CN116669464A - Display panel and display device - Google Patents
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- CN116669464A CN116669464A CN202310885642.3A CN202310885642A CN116669464A CN 116669464 A CN116669464 A CN 116669464A CN 202310885642 A CN202310885642 A CN 202310885642A CN 116669464 A CN116669464 A CN 116669464A
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000010409 thin film Substances 0.000 claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 238000003475 lamination Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 371
- 238000005538 encapsulation Methods 0.000 claims description 36
- 239000012044 organic layer Substances 0.000 claims description 23
- 239000010408 film Substances 0.000 abstract description 16
- 230000000694 effects Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a display panel and a display device, which relate to the technical field of display and comprise a substrate, a plurality of light-emitting units and a thin film packaging layer; wherein the plurality of light emitting units are positioned on one side of the substrate; the thin film packaging layer is positioned at one side of the light-emitting unit far away from the substrate, the thin film packaging layer covers the light-emitting unit, the thin film packaging layer comprises a first insulating layer and a second insulating layer which are adjacently arranged in a lamination manner, the first insulating layer is positioned between the second insulating layer and the light-emitting unit, and the refractive index of the first insulating layer is smaller than that of the second insulating layer; the first insulating layer is provided with a plurality of first openings, the second insulating layer fills the first openings, the first openings are perpendicular to the direction of the plane of the substrate, and the first openings are overlapped with the light emitting units. According to the embodiment of the invention, the micro lens layer is combined with the film packaging layer, so that the display performance of the display panel is effectively improved on the basis of not increasing the overall thickness of the display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel and a display device.
Background
The organic light emitting diode (Organic Light Emitting Diode, OLED) panel is an active light emitting display device, has the advantages of self-luminescence, wide viewing angle, high contrast, full color display, light weight, thin thickness, low power consumption, high reaction speed and the like, can realize flexible display, and is the display device with the most development potential.
In the existing organic light-emitting diode Panel, a Micro Lens layer (MLP) is additionally arranged above the organic light-emitting diode Panel, and the propagation direction of emergent light is improved through the refraction effect of the Micro Lens layer, so that the front light-emitting efficiency of the organic light-emitting diode Panel is further improved. However, the provision of the microlenses increases the overall thickness of the organic light emitting diode panel.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, wherein at least one insulating layer in a multiplexing film packaging layer is used as a high refractive index layer and/or a low refractive index layer in a micro lens layer, and the micro lens layer is combined with the film packaging layer, so that the display performance of the display panel is effectively improved on the basis of not increasing the whole thickness of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, including:
a substrate;
a plurality of light emitting units located at one side of the substrate;
the thin film packaging layer is positioned on one side of the light-emitting unit far away from the substrate, covers the light-emitting unit and comprises a first insulating layer and a second insulating layer which are adjacently arranged in a lamination mode, the first insulating layer is positioned between the second insulating layer and the light-emitting unit, and the refractive index of the first insulating layer is smaller than that of the second insulating layer;
the first insulating layer is provided with a plurality of first openings, the second insulating layer fills the first openings, the first openings are perpendicular to the direction of the plane of the substrate, and the first openings overlap with the light emitting units.
In a second aspect, an embodiment of the present invention further provides a display device, including a display panel according to any one of the first aspect.
The embodiment of the invention provides a display panel, which adopts a first insulating layer and a second insulating layer with different refractive indexes, wherein a micro-lens layer is not additionally arranged on the display panel, but the first insulating layer and the second insulating layer with different refractive indexes are arranged on a film packaging layer, at least one insulating layer in the film packaging layer is multiplexed to be used as a high refractive index layer and/or a low refractive index layer in the micro-lens layer, the effect of combining the micro-lens layer and the film packaging layer is achieved, and the display performance of the display panel is effectively improved on the basis of not increasing the whole thickness of the display panel. The micro-lens layer comprises a high refractive index layer and a low refractive index layer, the low refractive index layer is provided with an opening, and the part of the high refractive index layer, which fills the opening, forms a micro-lens structure.
Drawings
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present invention, and as shown in fig. 1, the display panel includes a substrate 10, a plurality of light emitting units 20, and a thin film encapsulation layer 30. Wherein a plurality of light emitting units 20 are located at one side of the substrate 10, a preset image may be displayed by controlling the light emitting brightness of the plurality of light emitting units 20. The thin film encapsulation layer 30 is located at a side of the light emitting unit 20 away from the substrate 10, the thin film encapsulation layer 30 covers the light emitting unit 20, and the thin film encapsulation layer 30 includes a stack of a first insulating layer 31 and a second insulating layer 32 adjacently disposed. The first insulating layer 31 is located between the second insulating layer 32 and the light emitting unit 20. The refractive index of the first insulating layer 31 is smaller than that of the second insulating layer 32. According to the optical principle, when light emitted from the light emitting unit 20 passes through the first insulating layer 31 and the second insulating layer 32 having different refractive indexes during transmission, the transmission direction of the light is changed. The first insulating layer 31 having a low refractive index is provided with a plurality of first openings 311 (illustrated by way of example as three first openings 311 in fig. 1), and a portion of the second insulating layer 32 having a high refractive index filled in the first openings 311 is formed into a microlens structure which can be used as a convex lens, and which can further collect light, effectively increasing the forward light extraction efficiency of the display panel. The plurality of first openings 311 are arranged in an array, and a plurality of microlens structures in the display panel may form a microlens array. The first openings 311 are formed in the first insulating layer 31, and are a plurality of first openings 311 formed by opening a hole in one entire film layer (first insulating layer 31). The first curved surface of the sidewall of the first insulating layer 31 may be a convex curved surface, the first curved surface protrudes toward a direction away from the substrate 10, and the first curved surface is an interface between the first insulating layer 31 and the second insulating layer 32, and the reflection and refraction ratio of the outgoing light of the light emitting unit 20 can be adjusted by adjusting the inclination angle of the interface, so that the adjustment of the light is realized, and the light emitting efficiency of the light emitting unit 20 is improved. The first opening 311 overlaps the light emitting unit 20 in a direction perpendicular to the plane of the substrate 10, that is, an orthographic projection of the light emitting unit 20 on the plane of the substrate 10 overlaps an orthographic projection of the first opening 311 on the plane of the substrate 10, and at least a portion of the light emitting unit 20 may be located in the first opening 311.
According to the technical scheme provided by the embodiment of the invention, the display panel adopts the first insulating layer 31 and the second insulating layer 32 with different refractive indexes. The display panel is not additionally provided with the micro-lens layer, but the first insulating layer 31 and the second insulating layer 32 with different refractive indexes are arranged on the film packaging layer 30, and at least one insulating layer in the film packaging layer 30 is multiplexed to serve as a high refractive index layer and/or a low refractive index layer in the micro-lens layer, so that the effect of combining the micro-lens layer with the film packaging layer 30 is achieved, and the display performance of the display panel is effectively improved on the basis of not increasing the whole thickness of the display panel. The micro-lens layer comprises a high refractive index layer and a low refractive index layer, the low refractive index layer is provided with an opening, and the part of the high refractive index layer, which fills the opening, forms a micro-lens structure.
Fig. 2 is a schematic cross-sectional structure of another display panel according to an embodiment of the present invention, referring to fig. 2, the thin film encapsulation layer 30 further includes a third insulation layer 33, the third insulation layer 33 includes an inorganic layer, and the third insulation layer 33 is located between the first insulation layer 31 and the light emitting unit 20. If the third insulating layer 33 is not provided, moisture and oxygen may enter the first opening 311 and further attack the light emitting unit 20. In the embodiment of the invention, the third insulating layer 33 is disposed between the first insulating layer 31 and the light emitting unit 20, and the third insulating layer 33 is a whole layer, so that the moisture and oxygen entering from the first opening 311 can be blocked, and the moisture and oxygen are prevented from corroding the light emitting unit 20, thereby improving the packaging performance of the thin film packaging layer 30.
Specifically, the thin film encapsulation layer 30 includes a first insulating layer 31, a second insulating layer 32, and a third insulating layer 33. The third insulating layer 33 may be an inorganic layer having a smaller thickness than the organic layer, and having a better water-oxygen barrier ability.
In one embodiment, the first insulating layer 31 and the third insulating layer 33 are both inorganic layers. The first insulating layer 31 and the third insulating layer 33 are stacked. In the case where no organic layer or metal layer is provided between the first insulating layer 31 and the third insulating layer 33, two or more inorganic layers may be etched simultaneously in the same etching process. Thus, the first insulating layer 31 and the third insulating layer 33 may be regarded as a single body, and together constitute one large insulating layer, and the first insulating layer 31 and the third insulating layer 33 may be made of the same inorganic material or different inorganic materials.
In another embodiment, a plurality of inorganic layers may be further disposed between the first insulating layer 31 and the light emitting unit 20.
Optionally, with continued reference to fig. 2, the second insulating layer 32 includes an organic layer. Thereby, the second insulating layer 32 fills the plurality of first openings 311 in the first insulating layer 31 by utilizing the fluidity of the organic layer at the time of formation, and the portion of the second insulating layer 32 filling the first openings 311 is formed into a microlens structure which can be used as a convex lens and which can further gather light. In the embodiment of the present invention, the original organic insulating layer in the thin film encapsulation layer 30 is reused, and the first opening 311 of the first insulating layer 31 is filled by utilizing the fluidity of the original organic insulating layer in the thin film encapsulation layer 30 during manufacturing.
The organic material used for the second insulating layer 32 may be, for example, an acrylic, epoxy, polyurethane, or the like polymer.
Illustratively, the original insulating layer in the thin film encapsulation layer 30 includes an inorganic insulating layer, an organic insulating layer, and an inorganic insulating layer, which are sequentially stacked. Wherein the organic insulating layer is located between the two inorganic insulating layers. The inorganic insulating layer may be composed of one or more inorganic sublayers.
Optionally, with continued reference to fig. 2, the first insulating layer 31 comprises an inorganic layer. The second insulating layer 32 includes an organic layer. In the embodiment of the present invention, not only the original organic insulating layer in the thin film encapsulation layer 30 but also the original inorganic insulating layer in the thin film encapsulation layer 30 are multiplexed, and the original inorganic insulating layer of the whole thin film encapsulation layer 30 is patterned, thereby forming the first insulating layer 31 having the first opening 311. The multiplexed inorganic insulating layer is located between the original organic insulating layer in the thin film encapsulation layer 30 and the substrate 10.
Illustratively, referring to fig. 2, the first insulating layer 31 is an inorganic layer having a smaller thickness than the organic layer, and having a better water-oxygen barrier capability. The inorganic material used for the first insulating layer 31 may be, for example, silicon oxynitride (SION), nitrogenSilicon oxide (SIN), silicon oxide (SIO), aluminum oxide (Al) 2 O 3 ) Titanium dioxide (TiO) 2 ) One or more of the following.
Optionally, fig. 3 is a schematic cross-sectional structure of another display panel according to an embodiment of the present invention, as shown in fig. 3, the thin film encapsulation layer 30 further includes a fourth insulation layer 34, and the fourth insulation layer 34 is located between the first insulation layer 31 and the light emitting unit 20. The fourth insulating layer 34 is provided with a plurality of second openings 341, and the second openings 341 communicate with the first openings 311. The second insulating layer 32 fills the second opening 341. In the embodiment of the present invention, the first insulating layer 31 is provided with the first opening 311, the fourth insulating layer 34 is provided with the second opening 341, and the first opening 311 and the second opening 341 are formed to be communicated with each other to form an opening with a larger depth. It will be appreciated that the first insulating layer 31 is an inorganic layer, the inorganic layer has a smaller thickness than the organic layer, and the gathering effect of the microlens structure on light is related to the thickness of the microlens structure, that is, the gathering effect of the microlens structure on light is related to the depth of the opening. According to the embodiment of the invention, the depth of the opening is increased by arranging the plurality of communicated openings, so that the thickness of the micro lens structure is increased, the design freedom degree of the curved surface (comprising the first curved surface) of the micro lens structure is improved, for example, the inclination angle of the first curved surface of the side wall is increased, and the gathering effect on light rays and the forward light-emitting efficiency of the display panel are improved.
Illustratively, referring to fig. 3, a fourth insulating layer 34 is disposed adjacent to the stack of first insulating layers 31. The first opening 311 is in abutting communication with the second opening 341. In other embodiments, at least one insulating layer having openings may also be provided between the first insulating layer 31 and the fourth insulating layer 34 to increase the depth of the total openings and to increase the thickness of the portion of the second insulating layer 32 filling the entrance openings.
Illustratively, referring to fig. 3, the second insulating layer 32 fills both the first opening 311 and the second opening 341. The arrangement of the fourth insulating layer 34 and the second opening 341 is equivalent to increasing the total filling depth of the second insulating layer 32, and the parts of the second insulating layer 32 filled with the first opening 311 and the second opening 341 can be formed into a micro-lens structure, so that the light converging capability of the micro-lens structure is improved, and the forward light emitting efficiency of the display panel is ensured. Etching the first insulating layer 31 and the fourth insulating layer 34 can effectively improve the inclination angle of the first curved surface of the sidewall of the first insulating layer 31 formed after etching.
In one embodiment, the fourth insulating layer 34 may be an inorganic layer. The first insulating layer 31 and the fourth insulating layer 34, which are both inorganic layers, are stacked, and two or more inorganic layers may be etched simultaneously in the same etching process without providing an organic layer or a metal layer between the first insulating layer 31 and the fourth insulating layer 34. Thus, the first insulating layer 31 and the fourth insulating layer 34 may be regarded as a single body, and together constitute one large insulating layer, and the first insulating layer 31 and the fourth insulating layer 34 may be made of the same inorganic material or different inorganic materials.
In another embodiment, a plurality of inorganic layers may be further disposed between the first insulating layer 31 and the light emitting unit 20, each of the inorganic layers being provided with a plurality of openings communicating with the first opening 311.
Optionally, fig. 4 is a schematic cross-sectional structure of another display panel according to an embodiment of the present invention, as shown in fig. 4, where the thin film encapsulation layer 30 further includes a fifth insulating layer 35, and the fifth insulating layer 35 includes an organic layer. The fifth insulating layer 35 is located between the first insulating layer 31 and the light emitting unit 20. If the fifth insulating layer 35 is not provided, when the first insulating layer 31 is an inorganic layer, the formation of the opening in the pixel defining layer in the light emitting unit 20 may generate a recess, which may affect the pattern formed by patterning the first insulating layer 31. In the embodiment of the present invention, the fifth insulating layer 35 is located between the first insulating layer 31 and the light emitting unit 20, the fifth insulating layer 35 is an organic layer, and the thickness of the organic layer is relatively large, so that the opening in the pixel defining layer can be filled, and thus the fifth insulating layer 35 serves as a planarization layer to provide a planar surface for the first insulating layer 31, and the influence of the recessing condition on the pattern formed by patterning the first insulating layer 31 can be avoided. On the other hand, the fifth insulating layer 35 is a whole film layer, and separates the first insulating layer 31 from the light emitting unit 20, thereby improving the packaging performance of the thin film packaging layer 30.
Specifically, the thin film encapsulation layer 30 includes a first insulating layer 31, a second insulating layer 32, and a fifth insulating layer 35. The fifth insulating layer 35 may be an organic layer, and the fifth insulating layer 35 fills the recess at the light emitting unit 20 using fluidity of the organic layer at the time of formation.
Optionally, fig. 5 is a schematic cross-sectional structure of a further display panel according to an embodiment of the present invention, as shown in fig. 5, the thin film encapsulation layer 30 further includes a third insulating layer 33, the third insulating layer 33 includes an inorganic layer, and the third insulating layer 33 is located between the fifth insulating layer 35 and the light emitting unit 20. In the embodiment of the present invention, the original inorganic insulating layer in the thin film encapsulation layer 30 is reused, and the original inorganic insulating layer in the entire thin film encapsulation layer 30 is patterned, thereby forming the first insulating layer 31 having the first opening 311. The multiplexed inorganic insulating layer is away from the side of the thin film encapsulation layer 30 where the original organic insulating layer is away from the substrate 10. Thus, the second insulating layer 32 can be understood as a film layer newly added to the original insulating layer in the thin film encapsulation layer 30. Even so, the number of film layers is reduced and the thickness of the display panel is reduced relative to the original insulating layer in the non-multiplexed thin film encapsulation layer 30.
Illustratively, the thin film encapsulation layer 30 includes a first insulating layer 31, a second insulating layer 32, a third insulating layer 33, and a fifth insulating layer 35. The first insulating layer 31 may be an inorganic layer, the second insulating layer 32 may be an organic layer, the third insulating layer 33 may be an inorganic layer, and the fifth insulating layer 35 may be an organic layer. The second insulating layer 32, the first insulating layer 31, the fifth insulating layer 35, and the third insulating layer 33 are sequentially stacked in a direction perpendicular to the plane in which the substrate 10 is located. The first insulating layer 31 is provided with a plurality of first openings 311, the second insulating layer 32 fills the first openings 311, and a portion of the second insulating layer 32 filling the first openings 311 may be formed as a microlens structure. The fifth insulating layer 35 and the third insulating layer 33 are present between the first insulating layer 31 and the light emitting unit 20 as barrier film layers for moisture and oxygen, improving the packaging performance of the thin film packaging layer 30.
Fig. 6 is a schematic cross-sectional structure of another display panel according to an embodiment of the present invention, and as shown in fig. 6, the first insulating layer 31 includes an organic layer. The second insulating layer 32 includes an organic layer. As an example, the first insulating layer 31 and the second insulating layer 32 are both organic layers. The first insulating layer 31 and the second insulating layer 32 are stacked. The embodiment of the invention adopts the organic layer to etch to form the opening, and adopts the organic layer to fill. The original organic insulating layer in the thin film encapsulation layer 30 is reused, and the first opening 311 of the first insulating layer 31 is filled by utilizing the fluidity of the original organic insulating layer in the thin film encapsulation layer 30 during manufacturing. Thus, the first insulating layer 31 can be understood as a film layer newly added to the original insulating layer in the thin film encapsulation layer 30. Even so, the number of film layers is reduced and the thickness of the display panel is reduced relative to the original insulating layer in the non-multiplexed thin film encapsulation layer 30.
Optionally, as shown in fig. 6, the thin-film encapsulation layer 30 further includes a sixth insulating layer 36, the sixth insulating layer 36 including an inorganic layer, the sixth insulating layer 36 being located on a side of the second insulating layer 32 remote from the substrate 10.
In an embodiment, fig. 7 is a schematic cross-sectional structure of a display panel according to another embodiment of the present invention, as shown in fig. 7, the thin film encapsulation layer 30 further includes a seventh insulating layer 37 disposed adjacent to the sixth insulating layer 36, the sixth insulating layer 36 is disposed between the seventh insulating layer 37 and the second insulating layer 32, and the refractive index of the sixth insulating layer 36 is smaller than that of the seventh insulating layer 37. The sixth insulating layer 36 is provided with a plurality of third openings 361, the seventh insulating layer 37 fills the third openings 361, and the third openings 361 overlap the light emitting units 20 in a direction perpendicular to the plane of the substrate 10.
Specifically, the thin film encapsulation layer 30 includes a first insulating layer 31, a second insulating layer 32, a sixth insulating layer 36, and a seventh insulating layer 37. The sixth insulating layer 36 and the seventh insulating layer 37 are stacked adjacently, the sixth insulating layer 36 is located between the seventh insulating layer 37 and the second insulating layer 32, and the refractive index of the sixth insulating layer 36 is smaller than that of the seventh insulating layer 37. According to the optical principle, when light emitted from the light emitting unit 20 passes through the sixth insulating layer 36 and the seventh insulating layer 37 having different refractive indexes during transmission, the transmission direction of the light is changed. The sixth insulating layer 36 having a low refractive index is provided with a plurality of third openings 361 (illustrated by way of example as three third openings 361 in fig. 7), and a portion of the seventh insulating layer 37 having a high refractive index filled in the third openings 361 is formed into a microlens structure which can be used as a convex lens, and which can further collect light, effectively increasing the forward light extraction efficiency of the display panel. The third opening 361 overlaps the light emitting unit 20 in a direction perpendicular to the plane of the substrate 10, that is, an orthographic projection of the light emitting unit 20 on the plane of the substrate 10 overlaps an orthographic projection of the third opening 361 on the plane of the substrate 10, and at least a portion of the light emitting unit 20 may be located in the third opening 361. The seventh insulating layer 37, the sixth insulating layer 36, the second insulating layer 32, and the first insulating layer 31 are sequentially stacked in a direction perpendicular to the plane of the substrate 10. The light emitted from the light emitting unit 20 passes through the microlens structure formed by the part of the second insulating layer 32 filled with the first opening 311, the microlens structure can collect light rays preliminarily, and then passes through the microlens structure formed by the part of the seventh insulating layer 37 filled with the third opening 361, the microlens structure can collect light rays further, and the forward light emitting efficiency of the display panel can be effectively improved by utilizing the two-layer microlens array structure.
Optionally, with continued reference to fig. 2, the front projection of the light emitting unit 20 on the plane of the substrate 10 is located within the front projection of the first opening 311 on the plane of the substrate 10. In other words, in a direction perpendicular to the plane of the substrate 10, the first opening 311 overlaps the light emitting unit 20, and the orthographic projection of the first opening 311 on the plane of the substrate 10 includes the orthographic projection of the light emitting unit 20 on the plane of the substrate 10. In the embodiment of the present invention, the first curved surface of the sidewall of the first insulating layer 31 may be a convex curved surface, and the light emitted from the light emitting unit 20 may be refracted at the position of the convex curved surface, where the convex curved surface plays a role in adjusting the light propagation direction. If the front projection of the light emitting unit 20 on the plane of the substrate 10 is the same as the front projection of the first opening 311 on the plane of the substrate 10, the brightness of the front viewing angle can be improved, and the brightness of the front viewing angle which is improved at this time is the largest. If the front projection of the first opening 311 on the plane of the substrate 10 is greater than the front projection of the light emitting unit 20 on the plane of the substrate 10, the front projection of the first opening 311 on the plane of the substrate 10 includes the front projection of the light emitting unit 20 on the plane of the substrate 10, the brightness of the front viewing angle can be improved, and in an exemplary embodiment, the brightness of the light within the angle range of 30 degrees can also be improved.
Optionally, with continued reference to fig. 2, the display panel further comprises a pixel defining layer 40, the pixel defining layer 40 being located on one side of the substrate 10, a pixel defining opening 41 being provided, and the light emitting unit 20 being located in the pixel defining opening 41. In other words, the orthographic projection of the pixel defining opening 41 on the plane of the substrate 10 in the direction perpendicular to the plane of the substrate 10 includes the orthographic projection of the light emitting unit 20 on the plane of the substrate 10, and the pixel defining opening 41 surrounds the light emitting unit 20. In the embodiment of the present invention, the display panel is an organic light emitting display panel, and the light emitting unit 20 includes a red sub-pixel 201, a green sub-pixel 202, and a blue sub-pixel 203, wherein the red sub-pixel 201 includes a pixel electrode 21, a red light emitting functional layer 221, and a common electrode 23, and the red light emitting functional layer 221 emits red light. The green sub-pixel 202 includes a pixel electrode 21, a green light emitting functional layer 222, and a common electrode 23, and the green light emitting functional layer 222 emits green light. The blue subpixel 203 includes a pixel electrode 21, a blue light emitting functional layer 223, and a common electrode 23, and the blue light emitting functional layer 223 emits blue light. The light emitting units 20 share the same common electrode 23. In a direction perpendicular to the substrate 10, the plurality of pixel cells 20 overlap the same common electrode 23, and the pixel defining opening 41 exposes at least a portion of the common electrode 23. The thickness of the common electrode 23 at each position on the pixel defining layer 40 is the same, but due to the arrangement of the pixel defining openings 41, it is necessary to additionally provide the fifth insulating layer 35 (which may be understood as a planarization layer), and the fifth insulating layer 35 is a whole layer, the influence of the pixel defining openings 41 on the pattern formed by patterning the first insulating layer 31 can be avoided.
Alternatively, the thickness of the first insulating layer 31 is greater than or equal to 0.5 μm in a direction perpendicular to the plane of the substrate 10. In the embodiment of the invention, the thickness of the first insulating layer 31 is greater than or equal to 0.5 μm, and the depth of the opening is increased, so that the thickness of the micro lens structure is increased, and the design freedom degree of the curved surface (including the first curved surface) of the micro lens structure is improved, for example, the inclination angle of the first curved surface of the side wall is increased, so that the gathering effect on light rays and the forward light-emitting efficiency of the display panel are improved.
Based on the same inventive concept, the embodiment of the invention also provides a display device. Fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present invention, and as shown in fig. 8, the display device includes a display panel 1 according to any one of the embodiments of the present invention. Therefore, the display device provided by the embodiment of the present invention has the corresponding beneficial effects of the display panel 1 provided by the embodiment of the present invention, and will not be described herein. The display device may be, for example, an electronic device such as a mobile phone, a computer, a smart wearable device (e.g., a smart watch), and a vehicle-mounted display device, which is not limited by the embodiment of the present invention.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (14)
1. A display panel, comprising:
a substrate;
a plurality of light emitting units located at one side of the substrate;
the thin film packaging layer is positioned on one side of the light-emitting unit far away from the substrate, covers the light-emitting unit and comprises a first insulating layer and a second insulating layer which are adjacently arranged in a lamination mode, the first insulating layer is positioned between the second insulating layer and the light-emitting unit, and the refractive index of the first insulating layer is smaller than that of the second insulating layer;
the first insulating layer is provided with a plurality of first openings, the second insulating layer fills the first openings, the first openings are perpendicular to the direction of the plane of the substrate, and the first openings overlap with the light emitting units.
2. The display panel according to claim 1, wherein the thin film encapsulation layer further comprises a third insulating layer including an inorganic layer, the third insulating layer being located between the first insulating layer and the light emitting unit.
3. The display panel of claim 1, wherein the second insulating layer comprises an organic layer.
4. The display panel of claim 3, wherein the first insulating layer comprises an inorganic layer.
5. The display panel according to claim 4, wherein the thin film encapsulation layer further comprises a fourth insulating layer between the first insulating layer and the light emitting unit;
the fourth insulating layer is provided with a plurality of second openings, the second openings are communicated with the first openings, and the second insulating layer fills the second openings.
6. The display panel according to claim 4, wherein the thin film encapsulation layer further comprises a fifth insulating layer including an organic layer, the fifth insulating layer being located between the first insulating layer and the light emitting unit.
7. The display panel according to claim 6, wherein the thin film encapsulation layer further comprises a third insulating layer comprising an inorganic layer, the third insulating layer being located between the fifth insulating layer and the light emitting unit.
8. The display panel of claim 3, wherein the first insulating layer comprises an organic layer.
9. The display panel of claim 1, wherein the thin film encapsulation layer further comprises a sixth insulating layer comprising an inorganic layer on a side of the second insulating layer remote from the substrate.
10. The display panel according to claim 9, wherein the thin film encapsulation layer further includes a seventh insulating layer provided adjacent to the sixth insulating laminated layer, the sixth insulating layer being located between the seventh insulating layer and the second insulating layer, the sixth insulating layer having a refractive index smaller than that of the seventh insulating layer;
the sixth insulating layer is provided with a plurality of third openings, the seventh insulating layer fills the third openings, the third openings are perpendicular to the direction of the plane of the substrate, and the third openings overlap the light emitting units.
11. The display panel of claim 1, wherein the orthographic projection of the light emitting unit on the plane of the substrate is located within the orthographic projection of the first opening on the plane of the substrate.
12. The display panel according to claim 1, further comprising a pixel defining layer on one side of the substrate, provided with a pixel defining opening, the light emitting unit being located in the pixel defining opening.
13. The display panel according to claim 1, wherein a thickness of the first insulating layer is 0.5 μm or more in a direction perpendicular to a plane in which the substrate is located.
14. A display device comprising the display panel of any one of claims 1-13.
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CN202310885642.3A CN116669464A (en) | 2023-07-17 | 2023-07-17 | Display panel and display device |
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