CN116678543A - Pressure transmitter and manufacturing method thereof - Google Patents
Pressure transmitter and manufacturing method thereof Download PDFInfo
- Publication number
- CN116678543A CN116678543A CN202310530090.4A CN202310530090A CN116678543A CN 116678543 A CN116678543 A CN 116678543A CN 202310530090 A CN202310530090 A CN 202310530090A CN 116678543 A CN116678543 A CN 116678543A
- Authority
- CN
- China
- Prior art keywords
- sleeve
- pressure
- joint
- welding
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000003466 welding Methods 0.000 claims abstract description 37
- 238000004544 sputter deposition Methods 0.000 claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 6
- 238000011179 visual inspection Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000004080 punching Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 2
- 238000002788 crimping Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention provides a pressure transmitter, which comprises a shell, a sputtering film sensor, a conversion circuit board and an electric connector, and is characterized in that the shell comprises a nut, a pressure inlet connector, a sleeve and a sleeve, wherein the pressure inlet connector is integrally formed, the pressure inlet connector is welded and fixed with the sputtering film sensor, the height of a welding interface between the pressure inlet connector and the sputtering film sensor is reduced, the sleeve is fixed on an inner ring step of the pressure inlet connector, the sleeve is fixed on an outer ring step of the pressure inlet connector, the pressure inlet connector is integrally formed, the height of the welding interface between the pressure inlet connector and the sputtering film sensor is reduced, the influence of welding stress on the output of the sensor is reduced, the precision grade is improved, and the response time is reduced. The bonding plate adopts the metal sleeve to cover the edge and fix, compares the mode of punching and fixing with the screw rod on other same type product bases, has guaranteed the integrality of advancing the crimping base to the influence of vibrations, impact has been reduced.
Description
Technical Field
The invention belongs to the technical field of sensors, relates to a pressure transmitter, and particularly relates to a sputtering film pressure transmitter and a manufacturing method thereof.
Background
The sensor is widely applied to various industrial self-control environments, and relates to various industries such as water conservancy and hydropower, railway traffic, intelligent building, production self-control, petrochemical industry, oil wells, electric power, ships, machine tools, pipelines and the like. The main stream products can be divided into a diffusion silicon pressure transmitter, a ceramic pressure transmitter, a sputtering film pressure transmitter and the like because of different pressure sensitive cores. The sputtering film pressure transmitter is generally used in the field of high-end industrial manufacturing due to the excellent performance, and cannot be popularized to low-end pressure measurement occasions.
Most of the mainstream sputtering film pressure transmitters in the current market adopt foreign imported pressure sensitive cores, the pressure inlet joint has complex structural design, and some pressure inlet joints also have PCB brackets, so that the pressure inlet joint has more parts and complex assembly process, thereby causing higher cost and high price.
Disclosure of Invention
The invention aims to provide a pressure transmitter which overcomes the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a pressure transmitter, includes shell, sputtering film sensor, conversion circuit board and electrical connector, the shell includes nut, advances to press joint, sleeve pipe and sleeve, and wherein, advances to press joint and adopt integrated into one piece, advance to press joint and sputtering film sensor welded fastening to reduced advance to press joint and sputtering film sensor's welding interface height, the sleeve pipe is fixed to advance to press joint inner circle step, and the sleeve pipe is fixed to advance to press joint outer lane step.
As an improvement of the pressure transmitter and the manufacturing method thereof, the conversion circuit board comprises a key plate, a conversion plate and a transmitting plate, wherein the key plate is electrically connected with the sputtering film sensor through a key alloy wire, and the key plate is sequentially connected with the conversion plate and the transmitting plate.
As an improvement of the pressure transmitter, the upper part of the inner side of the sleeve is provided with a step, and the sleeve is fixed with a key plate through the step.
As an improvement of the pressure transmitter, the electric connector is an aviation socket, one end of the electric connector is electrically connected with the transmitting plate, and the other end of the electric connector penetrates through the sleeve.
As an improvement of the pressure transmitter, a sealing ring is arranged between the electric joint and the sleeve.
The invention aims to provide a manufacturing method of a pressure transmitter, which overcomes the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows: a method for manufacturing a pressure transmitter comprises the following steps,
cleaning and drying the pressure inlet joint, the sleeve and the sleeve, welding the pressure inlet joint and the sputtering film sensor by a welding machine, performing visual inspection under a microscope to detect whether obvious welding defects exist, connecting the pressure inlet joint to a barometer after visual inspection, performing air pressure leakage detection, and welding the sleeve to the pressure inlet joint after the detection is qualified;
welding the contact pins on the bonding plates in sequence, putting the bonding plates into the sleeve, enabling bonding points on the bonding plates to correspond to bonding points of the sputtering film pressure sensor one by one, extruding the edges of the sleeve by using an edge wrapping tool, and fixing the bonding plates on the pressure inlet joint;
bonding the bonding alloy wire between the sputtering film pressure sensor and the bonding plate by using a bonding machine, and coating elastic silica gel to protect the sputtering film pressure sensor and the bonding alloy wire;
welding contact pins on a conversion plate, fixing the conversion plate on a bonding plate, welding a transmission plate on the conversion plate, placing the conversion plate in a high-temperature oven for high-temperature storage, and removing residual welding stress at a joint part;
after the high-temperature storage is finished, debugging and calibrating the pressure transmitter with the welded circuit board, connecting an electric joint to the transmitting board and the sleeve, sleeving a sealing ring at the threaded joint of the electric joint and the sleeve for sealing and fixing, and welding the sleeve and the pressure inlet joint into a whole by using a laser welder;
and finishing the factory test in the sensor test system.
Compared with the prior art, the invention has the beneficial effects that: the pressure inlet joint is integrally processed and formed, the height of a welding interface with the sputtering film sensor is reduced, the influence of welding stress on the output of the sensor is reduced, the precision level of the invention is improved, and the response time is reduced. The bonding plate is fixed by adopting the metal sleeve for edge covering, compared with the mode of punching holes on other product bases of the same type, the integrity of the pressure-inlet bonding base is ensured, and the influence of vibration and impact on the pressure-inlet bonding base is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic diagram of a pressure transmitter of the present invention;
FIG. 2 is a schematic cross-sectional view of a pressure transmitter of the present invention.
Wherein, 1, the nut; 2. a pressure inlet joint; 3. sputtering a thin film sensor; 4. a sleeve; 5. a bonding plate; 6. a bond alloy wire; 7. a conversion plate; 8. a transmitting plate; 9. aviation socket; 10. a sleeve; 11. and (3) sealing rings.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 2, a pressure transmitter comprises a housing, a sputtering film sensor 3, a conversion circuit board and an electric connector, wherein the housing comprises a nut 1, a pressure inlet connector 2, a sleeve 4 and a sleeve 10, the pressure inlet connector 2 is integrally formed, the pressure inlet connector 2 is welded and fixed with the sputtering film sensor 3, the height of a welding interface between the pressure inlet connector 2 and the sputtering film sensor 3 is reduced, the sleeve 4 is fixed on an inner ring step of the pressure inlet connector 2, and the sleeve 10 is fixed on an outer ring step of the pressure inlet connector 2.
The nut 1 is used for punching the hexagonal hole, the function of the nut is mainly to match with the pressure inlet joint 2 to fix the pressure transmitter through threads, the hexagonal hole of the pressure inlet joint 2 is also used for punching, the function of the nut is mainly to provide various modes for fixing the pressure transmitter, the pressure transmitter is conveniently and freely fixed at various positions, the pressure inlet hole on the pressure inlet joint 2 is used for conducting a measured medium, and the pressure of the measured medium is transmitted to a diaphragm of a core body of the sputtering film sensor 3.
The conversion circuit board comprises a key plate 5, a conversion plate 7 and a transmitting plate 8, wherein the key plate 5 is electrically connected with the sputtering film sensor 3 through a key alloy wire 6, and the key plate 5 is sequentially connected with the conversion plate 7 and the transmitting plate 8. The transmitting board 8 is used for supplying power to the transmitter, amplifying and converting weak voltage signals output by the sputtering film sensor 3, and integrating the functions of wide-voltage direct current 12V-30V power supply, high-precision AD conversion, reverse connection protection and the like.
The upper part of the inner side of the sleeve 4 is provided with a step, and the sleeve 4 is fixedly connected with a key plate 5 through the step.
The sleeve 4 is welded to the pressure inlet joint 2 by a laser welding machine, and a small step is machined on the inner side of the upper part of the sleeve 4 for fixing the key plate 5. The sleeve 10 is welded to the outer ring step of the pressure inlet joint 2 by a laser welding machine, and a sensitive core and a circuit board inside the transmitter are sealed and protected.
The electric connector is an aviation socket 9, one end of the electric connector is electrically connected with the transmitting plate 8, and the other end of the electric connector penetrates through the sleeve 10.
The electrical connector is an aerial socket 9 which functions to provide a standard electrical connection. The electrical interface part has the same function and size as the common connector, and has industry universality; the sealing protection and electric conduction requirements of the inside of the transmitter are guaranteed, and the whole product is more attractive. And the wires inside the socket are welded with the transmitting plate 8, so that the transmission of electric signals is realized.
A sealing ring 11 is arranged between the electric connector and the sleeve 10, and the sealing ring 11 is used for sealing between the electric connector and the sleeve 10.
A method for manufacturing a pressure transmitter comprises the following steps,
cleaning and drying the pressure inlet joint 2, the sleeve 4 and the sleeve 10, welding and fixing the pressure inlet joint 2 and the sputtering film sensor 3 by a welding machine, performing visual inspection under a microscope to detect whether obvious welding defects exist, connecting the pressure inlet joint 2 to a barometer after visual inspection, performing air pressure leakage detection, and welding the sleeve 4 to an inner ring step of the pressure inlet joint 2 after the inspection is qualified;
the contact pins are welded on the bonding plate 5 in sequence, the bonding plate 5 is placed in the sleeve 4, bonding points on the bonding plate 5 are in one-to-one correspondence with bonding points of the sputtering film sensor 3, the edge of the sleeve 4 is extruded by an edge wrapping tool, and the bonding plate 5 is fixed on the pressure inlet joint 2;
bonding the bonding alloy wire 6 between the sputtering film sensor 3 and the bonding plate 5 by using a bonding machine, and coating elastic silica gel to protect the sputtering film sensor 3 and the bonding alloy wire 6;
welding contact pins on a conversion plate 7, fixing the contact pins on a bonding plate 5, welding a transmission plate 8 on the contact pins, placing the contact pins in a high-temperature oven for high-temperature storage, and removing residual welding stress at a joint part;
after the high-temperature storage is finished, debugging and calibrating the pressure transmitter with the welded circuit board, connecting the aviation socket 9 to the transmitting board 8 and the sleeve 10, sleeving a sealing ring 11 at the threaded connection part of the aviation socket 9 and the sleeve 10 for sealing and fixing, and welding the sleeve 10 and the pressure inlet joint 2 into a whole by using a laser welding machine;
and finishing the factory test in the sensor test system.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The utility model provides a pressure transmitter, includes shell, sputtering film sensor, conversion circuit board and electrical joint, its characterized in that, the shell includes nut, advances pressure joint, sleeve pipe and sleeve, wherein, advances the pressure joint and adopts integrated into one piece, advance pressure joint and sputtering film sensor welded fastening to advance the pressure joint and reduce with sputtering film sensor's welding interface height, the sleeve pipe is fixed to advance on the pressure joint inner circle step, the sleeve pipe is fixed to advance on the pressure joint outer lane step.
2. The pressure transmitter of claim 1 wherein the conversion circuit board comprises a key plate, a conversion plate and a transmitter plate, wherein the key plate is electrically connected to the sputtered film sensor by a key alloy wire, and wherein the key plate is in turn connected to the conversion plate and the transmitter plate.
3. The pressure transmitter of claim 1 wherein the sleeve is provided with a step on an upper portion of an inner side thereof, the sleeve being fixedly connected to the key plate by the step.
4. The pressure transmitter of claim 1 wherein the electrical connector is an air socket, one end of the electrical connector is electrically connected to the transmitter board, and the other end of the electrical connector extends through the sleeve.
5. The pressure transmitter and the method of manufacturing the same of claim 1 wherein a seal ring is disposed between the electrical connector and the sleeve.
6. The method of manufacturing a pressure transmitter of claim 1, comprising the steps of,
cleaning and drying the pressure inlet joint, the sleeve and the sleeve, welding the pressure inlet joint and the sputtering film sensor by a welding machine, performing visual inspection under a microscope to detect whether obvious welding defects exist, connecting the pressure inlet joint to a barometer after visual inspection, performing air pressure leakage detection, and welding the sleeve to the pressure inlet joint after the detection is qualified;
welding the contact pins on the bonding plates in sequence, putting the bonding plates into the sleeve, enabling bonding points on the bonding plates to correspond to bonding points of the sputtering film sensor one by one, extruding the edges of the sleeve by using an edge wrapping tool, and fixing the bonding plates on the pressure inlet joint;
bonding the bonding alloy wire between the sputtering film pressure sensor and the bonding plate by using a bonding machine, and coating elastic silica gel to protect the sputtering film sensor and the bonding alloy wire;
welding contact pins on a conversion plate, fixing the conversion plate on a key plate, welding a transmission plate on the conversion plate, placing the conversion plate in a high-temperature oven for high-temperature storage, and removing residual welding stress at a joint part;
after the high-temperature storage is finished, debugging and calibrating the pressure transmitter with the welded circuit board, connecting an electric joint to the transmitting board and the sleeve, sleeving a sealing ring at the threaded joint of the electric joint and the sleeve for sealing and fixing, and welding the sleeve and the pressure inlet joint into a whole by using a laser welder;
and finishing the factory test in the sensor test system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310530090.4A CN116678543A (en) | 2023-05-12 | 2023-05-12 | Pressure transmitter and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310530090.4A CN116678543A (en) | 2023-05-12 | 2023-05-12 | Pressure transmitter and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116678543A true CN116678543A (en) | 2023-09-01 |
Family
ID=87784480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310530090.4A Pending CN116678543A (en) | 2023-05-12 | 2023-05-12 | Pressure transmitter and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116678543A (en) |
-
2023
- 2023-05-12 CN CN202310530090.4A patent/CN116678543A/en active Pending
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