CN116734222A - Composite phase-change heat dissipation device - Google Patents
Composite phase-change heat dissipation device Download PDFInfo
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- CN116734222A CN116734222A CN202310518721.0A CN202310518721A CN116734222A CN 116734222 A CN116734222 A CN 116734222A CN 202310518721 A CN202310518721 A CN 202310518721A CN 116734222 A CN116734222 A CN 116734222A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 239000002131 composite material Substances 0.000 title claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 59
- 230000008859 change Effects 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 238000012546 transfer Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000001179 sorption measurement Methods 0.000 abstract description 5
- 239000011800 void material Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 28
- 230000000694 effects Effects 0.000 description 7
- 239000004519 grease Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 238000010992 reflux Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 241000208818 Helianthus Species 0.000 description 2
- 235000003222 Helianthus annuus Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
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- 230000002349 favourable effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
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- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a composite phase-change heat dissipation device, wherein a bottom plate is fixed below a heat dissipation main body and seals a phase-change heat transfer cavity of the heat dissipation main body; the light source component is fixed at the lower surface of the bottom plate and provided with a welding groove structure. According to the invention, the welding groove structure with the same size as the soldering lug is carved at the position of the center of the lower surface of the bottom plate, which corresponds to the light source substrate, and the addition of the welding groove structure can change the wettability of metal liquid drops when the soldering lug is melted, reduce the internal cohesive force of the metal liquid drops, increase the adsorption force between the soldering lug and the bottom plate, increase the area of the adsorption surface after the soldering lug is melted, improve the welding quality, reduce the void ratio of a soldering lug layer and achieve the purpose of improving the heat conductivity between the light source substrate and the bottom plate.
Description
Technical Field
The invention belongs to the technical field of heat dissipation devices, and particularly relates to a composite phase change heat dissipation device.
Background
In the 'high-temperature-equalization composite radiator' (application number 2022220225934) disclosed in Chinese patent publication, the bottom surface of a radiating liner is contacted with the inner surface of a temperature equalization plate, and micro-groove groups are distributed on the inner side surface of the bottom of the radiating liner; the light source bracket can be fixed on the outer surface of the temperature equalizing plate through heat conduction silicone grease, and the problems that the interface contact thermal resistance is large, heat cannot be timely and outwards transferred, so that the heat is accumulated at the position of a heat source, the temperature gradient of the transverse temperature equalizing plate is large and the like exist. The light source support can also be fixed at the samming board surface through the welding mode, and the welded plane between light source support and the samming board produces the problem in actual operation that the solder can not the complete tiling of back welding cover light source support and samming board's whole contact surface, but exists about 50% cavity, makes welded effect be less than expected half even, leads to heat conduction efficiency decline, reduces heat dispersion.
Disclosure of Invention
The invention aims to solve the technical problem of providing a composite phase change heat dissipation device which can reduce thermal interface resistance and increase the heat conductivity coefficient between contact interfaces so as to enhance the heat conduction and dissipation performance of a radiator.
In order to solve the technical problems, in the composite phase-change heat dissipation device, a bottom plate is fixed below a heat dissipation main body and seals a phase-change heat transfer cavity of the heat dissipation main body; the light source component is fixed at the lower surface of the bottom plate and provided with a welding groove structure.
The welding groove structure is a square column-shaped groove matrix.
The square column-shaped groove has a groove depth of 0.1mm-1mm and a groove width of 1mm-10 mm.
The bottom plate is a metal temperature equalizing plate; the bottom surface of the metal temperature equalizing plate is provided with a welding groove structure corresponding to the position of the light source assembly, and the top surface is provided with a micro-groove group structure corresponding to the position of the phase change heat transfer cavity.
The bottom plate adopts a flat heat pipe structure.
The flat heat pipe structure comprises a heat pipe lower cover, a flat heat pipe and a heat pipe upper cover; the lower half part of the flat heat pipe is embedded into a lower pipe embedding groove on the top surface of the heat pipe lower cover, the upper half part of the flat heat pipe is embedded into an upper pipe embedding groove on the bottom surface of the heat pipe upper cover, and the heat pipe lower cover is fixedly connected with the heat pipe upper cover; the lower surface of the heat pipe lower cover is provided with a welding groove structure, and the part of the top surface of the heat pipe upper cover corresponding to the phase change heat transfer cavity is provided with a micro groove group structure.
The flat heat pipe structure comprises a heat pipe lower cover, a flat heat pipe and a heat pipe upper cover; the flat heat pipe is integrally embedded into a lower pipe embedding groove on the top surface of the heat pipe lower cover or an upper pipe embedding groove on the bottom surface of the heat pipe upper cover; the heat pipe lower cover and the heat pipe upper cover are fixed together; the lower surface of the heat pipe lower cover is provided with a welding groove structure, and the part of the top surface of the heat pipe upper cover corresponding to the phase change heat transfer cavity is provided with a micro groove group structure.
The liquid phase-change working medium is poured into the flat heat pipe, and the pouring quantity of the liquid phase-change working medium is 5% -75% of the volume of the flat heat pipe.
The flat heat pipe is a copper pipe or an aluminum pipe which is bent into a closed loop which is connected end to end.
The heat dissipation main body adopts magnesium aluminum alloy or aluminum alloy.
The invention has the beneficial effects that:
1. the welding groove structure with the same size as the soldering lug is carved in the position of the center of the metal temperature equalizing plate corresponding to the light source substrate in a laser micro-carving mode, the wettability of metal liquid drops when the soldering lug is melted can be changed by adding the welding groove structure, the internal cohesive force of the metal liquid drops is reduced, the adsorption force between the soldering lug and the metal temperature equalizing plate is increased, the area of an adsorption surface after the soldering lug is melted is increased, the welding quality is improved, the cavity rate of a soldering lug layer is reduced, and the purpose of improving the heat conductivity between the light source substrate and the metal temperature equalizing plate is achieved.
2. For COB light sources, heat is concentrated on the small-sized light source face. The heat conduction silicone grease is replaced by the integrated welding process of the light source interface, the heat conductivity of the contact interface is improved, meanwhile, the heat resistance is reduced, the heat conductivity of the heat interface can be improved from 2-8W/m.K of the heat conduction silicone grease to 67W/m.K of the metal alloy, the heat transfer to the radiator end is accelerated, the heat is prevented from accumulating at a heat source, and the light attenuation or other damages of the light source caused by overhigh temperature are reduced.
3. The light source is fixed in a welding mode, so that the use of a light source fixing screw can be reduced, and meanwhile, the punching of a metal uniform Wen Banjun temperature surface is avoided, and therefore, a flat heat pipe structure with a phase change microstructure inside can be used for replacing the metal uniform temperature plate.
4. The metal temperature equalizing plate is replaced by a flat plate heat pipe structure with a phase change microstructure inside, and the heat conductivity can be improved to more than 2000W/mK from 201W/mK of metal aluminum alloy.
5. Through the combination of the flat heat pipe structure and the micro-groove group structure, the heat dissipation in the transverse and longitudinal multi-dimensional directions is improved, and the heat resistance can be reduced to the minimum in all directions of the heat dissipation path of the radiator, so that the heat conductivity is maximum. Meanwhile, the phase change microstructure in the flat heat pipe carries out heat transfer through the pressure difference generated by capillary force and temperature difference, so that the influence of gravity of the radiator in an angled use environment can be reduced, and the heat dissipation effect of the illuminator in an angled working condition can be enhanced.
Drawings
Fig. 1 is a perspective view of embodiment 1 of the present invention.
Fig. 2 is a perspective view of a metal temperature uniformity plate.
Fig. 3 is a perspective view of embodiment 2 of the present invention.
Fig. 4 is a side view of embodiment 2 of the present invention.
FIG. 5 is a cross-sectional view of embodiment 2 of the present invention
Fig. 6 and 7 are exploded views of embodiment 2 of the present invention.
Fig. 8 is a schematic view of a weld groove.
Fig. 9 is a top view of a heat pipe lower cover.
FIG. 10 is a cross-sectional view of a flat plate heat pipe structure.
FIG. 11 is a schematic cross-sectional view of a flat plate heat pipe.
Fig. 12 a-12 d are schematic views of different shaped weld grooves.
In the figure: 1. a heat dissipating body; 11. a phase change heat transfer cavity; 12. a heat radiation fin; 13. condensing and refluxing an upper cover; 14. vacuumizing a screw; 2. a light source assembly; 21. a light source; 22. a light source substrate; 3. a metal temperature equalizing plate; 31. welding a groove structure; 4. a flat heat pipe structure; 41. a heat pipe lower cover; 411. a lower pipe embedding groove; 412. welding a groove structure; 42. a flat heat pipe; 421. a phase change working medium; 43. a heat pipe upper cover; 431. an upper pipe embedding groove; 432. micro-groove group structure.
Detailed Description
The present invention will now be described in further detail with reference to the drawings and examples, it being understood that the specific examples described herein are intended to illustrate the invention only and are not intended to be limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements or interaction relationship between the two elements. The specific meaning of the above terms in the present invention can be understood in detail by those skilled in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact, but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below", "beneath" the second feature includes the first feature being "directly under" and obliquely below "the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, for convenience of description and simplicity of operation, and are not meant to indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Example 1
As shown in fig. 1, the composite phase change radiator of the present invention includes a radiating body 1 and a base plate; the bottom plate is fixed below the heat dissipation main body 1 and seals the phase change heat transfer cavity 11 of the heat dissipation main body 1; the light source assembly 2 is fixed to the lower surface of the base plate.
The bottom plate adopts a metal temperature equalizing plate 3.
As shown in fig. 2, in order to enhance the welding effect between the light source assembly 2 and the metal temperature-equalizing plate 3, a welding groove structure 31 is prepared at the position corresponding to the light source assembly 2 at the center of the bottom surface of the metal temperature-equalizing plate 3 by laser micro-engraving, so as to change the wettability of molten metal drops and the surface of the radiator after the soldering lug is melted, disperse the cohesiveness and adsorptivity between the center and the periphery caused by uneven temperature during cooling, reduce the cavitation condition and enhance the welding effect; the top surface of the metal temperature equalizing plate 3 is provided with a micro-groove group structure at the position corresponding to the phase change heat transfer cavity 11.
The square column-shaped groove has a groove depth of 0.1mm-1mm and a groove width of 1mm-10 mm.
As shown in fig. 5, the heat dissipation main body 1 includes a phase change heat transfer cavity 11 and heat dissipation fins 12 extending outwards in the form of sunflower around the phase change heat transfer cavity; the cross section of the phase change heat transfer cavity 11 can be round or square; the bottom of the phase change heat transfer cavity 11 is partially blocked by a micro-groove group structure on the top surface of the metal temperature equalizing plate 3, and the top is blocked by a condensation reflux upper cover 13; the heat dissipation main body and the condensation reflux upper cover 13 are fixed in a press fit mode, the vacuumizing screw 14 is arranged on a threaded hole of the condensation reflux upper cover 13 and is sealed by a silica gel ring and heat conduction sealing silica gel between the heat dissipation main body and the condensation reflux upper cover, so that the phase change heat transfer cavity 11 forms a closed cavity, and the vacuum degree can reach more than-95 kpa; the liquid heat transfer working medium is filled in the phase change heat transfer cavity 11, and the surrounding radiating fins are used for increasing the radiating area and improving the radiating effect. The heat dissipation main body adopts magnesium aluminum alloy or aluminum alloy.
The heat dissipation main body 1 may also have a structure in which a heat transmission module (for example, "a phase-change liquid and a heat transmission module containing the phase-change liquid", application number: CN 201811049591.6) is embedded in the central through hole, and heat dissipation fins extending outwards in a sunflower form are distributed around the heat dissipation main body. For the heat dissipation main body of such a structure, the top surface of the metal temperature equalizing plate 3 may be in contact with the bottom surface of the heat transfer module and welded and fixed.
The light source assembly 2 comprises a light source 21 and a light source substrate 22; the light source 21 is fixed on the light source substrate 22; the shape and the size of the welding groove structure are the same as those of the welding lug and the light source substrate; the light source substrate 22 is fixed on the bottom surface of the metal temperature equalizing plate 3 at a position corresponding to the welding groove structure 31 by using a welding tab in a welding mode. Because the welding position of the metal temperature equalizing plate 3 is provided with the welding groove structure 31, the phenomenon that too much cohesive force and too little adsorption force are formed by welding lug liquid drops due to surface tension can be avoided, and therefore the heat conduction and dissipation performance is improved.
The weld recess structure 31 divides the weld face into a number of facets.
Example 2
As shown in fig. 3-7, this embodiment is different from embodiment 1 in that the bottom plate adopts a flat heat pipe structure 4; the flat heat pipe structure 4 is fixed below the heat dissipation main body 1 and seals the phase change heat transfer cavity 11 of the heat dissipation main body 1; the light source assembly 2 is fixed on the lower surface of the flat heat pipe structure 4.
The flat heat pipe structure 4 comprises a heat pipe lower cover 41, a flat heat pipe 42 and a heat pipe upper cover 43; the lower surface of the heat pipe lower cover 41 is provided with a welding groove structure 412, and the top surface is provided with a lower embedded pipe slot 411 corresponding to the shape of the flat heat pipe 42; the bottom surface of the upper cover 43 of the heat pipe is provided with an upper pipe embedding groove 431 corresponding to the shape of the heat pipe 42, and the top surface is provided with a micro groove group structure 432; the lower half part of the flat heat pipe 42 is embedded in the lower pipe embedding slot 411, and the upper half part is embedded in the upper pipe embedding slot 431 and fixed in a welding manner; the heat pipe lower cover 41 and the heat pipe upper cover 43 are welded and fixed together.
In order to enhance the welding effect between the light source assembly 2 and the flat heat pipe structure 4, a welding groove structure 412 is prepared at the central position of the bottom surface of the heat pipe lower cover 41 by laser micro-engraving, so that the wettability of molten metal drops of a soldering lug and the surface of a radiator is changed, the cohesiveness and adsorptivity between the center and the periphery caused by uneven temperature during dispersion cooling are reduced, the cavitation condition is reduced, and the welding effect is enhanced.
The square column-shaped groove has a groove depth of 0.1mm-1mm and a groove width of 1mm-10 mm.
The heat generated by the light source 21 is directly transferred to the phase change heat transfer cavity 11 for heat conduction and dissipation after passing through the flat heat pipe structure, so that the heat resistance in the heat dissipation path can be reduced.
The weld groove structure 412 divides the weld face into facets.
The flat heat pipe 12 is made of a copper pipe or an aluminum pipe which are connected end to end, a liquid phase change working medium 421 is poured into the flat heat pipe, heat is conducted based on a phase change principle, and the flat heat pipe has high heat conductivity; the liquid phase change working medium filling amount is 5% -75% of the volume of the flat heat pipe.
The flat heat pipe structure 4 is favorable for carrying out heat diffusion on the light source 21, and has the advantages of light weight, good starting performance, uniform temperature and the like; the phase change heat transfer cavity with the micro-groove group structure on the top has the characteristics of high heat exchange coefficient, stable operation and the like. The invention can be widely applied to high-power high-density electronic equipment, and high-intensity heat exchange is realized by performing high-intensity evaporation or nucleate boiling compound phase change heat exchange at a meniscus formed by capillary force of liquid working media in a micro-groove group.
The flat heat pipe can adopt heat pipes with three cores of internal sintered metal powder cores, channels and silk screen. When the flat heat pipe is heated, the liquid in the pipe is quickly evaporated, the steam flows to the condensing section under the action of pressure and capillary force to condense and release heat, and the steam is condensed into liquid again and flows back to the evaporating section along the porous material under the action of capillary force to quickly circulate. The heat conduction is carried out based on phase change, so that heat dissipation can be effectively solved, the temperature gradient can be reduced, the planar thermal resistance can be reduced to achieve high thermal conductivity, heat can be rapidly and timely transferred, the heat diffusion of the substrate can be enhanced to the greatest extent by replacing the metal substrate with the flat heat pipe, and the excellent isothermicity is also favorable for reducing the thermal resistance. The heat generated by the heat source can be quickly brought to the surroundings, the extremely high heat conductivity reduces the temperature gradient of the plane, and the heat is transferred to the micro-channel at the other end for phase-change heat dissipation.
The liquid phase change working medium in the flat heat pipe 42 and the phase change heat transfer cavity 11 is one or more of water, methanol, ethanol, acetone, R134a, R410a or R22.
The actual measurement and simulation experiments are carried out on the invention, and materials and thermal conductivity used in the experimental process are shown in table 1.
TABLE 1
| Structure of the | Thermal conductivity (W/m.K) |
| Heat-conducting silicone grease | 6.5 |
| Soldering lug | 67 |
| Pure metal temperature equalizing plate | 201 |
| Flat heat pipe structure | 2000 |
Actual measurement and simulation are carried out on the radiator according to the data, and temperature rise comparison of each comparative example and the example is obtained, and the data are shown in Table 2.
TABLE 2
Comparative example 1: in the traditional radiator, a light source is adhered to the lower surface of a metal temperature-equalizing plate through heat-conducting silicone grease.
Comparative example 2: in the traditional radiator, a light source is fixed on the lower surface of a metal temperature equalizing plate through welding by a welding lug.
Comparative example 3: the pure metal temperature equalizing plate is replaced by a flat plate heat pipe structure with a phase change heat pipe structure (the bottom surface of the flat plate heat pipe structure is not provided with a welding groove structure).
As can be seen from Table 2, compared with the conventional radiator using the heat-conducting silicone grease and the pure metal heat-equalizing plate, after the heat-conducting silicone grease is replaced by the welding piece welding mode, the temperature rise of the welding spot is slightly reduced, and at the moment, the welding cannot be completely attached to the contact surface due to the limitation of the process and the structure, so that the welding groove structure is added to the welding contact surface, and the data show that the temperature rise of the welding spot is reduced due to the addition of the welding groove structure, the cavitation condition of the welding surface is reduced, and the heat conductivity of the contact position is improved. After the pure metal temperature equalizing plate is replaced by a flat plate heat pipe structure with a phase change heat pipe structure, the temperature rise of welding spots is obviously reduced, the flat plate heat pipe structure is added to improve the temperature equalizing property of the contact surface of the light source, the heat conductivity is increased, and the heat accumulation at the position of the light source is avoided. The welding groove structure is additionally arranged on the bottom surface of the flat heat pipe structure, so that the heat conductivity of a heat dissipation path can be maximized to the greatest extent, the heat resistance is minimized, and the temperature rise of welding spots is reduced to the greatest extent.
The comparison of the thermal conductivity of the welding grooves on the lower surface of the lower cover of the heat pipe when different shapes are selected is shown in table 3.
TABLE 3 Table 3
In table 3: the thermal conductivity refers to the thermal conductivity of the portion of the heat pipe lower cover having the welded groove structure.
Example 2-1: as shown in fig. 8, the welding groove structure is a square column groove matrix, and 1mm, 5mm and 10mm refer to the groove width of the square column groove, namely the side length of the bottom surface of the square column groove.
Example 2-2: as shown in fig. 12a, the welding groove structure is a plurality of grooves with arc-shaped cross sections, which are parallel to each other, and 1mm, 5mm and 10mm refer to the distance between adjacent grooves (i.e. the distance between two lowest points).
Examples 2-3: as shown in fig. 12b, the welding groove structure is a trapezoid table type groove matrix, the edge sections between adjacent trapezoid table type grooves are trapezoid, and 1mm, 5mm and 10mm refer to the square side length of the bottom surface of the trapezoid table type groove.
Examples 2 to 4: as shown in fig. 12c, the welding groove structure is a surface on which cylindrical protrusions are distributed, and 1mm, 5mm and 10mm refer to the center-to-center distances between adjacent cylindrical protrusions.
Examples 2 to 5: as shown in fig. 12d, the welding groove structure is a trapezoid table type groove matrix, the edge sections between adjacent trapezoid table type grooves are triangular, and 1mm, 5mm and 10mm refer to square side lengths of the bottom surfaces of the trapezoid table type grooves.
The present invention is not limited to the above embodiment, and the flat heat pipe structure 1 may also adopt a structure in which the entire heat pipe 12 is embedded in the pipe groove of the heat pipe lower cover 11, the heat pipe upper cover 13 is a flat plate structure of an unprocessed pipe groove, or a structure in which the entire heat pipe 12 is embedded in the pipe groove of the heat pipe upper cover 13, and the heat pipe lower cover 13 is a flat plate structure of an unprocessed pipe groove.
Claims (10)
1. The composite phase-change heat dissipation device is characterized in that a bottom plate is fixed below a heat dissipation main body (1) and seals a phase-change heat transfer cavity (11) of the heat dissipation main body; the light source component (2) is fixed at the lower surface of the bottom plate and provided with a welding groove structure.
2. The composite phase change heat dissipating device of claim 1, wherein the welded groove structure is a matrix of square cylindrical grooves.
3. The composite phase-change heat dissipating device of claim 2, wherein the square column-shaped groove has a groove depth of 0.1mm to 1mm and a groove width of 1mm to 10 mm.
4. The composite phase change heat dissipation device according to claim 1, wherein the bottom plate is a metal temperature equalizing plate (3); the bottom surface of the metal temperature equalizing plate is provided with a welding groove structure corresponding to the position of the light source assembly, and the top surface is provided with a micro-groove group structure corresponding to the position of the phase change heat transfer cavity.
5. The composite phase-change heat dissipation device as defined in claim 1, wherein the bottom plate is a flat heat pipe structure (4).
6. The composite phase-change heat dissipating device of claim 5, wherein the flat heat pipe structure (4) comprises a heat pipe lower cover (41), a flat heat pipe (42), and a heat pipe upper cover (43); the lower half part of the flat heat pipe is embedded into a lower pipe embedding groove (411) on the top surface of the lower cover of the heat pipe, the upper half part of the flat heat pipe is embedded into an upper pipe embedding groove (431) on the bottom surface of the upper cover of the heat pipe, and the lower cover of the heat pipe is fixedly connected with the upper cover of the heat pipe; the lower surface of the heat pipe lower cover is provided with a welding groove structure, and the part of the top surface of the heat pipe upper cover corresponding to the phase change heat transfer cavity is provided with a micro groove group structure.
7. The composite phase-change heat dissipating device of claim 5, wherein the flat heat pipe structure (4) comprises a heat pipe lower cover (41), a flat heat pipe (42), and a heat pipe upper cover (43); the flat heat pipe is integrally embedded into a lower pipe embedding groove (411) on the top surface of the lower cover of the heat pipe or an upper pipe embedding groove (431) on the bottom surface of the upper cover of the heat pipe; the heat pipe lower cover and the heat pipe upper cover are fixed together; the lower surface of the heat pipe lower cover is provided with a welding groove structure, and the part of the top surface of the heat pipe upper cover corresponding to the phase change heat transfer cavity is provided with a micro groove group structure.
8. The composite phase-change heat dissipation device according to claim 6 or 7, wherein the liquid phase-change working medium is poured into the flat heat pipe, and the pouring amount of the liquid phase-change working medium is 5% -75% of the volume of the flat heat pipe.
9. The composite phase-change heat dissipating device of claim 6 or 7, wherein the flat heat pipe is a copper pipe or aluminum pipe bent into a closed loop end to end.
10. The composite phase change heat dissipating device of claim 1, wherein the heat dissipating body is made of magnesium aluminum alloy or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310518721.0A CN116734222A (en) | 2023-05-10 | 2023-05-10 | Composite phase-change heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310518721.0A CN116734222A (en) | 2023-05-10 | 2023-05-10 | Composite phase-change heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116734222A true CN116734222A (en) | 2023-09-12 |
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ID=87917646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310518721.0A Pending CN116734222A (en) | 2023-05-10 | 2023-05-10 | Composite phase-change heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116734222A (en) |
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2023
- 2023-05-10 CN CN202310518721.0A patent/CN116734222A/en active Pending
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