CN116677932A - High-power LED lamp bead with uniform light spots - Google Patents
High-power LED lamp bead with uniform light spots Download PDFInfo
- Publication number
- CN116677932A CN116677932A CN202310742564.1A CN202310742564A CN116677932A CN 116677932 A CN116677932 A CN 116677932A CN 202310742564 A CN202310742564 A CN 202310742564A CN 116677932 A CN116677932 A CN 116677932A
- Authority
- CN
- China
- Prior art keywords
- side wall
- fixedly connected
- bottom end
- lamp bead
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 239000000428 dust Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
- F21V14/02—Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/02—Fastening of light sources or lamp holders with provision for adjustment, e.g. for focusing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a high-power LED lamp bead with uniform light spots, which belongs to the field of lamp beads and comprises a lens and a mounting substrate, wherein the side wall of the bottom end of the lens is connected with an outer frame, two opposite sliding grooves are formed in the inner side wall of the outer frame, sliding buttons are connected to the inner side walls of the sliding grooves, a luminous wafer is connected to the side walls of the sliding buttons, an edge cooling plate is arranged below the luminous wafer, an integrated circuit board is arranged below the edge cooling plate, and two opposite side walls of the integrated circuit board are respectively connected with a safety connecting button through two guide rods. According to the invention, through the arrangement of the electromagnetic plate and the slide button, the up-and-down sliding of the slide button can be regulated by utilizing the electrifying control of the electromagnetic plate, so that the size of the light spot emitted by the lamp bead can be regulated conveniently according to the use requirement, the applicability of the high-power lamp bead is improved, meanwhile, the arrangement of the inlet pipe and the outlet pipe can exchange cold and hot air flow, the hot air flow is prevented from staying in the position space where the power supply part is located for a long time, and the stability and safety of the use of the power supply part are ensured.
Description
Technical Field
The invention relates to the technical field of lamp beads, in particular to a high-power LED lamp bead with uniform light spots.
Background
The LED lamp bead is a common light-emitting device, emits light by energy released by electron and hole recombination, has wide application in the field of illumination, can efficiently convert electric energy into light energy, and has wide application in modern society.
The even high-power LED lamp pearl of facula is in the in-process of using, because the voltage and current at its time is higher, power supply position and luminous position are the temperature when using for a long time all can rise gradually, this makes the inside component of luminous position ageing in high temperature environment easily, influence the life of high-power LED lamp pearl, the high temperature environment of power supply position also makes the use of lamp pearl have the potential safety hazard, the facula size of conventional type lamp pearl is fixed unchangeable simultaneously, can't change the size of facula according to the user demand of illumination in the in-process of using, so propose the even high-power LED lamp pearl of facula.
Disclosure of Invention
The invention aims to solve the problem that the temperature of a power supply part and a light emitting part in the prior art is gradually increased when the power supply part and the light emitting part are used for a long time, and provides a high-power LED lamp bead with uniform light spots.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a even high-power LED lamp pearl of facula, includes lens and mounting substrate, lens bottom lateral wall is connected with the frame, two relative spouts have been seted up to the frame inside wall, the spout inside wall is connected with the slide button, the slide button lateral wall is connected with luminous wafer, luminous wafer below is provided with the edge heating panel, edge heating panel below is provided with integrated circuit board, the opposite both sides wall of integrated circuit board is connected with safe the button through two guide arms respectively, safe button bottom is connected with the power strip, the opposite both sides of integrated circuit board are provided with the electromagnetic plate, the mounting substrate top is connected with a plurality of connecting plates that are the array setting, the inside lateral wall of connecting plate is connected with the fixed pipe, the fixed pipe top is connected with the closing plate, be provided with access tube and a plurality of access tubes on the closing plate, access tube below is provided with cooling module.
Preferably, the side wall at the bottom end of the lens is fixedly connected with the inner side wall of the outer frame, the slide Niu Cebi is in sliding connection with the inner side wall of the sliding groove formed in the inner side wall of the outer frame, the slide Niu Cebi is fixedly connected with the side wall of the light-emitting wafer, and the bottom end of the light-emitting wafer is fixedly connected with two connecting seats.
Preferably, the bottom end of the light-emitting wafer is fixedly connected with a fixing ring, the bottom end of the fixing ring is fixedly connected with the top end of the edge heat dissipation plate, a plurality of heat dissipation holes are uniformly formed in the edge outer ring of the edge heat dissipation plate in an array mode, and two through holes are formed in the center of the edge heat dissipation plate.
Preferably, the top end of the integrated circuit board is fixedly connected with two wires, the top ends of the wires are electrically connected with the bottom ends of the connecting seats, the side wall of the integrated circuit board is fixedly connected with the end part of the guide rod, and the other end of the guide rod is fixedly connected with the top end of the safety connecting button.
Preferably, the safety connects button bottom and power strip top electricity to be connected, power strip top and electromagnetic plate bottom fixed connection, electromagnetic plate and power strip electricity to be connected, the cooling hole has been seted up to the power strip axle center, cooling hole inside wall fixedly connected with sleeve pipe.
Preferably, the sleeve inner side wall is fixedly connected with the side wall of the sealing plate, a main hole and a plurality of auxiliary holes which are uniformly arranged in an array are respectively formed in the shaft center and the outer ring surface of the sealing plate, the inner side wall of the main hole is fixedly connected with the outer side wall of the access pipe, and the inner side wall of the auxiliary hole is fixedly connected with the outer side wall of the top end of the access pipe.
Preferably, the bottom end of the sealing plate is fixedly connected with the top end of the fixed pipe, the outer side wall of the fixed pipe is fixedly connected with the inner side wall of the connecting plate, a plurality of connecting plates are uniformly arranged on the outer side wall of the fixed pipe in an array mode, and the bottom end of the fixed pipe is fixedly connected with the top end of the mounting substrate.
Preferably, the cooling assembly comprises a bucket and a fan, the top end of the bucket is fixedly connected with the bottom end of the inlet pipe, the inner side wall of the fixed pipe is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating shaft, the outer side wall of the rotating shaft is fixedly connected with the inner side wall of the fan, and the inner side wall of the top end of the inlet pipe is fixedly connected with a dust-proof plate.
Preferably, a plurality of dead levers are fixedly connected with the bottom end of the mounting substrate, the bottom end of the dead lever is connected with the mounting plate, a plurality of pipe holes are formed in the mounting substrate, the inner side walls of the pipe holes are connected with the outer side walls of the delivery pipes, and the bottom end of the delivery pipes is fixedly connected with a cleaning bucket.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the scheme, through the arrangement of the electromagnetic plate and the sliding button, the electrifying control of the electromagnetic plate can be utilized, and the sliding button is adjusted to slide up and down, so that the size of a light spot emitted by the lamp bead is adjusted conveniently according to the use requirement, and the applicability of the high-power lamp bead is improved.
2. According to the scheme, through the arrangement of the edge cooling plates, the downward heat source can be dispersed from the periphery by utilizing the edge cooling plates, the integrated circuit board is prevented from being in a high-temperature environment for a long time in the using process, the components on the integrated circuit board are prevented from aging, and the service life of the lamp beads is prolonged.
3. According to the scheme, through the arrangement of the inlet pipe and the outlet pipe, cold and hot air flows can be exchanged, so that hot air flows are prevented from staying in the position space where the power supply part is located for a long time, and the stability and safety of the use of the power supply part are ensured.
Drawings
FIG. 1 is a schematic diagram of a three-dimensional structure of a high-power LED lamp bead with uniform light spots;
fig. 2 is a schematic diagram of a three-dimensional structure of a high-power LED lamp bead with uniform light spots;
FIG. 3 is a schematic diagram of an assembled structure of a high-power LED lamp bead with uniform light spots;
fig. 4 is a schematic structural diagram of an edge heat dissipation plate in a high-power LED lamp bead with uniform light spots;
FIG. 5 is a schematic structural view of a dust guard in a high-power LED lamp bead with uniform light spots;
fig. 6 is a schematic structural diagram of a cooling assembly for a high-power LED lamp bead with uniform light spots.
In the figure: 1. a lens; 2. a mounting substrate; 3. an outer frame; 4. a light emitting chip; 5. a connecting seat; 6. a slide button; 7. a fixing ring; 8. an edge heat dissipation plate; 9. a wire; 10. an integrated circuit board; 11. a guide rod; 12. a safety connecting button; 13. an electromagnetic plate; 14. a power panel; 15. a sleeve; 16. a sealing plate; 17. a fixed tube; 18. a connecting plate; 19. a tube is introduced; 20. a dust-proof plate; 21. pouring; 22. a fan; 23. a rotating shaft; 24. a motor; 25. a discharge pipe; 26. cleaning a bucket; 27. a fixed rod; 28. and (3) mounting a plate.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention are included in the protection scope of the present invention.
Example 1
Referring to fig. 1-6, a high-power LED lamp bead with uniform light spots comprises a lens 1 and a mounting substrate 2, wherein the side wall of the bottom end of the lens 1 is connected with an outer frame 3, two opposite sliding grooves are formed in the inner side wall of the outer frame 3, a sliding button 6 is connected to the inner side wall of the sliding groove, a light-emitting wafer 4 is connected to the side wall of the sliding button 6, and an edge heat dissipation plate 8 is arranged below the light-emitting wafer 4;
further, the side wall of the bottom end of the lens 1 is fixedly connected with the inner side wall of the outer frame 3, the side wall of the sliding button 6 is in sliding connection with the inner side wall of a sliding groove formed in the inner side wall of the outer frame 3, the side wall of the sliding button 6 is fixedly connected with the side wall of the luminous wafer 4, the bottom end of the luminous wafer 4 is fixedly connected with two connecting seats 5, the bottom end of the luminous wafer 4 is fixedly connected with a fixing ring 7, the bottom end of the fixing ring 7 is fixedly connected with the top end of an edge heat dissipation plate 8, a plurality of heat dissipation holes are uniformly formed in an array on the edge outer ring of the edge heat dissipation plate 8, and two through holes are formed in the center of the edge heat dissipation plate 8;
it should be noted that: the safety connector 12 is electrically connected through the power panel 14, then the integrated circuit board 10 is powered by the electric connection of the guide rod 11 and the safety connector 12, the integrated circuit board 10 emits light through the cooperation of the lead 9 and the light-emitting chip 4, the light source emits uniform and borderless light spots through the round outer frame 3 and the lens 1, the electromagnetic panel 13 can be magnetized through the control of the electromagnetic panel 13 connected with a power supply, the edge heat radiation plate 8 is magnetized and opposite to the top end of the electromagnetic panel 13, the light-emitting chip 4 is pushed upwards by the slide button 6, the distance between the light-emitting chip 4 and the lens 1 is changed, the size of the emitted light spots is changed, the bottom end of the outer frame 3 is made of metal iron, the power on the electromagnetic panel 13 is stopped during recovery, and the light-emitting chip 4 is reset under the magnetic attraction effect of the lower part;
the adoption of the method has the following further advantages: therefore, the size of the light spot emitted by the lamp bead can be adjusted according to the use requirement, and the applicability of the high-power lamp bead is improved.
Example two
Referring to fig. 1-6, an integrated electric board 10 is arranged below an edge heat dissipation plate 8, two opposite side walls of the integrated electric board 10 are respectively connected with a safety connecting button 12 through two guide rods 11, the bottom end of the safety connecting button 12 is connected with a power supply plate 14, and two opposite sides of the integrated electric board 10 are provided with electromagnetic plates 13;
further, two wires 9 are fixedly connected to the top end of the integrated circuit board 10, the top end of the wires 9 is electrically connected with the bottom end of the connecting seat 5, the side wall of the integrated circuit board 10 is fixedly connected with the end part of the guide rod 11, the other end of the guide rod 11 is fixedly connected with the top end of the safety connecting button 12, the bottom end of the safety connecting button 12 is electrically connected with the top end of the power panel 14, the top end of the power panel 14 is fixedly connected with the bottom end of the electromagnetic panel 13, the electromagnetic panel 13 is electrically connected with the power panel 14, a cooling hole is formed in the axis of the power panel 14, and a sleeve 15 is fixedly connected to the inner side wall of the cooling hole;
it should be noted that: when the light-emitting wafer 4 works, a large amount of heat sources are generated, the edge heat dissipation plate 8 disperses the downward heat sources from the periphery, so that the heat sources are prevented from directly acting on the upper part of the integrated circuit board 10, and then cooling holes on the power panel 14 can exchange cold and hot air flows, so that the hot air flows are prevented from staying in the position space where the integrated circuit board 10 is located for a long time;
the adoption of the method has the following further advantages: thus, the integrated circuit board 10 can be prevented from being in a high-temperature environment for a long time in the using process, the components on the integrated circuit board are prevented from aging, and the service life of the lamp beads is prolonged.
Example III
Referring to fig. 1 to 6, a plurality of connection plates 18 arranged in an array are connected to the top end of the mounting substrate 2, a fixed pipe 17 is connected to the inner side wall of the connection plates 18, a sealing plate 16 is connected to the top end of the fixed pipe 17, an inlet pipe 19 and a plurality of outlet pipes 25 are arranged on the sealing plate 16, and a cooling assembly is arranged below the inlet pipe 19;
further, the inner side wall of the sleeve 15 is fixedly connected with the side wall of the sealing plate 16, a main hole and a plurality of auxiliary holes which are uniformly arranged in an array are respectively formed in the axial center and the outer ring surface of the sealing plate 16, the inner side wall of the main hole is fixedly connected with the outer side wall of the inlet pipe 19, the inner side wall of the auxiliary hole is fixedly connected with the outer side wall of the top end of the outlet pipe 25, the bottom end of the sealing plate 16 is fixedly connected with the top end of the fixed pipe 17, the outer side wall of the fixed pipe 17 is fixedly connected with the inner side wall of the connecting plate 18, a plurality of connecting plates 18 are uniformly arranged on the outer side wall of the fixed pipe 17 in an array, the bottom end of the fixed pipe 17 is fixedly connected with the top end of the mounting substrate 2, the cooling assembly consists of a pouring hopper 21 and a fan 22, the top end of the pouring hopper 21 is fixedly connected with the bottom end of the inlet pipe 19, the inner side wall of the fixed pipe 17 is fixedly connected with a motor 24, the output end of the motor 24 is fixedly connected with a rotating shaft 23, the outer side wall of the rotating shaft 23 is fixedly connected with the inner side wall of the inlet pipe 22, the top end of the inlet pipe 19 is fixedly connected with a dust-proof plate 20, the bottom end of the mounting substrate 2 is fixedly connected with a plurality of fixing rods 27, the bottom ends of the mounting plates 28 are connected with the bottom ends of the fixing rods 27, a plurality of the inside holes 26 are fixedly connected with the inside walls of the pipe 25, a plurality of pipe holes are formed on the mounting substrate 2, the inside the pipe holes and the inside the pipe holes are connected with the cleaning holes and the cleaning the pipe 25, and are formed;
it should be noted that: the motor 24 is electrified and started to drive the rotating shaft 23 to rotate, the rotating shaft 23 can drive the fan 22 in the bucket 21 to rotate, so that upward flowing cold air flow is generated, the flowing cold air flow passes through the sealing plate 16 upwards from the inlet pipe 19 and enters the uppermost part, the dust-proof plate 20 can prevent dust from entering along with the air flow, then the air flow passing through the inlet pipe 19 can downwards extrude the air flow above, hot air flow below is discharged through the outlet pipe 25, the plurality of connecting plates 18 form a transitional heat dissipation space between the mounting substrate 2 and the power panel 14, the continuous temperature rise during the operation of the power panel 14 is avoided, the whole lamp beads are fixed through screw mounting through holes of the mounting plate 28, and the exchanged air flow is discharged from the outlet pipe 25 to enter the cleaning bucket 26 to blow the dust, so that dust deposition at the mounting position of the lamp beads is avoided;
the adoption of the method has the following further advantages: the hot air flow inside the lamp beads can be exchanged, the lamp beads are prevented from being in a high-temperature environment when in work, and meanwhile, the influence of dust entering in the heat dissipation process on the use of the lamp beads is avoided.
When the LED lamp is used, the safety joint button 12 is electrically connected through the power panel 14, then the integrated circuit board 10 is powered by the electric connection of the guide rod 11 and the safety joint button 12, the integrated circuit board 10 emits light through the cooperation of the lead 9 and the luminous wafer 4, the light source emits uniform and borderless light spots through the round outer frame 3 and the lens 1, the electromagnetic panel 13 can be magnetized through controlling the electromagnetic panel 13 to be connected with a power supply, the edge radiating plate 8 is magnetized and is opposite to the top end of the electromagnetic panel 13, the luminous wafer 4 is pushed upwards by the slide button 6, the distance between the luminous wafer 4 and the lens 1 is changed, the size of the emitted light spots is changed, the bottom end of the outer frame 3 is made of metal iron, the electromagnetic panel 13 is stopped being electrified during recovery, the luminous wafer 4 can reset under the action of magnetic attraction below, the size of the light spots emitted by the lamp beads can be adjusted according to the use requirement, and the applicability of the high-power lamp beads is improved;
the luminous wafer 4 can generate a large amount of heat sources when working, the edge heat dissipation plate 8 disperses the downward heat sources from the periphery, so that the heat sources are prevented from directly acting on the upper part of the integrated circuit board 10, then the cooling holes on the power panel 14 can exchange cold and hot air flows, and the hot air flows are prevented from staying in the position space where the integrated circuit board 10 is positioned for a long time, thus the integrated circuit board 10 can be prevented from being in a high-temperature environment for a long time in the using process, the ageing of parts on the integrated circuit board is prevented, and the service life of lamp beads is prolonged;
the motor 24 is electrified and started to drive the rotating shaft 23 to rotate, the rotating shaft 23 can drive the fan 22 in the bucket 21 to rotate, so that upward flowing cold air flow is generated, the flowing cold air flow passes through the sealing plate 16 upwards from the inlet pipe 19 and enters the uppermost part, the dust-proof plate 20 can prevent dust from entering along with the air flow, then the air flow passing through the inlet pipe 19 can downwards extrude the air flow above, hot air flow below is discharged through the outlet pipe 25, the plurality of connecting plates 18 form a transitional heat dissipation space between the mounting substrate 2 and the power panel 14, the continuous increase of the temperature of the power panel 14 during operation is avoided, the whole lamp beads are fixedly mounted through screws in holes of the mounting plate 28, the exchanged air flow is discharged from the outlet pipe 25 to enter the cleaning bucket 26 to blow dust, dust is prevented from being accumulated at the mounting position of the lamp beads, so that the hot air flow inside the lamp beads can be exchanged, the lamp beads are prevented from being in a high-temperature environment during operation, and the influence of the dust entering the lamp beads during heat dissipation process on the use is avoided.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a even high-power LED lamp pearl of facula, includes lens (1) and mounting substrate (2), its characterized in that, lens (1) bottom lateral wall is connected with frame (3), two relative spouts have been seted up to frame (3) inside wall, spout inside wall is connected with slide button (6), slide button (6) lateral wall is connected with luminous wafer (4), luminous wafer (4) below is provided with marginal heating panel (8), marginal heating panel (8) below is provided with integrated circuit board (10), integrated circuit board (10) relative both sides wall is connected with safe access button (12) through two guide arm (11) respectively, safe access button (12) bottom is connected with power strip (14), integrated circuit board (10) relative both sides are provided with electromagnetic plate (13), mounting substrate (2) top is connected with a plurality of connecting plates (18) that are the array setting, inside lateral wall of 18 is connected with fixed pipe (17), fixed pipe (17) top is connected with closing plate (16), be provided with closing plate (19) and lead in tube assembly (19) down.
2. The high-power LED lamp bead with uniform light spots according to claim 1, wherein the side wall at the bottom end of the lens (1) is fixedly connected with the inner side wall of the outer frame (3), the side wall of the sliding button (6) is slidably connected with the inner side wall of a sliding groove formed in the inner side wall of the outer frame (3), the side wall of the sliding button (6) is fixedly connected with the side wall of the light-emitting wafer (4), and two connecting seats (5) are fixedly connected with the bottom end of the light-emitting wafer (4).
3. The high-power LED lamp bead with uniform light spots according to claim 1, wherein the bottom end of the light emitting wafer (4) is fixedly connected with a fixing ring (7), the bottom end of the fixing ring (7) is fixedly connected with the top end of the edge radiating plate (8), a plurality of radiating holes are uniformly formed in an array on the edge outer ring of the edge radiating plate (8), and two through holes are formed in the center of the edge radiating plate (8).
4. The high-power LED lamp bead with uniform light spots according to claim 2, wherein two wires (9) are fixedly connected to the top end of the integrated circuit board (10), the top end of each wire (9) is electrically connected with the bottom end of the corresponding connecting seat (5), the side wall of the integrated circuit board (10) is fixedly connected with the end part of the corresponding guide rod (11), and the other end of the corresponding guide rod (11) is fixedly connected with the top end of the corresponding safety connecting button (12).
5. The high-power LED lamp bead with uniform light spots according to claim 1, wherein the bottom end of the safety connecting button (12) is electrically connected with the top end of the power panel (14), the top end of the power panel (14) is fixedly connected with the bottom end of the electromagnetic panel (13), the electromagnetic panel (13) is electrically connected with the power panel (14), a cooling hole is formed in the axis of the power panel (14), and a sleeve (15) is fixedly connected to the inner side wall of the cooling hole.
6. The high-power LED lamp bead with uniform light spots according to claim 5, wherein the inner side wall of the sleeve (15) is fixedly connected with the side wall of the sealing plate (16), a main hole and a plurality of auxiliary holes which are uniformly arranged in an array are respectively formed in the axial center and the outer annular surface of the sealing plate (16), the inner side wall of the main hole is fixedly connected with the outer side wall of the inlet pipe (19), and the inner side wall of the auxiliary hole is fixedly connected with the outer side wall of the top end of the outlet pipe (25).
7. The high-power LED lamp bead with uniform light spots according to claim 1, wherein the bottom end of the sealing plate (16) is fixedly connected with the top end of the fixed tube (17), the outer side wall of the fixed tube (17) is fixedly connected with the inner side wall of the connecting plate (18), a plurality of connecting plates (18) are uniformly arranged on the outer side wall of the fixed tube (17) in an array, and the bottom end of the fixed tube (17) is fixedly connected with the top end of the mounting substrate (2).
8. The high-power LED lamp bead with uniform light spots according to claim 1, wherein the cooling assembly consists of a pouring hopper (21) and a fan (22), the top end of the pouring hopper (21) is fixedly connected with the bottom end of an inlet pipe (19), the inner side wall of a fixed pipe (17) is fixedly connected with a motor (24), the output end of the motor (24) is fixedly connected with a rotating shaft (23), the outer side wall of the rotating shaft (23) is fixedly connected with the inner side wall of the fan (22), and the inner side wall of the top end of the inlet pipe (19) is fixedly connected with a dust-proof plate (20).
9. The high-power LED lamp bead with uniform light spots according to claim 1, wherein a plurality of fixing rods (27) are fixedly connected to the bottom end of the mounting substrate (2), a mounting plate (28) is connected to the bottom end of the fixing rods (27), a plurality of pipe holes are formed in the mounting substrate (2), the inner side walls of the pipe holes are connected with the outer side walls of the passing-through pipes (25), and cleaning hoppers (26) are fixedly connected to the bottom ends of the passing-through pipes (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310742564.1A CN116677932A (en) | 2023-06-20 | 2023-06-20 | High-power LED lamp bead with uniform light spots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310742564.1A CN116677932A (en) | 2023-06-20 | 2023-06-20 | High-power LED lamp bead with uniform light spots |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116677932A true CN116677932A (en) | 2023-09-01 |
Family
ID=87787186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310742564.1A Pending CN116677932A (en) | 2023-06-20 | 2023-06-20 | High-power LED lamp bead with uniform light spots |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116677932A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204141383U (en) * | 2014-09-02 | 2015-02-04 | 中山市理园五金电子有限公司 | A kind of high-power LED spotlight |
| CN204629271U (en) * | 2015-06-09 | 2015-09-09 | 常山优博特机电科技有限公司 | A kind of LED down with active heat removal fan and central suction hole |
| CN206647841U (en) * | 2017-03-15 | 2017-11-17 | 河南宝鸿光电股份有限公司 | A kind of pancratic LED tunnels lamp |
| CN108443844A (en) * | 2018-03-30 | 2018-08-24 | 广东知识城运营服务有限公司 | A kind of lamp radiator |
| CN210088797U (en) * | 2019-04-28 | 2020-02-18 | 杭州昊丰科技有限公司 | High-efficient LED lamp forced air cooling radiator |
| CN212960959U (en) * | 2020-10-14 | 2021-04-13 | 深圳市鑫晶品光电有限公司 | Mixed LED lamp bead |
| CN213394676U (en) * | 2020-11-28 | 2021-06-08 | 广东犀朗光电科技有限公司 | LED lamp bead |
| CN215764787U (en) * | 2021-09-14 | 2022-02-08 | 常州市驰川照明科技有限公司 | Anticorrosive dampproofing ground buries lamp |
| CN216202650U (en) * | 2021-09-29 | 2022-04-05 | 马鞍山三投光电科技有限公司 | Heat radiation lamp holder for high-power LED lamp |
-
2023
- 2023-06-20 CN CN202310742564.1A patent/CN116677932A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204141383U (en) * | 2014-09-02 | 2015-02-04 | 中山市理园五金电子有限公司 | A kind of high-power LED spotlight |
| CN204629271U (en) * | 2015-06-09 | 2015-09-09 | 常山优博特机电科技有限公司 | A kind of LED down with active heat removal fan and central suction hole |
| CN206647841U (en) * | 2017-03-15 | 2017-11-17 | 河南宝鸿光电股份有限公司 | A kind of pancratic LED tunnels lamp |
| CN108443844A (en) * | 2018-03-30 | 2018-08-24 | 广东知识城运营服务有限公司 | A kind of lamp radiator |
| CN210088797U (en) * | 2019-04-28 | 2020-02-18 | 杭州昊丰科技有限公司 | High-efficient LED lamp forced air cooling radiator |
| CN212960959U (en) * | 2020-10-14 | 2021-04-13 | 深圳市鑫晶品光电有限公司 | Mixed LED lamp bead |
| CN213394676U (en) * | 2020-11-28 | 2021-06-08 | 广东犀朗光电科技有限公司 | LED lamp bead |
| CN215764787U (en) * | 2021-09-14 | 2022-02-08 | 常州市驰川照明科技有限公司 | Anticorrosive dampproofing ground buries lamp |
| CN216202650U (en) * | 2021-09-29 | 2022-04-05 | 马鞍山三投光电科技有限公司 | Heat radiation lamp holder for high-power LED lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103052844B (en) | LED lighting module and use the illuminating lamp of this LED lighting module | |
| CN101776234B (en) | Modular street lamp | |
| CN116677932A (en) | High-power LED lamp bead with uniform light spots | |
| CN211399626U (en) | Car LED lamp that heat dispersion is good | |
| CN209012941U (en) | A kind of LED lamp | |
| CN201844255U (en) | LED lamp tube with effect of forced convection heat dissipation | |
| CN201373276Y (en) | LED tube lamp | |
| CN216345772U (en) | Ventilation cooling type aviation obstruction beacon | |
| CN105953088A (en) | Spiral LED lamp with composite type heat radiation structure | |
| KR20130136019A (en) | Light emitting diode ball bulb haveing triangular radiator for air circulation cooling type | |
| CN101949504A (en) | Light-emitting diode lamp bulb capable of performing forced convection and cooling | |
| CN220338262U (en) | Self-heat-dissipation type LED lamp bead | |
| CN208804538U (en) | A kind of LED light shell convenient for heat dissipation | |
| CN208535821U (en) | A kind of LED street lamp with radiating ribs | |
| CN208139010U (en) | A kind of Multifunctional LED lamp with minitype radiator | |
| CN207945539U (en) | A kind of LED line sensing lamp | |
| CN216813914U (en) | Semiconductor lighting lamp convenient for dimming | |
| CN206093579U (en) | LED spotlight | |
| CN218763273U (en) | High-power LED stage lamp with superstrong heat radiation structure | |
| CN220198858U (en) | LED spotlight ultraviolet curing lamp | |
| CN218993330U (en) | High heat dissipation LED lamps and lanterns | |
| CN104110664B (en) | A kind of heating integrated LED lamp of photoelectricity | |
| CN215061615U (en) | Novel efficient energy-saving LED lamp | |
| CN216431295U (en) | LED lamp with heat dissipation function | |
| CN214619257U (en) | Assembled down lamp with good illuminating effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |