CN116716067A - Composition for packaging flexible OLED device, packaging structure and display device - Google Patents
Composition for packaging flexible OLED device, packaging structure and display device Download PDFInfo
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- CN116716067A CN116716067A CN202310634827.7A CN202310634827A CN116716067A CN 116716067 A CN116716067 A CN 116716067A CN 202310634827 A CN202310634827 A CN 202310634827A CN 116716067 A CN116716067 A CN 116716067A
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- acrylate
- oled device
- monomer
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- 239000000203 mixture Substances 0.000 title claims abstract description 64
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000178 monomer Substances 0.000 claims abstract description 82
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 73
- -1 acrylic ester Chemical class 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims description 53
- 239000012044 organic layer Substances 0.000 claims description 29
- YCPMSWJCWKUXRH-UHFFFAOYSA-N 2-[4-[9-[4-(2-prop-2-enoyloxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1(C=2C=CC(OCCOC(=O)C=C)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YCPMSWJCWKUXRH-UHFFFAOYSA-N 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- 125000002723 alicyclic group Chemical group 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- BXSPZNVFEYWSLZ-UHFFFAOYSA-N (3-phenoxyphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 BXSPZNVFEYWSLZ-UHFFFAOYSA-N 0.000 claims description 4
- AXCHZLOJGKSWLV-UHFFFAOYSA-N (4-phenylphenyl)methanol Chemical compound C1=CC(CO)=CC=C1C1=CC=CC=C1 AXCHZLOJGKSWLV-UHFFFAOYSA-N 0.000 claims description 3
- UIZMHFXAOQVQRM-UHFFFAOYSA-N 2-(2-phenyl-4-propan-2-ylphenoxy)ethyl prop-2-enoate Chemical compound CC(C)C1=CC=C(OCCOC(=O)C=C)C(C=2C=CC=CC=2)=C1 UIZMHFXAOQVQRM-UHFFFAOYSA-N 0.000 claims description 3
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 claims description 3
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 claims description 2
- FJKOQFIGFHTRRW-UHFFFAOYSA-N (2-methoxy-3-methylphenyl)-(3-methylphenyl)methanone Chemical compound COC1=C(C)C=CC=C1C(=O)C1=CC=CC(C)=C1 FJKOQFIGFHTRRW-UHFFFAOYSA-N 0.000 claims description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- YYTNQIHMFFPVME-UHFFFAOYSA-N 2-methylprop-2-enoic acid;oxetane Chemical compound C1COC1.CC(=C)C(O)=O YYTNQIHMFFPVME-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 claims description 2
- RAWPGIYPSZIIIU-UHFFFAOYSA-N [benzoyl(phenyl)phosphoryl]-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 RAWPGIYPSZIIIU-UHFFFAOYSA-N 0.000 claims description 2
- 125000005011 alkyl ether group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 2
- XVKKIGYVKWTOKG-UHFFFAOYSA-N diphenylphosphoryl(phenyl)methanone Chemical compound C=1C=CC=CC=1P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 XVKKIGYVKWTOKG-UHFFFAOYSA-N 0.000 claims description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 claims description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 2
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 claims 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- 239000012957 2-hydroxy-2-methyl-1-phenylpropanone Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 25
- 239000010408 film Substances 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000001723 curing Methods 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000007641 inkjet printing Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- WBELHNUIWMNAFH-UHFFFAOYSA-N 12-prop-2-enoyloxydodecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCCCOC(=O)C=C WBELHNUIWMNAFH-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- XFQDAAPROSJLSX-UHFFFAOYSA-N 2-[4-(9h-fluoren-1-yl)phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1=CC=CC2=C1CC1=CC=CC=C21 XFQDAAPROSJLSX-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F267/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated polycarboxylic acids or derivatives thereof as defined in group C08F22/00
- C08F267/06—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated polycarboxylic acids or derivatives thereof as defined in group C08F22/00 on to polymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses a composition, a packaging structure and a display device for packaging a flexible OLED device, wherein the composition comprises a photo-curable monomer and a photoinitiator, the photo-curable monomer comprises an acrylate prepolymer, an acrylate monomer A and an acrylate monomer B, and the refractive index of the acrylate monomer A is larger than that of the acrylate monomer B; the weight percentage of the acrylic ester prepolymer in the photo-curable monomer is 10-40 wt%, the weight percentage of the acrylic ester monomer A is 20-70 wt%, and the weight percentage of the acrylic ester monomer B is 10-50 wt%, wherein the acrylic ester monomer A contains 9, 9-bis [4- (2-acryloyloxy ethoxy) phenyl ]. The film layer of the composition after ultraviolet light curing has good performances and can be well used for the packaging structure of the flexible display device.
Description
Technical Field
The invention belongs to the technical field of flexible display packaging, and relates to a composition for packaging a flexible OLED device, a packaging structure and a display device.
Background
An organic light emitting diode (Organic Light Emitting Diode, abbreviated as OLED) display has been widely used in various electronic devices including electronic products such as mobile phones, flat panels, intelligent wear, and large screen display, as it has advantages of simple structure, self-luminescence, fast response speed, light and thin profile, low power consumption, high contrast, high color gamut, and flexible display. However, the OLED device in the OLED display is particularly sensitive to moisture and oxygen, and is very easy to react with moisture, oxygen and other components in the air, so that the OLED device is invalid, and therefore, the OLED device needs to be packaged to prolong the service life of the OLED device.
The main mode of flexible OLED package is three-layer structure (PECVD-Flatiness-PECVD), which is respectively a first inorganic layer (SiN X ) A second organic layer, a third inorganic layer (SiN X ) The method comprises the steps of carrying out a first treatment on the surface of the The organic layer is generally formed by coating the photo-curable composition on the inorganic layer by means of ink-jet printing, and then irradiating the photo-curable composition by an ultraviolet light source to polymerize monomers in the photo-curable composition to form a film; the inorganic layer is prepared by sputtering, vapor deposition, or the like to generate plasma. At present, the light extraction efficiency of the OLED is low, and in order to improve the light extraction efficiency of the flexible display, the following two approaches are generally adopted:
firstly, a low refractive index layer and a high refractive index layer are arranged above a film packaging layer, and light is modulated by the difference of refractive indexes of the low refractive index layer and the high refractive index layer, so that the light-emitting efficiency is increased, for example, a patent application CN109216581A, but a large amount of light loss at the film packaging layer is ignored, so that the light-emitting efficiency of the patent can only reach about 40% -50% although the light-emitting efficiency is increased to a certain extent;
and secondly, the refractive index of the organic layer is improved, the refractive index of the organic layer is lower than that of the inorganic layer, and when the refractive index of the organic layer is too low, the light-emitting efficiency of the flexible display is lower, so that the refractive index of the organic layer is improved, the organic layer has a refractive index similar to that of the inorganic film, and the light-emitting efficiency of the flexible display can be effectively improved. Patent application CN110894361a provides a photo-curable encapsulating composition, an encapsulating structure and a semiconductor device, and the photo-curable encapsulating composition is an organic layer of a thin film encapsulating layer, and its components include a photo-curable silicon-containing monomer, a photo-curable epoxy-containing diluent and a photoinitiator, which exhibit high curing rate and excellent plasma etching resistance, but the prepared photo-curable encapsulating composition has a refractive index of 1.47-1.50, which has little effect on the light-emitting efficiency of the OLED device, and a great amount of light still has a waveguide effect on an inorganic layer due to total reflection in the thin film encapsulating layer, thereby causing light loss.
In view of the above, the present inventors have provided a composition for encapsulating a flexible OLED device, an encapsulation structure and a display device, so as to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a composition for packaging a flexible OLED device, a packaging structure and a display device, wherein after an organic layer in the packaging structure adopts the composition, the prepared organic layer shows good light curing rate, tg, outgas release amount and flexibility, and has excellent packaging effect on the OLED device, and meanwhile, the refractive index is higher, so that the light emitting efficiency of the OLED is obviously improved.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
in a first aspect, the present invention provides a composition for encapsulating a flexible OLED device, the composition comprising a photocurable monomer and a photoinitiator, the photocurable monomer comprising an acrylate prepolymer, an acrylate monomer a, and an acrylate monomer B, and the acrylate monomer a having a refractive index greater than that of the acrylate monomer B;
wherein, the weight percentage of the acrylic ester prepolymer in the photo-curable monomer is 10 to 40 weight percent, the weight percentage of the acrylic ester monomer A is 20 to 70 weight percent, and the weight percentage of the acrylic ester monomer B is 10 to 50 weight percent.
Further, the structure of the acrylate prepolymer is shown in the following formula (1):
in the formula (1), R 1 ，R 2 Each independently is a C6 to C30 alkyl or alkyl ether group; r is R 3 ，R 4 ，R 5 ，R 6 Is hydrogen or methyl; n is a positive integer;
and the weight average molecular weight of the acrylate prepolymer is 1000-2000.
Further, the refractive index n (nD/25 ℃) of the acrylate monomer A is more than or equal to 1.55,
the refractive index n (nD/25 ℃) of the acrylate monomer B is less than or equal to 1.51.
Further, the acrylate monomer a is at least one of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene (n=1.606), 2- ([ 1,1' -biphenyl ] -2-oxy) ethyl 2-acrylate (n=1.575), 3-phenoxybenzyl acrylate (n=1.565), 4-biphenylmethanolate (n=1.563), 2- (p-isopropylphenylphenoxy) -ethyl acrylate (n=1.552), ethoxylated bisphenol a diacrylate (n=1.550); preferably, the acrylate monomer a comprises 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene.
Further preferred, the acrylate monomer a is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene with at least one of 2- ([ 1,1' -biphenyl ] -2-oxy) ethyl 2-acrylate (n=1.575), 3-phenoxybenzyl acrylate (n=1.565), 4-biphenylmethanolate (n=1.563), 2- (p-isopropylphenylphenoxy) -ethyl acrylate (n=1.552) or ethoxylated bisphenol a diacrylate (n=1.550). Preferably, the weight ratio of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene to other substances in the acrylate monomer A mixture is (7-15): 1.
The invention can effectively increase the refractive index of the composition for packaging flexible display by adding 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene, and simultaneously effectively increase the glass transition temperature (Tg) of the cured organic layer, the chemical resistance, the heat resistance and the stability of the composition can be improved, but the rigidity of the prepared film is poor due to the higher rigidity of the 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene, so that the invention can effectively improve the flexibility of the cured film layer to lead the tensile strength to be more than 29MPa and the elongation at break to be 9-11 percent by adding the acrylate prepolymer with the weight average molecular weight of 1000-2000 into the composition for packaging flexible display through research, the reason is that the acrylate prepolymer provides a flexible long chain, can be freely twisted to a certain degree when being acted by external force, has the function of stress dispersion, thus has a certain improvement effect on flexibility, and the inventor finds that the molecular weight of the acrylate prepolymer is necessarily controlled to a certain extent, when the weight average molecular weight of the acrylate prepolymer is 1000-2000, the effect is optimal, the defects of small tensile strength, low flexibility and the like caused by adding 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene can be effectively improved, when the molecular weight is too small, the flexibility of a cured film layer is poor, namely the elongation at break is low, and when the molecular weight is too large, the crosslinking density is reduced, the relative content of hard segments is less, and thus the tensile strength of a film is reduced.
Further, the acrylate monomer B is at least one of a (meth) acrylate monomer containing an alicyclic group or a (meth) acrylate monomer containing a hetero alicyclic group.
Further, the (methyl) acrylate monomer containing alicyclic group is at least one of 4-tertiary butyl cyclohexyl acrylate, dicyclopentadienyl (methyl) acrylate, dicyclopentadienyl ethoxylated (methyl) acrylate, 3, 5-trimethyl cyclohexyl acrylate, isobornyl acrylate, cyclohexyl methacrylate or tricyclodecane dimethanol di (methyl) acrylate;
the (methyl) acrylate monomer containing the heteroalicyclic group is at least one of cyclotrimethylolpropane methylacrylate, tetrahydrofurfuryl acrylate, oxetane methacrylate, tetrahydrofurfuryl methacrylate or glycidyl methacrylate.
Further, the photoinitiator is one or more of 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide (TPO), 2-hydroxy-2-methyl-1-phenylpropion (1173), 2,4, 6-trimethylbenzoyl diphenyl phosphonite, benzoyl diphenyl phosphine oxide, dibenzoyl phenyl phosphine oxide, hydroxybenzophenone, acrylated benzophenone, 4' -bis (dimethylamino) benzophenone, 4' -dichlorobenzophenone, and 3,3' -dimethyl-2-methoxybenzophenone.
From the above, in combination with practical verification, the composition for encapsulating a flexible OLED device according to the present invention has the following advantages:
the composition for encapsulating a flexible OLED device of the present invention is solvent-free, insoluble; in addition, the composition can be particle-free without particles, even without high-refractive-index nano particles, the composition can form an organic film with a refractive index of more than 1.59 after curing, and the light-emitting efficiency of the flexible display can be effectively improved.
The composition for encapsulating a flexible OLED device of the present invention may have a moderate viscosity of 18 to 23cps at 25 deg.C, a surface tension of 32 to 36mN/m, so that it can form an organic film using an inkjet printing method, and at the same time, can form an organic film with a sufficiently uniform thickness. This is because the organic layer is likely to diffuse when the viscosity is too low, and the coating method of inkjet printing cannot be utilized when the viscosity is too high.
The composition for encapsulating a flexible OLED device of the present invention is a photocurable composition and uses UV wavelength at 10mJ/cm 2 ～100mJ/cm 2 The organic film can be formed by curing by irradiation for 1 to 1200 seconds and by vapor deposition, ink-jet printing, gravure coating, slit coating, spin coating, or the like, and among these, ink-jet printing is preferableThe organic film is formed by printing.
In a second aspect, the invention provides a packaging structure of a flexible OLED device, including a substrate for supporting the flexible OLED device, a flexible OLED device sequentially disposed on the substrate, and a thin film packaging layer covering the flexible OLED device, where the thin film packaging layer is composed of a plurality of alternately stacked inorganic layers and organic layers, and the organic layers are formed from the above composition;
the flexible OLED device comprises a first electrode, a luminescent material layer and a second electrode, wherein the first electrode is adjacent to the substrate, and the luminescent material layer is positioned between the first electrode and the second electrode;
the pixel defining layer is disposed on the substrate base plate, and the second electrode is disposed on the first electrode and the pixel defining layer.
The invention provides a flexible display device, which adopts the packaging structure of the flexible OLED device.
Compared with the prior art, the invention has the following beneficial effects:
1. the composition for packaging the flexible OLED device is prepared by introducing acrylate prepolymer with the molecular weight of 1000-2000 as a basis and matching with pure organic systems such as a high refractive index monomer A, a common acrylate monomer B and the like, does not add high refractive index inorganic particles, reduces the risk of blocking holes in ink-jet printing, has controllable viscosity and surface tension, ensures good ink-jet printing performance, has higher refractive index, and increases the light emitting efficiency of the flexible display device (screen).
2. According to the composition for packaging the flexible OLED device, the refractive index of an organic film formed by curing the composition is more than 1.59, so that the light emergent efficiency of the device when light incident in a non-vertical direction is refracted is greatly improved, the waveguide effect of light emitted from the OLED device in an inorganic layer is reduced, the loss of reflection of the light incident in the non-vertical direction and transmitted from the side surface of the device is reduced, and the light emergent efficiency of the OLED device is improved.
3. According to the film layer of the composition for packaging the flexible OLED device after ultraviolet light curing, through practical verification, the Outgas is less than 5.5ppm, the light curing rate is more than 95%, the Tg is more than 70 ℃, the tensile strength is more than 29MPa, and the elongation at break is in the range of 9-11%, so that the composition can be well used for packaging structures of flexible display devices.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate principles of the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a cross-sectional view of the package structure of the flexible OLED device of the present invention.
Wherein: 110 is a substrate; 120 is a flexible OLED device; 121 is a first electrode; 122 is a layer of luminescent material; 123 is a second electrode; 130 is a pixel defining layer; 140 is a thin film encapsulation layer; 141 is a first inorganic layer; 142 is an organic layer; 143 is a second inorganic layer.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are not intended to represent all embodiments consistent with the invention. Rather, they are merely examples of devices that are consistent with aspects of the invention that are set forth in the following claims.
The present invention will be described in further detail with reference to examples for better understanding of the technical aspects of the present invention by those skilled in the art.
Synthesis example 1 (target product M-1)
Preparing a stirrer, thermometer and cooling clampA jacketed flask was charged with 100ml of toluene, 1, 12-dodecanediol diacrylate (10 g, 3.2X10) -2 mol) azobisisobutyronitrile (0.26 g, 1.6X10) -3 mol), heated to 50℃with stirring, and maintained at this temperature for 4 hours. Cooling to room temperature, distilling under reduced pressure (40 ℃/20 mmHg) to remove the solvent, and obtaining a viscous near colorless product which is the target product M-1, wherein the purity is 91.4%, and the weight average molecular weight is 1650.
Synthesis example 2 (target product M-2)
A flask equipped with a mechanical stirrer, a thermometer and a cooling jacket was prepared, 50ml of toluene, 1,7- (4-hetero-oxyheptanediol) diacrylate (10 g, 4.1X10-2 mol) and azobisisobutyronitrile (0.68 g, 4.1X10 g were added under a nitrogen flow - 3 mol), heated to 60℃with stirring, and maintained at this temperature for 4 hours. Cooling to room temperature, distilling under reduced pressure (40 ℃/20 mmHg) to remove the solvent, and obtaining a viscous near colorless product which is the target product M-2, wherein the purity is 93.2%, and the weight average molecular weight is 1400.
Synthetic comparative example 3 (target product M-3)
A flask equipped with a mechanical stirrer, a thermometer and a cooling jacket was prepared, and 100ml of toluene, 1, 12-dodecanediol diacrylate (10 g, 3.2X10) was added under a nitrogen flow -2 mol) azobisisobutyronitrile (0.26 g, 1.6X10) -3 mol), heated to 50℃with stirring, and maintained at this temperature for 3 hours. Cooling to room temperature, distilling under reduced pressure (40 ℃/20 mmHg) to remove the solvent, and obtaining a viscous near colorless product which is the target product M-3, wherein the purity is 90.6%, and the weight average molecular weight is 800.
Synthesis of comparative example 4 (target product M-4)
A flask equipped with a mechanical stirrer, a thermometer and a cooling jacket was prepared, and 50ml of toluene, 1, 12-dodecanediol diacrylate (10 g, 3.2X10 were added under a nitrogen flow -2 mol), benzoyl peroxide (0.78 g, 3.2X10) -3 mol), heated to 80℃with stirring, and maintained at this temperature for 5.5 hours. Cooled to room temperature, and saturated NaHCO is used 3 Washing with water, and distilling under reduced pressure (40 ℃ C./20 mmHg) to remove the solvent to obtain a viscous near colorless product, namely the target product M-4, wherein the purity is 94.1%, and the weight average molecular weight is 2400.
Example 1
As shown in fig. 1, the present example provides a package structure of a flexible OLED device, in which a thin film package layer 140 includes a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 in this order from top to bottom; wherein the organic layer 142 comprises a composition for encapsulating the flexible OLED device, the composition comprising a mixture of a photocurable monomer and a photoinitiator, the photocurable monomer being 25 parts by weight of an acrylate prepolymer, 50 parts by weight of an acrylate monomer a, and 25 parts by weight of an acrylate monomer B; the photoinitiator was 5 parts by weight.
Specifically, the acrylate prepolymer used in this example was M-1 (weight average molecular weight 1650) prepared in Synthesis example 1;
the adopted acrylic ester monomer A is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene and 3-phenoxybenzyl acrylic ester, and the weight ratio of the two is 10:1, a step of;
the adopted acrylic ester monomer B is isobornyl acrylic ester;
the photoinitiator used was TPO.
Example 2
As shown in fig. 1, the present example provides a package structure of a flexible OLED device, in which a thin film package layer 140 includes a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 in this order from top to bottom; wherein the organic layer 142 comprises a composition for encapsulating the flexible OLED device, the composition comprising a mixture of a photocurable monomer and a photoinitiator, the photocurable monomer being 40 parts by weight of an acrylate prepolymer, 20 parts by weight of an acrylate monomer a, and 40 parts by weight of an acrylate monomer B; the photoinitiator was 5 parts by weight.
Specifically, the acrylate prepolymer used in this example was M-2 (weight average molecular weight 1400) prepared in Synthesis example 2;
the adopted acrylic ester monomer A is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene and 2-acrylic acid 2- ([ 1,1' -biphenyl ] -2-oxyethyl ester, and the weight ratio of the two is 15:1, a step of;
the adopted acrylic ester monomer B is isobornyl acrylic ester;
the photoinitiator used was TPO.
Example 3
As shown in fig. 1, the present example provides a package structure of a flexible OLED device, in which a thin film package layer 140 includes a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 in this order from top to bottom; wherein the organic layer 142 comprises a composition for encapsulating the flexible OLED device, the composition comprising a mixture of a photocurable monomer and a photoinitiator, the photocurable monomer being 10 parts by weight of an acrylate prepolymer, 70 parts by weight of an acrylate monomer a, and 20 parts by weight of an acrylate monomer B; the photoinitiator was 5 parts by weight.
Specifically, the acrylate prepolymer used in this example was M-1 (weight average molecular weight 1650) prepared in Synthesis example 1;
the adopted acrylic ester monomer A is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene and 2-acrylic acid 2- ([ 1,1' -biphenyl ] -2-oxyethyl) ester, and the weight ratio of the two is 10:1, a step of;
the adopted acrylic ester monomer B is isobornyl acrylic ester;
the photoinitiator used was TPO.
Example 4
As shown in fig. 1, the present example provides a package structure of a flexible OLED device, in which a thin film package layer 140 includes a first inorganic layer 141, an organic layer 142, and a second inorganic layer 143 in this order from top to bottom; wherein the organic layer 142 comprises a composition for encapsulating the flexible OLED device, the composition comprising a mixture of a photocurable monomer and a photoinitiator, the photocurable monomer being 25 parts by weight of an acrylate prepolymer, 50 parts by weight of an acrylate monomer a, and 25 parts by weight of an acrylate monomer B; the photoinitiator was 5 parts by weight.
Specifically, the acrylate prepolymer used in this example was M-1 (weight average molecular weight 1650) prepared in Synthesis example 1;
the adopted acrylic ester monomer A is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene and 3-phenoxybenzyl acrylic ester, and the weight ratio of the two is 15:1, a step of;
the adopted acrylic ester monomer B is tetrahydrofurfuryl methacrylate;
the photoinitiator used was TPO.
Comparative example 1
The embodiment of comparative example 1 is different from example 1 only in that the acrylate prepolymer used in comparative example 1 is M-3 (weight average molecular weight 800) prepared in synthetic comparative example 3, and other components and compounding conditions are identical.
Comparative example 2
The embodiment of comparative example 2 is different from example 1 only in that the acrylate prepolymer used in comparative example 2 is M-4 (weight average molecular weight 2400) prepared in synthetic comparative example 4, and other components and compounding conditions are identical.
Comparative example 3
The embodiment of comparative example 3 is different from example 1 only in that 25 parts by weight of the acrylic prepolymer used in comparative example 3 is replaced with a long-chain carbon-containing acrylic monomer which is 1, 12-dodecanediol dimethacrylate, and other components and compounding conditions are identical.
Comparative example 4
The embodiment of comparative example 4 differs from example 1 only in that the acrylate monomer A used in comparative example 4 is 3-phenoxybenzyl acrylate, i.e., 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene is not added, and other components and compounding conditions are identical.
Comparative example 5
The embodiment of comparative example 5 is different from example 1 only in that the acrylate monomer B used in comparative example 5 is hydroxyethyl methacrylate, i.e., a (meth) acrylate monomer containing an alicyclic group or a heteroalicyclic group is not added, and other components and compounding conditions are identical.
To further verify the efficacy of the present invention, the inventors performed the following performance tests:
the acrylate prepolymers, acrylate monomer a, acrylate monomer B and photoinitiator used in examples 1 to 4 and comparative examples 1 to 5 were added to a sample bottle, mixed and stirred uniformly, and then filtered using a 0.2 μm filter, to obtain a composition for packaging a flexible OLED device.
The composition for encapsulating the flexible OLED device was then coated onto a glass substrate and at 30mW/cm 2 The cured film layer, i.e., the organic layer, was then subjected to UV curing by UV irradiation for 120 s.
Finally, the following tests were performed:
(1) Outgas (amount of impurity gas released) measurement: the organic layer of the cured film was cut into thin strips (8 mm. Times.55 mm), attached to the inner wall of a 20mL headspace bottle, and the sample weight was about 0.1g, and Outgas was measured using a gas chromatograph-mass spectrometer (Siemens Feiter 1300). Gas chromatograph-mass spectrometer uses Agilent HP-5MS UI column (length: 30m, diameter: 0.25mm, stationary phase thickness: 0.25 μm) as chromatography column and helium as mobile phase with a split ratio of 17:1, and setting a temperature raising program: maintaining at 35deg.C for 2min, heating to 200deg.C at 8deg.C/min, heating to 300deg.C at 20deg.C/min, maintaining for 10min, collecting deaerated gas under the following conditions, collecting at 110deg.C for 30min, and purging with He gas at 200 mL/min flow rate, wherein the adsorbent is 5% phenyl methyl polysiloxane, and NMP solution of acetone with concentration of 6ppm,8ppm,10ppm,12ppm, and 14ppm is used as standard vertebral solution to draw calibration curve, wherein R is defined as the standard vertebral solution 2 The value was 0.9981.
(2) Photo-curing rate: using FT-IR (clothRuck INVENTIOO) measurement of glue before curing and film at 1635cm after curing -1 (C=C) and 1720cm -1 Absorption peak intensity near (c=o).
Cure rate (%) = |1- (C) 1 /C 0 )|×100％；
Wherein C is 1 At 1635cm for cured film -1 The intensity of the nearby absorption peak and the absorption peak at 1720cm -1 A ratio of nearby absorption peak intensities; c (C) 0 At 1635cm for uncured ink -1 The intensity of the nearby absorption peak and the absorption peak at 1720cm -1 The ratio of the intensities of the absorption peaks in the vicinity.
(3) Refractive index: films having dimensions of 5mm×15mm×25 μm (width×length×thickness) were produced and then tested using an abbe refractometer.
(4) Glass transition temperature (Tg): test with Differential Scanning Calorimeter (DSC), test conditions: test atmosphere N 2 /O 2 The method comprises the steps of carrying out a first treatment on the surface of the Test temperature range: 180-550 ℃ below zero; rate of temperature rise: 10 ℃/min.
(5) Elongation at break: the tensile properties of plastics were determined according to GB/T1040.1-2006.
(6) Tensile strength: the measurement is carried out according to GB/T1040-92 general test method for Plastic mechanical Properties (stretching). Instrument: WDW-5A microcomputer controlled electronic universal tester; test conditions: the stretching speed was 1mm/min, at least 5 samples per group, and the test results were averaged.
The final performance test results are shown in table 1 below:
TABLE 1
As can be seen from the data in table 1, the cured film layer (organic layer) obtained using the composition of the present invention had the following properties: the Outgas is less than 5.5ppm, the Tg is more than 70 ℃, the photo-curing rate is more than 95%, the tensile strength is more than 29MPa, the elongation at break is between 9 and 11%, and each performance is excellent, so that the packaging structure of the flexible display device can be very good. At the same time, the following specific problems can be found:
in comparative example 1, when the molecular weight of the acrylate prepolymer is too small (less than 1000), the flexibility thereof is poor and the elongation at break is small;
in comparative example 2, when the molecular weight of the acrylate prepolymer is too large (more than 2000), the flexibility is good, but the tensile strength is low, and the curing rate and refractive index are somewhat lowered as compared with the examples;
in comparative example 3, the acrylate prepolymer was replaced with 1, 12-dodecanediol dimethacrylate of equal mass, which was smaller in elongation at break, inferior in flexibility, and also lower in refractive index.
In comparative example 4, when 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene was not added to the component, the tensile strength was poor and the refractive index, tg and the output release amount were poor;
when the (meth) acrylate monomer having no alicyclic group or heteroalicyclic group in the component of comparative example 5, the outgas value was excessively large, that is, the amount of release of the impurity gas was large, and at the same time, the curing rate, refractive index and flexibility were all unsatisfactory as compared with examples.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.
It will be understood that the invention is not limited to what has been described above and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (10)
1. A composition for encapsulating a flexible OLED device, the composition comprising a photocurable monomer and a photoinitiator, the photocurable monomer comprising an acrylate prepolymer, an acrylate monomer a, and an acrylate monomer B, and the acrylate monomer a having a refractive index greater than that of the acrylate monomer B;
wherein, the weight percentage of the acrylic ester prepolymer in the photo-curable monomer is 10 to 40 weight percent, the weight percentage of the acrylic ester monomer A is 20 to 70 weight percent, and the weight percentage of the acrylic ester monomer B is 10 to 50 weight percent.
2. A composition for encapsulating a flexible OLED device according to claim 1, wherein the acrylate prepolymer has the structure shown in formula (1):
in the formula (1), R 1 ，R 2 Each independently is a C6 to C30 alkyl or alkyl ether group; r is R 3 ，R 4 ，R 5 ，R 6 Is hydrogen or methyl; n is a positive integer;
and the weight average molecular weight of the acrylate prepolymer is 1000-2000.
3. A composition for encapsulating a flexible OLED device according to claim 1, wherein the refractive index n of acrylate monomer a is 1.55 or more and the refractive index n of acrylate monomer B is 1.51 or less.
4. A composition for encapsulating a flexible OLED device according to claim 1, wherein the acrylate monomer a is a mixture of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene and at least one of 2- ([ 1,1' -biphenyl ] -2-oxy) ethyl 2-acrylate, 3-phenoxybenzyl acrylate, 4-biphenylmethanolate, 2- (p-isopropylphenylphenoxy) -ethyl acrylate or ethoxylated bisphenol a diacrylate.
5. The composition for encapsulating a flexible OLED device according to claim 1, wherein the acrylate monomer B is at least one of a (meth) acrylate monomer containing an alicyclic group or a (meth) acrylate monomer containing a heteroalicyclic group.
6. A composition for encapsulating a flexible OLED device according to claim 5, wherein the alicyclic group-containing (meth) acrylate monomer is at least one of 4-t-butylcyclohexyl acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl ethoxylated (meth) acrylate, 3, 5-trimethylcyclohexyl acrylate, isobornyl acrylate, cyclohexyl methacrylate, or tricyclodecane dimethanol di (meth) acrylate;
the (methyl) acrylate monomer containing the heteroalicyclic group is at least one of cyclotrimethylolpropane methylacrylate, tetrahydrofurfuryl acrylate, oxetane methacrylate, tetrahydrofurfuryl methacrylate or glycidyl methacrylate.
7. A composition for encapsulating a flexible OLED device according to claim 1, wherein the photoinitiator is one or more of 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone, 2,4, 6-trimethylbenzoyl diphenyl phosphonite, benzoyl diphenyl phosphine oxide, dibenzoyl phenyl phosphine oxide, hydroxybenzophenone, acrylated benzophenone, 4' -bis (dimethylamino) benzophenone, 4' -dichlorobenzophenone, and 3,3' -dimethyl-2-methoxybenzophenone.
8. A packaging structure of a flexible OLED device, characterized by comprising a substrate (110) for supporting the flexible OLED device, a flexible OLED device (120) and a thin film packaging layer (140) covering the flexible OLED device (120) sequentially disposed on the substrate (110), wherein the thin film packaging layer (140) is composed of a plurality of alternately stacked inorganic layers and organic layers, and the organic layers are formed by curing the composition according to any one of claims 1 to 7;
the flexible OLED device (120) comprises a first electrode (121), a luminescent material layer (122) and a second electrode (123), wherein the first electrode (121) is adjacent to the substrate (110), and the luminescent material layer (122) is positioned between the first electrode (121) and the second electrode (123);
also included is a pixel defining layer (130), the pixel defining layer (130) being disposed on the substrate base (110) and the second electrode (123) being disposed on the first electrode (121) and the pixel defining layer (130).
9. The package structure of a flexible OLED device of claim 8 wherein the refractive index of the organic layer is > 1.59.
10. A flexible display apparatus comprising the encapsulation structure of the flexible OLED device of claim 9.
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