CN116709602A - Manufacturing method of electromagnetic induction device and electromagnetic induction product - Google Patents
Manufacturing method of electromagnetic induction device and electromagnetic induction product Download PDFInfo
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- CN116709602A CN116709602A CN202210176170.XA CN202210176170A CN116709602A CN 116709602 A CN116709602 A CN 116709602A CN 202210176170 A CN202210176170 A CN 202210176170A CN 116709602 A CN116709602 A CN 116709602A
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- conductive layer
- conductive material
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- 230000005674 electromagnetic induction Effects 0.000 title claims abstract description 91
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000004020 conductor Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 230000006698 induction Effects 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 9
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
- H05B2206/02—Induction heating
- H05B2206/022—Special supports for the induction coils
Abstract
The embodiment of the application discloses a manufacturing method of an electromagnetic induction device, which comprises the steps of providing a bracket, bonding a conductive material on the bracket to form a conductive layer, and forming the electromagnetic induction device by the conductive layer and the bracket. And adhering and connecting the conductive material and the surface of the bracket at a molecular level. Through the formation on the support with the conducting layer joint, can effectually prevent to take place relative slip and lead to droing between conducting layer and the support, can effectively reduce the thickness of conducting layer and electromagnetic induction device's overall diameter. The application also discloses an electromagnetic induction product comprising the electromagnetic induction device.
Description
Technical Field
The present application relates to the field of electromagnetic induction, and in particular, to a method for manufacturing an electromagnetic induction device and an electromagnetic induction product.
Background
At present, the heating mode of electromagnetic induction mode is used widely, and the device of electromagnetic induction mode heating is applied to different fields, for example the heating mode of electron cigarette adopts electromagnetic induction heating mostly, and electromagnetic induction heating has heating efficiency height, electric energy utilization is high, and the intensification is fast, heats evenly, accuse temperature precision is high grade advantage, and its application is received more and more attention, but the prior art still has some shortages such as with high costs, size are big.
The heating device adopting the electromagnetic induction mode is usually manufactured by winding a single round wire or a plurality of round wires on a heat-resistant support, the total thickness of the heating device manufactured by the mode is larger, the heating device is unfavorable for being used in some small spaces and small devices, and the heating device is combined with the support in a wire winding mode and is easy to fall off in the transferring process, so that the device is damaged and the safety is poor.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application provides a method for manufacturing an electromagnetic induction device with small space occupation and good safety, and an electromagnetic induction product.
An embodiment of the application provides a method for manufacturing an electromagnetic induction device, which comprises providing a bracket, bonding a conductive material on the bracket to form a conductive layer, and matching the conductive layer with the bracket to form the electromagnetic induction device.
Optionally, the support is a hollow cylinder.
Optionally, the bracket is made of high-temperature-resistant plastic material.
Optionally, the high temperature resistant plastic material is polyetheretherketone or polyimide.
Optionally, the conductive layer is a metal layer made of one material of copper, nickel, silver, gold and zinc.
Optionally, the conductive layer is a layer of mixed metal of at least two metals of copper, nickel, silver, gold and zinc.
Optionally, the conductive layer is a ribbon structure of equal width.
Optionally, "bonding the conductive material to the support to form the conductive layer" includes: a conductive material is continuously bonded around the support to form a conductive layer.
Optionally, "continuously joining the conductive material around the support to form the conductive layer" includes: the conductive material is bonded to the outer surface of the stent.
Optionally, "continuously circumferentially engaging the conductive material to the outer surface of the stent" includes: the conductive material is spirally wound on the outer surface of the bracket.
Optionally, "continuously circumferentially engaging the conductive material to the outer surface of the stent" includes: and depositing a conductive material on the outer surface of the bracket to form a conductive layer.
Optionally, "depositing a conductive material on an outer surface of the stent to form a conductive layer" includes: and (3) preprocessing the outer surface of the bracket to manufacture a joint area and a non-joint area. The conductive material forms a conductive layer at the bonding region.
Optionally, the thickness of the scaffold in the engagement zone is the same as the non-engagement zone.
Optionally, the joint region is in a shape of a ribbon with equal width on the outer surface of the bracket and surrounds the outer surface of the bracket in a spiral shape.
Optionally, pre-treating the stent outer surface includes laser irradiation, physical spraying, or application of a modifying agent to distinguish the bonded region from the non-bonded region.
The application also provides an electromagnetic induction product, which comprises the electromagnetic induction device and a heating element, wherein a containing space is formed in the bracket, the heating element is fixed in the containing space, a variable induction magnetic field is generated when a conductive layer flows through a variable current, and the heating element cuts a magnetic induction line in the variable induction magnetic field to generate heat.
Compared with the prior art, the electromagnetic induction device manufactured by the manufacturing method of the electromagnetic induction device can effectively prevent the conductive layer from sliding relative to the support to fall off, can effectively control the thickness of the conductive layer and the whole diameter of the electromagnetic induction device, is more suitable for occasions with small space, and can be made into smaller products and convenient to carry.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1a is a schematic side view of an electromagnetic induction apparatus according to a first comparative embodiment of the present application;
fig. 1b is a schematic cross-sectional view of an electromagnetic induction apparatus according to a first comparative embodiment of the present application;
fig. 2 is a schematic side view of an electromagnetic induction apparatus according to a first embodiment of the present application;
FIG. 3a is a schematic cross-sectional view of the electromagnetic induction apparatus of FIG. 2;
FIG. 3b is a partial enlarged view of the electromagnetic induction device along line D in FIG. 2 (i.e., a partial enlarged view at D in FIG. 3 a);
fig. 4 is a schematic diagram of a manufacturing method of an electromagnetic induction device according to a first embodiment of the present application;
FIG. 5a is a schematic cross-sectional view of a stent;
FIG. 5b is a schematic plan view of the stent after pretreatment;
FIG. 5c is a top view of the stent after pretreatment;
FIG. 5d is a schematic plan view of an electromagnetic induction device;
FIG. 6 is a schematic diagram illustrating the operation of the electromagnetic induction apparatus of FIG. 2;
fig. 7 is a schematic side view of an electromagnetic induction apparatus according to a second embodiment of the present application;
fig. 8 is a schematic diagram illustrating a manufacturing process of the electromagnetic induction device in fig. 7.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order.
Furthermore, the terms "comprises," "comprising," "includes," "including," or "having," when used in this specification, are intended to specify the presence of stated features, operations, elements, etc., but do not limit the presence of one or more other features, operations, elements, etc., but are not limited to other features, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. Furthermore, when describing embodiments of the application, use of "may" means "one or more embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1a and 1b, which are a schematic plan view and a schematic cross-sectional view of an electromagnetic induction device 1 'according to a first comparative embodiment of the present application, as shown in fig. 1a and 1b, the electromagnetic induction device 1' includes a bracket 10 'and a spiral conductive coil 20'. The bracket 10' is a hollow cylindrical structure, and the outer surface of the bracket is provided with a spiral groove for fixing the spiral conductive coil 20', and the spiral conductive coil 20' is a copper wire with a circular cross section. Is secured by means of a spiral wrap within a spiral groove in the outer surface of the stent 10'.
It has been found that the greater thickness of the electromagnetic induction device 1 'produced by the aforementioned method results in a larger overall size of the electromagnetic induction device 1' that is difficult to accommodate for smaller submitted product applications, and that the poor firmness between the spiral conductive coil 20 'and the direct 10' results in an impaired safety.
Specifically, the spiral conductive coil 20' is made of copper wire with a circular cross section, and the circular copper wire is wound on the surface of the bracket 10', so that the overall thickness of the electromagnetic induction device 1' is large, which is not beneficial to use in occasions with small space.
In addition, since the support 10 needs to be grooved to facilitate the winding and fixing of the spiral conductive coil 20 'according to a predetermined track, the structure of the support 10' becomes complicated, thereby increasing the manufacturing cost.
Furthermore, since the electromagnetic induction device 20' is fixed to the outer side of the bracket 10' by winding and assembling, an additional jig and winding step are required, so that the assembly process of the electromagnetic induction device 1' manufactured in this way is complicated.
And, because the bracket 10 'is fixedly assembled to the bracket 20' by grooving, the bracket 20 'may fall off and rotate when receiving an external force in the process of production and transfer, so that the electromagnetic induction device 1' fails and the safety is poor.
Referring to fig. 2, fig. 2 is a schematic side view of an electromagnetic induction device 1 according to an embodiment of the application, and as shown in fig. 2, the electromagnetic induction device 1 includes a support 10 and a spiral conductive layer 20, wherein the support 10 has a hollow cylinder structure.
The conductive layer 20 is a ribbon structure with equal width and is spiral, and the conductive layer 20 is manufactured by bonding a conductive material to the outer surface of the bracket 10 (fig. 3 a) with a predetermined thickness. In this embodiment, "bonding" may be a manufacturing process such as deposition, spraying, coating, printing, etc., and the conductive material and the support 10 are fused and connected at a molecular level distance, so that the outer surface of the support 10 and the conductive material have a certain degree of mutual embedding between molecules, and thus the conductive layer 20 and the support 10 have a strong bonding force.
Referring to fig. 3a to 3b, fig. 3a is a schematic cross-sectional view of the electromagnetic induction device 1 in fig. 2, and fig. 3b is a partial enlarged view of the electromagnetic induction device 1 along line D in fig. 2 (i.e. a partial enlarged view at D in fig. 3 a).
As shown in fig. 3a to 3b, the bracket 10 has a hollow cylindrical structure, which may be manufactured by a plastic molding process such as injection molding or extrusion molding. The outer surface of the support 10 is a smooth surface, and relative to the central line O of the support 10, the distance from the outer surface of the support 10 to the central line O is that the outer diameter of the support 10 is R, the thickness of the outer edge of the support 10 is d1, and the size of the outer edge thickness d1 can be adjusted according to actual requirements.
The outer surface of the stent 10 includes a bonding region 14 and a non-bonding region 15, and the conductive layer 20 is bonded to the outer surface of the stent 10 at a position of the bonding region 14 and is not bonded to the outer surface of the stent 10 at a position of the non-bonding region 15. The land 14 is formed on the outer surface of the stent 10 by laser irradiation, physical spraying, painting of a modifying agent, or the like.
The thickness of the finished land 14 on the outer surface of the stent 10 is unchanged, and the thickness of the land 14 is the same as the thickness of the non-land 15 on the outer surface of the stent 10.
The conductive layer 20 has a uniform-width band-like structure with a thickness d2 and is spirally disposed on the outer surface.
In the electromagnetic induction device 1, the thickness of the position corresponding to the conductive layer 20 is d1+d2, that is, the thickness of the outer wall of the electromagnetic induction device 1 is the sum of the thickness d1 of the outer edge of the support 10 and the thickness d2 of the conductive layer, that is, when the conductive layer 20 is bonded to the outer surface of the support 10, no physical relative embedding occurs with the outer surface of the support 10.
In an exemplary embodiment, the bracket 10 may be made of a high temperature resistant plastic material, such as Polyether Ether Ketone (PEEK) or Polyimide (PI), but may be made of other high temperature resistant materials.
In an exemplary embodiment, the conductive layer 20 is a metal plating layer bonded to the bonding region, and the metal plating layer may be a metal plating layer made of one of metals with better conductivity such as copper, nickel, silver, gold, zinc, or an alloy material made of a mixture of copper, nickel, silver, gold, and zinc. Alternatively, the metal plating layer may be a multilayer metal plating layer made of one of copper, nickel, silver, gold, and zinc, or an alloy material obtained by mixing a plurality of metals of copper, nickel, silver, gold, and zinc. According to specific temperature, conductivity and magnetic flux requirements of the application scene, the material of the conductive layer 20 can be used for arbitrarily adjusting the proportion of alloy and the thickness of the metal coating so as to meet the use requirements in different development scenes.
Referring to fig. 4, which is a schematic diagram of a method for manufacturing an electromagnetic induction device 1 according to a first embodiment of the present application, as shown in fig. 4, the electromagnetic induction device 1 comprises the following specific steps:
step S101, providing a bracket.
Specifically, referring to fig. 5a, fig. 5a is a schematic cross-sectional view of the bracket 10. As shown in fig. 5a, a plastic material with high temperature resistance is manufactured into a bracket 10, and the bracket 10 has a hollow cylinder structure in this embodiment. Wherein the radius of the bracket 10 relative to the center line O is R and the outer edge thickness is d1. The outer surface of the support 10 is a smooth plane, and the outer edge of the support 10 is provided with a certain thickness for providing a depending carrier for the metal coating. The high temperature resistant material may be a high temperature resistant plastic material, such as Polyether Ether Ketone (PEEK) or Polyimide (PI), or may be other high temperature resistant materials, which is not limited by the present application.
Step S102, bonding a conductive material on the support to form a conductive layer.
In one embodiment of the present application, bonding the conductive material to the support 10 to form the conductive layer 20 may include: a conductive material is continuously bonded around the stent 10 to form a conductive layer 20, which creates an induced magnetic field when current flows through the conductive layer 20.
In one embodiment of the present application, the continuous circumferential bonding of the conductive material to the support 10 to form the conductive layer 20 may include: the conductive material is continuously bonded circumferentially to the outer surface of the stent 10 in the axial direction of the stent 10.
In one embodiment of the present application, the continuous circumferential engagement of the conductive material to the outer surface of the stent 10 along the axial direction of the stent 10 may specifically include: the conductive material is spirally bonded around the stent outer surface 10.
In one embodiment of the present application, the continuous circumferential engagement of the conductive material to the outer surface of the stent 10 along the axial direction of the stent 10 may specifically include: a conductive material is deposited on the outer surface of the stent 10 to form a conductive layer 20.
Specifically, referring to fig. 5b to 5d together, fig. 5b and 5c are a schematic plan view and a plan view of the bracket 10 after pretreatment, respectively, and fig. 5d is a schematic plan view of the electromagnetic induction device 1.
As shown in fig. 5b to 5c, the outer surface of the cylinder holder 10 is provided with a pretreatment.
More specifically, the outer surface of the stent 10 is divided into the joining region 14 and the non-joining region 15 by physical treatment or chemical treatment, and the joining region 14 is formed in a spiral shape along the axial direction of the stent 10, and the positions of metal joining are accurately divided. The physical treatment mode comprises the modes of activating the metal area by laser irradiation, covering the nonmetal area by physical spraying and the like. The chemical treatment mode comprises the application of a modifying agent.
During the pretreatment process, the parameters of the bonding region 14 can be adjusted to adjust the width, pitch and total number of turns of the conductive layer 20 to be bonded, thereby adjusting the electromagnetic induction parameters of the conductive layer 20.
After the pretreatment is completed, the conductive material is bonded to the bonding region 14 on the outer surface of the stent 10, as shown in fig. 5 d. The "bonding" may be a manufacturing process such as deposition, spraying, coating, printing, etc., and the conductive material and the support 10 are fused and connected at a molecular level, so that the outer surface of the support 10 and the conductive material have a certain degree of mutual embedding between molecules, and thus the conductive material has a stronger binding force with the support 10. For example, a metal plating layer is formed on the joint region 14 of the support 10 by depositing a conductive material at a certain thickness at the joint region 14, and the conductive material can be coated on the joint region 14 of the support 10 to form the conductive layer 20, so that the conductive layer 20 is tightly combined with the joint region 14 of the support 10 at a molecular level, the conductive layer 20 and the support 10 have a strong binding force, and the conductive layer 20 and the support 10 are firmly connected and are not easy to fall off. After the conductive layer 20 is manufactured, the bracket 10 and the conductive layer 20 form the electromagnetic induction device 1.
In exemplary embodiments, the metal deposition process may be electroplating, electroless plating, laser activated plating (Laser Activating Plating, LAP), physical vapor deposition (Physical Vapor Deposition PVD), chemical vapor deposition (Chemical Vapor Deposition, CVD), or the like.
Fig. 6 is a schematic operation diagram of the electromagnetic induction device 1 in fig. 2, wherein the electromagnetic induction device 1 is applied to an electromagnetic induction product, that is, the electromagnetic induction product includes the electromagnetic induction device 1 shown in fig. 2 and a heating element 30 disposed in an accommodating space inside the electromagnetic induction device 1.
Specifically, as shown in fig. 6, in the electromagnetic induction device 1, both ends of the conductive layer 20 are respectively connected to the positive and negative electrodes of the power supply, so that the current flows in from one end of the conductive layer and flows out from the other end of the conductive layer. Under the action of the annular current, the hollow cavity in the bracket 10 serves as a receiving space for receiving the heating element 30, and a magnetic field is generated in the receiving space in the bracket 10.
When the current flowing in the conductive layer 20 is a variable current, the magnetic field generated by the conductive layer 20 is also a variable induction magnetic field, that is, when the variable current flows in the conductive layer 20, a variable induction magnetic field is generated, and the heating element 30 continuously cuts the magnetic induction lines in the variable induction magnetic field in the accommodating space of the bracket 10, so that the heating element 30 generates heat.
The current that changes in this embodiment is an alternating current, but may also be other currents that can change with time, which is not limited by the present application. The alternating current refers to a current whose current direction changes periodically with time.
Compared with the electromagnetic induction device 1' in the first comparative embodiment, in the electromagnetic induction device 1 provided by the first embodiment of the present application, the conductive layer 20 manufactured by the metal bonding method has a smaller diameter than a single strand copper wire or a plurality of strands with a circular cross section, and the thickness of the conductive layer 20 can be controlled to be 0.1mm or less, so that the electromagnetic induction device 1 manufactured by the present application has a smaller diameter and a smaller overall size when the bracket 10 with the same size is used, and is more suitable for occasions with small space, and the manufactured product can be smaller and portable.
For the support 10, the conductive layer 20 can be effectively fixed on the support 10 by manufacturing the conductive layer 20 through a metal bonding method, so that the process of fixing the support 10 such as grooving is not needed, the process flow is effectively reduced, and the production cost is saved.
The electromagnetic induction device 1 adopts a bonding process to attach metal to the outer side of the support 10, so that the metal components for manufacturing the conductive layer 20 are tightly combined with the support 10 at the molecular level, and thus the problems of falling off, relative rotation and the like are not easy to occur in the production and transfer process, and the quality of the electromagnetic induction device 1 is improved.
In addition, the bracket 10 in the first embodiment of the present application is made of a plastic material with high temperature resistance, so that the electromagnetic induction device 1 is applied to a higher temperature working environment.
For the electromagnetic induction mode in the first comparative example, the spiral groove of the outer surface of the bracket 10 'has a fixed specification, the diameter, the number of turns, the interval distance, etc. of the conductive layer 20' are limited, and thus the specification of the spiral line cannot be adjusted during the development of the product. However, in the first embodiment of the present application, when the electromagnetic induction device 1 is manufactured by the metal bonding process, the process parameters can be arbitrarily adjusted to change the line width, thickness, number of turns, spacing distance, etc. of the conductive layer 20, so as to adjust the relevant parameters of the electromagnetic induction device. Further, the metal-bonded electromagnetic induction method of the first embodiment of the present application can minimize the capacitive energy loss formed by the relative cross-sectional areas between adjacent wires, as compared to the coil winding method of the comparative embodiment.
Referring to fig. 7, which is a schematic structural diagram of an electromagnetic induction device 2 according to a second embodiment of the present application, as shown in fig. 7, the electromagnetic induction device 2 includes a support 10 and a conductive layer 20, wherein the support 10 is a hollow cylinder structure, a plurality of protruding structures 13 are disposed on a surface of the support 10, the protruding structures 13 are hemispherical, and the array is disposed on an outer surface of the support 10. The conductive layer 20 is a ribbon structure with equal width and is spirally connected to the outer surface of the support 10, wherein the connection can be a manufacturing process such as deposition, spraying, coating, printing and the like, and the conductive material and the support 10 are fused and connected at a molecular level, so that the outer surface of the support 10 and the conductive material are mutually embedded in a certain degree between molecules, and the conductive layer 20 and the support 10 have stronger bonding force.
The joint path is located between the slits of each protruding structure 13 to enhance the stabilizing effect of the conductive layer 20 on the support 10, and the protruding structures 13 have no fixed winding path guide, so the number of turns of the conductive layer can be changed arbitrarily to adapt to different electromagnetic induction parameter requirements.
Referring to fig. 8, which is a schematic diagram illustrating a manufacturing process of the electromagnetic induction device 3 in fig. 7, as shown in fig. 8, a high temperature resistant plastic material is first manufactured into a hollow cylinder shape, hemispherical protruding structures 13 arranged in an array are manufactured on an outer surface to obtain a bracket 10, and then a conductive material is bonded on the outer surface of the bracket 10 to finally obtain the electromagnetic induction device 2. The "bonding" may be a manufacturing process such as deposition, spraying, coating, printing, etc., and the conductive material and the support 10 are fused and connected at a molecular level, so that the outer surface of the support 10 and the conductive material have a certain degree of mutual embedding between molecules, and thus the conductive layer 20 and the support 10 have a stronger bonding force.
In the electromagnetic induction device 2 obtained in the mode, as the convex structures 13 arranged in an array are arranged on the outer surface of the support 10, the conductive layer 20 can be effectively fixed on the support 10, and is not easy to fall off and relatively move due to external force. At the same time, the conductive layer 20 is a flat conductive trace, resulting in a smaller relative cross-sectional area between adjacent traces and thus less capacitive energy loss.
It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (16)
1. A method for manufacturing an electromagnetic induction device is characterized in that,
providing a bracket;
and bonding a conductive material on the bracket to form a conductive layer, wherein the conductive layer is matched with the bracket to form the electromagnetic induction device.
2. The method of claim 1, wherein the bracket is a hollow cylinder.
3. The method for manufacturing an electromagnetic induction device according to claim 1 or 2, wherein the bracket is made of a high-temperature-resistant plastic material.
4. The method of claim 3, wherein the high temperature resistant plastic material is polyetheretherketone or polyimide.
5. The method of claim 1, wherein the conductive layer is a metal layer made of one of copper, nickel, silver, gold, and zinc.
6. The method of claim 1, wherein the conductive layer is a metal layer of a mixture of at least 2 of copper, nickel, silver, gold, and zinc.
7. The method of manufacturing an electromagnetic induction apparatus according to claim 1, wherein the conductive layer is a ribbon structure having an equal width.
8. The method of manufacturing an electromagnetic induction apparatus according to any one of claims 1 to 7, wherein said bonding said conductive material to said support to form a conductive layer comprises:
the conductive material is continuously bonded around the support to form the conductive layer.
9. The method of manufacturing an electromagnetic induction apparatus according to claim 8, wherein,
the "continuously and circumferentially bonding the conductive material to the support to form the conductive layer" includes:
the conductive material is bonded to an outer surface of the stent.
10. The method of manufacturing an electromagnetic induction apparatus according to claim 9, wherein,
the "continuously and circumferentially engaging the conductive material to the outer surface of the stent" includes:
and spirally surrounding the conductive material on the outer surface of the bracket.
11. The method of manufacturing an electromagnetic induction apparatus according to claim 9, wherein,
the "continuously and circumferentially engaging the conductive material to the outer surface of the stent" includes:
and depositing the conductive material on the outer surface of the bracket to form the conductive layer.
12. The method of manufacturing an electromagnetic induction apparatus according to claim 11,
the "depositing the conductive material on the outer surface of the stent to form the conductive layer" includes:
pretreating the outer surface of the bracket to manufacture a joint area and a non-joint area;
the conductive material forms the conductive layer at the bonding region.
13. The method of manufacturing an electromagnetic induction apparatus according to claim 12, wherein,
the thickness of the bracket is the same in the joint area and the non-joint area.
14. The method of manufacturing an electromagnetic induction apparatus according to claim 12 or 13, wherein,
the joint area is in a ribbon shape with equal width on the outer surface of the bracket and surrounds the outer surface of the bracket in a spiral shape.
15. The method of claim 14, wherein pre-treating the outer surface of the stent comprises laser irradiation, physical spraying, or application of a modifying agent to distinguish the bonded region from the non-bonded region.
16. An electromagnetic induction product, characterized by comprising the electromagnetic induction device of any one of claims 1-15 and a heating element, wherein a containing space is formed inside the bracket, the heating element is fixed in the containing space, a changing induction magnetic field is generated when the conductive layer flows through a changing current, and the heating element cuts a magnetic induction line in the changing induction magnetic field to generate heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210176170.XA CN116709602A (en) | 2022-02-24 | 2022-02-24 | Manufacturing method of electromagnetic induction device and electromagnetic induction product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210176170.XA CN116709602A (en) | 2022-02-24 | 2022-02-24 | Manufacturing method of electromagnetic induction device and electromagnetic induction product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116709602A true CN116709602A (en) | 2023-09-05 |
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ID=87829866
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210176170.XA Pending CN116709602A (en) | 2022-02-24 | 2022-02-24 | Manufacturing method of electromagnetic induction device and electromagnetic induction product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116709602A (en) |
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2022
- 2022-02-24 CN CN202210176170.XA patent/CN116709602A/en active Pending
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