CN116752219A - Method for manufacturing diamond blade - Google Patents
Method for manufacturing diamond blade Download PDFInfo
- Publication number
- CN116752219A CN116752219A CN202310532226.5A CN202310532226A CN116752219A CN 116752219 A CN116752219 A CN 116752219A CN 202310532226 A CN202310532226 A CN 202310532226A CN 116752219 A CN116752219 A CN 116752219A
- Authority
- CN
- China
- Prior art keywords
- aluminum alloy
- alloy matrix
- diamond
- solution
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 104
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 141
- 238000007747 plating Methods 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000011159 matrix material Substances 0.000 claims abstract description 61
- 238000009713 electroplating Methods 0.000 claims abstract description 40
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011701 zinc Substances 0.000 claims abstract description 27
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005498 polishing Methods 0.000 claims abstract description 11
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims abstract description 10
- 238000005246 galvanizing Methods 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004327 boric acid Substances 0.000 claims abstract description 8
- ICAKDTKJOYSXGC-UHFFFAOYSA-K lanthanum(iii) chloride Chemical compound Cl[La](Cl)Cl ICAKDTKJOYSXGC-UHFFFAOYSA-K 0.000 claims abstract description 8
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 101
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 239000008367 deionised water Substances 0.000 claims description 17
- 229910021641 deionized water Inorganic materials 0.000 claims description 17
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 12
- 229910017604 nitric acid Inorganic materials 0.000 claims description 12
- 238000001556 precipitation Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000005238 degreasing Methods 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000002791 soaking Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000003921 oil Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The application discloses a method for manufacturing a diamond blade. The manufacturing method of the diamond blade comprises the following steps: clamping an aluminum alloy substrate on a conductive member; galvanizing the clamped aluminum alloy matrix to form a zinc layer on the surface of the aluminum alloy matrix; placing the aluminum alloy matrix into electroplating solution for electroplating, and simultaneously adding diamond into the electroplating solution in an internal mode in the electroplating process to form a diamond nickel layer on a zinc layer on the surface of the aluminum alloy matrix, wherein the electroplating solution comprises nickel sulfamate with the concentration range of 450ml/L-600ml/L, boric acid with the concentration range of 35g/L-55g/L, lanthanum chloride with the concentration range of 0.5g/L-2g/L and sodium dodecyl sulfate with the concentration range of 0.05g/L-0.2 g/L; polishing the electroplated aluminum alloy matrix to obtain the diamond blade. The diamond blade manufactured by the method is beneficial to improving the uniformity of diamond distribution on the surface of the diamond blade and the strength of a plating layer.
Description
Technical Field
The application relates to the technical field of dicing blade manufacturing, in particular to a manufacturing method of a diamond blade.
Background
In the production of semiconductor chips, a diamond dicing blade is typically used to cut silicon wafers. The quality of the diamond dicing blade itself affects the processing quality of the product as an important cutting tool in production. Wherein, the plating layer strength on the surface of the diamond dicing blade and the uniformity of diamond distribution can influence the processing quality of the product. Therefore, ensuring diamond uniformity and plating strength on the surface of a diamond dicing blade when it is produced is a problem to be solved.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a method for manufacturing a diamond blade to improve the uniformity of diamond distribution on the surface of the diamond blade and the strength of the coating.
The embodiment of the application provides a manufacturing method of a diamond blade, which comprises the following steps:
clamping an aluminum alloy substrate on a conductive member;
galvanizing the clamped aluminum alloy matrix to form a zinc layer on the surface of the aluminum alloy matrix;
placing the aluminum alloy matrix into electroplating solution for electroplating, and simultaneously adding diamond into the electroplating solution in an internal mode in the electroplating process to form a diamond nickel layer on a zinc layer on the surface of the aluminum alloy matrix, wherein the electroplating solution comprises nickel sulfamate with the concentration range of 450ml/L-600ml/L, boric acid with the concentration range of 35g/L-55g/L, lanthanum chloride with the concentration range of 0.5g/L-2g/L and sodium dodecyl sulfate with the concentration range of 0.05g/L-0.2 g/L;
polishing the electroplated aluminum alloy matrix to obtain the diamond blade.
According to the manufacturing method of the diamond blade, the plating solution contains the sodium dodecyl sulfate, so that the main function of the sodium dodecyl sulfate is lubrication, pinhole defects on a coating can be avoided in the electroplating process, the diamond blade is prevented from being scrapped, and lanthanum chloride can enable the coating to crystallize and refine in the electroplating process, so that the strength of the coating is increased. During the electroplating process, diamond is added into the electroplating liquid in batches, so that the diamond is distributed in the plating layer more uniformly. The grooves cut by the diamond blade manufactured by the method are smoother.
In some embodiments, the step of placing the aluminum alloy substrate into the plating solution for plating includes washing the clamped aluminum alloy substrate with deionized water, and then installing a conductive member in a plating apparatus for plating the aluminum alloy substrate, wherein the current is kept at 3.8A during the plating, and the plating temperature is kept at 50 ℃.
In some embodiments, the step of adding diamond to the plating solution in bulk during plating includes adding 0.8g to 1.2g of diamond to the plating solution at the beginning of plating, then adding 1.8g to 2.2g of diamond to the plating solution after 1.5 hours of plating, then adding 1.3 to 1.7g of diamond to the plating solution after 3 hours of plating, and finally adding 1.8g to 2.2g of diamond to the plating solution after 4 hours of plating, the plating operation ending after 5 hours of plating to obtain the final plating layer.
In some embodiments, the step of galvanizing the clamped aluminum alloy substrate includes degreasing the aluminum alloy substrate, descaling the aluminum alloy substrate, and finally galvanizing the surface of the aluminum alloy substrate.
In some embodiments, the degreasing treatment is to degrease the aluminum alloy substrate in a sodium hydroxide solution; the descaling treatment is to put the aluminum alloy matrix after oil removal into a nitric acid solution for descaling; and the galvanization treatment is to put the aluminum alloy matrix subjected to descaling into a zinc precipitation solution to galvanize the aluminum alloy matrix.
In some embodiments, the step of degreasing the aluminum alloy substrate includes immersing the aluminum alloy substrate in 20g/L to 40g/L sodium hydroxide solution for 120s to 180s and then rinsing with deionized water; the step of putting the deoiled aluminum alloy matrix into a nitric acid solution for descaling comprises the steps of immersing the aluminum alloy matrix into 50% -70% nitric acid solution for 30s-60s, and then washing with deionized water; the step of putting the aluminum alloy matrix subjected to descaling into a zinc precipitation solution to carry out zinc plating on the aluminum alloy matrix comprises the steps of immersing the aluminum alloy matrix into the zinc precipitation solution for 120-180 s and then washing with deionized water.
In some embodiments, the diamond added batchwise to the plating solution has a particle size in the range of 4 microns to 40 microns.
In some embodiments, the step of polishing the electroplated aluminum alloy substrate includes first performing cylindrical flattening on the electroplated aluminum alloy substrate using a grinding wheel, and then placing the flattened aluminum alloy substrate on a lathe for edging.
In some embodiments, the step of polishing the electroplated aluminum alloy substrate further comprises placing the sharpened aluminum alloy substrate in a sodium hydroxide solution having a temperature in the range of 70-85 ℃, the concentration of the sodium hydroxide solution ranging from 250g/L to 300g/L.
In some embodiments, the step of polishing the electroplated aluminum alloy substrate further comprises placing the chemically-edged aluminum alloy substrate in a mixture of sulfuric acid and phosphoric acid.
Drawings
Fig. 1 is a flow chart of a method of making a diamond blade according to the present application.
Fig. 2 is a schematic cross-sectional structure of a finished diamond blade according to an embodiment of the present application.
Fig. 3 is a schematic perspective view of a clamped aluminum alloy substrate.
Fig. 4 is a schematic cross-sectional structure of a semi-finished product of the diamond blade shown in fig. 2.
Fig. 5 is an optical microscopic image of the cut of a diamond blade on a silicon wafer.
Description of the main reference signs
Aluminum alloy matrix 10
Blade body 11
Step 12
Conductive member 20
Clamp 30
Coating 40
Diamond blade 100
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that the terms "orientation" or "positional relationship" are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application. Furthermore, in the description of the present application, it is to be noted that the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; the two components can be connected in a mechanical mode, can be electrically connected or can be communicated with each other, can be directly connected, can be indirectly connected through an intermediate medium, and can be communicated with each other inside the two components or can be in interaction relation with each other. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, some embodiments of the present application provide a method for manufacturing a diamond blade 100. The method of manufacturing the diamond blade 100 in this embodiment may be used to manufacture a hubless diamond dicing blade, for example, the diamond blade 100 is manufactured to have a thickness in the range of 50mm to 200 mm.
Referring to fig. 1, 2 and 3, the method for manufacturing the diamond blade 100 includes the following steps S1-S4.
S1, clamping an aluminum alloy substrate 10 on a conductive member 20, namely, the specific operation can be as follows: when the aluminum alloy substrate 10 is manufactured, the rod-shaped aluminum alloy blank is firstly subjected to turning processing to process the shape of the blank into a stepped shape, namely, the aluminum alloy substrate 10 consists of a blade body 11 and a step 12, and the diameter of the step 12 is smaller than that of the blade body 11. When transferring the aluminum alloy substrate 10, the step 12 can be directly clamped, so that damage to the blade body 11 is avoided, and the process of transferring the aluminum alloy substrate 10 is more convenient due to the step 12.
After the aluminum alloy substrate 10 is processed, the aluminum alloy substrate 10 is rinsed by deionized water, so that the surface of the aluminum alloy substrate 10 is kept clean, and the deionized water removes ionic impurities, so that the cleaning effect on the aluminum alloy substrate 10 is better. Then, a plurality of aluminum alloy substrates 10 are sleeved on the same conductive piece 20 and fixed by the clamp 30, so that the clamped aluminum alloy substrates 10 are obtained, and two adjacent aluminum alloy substrates 10 are separated by the clamp 30. In this embodiment, the conductive member 20 is a conductive copper core. Because a plurality of aluminum alloy matrixes 10 are clamped on the same conductive piece 20, the processing of the plurality of aluminum alloy matrixes 10 can be realized in each process, so that the processing efficiency and the production efficiency of the diamond blade 100 are improved.
S2, galvanizing the clamped aluminum alloy substrate 10 to form a zinc layer on the surface of the aluminum alloy substrate 10, specifically, before galvanizing the aluminum alloy substrate 10, sequentially degreasing, descaling and galvanizing the clamped aluminum alloy substrate 10, so that a firm zinc layer can be formed on the surface of the aluminum alloy substrate 10. Oil lubrication, coolant, intermediate rust prevention, etc. are inevitably performed during turning or clamping, etc., and thus, oil stains are inevitably present on the surface of the aluminum alloy base body 10. Because greasy dirt can influence the quality of electroplating, leads to plating bath unable to plate to aluminum alloy base member 10, consequently must carry out deoiling to aluminum alloy base member 10, i.e. put into sodium hydroxide solution and deoil, the specific mode of deoiling is: the aluminum alloy matrix 10 is put into sodium hydroxide solution with the concentration range of 20g/L-40g/L and soaked for 120s-180s, and at the moment, the greasy dirt and sodium hydroxide are subjected to saponification reaction, so that the aim of removing the greasy dirt is fulfilled. It should be noted that the soaking time range includes two end values, namely 120s and 180s. When the soaking time is less than 120s, the greasy dirt on the surface of the aluminum alloy substrate 10 is not removed completely, the zinc layer cannot be firmly attached to the aluminum alloy substrate 10 during subsequent galvanization treatment, when the soaking time exceeds 180s, the manufacturing time of the diamond blade 100 is prolonged, at this time, the manufacturing efficiency of the diamond blade 100 is reduced, and the sodium hydroxide solution corrodes the aluminum alloy substrate 10, so that the surface of the aluminum alloy substrate 10 is blackened. In this embodiment, the soaking time of the aluminum alloy matrix 10 is 150s, and after the aluminum alloy matrix 10 reaches the soaking time, the aluminum alloy matrix 10 is taken out of the sodium hydroxide solution, and the sodium hydroxide solution remained on the surface of the aluminum alloy matrix 10 is washed by deionized water, so that the influence of the sodium hydroxide solution remained on the aluminum alloy matrix 10 on the subsequent descaling treatment is avoided.
The aluminum alloy substrate 10 after oil removal is placed into a nitric acid solution with the concentration range of 50% -70% and soaked for 30s-60s to carry out scale removal treatment, and oxide scales, burrs and the like on the surface of the aluminum alloy substrate 10 can be removed by carrying out acid washing on the aluminum alloy substrate 10. When oil stains exist on the surface of the aluminum alloy substrate 10, the oil stains pollute the nitric acid solution in the pickling process, thereby affecting the pickling quality, and therefore, the descaling process needs to be performed after the degreasing process. It should be noted that the soaking time range includes two end values, namely 30s and 60s. When the soaking time is less than 30 seconds, dirt on the surface of the aluminum alloy substrate 10 is not removed cleanly, a zinc layer cannot be firmly attached to the aluminum alloy substrate 10 during subsequent galvanization treatment, and when the soaking time exceeds 60 seconds, the manufacturing efficiency of the diamond blade 100 becomes low, and nitric acid can cause corrosion to the surface of the aluminum alloy substrate 10. In this embodiment, the soaking time of the aluminum alloy substrate 10 is 60s, and after the aluminum alloy substrate 10 reaches the soaking time, the aluminum alloy substrate 10 is taken out of the nitric acid solution, and the residual nitric acid solution on the surface of the aluminum alloy substrate 10 is washed away by deionized water, so that the residual nitric acid solution on the aluminum alloy substrate 10 is prevented from corroding the aluminum alloy substrate 10.
The aluminum alloy substrate 10 after descaling is put into a zinc precipitation solution and soaked for 120s-180s for galvanization, and it should be noted that the soaking time range includes two end values, namely 120s and 180s. When the time of placing the aluminum alloy matrix 10 in the zinc precipitation solution is too short, the zinc layer is difficult to meet the processing requirements; when the aluminum alloy substrate 10 is placed in the zinc precipitation solution for too long, the zinc layer on the surface of the aluminum alloy substrate 10 is rough and porous, the compactness and uniformity are reduced, and the quality of subsequent procedures is affected. In this embodiment, the soaking time of the aluminum alloy matrix 10 is 150s, and after the aluminum alloy matrix 10 reaches the soaking time, the aluminum alloy matrix 10 is taken out of the zinc precipitation solution, and the residual zinc precipitation solution on the surface of the aluminum alloy matrix 10 is washed by deionized water. The surface of the aluminum alloy substrate 10 is coated with a zinc layer, and the surface of the aluminum alloy substrate 10 is galvanized to prepare for the subsequent electroplating process, so that the electroplated coating 40 can be more firmly attached to the aluminum alloy substrate 10.
S3, mounting the aluminum alloy substrate 10 in a plating tank in a plating device, wherein a plating solution is arranged in the plating tank, and meanwhile, diamond is added into the plating solution in an partitioned manner in the plating process so as to form a diamond nickel layer on a zinc layer on the surface of the aluminum alloy substrate 10. The plating solution is a mixed solution composed of nickel sulfamate with the concentration range of 450ml/L-600ml/L, boric acid with the concentration range of 35g/L-55g/L, lanthanum chloride with the concentration range of 0.5g/L-2g/L and sodium dodecyl sulfate with the concentration range of 0.05g/L-0.2 g/L. Wherein when the concentration of each component in the plating solution is higher than the upper limit value, the dispersion ability of the plating solution is lowered, and when the dispersion ability of the plating solution is low, the surface plating layer 40 of the aluminum alloy substrate 10 is unevenly distributed; when the concentration of each component in the plating solution is lower than the lower limit value, the conductivity of the plating solution decreases, resulting in a longer plating time and a decrease in plating efficiency.
The plating solution is prepared by the following method, and 100L of plating solution is used as an example.
30L of deionized water was added to the plating tank, then 45L of nickel sulfamate solution was added, then 3500g of boric acid was further added while heating the solution to 50℃with stirring, and the stirring was maintained until the boric acid was completely dissolved.
5g of sodium dodecyl sulfate is added into 20ml of water for preparation, then 4L of boiling water is added, and the solution is continuously boiled for 15-45 min, so that the sodium dodecyl sulfate is quickly dissolved in the water, thereby being beneficial to saving the solution proportioning time and improving the solution proportioning speed. Finally, after the solution is cooled to 55 ℃, adding the sodium dodecyl sulfate solution into the solution in which the boric acid is completely dissolved.
50g of lanthanum chloride was added to deionized water to dissolve to form a lanthanum chloride solution, which was then added to the solution in which boric acid had been completely dissolved.
Deionized water was added to the plating bath until the solution reached 100L.
Before electroplating, 0.8g-1.2g of diamond, such as 1g of diamond, is added into the electroplating tank, then electroplating is started, the current is 3.8A in the electroplating process, and the electroplating temperature is kept at 50 ℃. When the current intensity is less than 3.8A, the plating time increases due to the small current, thereby making the manufacturing time of the diamond blade 100 long. When the current is more than 3.8A, the plating layer 40 grows at a too high rate due to the large current, resulting in dendrites, which cause a large stress in the plating layer 40, thereby affecting the strength of the plating layer 40. In the electroplating process, when the temperature of the electroplating is higher than 50 ℃, partial components in the electroplating solution are decomposed, so that the electroplating is failed; in addition, when the temperature is too high, the dispersion ability of the plating solution is lowered, resulting in uneven distribution of the plating layer 40 on the aluminum alloy base 10. When the plating temperature is lower than 50 ℃, the conductivity of the plating solution becomes low, so that the plating time becomes long.
After 1.5 hours of plating, 1.8g-2.2g of diamond is added to the plating solution and plating is continued, for example, 2g of diamond is added, after 3 hours of plating, 1.3 g-1.7 g of diamond is added and plating is continued, for example, 1.5g of diamond is added, after 4 hours of plating, 1.8g-2.2g of diamond is added and plating is continued, for example, 2g of diamond is added, and after 5 hours of plating, plating is stopped, at which time 150 μm thick plating layer 40, i.e., diamond nickel layer, is finally formed on aluminum alloy substrate 10. After the plating is completed, the aluminum alloy substrate 10 is taken out of the plating tank and the plated semifinished product is washed with deionized water. The diamond size is selected from the range of 4 microns to 40 microns, and the diamond size is selected based on the material to be cut by the diamond blade 100.
Since the rare earth element additive lanthanum chloride is added into the plating solution, the plating layer 40 can be crystallized and thinned, and the strength of the plating layer 40 can be increased. The sodium dodecyl sulfate in the electroplating solution plays a role of a wetting agent, so that pinhole defects of the plating layer 40 are not easy to occur in the electroplating process, and the scrapping condition is avoided. In this embodiment, the diamonds are added into the plating solution in four batches, and since the amount of the diamonds added into the plating solution is small each time, the diamonds can be rapidly and uniformly dispersed into the plating solution, so that the diamonds are added into the plating solution in a batch-wise manner, the phenomenon that the diamonds are agglomerated in the plating solution is prevented, and the diamonds can be uniformly plated on the surface of the aluminum alloy substrate 10, thereby preventing uneven grooves cut by the diamond blade 100 due to uneven diamond distribution. In addition, nickel acts as a binder in the diamond nickel coating 40, and nickel can firmly hold the diamond.
After a period of use of the plating solution, the concentration of each component in the plating solution may decrease, and the consumed components may need to be replenished into the plating solution. The general flow is as follows: firstly, calculating the electric quantity consumed by electroplating, then, calculating the consumption of each component according to the electric quantity, and finally, measuring each component and adding the components into the electroplating solution.
And S4, polishing the electroplated aluminum alloy matrix 10 to obtain the diamond blade. Referring to fig. 1, 2 and 4, the electroplated aluminum alloy substrate 10 is removed from the conductive member 20, and the aluminum alloy substrate 10 is first ground and flattened by using a # 800 grinding wheel, so that the diameter of the outer circle of the aluminum alloy substrate 10 meets the diameter requirement. Then the aluminum alloy substrate 10 is clamped on a lathe chuck for turning to thin the thickness of the outer edge of the blade body 11 (as shown in fig. 4), then the processed aluminum alloy substrate 10 is placed in a sodium hydroxide solution with the concentration of 250g/L-300g/L, the solution temperature of the sodium hydroxide solution is controlled to be 70-85 ℃, and the thinner part of the blade body 11 is etched by using the sodium hydroxide solution so as to expose the diamond nickel layer. Finally, the aluminum alloy substrate 10 is put into a mixed solution of sulfuric acid and phosphoric acid for electrochemical polishing to remove surface dirt, so that the cutting edge of the diamond blade 100 is sharpened.
When the diamond blade 100 is manufactured, the diamond blade 100 may be inspected by an application test.
The test conditions were as follows:
cutting materials: 6 inch silicon wafer with thickness of 0.7mm
Cutting equipment: DISCO 322 cutting machine
Spindle rotational speed: 24000rpm
Feed speed: 10mm/s
Depth of cut: 0.4mm
When the diamond blade 100 cuts several streets on the silicon wafer, the cutting result is verified by observing the groove shape of the cross section of the streets.
The purpose of this test was to verify the uniformity of diamond distribution in the diamond blade 100 in the groove shape of the cross section of the dicing lane, as shown in fig. 5, the groove width of the dicing lane was uniform and the groove surface was smooth, thereby indicating that the diamond distribution in the diamond blade 100 was uniform and the diamond blade 100 produced without defects.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Finally, it should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. The manufacturing method of the diamond blade is characterized by comprising the following steps:
clamping an aluminum alloy substrate on a conductive member;
galvanizing the clamped aluminum alloy matrix to form a zinc layer on the surface of the aluminum alloy matrix;
placing the aluminum alloy matrix into electroplating solution for electroplating, and simultaneously adding diamond into the electroplating solution in an internal mode in the electroplating process to form a diamond nickel layer on a zinc layer on the surface of the aluminum alloy matrix, wherein the electroplating solution comprises nickel sulfamate with the concentration range of 450ml/L-600ml/L, boric acid with the concentration range of 35g/L-55g/L, lanthanum chloride with the concentration range of 0.5g/L-2g/L and sodium dodecyl sulfate with the concentration range of 0.05g/L-0.2 g/L;
polishing the electroplated aluminum alloy matrix to obtain the diamond blade.
2. The method for manufacturing a diamond blade according to claim 1, wherein,
the step of placing the aluminum alloy matrix into the electroplating solution for electroplating comprises the steps of firstly flushing the clamped aluminum alloy matrix by using deionized water, then installing a conductive piece in electroplating equipment for electroplating the aluminum alloy matrix, wherein the current is kept at 3.8A during electroplating, and the electroplating temperature is kept at 50 ℃.
3. The method for manufacturing a diamond blade according to claim 2, wherein,
the step of adding diamond to the plating solution in an partitioned manner in the plating process comprises the steps of adding 0.8g-1.2g of diamond to the plating solution at the beginning of plating, adding 1.8g-2.2g of diamond to the plating solution after 1.5 hours of plating, adding 1.3 g-1.7 g of diamond to the plating solution after 3 hours of plating, adding 1.8g-2.2g of diamond to the plating solution after 4 hours of plating, and finishing the plating operation after 5 hours of plating to obtain a final plating layer.
4. The method for manufacturing a diamond blade according to claim 1, wherein,
the step of galvanizing the clamped aluminum alloy matrix comprises the steps of firstly degreasing the aluminum alloy matrix, then descaling the aluminum alloy matrix, and finally galvanizing the surface of the aluminum alloy matrix.
5. The method for manufacturing a diamond blade according to claim 4, wherein,
the oil removal treatment is to put the aluminum alloy matrix into sodium hydroxide solution for oil removal;
the descaling treatment is to put the aluminum alloy matrix after oil removal into a nitric acid solution for descaling;
and the galvanization treatment is to put the aluminum alloy matrix subjected to descaling into a zinc precipitation solution to galvanize the aluminum alloy matrix.
6. The method for manufacturing a diamond blade according to claim 5, wherein,
the step of putting the aluminum alloy matrix into sodium hydroxide solution for degreasing comprises immersing the aluminum alloy matrix into 20-40 g/L sodium hydroxide solution for 120-180 s, and then washing with deionized water;
the step of putting the deoiled aluminum alloy matrix into a nitric acid solution for descaling comprises the steps of immersing the aluminum alloy matrix into 50% -70% nitric acid solution for 30s-60s, and then washing with deionized water;
the step of putting the aluminum alloy matrix subjected to descaling into a zinc precipitation solution to carry out zinc plating on the aluminum alloy matrix comprises the steps of immersing the aluminum alloy matrix into the zinc precipitation solution for 120-180 s and then washing with deionized water.
7. The method for manufacturing a diamond blade according to claim 1, wherein,
the diamond particles added to the plating solution in batches have a particle size in the range of 4 microns to 40 microns.
8. The method for manufacturing a diamond blade according to claim 1, wherein,
the step of polishing the electroplated aluminum alloy matrix comprises the steps of firstly using a grinding wheel to conduct excircle flattening on the electroplated aluminum alloy matrix, and then placing the flattened aluminum alloy matrix on a lathe for edge machining.
9. The method of manufacturing a diamond blade according to claim 8, wherein,
the step of polishing the electroplated aluminum alloy matrix further comprises the step of placing the aluminum alloy matrix after turning into a sodium hydroxide solution with the temperature range of 70-85 ℃, wherein the concentration range of the sodium hydroxide solution is 250-300 g/L.
10. The method of manufacturing a diamond blade according to claim 9, wherein,
the step of polishing the electroplated aluminum alloy matrix further comprises the step of placing the aluminum alloy matrix after chemical cutting into a mixed solution of sulfuric acid and phosphoric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310532226.5A CN116752219A (en) | 2023-05-11 | 2023-05-11 | Method for manufacturing diamond blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310532226.5A CN116752219A (en) | 2023-05-11 | 2023-05-11 | Method for manufacturing diamond blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116752219A true CN116752219A (en) | 2023-09-15 |
Family
ID=87956087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310532226.5A Pending CN116752219A (en) | 2023-05-11 | 2023-05-11 | Method for manufacturing diamond blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116752219A (en) |
-
2023
- 2023-05-11 CN CN202310532226.5A patent/CN116752219A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109518259B (en) | Nickel-copper composite electroplating hub type scribing cutter and application thereof | |
| CN101633158B (en) | Diamond grinding wheel for cutting silicon crystal circle and preparation method thereof | |
| CN105970260A (en) | Method for improving homogeneity in jet electrodeposition processing process | |
| CN109023378B (en) | Cathode roller chemical polishing solution and polishing method | |
| CN102803574B (en) | Copper alloy for electronic material and preparation method thereof | |
| CN110125828A (en) | A kind of preparation method of diamond tool | |
| KR100597545B1 (en) | Apparatus and method for making electrodeposition blades | |
| CN111636084A (en) | Method for improving binding force of neodymium iron boron magnet coating and neodymium iron boron magnet electroplated part | |
| KR100338386B1 (en) | Wire saw with adhesive diamond electrodeposited on it and its manufacturing method | |
| CN1302235A (en) | Low etch alkaline zincate composition and process for zincating aluminum | |
| CN116752219A (en) | Method for manufacturing diamond blade | |
| JP2004237376A (en) | Single layer fixed abrasive grain wire saw, its manufacturing method and cutting method | |
| CN113201738A (en) | Electrochemical surface treatment method for selectively laser melting AlSi10Mg formed workpiece | |
| CN113477941A (en) | Electro-deposition process for self-lubricating coating of additive manufactured aluminum alloy part | |
| US20090302003A1 (en) | Aqueous Solution for Chemical Polishing and Deburring and Process for Polishing and Deburring A Part made of Pure Nickel or Nickel-200 Therein | |
| CN113186589B (en) | Electrochemical surface treatment method for selectively laser melting AlSi10Mg alloy heat treatment product | |
| CN114197002B (en) | Cyanide cadmium plating barrel plating method for aircraft engine parts | |
| CN115515327A (en) | Electroless nickel-gold process applied to ceramic substrate | |
| CN112746304B (en) | Hub type scribing cutter, preparation method thereof and application thereof in gallium arsenide material processing | |
| CN109097779A (en) | A kind of electrolytic copper foil titanium cathode roller chemical polishing solution and polishing method | |
| CN112831813B (en) | Multilayer concentration diamond scribing knife and preparation method thereof | |
| CN114318448A (en) | Chemical copper-nickel plating process universally used for aluminum alloy matrix | |
| CN110125825B (en) | Annular grinding tool and method for manufacturing annular grinding tool | |
| CN117210909A (en) | Preparation method of diamond wire saw with diameter less than 40um | |
| KR101826428B1 (en) | Method for manufacturing grinding tool with aluminium diamond grinder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |