module groups. In addition, by assembling the displacement sensor and the force sensor, the clamping precision of the substrate and the position and posture adjusting precision of the substrate are further improved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (8)
1. A piezoelectric driven clamping device, comprising:
the base (1) comprises a substrate placing area (100) and a driving module installing area (101), wherein the driving module installing area (101) is arranged on the periphery of the substrate placing area (100) in a surrounding mode;
a support (2) located in the substrate placement area (100) for carrying a substrate;
the piezoelectric driving module groups are positioned in the driving module installation area (101), one piezoelectric driving module group comprises two piezoelectric motors (3) which are arranged at two sides of the substrate placement area (100) in a mirror image mode, the piezoelectric motors (3) are sticky sliding type piezoelectric motors, each piezoelectric motor (3) comprises a stator (30) and a rotor (31), the stators (30) are fixed on the two sides of the substrate placement area (100), each rotor (31) can move along a direction towards or away from the substrate placement area (100), each piezoelectric driving module group comprises a first piezoelectric driving module group and a second piezoelectric driving module group, each first piezoelectric driving module group comprises a first piezoelectric motor (300) and a second piezoelectric motor (301), each second piezoelectric driving module group comprises a third piezoelectric motor (302) and a fourth piezoelectric motor (303), each first piezoelectric motor (300) and each second piezoelectric motor (301) are positioned at two sides of the substrate placement area (100) in the X direction, each third piezoelectric motor (302) and each fourth piezoelectric motor (301) are positioned at the two sides of the substrate placement area (100) in the X direction, and each piezoelectric driving module group is positioned at the two sides of the first piezoelectric driving module group in the Y direction;
the clamping units (4) are arranged at the end parts of the rotor (31) close to the substrate placing area (100) in a one-to-one correspondence mode, the clamping units (4) comprise a clamping main plate (40) and a clamping head (41), the clamping main plate (40) is arranged on the rotor (31), the clamping head (41) is arranged at the end part of the clamping main plate (40) close to the substrate placing area (100), the clamping head (41) is arranged in the direction of the substrate placing area (100) in the horizontal direction, when the rotor (31) of the piezoelectric driving module group moves, the clamping units (4) can be driven to clamp the substrate, release the substrate and adjust the pose of the substrate, after the substrate clamping is completed, the first piezoelectric motor (300) and the second piezoelectric motor (301) move along the X direction, and simultaneously the third piezoelectric motor (302) and the fourth piezoelectric motor (303) move along the X direction or the first piezoelectric motor (300) and the fourth piezoelectric motor (301) move along the X direction, and the second piezoelectric motor (301) can move along the X direction.
2. The piezoelectric driven gripping device of claim 1, wherein: also comprises a displacement sensor (5), wherein the displacement sensor (5) comprises a sensing part (50) and a receiving part (51), the sensing part (50) is arranged on the clamping main plate (40) and linearly extends along the moving direction of the mover (31), and the receiving part (51) is arranged on the base (1).
3. The piezoelectric driven gripping device of claim 1, wherein: in the clamping units (4) mounted on the same piezoelectric driving module group, a force sensor (6) is arranged between the clamping main board (40) and the clamping head (41) of at least one clamping unit (4).
4. The piezoelectric driven gripping device of claim 1, wherein: the piezoelectric motor (3) is provided with a clearance space, a displacement sensor (5) is arranged in the clearance space, the displacement sensor (5) comprises an induction part (50) and a receiving part (51), the induction part (50) is arranged on the rotor (31) and linearly extends along the moving direction of the rotor (31), and the receiving part (51) is arranged on the stator (30).
5. The piezoelectric driven gripping device of claim 1, wherein: the piezoelectric driving module group further comprises a third piezoelectric driving module group, the third piezoelectric driving module group comprises a fifth piezoelectric motor (304) and a sixth piezoelectric motor (305), and the fifth piezoelectric motor (304) and the sixth piezoelectric motor (305) are located on two sides of the substrate placing area (100) in the Y direction.
6. A movement system comprising the piezoelectric driven gripping device of any one of claims 1-5, characterized in that: the piezoelectric driving clamping device is mounted on the two-dimensional macro-moving table (7).
7. A method of inspecting a substrate, comprising the steps of:
s1: providing a movement system according to claim 6;
s2: in a handover station, a transmission manipulator (9) places a substrate (8) to be detected on the support legs (2), and the movers (31) of the piezoelectric driving module group move in opposite directions to drive the clamping unit (4) to clamp the substrate (8);
s3: the two-dimensional macro-moving table (7) drives the piezoelectric driving clamping device and the substrate (8) to move to a detection station, wherein the substrate (8) is positioned below the image acquisition system (10) at the detection station;
s4: based on the identification of the substrate (8) acquired by the image acquisition system (10), judging whether the substrate (8) is in a detection range, if the substrate (8) is in the detection range, executing the next step, and if the substrate (8) is not in the detection range, driving the substrate (8) to continuously move by the piezoelectric driving module group until the substrate (8) moves into the detection range;
s5: based on the image acquisition system (10) to acquire the graph of the substrate (8), judging whether the substrate (8) is in a target posture, if the substrate (8) is in the target posture, executing the next step, and if the substrate (8) is not in the target posture, the piezoelectric driving module group drives the substrate (8) to continuously rotate until the substrate (8) rotates into the target posture;
s6: at a detection station, the two-dimensional macro-moving table (7) is controlled to move along the X direction and the Y direction respectively, and the image acquisition system (10) is used for identifying and acquiring data of patterns on the surface of the substrate (8);
s7: the two-dimensional macro-moving table (7) drives the piezoelectric driving clamping device and the substrate (8) to move to a handover station, the rotor (31) of the piezoelectric driving module group moves reversely to drive the clamping unit (4) to release the substrate (8), and the substrate (8) is moved away from the piezoelectric driving clamping device by the transmission manipulator (9).
8. The method for inspecting a substrate according to claim 7, wherein: in step S2, first motion data of the piezoelectric driving clamping device is acquired, wherein the first motion data is used as position reference correction data of a next cycle; and/or, in step S3, second motion data of the two-dimensional macro-moving table (7) is acquired, wherein the second motion data is used as position reference correction data of the next cycle.
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