CN116694285A - High-modulus flame-retardant MS adhesive and preparation method thereof - Google Patents
High-modulus flame-retardant MS adhesive and preparation method thereof Download PDFInfo
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- CN116694285A CN116694285A CN202310979722.5A CN202310979722A CN116694285A CN 116694285 A CN116694285 A CN 116694285A CN 202310979722 A CN202310979722 A CN 202310979722A CN 116694285 A CN116694285 A CN 116694285A
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- 239000003063 flame retardant Substances 0.000 title claims abstract description 72
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000000853 adhesive Substances 0.000 title claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- -1 flame retardant siloxane Chemical class 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 16
- 239000004014 plasticizer Substances 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000004526 silane-modified polyether Substances 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 7
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002516 radical scavenger Substances 0.000 claims abstract description 4
- 239000006229 carbon black Substances 0.000 claims abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 52
- 238000003756 stirring Methods 0.000 claims description 43
- 229910052757 nitrogen Inorganic materials 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000008595 infiltration Effects 0.000 claims description 10
- 238000001764 infiltration Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 8
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 8
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- VJZHYVVYCBREGE-UHFFFAOYSA-N P(=O)(OC1=CC=CC=C1)(OC1=CC=CC=C1)OC1=C(C(=CC=C1)O)O Chemical compound P(=O)(OC1=CC=CC=C1)(OC1=CC=CC=C1)OC1=C(C(=CC=C1)O)O VJZHYVVYCBREGE-UHFFFAOYSA-N 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 6
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- 239000006227 byproduct Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- HEDLCNIIGBUTDQ-UHFFFAOYSA-N OC1=CC=CC(OP(O)(O)=O)=C1O Chemical compound OC1=CC=CC(OP(O)(O)=O)=C1O HEDLCNIIGBUTDQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- RWPICVVBGZBXNA-UHFFFAOYSA-N bis(2-ethylhexyl) benzene-1,4-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C=C1 RWPICVVBGZBXNA-UHFFFAOYSA-N 0.000 claims description 2
- HORIEOQXBKUKGQ-UHFFFAOYSA-N bis(7-methyloctyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCC(C)C HORIEOQXBKUKGQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000004806 diisononylester Substances 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 claims description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 2
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 claims 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 238000002791 soaking Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- GXGAKHNRMVGRPK-UHFFFAOYSA-N dimagnesium;dioxido-bis[[oxido(oxo)silyl]oxy]silane Chemical compound [Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O GXGAKHNRMVGRPK-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229940099273 magnesium trisilicate Drugs 0.000 description 2
- 229910000386 magnesium trisilicate Inorganic materials 0.000 description 2
- 235000019793 magnesium trisilicate Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 2
- 241000208125 Nicotiana Species 0.000 description 1
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000001891 dimethoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical group [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000004588 polyurethane sealant Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- XLUBVTJUEUUZMR-UHFFFAOYSA-B silicon(4+);tetraphosphate Chemical compound [Si+4].[Si+4].[Si+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XLUBVTJUEUUZMR-UHFFFAOYSA-B 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/04—Esters of silicic acids
- C07F7/06—Esters of silicic acids with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a high-modulus flame-retardant MS adhesive and a preparation method thereof, and relates to the field of adhesives. Comprises 40-50 parts of silane modified polyether; 10-20 parts of self-made high Tg and flame retardant siloxane modified resin; 5-10 parts of plasticizer; 20-40 parts of flame retardant filler, 1-5 parts of gas-phase white carbon black, 0.1-1 part of water scavenger, 5-10 parts of aminosilane monomer and 1-3 parts of catalyst. The phosphate structure with benzene ring in the high-modulus flame-retardant MS adhesive provided by the invention endows the adhesive with good chemical stability, and the structure contains P-H bonds, so that the system has self-extinguishing property and excellent arc resistance, and can be widely applied to bonding encapsulation of various materials, especially bonding encapsulation in the fields of electronic appliances, lighting lamps and the like.
Description
Technical Field
The invention relates to the field of adhesives, in particular to a high-modulus flame-retardant MS adhesive and a preparation method thereof.
Background
MS adhesive (silane modified polyether adhesive) is a type of sealant which appears in recent years, combines the performances of organosilicon sealant and polyurethane sealant, is free from foaming after curing, does not contain-NCO, has excellent adhesive force on a plurality of difficult-to-adhere engineering plastics, is free from surface contamination, is environment-friendly and has lower cost, is widely applied to sealing, waterproofing and the like in the building and home decoration industries, and plays an increasingly important role in the low-end market. However, the conventional silane modified polyether has the temperature resistance of not more than 120 ℃ generally, can crack chain segments under the conditions of high temperature and high humidity, has poor flame retardance, and is rarely applied to industries with high standard requirements in the aspect of electronic and electrical appliance manufacturing.
Along with the development of large-scale automatic continuous production and the improvement of environmental protection requirements at the present stage, the ultraviolet light curing adhesive can be rapidly positioned to achieve wide application, but in practical application, the ultraviolet light curing is difficult to be performed in deep or shadow areas due to the existence of a non-illumination area, light blocking of filler colors and weak light intensity, and the bonding effect can be greatly influenced. Therefore, the silane modified polyether adhesive capable of being quickly positioned by UV and being cured by later moisture can well solve the technical defects in the prior art.
The flame retardant research on the end siloxane moisture curing polymer resin at home and abroad is very few at present, and the flame retardant research mainly stays on the level of adding inorganic filler flame retardant, and the essential flame retardant research on the resin material basically belongs to the blank. As is well known, the high polymer material with the limiting oxygen index larger than 27 belongs to a flame-retardant material, and the oxygen index of MS and SPU sealants sold in the market is found to be lower than 21 through test, and the vertical combustion is lower than FV-0 grade, so that the high polymer material belongs to a flammable material. The fire safety hidden trouble brought by the method threatens the life and property safety of people at all times, so that the application of the silane modified polyether is greatly limited, and the requirements on the flame retardance of materials are more strict in the fields of electronic appliances and the like.
Although the traditional halogen flame retardant has high flame retardant effect, high cost performance and wide applicability, the hydrogen halide gas released by decomposition of the traditional halogen flame retardant has serious corrosiveness to adhesive materials such as electronic components, electrical equipment and the like. Thus, halogen-free flame retardant epoxy resins have become a direction of research and development in recent years. The nitrogen flame retardant and the phosphorus flame retardant in the halogen-free flame retardant have lower flame retardant efficiency, wherein the phosphorus flame retardant has high price and few types in the market. However, the additive type flame retardant is not only required to be added in a large amount, but also can reduce the mechanical properties of the matrix material, so that the flame retardant is also greatly limited.
As is well known in the electronic and electrical industry, contacts of components are likely to generate an arc at the contacts when the circuit is opened or closed, which not only results in deterioration of the working conditions of the contacts, but also affects the service life and reliability of the electronic and electrical equipment to a great extent. The adhesive can be used for fixing and sealing parts at the contact, so that the generation of electric arcs is reduced, and the service life and flame retardance of the electrical equipment are improved. It is clear from this that the adhesive used for bonding and sealing has a very important meaning for the study of the effect of the arc characteristics.
In the patent of CN106833478A, magnesium Trisilicate (MTS) flame retardant synergist is adopted, and is amorphous silicate at room temperature and high temperature, and can chemically react with an acid source in an Intumescent Flame Retardant (IFR) at high temperature, and part of the silicate is converted into silicon phosphate substances and amorphous silicon dioxide, so that the flame retardant performance of a flame-retardant object can be effectively improved, but the filler can shield illumination and prevent deep curing.
Disclosure of Invention
The invention aims to provide a high-modulus flame-retardant MS adhesive, which solves the problems that the prior MS adhesive has poor temperature difference resistance and stability and cannot take the flame retardance and the mechanical property into consideration, and realizes the technical effects of good temperature resistance effect and chemical stability and good self-extinguishing property.
In order to solve the technical problems, the invention adopts the following technical scheme:
the high-modulus flame-retardant MS adhesive comprises the following components in parts by mass:
40-50 parts of silane modified polyether;
10-20 parts of self-high Tg flame-retardant siloxane modified resin;
5-10 parts of plasticizer;
20-40 parts of flame retardant filler;
1-5 parts of gas phase white carbon black;
0.1-1 part of a water scavenger;
5-10 parts of aminosilane monomer;
1-3 parts of a catalyst;
the self-made high Tg and flame retardant siloxane modified resin has a structural formula shown in the following formula I:
i
Wherein R is methyl or ethyl;
the self-made high Tg and flame retardant siloxane modified resin comprises dihydroxyphenyl phosphate (diphenyl) and methyl orthosilicate or ethyl orthosilicate according to the mol ratio of 1: 2. is obtained by proportional reaction.
Further, the silane-modified polyether is one or two selected from the group consisting of a dimethoxy silane-terminated polyether and a trimethoxy silane-terminated polyether of KANEKA.
Further, the plasticizer is one or more selected from the group consisting of a Pasteur plasticizer Efka PL5382, a Pasteur plasticizer Hexamell DINCH, eastman168, and Aijing NEO-T.
Further, the flame retardant filler is a hydroxide filler having flame retardancy, such as magnesium hydroxide or aluminum hydroxide, preferably inexpensive aluminum hydroxide.
Further, the water scavenger is one or two selected from vinyl trimethoxy silane and vinyl triethoxy silane.
Further, the aminosilane monomer is selected from one or more of aminopropyl trimethoxysilane, N-aminoethyl-3-aminopropyl methyldimethoxy silane, N-aminoethyl-3-aminopropyl trimethoxysilane or N-beta- (aminoethyl) -gamma-aminopropyl trimethoxysilane.
Further, the catalyst is selected from one or more of an organotin catalyst, an organobismuth catalyst, and an amine catalyst.
The self-made high Tg and flame retardant siloxane modified resin is prepared through the following steps:
s1, adding 100 parts of dihydroxyphenyl (diphenyl) phosphate into a reaction kettle, heating to 120 ℃, continuously vacuumizing and dehydrating for 2 hours, wherein the mol ratio of the theoretical hydroxyl value of the dihydroxyphenyl (diphenyl) phosphate to the mol ratio of methyl orthosilicate or ethyl orthosilicate is 1: 2. adding methyl orthosilicate or ethyl orthosilicate, stirring for 10min at the speed of revolution of 20r/min, adding 1 part of dibutyltin dilaurate catalyst, vacuumizing to < -0.98MPa, continuously stirring at the speed of revolution of 20r/min and rotation of 1000r/min until the by-product ethanol reaches a theoretical value, stopping stirring and cooling to obtain a primary product;
s2, dissolving the preliminary product prepared in the step S1 in petroleum ether, carrying out high-speed centrifugal treatment at a centrifugal speed of 10000r/min, carrying out layered extraction, and drying to obtain purified self-made high Tg flame-retardant siloxane modified resin; the specific reaction is shown in the following formula II:
II type
Where R is methyl or ethyl.
The invention also discloses a preparation method of the high-modulus flame-retardant MS adhesive, which comprises the following steps:
adding 40-50 parts of silane modified polyether, 10-20 parts of self-made high Tg flame-retardant siloxane modified resin and 5-10 parts of plasticizer into a reaction kettle, charging nitrogen, and stirring for 20min at the speed of revolution of 20 r/min; adding 20-40 parts of flame-retardant filler, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing, and maintaining the vacuum degree of < -0.98 MPa; adding 1-5 parts of fumed silica, stirring for 30min at the speed of revolution of 20r/min and rotation of 1000r/min after infiltration, vacuumizing in the process, and keeping the vacuum degree of < -0.98 MPa; adding 0.1-1 part of a water removing agent, protecting nitrogen, stirring for 15min at the speed of revolution of 20r/min, finally adding 5-10 parts of an aminosilane monomer and 1-3 parts of a catalyst, and stirring for 20min at the speed of revolution of 20r/min under the protection of nitrogen.
The invention has the following beneficial technical effects:
1. the high-modulus flame-retardant MS adhesive provided by the invention has the advantages that the three benzene ring structures are contained, so that the system has higher hardness and cohesive strength, the cross-linking density of the cured product is tighter, and the intermolecular cohesive force is larger. And simultaneously has more excellent temperature resistance and good chemical stability.
2. The phosphate structural bond in the structure ensures that the system has self-extinguishing property and excellent arc resistance. The adhesive can be widely applied to adhesive encapsulation of various materials, in particular to adhesive encapsulation in the fields of electronic appliances, lighting fixtures and the like.
Detailed Description
The principles and features of the present invention are described below in connection with the following examples and comparative examples, which are set forth to illustrate the present invention and are not intended to limit the scope of the invention. Any product that is the same or similar to the present invention, whether made by any person in the light of the present invention or by combining the present invention with other prior art features, falls within the scope of the present invention.
Preparation of self-made high Tg flame retardant siloxane modified resin
S1, adding 100 parts of dihydroxyphenyl (diphenyl) phosphate into a reaction kettle, heating to 120 ℃, continuously vacuumizing and dehydrating for 2 hours, wherein the mol ratio of the theoretical hydroxyl value of the dihydroxyphenyl (diphenyl) phosphate to the mol ratio of the tetraethoxysilane is 1: 2. adding ethyl orthosilicate, stirring at a revolution speed of 20r/min for 10min, adding 1 part of dibutyltin dilaurate catalyst, vacuumizing to < -0.98MPa, continuously stirring at a revolution speed of 20r/min and a rotation speed of 1000r/min until the byproduct ethanol reaches a theoretical value, stopping stirring and cooling to obtain a premix A;
s2, dissolving the premix A prepared in the step S1 in petroleum ether, carrying out high-speed centrifugal treatment at a centrifugal speed of 10000r/min, carrying out layered extraction, and drying to obtain a purified premix B, namely the high Tg flame-retardant siloxane modified resin.
The self-made high Tg and flame retardant siloxane modified resin used in the subsequent examples and comparative examples are prepared by the steps described above.
Comparative example 1
Adding the Japanese brillouin silane modified polyether (model MAX 951) and 60 parts of the Pasteur plasticizer Efka PL5382 in 5 parts into a reaction kettle, charging nitrogen, and stirring for 20min at a revolution speed of 20 r/min; adding 30 parts of flame-retardant filler aluminum hydroxide, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing in the process, and maintaining the vacuum degree of < -0.98 MPa; adding 202 parts of fumed silica carbopol R, stirring for 30min at the speed of revolution of 20R/min and rotation of 1000R/min after infiltration, vacuumizing, and maintaining the vacuum degree of < -0.98 MPa; then adding 1 part of vinyl trimethoxy silane, nitrogen protection, stirring for 15min at the revolution speed of 20r/min, finally adding 5 parts of N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy, 3 parts of dibutyl tin dilaurate and nitrogen protection, and stirring for 20min at the revolution speed of 20 r/min.
Comparative example 2
60 parts of self-made high Tg flame-retardant siloxane modified resin and 5382 parts of Pasteur plasticizer Efka PL 535 parts are added into a reaction kettle, nitrogen is filled, and the mixture is stirred for 20 minutes at the revolution speed of 20 r/min; adding 30 parts of flame-retardant filler aluminum hydroxide, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing in the process, and maintaining the vacuum degree of < -0.98 MPa; adding 202 parts of cabot R, soaking, stirring at revolution speed of 20R/min and rotation speed of 1000R/min for 30min, vacuumizing, and maintaining vacuum degree of < -0.98 MPa; then adding 1 part of vinyl trimethoxy silane, nitrogen protection, stirring for 15min at the revolution speed of 20r/min, finally adding 5 parts of N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy, 3 parts of dibutyl tin dilaurate and nitrogen protection, and stirring for 20min at the revolution speed of 20 r/min.
Example 1
50 parts of Japanese Brillouin silane modified polyether (model MAX 951) and 10 parts of self-made high Tg flame retardant siloxane modified resin and 5382 parts of basf plasticizer Efka PL 535 are added into a reaction kettle, nitrogen is filled, and stirring is carried out for 20min at the speed of revolution of 20 r/min; adding 30 parts of flame-retardant filler aluminum hydroxide, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing in the process, and maintaining the vacuum degree of < -0.98 MPa; adding 202 parts of cabot R, soaking, stirring at revolution speed of 20R/min and rotation speed of 1000R/min for 30min, vacuumizing, and maintaining vacuum degree of < -0.98 MPa; then adding 1 part of vinyl trimethoxy silane, nitrogen protection, stirring for 15min at the revolution speed of 20r/min, finally adding 5 parts of N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy, 3 parts of dibutyl tin dilaurate and nitrogen protection, and stirring for 20min at the revolution speed of 20 r/min.
Example 2
45 parts of Japanese Brillouin silane modified polyether (model MAX 951) and 15 parts of self-made high Tg flame retardant siloxane modified resin and 5382 parts of basf plasticizer Efka PL 535 are added into a reaction kettle, nitrogen is filled, and stirring is carried out for 20min at the speed of revolution of 20 r/min; adding 30 parts of flame-retardant filler aluminum hydroxide, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing in the process, and maintaining the vacuum degree of < -0.98 MPa; adding 202 parts of cabot R, soaking, stirring at revolution speed of 20R/min and rotation speed of 1000R/min for 30min, vacuumizing, and maintaining vacuum degree of < -0.98 MPa; then adding 1 part of vinyl trimethoxy silane, nitrogen protection, stirring for 15min at the revolution speed of 20r/min, finally adding 5 parts of N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy, 3 parts of dibutyl tin dilaurate and nitrogen protection, and stirring for 20min at the revolution speed of 20 r/min.
Example 3
40 parts of Japanese Brillouin silane modified polyether (model MAX 951) and 20 parts of self-made high Tg flame retardant siloxane modified resin and 5382 parts of basf plasticizer Efka PL 535 are added into a reaction kettle, nitrogen is filled, and stirring is carried out for 20min at the speed of revolution of 20 r/min; adding 30 parts of flame-retardant filler aluminum hydroxide, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing in the process, and maintaining the vacuum degree of < -0.98 MPa; adding 202 parts of cabot R, soaking, stirring at revolution speed of 20R/min and rotation speed of 1000R/min for 30min, vacuumizing, and maintaining vacuum degree of < -0.98 MPa; then adding 1 part of vinyl trimethoxy silane, nitrogen protection, stirring for 15min at the revolution speed of 20r/min, finally adding 5 parts of N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy, 3 parts of dibutyl tin dilaurate and nitrogen protection, and stirring for 20min at the revolution speed of 20 r/min.
The beneficial effects of the invention are further illustrated below in conjunction with experimental data:
materials and methods:
1.1 test sites: tobacco stand Xinyou new material stock limited company test production workshop.
The surface dry time and 24-hour curing thickness test method refers to GB/T13477 standard;
tensile strength and elongation at break test methods refer to the GB/T528 standard;
the oxygen index and UL94 vertical burning grade test method refers to GB/T10707 standard;
1.2 experimental detection:
1.2.1 tensile shear strength: three groups of LCP sheets are taken, the glue spreading area is 12.5cm x 20mm, after lapping, the LCP sheets are cured for 24 hours at room temperature, the shearing strength is tested on a tensile tester, and data are recorded.
1.2.2 modulus
Adopting DMA test, selecting stretching mode, nitrogen flow rate is 20ml/min, liquid nitrogen refrigeration, heating rate is 1 ℃/min, and temperature range is-100-80 ℃. The results were averaged three times.
1.2.3 Tensile strength and elongation at break: three groups of dumbbell-shaped sample pieces with the thickness of 2mm and the middle width of 6mm are taken, and after curing for 7 days under the humidity of 60% RH at 25 ℃, the tensile strength of the adhesive body is tested on a universal testing machine. Data is recorded.
1.2.4 UL94 vertical burn test
The test used a british FTT company vertical burn tester with sample bar sizes of 125 x 13 x 3.2mm3, with 5 parallel samples tested in each group.
1.2.5 Tg Point test
Adopting DMA test, selecting stretching mode, nitrogen flow rate is 20ml/min, liquid nitrogen refrigeration, heating rate is 1 ℃/min, and temperature range is-100-80 ℃. The results were averaged three times.
1.3 test materials: the effect comparison was made for example 1, example 2, example 3, comparative example 1 and comparative example 2.
The experiment is consistent with other operations except different experimental treatments.
2. Results and analysis:
conclusion: examples 1-3 were moisture fast curable, and after a later stage were dark cured, the adhesive strength and adhesion and hardness were significantly improved over comparative example 1, slightly worse than comparative example 2, but significantly improved in cohesive force and elongation at break after 24 hours. Overall performance example 3 was optimal.
Therefore, the high-modulus flame-retardant MS adhesive synthesized by the invention can obviously improve the adhesive strength of the adhesive film to the base material and the cohesive force of the adhesive body, and the flame-retardant grade can reach UL 94V-0
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. The high-modulus flame-retardant MS adhesive is characterized by comprising the following components in parts by mass:
40-50 parts of silane modified polyether;
10-20 parts of self-made high Tg flame retardant siloxane modified resin;
5-10 parts of plasticizer;
20-40 parts of flame retardant filler;
1-5 parts of gas phase white carbon black;
0.1-1 part of water scavenger;
5-10 parts of aminosilane monomer;
1-3 parts of a catalyst;
the self-made high Tg and flame retardant siloxane modified resin has a structural formula shown in the following formula I:
i
Wherein R is methyl or ethyl;
the self-made high Tg and flame retardant siloxane modified resin comprises dihydroxyphenyl phosphate (diphenyl) and methyl orthosilicate or ethyl orthosilicate according to the mol ratio of 1: 2. is obtained by proportional reaction.
2. The high modulus, flame retardant MS adhesive of claim 1, wherein: the silane modified polyether is selected from one or two of dimethoxy silane end capped polyether and trimethoxy silane end capped polyether of KANEKA.
3. The high modulus, flame retardant MS adhesive of claim 1, wherein: the plasticizer is selected from one or more of Pasteur plasticizer Efka PL5382, pasteur plasticizer Hexamall DINCH, eastman168, and Aijing NEO-T.
4. The high modulus, flame retardant MS adhesive of claim 1, wherein: the flame-retardant filler is selected from one or two of magnesium hydroxide and aluminum hydroxide.
5. The high modulus, flame retardant MS adhesive of claim 1, wherein: the water remover is one or two selected from vinyl trimethoxy silane and vinyl triethoxy silane.
6. The high modulus, flame retardant MS adhesive of claim 1, wherein: the aminosilane monomer is selected from one or more of aminopropyl trimethoxysilane, N-aminoethyl-3-aminopropyl methyldimethoxy silane, N-aminoethyl-3-aminopropyl trimethoxysilane or N-beta- (aminoethyl) -gamma-aminopropyl trimethoxysilane.
7. The high modulus, flame retardant MS adhesive of claim 1, wherein: the catalyst is selected from one or more of an organotin catalyst, an organobismuth catalyst and an amine catalyst.
8. The high modulus, flame retardant MS adhesive of claim 1, wherein: the self-made high Tg and flame retardant siloxane modified resin is prepared by the following steps:
s1, adding dihydroxyphenyl (diphenyl) phosphate into a reaction kettle, heating to 120 ℃, continuously vacuumizing and dehydrating for 2 hours, wherein the mol ratio of the theoretical hydroxyl value of the dihydroxyphenyl (diphenyl) phosphate to methyl orthosilicate or ethyl orthosilicate is 1: 2. adding methyl orthosilicate or ethyl orthosilicate, stirring at a revolution speed of 20r/min for 10min, adding 1 part of dibutyltin dilaurate catalyst, vacuumizing to < -0.98Mpa, continuing stirring at a revolution speed of 20r/min and a rotation speed of 1000r/min until the byproduct ethanol reaches a theoretical value, stopping stirring and cooling to obtain a primary product;
s2, dissolving the preliminary product prepared in the step S1 in petroleum ether, carrying out high-speed centrifugal treatment at a centrifugal speed of 10000r/min, carrying out layered extraction, and drying to obtain purified self-prepared high Tg flame-retardant siloxane modified resin;
where R is methyl or ethyl.
9. The method for preparing a high modulus, flame retardant MS adhesive according to any of claims 1-8, comprising the steps of:
adding 40-50 parts of silane modified polyether, 10-20 parts of self-made high Tg flame-retardant siloxane modified resin and 5-10 parts of plasticizer into a reaction kettle, charging nitrogen, and stirring for 20min at the speed of revolution of 20 r/min; adding 20-40 parts of flame-retardant filler, heating to 120 ℃ after infiltration, stirring for 120min at the speed of revolution of 20r/min and rotation of 1000r/min, vacuumizing, and maintaining the vacuum degree of < -0.98 MPa; adding 1-5 parts of fumed silica, stirring for 30min at the speed of revolution of 20r/min and rotation of 1000r/min after infiltration, vacuumizing in the process, and keeping the vacuum degree of < -0.98 MPa; adding 0.1-1 part of a water removing agent, protecting nitrogen, stirring for 15min at the speed of revolution of 20r/min, and finally adding 5-10 parts of an aminosilane monomer, 1-3 parts of a catalyst and protecting nitrogen, and stirring for 20min at the speed of revolution of 20 r/min.
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