CN116716051A - Electronic equipment protective film and manufacturing method thereof - Google Patents

Electronic equipment protective film and manufacturing method thereof Download PDF

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Publication number
CN116716051A
CN116716051A CN202310978501.6A CN202310978501A CN116716051A CN 116716051 A CN116716051 A CN 116716051A CN 202310978501 A CN202310978501 A CN 202310978501A CN 116716051 A CN116716051 A CN 116716051A
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CN
China
Prior art keywords
layer
protective layer
protective
display screen
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310978501.6A
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Chinese (zh)
Inventor
李一波
杨家春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Magic Cube Digital Technology Co ltd
Original Assignee
Shenzhen Magic Cube Digital Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Magic Cube Digital Technology Co ltd filed Critical Shenzhen Magic Cube Digital Technology Co ltd
Priority to CN202310978501.6A priority Critical patent/CN116716051A/en
Publication of CN116716051A publication Critical patent/CN116716051A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides an electronic equipment protective film and a manufacturing method thereof, wherein the electronic equipment protective film comprises a protective layer and a connecting layer, the connecting layer is arranged on one side of the protective layer, the connecting layer comprises an adhesive part and a buffer space, the adhesive part is arranged around the periphery of the buffer space and is connected with the protective layer, when an electronic equipment is attached to a display screen of the electronic equipment, the protective layer is attached to the display screen through the adhesive part, the adhesive part lifts the protective layer away from the display screen, the buffer space is arranged between the display screen and the protective layer, so that the protective layer and the display screen are suspended, gas between the electronic equipment protective film and the display screen is not required to be exhausted specially, the operation of attaching the electronic equipment protective film to the display screen is simplified, and further, the operation of attaching the protective film to the display screen is simplified.

Description

Electronic equipment protective film and manufacturing method thereof
Technical Field
The application relates to the technical field of electronic equipment accessories, in particular to an electronic equipment protective film and a manufacturing method thereof.
Background
The selling price of the existing electronic devices such as mobile phones, tablet computers and intelligent watches is more and more expensive, and in order to protect the display screen of the electronic device from being scratched, a user generally attaches a protective film to the display screen of the electronic device so as to prevent the display screen from being scratched.
The current protection film can include glass layer and cover the viscose portion on one side of glass layer, viscose portion is full of one side of glass layer, the user pastes the protection film and locates on the display screen, need remove the gas discharge between protection film and the display screen clean, specifically, the first one end of protection film contacts and laminates on the display screen to the other end gradually, or the protection film is first contacted and laminates on the display screen to the edge gradually by middle part and display screen, laminate on the display screen at the protection film in-process, still need additionally extrude the bubble that produces because of stranded gas between protection film and the display screen, and then make the pad pasting operation become loaded down with trivial details and difficult.
Disclosure of Invention
In view of the above, the present application provides a protective film for electronic devices and a method for manufacturing the same.
The embodiment of the application provides an electronic equipment protective film, which comprises a protective layer and a connecting layer, wherein the connecting layer is arranged on one side of the protective layer, the connecting layer comprises an adhesive part and a buffer space, and the adhesive part is arranged around the periphery of the buffer space and is connected with the protective layer.
In an embodiment, the connection layer further includes a plurality of support portions, and the plurality of support portions are disposed in the buffer space at intervals and connected to the protection layer.
In an embodiment, the adhesive part has a closed loop structure.
In an embodiment, the height of the supporting portion relative to the protrusion of the surface of the protective layer is smaller than or equal to the height of the adhesive portion relative to the protrusion of the surface of the protective layer.
In an embodiment, the height of the supporting portion protruding from the surface of the protective layer is H1, and the height of the adhesive portion protruding from the surface of the protective layer is H2, where: h1 is more than or equal to 0.05mm and less than or equal to 0.10mm, H2 is more than or equal to 0.05mm and less than or equal to 0.20mm.
In an embodiment, the protective layer comprises a glass layer and an explosion-proof layer, the explosion-proof layer is arranged on one side of the glass layer, and the adhesive part and the supporting part are connected to one side, far away from the glass layer, of the explosion-proof layer.
In an embodiment, the connection layer further includes a support portion and a sub-connection layer, the sub-connection layer with the support portion is disposed in the buffer space, and the sub-connection layer is connected with the protection layer, and the support portion is plural, and the support portion is disposed at intervals and connected to a side of the sub-connection layer away from the protection layer.
In an embodiment, when the protective film of the electronic device is adhered to the display screen of the electronic device through the adhesive portion, a sealed cavity structure is formed between the buffer space and the display screen.
The embodiment of the application also provides a manufacturing method of the electronic equipment protective film, which is used for manufacturing the electronic equipment protective film and comprises the following steps of:
s100: the base material is manufactured to obtain an initial protective layer;
s200: printing a supporting part on one side surface of the initial protective layer to obtain the protective layer;
s300: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained.
An embodiment of the present application further provides a method for manufacturing the protective film for electronic equipment, which is used for manufacturing the protective film for electronic equipment, and includes the following steps:
s400: the base material is manufactured to obtain an initial protective layer; the method comprises the steps of obtaining an initial explosion-proof layer through manufacturing, and printing a supporting part on the surface of one side of the initial explosion-proof layer to obtain the explosion-proof layer;
s500: bonding one side of the explosion-proof layer, which is away from the supporting part, to one side of the initial protection layer to obtain a protection layer;
s600: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained.
The embodiment of the application also provides a manufacturing method of the electronic equipment protective film, which is used for manufacturing the electronic equipment protective film and comprises the following steps of:
s700: the base material is manufactured to obtain a protective layer;
s800: the sub-connection layer is manufactured, a supporting part is printed on the surface of one side of the sub-connection layer, and one side of the sub-connection layer, which is away from the supporting part, is adhered to the protective layer;
s900: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the sub-connecting layer is adhered, of the protective layer, so that the protective film for the electronic equipment is obtained.
In summary, the application provides an electronic device protection film and a manufacturing method thereof, wherein the electronic device protection film comprises a protection layer and a connection layer, the connection layer is arranged on one side of the protection layer, the connection layer comprises an adhesive part and a buffer space, the adhesive part is arranged around the periphery of the buffer space and is connected with the protection layer, when an electronic device is attached to a display screen of the electronic device, the protection layer is attached to the display screen through the adhesive part, the adhesive part lifts the protection layer away from the display screen, the buffer space is arranged between the display screen and the protection layer, so that the protection layer is suspended from the display screen, gas between the electronic device protection film and the display screen is not required to be exhausted specially, the film attaching operation of the electronic device protection film on the display screen is simplified, and further the film attaching operation is simplified.
Drawings
Fig. 1 is a schematic view of an electronic device protection film provided by the present application at an angle.
Fig. 2 is an exploded schematic view of the electronic device protection film in fig. 1.
Fig. 3 is a schematic view of the electronic device protection film of fig. 1 at another angle.
Fig. 4 is a schematic sectional view of a portion A-A of the electronic device protection film in fig. 3.
Fig. 5 is an enlarged schematic view of a portion B of the electronic device protection film in fig. 4.
Fig. 6 is a schematic view of an electronic device protection film according to another embodiment of the present application.
Fig. 7 is a schematic sectional view of a C-C portion of the electronic device protection film in fig. 6.
Fig. 8 is a schematic view of an electronic device protection film according to another embodiment of the present application.
Fig. 9 is a schematic sectional view of a D-D portion of the electronic device protection film in fig. 8.
Fig. 10 is a manufacturing method of the protective film for electronic equipment according to the present application.
Fig. 11 is another manufacturing method of the protective film for electronic equipment provided by the present application.
Fig. 12 is a further manufacturing method of the protective film for electronic equipment provided by the present application.
Detailed Description
Before the embodiments are explained in detail, it is to be understood that the application is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of the terms "comprising," "including," "having," and the like are intended to encompass the items listed thereafter and equivalents thereof as well as additional items. In particular, when "a certain element" is described, the present application is not limited to the number of the element as one, but may include a plurality of the elements.
As shown in fig. 1 and 2, the present application provides an electronic device protection film 10, including a protection layer 20 and a connection layer, where the connection layer is disposed on one side of the protection layer 20, the connection layer includes an adhesive portion 30 and a buffer space 101, the adhesive portion 30 is enclosed on the periphery of the buffer space 101 and is connected with the protection layer 20, when the electronic device protection film 10 is attached to a display screen of an electronic device, the protection layer 20 is attached to the display screen through the adhesive portion 30, the adhesive portion 30 lifts the protection layer 20 away from the display screen, the buffer space 101 is located between the display screen and the protection layer 20, so that the protection layer 20 and the display screen are suspended, and no gas between the electronic device protection film 10 and the display screen is required to be exhausted.
As shown in fig. 2 to 5, in the present embodiment, the connection layer further includes a plurality of support portions 40, the plurality of support portions 40 are disposed in the buffer space 101 at intervals and connected with the protective layer 20, when the protective film 10 for electronic equipment is attached to the display screen, the support portions 40 contact with the display screen, and the plurality of support portions 40 disposed at intervals can support a plurality of portions of the protective layer 20, so that the capability of the protective layer 20 to be suspended relative to the display screen is further improved by the support portions 40. Specifically, the plurality of supporting portions 40 are uniformly and orderly arranged at intervals and connected to one side of the protective layer 20, and in other embodiments, the plurality of supporting portions 40 may be arranged randomly and connected to one side of the protective layer 20.
In this embodiment, when the protective film 10 for electronic equipment is adhered to the display screen of the electronic equipment through the adhesive portion 30, a sealed cavity structure is formed between the buffer space 101 and the display screen, specifically, the display screen, the adhesive portion 30 and the protective layer 20 together enable the buffer space 101 to form a sealed cavity structure, wherein the protective layer 20 is spaced relative to the display screen, and when the protective film 10 for electronic equipment is impacted, the protective layer 20 extrudes the buffer space 101 to deform, so that the protective layer 20 can buffer and protect the display screen of the electronic equipment, and breakage of the display screen due to impact is avoided.
Further, when the electronic device protection film 10 is adhered to the display screen of the electronic device through the adhesive portion 30, the supporting portion 40 contacts with the display screen, and when the electronic device protection film is impacted by external force, the protective layer 20 extrudes the buffer space 101, and meanwhile the supporting portion 40 plays a role in buffering and supporting the protective layer 20, so that the capability of the electronic device protection film 10 for buffering and protecting the display screen of the electronic device is further improved.
In this embodiment, the adhesive portion 30 is in a closed loop structure, the adhesive portion 30 is disposed around the periphery of the protective layer 20, so that when the protective layer 20 is adhered to the display screen through the adhesive portion 30, the protective layer 20 and the display screen together enable the buffer space 101 to be in a sealed cavity structure, the adhesive portion 30 can isolate dust, fine debris and other garbage from entering the buffer space 101, keeping clean between the protective layer 20 and the display screen is ensured, and a user can clearly browse the content of the display screen through the protective layer 20.
As shown in fig. 4 and 5, in the present embodiment, the height of the protrusion of the supporting portion 40 relative to the surface of the protective layer 20 is smaller than or equal to the height of the protrusion of the adhesive portion 30 relative to the surface of the protective layer 20, and when the fixing of the protrusion of the supporting portion 40 relative to the surface of the protective layer 20 is equal to the height of the protrusion of the adhesive portion 30 relative to the surface of the protective layer 20, the supporting portion 40 directly contacts the display screen when the protective layer 20 is adhered to the display screen by the adhesive; when the height of the protrusion of the supporting portion 40 relative to the surface of the protective layer 20 is smaller than the height of the protrusion of the adhesive portion 30 relative to the surface of the protective layer 20, the protective layer 20 is attached to the display screen through the adhesive portion 30, and the adhesive portion 30 can be deformed, the protective layer 20 presses the adhesive portion 30, so that the supporting portion 40 contacts with the display screen.
As shown in fig. 4 and 5, in the present embodiment, the supporting portion 40 is fixed to the surface of the protective layer 20 by a protrusion H1, and the adhesive portion 30 is raised to the surface of the protective layer 20 by a protrusion H2, wherein: h1 is more than or equal to 0.05mm and less than or equal to 0.10mm, H2 is more than or equal to 0.05mm and less than or equal to 0.20mm. Specifically, when H1 is greater than 0.10mm, as the value of H1 is greater, the larger the gap between the protective layer 20 and the display screen is, the lower the sensitivity of the user for touching the display screen through the protective layer 20 is, even the situation that the display screen cannot be touched through the protective layer 20, namely, the malfunction of the touch of the display screen is caused occurs, when H1 is less than 0.1mm, the protective layer 20 is easy to collapse and directly contact with the display screen, optimally, when H1 meets 0.05mm and less than or equal to 0.10mm, the protective layer 20 can be suspended relative to the display screen, and the touch sensitivity of the display screen is high through the protective layer 20, so that the user can smoothly touch the display screen through the protective layer 20. When H2 is greater than 0.2mm, the greater the value of H2, the more the supporting portion 40 cannot contact with the display screen, and meanwhile, the distance between the protective layer 20 and the display screen is increased, so that the sensitivity of a user to touch the display screen through the protective layer 20 becomes low, and even the situation that the touch failure is caused by the fact that the protective layer 20 touches the display screen cannot occur; when H2 is less than 0.05mm, the thickness of the adhesive part 30 is too thin, and when the distance between the protective layer 20 and the display screen is 0.05mm because the minimum thickness of the supporting part 40 is 0.05mm, there is a case that the adhesive part 30 cannot be adhered to the display screen. Optimally, H1 satisfies H2 which is more than or equal to 0.05mm and less than or equal to 0.20mm, the viscose part 30 and the display screen can be ensured to be viscose, and the sensitivity of the display screen touch control through the protective layer 20 cannot be influenced by the viscose part 30.
As shown in fig. 6 and 7, in this embodiment, the protection layer 20 includes a glass layer 21 and an explosion-proof layer 22, the explosion-proof layer 22 is disposed on one side of the glass layer 21, the adhesive portion 30 and the supporting portion 40 are disposed on one side of the explosion-proof layer 22 away from the glass layer 21, the explosion-proof layer 22 is a transparent flexible structure, and when the glass layer 21 is broken by external force, broken residues generated when the glass layer 21 breaks the screen can be adhered to the explosion-proof layer 22, so as to prevent broken glass residues of the glass layer 21 from separating from the explosion-proof layer 22.
As shown in fig. 8 and 9, in another embodiment, the connection layer further includes a sub-connection layer 41 and a supporting portion 40, the sub-connection layer 41 and the supporting portion 40 are disposed in the buffer space 101, the sub-connection layer 41 is connected with the protection layer 20, the supporting portion 40 is plural, the plurality of supporting portions 40 are disposed at intervals and connected to a side of the sub-connection layer 41 away from the protection layer 20, specifically, the sub-connection layer 41 and the supporting portion 40 are in an integral structure, the sub-connection layer 41 covers a side of the protection layer 20, and when the supporting portion 40 contacts with the display screen, the supporting portion 40 can firmly support the protection layer 20 to fix the surface of the display screen.
As shown in fig. 10, the present application further provides a method for manufacturing the electronic device protection film, which is used for manufacturing the electronic device protection film, and includes the following steps:
s100: the base material is manufactured to obtain an initial protective layer; specifically, the substrate may be a glass material or a structure made of a transparent material other than glass, and the substrate includes a structure made of at least one material of PET, PC, TPU, PMMA and CPI.
S200: printing a supporting part on one side surface of the initial protective layer to obtain the protective layer; specifically, the support portion is printed on one side surface of the initial protective layer by a special printing manner of screen printing or pad printing.
S300: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained. In other embodiments, the support portion may be printed on the periphery or other portions of the protective layer in addition to the initial protective layer.
As shown in fig. 11, the present application further provides a method for manufacturing the electronic device protection film, which is used for manufacturing the electronic device protection film, and includes the following steps:
s400: the base material is manufactured to obtain an initial protective layer; the method comprises the steps of obtaining an initial explosion-proof layer through manufacturing, and printing a supporting part on the surface of one side of the initial explosion-proof layer to obtain the explosion-proof layer; specifically, the substrate is a structure made of glass material, the initial explosion-proof layer is a structure made of flexible transparent material, and the supporting part is printed on one side surface of the initial explosion-proof layer in a silk screen printing or pad printing special printing mode.
S500: bonding one side of the explosion-proof layer, which is away from the supporting part, to one side of the initial protection layer to obtain a protection layer;
s600: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained.
As shown in fig. 12, the present application further provides a method for manufacturing the protective film for electronic equipment, which is used for manufacturing the protective film for electronic equipment, and includes the following steps:
s700: the base material is manufactured to obtain a protective layer; specifically, the substrate may be a glass material or a structure made of a transparent material other than glass, and the substrate includes a structure made of at least one material of PET, PC, TPU, PMMA and CPI.
S800: the sub-connection layer is manufactured, a supporting part is printed on the surface of one side of the sub-connection layer, and one side of the sub-connection layer, which is away from the supporting part, is adhered to the protective layer; the sub-connecting layer is of a sheet-shaped structure, and the supporting part is printed on one side surface of the sub-connecting layer in a special printing mode of silk screen printing or pad printing.
S900: the annular adhesive part is manufactured, and is sleeved on the periphery of one side of the protective layer, to which the sub-connecting layer is adhered, so that the protective film for the electronic equipment is obtained.
In summary, the application provides an electronic device protection film and a manufacturing method thereof, wherein the electronic device protection film comprises a protection layer and a connection layer, the connection layer is arranged on one side of the protection layer, the connection layer comprises an adhesive part and a buffer space, the adhesive part is arranged around the periphery of the buffer space and is connected with the protection layer, when an electronic device is attached to a display screen of the electronic device, the protection layer is attached to the display screen through the adhesive part, the adhesive part lifts the protection layer away from the display screen, the buffer space is arranged between the display screen and the protection layer, so that the protection layer is suspended from the display screen, gas between the electronic device protection film and the display screen is not required to be exhausted specially, the film attaching operation of the electronic device protection film on the display screen is simplified, and further the film attaching operation is simplified.
The concepts described herein may be embodied in other forms without departing from the spirit or characteristics thereof. The particular embodiments disclosed are illustrative and not restrictive. The scope of the application is, therefore, indicated by the appended claims rather than by the foregoing description. Any changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (11)

1. The utility model provides an electronic equipment protection film, its characterized in that includes protective layer and tie coat, the tie coat set up in one side of protective layer, the tie coat includes viscose portion and buffering space, viscose portion enclose and locate the periphery in buffering space and with the protective layer is connected.
2. The protective film for electronic devices according to claim 1, wherein the connection layer further comprises a plurality of support portions, and the plurality of support portions are disposed in the buffer space at intervals and connected to the protective layer.
3. The protective film for electronic devices according to claim 2, wherein the adhesive portion has a closed-loop annular structure.
4. The protective film for electronic devices according to claim 2, wherein the height of the supporting portion with respect to the surface of the protective layer is smaller than or equal to the height of the adhesive portion with respect to the surface of the protective layer.
5. The protective film for electronic devices according to claim 4, wherein the supporting portion has a height H1 with respect to the surface of the protective layer, and the adhesive portion has a height H2 with respect to the surface of the protective layer, wherein: h1 is more than or equal to 0.05mm and less than or equal to 0.10mm, H2 is more than or equal to 0.05mm and less than or equal to 0.20mm.
6. The protective film for electronic devices according to claim 2, wherein the protective layer comprises a glass layer and an explosion-proof layer, the explosion-proof layer is disposed on one side of the glass layer, and the adhesive portion and the supporting portion are connected to one side of the explosion-proof layer away from the glass layer.
7. The electronic device protection film according to claim 1, wherein the connection layer further comprises a support portion and a sub-connection layer, the sub-connection layer and the support portion are disposed in the buffer space, the sub-connection layer is connected with the protection layer, the support portion is plural, and the support portion is disposed at intervals and connected to a side of the sub-connection layer away from the protection layer.
8. The protective film for electronic equipment according to any one of claims 1 to 7, wherein when the protective film for electronic equipment is attached to a display screen of the electronic equipment through the adhesive portion, a sealed cavity structure is formed between the buffer space and the display screen.
9. A method for manufacturing the electronic device protection film according to any one of claims 2 to 5, characterized by comprising the steps of:
s100: the base material is manufactured to obtain an initial protective layer;
s200: printing a supporting part on one side surface of the initial protective layer to obtain the protective layer;
s300: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained.
10. A method for manufacturing the protective film for electronic equipment according to claim 6, characterized by comprising the steps of:
s400: the base material is manufactured to obtain an initial protective layer; the method comprises the steps of obtaining an initial explosion-proof layer through manufacturing, and printing a supporting part on the surface of one side of the initial explosion-proof layer to obtain the explosion-proof layer;
s500: bonding one side of the explosion-proof layer, which is away from the supporting part, to one side of the initial protection layer to obtain a protection layer;
s600: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the support part is printed, of the protective layer, so that the protective film for the electronic equipment is obtained.
11. A method for manufacturing the electronic device protection film according to claim 7, characterized by comprising the steps of:
s700: the base material is manufactured to obtain a protective layer;
s800: the sub-connection layer is manufactured, a supporting part is printed on the surface of one side of the sub-connection layer, and one side of the sub-connection layer, which is away from the supporting part, is adhered to the protective layer;
s900: the annular adhesive part is manufactured, and the adhesive part is adhered to the periphery of the side, on which the sub-connecting layer is adhered, of the protective layer, so that the protective film for the electronic equipment is obtained.
CN202310978501.6A 2023-08-04 2023-08-04 Electronic equipment protective film and manufacturing method thereof Pending CN116716051A (en)

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Application Number Priority Date Filing Date Title
CN202310978501.6A CN116716051A (en) 2023-08-04 2023-08-04 Electronic equipment protective film and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN202310978501.6A CN116716051A (en) 2023-08-04 2023-08-04 Electronic equipment protective film and manufacturing method thereof

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Publication Number Publication Date
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CN212560082U (en) * 2020-04-20 2021-02-19 东莞市派尔新材料科技有限公司 Tempering dull polish protection film
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CN207842201U (en) * 2018-01-17 2018-09-11 永春科盛机械技术开发有限公司 A kind of new material sticking film for mobile phone with dedusting function
CN110936692A (en) * 2019-11-12 2020-03-31 广东金斯迪新材料科技有限公司 Base film, composite film and preparation method thereof
CN212560082U (en) * 2020-04-20 2021-02-19 东莞市派尔新材料科技有限公司 Tempering dull polish protection film
CN217297722U (en) * 2022-06-01 2022-08-26 英佰科技(沈阳)有限公司 Mobile phone film

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