CN116732582A - Copper methylsulfonate plating solution in PCB production process and preparation method thereof - Google Patents
Copper methylsulfonate plating solution in PCB production process and preparation method thereof Download PDFInfo
- Publication number
- CN116732582A CN116732582A CN202310712314.3A CN202310712314A CN116732582A CN 116732582 A CN116732582 A CN 116732582A CN 202310712314 A CN202310712314 A CN 202310712314A CN 116732582 A CN116732582 A CN 116732582A
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- Prior art keywords
- copper
- plating solution
- production process
- methylsulfonate
- methylsulfonic acid
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- 238000007747 plating Methods 0.000 title claims abstract description 87
- BSXVKCJAIJZTAV-UHFFFAOYSA-L copper;methanesulfonate Chemical compound [Cu+2].CS([O-])(=O)=O.CS([O-])(=O)=O BSXVKCJAIJZTAV-UHFFFAOYSA-L 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000243 solution Substances 0.000 claims abstract description 62
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 50
- 239000010949 copper Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000005282 brightening Methods 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000011259 mixed solution Substances 0.000 claims abstract description 24
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims abstract description 23
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 16
- 239000003112 inhibitor Substances 0.000 claims abstract description 15
- 239000002270 dispersing agent Substances 0.000 claims abstract description 14
- SDFNZYMSEOUVIF-UHFFFAOYSA-N copper;methanesulfonic acid Chemical compound [Cu].CS(O)(=O)=O SDFNZYMSEOUVIF-UHFFFAOYSA-N 0.000 claims description 16
- -1 polyoxyethylene Polymers 0.000 claims description 11
- FXCSCTVYEKPPDO-UHFFFAOYSA-N (2-ethenylphenyl)-phenylmethanone Chemical group C=CC1=CC=CC=C1C(=O)C1=CC=CC=C1 FXCSCTVYEKPPDO-UHFFFAOYSA-N 0.000 claims description 5
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical group O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 claims description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- 229920002873 Polyethylenimine Polymers 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 5
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 5
- 150000002191 fatty alcohols Chemical class 0.000 claims description 3
- 125000000373 fatty alcohol group Chemical group 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 4
- 230000002378 acidificating effect Effects 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 abstract description 2
- 238000007086 side reaction Methods 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 230000009044 synergistic interaction Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000006259 organic additive Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to a copper methylsulfonate plating solution in a PCB production process and a preparation method thereof. The methylsulfonic acid can provide acidic conditions for the copper plating solution, and the mixed solution obtained by uniformly mixing the methylsulfonic acid and the copper methylsulfonate can effectively inhibit side reactions to obtain Cu with good stability 2+ The chemical stability of the copper plating solution is further improved; the mixed solution II obtained by uniformly mixing the dispersing agent, the inhibitor, the main brightening agent, the auxiliary brightening agent, the leveling agent and the chloride ions can play a good synergistic effect, and interaction exists between the dispersing agent, the inhibitor, the main brightening agent, the auxiliary brightening agent, the leveling agent and the chloride ions, so that the dispersing capability of the electroplating solution can be improved, and the performance of the formed copper plating layer is improved. The invention mixes the mixed solution I and the mixed solution II to finally obtain the copper methylsulfonate plating solution in the PCB production process, which has the advantages of good chemical stability, good deep plating performance and high leveling property, and the plating layer strengthHigh toughness, good binding force with matrix metal, easy polishing and welding, etc.
Description
Technical Field
The invention relates to the technical field of copper plating solutions, in particular to a methylsulfonic acid copper plating solution in a PCB production process and a preparation method thereof.
Background
Electrolytic copper plating has a variety of applications in the industry. For example, it is also used as a decorative coating film and an anticorrosive film. In addition, it is also used in the electronics industry to manufacture printed wiring boards and semiconductors. In the manufacturing process of the wiring board, copper plating can be used for the wiring layer formed on the surface of the wiring board and for the conductive layer passing through the wall surface of the through hole between the surfaces of the printed wiring board.
The addition of organic additives in the electrolytic copper plating solution is particularly critical in order to obtain a glossy and smooth copper-clad layer. The organic additives in the electrolytic copper plating solution comprise brightening agent (accelerator), leveling agent (leveling agent) and inhibitor (carrier), wherein the brightening agent is a main acting component of the gloss of the copper plating layer.
The brightening agents in the traditional acidic copper plating organic additive mainly comprise sodium polydithiopropane sulfonate, sodium 3-mercaptopropane sulfonate, sodium N, N-dimethyl thiopropane sulfonate, sodium thiazoline dithiopropane sulfonate and the like, and although the brightening agents are high in universality and good in glossiness, the brightening agents cannot completely cover industry requirements, for example, an anode film layer of a soluble anode copper ball in an existing electroplating system is too thick, the anode film layer easily drops to block an anode bag, the anode copper ball must be cleaned regularly, so that the loss of the anode copper ball is large, part of anode sludge is dissolved into bath liquid to pollute the bath liquid, the replacement frequency of the copper plating bath liquid is accelerated, the discharge of waste bath liquid is easy to cause environmental pollution, and the environment-friendly pressure is increased. And the traditional electroplating brightening agent is used for continuous electroplating under high current density (35-50 ASF), so that the anode copper ball film layer is seriously peeled off, cuprous ions in the bath solution are lifted, copper wire plating points are formed on the surface of the copper layer of the electroplated plate, and the quality of copper plating is affected.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and develop a copper plating solution with better stability in the PCB production process and a preparation method thereof.
The aim of the invention is realized by the following technical scheme:
the methylsulfonic acid copper plating solution in the PCB production process comprises the following components:
copper methylsulfonate, methylsulfonic acid, dispersant, inhibitor, main brightening agent, auxiliary brightening agent, leveling agent and chloride ion, and the copper plating liquid has excellent brightening effect, and the obtained plated layer has fine crystal, brightening, less peeling and excellent weldability.
As a further scheme of the invention: the source of copper ions is copper methylsulfonate.
As a further scheme of the invention: the copper ions contain Cu 2+ The concentration is 2-15 g/L.
As a further scheme of the invention: the concentration of the methanesulfonic acid is 40-60 g/L.
As a further scheme of the invention: the dispersing agent is polyoxyethylene alkyl alcohol amide, and the concentration is 0.6-1.5 g/L.
As a further scheme of the invention: the inhibitor is fatty alcohol polyoxyethylene ether, and the concentration is 1-1.4 g/L.
As a further scheme of the invention: the main brightening agent is vinyl benzophenone with the concentration of 0.3-1.2 g/L.
As a further scheme of the invention: the auxiliary brightening agent is glutaraldehyde, and the concentration is 0.2-0.5 g/L.
As a further scheme of the invention: the leveling agent is polyethyleneimine alkyl salt with the concentration of 0.2-0.5 g/L.
As a further scheme of the invention: the concentration of the chloride ions is 0.1-0.8 g/L.
Copper methylsulfonate and methylsulfonic acid are mixed according to the mass ratio of (3-11): (45-60) uniformly mixing to obtain a first mixed solution;
dispersing agent, inhibitor, main brightening agent, auxiliary brightening agent, leveling agent and chloride ion according to the mass ratio of (0.6-1.3): (1-1.4): (0.3-1): (0.2-0.5): (0.2-0.5): (0.3-0.8) uniformly mixing to obtain a mixed solution II;
and mixing the first mixed solution with the second mixed solution to obtain the copper plating solution.
The invention has the beneficial effects that: the invention discloses a methylsulfonic acid copper plating solution in a PCB production process and a preparation method thereof, which can be applied to PCB copper plating. The methylsulfonic acid can provide acidic conditions for the copper plating solution, and the mixed solution obtained by uniformly mixing the methylsulfonic acid and the copper methylsulfonate can effectively inhibit side reactions to obtain Cu with good stability 2+ The chemical stability of the copper plating solution is further improved; the mixed solution II obtained by uniformly mixing the dispersing agent, the inhibitor, the main brightening agent, the auxiliary brightening agent, the leveling agent and the chloride ions can play a good synergistic effect, and interaction exists between the dispersing agent, the inhibitor, the main brightening agent, the auxiliary brightening agent, the leveling agent and the chloride ions, so that the dispersing capability of the electroplating solution can be improved, and the performance of the formed copper plating layer is improved. The invention mixes the liquidThe methylsulfonic acid copper plating solution obtained by mixing the first mixed solution and the second mixed solution in the PCB production process has the advantages of good chemical stability, good deep plating performance, high leveling property, high plating strength, good toughness, good binding force with matrix metal, easiness in polishing and welding and the like.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for preparing a copper methylsulfonate plating solution in a PCB production process according to an embodiment of the present disclosure.
Fig. 2 is a flowchart of a copper plating method for printing a PCB board in a PCB production process according to an embodiment of the present disclosure.
Fig. 3 to 5 are SEM photographs of the PCB boards of example 1, example 2 and comparative example 1 disclosed in the present invention.
Detailed Description
The invention is further illustrated by the following examples. The content of the invention is not limited thereto.
Example 1
The embodiment provides a copper plating solution in a PCB production process, wherein the copper plating solution comprises the following components in percentage by weight: copper methylsulfonate 8.5%, methylsulfonic acid 85.5%, polyoxyethylene alkyl alcohol amide 1.2%, fatty alcohol polyoxyethylene ether 2.1%, vinyl benzophenone 0.84%, glutaraldehyde 0.51%, polyethyleneimine alkyl salt 0.51%, and chloride ion 0.84%.
Uniformly mixing the copper methylsulfonate and methylsulfonic acid to obtain a mixed solution I; uniformly mixing the dispersing agent, the inhibitor, the main brightening agent, the auxiliary brightening agent, the leveling agent and chloride ions to obtain a mixed solution II; and mixing the mixed solution I and the mixed solution II to obtain the methylsulfonic acid copper plating solution in the PCB production process.
In order to test the stability of the methylsulfonic acid copper plating solution, air is continuously blown into the methylsulfonic acid copper plating solution for 40 hours, and the methylsulfonic acid copper plating solution is always clear and transparent without turbidity, which indicates that the methylsulfonic acid copper plating solution has good stability.
The copper plating solution is used as electroplating solution, the electroplating grade phosphor copper balls are used as anodes, the pretreated PCB is used as cathodes, and the current density is 4.5A/dm at the temperature of 40 DEG C 2 The plating is carried out for 6min under the condition of uniformity, fineness and high density, and the average thickness of the copper plating layer is 6 mu m, thereby meeting the thickness requirement of a pattern plating protection circuit. And continuously carrying out copper plating on a plurality of batches under the same conditions to obtain a batch of copper-plated PCB. After copper plating, the copper plating solution was analyzed for Cu 2+ And the like, the concentration of which was found to remain substantially unchanged, while the phosphor copper spheres of the anode were reduced in weight by 400g.
Example 2
The embodiment provides a copper methylsulfonate plating solution in a PCB production process, wherein the copper methylsulfonate plating solution comprises the following components in percentage by weight: 15.4% of copper methylsulfonate, 76.9% of methylsulfonic acid, 2.0% of polyoxyethylene alkyl alcohol amide, 1.8% of fatty alcohol polyoxyethylene ether, 1.2% of vinyl benzophenone, 0.8% of glutaraldehyde, 0.8% of polyethyleneimine alkyl salt and 1.1% of chloride ions.
The preparation process and the application method of this example are the same as those of example 1.
In order to test the stability of the methylsulfonic acid copper plating solution, air is continuously blown into the methylsulfonic acid copper plating solution for 40 hours, and the methylsulfonic acid copper plating solution is always clear and transparent without turbidity, which indicates that the methylsulfonic acid copper plating solution has good stability.
Taking the copper plating solution as an electroplating solution, taking electroplating-grade phosphor-copper balls as an anode, taking a pretreated PCB as a cathode, and carrying out current density of 5A/dm at the temperature of 45 DEG C 2 The plating is carried out for 6min under the condition of uniformity, fineness and high density, and the average thickness of the copper plating layer is 8 mu m, thereby meeting the thickness requirement of a pattern plating protection circuit. Under the same conditions as above, the reaction is carried out continuouslyAnd carrying out copper plating in batches to obtain a batch of copper-plated PCB. After copper plating, the copper plating solution was analyzed for Cu 2+ And the like, the concentration of which was found to remain substantially unchanged, while the phosphor copper spheres of the anode were reduced in weight by 480g.
Comparative example 1
The formulation of this comparative example was the same as in example 1, except that: and uniformly mixing copper methylsulfonate, methylsulfonic acid, a dispersing agent, an inhibitor, a main brightening agent, an auxiliary brightening agent, a leveling agent and chloride ions together to obtain the methylsulfonic acid copper plating solution in the PCB production process.
To test the stability of the copper methylsulfonate plating solution, air was continuously blown into the copper methylsulfonate plating solution, and after 30 hours of blowing air, the copper methylsulfonate plating solution began to become cloudy, and it was found that the copper methylsulfonate plating solution was poor in stability. The plating is performed under the same condition, the obtained copper plating is relatively uneven, loose and porous, and the plating layer is dark, so that the requirements of the pattern electroplating protection circuit cannot be met.
SEM photographs of the PCB boards after copper plating of example 1, example 2 and comparative example 1 are shown in fig. 3 to 5.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art
It should be understood that the invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are merely illustrative of the principles of the invention, and various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Table 1 is a comparative table of PCB performance of example 1, example 2 and comparative example 1 disclosed in the present invention.
Table 1 PCB performance comparative table of example 1, example 2 and comparative example 1 disclosed in the present invention
Claims (10)
1. The copper methylsulfonate plating solution is characterized by comprising copper methylsulfonate, methylsulfonic acid, a dispersing agent, an inhibitor, a main brightening agent, an auxiliary brightening agent, a leveling agent and chloride ions in the PCB production process. The invention discloses a methylsulfonic acid copper plating solution, which is characterized in that: copper methylsulfonate, methylsulfonic acid, dispersant, inhibitor, main brightening agent, auxiliary brightening agent, leveling agent and chloride ion in the mass ratio of (2-15): (40-60): (0.6-1.5): (1-1.4): (0.3-1.2): (0.2-0.5): (0.2-0.5): (0.1-0.8). The preparation method of the methylsulfonic acid copper plating solution in the PCB production process comprises the following steps: copper methylsulfonate and methylsulfonic acid are mixed according to the mass ratio of (2-15): (40-60) uniformly mixing to obtain a first mixed solution; dispersing agent, inhibitor, main brightening agent, auxiliary brightening agent, leveling agent and chloride ion according to the mass ratio of (0.6-1.5): (1-1.4): (0.3-1.2): (0.2-0.5): (0.2-0.5): (0.1-0.8) uniformly mixing to obtain a mixed solution II; and mixing the mixed solution I with the mixed solution II to prepare the copper methylsulfonate plating solution in the PCB production process, thereby obtaining the copper methylsulfonate plating solution in the PCB production process and a preparation method thereof.
2. A copper methylsulfonate plating solution in PCB production process and a preparation method thereof are characterized in that Cu in the copper methylsulfonate plating solution 2+ The concentration of the ions is 2-15 g/L.
3. A copper-plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the concentration of methylsulfonic acid is 40-60 g/L.
4. A copper-plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the dispersant is polyoxyethylene alkyl alcohol amide, and the concentration of the polyoxyethylene alkyl alcohol amide is 0.6-1.5 g/L.
5. A copper-plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the inhibitor is fatty alcohol polyoxyethylene ether, and the concentration of the fatty alcohol polyoxyethylene ether is 1-1.4 g/L.
6. A copper-plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the main brightening agent is vinyl benzophenone, and the concentration of the vinyl benzophenone is 0.3-1.2 g/L.
7. A copper plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the auxiliary brightening agent is glutaraldehyde, and the concentration of glutaraldehyde is 0.2-0.5 g/L.
8. The copper methylsulfonate plating solution in the production process of the PCB according to claim 1, wherein the leveling agent is polyethyleneimine alkyl salt, and the concentration of the polyethyleneimine alkyl salt is 0.2-0.5 g/L.
9. A copper-plating solution of methylsulfonic acid in the production process of PCB and a preparation method thereof, wherein the concentration of chloride ions is 0.1-0.8 g/L.
10. The preparation method of the copper methylsulfonate plating solution in the PCB production process comprises the following steps: copper methylsulfonate and methylsulfonic acid are mixed according to the mass ratio of (3-11): (45-60) uniformly mixing to obtain a first mixed solution; dispersing agent, inhibitor, main brightening agent, auxiliary brightening agent, leveling agent and chloride ion according to the mass ratio of (0.6-1.3): (1-1.4): (0.3-1): (0.2-0.5): (0.2-0.5): (0.3-0.8) uniformly mixing to obtain a mixed solution II; and mixing the mixed solution I with the mixed solution II to prepare the copper methylsulfonate plating solution in the PCB production process, thereby obtaining the copper methylsulfonate plating solution in the PCB production process and a preparation method thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310712314.3A CN116732582A (en) | 2023-06-15 | 2023-06-15 | Copper methylsulfonate plating solution in PCB production process and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310712314.3A CN116732582A (en) | 2023-06-15 | 2023-06-15 | Copper methylsulfonate plating solution in PCB production process and preparation method thereof |
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| Publication Number | Publication Date |
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| CN116732582A true CN116732582A (en) | 2023-09-12 |
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| CN202310712314.3A Pending CN116732582A (en) | 2023-06-15 | 2023-06-15 | Copper methylsulfonate plating solution in PCB production process and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460181A (en) * | 2023-11-01 | 2024-01-26 | 惠州市三强线路有限公司 | PCB manufacturing process with high copper plating uniformity |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460181A (en) * | 2023-11-01 | 2024-01-26 | 惠州市三强线路有限公司 | PCB manufacturing process with high copper plating uniformity |
| CN117460181B (en) * | 2023-11-01 | 2024-04-05 | 惠州市三强线路有限公司 | PCB manufacturing process with high copper plating uniformity |
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