CN116648998A - Control device and manufacturing method - Google Patents

Abstract

The invention relates to a control device having a housing, control electronics arranged in the housing, and at least one electrical feedthrough. The electrical feedthrough leads can be used to supply a load arranged outside the housing of the control device with current. The electrical through-guide is arranged on the housing. The housing is at least partially fluid-tight, wherein the electrical feedthrough is arranged in a fluid-tight region of the housing. The electrical penetration guide has a metal core and an insulator surrounding the metal core. The metal core has an end side. The first bond connection is arranged between the end side of the metal core and the control electronics, wherein the first bond connection is laser bonded on the end side.

Description

Control device and manufacturing method

Technical Field

The present invention relates to a control device and a method for manufacturing a control device.

Background

It is known from the prior art to seal a control device together with control electronics arranged in the control device with respect to a gaseous or liquid medium. In order to provide a current or voltage outside the sealed housing of the control device, an electrical feedthrough can be used. The through-guide is usually formed from a circular metal core, wherein the circular metal core is cast with glass in order to electrically insulate the metal core from the housing. The combination of glass and metal core results in a seal against fluids (i.e., gases or liquids). For connecting the metal core to the control electronics, the guide element can be welded or soldered or plugged. In soldering or welding, it may occur that cracks develop in the glass due to the high temperatures that occur during the welding or soldering process, so that the electrical feedthrough leads become unsealed from the gas or liquid. In the case of plug connections, mechanical effects on the insulator which lead to leakages can also occur. Furthermore, the corresponding plug elements have to be arranged on one side of the control electronics, which makes the manufacturing process more complicated.

Disclosure of Invention

The object of the invention is to provide a control device in which the electrical feedthrough is reliably connected to the control electronics and during this process no damage is caused to the insulation of the electrical feedthrough, in particular with glass. Another object of the invention is to provide a corresponding manufacturing method.

These objects are solved by the subject matter of the independent claims. Advantageous developments are specified in the dependent claims.

The control device has a housing, control electronics arranged in the housing, and at least one electrical feedthrough. By means of the electrical through-going guide, a load arranged outside the housing of the control device can be supplied with current. Preferably, the load is an electrically driven compressor, and preferably the control device controls the electrically driven compressor. Preferably, the load can be embodied as a component, in particular a valve or a pump, through which the fluid flows during operation.

The electrical feedthrough is arranged for this purpose on the housing, and the housing is at least partially fluid-tight. The electrical feedthrough is arranged in the fluid-tight region of the housing. The electrical penetration guide has a metal core and an insulator surrounding the metal core. The metal core has an end side, wherein a first bond connection is arranged between the end side of the metal core and the control electronics. The first bonding connection is laser bonded on the end side.

The metal core of the electrical through-guide portion is insulated from the housing by the insulator surrounding the metal core, so that a load outside the housing can be supplied with an electric current well without causing a short circuit with the housing. If necessary, the housing can be completely fluid-tightly closed and has, for example, a first housing half and a second housing half, with a seal being arranged between the housing halves. The control device can be installed, for example, in a vehicle in such a way that fluid, i.e. gas or liquid, can reach the housing from the outside at least in the area of the fluid seal of the housing, and penetration of the fluid in the area of the fluid seal of the housing should be prevented. The end side of the metal core can be arranged within the housing such that the first bond connection provides an electrical connection between the metal core and the control electronics and by means of which the current can be conducted from the control electronics to the load via the electrical through-lead.

The insulator can have glass and be designed, for example, in the form of a glass layer. The glass forms an electrical and fluid insulator. The insulator prevents the penetration of fluids into the housing in the region of the electrical feedthrough. Just in the case of a load configured as a compressor, the fluid may have a high pressure within the load housing of the load. If a part of the housing now also forms a load housing at the same time, the fluid under pressure acts directly on the elements in the region of the electrical through-lead. The insulator can likewise have rubber or ceramic. Combinations of the mentioned materials are also possible.

Here, the first bonding connection part can include a bonding wire or a bonding tape. Since the first bond connection is laser bonded on the end face, the end face is electrically conductively connected to the first bond connection, wherein a connection region is present at the transition between the end face and the first bond connection as a result of the laser bonding process, wherein the connection region is composed of the melted and resolidified material of the first bond connection and of the metal core.

The method for manufacturing the control device comprises the following steps:

-providing a housing, wherein the housing has at least one electrical feedthrough, wherein the housing is at least partially fluid-tight, wherein the electrical feedthrough is arranged in a fluid-tight region of the housing, wherein the electrical feedthrough has a metal core and an insulator surrounding the metal core, wherein the metal core has an end face;

-arranging control electronics in the housing;

-arranging a first bond connection between the end side of the metal core and the control electronics;

-laser bonding the first bond connection on the end side.

The laser bonding of the first bond connection on the end side can be realized in such a way that the first bond connection is in mechanical contact with the end side and the first bond connection and the end side lying thereunder are then heated and partially melted by means of the focused laser beam. After switching off the laser again, a connection region is then formed between the first bonding connection and the end face, wherein the melted and subsequently resolidified material of the first bonding connection and of the metal core is initially disposed in the connection region. Thereby, an electrically conductive and mechanically stable connection is produced between the metal core and the first bonding connection.

The laser radiation for laser bonding can be provided, for example, with a fiber laser having a power of approximately 1000 watts and an emission wavelength of 1070 nm. However, other laser types, laser powers and wavelengths are also conceivable. The laser beam can be guided in a circular oscillating manner, if necessary, in order to achieve a large impingement surface of the laser beam on the first bonding connection and thus a large connection surface and a low contact resistance. The arrangement of the first bond connection and the laser bonding can optionally be carried out in a common step. For this purpose, a commercial system is available in which the arrangement of the first bond connection and the laser bonding are performed in one step, which commercial system has in particular the characteristics of the laser mentioned above.

By arranging the first bonding connection and laser bonding the first bonding connection with the metal core, several advantages for the control device and the manufacturing method are achieved. First, the possibility of damaging the insulator, in particular the glass or ceramic of the insulator, is reduced compared to setting the connection by means of a welding or soldering method, since the temperatures occurring during laser bonding are significantly lower. Furthermore, the first bond connection can move within a certain range and compensate for manufacturing tolerances, for example, manufacturing tolerances of the electrical feedthrough and different thermal expansions of the electrical feedthrough and the control electronics.

In one embodiment of the control device, the control electronics are arranged on a circuit board and the first bond connection is laser bonded on the circuit board. Therefore, with the manufacturing method, the first bonding connection portion is placed on the circuit board and also laser-bonded with the circuit board, similarly to the processing manner of laser bonding between the first bonding connection portion and the end side of the metal core. Laser bonding is a joining method suitable for thin workpieces, in particular for bonding joints, preferably bonding wires or bonding tapes (in the region of approximately 100 μm), so that the first bonding joint can be bonded directly to the circuit board by laser if necessary. This enables a particularly simple manufacturing method.

In one embodiment of the method, a buffer board is disposed on the circuit board. The first bonding connection part is laser bonded on the buffer plate. The buffer plate can be a rectangular parallelepiped made of metal, which is fastened, e.g. soldered, to the circuit board using conventional methods. In the manufacturing method, the buffer board can be placed on a circuit board and soldered, for example, or the buffer board has been arranged on a circuit board of a control electronics. In both cases, the buffer plate can be designed as an SMD component and connected to the control electronics by means of SMD soldering. The buffer plate provides several advantages in laser bonding, namely: thanks to the buffer plate, firstly a thicker metal layer (buffer plate itself) is available for the laser bonding process and secondly the buffer plate is able to more easily conduct away the process heat generated during laser bonding.

In one embodiment, the circuit board has a thermally conductive structure in the region of the first bond connection. The thermally conductive structure is in thermally conductive connection with the housing and is electrically insulated from the housing. In the manufacturing method, the thermally conductive structure can already be part of a circuit board of the control electronics. The heat conducting structure can be configured in the form of a through-hole, in particular a copper through-hole, so that heat can be conducted through the through-hole. A thermally conductive paste, for example based on silicon, can be arranged between the circuit board and the housing. Here, the thermal paste can have good thermal conductivity and poor electrical conductivity, so that the thermal structure is electrically insulated from the housing by the thermal paste without impeding the heat conduction from the thermal structure to the housing. In the method of manufacture, it can be provided that a thermally conductive paste is applied to the region in the housing before the control electronics are arranged.

The metal core of the electrical feedthrough can be designed essentially round. This means that the metal core is designed to be circular, in particular in the region of the insulator, and that the insulator surrounds the metal core as a circular jacket layer. This can be easier to achieve in terms of process technology than other cross sections of the metal core.

In one embodiment of the control device, the end side of the metal core has a base which protrudes beyond the metal core. The base can be one-piece or two-piece with the metal core. Thus, the metal core and the base can be manufactured from one piece or from two different pieces and connected to each other. In this case, the end side of the metal core is the end side of the base. Thereby, the contact surface of the electrical penetration guide can be increased, and thus laser bonding of the first bonding connection on the end side can be simplified as necessary.

In one embodiment of the control device, the electrical feedthrough is designed such that the current supplied to the load is greater than 1 ampere, in particular greater than 10 amperes, and preferably in the range of 100 amperes. In this case, at least one bond connection, in particular at least one bond wire and/or at least one bond ribbon should be provided in any case at higher currents, in particular in the range of 10 amperes or more, since the bond wires are no longer suitable for these high currents. For particularly high currents in the range of 100 amperes, it can additionally be provided that the first bond connection comprises more than one individual bonding strip or individual bonding wires, in particular two or more. This can be particularly easy to implement when a buffer plate is used on the circuit board, since the buffer plate then provides a sufficiently large area for connecting the first bond connection. If necessary, in this embodiment, it is also advantageous to use a metal core base in order to increase the existing area also in the region of the electrical through-going guide.

In one embodiment of the control device, the power supply is directed through the housing. The control electronics are connected to the power supply by means of a second bond connection, wherein the second bond connection is laser-bonded to the power supply and the control electronics. The power supply can likewise be configured in the form of an electrical through-connection, but can also be configured in the form of a conventional plug, depending on whether the housing is designed to be fluid-tight in the region of the power supply. It is also possible to provide a buffer plate on the circuit board of the control electronics in the region of the power supply, so that the advantages of the buffer plate described in connection with the first bond connection are also used in the region of the power supply. In the manufacturing method, the second bond connection is placed onto the power supply and control electronics and laser bonded as also described for the first bond connection. In this case, it is particularly advantageous if the laser bonding of the first bonding connection and the laser bonding of the second bonding connection can be performed in one working step, i.e. in particular in one machine.

Furthermore, a signal plug can be additionally provided on the housing, with which the control electronics can receive control signals from the outside or read measured values from the sensor. These signal plugs can also be laser-bonded to the control electronics in order to also be able to electrically connect the signal plugs to the control electronics in a workflow.

In one embodiment of the control device, the metal core has copper or iron. Copper is very suitable as a material for laser bonding processes, wherein the metal core here can for example comprise pure copper with a purity of at least 99.99%, but can also comprise specific copper alloys. For example, such copper alloys can have, in addition to copper, chromium in a mass content of between 0.7% and 1.4% and a small amount of zirconium. The remainder of the alloy is copper. If the metal core has iron, an iron-nickel alloy can be provided in particular, which has, for example, between 45 and 55 mass% iron, between 45 and 55 mass% nickel and up to 0.5 mass% silicon. These materials are also suitable for use in laser bonding processes. Selected based on thermal expansion and electrical conductivity. The thermal expansion must be similar to that of the insulator and/or metal plate. The iron-nickel alloys mentioned previously have these advantageous properties. In one embodiment of the control device, the first bond connection comprises copper or aluminum. In particular copper strips with cross sections of 2mm to 0.2mm (von 2mm auf 0,2 mm) or 2mm to 0.3mm or similar orders of magnitude, or aluminum strips in the same order of magnitude, are well suited for manufacturing laser-bonded connections with metal cores. If a second bond connection is provided for the power supply, the second bond connection can be composed of the same material as the first bond connection.

In one embodiment of the control device, the control electronics comprise a motor control. The motor control unit is designed here to perform a three-phase actuation of a load designed as a motor. In order to be able to do this, at least one electrical through-guide is provided for each motor phase, which is connected to the control electronics by means of a first bond connection, respectively. Preferably, more or fewer, in particular two, four or six, electrical through-leads can also be configured. Thus, three electrical through-leads are arranged in the housing, which are each connected to the control electronics by means of a first bonding connection and are each laser bonded to the metal core of the associated electrical through-lead and to the control electronics. Three electrical feedthrough guides can be used to provide one of three phases, also indicated by the letter UVW, respectively. Instead of a three-phase control, a further multiphase control can be provided, wherein a separate electrical feedthrough can be provided for each of the phases of the multiphase control. In particular, an electrically commutated electrically driven compressor has three phases and thus an electrical through-lead.

In particular, a motor can be provided as a load, wherein it can be provided that the motor drives a compressor, a fan, a pump, a window lifter or an expansion valve for the refrigerant. In this case, it is possible, for example, for the motor and the compressor to be exposed to gases or liquids which are not allowed to enter the control electronics, so that an advantageous design can be achieved by the above-described sealing of the housing. Preferably, there is a fluid with a significantly greater pressure in the compressor or valve. The fluid is not allowed to penetrate into the housing. The same applies if the expansion valve for the refrigerant can be driven by means of the control device, since the refrigerant can also be harmful to the control electronics. Even when used in a hydrogen system, hydrogen is not allowed to permeate into the housing. The control device according to the invention can also be used as a transmission control device, wherein the components to be driven on the outside of the housing can be arranged in the transmission and thus exposed to the transmission oil, wherein the transmission oil should likewise not enter the control device or the housing of the control device. Furthermore, the control device can be advantageously used in an inverter of an electric vehicle.

Drawings

Embodiments of the present invention are illustrated in accordance with the following figures. In the schematic:

FIG. 1 shows a cross-sectional view through a control device and a load;

FIG. 2 shows an enlarged view of a connection between a metal core and a first bond connection;

FIG. 3 shows a cross-sectional view through another control device;

FIG. 4 shows a flow chart of a method of manufacture;

FIG. 5 shows an isometric view of a control device;

FIG. 6 shows an isometric view of a compressor; and is also provided with

Fig. 7 shows a through guide member.

Detailed Description

Fig. 1 shows a cross-sectional view through a control device 100 having a housing 110 and control electronics 120 arranged in the housing 110. Adjacent to the housing 110, the load 200 is located in a load housing 201 having a load housing interior space 202. The load is in particular an electrically driven compressor. In the compressor, a fluid, in particular gaseous, is present in the load housing interior 202, and the pressure of the fluid can be significantly increased relative to the pressure within the housing 110. The housing 110 also has an electrical feedthrough 130, wherein an electrical current can be supplied to a load 200 arranged outside the housing 110 using the electrical feedthrough 130. Here, the housing 110 is at least partially fluid-tight, and the electrical feedthrough 130 is arranged in a fluid-tight region 111 of the housing 110. In the fluid-tight region 111, the housing 110 is thus fluid-tight with respect to a fluid, such as, for example, a liquid or a gas, disposed in the load housing interior 202.

The electrical feedthrough guide 130 has a metal core 131 with an end side 132, wherein the end side 132 is arranged inside the housing 110. Preferably, the metal core is cylindrically configured. The electrical feedthrough 130 also has an insulator 133 surrounding the metal core 131, wherein the metal core 131 is electrically insulated from the housing 110 by the insulator 133. Preferably, the insulator 133 coaxially surrounds the metal core. The first bond connection 140 is arranged between the control electronics 120 and the end side 132 of the metal core 131. The first bond connection 140 can be designed as a bond wire or a bond ribbon and serves to guide the current from the control electronics 120 to the through-guide 130 and further to the load 200. The first bonding connection 140 is laser bonded on the end side 132. This means that the material of the first bond connection 140 is placed onto the end side 132 and subsequently irradiated by means of a laser. The connection region is realized by laser irradiation in such a way that: the metal core 131 and the first bonding connection part 140 are connected to each other. Advantageously, the insulator 133 is not damaged by the bond connection. Such damage may reduce fluid tightness, whereby fluid may penetrate into the housing 110. Only small forces and heat inputs are also required in the establishment of the bond connection.

Here, the insulator 133 can have glass, rubber, or ceramic or a combination of these materials. Advantageously, the insulator 133 is composed of glass. The glass causes electrical insulation and isolation against fluid penetration. The insulator 133 can be designed in particular as a glass layer or a ceramic layer.

Fig. 2 shows an enlarged cut-out of the connection between the first bond connection 140 and the metal core 131. The connection region 141 here extends from the metal core 131 to the first bonding connection 140. During laser bonding, the material of the metal core 131 and the first bonding connection 140 is melted by the energy of the injected laser light and solidifies into the connection region 141 after switching off the laser light, wherein not only the material of the metal core 131 but also the material of the first bonding connection 140 is also arranged in the connection region 141. To illustrate this, the connection region 141 is shown in dashed lines. Preferably, laser bonding enables a connection region that protrudes into the bonded connection 140 in a similar manner as it protrudes into the metal core. Laser bonding enables a well-metered and targeted use of energy.

Fig. 3 shows a cross-sectional view through a further embodiment of the control device 100, which in principle corresponds to the control device 100 of fig. 1, but has further optional features. The individual additional features described below can also be implemented separately and additionally in the control device 100 of fig. 1. Various such embodiments are described below, which can also be implemented in the control device 100 of fig. 1, if desired.

In one embodiment, the control electronics 120 are disposed on a circuit board 121. A circuit board is understood to mean a circuit carrier, in particular a carrier for electronic components. The circuit board comprises epoxy, paper, fiber reinforced plastic, ceramic substrate (DBC, LTCC, LCTC) or Insulated Metal (IMS). Thus, the circuit board is constructed as a DBC-, LTCC-, LCTC-, IMS-circuit board. The first bonding connection 140 is laser bonded to the circuit board 121. This can be achieved, for example, by laser bonding the first bond connection 140 on the conductor tracks of the circuit board 121. Accordingly, the first bonding connection part 140 can be directly laser-bonded with the circuit board 121.

In one embodiment, as shown in fig. 3, a buffer board 122 is disposed on the circuit board 121, and the first bonding connection part 140 is laser bonded on the buffer board 122. The buffer plate 122 here provides, in particular, a greater material thickness, so that the laser bonding process can be constructed more simply with a connection region similar to that of fig. 2.

Also shown as a further embodiment in fig. 3 is that the circuit board 121 has a thermally conductive structure 123 in the region of the first bond connection 140. Here, the heat conductive structure 123 can be constituted by a through hole that leads through the circuit board 121. The thermally conductive structure 123 is thermally conductive with the housing 110 and electrically insulated from the housing 110. This can be achieved, for example, in the following way: a thermally conductive, but electrically non-conductive paste 124 is arranged between the circuit board 121 and the housing 110 in the region of the thermally conductive structure 123. The thermally conductive paste 124 can here comprise silicon.

In one embodiment, as shown in FIG. 3, the housing 110 is made of a lower member 112 having a fluid-tight region 111 with an electrical feedthrough 130, and a cover 113. A seal 114 is arranged between the cover 113 and the lower part 112, so that the entire housing 110 can be designed fluid-tight.

In one embodiment, the electrical feedthrough 130 is designed as a feedthrough guide 135 with a metal plate 134. In this case, a metal core 131 with an insulator 133 is arranged on a metal plate 134 and is fastened to the fluid-tight region 111 of the housing 110 by means of a seal 114. This makes it possible, if necessary, to removably arrange the through-guide 135 on the housing 110 and thus replace the defective electrical through-guide 130.

The metal plate 134 has, for each electrical through-guide 130, in particular a recess, in particular a cylindrical through-recess, preferably a hole. The electrical through guide 130 is guided through the recess. The recess is in particular configured as a through recess. If no metal plate is constructed, a corresponding recess is constructed in the housing. Illustratively, the metal plate 134 in fig. 3 forms part of the housing 110 of the control device 100 and at the same time forms part of the load housing 201 of the load 200. The metal plate in turn closes the recess in the housing 110. Preferably, the metal plate closes a recess between the housing 110 of the control device and the load housing 201. Advantageously, the metal plate 134 can be manufactured together with the electrical feedthrough 130 and the insulator 133 and then be fitted as a component into a recess provided for this purpose. In particular, the metal sheet is attached to one or both housings by means of welding, soldering, adhesive bonding, screwing, riveting. The sealing of the metal plate is achieved by a further insulator, in particular a sealing ring, or also by glass.

The insulator 133 is constructed around the metal core 131 of the electrical penetration guide 130. The insulator is in particular coaxially constructed around the metal core 131. After being positioned within the recess, the insulator is at least partially liquefied. Thereby, the insulator closes the open area around the metal core 131. The insulator 133 closes the opening and the open area between the recess and the metal core 131.

In one embodiment, the housing 110 additionally has a power source 115 directed through the housing 110. Here, the power supply 115 is designed with a plate, in particular a metal plate, a metal core and an insulator 133, similar to the electrical through guide 130. This is advantageous in particular in combination with the already described embodiment of the housing 110 with a complete fluid seal, since in this case a seal can also be achieved in the region of the power supply 115 to prevent fluids. If the housing 110 is fluid-tight only in the fluid-tight region 111, a conventional, non-fluid-tight plug can also be installed if necessary instead of the power supply 115 shown in fig. 3. The control electronics 120 is connected to the power supply 115 by means of a second bond connection 150. The second bonding connection 150 is laser bonded to the power supply 115. It is also possible to provide that the second bond connection 150 is also laser bonded to the control electronics 120 and in particular to the circuit board 121. Also optionally, an additional buffer plate 122 can be provided here.

The circuit board 121 of the control electronics 120 additionally has an electronic component 125, which can be used to control the load 200.

In the control device 100 shown in fig. 1 to 3, it can be provided that the metal core 131 has copper or iron. The metal core 131 can in particular be made of pure copper with a copper content of at least 99.99% or of a copper alloy with 0.7% to 1.4% chromium and a small amount of zirconium. The alloy must have similar thermal expansion and high electrical conductivity as the insulator 133. The differential thermal expansion results in movement of the insulator. The low conductivity results in an increase in cross section. The alloys listed here meet the requirements in an inventive manner. Furthermore, the metal core 131 can be designed as an iron-nickel alloy, wherein in particular, an iron content of between 45% and 55% and a nickel content of between 45% and 55% as well as up to 0.5% silicon can be provided as alloy components. For example, an alloy of 52% nickel and 48% iron can be provided without silicon. Alternatively, an alloy can be provided having between 50.8% and 51.2% nickel, between 48.8% and 49.2% iron, and up to 0.3% silicon. Here, the percentage value can refer to mass percent.

The buffer plate 122 can be composed of the same material as the metal core 131 and in particular copper.

The first bonding connection 140 can have copper or aluminum. The second bond connection 150 can likewise have copper or aluminum.

Fig. 4 shows a flow chart 300 of a method for producing the control device 100 as shown in fig. 1 or 3. In a first method step 301, a housing 110 is provided. The housing 110 has an electrical through-guide 130 and is partially fluid-tight, wherein the electrical through-guide 130 is arranged in a fluid-tight region 111 of the housing 110. The electrical feedthrough guide 130 has a metal core 131 and an insulator 133 surrounding the metal core 131, wherein the metal core 131 also has an end face 132. It can be provided here that in a first method step 301, the electrical through-guide 130, which is configured as the through-guide 135, is first inserted into the housing 110. The through guide 135 includes an electrical through guide 130 and an insulator 133. The through-guide 135 has a recess, in particular a cylindrical through-hole, into which the electrical through-guide 130 is introduced. The insulator 133 is melted, whereby the region between the metal core and the metal plate of the electrical penetration guide 130 is sealed fluid-tightly.

If the housing 110 is designed with a lower part 112 and a cover 113 as shown in fig. 3, it can be provided that only the lower part 112 of the housing 110 is provided first and that the cover 113 is only placed after further method steps. In a second method step 302, the control electronics 120 are arranged and, for example, fixedly inserted or screwed into the housing 110. In a third method step 303, the first bond connection 140 is arranged between the end side 132 and the control electronics 120.

In a fourth method step 304, the first bond connection 140 is laser bonded to the end side 132, wherein the connection region 141 shown in fig. 2 can thereby be constructed. In an optional fifth method step 305, the first bond connection 140 can likewise be laser bonded to the circuit board 121 or the buffer plate 122.

In an optional sixth method step 306, the second bond connection 150 of fig. 3 can be arranged and likewise laser-bonded between the control electronics 120 and the power supply 115, wherein additionally the second bond connection 150 can also be laser-bonded on the control electronics 120 or the circuit board 121.

Fig. 5 shows an isometric view of the control device 100, wherein the housing 110 has a lower part 112 as in fig. 3, and the cover 113 shown in fig. 3 is omitted in order to make visible the structural elements arranged within the housing 110. Of course, similar to fig. 3, the cover 113 can be placed onto the lower part 112 of the housing 110. The control electronics 120 in turn have a circuit board 121. The control electronics 120 here comprise a motor control. The motor control is designed to perform a three-phase control of a load 200 designed as a motor. To enable this, three electrical through-guides 130 are provided, each having an end side 132 and each being connected to the buffer plate 122 on the circuit board 121 by means of two first bond connections 140. Laser bonding connection parts are respectively designed between the first bonding connection part 140 and the through guide part 130 and between the first bonding connection part 140 and the buffer plate 122 as described above. Two first bonding connections 140 are provided for each electrical feedthrough 130 so that the total current flowing through the electrical feedthrough 130 can be increased.

The first bond connections 140 are each designed as a bond ribbon in the exemplary embodiment shown in fig. 5. For example, such a bonding tape can have a cross section of 2mm to 0.3 μm and is therefore also suitable for high currents. In particular, it can be provided that a current of more than 1 ampere flows through the electrical feedthrough 130 (for example also in the embodiment of fig. 1 and 3). In particular, it can also be provided for the motor control that the current is greater than 10 amperes or even lies in the range of 100 amperes. In order to enable the passage of 100 amperes through the electrical feedthrough 130, it is provided in particular that two first bond connections 140 are provided for each electrical feedthrough 130. Below the buffer plate 122 is arranged a heat conducting structure as already described in connection with fig. 3, which has a good thermal connection with the housing 110 and an electrical insulation with the housing 110. Thus, it is possible for the current which normally flows in the range of 100 amperes for motor actuation to be able to heat the first bond connection 140 to a maximum of 200 ℃ and the buffer plate 122 to a maximum of 100 ℃ during operation, and thus to supply the required current without damaging the components.

The lower part 112 of the housing 110 additionally has two poles of a power supply 115, each of which has a metal plate 116 at its upper end. The metal plate 116 is connected to the buffer plate 122 of the circuit board 121 by two second bonding connection portions 150, respectively, wherein the second bonding connection portions 150 are laser bonded to the metal plate 116 and the buffer plate 122, respectively. Two second bond connections 150 are also provided here in each case in order to be able to receive the current.

Fig. 6 shows an isometric view of the control device 100 of fig. 5 placed on a load 200. The load 200, which is not shown due to the load housing 201, is designed as an electric motor and serves to drive the compressor 205. The load is here an electric motor driving the compressor 205. Here, the gas flowing through the compressor 205 enters the load housing 201 and is isolated from the interior space of the housing 110 by the fluid-tight region 111 that electrically penetrates the guide 130 and the housing 110. Thus, gases that may be harmful to the control electronics 120 (which are compressed using the compressor 205) cannot enter the control electronics 120. The cover 113 is also not shown as in fig. 5 and 6.

Instead of an electric motor and compressor 205, as shown in fig. 5 and 6, the load 200 can also comprise a valve, for example an expansion valve for the refrigerant. A load, such as, for example, a hydrogen valve or a hydrogen pump, can also be part of the fuel cell. Furthermore, an electric motor can be provided, which is operated by the control electronics 120 and drives a fan or coolant pump, wherein the gas or coolant that is moved by the fan is likewise not admitted to the control electronics 120, and thus a fluid-tight region 111 is likewise provided. Alternatively, the load can also be, for example, an adjusting device in an automatic transmission, a window lifter motor, a pump, for example a petrol pump, or an inverter of an electric vehicle. These components may also be exposed to fluids that should not enter the control electronics 120.

Fig. 7 shows a through-guide 135, as it can be used if necessary in the control device 100 of fig. 5 and 6. The through-guide 135 has three electrical through-guides 130, each of which has a metal core 131 and an insulator 133, which are each inserted into a metal plate 134. The end side 132 has a base 136 that protrudes beyond the metal core 131. Such a base is particularly advantageous if the metal core 131 has a diameter which may not enable the arrangement of two or more first bond connections 140 on the end side 132. The area of the end side 132 is increased by the pedestals 136 protruding beyond the metal core 131. The base 136 can be embodied in one piece with the metal core 131 or welded to the metal core 131 or connected to the metal core 131. However, the end side 132 correspondingly refers to the end side of the overall member constituted by the metal core 131 and the base 136.

In addition to the electrical through-guide 130 and the power supply 115 shown in the figures, it can also be provided that a signal plug is arranged on the housing 110, which signal plug is likewise connected to the control electronics 120 in the housing 110 by means of a laser bonding process. The control electronics can thus be connected to all relevant components in the working step overall by means of a laser bonding process. The electrical feedthrough 130 with the metal core 131 and insulator 133 is not susceptible to damage, particularly during the laser bonding process, so that the electrical feedthrough 130 is also fluid-tight after laser bonding. This enables advantages in terms of manufacturing technology to be achieved over fusion welding methods and soldering methods or plugging methods.

Although the invention has been described in detail with reference to preferred embodiments, the invention is not limited to the examples disclosed and other variants can be derived by a person skilled in the art without departing from the scope of protection of the invention.

Claims (12)

1. A control device (100) having a housing (110), control electronics (120) arranged in the housing (110) and at least one electrical feedthrough (130), wherein a load (200) arranged outside the housing (110) of the control device (100) can be supplied with current by the electrical feedthrough (130), wherein the electrical feedthrough (130) is arranged on the housing (110), wherein the housing (110) is at least partially fluid-tight, wherein the electrical feedthrough (130) is arranged in a fluid-tight region (111) of the housing (110), wherein the electrical feedthrough (130) has a metal core (131) and an insulator (133) surrounding the metal core (131), wherein the metal core (131) has an end face (132), wherein a first bond connection (140) is arranged between the end face (132) of the metal core (131) and the control electronics (120), wherein the first bond connection (140) is bonded on the laser end face (132).

2. The control device (100) according to claim 1, wherein the control electronics (120) are arranged on a circuit board (121) and the first bond connection (140) is located on the circuit board (121).

3. The control device (100) according to claim 2, wherein a buffer plate (122) is arranged on the circuit board (121), and the first bonding connection (140) is laser-bonded on the buffer plate (122).

4. A control device (100) according to claim 2 or 3, wherein the circuit board (121) has a thermally conductive structure (123) in the region of the first bond connection (140), wherein the thermally conductive structure (123) is thermally conductively connected to the housing (110), wherein the thermally conductive structure (123) is electrically insulated from the housing (110).

5. The control device (100) according to any one of claims 1 to 4, wherein the end side (132) has a base (136) protruding beyond the metal core (131).

6. The control device (100) according to any one of claims 1 to 5, wherein a power supply (115) is guided through the housing (110), and wherein the control electronics (120) is connected to the power supply (115) by means of a second bond connection (150), wherein the second bond connection (150) is laser bonded to the power supply (115) and the control electronics (120).

7. The control device (100) according to any one of claims 1 to 6, wherein the metal core (131) has copper or iron.

8. The control device (100) according to any one of claims 1 to 7, wherein the first bond connection (140) has copper or aluminum.

9. The control device (100) according to any one of claims 1 to 8, wherein the control electronics (120) comprises a motor control, wherein end sides (132) of three electrical through-leads (130) are connected to the control electronics (120) by means of a first bond connection (140), and wherein the motor control is designed for performing a three-phase manipulation of the load (200) by means of the three electrical through-leads (130).

10. The control device (100) according to any one of the preceding claims, wherein the insulator (133) is constructed from glass, and wherein in particular the insulator (133) seals the housing (110) against fluid ingress in the region of the electrical through-lead (130).

11. The control device (100) according to any one of the preceding claims, wherein the load (200) is configured as a compressor with a compressor housing, and wherein an increased pressure is present within the compressor.

12. A method for manufacturing a control device (100), the method having the steps of:

-providing (301) a housing (110), wherein the housing (110) has at least one electrical feedthrough (130), wherein the housing (110) is at least partially fluid-tight, wherein the electrical feedthrough (130) is arranged in a fluid-tight region (111) of the housing (110), wherein the electrical feedthrough (130) has a metal core (131) and an insulator (133) surrounding the metal core (131), wherein the metal core (131) has an end side (132);

-arranging (302) control electronics (120) in the housing (110);

-arranging (303) a first bond connection (140) between an end side (132) of the metal core (131) and the control electronics (120);

-laser bonding (304) the first bond connection (140) on the end side (132).