CN116695217A - High-precision local electroplating device - Google Patents
High-precision local electroplating device Download PDFInfo
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- CN116695217A CN116695217A CN202310775796.7A CN202310775796A CN116695217A CN 116695217 A CN116695217 A CN 116695217A CN 202310775796 A CN202310775796 A CN 202310775796A CN 116695217 A CN116695217 A CN 116695217A
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- electroplating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 69
- 238000003860 storage Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims description 28
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 34
- 239000002184 metal Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a high-precision local electroplating device, which relates to the technical field of electroplating and comprises a mother tank, wherein the bottom of the mother tank is fixedly connected with a liquid storage tank, the inside of the mother tank is fixedly sleeved with a sub-tank, one side of the back of the liquid storage tank is fixedly sleeved with a liquid guide pipe, the front surface of the bottom of the liquid guide pipe is fixedly connected with a connecting pipe, the side surface of the connecting pipe is provided with a liquid outlet hole, the front surface and the back surface of the bottom of the inside of the mother tank are fixedly sleeved with a fixed outer cylinder, and the inside of the fixed outer cylinder is movably sleeved with a screw rod; according to the invention, the connecting pipe is provided with the liquid outlet hole, the electroplating solution is output from the liquid outlet hole through the connecting pipe, the aperture of the liquid outlet hole is gradually increased from the other side to one side of the mother tank, the opening direction is inclined downwards, no obvious fluctuation is generated on the electroplating liquid surface when the solution is input, the surface of the electroplating liquid surface tends to be flat, and the size precision range of workpiece electroplating is ensured.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a high-precision local electroplating device.
Background
Electroplating is a process of plating a layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, so that a layer of metal film is attached to the surface of the metal or other material parts, thereby playing roles in preventing oxidation of the metal, improving wear resistance, conductivity, reflectivity, corrosion resistance, improving attractiveness and the like, and meanwhile, as different parts of a part are required to have different performances and effects in the industrial manufacturing production process, the part of the workpiece is required to be electroplated.
A plurality of workpieces to be plated are clamped on the electroplating rod, after the electroplating solution is added into the electroplating box, the workpieces on the electroplating rod are moved into the electroplating solution for electroplating, when the surface fluctuation of the electroplating solution is large, the deposition position of the electroplating layer of the workpieces can be influenced, the position of the plating surface on the workpieces can be higher or lower, the electroplating quality of the workpieces is influenced, the resources are wasted due to the higher position, and the production cost is increased.
The current local electroplating device is located the height of electroplating solution through manual work rotation screw rod regulation work piece, and the manual work is adjusted difficult quantization control and is adjusted the height and lead to the cathode conductive frame to appear the inconsistent condition of levelness to lead to the plating bar levelness not enough, different positions dip plating solution degree of depth inconsistent, seriously influence the quality that the work piece was electroplated, need adjust the height of four screw rods when carrying out the altitude mixture control, and the adjustment process is more loaded down with trivial details consuming time, and the regulation precision is not high.
Disclosure of Invention
The invention aims to provide a high-precision local electroplating device, which aims to solve the problems in the prior art.
The technical aim of the invention is realized by the following technical scheme:
the utility model provides a high accuracy local electroplating device, includes female groove, the bottom fixedly connected with liquid reserve tank of female groove, the inside fixed sub-groove that has cup jointed of female groove, the fixed catheter that has cup jointed in one side of liquid reserve tank back, the positive fixedly connected with connecting pipe of catheter bottom, the liquid outlet has been seted up in the front of connecting pipe, the positive of the inside bottom of female groove has all been fixedly cup jointed fixed urceolus with the back, the equal activity in inside of fixed urceolus has cup jointed the lead screw, the equal fixedly connected with fixed block in top of lead screw, the top fixedly connected with negative pole of fixed block removes the frame, the positive equal fixedly connected with electrode slice at negative pole removes the frame top, the top fixedly connected with connecting block of electrode slice, the middle part activity at connecting block top has cup jointed the plating bar, the top of plating bar is adorned the card and is had the work piece, the drain hole has been seted up to the opposite side of the inside bottom of female groove, the opposite side fixedly connected with positive pole conducting bar at female groove top, positive pole bottom has hung positive pole basket.
By adopting the technical scheme, the part area is selectively plated, so that the requirements of good welding, electric conduction, wear resistance or other performances can be obtained in the part area, the functional diversity of different parts of a single part can be improved, the processing difficulty can be reduced, the waste of electroplating solution can be reduced, the material can be saved, particularly the noble metal material, and the production cost can be greatly reduced.
The invention is further provided with: the cathode moving frame is positioned between the sub-groove and the mother groove, and the cathode moving frame is not contacted with the sub-groove and the mother groove.
By adopting the technical scheme, the electroplating solution in the subslot always keeps a uniform and gentle flowing state, so that the electroplating solution on the periphery of the workpiece to be plated is updated and supplemented in time, concentration polarization is eliminated, the influence of hydrogen evolution on the quality of a plating layer in the metal deposition process is reduced, and the required plating layer is obtained rapidly and with high quality.
The invention is further provided with: the plane of the top of the mother groove is higher than that of the top of the sub groove, and the height of the plane is the same as half of the length of the maximum workpiece to be plated, so that the universality of the electroplated workpiece applicable to various specifications and sizes can be improved.
Through adopting above-mentioned technical scheme, when guaranteeing the high fixed positive pole conducting rod of female groove, a part at positive pole basket top is located the top of electroplating solution liquid level, and the metal anode that is located in the electroplating solution is dissolved out metal ion, along with the positive pole metal consumption in the immersion plating solution in the electroplating process, the metal anode that is located in the positive pole basket above the electroplating solution liquid level gradually reduces in order to automatic replenishment the positive pole metal that consumes, also can observe at any time in the production process whether the positive pole blue in-metal anode is sufficient to in time replenishing.
The invention is further provided with: the electrode plate, the connecting block and the electroplating rod are all made of conductive materials, and the anode conductive rods and the electroplating rod are arranged in a staggered mode.
Through adopting above-mentioned technical scheme, positive pole conducting rod and electroplating pole staggered arrangement make positive pole basket and work piece staggered arrangement to make positive pole and negative pole one-to-one interval equipartition, guarantee the homogeneity that all parts receive the plating.
The invention is further provided with: the aperture of the liquid outlet hole is gradually reduced from one side of the mother groove to the other side, and the direction of the liquid outlet hole is inclined downwards.
By adopting the technical scheme, the pressure and the flow rate tend to be consistent when the electroplating solution is conveyed, so that the solution exchange in the subslot is even and sufficient when the electroplating solution is conveyed to the subslot, the electroplating liquid level cannot fluctuate, and the accuracy of the plating surface when the workpiece is electroplated is ensured.
The invention is further provided with: the fixed outer cylinder is corrosion-resistant and is not electroplated, the screw rods move up and down synchronously through the control system, and the moving heights of the screw rods on the front surface and the back surface are the same.
Through adopting above-mentioned technical scheme, drive all work pieces and remove jointly when the cathode removes the frame and remove, and the distance of removal is more accurate for the work piece electroplates more convenient accurate, and can select different control parameter accurate adjustment and control plating height according to different work pieces.
The invention is further provided with: the liquid leakage hole is positioned between the sub-groove and the mother groove and is positioned in the range of the liquid storage tank.
Through adopting above-mentioned technical scheme, the weeping hole is collected from the electroplating solution inflow liquid reserve tank that sub tank circulation exchanged, and the catheter carries the electroplating solution in the liquid reserve tank to the sub tank in the same time, realizes the circulation flow of electroplating solution in the sub tank.
In summary, the beneficial technical effects of the invention are as follows:
(1) According to the invention, the connecting pipe is provided with the liquid outlet hole, the electroplating solution is output from the liquid outlet hole through the connecting pipe, the aperture of the liquid outlet hole is gradually increased from the other side to one side of the mother tank, the opening direction is inclined downwards, no obvious fluctuation is generated on the electroplating liquid surface when the solution is input, the surface of the electroplating liquid surface tends to be flat, and the size precision range of workpiece electroplating is ensured.
(2) According to the invention, the screw rods are arranged, the height of the cathode moving frame is adjusted, the control system simultaneously controls the screw rods to synchronously rise or fall by the same height, manual adjustment is not needed, the height adjustment speed is high, the efficiency is high, the lifting precision can reach 0.5mm, and the accuracy of height adjustment and the universality of accurate control of different size requirements of various types during workpiece electroplating are ensured.
Drawings
FIG. 1 is an isometric view of the overall structure of one embodiment of the invention;
FIG. 2 is a schematic elevational cross-sectional view of one embodiment of the present invention showing the fixed relationship of the stationary outer cartridge and the outer housing main body;
FIG. 3 is an isometric view of an overall rear structure of an embodiment of the invention;
FIG. 4 is an isometric view of a workpiece structure according to one embodiment of the invention.
Reference numerals: 1. a female groove; 101. a weeping hole; 2. a liquid storage tank; 3. a catheter; 301. a connecting pipe; 302. a liquid outlet hole; 4. a cathode moving frame; 401. an electrode sheet; 5. a subslot; 6. an anode conductive rod; 601. an anode basket; 7. an electroplating rod; 8. a workpiece; 9. a connecting block; 10. a fixed block; 1001. a screw rod; 1002. the outer cylinder is fixed.
Detailed Description
The present invention will be described more fully hereinafter with reference to the accompanying examples.
Referring to fig. 1-4, a high-precision local electroplating device comprises a mother tank 1, a liquid storage tank 2 is fixedly connected to the bottom of the mother tank 1, a sub-tank 5 is fixedly sleeved in the mother tank 1, a liquid guide tube 3 is fixedly sleeved on one side of the back of the liquid storage tank 2, a connecting pipe 301 is fixedly connected to the front of the bottom of the liquid guide tube 3, a liquid outlet hole 302 is formed in the front of the connecting pipe 301, a fixed outer cylinder 1002 is fixedly sleeved on the front and the back of the inner bottom of the mother tank 1, a screw 1001 is movably sleeved in the fixed outer cylinder 1002, a fixed block 10 is fixedly connected to the top of the screw 1001, a cathode moving frame 4 is fixedly connected to the top of the fixed block 10, an electrode plate 401 is fixedly connected to the front of the top of the cathode moving frame 4, a connecting block 9 is fixedly connected to the top of the electrode plate 401, the middle part activity at connecting block 9 top has cup jointed electroplating rod 7, electroplating rod 7 dress card has work piece 8, leak hole 101 has been seted up to the opposite side of the inside bottom of mother tank 1, the opposite side fixedly connected with positive pole conducting rod 6 at mother tank 1 top, positive pole basket 601 has been hung to the bottom of positive pole conducting rod 6, during electroplating, plating metal or other insoluble material are the positive pole, work piece 8 that waits to plate is the negative pole, plating metal's cation is reduced to form the metal coating on waiting to plate work piece 8 surface, in order to get rid of the interference of other cations, and make the cladding even, firmly, need use plating metal cation containing solution to do the plating solution, positive pole metal separates out as metal ion under chemistry and electrochemistry effect simultaneously and gets into electroplating solution, in order to keep plating metal cation's concentration stable in the electroplating solution. When the metal is used in various environments, the metal corrosion is generated due to the chemical and electrochemical actions of external media on the surface of the metal, and the metal corrosion results not only in the loss of the metal, but also in the loss of use value due to the damage of the structure of a metal product, so that the waste of manpower and material resources is caused, and therefore, the metal and the metal product are produced in a large quantity, meanwhile, the corrosion of the metal must be prevented, meanwhile, the metal itself does not have certain special properties and also limits the application of the metal, and the electroplating technology is one of the most effective methods for increasing the metal protection performance, improving the quality of the surface of the metal, assisting the surface of the metal with better performance and even giving modification.
In a preferred embodiment, the cathode moving frame 4 is located between the sub-tank 5 and the mother tank 1, the cathode moving frame 4 is not in contact with the sub-tank 5 and the mother tank 1, and the plating solution that has passed through the sub-tank 5 flows down along the outer edge of the sub-tank 5 while the cathode moving frame 4 is not obstructed from moving.
In a preferred embodiment, the top of the mother tank 1 is located at a higher level than the top of the sub tank 5, and the height of the top is the same as half of the length of the largest workpiece 8 to be plated, the anode conductive rod 6 is fixed on the mother tank 1, and a part of the anode basket 601 is positioned in the electroplating solution, so that the current is led out and the stable anode area and the replenishment of the consumption of discharged metal ions in the electroplating solution are realized, and the situation that the electroplating solution is blocked by the mother tank 1 after being overflowed from the sub tank 5 is ensured.
In a preferred embodiment, the electrode plates 401, the connecting blocks 9 and the electroplating rods 7 are made of conductive materials, the anode conductive rods 6 and the electroplating rods 7 are staggered, current is conveyed to each conductive part after the cathode moving frame 4 is electrified, the current is conveyed to the connecting blocks 9 through the electrode plates 401, the connecting blocks 9 convey the current to the electroplating rods 7 and then to each workpiece 8, each workpiece 8 is in a cathode conductive state, the anode basket 601 is an anode in the electrified state, the workpiece 8 is a cathode, anode metal in the anode basket 601 is oxidized and dissolved to become metal ions to enter plating solution, reduction reaction occurs on the cathode surface under the action of external current and then the metal ions are deposited on the surface of the workpiece 8, and therefore a plating layer is obtained.
In a preferred embodiment, the aperture of the liquid outlet 302 gradually decreases from one side to the other side of the mother tank 1, the direction of opening the liquid outlet 302 is inclined downward, the pressure of the electroplating solution in the connecting pipe 301 close to the direction of the liquid guide tube 3 is larger when the electroplating solution is output, the pressure of the electroplating solution in the connecting pipe 301 gradually far from the direction of the liquid guide tube 3 gradually decreases, the output pressure of the electroplating solution greatly increases the flow rate, so that the aperture of the liquid outlet 302 gradually increases from the direction far from the liquid guide tube 3, the output pressure and the flow rate tend to be consistent, the overall level of the electroplating solution is ensured to be flat, the electroplated surface on the workpiece 8 reaches the standard, and the electroplated surface is not lower or higher.
In a preferred embodiment, the fixed outer cylinder 1002 is corrosion-resistant and not electroplated, the screw 1001 moves up and down through the control system, and the moving heights of the screw 1001 on the front and back are the same, so as to protect the screw 1001, ensure that the screw 1001 moves smoothly in the fixed outer cylinder 1002, and ensure that the cathode moving frame 4 moves straight all the time during the movement of the screw 1001, thereby ensuring the electroplating quality of the workpiece 8.
In a preferred embodiment, the weeping hole 101 is located between the sub tank 5 and the mother tank 1, the weeping hole 101 is located in the range of the liquid storage tank 2, the electroplating solution flowing downwards along the sub tank 5 is converged between the mother tank 1 and the sub tank 5, and flows into the liquid storage tank 2 through the weeping hole 101, the electroplating solution cannot flow to the outside of the liquid storage tank 2, and meanwhile, the electroplating solution is conveyed from the liquid storage tank 2 into the sub tank 5 through the liquid guide tube 3, so that the electroplating solution in the sub tank 5 always keeps a circulating flow state, the influence of concentration polarization of cathode and anode ends on the electroplating process is reduced to the greatest extent, and the electroplating quality is ensured.
The working principle of the embodiment is as follows: the plurality of workpieces 8 are clamped on the electroplating rod 7 according to the same interval, then the electroplating rod 7 is fixed on the connecting block 9, then electroplating solution is conveyed into the sub-tank 5 through the liquid guide pipe 3, the front surface of the bottom of the liquid guide pipe 3 is connected with the connecting pipe 301, the connecting pipe 301 is jointed with the bottom of the sub-tank 5, meanwhile, the side surface of the connecting pipe 301 is provided with a liquid outlet hole 302, the aperture of the liquid outlet hole 302 is gradually increased from the other side to one side of the sub-tank 5, because the pressure exists when the electroplating solution is conveyed into the sub-tank 5 from the liquid guide pipe 3, the pressure of the part of the connecting pipe 301 close to the liquid guide pipe 3 is larger than the pressure of the part far away from the liquid guide pipe 3, the aperture of the liquid outlet hole 302 with large pressure on the connecting pipe 301 is smaller, and gradually increased towards the direction far away from the liquid guide pipe 3, so that the pressure of the electroplating solution conveyed into the sub-tank 5 tends to be consistent, meanwhile, the direction of the liquid outlet hole 302 is downwards inclined, when the electroplating solution is output, the electroplating solution is firstly uniformly output to the bottom of the sub-tank 5, the liquid level of the electroplating solution is gradually increased from the bottom of the sub-tank 5, the liquid level of the electroplating solution tends to be stable, when the liquid level of the electroplating solution in the sub-tank 5 is gradually increased and overflows from the sub-tank 5, the overflowed electroplating solution flows into the mother tank 1 along the outer edge of the sub-tank 5, after the electroplating solution between the mother tank 1 and the sub-tank 5 is converged, the electroplating solution flows into the liquid storage tank 2 from the liquid outlet hole 101, the overflowed electroplating solution does not affect the fixed outer cylinder 1002, then the height of the cathode moving frame 4 is regulated through the control system, the connecting block 9 is fixed on the cathode moving frame 4, the height value required to be moved is input in the control system, the screw 1001 is enabled to execute the descending or the ascending corresponding height in the fixed outer cylinder 1002, ensuring that the position of the liquid level of the electroplating solution is positioned at the height position of the workpiece 8 where plating is required by process design;
after the position of the workpiece 8 to be electroplated is determined, the electroplating device is electrified, because the electroplating metal is filled in the anode basket 601 and is hung on the anode conducting rod 6, the anode basket 601 is immersed in the electroplating solution in the sub-tank 5, the anode basket 601 and the workpiece 8 are staggered, the position of the anode basket 601 belongs to the anode, the connecting block 9 is fixedly connected with the electrode plate 401, the electroplating rod 7 is fixedly lapped on the connecting block 9, meanwhile, the workpiece 8 is clamped on the electroplating rod 7 in a certain mode, the electrode plate 401, the connecting block 9 and the electroplating rod 7 are all made of conductive materials, after the electrifying, current is conducted to the workpiece 8 through the electrode plate 401, the connecting block 9 and the electroplating rod 7, at the moment, the position of the workpiece 8 is connected with the cathode to serve as the cathode, under the electrochemical action, the electroplating metal in the anode basket 601 can be dissolved out of metal cations, and is attracted by the cathode, the cations are moved to the cathode, and then deposited on the surface of the workpiece 8, thus a plating layer is obtained, the part to be electroplated on the workpiece 8 is fully dried after the electroplating is finished through water washing, anti-discoloration treatment and the like.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. All equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.
Claims (7)
1. The utility model provides a high accuracy local electroplating device, includes female groove (1), its characterized in that: the bottom fixedly connected with liquid storage tank (2) of female groove (1), the inside fixed sub-groove (5) that has cup jointed of female groove (1), the fixed catheter (3) that has cup jointed in one side of liquid storage tank (2) back, the positive fixedly connected with connecting pipe (301) of catheter (3) bottom, play liquid hole (302) have been seted up in the front of connecting pipe (301), fixed urceolus (1002) have all been fixedly cup jointed in the front and the back of female groove (1) inside bottom, lead screw (1001) have all been movably cup jointed in the inside of fixed urceolus (1002), the equal fixedly connected with fixed block (10) in top of lead screw (1001), the top fixedly connected with negative pole removes frame (4) of fixed block (10), the positive fixedly connected with electrode plate (401) at negative pole removes the top of frame (4), the top fixedly connected with connecting block (9) of electrode plate (401), the middle part activity at connecting block (9) top has electroplated pole (7), the dress card has work piece (8) on electroplating pole (7), the positive pole (1) bottom is equipped with positive pole (6) and is connected with drain hole (101), the bottom of the suspension rod anode conducting rod (6) is suspended with an anode basket (601).
2. The high-precision partial plating apparatus according to claim 1, wherein: the cathode moving frame (4) is positioned between the sub-groove (5) and the mother groove (1), and the cathode moving frame (4) is not contacted with the sub-groove (5) and the mother groove (1).
3. A high precision partial plating apparatus according to claim 2, wherein: the plane of the top of the mother groove (1) is higher than the plane of the top of the sub groove (5), and the height of the plane is the same as one half of the length of the workpiece (8) with the largest dimension.
4. The high-precision partial plating apparatus according to claim 1, wherein: the electrode plates (401), the connecting blocks (9) and the electroplating rods (7) are made of conductive materials, and the anode conductive rods (6) and the electroplating rods (7) are arranged in a staggered mode.
5. The high-precision partial plating apparatus according to claim 1, wherein: the aperture of the liquid outlet hole (302) is gradually reduced from one side of the mother groove (1) to the other side, and the opening direction of the liquid outlet hole (302) is inclined downwards.
6. The high-precision partial plating apparatus according to claim 1, wherein: the fixed outer cylinder (1002) is corrosion-resistant and is not electroplated, the screw rods (1001) move up and down synchronously through a control system, and the moving heights of the screw rods (1001) on the front surface and the back surface are the same.
7. The high-precision partial plating apparatus according to claim 1, wherein: the liquid leakage hole (101) is positioned between the sub-tank (5) and the main tank (1), and the liquid leakage hole (101) is positioned in the range of the liquid storage tank (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310775796.7A CN116695217A (en) | 2023-06-28 | 2023-06-28 | High-precision local electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310775796.7A CN116695217A (en) | 2023-06-28 | 2023-06-28 | High-precision local electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116695217A true CN116695217A (en) | 2023-09-05 |
Family
ID=87823820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310775796.7A Pending CN116695217A (en) | 2023-06-28 | 2023-06-28 | High-precision local electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116695217A (en) |
-
2023
- 2023-06-28 CN CN202310775796.7A patent/CN116695217A/en active Pending
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