CN116660732A - High-density circuit board detection device - Google Patents

Abstract

The invention relates to the field of circuit board testing, and discloses a high-density circuit board detection device which comprises a rack, a conveying mechanism, a supply mechanism, a shifting mechanism and a testing mechanism, wherein the conveying mechanism, the supply mechanism, the shifting mechanism and the testing mechanism are arranged on the rack, the conveying mechanism is used for continuously conveying a circuit board towards the supply mechanism, the supply mechanism is used for carrying out negative pressure adsorption on the circuit board and dragging the circuit board to move towards the shifting mechanism, the shifting mechanism is used for dragging the circuit board to move towards the testing mechanism, the testing mechanism is used for testing the circuit board, the supply mechanism is used for carrying out negative pressure adsorption on the circuit board, the inside of the supply mechanism is in a preset negative pressure state through the negative pressure pump at first, and then the negative pressure pump only needs to continuously keep low-power operation, so that the problem that the service life of the negative pressure pump is shortened due to frequent opening and closing is solved, and compared with the prior art, the energy consumption is low.

Description

High-density circuit board detection device

Technical Field

The invention relates to the field of circuit board testing, in particular to a high-density circuit board detection device.

Background

The ICT automatic online tester is test equipment for the production of a PCBA (i.e. a circuit board) which is necessary for modern electronic enterprises, and mainly carries out power-on test on the circuit board by contacting test points on the circuit board through a test probe, and has the characteristics of wide application range and high measurement accuracy, and the test efficiency is very high, and only one second of time is needed for testing a group of circuit boards, but the test equipment has some defects when in use: 1. on one hand, in order to ensure the electrical performance of the circuit boards, each group of circuit boards need to be subjected to one-time electrifying test after being produced, on the other hand, the test efficiency of the ICT automatic on-line tester is higher, and one group of ICT automatic on-line testers can be achieved in one second, so that the ICT automatic on-line tester can rapidly realize the test of the circuit boards in the production test of the circuit boards; 2. based on the knowledge 1, the circuit board needs to be continuously and rapidly supplied towards the tester to meet the requirement of rapidly testing the produced circuit board, however, in the prior art, the circuit board is supplied manually, so that the time and effort are wasted, the same actions are repeated frequently, fatigue is easily generated by people, and errors are caused, or the circuit board is supplied by a mechanical arm technology; 3. based on the mechanical arm technology in 2, in order to avoid damaging the circuit board, an adsorption head is generally arranged at the output end of the mechanical arm, the adsorption head fixes the circuit board through a negative pressure adsorption mode, then the circuit board is pulled into a test structure, the adsorption head withdraws negative pressure, and the negative pressure adsorption of the adsorption head is realized by technologies such as a vacuum pump or a negative pressure pump, and the like.

Based on the above, the invention provides a high-density circuit board detection device.

Disclosure of Invention

In order to solve the above-mentioned problems, the present invention provides a high-density circuit board detection device.

In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.

The high-density circuit board detection device comprises a frame, wherein a conveying mechanism, a supply mechanism, a shifting mechanism and a testing mechanism are arranged on the frame, the conveying mechanism is used for continuously conveying the circuit board towards the supply mechanism, the supply mechanism is used for carrying out negative pressure adsorption on the circuit board and pulling the circuit board to move towards the shifting mechanism, the shifting mechanism is used for pulling the circuit board to move towards the testing mechanism, and the testing mechanism is used for testing the circuit board;

in the process that the supply mechanism pulls the circuit board to move, the negative pressure pump connected with the supply mechanism firstly operates to enable the interior of the supply mechanism to be in a preset negative pressure state, and then the negative pressure pump keeps low-power operation.

Further, the supply mechanism comprises a connecting frame connected with the frame and a synchronous belt which is arranged on the connecting frame and is vertically arranged, a sealed cavity is formed between the synchronous belt and the connecting frame in a sealing fit manner, two groups of pipe holes communicated with the sealed cavity are formed in the side face of the connecting frame, one group of pipe holes are communicated with the negative pressure pump, and the other group of pipe holes are provided with vacuum negative pressure safety valves;

the supply mechanism further comprises an adsorption unit arranged outside the synchronous belt and communicated with the closed cavity, and a withdrawal unit arranged inside the synchronous belt and close to the lower end of the synchronous belt, wherein a plurality of groups of adsorption units are arranged in an array along the extending direction of the synchronous belt, and the withdrawal unit is used for withdrawing the adsorption of the adsorption units to the circuit board.

Further, the link comprises two sets of connectors that are the opposite arrangement, and the one side that two sets of connectors are in opposite directions is provided with the side tank, and the tank bottom in side tank extends has the picture peg, and both sides limit of hold-in range all is provided with the slot, and the picture peg is located the slot and the inside and outside surface of hold-in range is laminated with two cell walls in side tank respectively, and the region that constitutes jointly between the interior surface of hold-in range and the side that two sets of connectors are in opposite directions is sealed cavity.

Further, the adsorption unit comprises an outer cylinder shell, a joint mouth extends from one side of the outer cylinder shell, the joint mouth is connected with the synchronous belt, the tail end of the joint mouth stretches into the closed cavity, an adsorption assembly is further arranged in the outer cylinder shell, and a plurality of groups of adsorption assemblies are arranged along the width direction of the synchronous belt.

Further, the adsorption assembly comprises an inner fixed body arranged in the outer cylinder shell, an adsorption pipe extends from one side of the inner fixed body, which is away from the synchronous belt, and the tail end of the adsorption pipe extends out of the outer cylinder shell and is provided with an adsorption head;

the inner fixing body is provided with a sliding hole communicated with the adsorption pipe towards one side of the synchronous belt, the bottom of the inner fixing body is provided with a valve slot, the wall of the sliding hole is provided with a first connecting hole and a second connecting hole communicated with the valve slot, the first connecting hole is positioned at one side of the second connecting hole towards the adsorption pipe, the wall of the sliding hole is also provided with a third connecting hole communicated with the inner cavity of the outer cylinder shell, the axial lead of the third connecting hole and the axial lead of the second connecting hole are positioned in the same plane, the wall of the valve slot facing the synchronous belt is provided with a first valve hole, and the valve slot is communicated with the adsorption pipe through the second valve hole;

the top of the inner fixing body is provided with an air hole III which is communicated with the sliding hole and is coaxial with the connecting hole I, and the outer surface of the outer cylinder shell is provided with an air hole I which is communicated with the air hole III and an air hole II which is communicated with the valve groove.

Further, an inner support is arranged in the adsorption tube, the adsorption assembly further comprises a needle bar, one end of the needle bar is positioned at one side of the adsorption head, which is away from the synchronous belt, the other end of the needle bar passes through the inner support and is coaxially positioned in the sliding hole, a limiting ring positioned at one side of the inner support, which is towards the adsorption head, is arranged outside the needle bar, and a first spring positioned between the inner support and the limiting ring is sleeved outside the needle bar;

the outside of needle bar is provided with the annular, and in the initial state, annular and connecting hole one and gas pocket three intercommunication, connecting hole two and connecting hole three are by the needle bar shutoff.

Further, the adsorption component further comprises a valve core sleeved in the valve groove, the valve core comprises a first plugging section, a second plugging section and a connecting section for connecting the first plugging section and the second plugging section, the first plugging section is opened towards one end of the sliding hole, the other end of the first plugging section is closed and connected with the connecting section, the diameter of the connecting section is smaller than that of the valve groove, a second spring is arranged between the bottom of a cavity of the first plugging section and the bottom of the valve groove, when the opening end of the first plugging section is contacted with the bottom of the valve groove, the connecting section is positioned between the first valve hole and the second valve hole, and in an initial state, the first valve hole and the second valve hole are plugged by the first plugging section.

Further, the withdrawal unit comprises an installation body arranged in the closed cavity, the installation body is provided with an installation hole along the direction perpendicular to the outer surface of the synchronous belt, the installation hole is provided with a built-in step towards the orifice of the conveying mechanism, the other orifice is provided with a cover plate, the installation body is provided with a constant pressure hole communicated with the installation hole along the side surface of the width direction of the synchronous belt, and the connecting frame is provided with an outer hole communicated with the constant pressure hole.

Further, a sliding body is sleeved in the mounting hole, the sliding body comprises a solid section and a hollow section, the solid section is in contact with the built-in step in an initial state, the hollow section is used for plugging the orifice of the constant pressure hole, the outer circular surface of the hollow section is provided with a through hole, and the through hole is positioned at one side of the constant pressure hole facing the solid section;

the one end extension of solid section has the tube head, and the terminal mounting hole and the fillet of stretching out of tube head, and the other end of solid section is provided with the mounting groove, and the tank bottom of mounting groove is provided with the hole of wearing to establish with the tube head intercommunication, and the notch department of mounting groove is provided with the fixed plate, is provided with the spring III between fixed plate and the apron, has seted up the centre bore with the mounting groove intercommunication on the fixed plate.

Further, a piston is sleeved in the mounting groove, a spring IV is arranged between the piston and the bottom of the mounting groove, a piston rod extends from the end face of the piston, and the tail end of the piston rod penetrates through the penetrating hole and is positioned in the pipe head;

the end face of the solid section is provided with a second side hole in a penetrating mode, the second side hole is communicated with the hollow section, the second side hole is communicated with the penetrating hole through the first side hole, the inside of the piston rod is hollow, a third side hole is formed in the outside of the piston rod, and in an initial state, the third side hole is located on one side of the first side hole, which faces the hollow section.

Compared with the prior art, the invention has the beneficial effects that:

in the invention, a negative pressure adsorption mode is adopted in the process of dragging the circuit board by the supply mechanism, and the negative pressure pump corresponding to the supply mechanism needs to operate with high power except for the beginning, so that the inside of the supply mechanism is in a preset negative pressure state, then, besides the adsorption unit is deactivated by the constant pressure of the deactivation unit, the adsorption of the circuit board is deactivated, the negative pressure in the closed area is not influenced, namely, only the negative pressure in the adsorption unit corresponding to the adsorption unit is lost in the adsorption deactivation process, and the loss is smaller, so that the negative pressure pump only needs to continuously keep low-power operation, on one hand, the problem that the service life of the negative pressure pump in the background art is shortened due to frequent opening and closing of the negative pressure pump is solved, and on the other hand, compared with the prior art, the negative pressure pump needs to continuously operate with lower operation power, so that the energy consumption is lower compared with the prior art in the background art.

Further, the adsorption unit carries out negative pressure adsorption's in-process to the circuit board, and what adopted is that the needle bar triggers makes valve opening one and valve opening two intercommunication, carries out negative pressure adsorption to the circuit board then, and like this advantage lies in: the needle bar is thinner, can not occupy the excessive area of absorption head, can not exert an influence to the absorption of absorption head, based on this, because the needle bar is thinner can not order about the great object of damping to remove, and in the negative pressure absorption process, need the great air flow channel of internal diameter specification to realize the intercommunication between absorption head and the closed cavity again, so this scheme uses the needle bar as the trigger, makes valve opening one and valve opening two intercommunication, makes the great air flow channel of internal diameter specification between absorption head and the closed cavity opened, and then realizes negative pressure absorption.

Furthermore, when the adsorption unit is used for removing the adsorption to the circuit board, the adsorption unit uses the normal pressure of the external environment as a driving medium, only the negative pressure in the corresponding adsorption unit is lost in the whole removing process, and the negative pressure in the closed area is not influenced, so that the negative pressure loss is smaller after the negative pressure adsorption of the circuit board moves each time, and the low-power operation of the negative pressure pump can be compensated.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a schematic diagram of a transport mechanism and a supply mechanism;

FIG. 3 is a schematic view of a transport mechanism;

FIG. 4 is a schematic view of a side or lower conveyor belt and an inner support frame;

FIG. 5 is a schematic diagram of a supply mechanism I;

FIG. 6 is a second schematic diagram of a supply mechanism;

FIG. 7 is a cross-sectional view of a link and timing belt;

FIG. 8 is a schematic diagram of an adsorption unit and a revocation unit;

FIG. 9 is a cross-sectional view of an adsorption unit;

FIG. 10 is a cross-sectional view of the inner stator;

FIG. 11 is a partial schematic view of an adsorbent assembly;

fig. 12 is a cross-sectional view of the revocation unit;

FIG. 13 is a partial cross-sectional view of a first revocation unit;

fig. 14 is a partial cross-sectional view of a second revocation unit;

FIG. 15 is a schematic view of a displacement mechanism;

FIG. 16 is a top view of the receiving arm;

FIG. 17 is a schematic diagram of a testing mechanism.

The reference numerals in the drawings are:

100. a conveying mechanism; 101. a lower conveyor belt; 102. a carriage; 103. a side conveyor belt; 104. an adjusting module I; 105. an inner support frame;

200. a supply mechanism; 201. a connecting frame; 202. a synchronous belt; 203. an adsorption unit; 204. a revocation unit; 205. an outer cartridge housing; 2051. a nozzle; 2052. an air hole I; 2053. an air hole II; 206. an inner fixing body; 2061. a slide hole; 2062. a valve spool; 2063. a first connecting hole; 2064. a second connecting hole; 2065. a third connecting hole; 2066. a valve hole I; 2067. a valve hole II; 2068. an air hole III; 207. an adsorption tube; 208. an adsorption head; 209. a needle bar; 2091. a ring groove; 210. a first spring; 211. a valve core; 212. a second spring; 213. a clamping rod; 214. a mounting body; 215. a constant pressure hole; 216. a cover plate; 217. a sliding body; 2171. a mounting groove; 2172. a side hole I; 2173. a second side hole; 2174. a fixing plate; 2175. a central bore; 2176. a through hole; 218. a third spring; 219. a tube head; 220. a piston; 221. a piston rod; 2211. a side hole III; 222. a spring IV;

300. a displacement mechanism; 301. a first linear module; 302. a movable bracket I; 303. rotating the first bracket; 304. a first motor; 305. an adjusting module II; 306. a receiving arm; 3061. a receiving groove;

400. a testing mechanism; 401. a second linear module; 402. a movable bracket II; 403. a second rotating bracket; 404. a second motor; 405. an adjusting module III; 406. a mounting arm; 407. a test element; 408. and an output member.

Detailed Description

In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects according to the present invention with reference to the accompanying drawings and preferred embodiments.

A in the drawings of the present invention refers to a circuit board.

As shown in fig. 1-17, a high-density circuit board detection device includes a rack, a conveying mechanism 100, a supply mechanism 200, a displacement mechanism 300 and a test mechanism 400, wherein the conveying mechanism 100 is used for continuously conveying a circuit board towards the supply mechanism 200, the supply mechanism 200 is used for drawing the circuit board towards the displacement mechanism 300 in a negative pressure adsorption manner, the displacement mechanism 300 is used for drawing the circuit board towards the test mechanism 400, and the test mechanism 400 is used for testing the circuit board.

In the process of the supply mechanism 200 dragging the circuit board to move, a negative pressure adsorption mode is adopted, and the negative pressure pump corresponding to the supply mechanism 200 needs to operate with high power except for the initial state of the preset negative pressure, then the negative pressure pump only needs to continuously keep low power operation, so that the problem that the service life of the negative pressure pump is shortened due to frequent opening and closing of the negative pressure pump in the background art is solved.

As shown in fig. 5 to 14, the specific structure of the supply mechanism 200 is:

the supply mechanism 200 comprises a connecting frame 201 connected with a frame and a synchronous belt 202 which is arranged on the connecting frame 201 and is vertically arranged, wherein the synchronous belt 202 and the connecting frame 201 form a sealed fit and form a closed cavity, in particular, as shown in fig. 6 and 7, the connecting frame 201 is composed of two groups of connecting bodies which are oppositely arranged, one side of each of the two groups of connecting bodies is provided with a side groove, the bottom of each side groove is extended with a plugboard, both side edges of the synchronous belt 202 are provided with slots, the plugboard is positioned in each slot, the inner surface and the outer surface of the synchronous belt 202 are respectively attached to two groove walls of the side grooves, the region which is jointly formed between the inner surface of the synchronous belt 202 and the opposite side surfaces of the two groups of connecting bodies is a closed cavity, two groups of pipe holes are formed in the side surface of the connecting frame 201, one group of pipe holes are communicated with the prior art means such as a negative pressure pump or a vacuum pump, so that the closed cavity is in a preset negative pressure state, the plugboard is tightly attached to the slots, and the other group of pipe holes are provided with a vacuum negative pressure safety valve; when the vacuum pump is used, the closed cavity is in a preset negative pressure state through the negative pressure pump at first, then the supply mechanism 200 can start to absorb negative pressure on the circuit board and pull the circuit board to shift, and a small amount of air inevitably enters into the closed cavity in the process, so that the negative pressure pump only needs to operate at low power except at first, and the closed cavity keeps the preset negative pressure state and has lower energy consumption under the cooperation of the negative pressure pump and the vacuum negative pressure safety valve.

The synchronous belt 202 and the vacuum negative pressure safety valve are realized in the prior art, and will not be described in detail.

The supply mechanism 200 further includes an adsorption unit 203 disposed outside the timing belt 202 and a withdrawal unit 204 disposed inside the timing belt 202 and near the lower end of the timing belt 202, the adsorption unit 203 being provided with a plurality of groups in an array along the extending direction of the timing belt 202 and the adsorption unit 203 being in communication with the closed chamber, and the timing belt 202 being movable together with the adsorption unit 203 and the circuit board being negative pressure-adsorbed by the adsorption unit 203, the withdrawal unit 204 being for causing the adsorption unit 203 to withdraw negative pressure adsorption to the circuit board.

Specifically, as shown in fig. 9-11, the adsorption unit 203 includes an outer cylinder housing 205, a nozzle 2051 extends from one side of the outer cylinder housing 205, the nozzle 2051 is connected with the synchronous belt 202, and the nozzle 2051 is used for communicating the outer cylinder housing 205 with a closed chamber, the synchronous belt 202 moves together with the outer cylinder housing 205, preferably, a corresponding matching annular track surrounds the outer part of the synchronous belt 202, and the outer cylinder housing 205 and the annular track form a sliding connection, so that the movement of the outer cylinder housing 205 can be smoother.

An adsorption assembly is further provided in the outer cylinder housing 205, and a plurality of groups of adsorption assemblies are provided along the width direction of the timing belt 202.

As shown in fig. 9-11, the adsorption assembly includes an inner fixing body 206 in an outer cylinder housing 205, as shown in fig. 10, a side of the inner fixing body 206 facing away from the timing belt 202 extends with an adsorption tube 207, and a tip of the adsorption tube 207 extends out of the outer cylinder housing 205 and is provided with an adsorption head 208.

The inner fixing body 206 is provided with a sliding hole 2061 communicated with the adsorption tube 207 towards one side of the synchronous belt 202, the bottom of the inner fixing body 206 is provided with a valve slot 2062, the wall of the sliding hole 2061 is provided with a first connecting hole 2063 and a second connecting hole 2064 communicated with the valve slot 2062, the first connecting hole 2063 is positioned on one side of the second connecting hole 2064 towards the adsorption tube 207, the wall of the sliding hole 2061 is also provided with a third connecting hole 2065 communicated with the inner cavity of the outer cylinder shell 205, the axial lead of the third connecting hole 2065 and the axial lead of the second connecting hole 2064 are positioned in the same plane, the wall of the valve slot 2062 towards the synchronous belt 202 is provided with a valve hole 2066, and the valve slot 2062 and the adsorption tube 207 are communicated through the valve hole 2067.

The top of the inner fixing body 206 is provided with an air hole three 2068 communicating with the sliding hole 2061 and the air hole three 2068 is coaxial with the connecting hole one 2063, and the outer surface of the outer cylinder housing 205 is provided with an air hole one 2052 communicating with the air hole three 2068 and an air hole two 2053 communicating with the valve groove 2062.

An inner support is arranged in the adsorption tube 207, the adsorption assembly further comprises a needle rod 209, one end of the needle rod 209 is located at one side of the adsorption head 208, which is away from the synchronous belt 202, the other end of the needle rod 209 passes through the inner support and is coaxially located in the sliding hole 2061, a limiting ring located at one side of the inner support, which is towards the adsorption head 208, is arranged outside the needle rod 209, and a first spring 210 located between the inner support and the limiting ring is sleeved outside the needle rod 209.

The outer portion of the needle bar 209 is provided with a ring groove 2091, and in the initial state, the ring groove 2091 communicates with the first connection hole 2063 and the third air hole 2068, and the second connection hole 2064 and the third connection hole 2065 are blocked by the needle bar 209.

The adsorption assembly further comprises a valve core 211 sleeved in the valve groove 2062, further, the valve core 211 comprises a first plugging section, a second plugging section and a connecting section for connecting the first plugging section, the first plugging section is opened towards one end of the sliding hole 2061, the other end of the plugging section is closed and connected with the connecting section, the diameter of the connecting section is smaller than that of the valve groove 2062, a second spring 212 is arranged between the cavity bottom of the first plugging section and the bottom of the valve groove 2062, and when the opening end of the first plugging section is contacted with the bottom of the valve groove 2062, the connecting section is positioned between the valve hole I2066 and the valve hole II 2067, and in an initial state, the first plugging section is used for plugging the valve hole I2066 and the valve hole II 2067.

The outer surface of the valve core 211 extends to form a clamping rod 213, the tail end of the clamping rod 213 passes through the valve hole 2066 and is close to the sliding hole 2061, the tail end of the clamping rod 213 is provided with a clamping protrusion, one side of the clamping protrusion, which faces the axial line of the sliding hole 2061, is provided with an inclined surface, and the clamping rod 213 is made of elastic materials.

The process of adsorbing the circuit board by the adsorption unit 203 is specifically shown as follows:

firstly, the circuit board is pulled by the conveying mechanism 100 to be conveyed towards the supply mechanism 200, the circuit board is firstly contacted with the needle bar 209, in order not to influence the negative pressure adsorption function of the adsorption head 208 on the circuit board, the needle bar 209 is thinner and is easily pushed by the circuit board to generate retreating movement, when the circuit board contacts with the adsorption head 208, the circuit board stops moving, at the moment, the ring groove 2091 is communicated with the connecting hole two 2064, namely: the closed chamber is communicated with the valve groove 2062 sequentially through the third connecting hole 2065, the annular groove 2091 and the second connecting hole 2064, and the valve core 211 moves close to the sliding hole 2061 under the action of negative pressure;

when the open end of the first blocking section of the valve element 211 contacts the bottom of the valve groove 2062, the valve element 211 is restrained from moving, and at this time, the connecting section of the valve element 211 is located between the first valve bore 2066 and the second valve bore 2067, so that the first valve bore 2066 and the second valve bore 2067 communicate with each other, and at this time: the closed cavity is communicated with the adsorption head 208 sequentially through the valve hole I2066, the valve hole II 2067 and the adsorption tube 207, and the adsorption head 208 performs negative pressure adsorption on the circuit board under the action of negative pressure; at the same time, the clamping rod 213 is clamped with the needle rod 209 through the clamping protrusion, so that the closed cavity is communicated with the adsorption head 208.

In the above process, the needle bar 209 is required to trigger the first valve hole 2066 to communicate with the second valve hole 2067, so as to perform negative pressure adsorption on the circuit board, because: on the one hand, the needle rod 209 is thinner, the object with larger damping can not be driven to move, on the other hand, in the negative pressure adsorption process, an air flow channel with larger inner diameter specification is needed to realize the communication between the adsorption head 208 and the closed cavity, so the needle rod 209 is used as trigger in the scheme, the valve hole I2066 is communicated with the valve hole II 2067, the air flow channel with larger inner diameter specification between the adsorption head 208 and the closed cavity is opened, and the negative pressure adsorption is realized.

Specifically, as shown in fig. 8 and 12-14, the withdrawal unit 204 includes an installation body 214 fixedly disposed in the closed chamber, the installation body 214 is provided with an installation hole along a direction perpendicular to the outer surface of the synchronous belt 202, an orifice of the installation hole facing the conveying mechanism 100 is provided with a built-in step, another orifice is provided with a cover plate 216, a side surface of the installation body 214 along the width direction of the synchronous belt 202 is provided with a constant pressure hole 215 communicated with the installation hole, and the connecting frame 201 is provided with an outer hole communicated with the constant pressure hole 215.

The installation hole is internally sleeved with a sliding body 217, the sliding body 217 comprises a solid section and a hollow section, the solid section is in contact with the built-in step in the initial state, the hollow section is used for plugging the orifice of the constant pressure hole 215, the outer circular surface of the hollow section is provided with a through hole 2176, and the through hole 2176 is positioned on one side of the constant pressure hole 215 facing the solid section.

The pipe head 219 extends from one end of the solid section, the tail end of the pipe head 219 extends out of the mounting hole and is rounded, the mounting groove 2171 is arranged at the other end of the solid section, a penetrating hole communicated with the pipe head 219 is formed in the bottom of the mounting groove 2171, a fixing plate 2174 is arranged at the notch of the mounting groove 2171, a spring III 218 is arranged between the fixing plate 2174 and the cover plate 216, and a central hole 2175 communicated with the mounting groove 2171 is formed in the fixing plate 2174.

The mounting groove 2171 is sleeved with a piston 220, a spring IV 222 is arranged between the piston 220 and the bottom of the mounting groove 2171, the end face of the piston 220 is extended with a piston rod 221, and the tail end of the piston rod 221 passes through the penetrating hole and is positioned in the tube head 219.

The end face of the solid section is provided with a second side hole 2173 in a penetrating mode, the second side hole 2173 is communicated with the hollow section, the second side hole 2173 is communicated with the penetrating hole through a first side hole 2172, a third side hole 2211 is formed in the hollow portion of the piston rod 221 and the outside of the piston rod, and in an initial state, the third side hole 2211 is located on one side of the first side hole 2172, facing the hollow section.

The revocation unit 204 causes the adsorption unit 203 to revoke the adsorption process to the circuit board, which is specifically expressed as:

during the process that the synchronous belt 202 moves with the adsorption unit 203, the joint 2051 in the adsorption unit 203 stretches into the closed chamber, the joint 2051 can be contacted with the pipe head 219, when in contact, under the effect of chamfering, the joint 2051 firstly pushes the pipe head 219 to retreat, the pipe head 219 retreats with the sliding body 217, the through hole 2176 is communicated with the constant pressure hole 215, the spring III 218 is compressed, when the joint 2051 is coaxial with the pipe head 219, the spring III 218 releases elasticity, the tail end of the pipe head 219 partially stretches into the joint 2051, the through hole 2176 still keeps the communication with the constant pressure hole 215, at the moment, the external environment is communicated with the hollow section through the external hole, the constant pressure hole 215 and the through hole 2176 in sequence, the piston 220 can move close to the joint 2051 under the action of negative pressure, the piston 220 moves with the piston rod 221, and further enables the side hole III 2211 to be communicated with the first 2172, and at the moment, the external environment sequentially passes through the external hole, the constant pressure hole 215, the through hole 2176, the hollow section, the second side hole 2172, the third side hole 219, the side hole 219 and the inside of the joint 2051 are switched from the state of the normal pressure state to the adsorption unit 203;

when the adsorption unit 203 is switched to the normal pressure state, the fourth spring 222 releases the elastic force to reset the piston 220, meanwhile, the second spring 212 releases the elastic force to reset the valve core 211, the first spring 210 releases the elastic force to reset the needle 209, and the adsorption unit 203 withdraws the negative pressure adsorption to the circuit board.

As shown in fig. 1 to 4, the conveying mechanism 100 has a specific structure that:

the delivery mechanism 100 is located at one side of the upper end of the supply mechanism 200.

The conveying mechanism 100 comprises two groups of conveying frames 102 which are slidably arranged on a frame along the width direction of a synchronous belt 202, an adjusting module I104 for driving the two groups of conveying frames 102 to be close to or far from each other, a side conveying belt 103 is arranged on the conveying frame 102, and the conveying direction of the side conveying belt 103 is perpendicular to the outer surface of the synchronous belt 202.

The conveying mechanism 100 further includes a lower conveying belt 101 mounted on the frame, and the lower conveying belt 101 is positioned below the side conveying belt 103 with the conveying directions of the two being parallel.

Preferably, as shown in fig. 4, the side conveyor 103 and the lower conveyor 101 are each provided with an inner support frame 105, and the side conveyor 103 or the lower conveyor 101 is supported.

The working process of the conveying mechanism 100 is specifically:

the stacked circuit boards are stuffed into the region formed by the two groups of side conveying belts 103 and the lower conveying belt 101, the conveying direction of the circuit boards and the conveying direction of the lower conveying belt 101 are vertical, then the side conveying belts 103 and the lower conveying belt 101 move together with the circuit boards, the distance between the discharging ends of the side conveying belts 103 and the lower conveying belt 101 and the nearby adsorption units 203 is equal to the thickness of one circuit board, and the forefront circuit board is pushed to be close to the adsorption units 203 by the rear circuit board in the process of being clamped between the rear circuit board and the adsorption units 203, so that the forefront circuit board is suspended and does not fall until being adsorbed by the adsorption units 203 and then moves downwards along with the adsorption units 203 and the synchronous belt 202.

Further, the distance between the two sets of side conveyor belts 103 can be adjusted by the first adjusting module 104 to adapt to circuit boards with different specifications and sizes.

As shown in fig. 1, 15 and 16, the specific structure of the displacement mechanism 300 is:

the displacement mechanism 300 is located at one side of the lower end of the supply mechanism 200, and the displacement mechanism 300 is located at the same side of the supply mechanism 200 as the conveying mechanism 100.

The displacement mechanism 300 includes a first movable frame 302 and a first linear module 301 for driving the first movable frame 302 to move along the conveying direction of the lower conveying belt 101.

The first movable bracket 302 is rotatably provided with a first rotary bracket 303, a first rotary shaft formed at the rotatably installed position is parallel to the width direction of the synchronous belt 202, and the first rotary shaft is driven to rotate by a first motor 304.

The first rotating bracket 303 is provided with two groups of receiving arms 306 in a sliding manner along the axial direction of the first rotating shaft, and is provided with a second adjusting module 305 for driving the two groups of receiving arms 306 to approach or separate from each other.

The two sets of receiving arms 306 are provided with receiving grooves 3061 on opposite sides, and the receiving grooves 3061 penetrate through to the free end surfaces of the receiving arms 306, and the distance between the two groove walls of the receiving grooves 3061 along the thickness direction of the receiving arms 306 increases along the groove depth direction of the receiving grooves 3061 and the direction from the groove bottom to the groove opening.

The working process of the displacement mechanism 300 is specifically:

firstly, the first motor 304 drives the first rotary bracket 303 to rotate ninety degrees, so that the receiving arm 306 is vertically arranged, and the circuit board absorbed by the absorbing unit 203 is positioned right above the receiving groove 3061;

then, in the downward movement process of the adsorption unit 203 and the circuit board, when the circuit board approaches the lower groove wall of the receiving groove 3061, the adsorption unit 203 is contacted with the withdrawal unit 204, under the cooperation of the withdrawal unit 204, the adsorption unit 203 withdraws the negative pressure adsorption of the circuit board, the circuit board falls under the action of gravity, the bottom of the circuit board is contacted with the lower groove wall of the receiving groove 3061, the side edge of the circuit board is contacted by two chute walls of the receiving groove 3061, namely, the circuit board is supported by two groups of receiving grooves 3061;

then, the second adjusting module 305 drives the two groups of receiving arms 306 to approach each other, and the circuit board is self-aligned and clamped under the inclined guidance of the inclined slot wall;

then, the first motor 304 drives the first rotating bracket 303 to reversely rotate ninety degrees, so that the circuit board is horizontally arranged, the first linear module 301 drives the first movable bracket 302 to move, and the first movable bracket 302 moves together with the circuit board, namely, pulls the circuit board to move towards the testing mechanism 400.

As shown in fig. 1 and 17, the specific structure of the test mechanism 400 is as follows:

the testing mechanism 400 includes a second movable bracket 402 and a second linear module 401 for driving the second movable bracket 402 to move vertically. The bottom of the movable support II 402 is rotatably provided with a rotary support II 403, a rotating shaft II formed at the rotary installation position is parallel to the conveying direction of the lower conveying belt 101, the rotating shaft II is driven to rotate by a motor II 404, two groups of installation arms 406 are slidably installed on the rotary support II 403, an adjusting module III 405 for driving the two groups of installation arms 406 to be far away or close to each other is arranged on the rotary support II, the installation arms 406 are parallel to the rotating shaft II, and the sliding direction of the installation arms 406 is perpendicular to the axial direction of the rotating shaft II.

The free end of the mounting arm 406 is provided with a test element 407, the test element 407 comprises a guide rod which is slidably mounted on the mounting arm 406, the sliding direction and the extending direction of the guide rod are parallel to the sliding direction of the mounting arm 406, one opposite ends of the guide rods in the two groups of test elements 407 are vertically provided with a substrate, probes are correspondingly arranged on the substrate, and a spring five positioned between the mounting arm 406 and the substrate is sleeved outside the guide rod.

When the circuit board is held by the displacement mechanism 300 and arranged horizontally, the circuit board is located between the two sets of test elements 407;

then, after the shifting mechanism 300 pulls the circuit board to move between the two groups of test elements 407, the adjusting module III 405 drives the two groups of test elements 407 to be close to each other, so that the probes are in contact with test points of the circuit board, then, the shifting mechanism 300 releases the clamping of the circuit board and returns to clamp the next circuit board, the test elements 407 test the circuit board, after the test is finished, the motor II 404 drives the rotating bracket II 403 to rotate ninety degrees, and then, the linear module II 401 drives the movable bracket II 402, the rotating bracket II 403, the test elements 407 and the circuit board to move downwards, so that the circuit board is inserted into the output piece 408;

then, the third adjusting module 405 drives the two sets of test elements 407 away from each other, and the second motor 404 cooperates with the second linear module 401 to drive the test mechanism 400 to reset.

In the above process, the output member 408 includes a bottom conveyor below the test element 407, the outer surface of the bottom conveyor is vertically provided with an insertion box, the tested circuit board is inserted into the insertion box, and then pulled away by the bottom conveyor, and the circuit board is taken away at the discharge end of the bottom conveyor.

The present invention is not limited to the above embodiments, but is capable of modification and variation in detail, and other modifications and variations can be made by those skilled in the art without departing from the scope of the present invention.

Claims (10)

1. The utility model provides a high density circuit board detection device, includes frame, its characterized in that: the rack is provided with a conveying mechanism, a supply mechanism, a shifting mechanism and a testing mechanism, wherein the conveying mechanism is used for continuously conveying the circuit board towards the supply mechanism, the supply mechanism is used for absorbing negative pressure on the circuit board and pulling the circuit board to move towards the shifting mechanism, the shifting mechanism is used for pulling the circuit board to move towards the testing mechanism, and the testing mechanism is used for testing the circuit board; in the process that the supply mechanism pulls the circuit board to move, the negative pressure pump connected with the supply mechanism firstly operates to enable the interior of the supply mechanism to be in a preset negative pressure state, and then the negative pressure pump keeps low-power operation.

2. The high-density circuit board inspection device according to claim 1, wherein: the supply mechanism comprises a connecting frame connected with the frame and a synchronous belt which is arranged on the connecting frame and is vertically arranged, wherein a sealed cavity is formed between the synchronous belt and the connecting frame in a sealing fit manner, two groups of pipe holes communicated with the sealed cavity are formed in the side face of the connecting frame, one group of pipe holes are communicated with the negative pressure pump, and the other group of pipe holes are provided with vacuum negative pressure safety valves; the supply mechanism further comprises an adsorption unit arranged outside the synchronous belt and communicated with the closed cavity, and a withdrawal unit arranged inside the synchronous belt and close to the lower end of the synchronous belt, wherein a plurality of groups of adsorption units are arranged in an array along the extending direction of the synchronous belt, and the withdrawal unit is used for withdrawing the adsorption of the adsorption units to the circuit board.

3. The high-density circuit board inspection device according to claim 2, wherein: the connecting frame is formed by two groups of connecting bodies which are oppositely arranged, one side of each of the two groups of connecting bodies is provided with a side groove, the bottom of each side groove is extended with a plugboard, the two sides of the synchronous belt are respectively provided with a slot, the plugboard is positioned in the slot, the inner surface and the outer surface of the synchronous belt are respectively attached to the two groove walls of the side grooves, and the region which is jointly formed between the inner surface of the synchronous belt and the opposite side surfaces of the two groups of connecting bodies is a closed chamber.

4. The high-density circuit board inspection device according to claim 2, wherein: the adsorption unit comprises an outer cylinder shell, one side of the outer cylinder shell is extended to form a joint mouth, the joint mouth is connected with the synchronous belt, the tail end of the joint mouth stretches into the closed cavity, an adsorption assembly is further arranged in the outer cylinder shell, and a plurality of groups of adsorption assemblies are arranged along the width direction of the synchronous belt.

5. The high-density circuit board inspection device according to claim 4, wherein: the adsorption component comprises an inner fixed body arranged in the outer cylinder shell, an adsorption pipe extends from one side of the inner fixed body, which is away from the synchronous belt, and the tail end of the adsorption pipe extends out of the outer cylinder shell and is provided with an adsorption head; the inner fixing body is provided with a sliding hole communicated with the adsorption pipe towards one side of the synchronous belt, the bottom of the inner fixing body is provided with a valve slot, the wall of the sliding hole is provided with a first connecting hole and a second connecting hole communicated with the valve slot, the first connecting hole is positioned at one side of the second connecting hole towards the adsorption pipe, the wall of the sliding hole is also provided with a third connecting hole communicated with the inner cavity of the outer cylinder shell, the axial lead of the third connecting hole and the axial lead of the second connecting hole are positioned in the same plane, the wall of the valve slot facing the synchronous belt is provided with a first valve hole, and the valve slot is communicated with the adsorption pipe through the second valve hole; the top of the inner fixing body is provided with an air hole III which is communicated with the sliding hole and is coaxial with the connecting hole I, and the outer surface of the outer cylinder shell is provided with an air hole I which is communicated with the air hole III and an air hole II which is communicated with the valve groove.

6. The high-density circuit board inspection device according to claim 5, wherein: an inner support is arranged in the adsorption tube, the adsorption assembly further comprises a needle bar, one end of the needle bar is positioned at one side of the adsorption head, which is away from the synchronous belt, the other end of the needle bar passes through the inner support and is coaxially positioned in the sliding hole, a limiting ring positioned at one side of the inner support, which is towards the adsorption head, is arranged outside the needle bar, and a first spring positioned between the inner support and the limiting ring is sleeved outside the needle bar; the outside of needle bar is provided with the annular, and in the initial state, annular and connecting hole one and gas pocket three intercommunication, connecting hole two and connecting hole three are by the needle bar shutoff.

7. The high-density circuit board inspection device according to claim 6, wherein: the adsorption component further comprises a valve core sleeved in the valve groove, the valve core comprises a first plugging section, a second plugging section and a connecting section for connecting the first plugging section and the second plugging section, one end of the first plugging section, which faces the sliding hole, is opened, the other end of the first plugging section is closed and is connected with the connecting section, the diameter of the connecting section is smaller than that of the valve groove, a second spring is arranged between the bottom of a cavity of the first plugging section and the bottom of the valve groove, when the opening end of the first plugging section contacts with the bottom of the valve groove, the connecting section is positioned between the first valve hole and the second valve hole, and in an initial state, the first valve hole and the second valve hole are plugged by the first plugging section.

8. The high-density circuit board inspection device according to claim 7, wherein: the withdrawal unit comprises an installation body arranged in the closed cavity, the installation body is provided with an installation hole along the direction vertical to the outer surface of the synchronous belt, the orifice of the installation hole facing the conveying mechanism is provided with a built-in step, the other orifice is provided with a cover plate, the side surface of the installation body along the width direction of the synchronous belt is provided with a constant pressure hole communicated with the installation hole, and the connecting frame is provided with an outer hole communicated with the constant pressure hole.

9. The high-density circuit board inspection device according to claim 7, wherein: the installation hole is sleeved with a sliding body, the sliding body comprises a solid section and a hollow section, the solid section is in contact with the built-in step in an initial state, the hollow section is used for plugging the orifice of the constant pressure hole, the outer circular surface of the hollow section is provided with a through hole, and the through hole is positioned on one side of the constant pressure hole facing the solid section; the one end extension of solid section has the tube head, and the terminal mounting hole and the fillet of stretching out of tube head, and the other end of solid section is provided with the mounting groove, and the tank bottom of mounting groove is provided with the hole of wearing to establish with the tube head intercommunication, and the notch department of mounting groove is provided with the fixed plate, is provided with the spring III between fixed plate and the apron, has seted up the centre bore with the mounting groove intercommunication on the fixed plate.

10. The high-density circuit board inspection device according to claim 9, wherein: a piston is sleeved in the mounting groove, a spring IV is arranged between the piston and the bottom of the mounting groove, a piston rod extends from the end face of the piston, and the tail end of the piston rod passes through the penetrating hole and is positioned in the pipe head; the end face of the solid section is provided with a second side hole in a penetrating mode, the second side hole is communicated with the hollow section, the second side hole is communicated with the penetrating hole through the first side hole, the inside of the piston rod is hollow, a third side hole is formed in the outside of the piston rod, and in an initial state, the third side hole is located on one side of the first side hole, which faces the hollow section.