CN116685124A

CN116685124A - Intelligent gateway with heat dissipation function

Info

Publication number: CN116685124A
Application number: CN202310770922.XA
Authority: CN
Inventors: 叶征; 宋贝贝; 刘德丽; 王虎
Original assignee: Hefei Lingyan Technology Co ltd
Current assignee: Hefei Lingyan Technology Co ltd
Priority date: 2023-06-28
Filing date: 2023-06-28
Publication date: 2023-09-01

Abstract

The application relates to an intelligent gateway with a heat dissipation function, which belongs to the technical field of FTTR equipment and comprises a P-type semiconductor arranged on a beam splitter box body, a heat dissipation box arranged on the outer side of the beam splitter box body and an N-type semiconductor I arranged on the heat dissipation box; the first N-type semiconductor and the second P-type semiconductor are respectively connected with a power supply, a heat storage box is fixedly connected to one side of the heat dissipation box, and a heat storage disc is rotatably arranged in the heat storage box; a first radiating hole which can be communicated with the radiating box is formed in the heat storage box, and a plurality of heat storage balls for storing heat storage materials are embedded and fixed on the heat storage disc along the circumferential direction of the heat storage disc; the heat storage material is a phase change material. The heat collection box is fixedly connected with the heat storage box; the heat collection box is fixedly connected with an N-type semiconductor II which is electrically connected with a P-type semiconductor; and a second radiating hole which can be communicated with the heat collection box is formed in the heat storage box. The side wall of the heat storage box is fixedly connected with a humidity box for storing hygroscopic materials, and the hygroscopic materials absorb water and release heat. The application has the effect of improving the heat dissipation efficiency of the beam splitter.

Description

Intelligent gateway with heat dissipation function

Technical Field

The application relates to the technical field of FTTR equipment, in particular to an intelligent gateway with a heat dissipation function.

Background

The FTTR device comprises a gateway device comprising a master optical cat, a slave optical cat and an optical splitter. The master optical cat, the slave optical cat and the beam splitter are connected through optical fibers. Slave light cats are typically installed indoors; the optical splitter is used for distributing the downlink signals of the master optical cat to a plurality of slave optical cats or combining the uplink signals of the plurality of slave optical cats to the master optical cat. When FTTR equipment is installed in some enterprises, the optical splitters need to be installed outdoors under the influence of a field environment or an optical fiber line.

The beam splitter is generally arranged in a closed box body and is used for isolating the outside temperature and moisture. However, in summer, the outdoor temperature reaches 25-40 ℃, and the beam splitter needs to be cooled to avoid damage caused by high Wen Duiguang fiber. Meanwhile, in summer, heavy rain and sudden cooling weather are accompanied, so that the relative humidity inside the beam splitter can be saturated, and water drops are generated on the box wall of the box body of the beam splitter, and therefore, a dryer is required to be arranged in the box body of the beam splitter, so that the optical fibers are in a drying environment.

The semiconductor refrigeration is a thermoelectric couple pair formed by a P-type semiconductor and an N-type semiconductor, and the heat absorption and release phenomenon occurs when direct current passes through a loop formed by the two semiconductors. The semiconductor refrigeration can be applied to the beam splitter to provide a low-temperature environment for the beam splitter, but because the beam splitter is outdoor, the heat release end in the semiconductor refrigeration can not release heat rapidly, so that the heat still stays around the beam splitter, and the heat dissipation efficiency is lower.

Disclosure of Invention

In order to solve the problem that heat cannot be rapidly discharged from a heat-radiating end when a semiconductor refrigeration application and a light splitter are performed, the application provides an intelligent gateway with a heat-radiating function.

The intelligent gateway with the heat dissipation function adopts the following technical scheme:

an intelligent gateway with a heat dissipation function comprises a P-type semiconductor arranged on a beam splitter box body, a heat dissipation box arranged on the outer side of the beam splitter box body and an N-type semiconductor I arranged on the heat dissipation box; the first N-type semiconductor and the second P-type semiconductor are respectively connected with a power supply, a heat storage box is fixedly connected to one side of the heat dissipation box, and a heat storage disc is rotatably arranged in the heat storage box; the heat storage box is provided with a first heat dissipation hole which can be communicated with the heat dissipation box, and a plurality of heat storage balls for storing heat storage materials are embedded and fixed on the heat storage disc along the circumferential direction of the heat storage disc; the heat storage material is a phase change material.

Optionally, a heat collection box is fixedly connected to the heat storage box; an N-type semiconductor II is fixedly connected to the heat collection box, and the N-type semiconductor II is electrically connected with the P-type semiconductor; and a second radiating hole which can be communicated with the heat collection box is formed in the heat storage box.

Optionally, a humidity box for storing hygroscopic materials is fixedly connected to the side wall of the heat storage box, and the hygroscopic materials absorb water and release heat.

Optionally, a dehumidifier box communicated with the beam splitter box body is fixedly connected to the beam splitter box body, a rotatable dehumidifier disk is arranged in the dehumidifier box, and a plurality of dehumidification holes are uniformly distributed on the dehumidifier disk along the circumferential direction of the dehumidifier disk; a mesh bag for placing a drying agent is arranged in the dehumidification hole; a cover plate for sealing is fixed on one side of the dehumidifying box, which is close to the beam splitter box body; and a heat dissipation hole III is formed in one side, close to the heat storage box, of the dehumidifying box, so that the heat collection box is communicated with the dehumidifying box.

Optionally, a micro motor for driving the heat storage disc to rotate is arranged on the inner wall of the heat storage box, and an output shaft of the micro motor is fixedly connected with the heat storage disc; the side wall of the heat storage disc, which is close to the dehumidification disc, is fixedly connected with a telescopic pipe; the telescopic pipe comprises a pipe body and a pipe shaft which is arranged in the pipe body in a sliding manner; an extension spring is fixedly arranged in the pipe body, and the end part of the extension spring is fixedly connected with the pipe shaft and is used for driving the pipe to reset in the pipe body; the dehumidification disc is provided with an insertion hole which can be inserted with the tube shaft; a preformed hole capable of penetrating through the pipe shaft is formed in the dehumidifying box; an electromagnet is fixedly connected in the reserved hole, and a magnetic ring which can be attracted by the electromagnet is rotationally connected to the outer circumferential surface of the tube shaft.

Optionally, a rainwater collecting box is fixedly connected to the heat storage box; the rainwater collecting box comprises a collecting box and a water level box fixed at the bottom of the collecting box; a water inlet hole communicated with the water level box is formed in the bottom surface of the collecting box; a floating block is arranged in the water level box in a sliding manner along the circumferential direction of the water level box; a chute I is formed in the bottom of the water level box; a pressing block is arranged in the first chute in a vertical sliding manner; the bottom of the pressing block is fixedly provided with a first spring, and the bottom surface of the first spring is fixedly connected with the inner bottom wall of the chute and is used for driving the pressing block to reset upwards; a valve groove communicated with the first chute is formed in the side wall of the water level box, and a valve plate is slidably arranged in the valve groove; the side wall of the water level box is provided with a water outlet hole I and a water outlet hole II which are respectively communicated with the water level box, the outer wall of the water level box is fixedly connected with a water outlet pipe I communicated with the water outlet hole I and a water outlet pipe II communicated with the water outlet hole II, the bottom end of the water outlet pipe II is communicated with the humidity box, and a water outlet hole III is formed in the valve plate.

Optionally, a switch groove is formed in the inner top surface of the water level box; a sliding sheet is arranged in the switch groove in a vertical sliding manner; a first switch is arranged on a connecting circuit of the first N-type semiconductor and the P-type semiconductor, and comprises a first stator and a first rotor which can be electrically connected; a second switch is arranged on a connecting circuit of the second N-type semiconductor and the P-type semiconductor, and comprises a second stator and a second moving sheet which can be electrically connected; the side wall of the sliding vane is fixed with a guide plate, and the inner side wall of the switch groove is provided with a guide groove which can be vertically and slidably connected with the guide plate; the first moving plate is fixed on the bottom surface of the guide plate, and the second moving plate is fixed on the top surface of the guide plate; the first stator is fixed on the bottom surface of the guide groove, and the second stator is fixed on the top surface of the guide groove.

Optionally, a second chute communicated with the first chute is formed at the bottom of the water level box; a pressing plate is arranged in the second chute along the circumferential direction of the water level box in a sliding manner; the bottom end of the pressing plate can be in contact with the pressing block, and inclined planes are respectively formed on the contact surfaces of the pressing plate and the pressing block; the top of the second chute is fixedly provided with a first magnet; a second magnet which can magnetically attract the first magnet is fixed on the side wall of the floating block; the second top of the chute is provided with a first communication hole communicated with the water level box, and the pressing plate is provided with a second communication hole along the thickness direction of the pressing plate.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the application provides a radiating effect for the beam splitter in a semiconductor refrigeration mode; meanwhile, in order to discharge the heat released by the N-type plate conductor as soon as possible, the heat storage material is arranged, and the heat released by the semiconductor is absorbed by utilizing the heat absorption effect of the heat storage material during phase change, so that the heat dissipation efficiency is improved;

2. the heat storage material absorbs heat, the purpose of making the heat storage material phase change and release heat is achieved by reducing the temperature of the environment where the heat storage material is positioned, and meanwhile, the principle that the semiconductor can be continuously cooled when the temperature difference exists in the environment is continuously utilized, so that the power consumption of a power supply is reduced;

3. according to the application, by utilizing the principle that part of the moisture absorption material reacts with water to form crystals and absorb heat, the moisture absorption material reacts with water to absorb heat in rainy weather, so that the phase change of the heat storage material is promoted and the heat is released; and meanwhile, the heat released by the heat storage material is utilized for the thermal regeneration of the drying agent, so that the drying agent can be ensured to be recycled.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipating system, a dehumidifying system, and a heat storage unit according to an embodiment of the present application.

Fig. 2 is a schematic structural view of a rainwater collecting tank according to an embodiment of the present application.

Fig. 3 is a cross-sectional view of a thermal storage tank according to an embodiment of the present application.

Fig. 4 is a cross-sectional view of a dehumidifying box according to an embodiment of the present application.

Fig. 5 is a cross-sectional view of a rainwater collection tank according to an embodiment of the present application.

Fig. 6 is an enlarged schematic view at a in fig. 5.

Reference numerals: 1. a beam splitter box; 11. a P-type semiconductor; 12. a tube body; 13. a tube shaft; 14. a tension spring; 15. a jack; 16. a preformed hole; 17. an electromagnet; 18. a magnetic ring; 2. a heat dissipation system; 21. a heat radiation box; 22. an N-type semiconductor I; 3. a dehumidification system; 31. an N-type semiconductor II; 4. a heat storage unit; 41. a heat storage tank; 42. a heat storage plate; 43. a first heat dissipation hole; 44. a heat storage ball; 5. a dehumidifying box; 51. a humidity box; 52. a cover plate; 53. a dehumidifying tray; 54. dehumidifying holes; 55. a mesh bag; 6. a heat collection box; 61. a second heat dissipation hole; 62. a heat dissipation hole III; 63. a heat dissipation hole IV; 7. a rainwater collection tank; 71. a collection box; 72. a sliding sheet; 73. a water inlet hole; 74. a floating block; 75. a waterproof ring; 8. a switch groove; 81. a stator I; 82. a first moving plate; 83. a second stator; 84. a second moving plate; 85. a guide piece; 86. a guide groove; 9. a water level box; 91. a first chute; 92. a second chute; 93. briquetting; 94. a first spring; 95. a pressing plate; 96. an inclined plane; 97. a first magnet; 98. a second communicating hole; 99. a first communicating hole; 10. a valve plate; 101. a valve spool; 102. a water outlet hole I; 103. a water outlet hole II; 104. a first water outlet pipe; 105. and a second water outlet pipe.

Detailed Description

The application is described in further detail below with reference to fig. 1-6.

The embodiment of the application discloses an intelligent gateway with a heat dissipation function. Referring to fig. 1 and 2, the gateway with heat dissipation function includes a heat dissipation system 2 for reducing the temperature in the beam splitter box 1, a dehumidification system 3 for reducing the humidity in the beam splitter box 1, and a heat storage unit 4, where the heat storage unit 4 is used for storing heat released by the heat dissipation system 2. The heat dissipation system 2 comprises a P-type semiconductor 11 arranged in the beam splitter box body 1 and an N-type semiconductor I22 arranged outside the beam splitter box body 1; the P-type semiconductor 11 is used for absorbing heat in the beam splitter box 1, the N-type semiconductor 22 is used for releasing heat to the outside, and the heat released by the N-type semiconductor 22 is collected by the heat storage unit 4. The dehumidification system 3 includes a dehumidification box 5 connected to the beam splitter box 1 and an N-type semiconductor two 31 disposed outside the beam splitter box 1. A desiccant is arranged in the dehumidification box 5 and used for absorbing moisture in the beam splitter box body 1; the second N-type semiconductor 31 is connected to the P-type semiconductor 11; when the heat storage unit 4 releases heat to the outside, the heat absorption effect of the P-type semiconductor 11 is triggered by generating a temperature difference between the second N-type semiconductor 31 and the P-type semiconductor 11; the heat released by the heat storage unit 4 is also used for regenerating the desiccant.

Referring to fig. 1, the heat dissipation system 2 specifically includes a P-type semiconductor 11 disposed on the beam splitter box 1, a heat dissipation box 21 disposed outside the beam splitter box 1, and an N-type semiconductor one 22 disposed on the heat dissipation box 21. The P-type semiconductor 11 is embedded on the side wall of the beam splitter box 1, so that the cold end of the P-type semiconductor 11 is positioned in the beam splitter box 1, and the hot end is positioned outside the beam splitter box 1. The first N-type semiconductor 22 is embedded on the side wall of the box body of the heat dissipation box 21, so that the hot end of the first N-type semiconductor 22 is positioned in the heat dissipation box 21, and the cold end is positioned outside the heat dissipation box 21. The hot end of the N-type semiconductor I22 and the cold end of the P-type semiconductor 11 are respectively connected with a power supply; and a switch I is arranged on the connection circuit of the N-type semiconductor I22 and the P-type semiconductor 11.

After the circuits of the first N-type semiconductor 22 and the second P-type semiconductor 11 are conducted, under the action of a power supply, current flows from the hot end of the first N-type semiconductor 22 to the cold end of the second P-type semiconductor 11, the cold end of the second P-type semiconductor 11 absorbs heat of the light splitting box, and the hot end of the first N-type semiconductor 22 emits heat.

Referring to fig. 3, the heat storage unit 4 specifically includes a heat storage tank 41 connected to the heat radiation tank 21, and a heat storage plate 42 rotatably provided in the Chu Rexiang. The heat storage tank 41 is provided with a first heat radiation hole 43 which can be communicated with the heat radiation tank 21, so that heat exchange with the first N-type semiconductor 22 is facilitated. The cross sections of the heat storage box 41 and the heat storage disc 42 are all round; a plurality of heat storage balls 44 are embedded and fixed on the heat storage disk 42 along the circumferential direction of the heat storage disk; the heat storage balls 44 are hollow spheres for storing heat storage material. The heat storage balls 44 are made of heat transfer materials; when the heat storage ball 44 rotates to the first radiating hole 43, the heat storage material absorbs the heat released by the first N-type semiconductor 22 and changes phase, so that the first N-type semiconductor 22 is subjected to heat radiation treatment; the heat storage tank 41 and the heat storage disc 42 are made of heat insulation materials, so that the interference of the external temperature to the heat storage materials is reduced, and the interference to the heat storage materials in the adjacent heat storage balls 44 when the heat storage materials in each heat storage ball 44 are subjected to phase change is also reduced. The side walls of the heat-dissipating box 21 are provided with ventilation holes for dissipating excessive heat not absorbed by the heat-storing material.

In this embodiment, the heat storage material is pentaerythritol. The phase transition temperature of pentaerythritol is 16-18 ℃. When pentaerythritol contacts with the N-type semiconductor 22 in an exothermic state, heat is absorbed and is converted from a crystalline state to a plastic crystalline state, and heat is dissipated from the hot end of the N-type semiconductor 22. When pentaerythritol contacts a cold source, the plastic crystal state is changed into a crystalline state, and heat is released. By sequentially contacting the N-type semiconductor one 22 with a plurality of pentaerythritol, heat dissipation can be performed on the N-type semiconductor one 22.

Referring to fig. 3, a micro motor for driving the heat storage disc 42 to rotate is provided on the inner wall of the heat storage tank 41, and an output shaft of the micro motor is fixedly connected with the heat storage disc 42 coaxially. The micro motor may be a stepper motor for driving the thermal storage disc 42 to rotate by a unit angle in a unit time, so that the thermal storage ball 44 stops rotating when rotating to the first heat dissipation hole 43 and stays at the first heat dissipation hole 43 for a unit time, so that the thermal storage material can absorb the heat emitted by the first N-type semiconductor 22 and perform phase change.

Referring to fig. 4, the dehumidification system 3 specifically includes a dehumidification tank 5 fixedly connected to the beam splitter box body 1, a humidity box 51 fixedly connected to the heat storage tank 41 for placing a water absorbing material, and a rainwater collection tank 7 fixedly connected to the heat storage tank 41 for measuring a rainfall.

Referring to fig. 4, the beam splitter box 1 is fixed to the dehumidifying box 5 in a direction away from the heat storage box 41, and the beam splitter box 1 communicates with the dehumidifying box 5. A rotatable dehumidification disc 53 is arranged in the dehumidification box 5, and a plurality of dehumidification holes 54 are uniformly distributed on the dehumidification disc 53 along the circumferential direction of the dehumidification disc. A mesh bag 55 is provided in each of the dehumidifying holes 54. The mesh bag 55 is used to house a desiccant. In this embodiment, the cross section of the dehumidifying box 5 is circular; the cross section of the beam splitter box body 1 is semicircular, and the beam splitter box body 1 is covered on the dehumidification box 5, so that half area of the dehumidification disc 53 is covered on the beam splitter box body 1. A semicircular cover plate 52 is fixed on one side of the dehumidification box 5 close to the beam splitter box body 1; the cover plate 52 is matched with the beam splitter box body 1 to cover the whole round surface of the dehumidification box 5. The side plane of the cover plate 52 is fixedly connected with the outer wall of the beam splitter box body 1 and is used for reducing water molecules from entering the dehumidification box 5.

In this embodiment, the desiccant is montmorillonite, which adsorbs water molecules by means of internal cations. After the temperature is raised, water molecules in the montmorillonite can be desorbed, and the water absorption capacity of the montmorillonite is recovered through thermal regeneration.

In sunny days, the dehumidifying disc 53 is in a static state, so that the desiccant can dehumidify the beam splitter box 1. In rainy weather, the desiccant tray 53 rotates along with the thermal storage tray 42 for replacing the desiccant, so that the desiccant initially located in the coverage area of the cover plate 52 rotates into the coverage area of the beam splitter box 1. The dehumidifying box 5 and the dehumidifying disk 53 are made of heat insulation materials, so that the interference of external temperature to the beam splitter box body 1 is reduced.

Referring to fig. 4, a heat collecting tank 6 is fixedly connected to a circular plane of the heat storing tank 41; the heat collection box 6 is a cylinder with two open ends, the second N-type semiconductor 31 is embedded on the peripheral wall of the heat collection box 6, the hot end of the second N-type semiconductor 31 is positioned in the heat collection box 6, and the cold end is positioned outside the heat collection box 6. The hot end of the second N-type semiconductor 31 is connected with the cold end of the P-type semiconductor 11, and a second switch is arranged on a connecting circuit of the second N-type semiconductor 31 and the P-type semiconductor 11. When the temperature difference occurs between the heat collection box 6 and the beam splitter box body 1 and the temperature of the heat collection box 6 is higher, the second N-type semiconductor 31 and the second P-type semiconductor 11 generate current due to the temperature difference, and meanwhile the second N-type semiconductor 31 emits heat and the second P-type semiconductor 11 absorbs heat.

Referring to fig. 4, the heat radiation box 21 and the heat collection box 6 are fixedly connected to the dehumidifying box 5 at a side away from the heat storage box 41 and away from the plane of the beam splitter box 1. The heat storage tank 41 is provided with a second heat radiation hole 61 which can be communicated with the heat collection tank 6, so that heat exchange with the second N-type semiconductor 31 is facilitated. The heat-dissipating tank 21 and the heat-collecting tank 6 are symmetrically arranged along the radial line of the heat-storing tank 41, and when one heat-storing ball 44 on the heat-storing plate 42 rotates to the position of the first heat-dissipating hole 43, the other heat-storing ball 44 rotates to the position of the second heat-dissipating hole 61. When the heat storage balls 44 release heat, a temperature difference occurs between the heat collection box 6 and the beam splitter box 1, and the second N-type semiconductor 31 releases heat. The circular plane of the dehumidification box 5, which is close to the heat storage box 41, is provided with a third heat dissipation hole 62 which is coaxially arranged with the second heat dissipation hole 61, so that the heat collection box 6 is communicated with the dehumidification box 5. When the desiccant disk 53 stops rotating, the mesh bag 55 is positioned at the third heat radiation hole 62, so that the desiccant in the mesh bag 55 is thermally regenerated. The cover plate 52 is provided with a heat dissipation hole IV 63 which is coaxially arranged with the heat dissipation hole III 62; when the dehumidifying hole 54 rotates to the fourth radiating hole 63, air convection can occur at two sides of the dehumidifying hole 54, so as to discharge the surplus heat released by the second N-type semiconductor 31 and the heat storage material.

Referring to fig. 2, a humidity box 51 is used to store the moisture absorbing material; the hygroscopic material absorbs heat after absorbing moisture and reduces the ambient temperature below the phase transition temperature of the heat storage material, thereby causing the heat storage material to undergo a phase transition and emit heat. The humidity box 51 is embedded on the side wall of the heat storage box 41 far away from the dehumidifying box 5, and the humidity box 51 is coaxially arranged with the third 62 and fourth 63 heat dissipation holes. The side wall of the humidity box 51 far away from the third discrete heat hole 62 is a closed side, and the side wall close to the third discrete heat hole 62 is an open side, so that heat exchange with the outside when the moisture absorption material absorbs moisture is reduced; the side wall of the humidity box 51 near the third heat dissipation hole 62 is fixedly provided with a heat transfer plate made of a heat transfer material.

In this embodiment, the hygroscopic material is calcium chloride or magnesium chloride. When calcium chloride or magnesium chloride contacts with a small amount of water, crystalline hydrate is generated, and environmental heat is absorbed; when the pentaerythritol in the crystalline state rotates to the position of the third 62 radiating holes, the pentaerythritol encounters the moisture absorbing material in the heat absorbing state, and the temperature in the third 62 radiating holes is reduced below the phase transition temperature of the pentaerythritol, the pentaerythritol is converted into the crystalline state from the plastic crystalline state, and heat is released. The heat emitted by pentaerythritol can cause a temperature difference between the second N-type semiconductor 31 and the P-type semiconductor 11, and promote the second N-type semiconductor 31 to emit heat, and the P-type semiconductor 11 to absorb heat. Meanwhile, heat emitted by pentaerythritol and the N-type semiconductor II 31 enters the third heat dissipation hole 62, and the drying agent is subjected to heat regeneration treatment.

Referring to fig. 3 and 4, a telescopic tube is fixedly connected to the side wall of the heat storage disc 42, which is close to the dehumidification disc 53; the telescopic pipe comprises a pipe body 12 and a pipe shaft 13 which is arranged in the pipe body 12 in a sliding manner; in order to enable the tube shaft 13 to rotate with the tube body 12, the longitudinal sections of the tube shaft 13 and the tube body 12 may be square. An extension spring 14 is fixedly arranged in the pipe body 12, and the end part of the extension spring 14 is fixedly connected with the pipe shaft 13 and is used for driving the pipe shaft 13 to reset towards the inside of the pipe body 12. The center of the dehumidification disc 53 is provided with a jack 15 which can be spliced with the tube shaft 13; for the tube shaft 13 to drive the dehumidifying disk 53 to rotate, the insertion hole 15 may be provided as a square hole; the wall of the heat storage tank 41 and the wall of the dehumidifying tank 5 are provided with preformed holes 16 which can be penetrated by the pipe shafts 13.

Referring to fig. 4, an electromagnet 17 is fixedly connected in a preformed hole 16 of the dehumidification box 5, the electromagnet 17 is connected in series with a switch II, and after the switch II is closed, the electromagnet 17 is conducted. The outer peripheral surface of the tube shaft 13 is rotationally connected with a magnetic ring 18 which can be adsorbed with an electromagnet 17; the outer circumferential surface of the tube shaft 13 can be provided with an annular groove, so that the magnetic ring 18 is rotatably arranged in the annular groove. After the electromagnet 17 is electrified to adsorb the magnetic ring 18, the tube shaft 13 is spliced with the jack 15, so that the dehumidification disc 53 rotates along with the heat storage disc 42; after the electromagnet ring 18 is powered off, the tension spring 14 drives the pipe shaft 13 to be separated from the jack 15.

Referring to fig. 5, the rainwater collecting tank 7 includes a fan-shaped collecting tank 71 and a water level tank 9 fixed to the bottom of the collecting tank 71. The longitudinal section of the collecting box 71 is arc-shaped, and the water level box 9 is attached to the bottom arc surface of the collecting box 71. The bottom surface of the water level box 9 is provided with a water inlet 73 communicated with the water level box 9; the collecting box 71 is used for collecting rainwater, and the water level of the water level box 9 rises along with the water level in the collecting box 71. A floating block 74 is arranged in the water level box 9 in a sliding manner along the circumferential direction of the water level box; the longitudinal section of the floating block 74 is arc-shaped, so that the floating block can conveniently move along with the water level in the water level box 9. The inner top surface of the water level box 9 is provided with a switch groove 8. A sliding sheet 72 is arranged in the switch groove 8 in a vertical sliding manner; the slide sheet 72 is positioned outside the switch groove 8 and is fixedly sleeved with a waterproof ring 75, and the slide sheet 72 and the waterproof ring 75 are made of waterproof materials; after the slide sheet 72 moves upwards, the waterproof ring 75 can be abutted against the inner top surface of the water level box 9, so as to prevent the water level from rising and entering the switch groove 8.

Referring to fig. 6, the switch one includes a stator one 81 and a rotor one 82, and after the stator one 81 and the rotor one 82 are in electrical contact, the N-type semiconductor one 22 is in electrical communication with the P-type semiconductor 11; the second switch includes a second stator 83 and a second rotor 84, and the second N-type semiconductor 31 is electrically connected to the P-type semiconductor 11 after the second stator 83 and the second rotor 84 are electrically contacted. The side wall of the sliding sheet 72 is fixed with a guide sheet 85, and the inner side wall of the switch groove 8 is provided with a guide groove 86 which can be vertically and slidably connected with the guide sheet 85. The first moving plate 82 is fixed to the bottom surface of the guide plate 85, and the second moving plate 84 is fixed to the top surface of the guide plate 85. The first stator 81 is fixed to the bottom surface of the guide groove 86, and the second stator 83 is fixed to the top surface of the guide groove 86. After the water level rises, the floating block 74 contacts the sliding sheet 72 and enables the sliding sheet 72 to rise, and the switch I is closed and the switch II is opened; after the water level drops, the floating block 74 descends under the action of self gravity, and the first switch is closed and the second switch is opened.

Referring to fig. 5, a first chute 91 and a second chute 92 which are mutually communicated are formed in an arc plate on one side of the water level box 9 away from the collecting box 71; the first chute 91 is arranged along the radial direction of the water level box 9 and is arranged at the end part of the arc plate, which is close to the vertical side wall of the water level box 9; the second chute 92 is disposed along the circumference of the arc plate. A pressing block 93 is arranged in the sliding way I91; the bottom of the pressing block 93 is fixedly provided with a first spring 94, and the bottom surface of the first spring 94 is fixedly connected with the inner bottom wall of the first chute 91 and is used for driving the pressing block 93 to reset upwards. An arc-shaped pressing plate 95 is arranged in the sliding way II 92, the bottom end of the pressing plate 95 can be in contact with the pressing block 93, and inclined planes 96 are respectively formed on the contact surfaces of the pressing plate 95 and the pressing block 93; the inclined surfaces 96 are located at the bottom angular positions of the pressing blocks 93 and the top angular positions of the pressing plates 95, respectively. As the water level in the collection box 71 rises, the pressing block 93 moves downward by the water pressure and pushes the pressing plate 95 to slide upward through the inclined surface 96; after the water level drops, the pressing block 93 is reset under the action of the first spring 94, and the pressing plate 95 slides downwards under the action of self gravity. An overflow hole is formed in the arc wall of one side, far away from the collecting box 71, of the second chute 92, and is used for discharging accumulated water flowing into the first chute 91 and the second chute 92, and the overflow hole is arranged at the bottom of the water level box 9.

Referring to fig. 5, a first magnet 97 is fixed on the arc wall at the top of the second chute 92 and at the side far away from the collection box 71; a second magnet which can magnetically attract the first magnet 97 is fixed on the side wall of the floating block 74 far away from the collection box 71; a first communication hole 99 communicated with the water level box 9 is formed in the arc wall, close to the collection box 71, of the top of the second sliding groove 92, so that when the floating block 74 rises to the top of the water level box 9, the floating block 74 is attracted through the magnetic attraction effect of the first magnet 97 and the second magnet, and the floating block 74 is used for preventing the water level from fluctuating up and down when the water level fluctuates up and down; when the float block 74 is lifted up to the top of the water level box 9, the second stator 83 and the second rotor 84 can be kept in electrical contact by the attraction between the first magnet 97 and the second magnet. One end of the pressing plate 95, which is far away from the pressing block 93, is made of a magnetic insulating material, and a second communication hole 98 is formed along the thickness direction of the pressing plate. When the pressing plate 95 moves upwards, the communication hole is aligned with the magnet II, so that the magnet I97 and the magnet II can be magnetically attracted. When the pressing plate 95 moves downwards, the first communicating hole 99 is misplaced with the second magnet, and the first magnet 97 and the second magnet are separated by the magnetic insulating material on the pressing plate 95, so that the floating block 74 loses the positioning function of the second magnet, and the floating block 74 can descend along with the water level; at this time, the first stator 81 is in electrical contact with the first rotor 82, and the pressure plate 95 is lowered due to the lowering of the water level while the pressure block 93 is raised, so that the water level in the collection box 71 tends to be lowered.

Referring to fig. 5, a valve groove 101 communicating with the first chute 91 is provided in a vertical sidewall of the water level box 9, and a valve plate 10 is slidably provided in the valve groove 101. A first water outlet hole 102 and a second water outlet hole 103 which are respectively communicated with the water level box 9 are formed in the vertical side wall of the water level box 9, a first water outlet pipe 104 communicated with the first water outlet hole 102 and a second water outlet pipe 105 communicated with the second water outlet hole 103 are fixedly connected to the outer wall of the water level box 9, the bottom end of the second water outlet pipe 105 is communicated with the humidity box 51, and water discharged from the water level box 9 is introduced into the humidity box 51 through the second water outlet pipe 105 to react with a moisture absorption material; a water hole is opened at the bottom of the humidity chamber 51 to drain the surplus water. The valve plate 10 is provided with a water outlet hole III. When the valve plate 10 moves upwards, the water outlet hole III coincides with the water outlet hole I102; the speed of water flow out of the water level box 9 can be controlled by adjusting the aperture of the water outlet hole I102; when the speed of the external water entering the collection box 71 is smaller than the water outlet speed of the first water outlet pipe 104, the water level of the collection box 71 cannot be increased. When the rainfall exceeds the water outlet speed of the first water outlet pipe 104, the water level in the collecting box 71 and the water level box 9 can keep rising trend. When the valve plate 10 moves downwards, the water outlet hole III coincides with the water outlet hole II 103; the valve plate 10 is fixedly connected with the pressing plate 95, so that after the water level in the collecting box 71 rises, the valve plate 10 can move downwards along with the pressing plate 95, and water flow is introduced into the humidity box 51 to react, namely, when the rainfall exceeds the discharge amount of the first water outlet hole 102, the moisture absorption material is controlled to react with water by adjusting the valve plate 10. By setting the aperture of the water outlet hole two 103, the water level rising speed in the collecting box 71 can be kept equal to the water level rising speed when the valve plate 10 is in the initial state when the valve plate 10 moves downwards.

The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims

1. An intelligent gateway with a heat dissipation function comprises a P-type semiconductor (11) arranged on a beam splitter box body (1), a heat dissipation box (21) arranged on the outer side of the beam splitter box body (1) and an N-type semiconductor I (22) arranged on the heat dissipation box (21); the first N-type semiconductor (22) and the second P-type semiconductor (11) are respectively connected with a power supply, and are characterized in that: a heat storage box (41) is fixedly connected to one side of the heat dissipation box (21), and a heat storage disc (42) is rotationally arranged in the heat storage box (41); a first radiating hole (43) which can be communicated with the radiating box (21) is formed in the heat storage box (41), and a plurality of heat storage balls (44) for storing heat storage materials are embedded and fixed on the heat storage disc (42) along the circumferential direction of the heat storage disc; the heat storage material is a phase change material.

2. The intelligent gateway with heat dissipation function according to claim 1, wherein: a heat collection box (6) is fixedly connected to the heat storage box (41); an N-type semiconductor II (31) is fixedly connected to the heat collection box (6), and the N-type semiconductor II (31) is electrically connected with the P-type semiconductor (11); and a second radiating hole (61) which can be communicated with the heat collection box (6) is formed in the heat storage box (41).

3. The intelligent gateway with heat dissipation function according to claim 2, wherein: the side wall of the heat storage box (41) is fixedly connected with a humidity box (51) for storing a hygroscopic material, and the hygroscopic material absorbs water and releases heat.

4. An intelligent gateway with heat dissipation function according to claim 2 or 3, wherein: a dehumidifying box (5) communicated with the beam splitter box body (1) is fixedly connected to the beam splitter box body (1), a rotatable dehumidifying disc (53) is arranged in the dehumidifying box (5), and a plurality of dehumidifying holes (54) are uniformly distributed on the dehumidifying disc (53) along the circumferential direction of the dehumidifying disc; a mesh bag (55) for placing a drying agent is arranged in the dehumidification hole (54); a cover plate (52) for sealing is fixed on one side of the dehumidifying box (5) close to the beam splitter box body (1); and a heat dissipation hole III (62) is formed in one side, close to the heat storage box (41), of the dehumidification box (5), so that the heat collection box (6) is communicated with the dehumidification box (5).

5. The intelligent gateway with heat dissipation function according to claim 4, wherein: a miniature motor for driving the heat storage disc (42) to rotate is arranged on the inner wall of the heat storage box (41), and an output shaft of the miniature motor is fixedly connected with the heat storage disc (42); the side wall of the heat storage disc (42) close to the dehumidifying disc (53) is fixedly connected with a telescopic tube; the telescopic pipe comprises a pipe body (12) and a pipe shaft (13) which is arranged in the pipe body (12) in a sliding manner; an extension spring (14) is fixedly arranged in the pipe body (12), and the end part of the extension spring (14) is fixedly connected with the pipe shaft (13) and is used for driving the pipe shaft (13) to reset into the pipe body (12); an inserting hole (15) which can be inserted with the tube shaft (13) is formed in the dehumidifying disc (53); a preformed hole (16) capable of penetrating the pipe shaft (13) is formed in the dehumidifying box (5); an electromagnet (17) is fixedly connected in the reserved hole (16), and a magnetic ring (18) which can be adsorbed by the electromagnet (17) is rotationally connected to the outer peripheral surface of the tube shaft (13).

6. The intelligent gateway with heat dissipation function according to claim 3, wherein: a rainwater collecting box (7) is fixedly connected to the heat storage box (41); the rainwater collecting box (7) comprises a collecting box (71) and a water level box (9) fixed at the bottom of the collecting box (71); a water inlet hole (73) communicated with the water level box (9) is formed in the bottom surface of the collecting box (71); a floating block (74) is arranged in the water level box (9) in a sliding manner along the circumferential direction of the water level box; a first chute (91) is formed in the bottom of the water level box (9); a pressing block (93) is arranged in the first chute (91) in a vertical sliding manner; a first spring (94) is fixed at the bottom of the pressing block (93), and the bottom surface of the first spring (94) is fixedly connected with the inner bottom wall of the first chute (91) and is used for driving the pressing block (93) to reset upwards; a valve groove (101) communicated with the first chute (91) is formed in the side wall of the water level box (9), and a valve plate (10) is arranged in the valve groove (101) in a sliding manner; the water level box is characterized in that a first water outlet hole (102) and a second water outlet hole (103) which are respectively communicated with the water level box (9) are formed in the side wall of the water level box (9), a first water outlet pipe (104) communicated with the first water outlet hole (102) and a second water outlet pipe (105) communicated with the second water outlet hole (103) are fixedly connected to the outer wall of the water level box (9), the bottom end of the second water outlet pipe (105) is communicated with the humidity box (51), and a third water outlet hole is formed in the valve plate (10).

7. The intelligent gateway with heat dissipation function according to claim 6, wherein: a switch groove (8) is formed in the inner top surface of the water level box (9); a sliding sheet (72) is arranged in the switch groove (8) in a vertical sliding manner; a first switch (81) and a first moving plate (82) which can be electrically connected are arranged on a connecting circuit of the first N-type semiconductor (22) and the second P-type semiconductor (11); a second switch (83) and a second moving plate (84) which can be electrically connected are arranged on a connecting circuit of the second N-type semiconductor (31) and the second P-type semiconductor (11); a guide plate (85) is fixed on the side wall of the sliding plate (72), and a guide groove (86) which can be vertically and slidably connected with the guide plate (85) is formed in the inner side wall of the switch groove (8); the first moving plate (82) is fixed on the bottom surface of the guide plate (85), and the second moving plate (84) is fixed on the top surface of the guide plate (85); the first stator (81) is fixed on the bottom surface of the guide groove (86), and the second stator (83) is fixed on the top surface of the guide groove (86).

8. The intelligent gateway with heat dissipation function according to claim 7, wherein: a second chute (92) communicated with the first chute (91) is formed at the bottom of the water level box (9); a pressing plate (95) is arranged in the second chute (92) in a sliding manner along the circumferential direction of the water level box (9); the bottom end of the pressing plate (95) can be in contact with the pressing block (93), and inclined planes (96) are respectively formed on the contact surfaces of the pressing plate (95) and the pressing block (93); a first magnet (97) is fixedly arranged at the top of the second chute (92); a second magnet which can magnetically attract the first magnet (97) is fixed on the side wall of the floating block (74); the top of the second chute (92) is provided with a first communication hole (99) communicated with the water level box (9), and the pressing plate (95) is provided with a second communication hole (98) along the thickness direction of the pressing plate.