CN116648437A - Fluid for forming glazing for portable electronic devices - Google Patents

Abstract

Techniques for manufacturing glass parts for electronic devices are disclosed. The disclosed techniques may be used to shape a glass workpiece to form a three-dimensional glass component, such as a glass cover member. A glass member and a housing are also disclosed, as are electronic devices including the glass member.

Description

Fluid for forming glazing for portable electronic devices

Cross Reference to Related Applications

The patent Cooperation treaty patent application claims priority from U.S. provisional patent application No. 63/154,159, entitled "Fluid Forming a Glass Component for a Portable Electronic Device", filed 26, 2, and U.S. provisional patent application No. 63/126,906, entitled "Fluid Forming a Glass Component for a Portable Electronic Device", filed 17, 12, 2020, the contents of both of which are incorporated herein by reference in their entirety.

Technical Field

The described embodiments relate generally to techniques for manufacturing glazing components for electronic devices. More particularly, embodiments of the invention relate to techniques for shaping glass workpieces using a fluid such as liquid metal or molten salt.

Background

Conventional electronic devices include glass portions, such as cover sheets and the like. Some of the glasses used for the cover sheets are hard and scratch resistant. However, these glasses may also have high molding temperatures. Thus, mechanical techniques such as grinding and polishing are traditionally used to shape the cover sheets formed from these glasses.

Disclosure of Invention

Techniques for forming glass parts for electronic devices are disclosed herein. In embodiments, the techniques disclosed herein may be used to form glass workpieces to produce three-dimensional glass components, such as glass cover members. The invention also relates to a glass component and a housing and an electronic device comprising the glass component.

In some examples, the shape of the glass workpiece is modified using a shaping technique in which a portion of the glass workpiece is molded between a mold tool and a heating fluid (such as molten metal or molten salt). The resulting molded glass workpiece may then be finished to produce a glass part.

The glass workpiece may be assembled with the first mold tool and the second mold tool to form an assembly comprising a fluid seal. A first region of the glass workpiece may be molded between the first mold tool and the heating fluid. In some cases, a fluid seal is formed between the second mold tool and the second region of the glass workpiece. The first region of the glass workpiece may be a central region of the glass workpiece and the second region of the glass workpiece may be a peripheral region of the glass workpiece.

The molding techniques disclosed herein may enable the production of glass components whose shape defines an undercut. The shaping techniques disclosed herein may be particularly useful for molding glass that becomes soft enough to be molded only at relatively high temperatures. For example, the molding techniques disclosed herein may be used for aluminosilicate glass and borosilicate glass.

The present disclosure provides a method for manufacturing a glazing component for an electronic device, the method comprising heating each of a first mold tool and a second mold tool to a first temperature. The method further includes positioning the glass workpiece between a first mold tool and a second mold tool, the second mold tool defining an opening positioned above the glass workpiece. The method further includes securing the first mold tool with the second mold tool to form a sealing interface at a parting line between the first mold tool and the second mold tool. The method further includes introducing a forming liquid into the opening at a second temperature, and pressurizing the forming liquid to deform the glass workpiece into the groove feature of the first mold tool, the second temperature being higher than the first temperature. The method further includes depressurizing and removing the forming liquid from the opening, separating the first mold tool and the second mold tool and removing the molded glass work piece, and finishing the molded glass work piece to produce the glass part.

The present disclosure also provides a method for manufacturing a glazing component for an electronic device, the method comprising heating a first mold tool and a second mold tool of a mold to a first temperature, and positioning a glass workpiece within the first mold tool and the second mold tool, a portion of the glass workpiece defining a fluid seal between the first mold tool and the second mold tool. The method further includes introducing a heating fluid into the mold, the heating fluid in contact with the first surface of the glass workpiece, the heating fluid at a second temperature greater than the first temperature, and pressurizing the heating fluid to deform a second surface of the glass workpiece opposite the first surface into the groove features of the second mold tool to form the molded glass workpiece. In addition, the method includes depressurizing and evacuating the heated fluid from the mold, removing the molded glass article from the mold, and finishing the molded glass article to produce the glass part.

Further, the present disclosure provides a glass member for an electronic device, the glass member defining a planar rear portion and a curved side portion extending from the planar rear portion. The curved side portions define an undercut and an opening to the glazing component.

Drawings

The present disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals designate like elements.

Fig. 1A depicts an exemplary electronic device.

Fig. 1B depicts another exemplary electronic device.

FIG. 2 illustrates a simplified cross-sectional view of an exemplary glass component manufactured using a molding technique.

Fig. 3 shows a flow chart of a molding process for manufacturing a glazing component.

Fig. 4 schematically illustrates the operation of positioning a glass workpiece between two mold tools.

Fig. 5A and 5B show partial cross-sectional views of stages in a process for manufacturing a glazing component.

Fig. 6A and 6B show partial cross-sectional views of a sealing arrangement.

Fig. 7 shows a partial cross-sectional view of another sealing arrangement.

Fig. 8 is a schematic illustration of the operation of removing a molded glass workpiece from two mold tools.

Fig. 9 shows an example of a glazing component defining an undercut.

Fig. 10 shows an example of a molded glass work piece in a portion of a mold tool.

FIG. 11 shows a block diagram of a sample electronic device that can incorporate glass components.

The use of cross-hatching or shading in the drawings is generally provided to clarify the boundaries between adjacent elements and also to facilitate legibility of the drawings. Thus, the presence or absence of a non-cross-hatching or shading does not indicate or indicate any preference or requirement for a particular material, material property, proportion of an element, dimension of an element, commonality of similar illustrated elements, or any other feature, attribute, or characteristic of any element shown in the drawings.

Additionally, it should be understood that the proportions and dimensions (relative or absolute) of the various features and elements (and sets and groupings thereof) and the limitations, spacings, and positional relationships presented therebetween are provided in the drawings, merely to facilitate an understanding of the various embodiments described herein, and thus may be unnecessarily presented or shown to scale and are not intended to indicate any preference or requirement of the illustrated embodiments to exclude embodiments described in connection therewith.

Detailed Description

Reference will now be made in detail to the exemplary embodiments illustrated in the drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred implementation. On the contrary, the described embodiments are intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the disclosure and defined by the appended claims.

The following disclosure relates to techniques for manufacturing glass components for electronic devices. In embodiments, the techniques disclosed herein may be used to shape a glass workpiece to produce a three-dimensional glass part. By way of example, the three-dimensional glass component may be a glass cover member or a glass housing.

In some examples, the shape of the glass workpiece is modified using a shaping technique in which a portion of the glass workpiece is molded between a mold tool and a heating fluid (such as molten metal or molten salt). The heating fluid may also be referred to herein as a shaping fluid or shaping liquid. The resulting molded glass workpiece may then be finished to produce a glass part.

In some cases, the glass workpiece may be assembled with a first mold tool and a second mold tool. The first mold tool may define a groove feature and the second mold tool may define an opening positioned over the glass workpiece, an example of which is shown in fig. 4. During operation of forming the glass workpiece, the opening provides a conduit for the heated fluid to enter the upper mold tool, as described in further detail below with respect to fig. 3.

The glass workpiece may be assembled with the first mold tool and the second mold tool to form an assembly comprising a fluid seal. A first region of the glass workpiece may be molded between the first mold tool and the heating fluid. In some examples, a fluid seal is formed between the second mold tool and the second region of the glass workpiece. This example is not limiting and alternative sealing arrangements are described below. The first region of the glass workpiece may be a central region of the glass workpiece and the second region of the glass workpiece may be a peripheral region of the glass workpiece.

The molding techniques disclosed herein may be particularly useful for molding glass that becomes soft enough to be molded only at relatively high temperatures. For example, the molding techniques disclosed herein may be used for aluminosilicate glass and borosilicate glass.

The invention also relates to a glass component and a housing and an electronic device comprising the glass component. The molding techniques disclosed herein may enable the formation of glass components whose shape defines an undercut. Such shapes may be difficult to achieve with other techniques, such as sagging the glass sheet into a mold tool or forming the glass sheet between a core mold and a cavity mold. The techniques described herein may be used to produce a variety of glass components, such as glass cover members and other types of glass housing components. Although the following description provides examples of glass components that may be used as cover members and housings for electronic devices, the techniques described herein are generally applicable to glass components of electronic devices.

These and other embodiments are discussed below with reference to fig. 1A-11. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

Fig. 1A depicts an exemplary electronic device 100. In an embodiment, the electronic device 100 has a housing 110 that includes a glass cover member or other glass component produced by the techniques as described herein. In some embodiments, the electronic device 100 may be a digital media player, a portable media player, and/or a home control device. In additional embodiments, the electronic device 100 may be a computing device (e.g., a desktop computing device, a notebook computing device, a laptop computing device, or a tablet computing device), a mobile phone (also referred to as a cell phone), an input device, or another type of portable electronic device. As shown in fig. 1A, the electronic device 100 has a form factor in which the height of the device is greater than both the width and length of the top surface. Further, the width and length of the top surface of the electronic device 100 are depicted as being similar in size. The form factor shown in the example of fig. 1A is exemplary and not limiting, and in additional examples, the height may be less than the width and/or length, the width and length of the top surface may be different, or both.

As shown in fig. 1A, the electronic device 100 includes a housing 110 that includes a housing member 112 and a cover 122. The cover 122 may define at least a portion of the front surface 102 of the electronic device and may be referred to as a front cover. In some examples, the housing further includes another cover that defines at least a portion of the rear surface 104 of the electronic device and may be referred to as a rear cover. In an embodiment, the cover 122 comprises a glass component produced by the techniques as described herein. In additional examples, the cover may define another exterior surface of the electronic device, such as a back surface, a side surface, or two or more of a front surface, a back surface, and a side surface of the electronic device.

In some embodiments, a cover of electronic device 100, such as cover 122, is three-dimensional (e.g., non-planar) or defines a contoured shape. For example, the cover 122 may define a peripheral portion that is non-coplanar with respect to the central portion. An example of a three-dimensional shape of a central portion defining a generally planar surface and a peripheral portion extending from the plane defined by the central portion is shown in fig. 2. The peripheral portion may, for example, define a side wall of the electronic device housing, while the central portion defines a front surface (which may define a transparent window covering the display). As additional examples, the cover may define surface protrusions (examples of which are shown in fig. 1B), surface grooves, and/or one or more curved surfaces. Glass components such as glass cover members 132 may be shaped similarly to their respective covers.

In the example of fig. 1A, the cover 122 is positioned over a display 144 at least partially surrounded or surrounded by the housing component 112 of the housing 110. The cover 122 may define a transparent area for viewing the display. Alternatively or additionally, cover 122 may be integrated with or coupled to a touch sensor configured to detect or estimate the location of the touch portion along the outer surface of cover 122. The touch sensor may include an array of capacitive electrodes located below the cover 122 and, in some cases, may be integrated with the display. In additional examples, the cover 122 may be integrated with or coupled to an electronic device component that provides alternative or additional functional characteristics. Capacitance and/or other functional characteristics may be associated with planar and/or non-planar areas of cover 122. Additional description of the display and sensor provided with respect to fig. 11 is generally applicable herein and will not be repeated here.

The cover 122 includes a cover member 132, which may be referred to as a front cover member. The cover member 132 may extend laterally across the cover 122 (such as substantially across the width and length of the cover 122). The cover member 132 may have a thickness of about 0.3mm to about 0.75mm or about 0.5mm to about 1 mm. In some embodiments, the cover member 132 is a glass component (glass cover member), which may be produced by techniques as described herein. Additional descriptions of glass components provided herein (including descriptions provided with respect to fig. 2, 3A, 3B, 9, and 10) are generally applicable herein. In additional embodiments, the cover member 132 may be formed of one or more materials other than glass, and in some cases may be a glass-ceramic cover member. In some embodiments, the cover 122 may define one or more apertures extending through its thickness, wherein the apertures are positioned over another device component (such as a microphone, speaker, optical camera or sensor component, etc.).

The cover 122 may include one or more coatings applied to the cover member. For example, an anti-reflective and/or anti-fouling coating may be applied to the outer surface of the cover member. As an additional example, a coating designed to create a visual effect (such as an opaque masking coating) may be applied to the inner surface of the cover member. In further examples, the cover 122 may include a laminate applied along an inner surface (e.g., in sheet form) of the cover 122 to provide structural support/reinforcement, electrical functionality, thermal functionality, and/or visual effects. The laminate may conform to the three-dimensional portion of the cover.

As shown in fig. 1A, the housing 110 also includes a housing member 112, which may also be referred to herein simply as a shell. The cover 122 may be coupled to the housing member 112. For example, the cover 122 may be coupled to the housing member with an adhesive, fasteners, engagement features, or a combination thereof.

In an embodiment, the housing member 112 at least partially defines the side surface 106 of the electronic device 100. In the example of fig. 1A, the housing member 112 defines all four sides of the electronic device 100. The housing member 112 of fig. 1A also defines corner regions 108. Fig. 1A includes vertical lines to indicate approximate boundaries of corner regions 108. One or more of the corner regions may define a compound curvature. In additional embodiments, the housing member 112 may be positioned inside the electronic device 100, and one or more of the front cover 122 or the rear cover may define all or a majority of the side surfaces of the electronic device. In the example of fig. 1A, electronic device 100 includes input device 152, which may be a button or any other input device described with respect to fig. 11. The housing member 112 may define an opening to accommodate an input device. In additional examples, the housing component may define one or more openings in the side surface to allow (audio) input or output from a device component such as a microphone or speaker, provide a window for transmitting and/or receiving wireless signals, and/or accommodate electrical ports or connections.

In some embodiments, the housing component 112 may be formed from a single material and may be a monolithic component. For example, the housing member 112 may be formed of a glass material, a metal material, a ceramic material, a glass ceramic material, or a polymer material. In some cases, the housing component is a glass component as described herein. In additional embodiments, the housing component may comprise a plurality of members. For example, the housing component may include one or more metal members, one or more glass members, or one or more glass-ceramic members. In some cases, one or more glass members can be a glass component as described herein. In some cases, the housing member is formed from a series of metal segments separated by dielectric segments that provide electrical isolation between adjacent metal segments. For example, the dielectric segment may be disposed between a pair of adjacent metal segments. One or more of the metal segments may be coupled to internal circuitry of the electronic device 100 and may serve as an antenna for sending and receiving wireless communications. The dielectric segment may be formed of one or more dielectric materials such as a polymer, glass, or ceramic material. As mentioned herein, a component or member formed of a particular material, such as glass or a metallic material, may also include a relatively thin coating of a different material along one or more surfaces, such as an anodized layer, a physical vapor deposition coating, a paint coating, a primer coating (which may include a coupling agent), and the like.

In addition to the display and/or touch screen, the electronic device 100 may include additional components. These additional components may include one or more of a processing unit, control circuitry, memory, input/output devices, a power source (e.g., a battery), a charging component (e.g., a wireless charging component), a network communication interface, an accessory, a sensor, or another component (e.g., an antenna, a transmitter, a receiver, a transceiver, etc.) that is part of a wireless communication system. The components of the sample electronics are discussed in more detail below with respect to fig. 11, and the description provided with respect to fig. 11 is generally applicable herein.

Fig. 1B shows another example of an electronic device 101. In an embodiment, the electronic device 101 has a housing 111 that includes a glass cover member or other glass component produced by the techniques as described herein. The electronic device 101 may be any of the electronic devices previously described with respect to the electronic device 100 and may have any of the form factors previously described with respect to the device.

As shown in fig. 1B, the housing 111 includes a cover 123. The cover 123 includes a cover member 133. The cover member 133 may define at least a portion of the front surface 103 of the electronic device and may be referred to as a front cover member. The cover member 133 may extend laterally across the cover 123 (such as substantially across the width and length of the cover 123). In some embodiments, the cover member 133 is a glass component (glass cover member), which can be produced by techniques as described herein. In additional embodiments, the cover member 133 may be formed of one or more materials other than glass, and in some cases may be a glass-ceramic cover member. The glass cover member 133 may be shaped similarly to the cover 123.

In the example of fig. 1B, the cover 123 defines a protruding portion 127 that protrudes relative to another portion 126 of the cover. The protruding portion 127 may also be referred to herein as a protruding feature or simply a feature. More generally, a glass component (such as the cover member 133) may define one or more features that vary in height relative to adjacent portions or regions of the glass component. In some embodiments, features formed to a different height than adjacent portions of the glazing component can define protrusions or grooves. In some cases, equipment components (such as sensor assemblies, camera assemblies, etc.) may be disposed below the raised features. The size of the features 127 may depend, at least in part, on the size of the equipment components below the protruding features. In some embodiments, the lateral dimension (e.g., width) of the protruding features may be about 2mm to about 10mm, about 5mm to about 30mm, about 10mm to about 20mm, or about 15mm to about 30mm.

In the example of fig. 1B, the raised features 127 are shown as being generally curved or circular in shape. However, this example is not limiting, and in other examples, the raised features may define a substantially platform-shaped top. The top of the mesa shape may be substantially parallel to an outer surface defined by adjacent portions of the cap. The amount of protrusion or offset between the top of the protruding portion 127 and the outer surface of the adjacent portion of the cover may be about 0.5mm to about 1.5mm or about 0.75mm to about 2mm.

The glass cover member 133 may also define protruding features when the glass cover member 133 is shaped similar to the cover 123. In some examples, the cover member 133 defining the protruding feature has substantially the same thickness as an adjacent portion of the cover member. In some cases, the cover member 133 is produced by reshaping a substantially uniform thickness glass workpiece to form raised features. In some examples, the resulting raised features may be convex on the exterior of the cover member and concave on the interior of the cover member. In an example, the thickness of the cover member can be greater than about 0.3mm and less than about 0.75mm or greater than about 0.5mm and less than about 1mm in both portions 127 and 126 of the cover 123.

In additional examples, the thickness of the cover member 133 varies. In some cases, the cover member 133 may have a greater thickness in the protruding portion than in the adjacent portion. In embodiments, the thickness of the cover member 133 in the raised portion 127 may be at least 10%, 25% or 50% and at most about 250% greater than the thickness of the cover member in the portion 126 of the cover 123. In some cases, the thicker portion of the cover 123 (including the raised features) has a thickness greater than about 1mm and less than or equal to about 2mm or about 2.5mm. The thickness of portion 126 of cover 123 may be greater than about 0.3mm and less than about 0.75mm or greater than about 0.5mm and less than about 1mm.

In some embodiments, the cover 123 may define one or more holes, also referred to herein as through holes, extending through its thickness. The one or more apertures may facilitate positioning one or more device components, such as a speaker or an optical module of a camera assembly or sensor assembly. In some cases, a hole may be formed into the protruding feature 127, and the device component may extend at least partially into the hole in the protruding feature. By way of example, the electronic device may include one or more optical modules selected from a camera module, an optical sensor module, an illumination module, and a (non-optical) sensor. In some examples, a window may be provided over the aperture to protect the underlying device components. When the glass cover member 133 is shaped similar to the cover 123, the glass cover member may also define one or more through holes.

In some cases, cover 123 may be integrated with or coupled to a touch sensor or another electronic device component that provides functional characteristics to the cover. The cover 123 may include one or more coatings applied to the cover member, and these coatings may be similar to the coatings previously described with respect to the cover 122. In some examples, the cover 123 may include a laminate applied along an inner surface of the cover 123 in a similar manner as described with respect to fig. 1A.

The housing 111 of the electronic device 101 further comprises a housing part 113. The housing member 113 at least partially defines the side surface 107 of the electronic device 100. In the example of fig. 1B, the housing member 113 defines all four sides of the electronic device 101. The housing member 113 of fig. 1B also defines corner regions 109. The housing member may be similar in structure and material to the housing member 112 and those details are not repeated here.

The electronic device 101 may include additional components in addition to the display and camera assembly. For example, the electronic device may include one or more sensor assemblies and/or camera assemblies. As additional examples, the electronic device may include one or more of a processing unit, control circuitry, memory, input/output devices, a power source (e.g., a battery), a charging component (e.g., a wireless charging component), a network communication interface, accessories, and sensors. The components of the sample electronics are discussed in more detail below with respect to fig. 11, and the description provided with respect to fig. 11 is generally applicable herein.

Fig. 2 illustrates a simplified cross-sectional view of an exemplary glazing component 232. The glass component 232 defines a three-dimensional shape and may be an example of the glass cover member 132 of fig. 1A. The cross-sectional view may be along A-A in fig. 1A. The three-dimensional shape shown in fig. 2 is exemplary and not limiting, and the techniques described herein may be used to create a variety of three-dimensional shapes.

Glazing component 232 can be described as defining a generally planar central portion and a peripheral portion extending from the generally planar central portion. As shown in fig. 2, the glass member 232 includes a central portion 292 and a peripheral portion 294 extending from a plane defined by the central portion 292. The central portion 292 and the peripheral portion 294 are contiguous. The peripheral portion 294 shown in fig. 2 defines an angle (as seen in cross-section) with respect to the generally planar central portion 292. The peripheral portion 294 may thus be referred to herein as an angled portion. In the example of fig. 2, the peripheral portion 294 defines an obtuse angle relative to the generally planar central portion, but the example is not limiting and in some embodiments, the peripheral portion may define a ninety degree angle or an acute angle relative to the central portion. The three-dimensional shape shown in fig. 2 is exemplary and not limiting, and the techniques described herein may be used to create a variety of three-dimensional shapes, including shapes in which the central portion is curved rather than planar, and shapes in which both the central portion and the peripheral portion are curved.

In the example of fig. 2, the glass component 232 defines inner and outer surfaces (242, 244) that are generally planar in a central portion of the cover and curved in a peripheral portion of the cover. As shown, the inner and outer surfaces in the peripheral portion are generally curved toward the interior of the electronic device. In other words, the curve defined by the inner and outer surfaces in the peripheral portion is concave with respect to the interior of the electronic device. As shown in fig. 2, the central portion 292 includes a central outer surface 244a and a central inner surface 242a. Peripheral portion 294 includes a peripheral outer surface 244b, a transition inner surface 242b, and a peripheral inner surface 242c. The peripheral inner surface 242c is offset from the central inner surface 242 a; the transition inner surface 242b provides a transition between the peripheral inner surface 242c and the central inner surface 242a. The curvature and/or curvilinear length of peripheral outer surface 244b and transition inner surface 242b is not limited to the example of fig. 2, and may have a greater or lesser curvature and/or curvilinear length. In some cases, the glass component has a wall thickness in the range of 300 microns to 2 mm.

In some cases, the glazing component has a smooth surface. When the roughness of the glass part is determined by arithmetic mean height (e.g., R _a Or S _a ) One or more surfaces of the glass component may have a surface roughness greater than zero and less than about 250nm, 150nm, 100nm, 50nm, 25nm, or 10nm, as measured. The glazing may also have a sufficiently high transmissivity and clarity that the high resolution graphics produced by the display are not distorted.

Typically, the glass cover member or other glass component is formed from a silica-based glass material. The glass material may have a network structure, such as a silicate-based network structure. As referred to herein, "glass cover member," "glass part," "glass work piece," "molded glass work piece," "glass sheet," "glass layer," and/or "glass block" may include some relatively small amount of impurities or crystalline material, such as 1% or less, 2% or less, or 5% or less by weight of the member.

In some embodiments, the glass material comprises an aluminosilicate glass. As used herein, aluminosilicate glass includes the elements aluminum, silicon, and oxygen, but may also include other elements. Typically, the glass material includes an ion-exchangeable glass material, such as an alkali aluminosilicate glass (e.g., a lithium aluminosilicate glass). The ion-exchangeable aluminosilicate glass may contain monovalent ions or divalent ions that compensate for the charge caused by the replacement of silicon ions by aluminum ions. Suitable monovalent ions include, but are not limited to, alkali metal ions such as Li ⁺ 、Na ⁺ Or K ⁺ . Suitable divalent ions include alkaline earth ions such as Ca ²⁺ Or Mg (Mg) ²⁺ . In some embodiments, the glass material comprises crystallizable glass. In some cases, small amounts of tin or other elements present in the shaping fluid may be introduced near the surface of the glass part during the shaping process.

Fig. 3 shows a flow chart of a forming process for manufacturing a glass part by forming a glass workpiece. As described below, the shaping operation changes the shape of the glass workpiece to produce a molded glass workpiece. In some cases, glass parts are produced from molded glass workpieces using one or more operations (such as finishing operations).

In some cases, the glass workpiece (which may also be referred to herein as a blank or preform) may be a glass sheet that is substantially flat and has a substantially uniform thickness. In some examples, the glass workpiece may have a thickness of about 300 microns to about 2mm, about 300 microns to about 1mm, about 0.3mm to about 0.75mm, about 0.5mm to about 1mm, or about 0.5mm to about 1.5 mm. In additional cases, the glass workpiece may have a non-uniform thickness and/or may have a shape other than a flat shape. For example, the glass workpiece may be shaped to facilitate the shaping process. The glass workpiece may have a lateral dimension that is greater than a lateral dimension of the glass component to allow a peripheral portion of the glass workpiece to be inserted between the mold tools and to serve as a flange, as described in more detail below. The glass workpiece may be formed from any of the glass materials previously described with respect to fig. 2. In some examples, the glass workpiece may be cleaned prior to placement in the mold tool and/or may be treated with one or more surface treatments (such as etching and plasma treatments).

The process 300 includes an operation 302 of heating each of the first mold tool and the second mold tool, and then positioning the glass workpiece between the first mold tool and the second mold tool. The first mold tool and the second mold tool may be preheated to a first temperature prior to assembly of the glass workpiece with the mold tools. In some examples, each of the first and second mold tools may be heated to a temperature within about 75 ℃, 50 ℃, or 25 ℃ of the glass transition temperature of the glass workpiece. In some cases, the first mold-tool and the second mold-tool may be heated to a temperature of 500 ℃ to 600 ℃. In some cases, at least a portion of the first mold tool and/or the second mold tool is maintained at a temperature within the range during the molding process.

The first and second mold tools are typically configured to withstand elevated temperatures. As an example, the first and second mold tools may be formed from one or more materials, such as high purity chromium (e.g., at least 99.95% pure), noble metals (e.g., pt, rd, ir, or alloys thereof, such as Pt-Ir), or ceramic materials such as tungsten carbide, alumina, zirconia, and the like. For example, the mold tool may be formed from chromium or ceramic materials. In some cases, a precious metal or ceramic coating is applied to the bulk chromium or ceramic of the mold tool. Examples of suitable coatings include, but are not limited to, coatings of one or more of noble metals and noble metal alloys (such as Pt-Ir), oxides (such as alumina), nitrides (such as titanium nitride or titanium aluminum nitride), carbonitrides (such as titanium carbonitride), and the like.

In some cases, the first mold tool, the second mold tool, or both are multi-part mold tools. For example, the second mold tool may include a mold insert and a retainer for the mold insert, as shown in the example of fig. 4. In some cases, the mold insert may be separated into two or more portions to facilitate removal of the molded glass workpiece from the mold insert, as schematically shown in fig. 10. More generally, the mold-tool may comprise two or more separable portions. The parting line of the multipart mold tool may be located at the location of the partial draft change. In some examples, the parting line of the mold insert or mold tool may be positioned along a diagonal of the molded portion of the molded glass workpiece.

The method 300 includes an operation 304 of positioning a glass workpiece with a first mold tool and a second mold tool. Alternatively or additionally, the glass workpiece may be positioned between the first mold tool and the second mold tool. When the glass workpiece has a horizontal orientation, the first mold tool may be a lower mold tool and the second mold tool may be an upper mold tool.

In some cases, the first mold tool may define a groove feature and the second mold tool may define an opening positioned above the glass workpiece. Fig. 4 illustrates an example of an operation to position a glass workpiece between two mold tools having these features. During the operation of forming the glass workpiece, the opening provides a conduit for the heated fluid to enter the upper mold tool, as described in further detail below with respect to operation 308.

The process 300 includes an operation 306 of securing the first mold-tool with the second mold-tool. Operation 306 may form an assembly comprising a glass workpiece, a first mold tool, and a second mold tool. In some cases, operation 306 forms a sealing interface at a parting line between the first mold tool and the second mold tool. In an additional instance, a portion of the glass workpiece may at least partially define a fluid seal between the first mold tool and the second mold tool. The glass workpiece and/or the additional sealing element may define one or more sealing interfaces through which the first mold tool contacts the second mold tool.

The operation of securing the first mold tool with the second mold tool may include sealing the glass workpiece to the second mold tool. For example, the second mold-tool may be pressed against the glass workpiece to limit intrusion of heating fluid between the glass workpiece and the second mold-tool, as shown in the example of fig. 7.

In additional examples, the assembly may further include a sealing element. Such a sealing element may be placed between a first mold tool and a second mold tool, as shown in the example of fig. 6A. The first mold-tool may contact the second mold-tool (via the sealing element) along a sealing interface around the glass workpiece. Alternatively or additionally, a sealing element may be placed between the glass work piece and the second mold tool, as shown in the example of fig. 6B. The sealing element may be formed from a variety of materials including carbon or graphite. In some embodiments, the sealing element slidably seals the assembly against intrusion of the heating fluid. Seals formed to limit or prevent the intrusion of heated fluids may also be referred to herein as fluid seals.

The method 300 further includes an operation 308 of introducing a heating fluid into the mold. During operation 308, the heating fluid may enter the second mold-tool and contact the glass workpiece, as shown in the cross-sectional view of fig. 5B. A heating fluid may be introduced into an opening in the second mold tool to mold at least a portion of the glass workpiece into the groove feature of the first mold tool.

When the heating fluid enters the second mold-tool, the heating fluid is at an elevated temperature, above the temperature of the mold-tool and the glass workpiece. The heating fluid can thus heat and soften the glass workpiece. In some cases, the heating fluid may be at a temperature from the softening point to the working point of the glass workpiece or at a temperature from the working point to the melting point of the glass workpiece upon entering the assembly.

The method 300 also includes an operation 310 of pressurizing the heating fluid and forming at least a portion of the glass workpiece using the heating fluid. Operation 310 produces a molded glass work piece having a shaped or molded portion. The forming portion of operation 310 may also be referred to herein as a reforming operation, a thermoforming operation, a molding operation, or a forming operation, and the molded glass workpiece may also be referred to herein as a reformed or reshaped glass workpiece. In particular, portions of the glass workpiece may be deformed between the heating fluid and the groove features of the first mold tool. The heating fluid may contact a first surface (also referred to as a first face) of the glass workpiece, and a second surface (also referred to as a second face) of the glass workpiece, generally opposite the first surface, may be pressed against the groove features of the first mold tool. The glass workpiece may be deformed by bending, stretching, flowing, or in some cases, by a combination of these deformation modes. The molding process may be completed quickly, such as within 30 seconds or less or within about 5 seconds to about 25 seconds.

When the shape change during the shaping of the glass workpiece is achieved to a large extent by bending, it may be useful to heat the glass workpiece to a temperature approximately equal to the softening point of the glass workpiece. When shape changes during the shaping of the glass workpiece are achieved to a large extent by stretching, but the glass workpiece remains substantially uniform in thickness, it may be useful to heat the glass workpiece to a temperature approximately equal to the working point of the glass workpiece. When the shape change during the shaping of the glass workpiece is achieved, to a large extent, at least in part, by the flow of the glass material of the glass workpiece, it may be useful to heat the glass workpiece to a temperature in the range of the working point to the melting point of the glass workpiece. In case of a high shear rate resulting in shear thinning, a sufficiently viscous flow may occur at a lower temperature than would otherwise be possible. In some cases, the glass workpiece may be heated to a temperature of about 800 ℃ to about 1000 ℃.

The heating fluid may be pressurized to assist in deforming the glass workpiece against the first mold tool. As an example, the heating fluid is pressurized to a pressure of less than or equal to 1MPa, less than or equal to 0.75MPa, less than or equal to 0.5MPa, or 0.25MPa to 0.75MPa above atmospheric pressure. Suitable heating fluids include substantially incompressible fluids. Thus, the heating fluid is different from the heating gas. The heating fluid may be a heating liquid capable of remaining in a liquid state at the forming temperature. Typically, the heated liquid is different from conventional hydroforming fluids (e.g., different from conventional aqueous hydroforming fluids). In some examples, the heating fluid is a molten metallic material, such as molten tin, molten tin alloy, or another molten alloy. In additional examples, the heating fluid is a molten salt, such as a mixture of potassium nitrate, sodium nitrite, and sodium nitrate (e.g., a HITEC salt), or a mixture of sodium nitrate and potassium nitrate (e.g., a binary solar salt).

In some cases, pressurized gas may be used to apply pressure to the heating fluid. For example, a pressurized gas may be introduced into the region of the heating fluid to deform the glass workpiece. In other cases, a tool such as a plunger may be used to apply pressure to the heating fluid. In additional embodiments, the heating fluid may be pressurized as it is introduced (such that operations 308 and 310 occur simultaneously).

In some cases, during the forming operation, the peripheral portion of the glass workpiece may tend to move between the mold tools. In embodiments, movement of the peripheral portion of the glass workpiece within the mold tool is controlled at least in part by techniques for sealing the assembly from intrusion of heating fluid between the second mold tool and the glass workpiece. In additional examples, movement of the peripheral portion of the workpiece may be affected by modification of a surface of one or more of the mold tools and/or modification of a surface of the glass workpiece. Modifications may include one or more of temporary or permanent coatings, textures, gas buffer/slip planes, and the like. For example, a coating may be applied to all or a portion of the surface of the glass workpiece to reduce friction between the surface of the glass workpiece and the surface of the mold tool. Suitable coatings include, but are not limited to, graphite or boron nitride powder coatings or evaporable coatings that create a gas cushion between the glass workpiece surface and the mold tool surface. As an additional example, the mold-tool surface may be coated to reduce friction or textured to increase friction between the mold-tool surface and the glass workpiece.

For silicate glasses, a plot of viscosity versus temperature can be used to identify the temperature associated with glass deformation. For example, strain point (viscosity of about 10 ^14.5 Poise) is the temperature at which the internal stress of the glass is relieved in hours. Annealing Point (viscosity of about 10) ^13.2 Poise to 10 ^13.4 Poise) is the temperature at which the internal stress of the glass is relieved in minutes. Glass transition temperature (viscosity of about 10) ¹² Poise to 10 ¹³ Poise) is the temperature at which glass transitions from a supercooled liquid to a glassy state. The expansion softening point is from about 10 ⁹ Poise to 10 ¹¹ The viscosity of poise defines a glass softening point of about 10 ^7.6 Viscosity definition of poise; the "softening point" as referred to herein may refer to any of these temperatures. Operating point is from about 10 ⁴ The viscosity of the poise is defined. The melting range can be from about 10 ^1.5 Poise to about 10 ^2.5 The viscosity of the poise is defined.

As an example, the strain point of an aluminosilicate glass (such as an alkali aluminosilicate glass) may be about 525 ℃ to about 575 ℃; the aluminosilicate glass may have an annealing point of about 600 ℃ to about 650 ℃, and an operating point of greater than 1000 ℃, such as about 1100 ℃ to about 1300 ℃. The glass transition temperature may be from about 575 ℃ to about 625 ℃. As an additional example, aluminosilicate glasses may be configured to have lower operating temperatures and glass transition temperatures, such as operating temperatures of about 900 ℃ to about 1100 ℃ and glass transition temperatures of about 500 ℃ to about 550 ℃.

Process 300 also includes an operation 312 of depressurizing and removing the heated fluid. The depressurisation and removal of the heating fluid may occur sequentially or simultaneously. In some cases, the heating fluid may be removed from the opening of the second mold tool. For example, the heating fluid may be removed by draining the heating fluid from the assembly of the glass workpiece and the mold tool. The operation of removing the heating fluid may help cool the molded glass workpiece so that it may be removed from the mold tool without losing its shape. In addition, the process 300 includes an operation 314 of removing the molded glass workpiece from the first mold tool and the second mold tool.

The process 300 also includes an operation 316 of cooling the molded glass workpiece after operation 314. Operation 316 may cool the molded glass workpiece to an ambient temperature (e.g., room temperature, about 25 ℃), an ambient temperature range, or a temperature range that is substantially below a transition temperature (e.g., a strain point or a glass transition point) of the glass component. Operation 316 may include one or more stages.

In some embodiments, the process 300 may include one or more additional operations to produce a glass part from a molded glass workpiece. For example, the process 300 may include one or more operations of finishing a molded glass workpiece to produce a glass part. In some cases, the one or more finishing operations include a finishing operation. In some embodiments, the molded glass workpiece includes a peripheral portion positioned between the first mold tool and the second mold tool at the end of the forming operation. During the finishing operation, at least some of the peripheral portion of the molded glass workpiece may be removed (trimmed) to achieve the desired shape of the glass component. The molded glass piece may also be trimmed inwardly from the peripheral portion if desired. Any suitable separation technique may be used during the trimming operation, such as a laser separation process, a mechanical separation process, or a combination thereof. The one or more finishing operations may optionally include an operation to create a through hole through the glazing component. The operation of creating the via may employ a mechanical process, a laser-based process, or a combination thereof. In additional examples, the one or more finishing operations may include cleaning, texturing, and/or polishing operations.

The process 300 may also include an annealing operation to relieve residual thermal stresses from the heating and forming operations. The annealing operation may be performed after the molded glass workpiece is removed from the mold tool.

In additional examples, process 300 may include a chemical strengthening operation. The glazing component may be chemically strengthened by one or more ion exchange operations. When the heating fluid includes a suitable ion source and/or a suitable ion source is introduced into the cavity mold, ion exchange operations may be included in operations 308 and/or 310. Alternatively or additionally, the ion exchange operation may be performed after removing the glass workpiece from the first and second mold tools. During the ion exchange operation, ions present in the glass component may be exchanged with larger ions in the region extending from the surface of the glass component. Ion exchange can form a compressive stress layer (or region) extending from the surface of the glass component. In some implementations, a compressive stress layer is formed at each of the outer and inner surfaces of the glass component. A tensile stress layer may be formed between these compressive stress layers.

Fig. 4 schematically illustrates the operation of positioning a glass workpiece between two mold tools. The glass workpiece 452 has a horizontal orientation and is positioned between the lower die tool 492 and the upper die tool 498. The mold tools 492 and 498 may be formed of materials similar to those previously described with respect to fig. 3, and the description is not repeated herein. In some examples described herein, the mold tool 492 may be referred to as a first mold tool and the mold tool 498 may be referred to as a second mold tool.

The mold tool 492 is positioned below the glass workpiece 452. In the example of fig. 4, the mold tool 492 includes an insert 494. The insert 494 of the mold tool 492 defines the recess 495. Groove 495 may be defined by a substantially planar recessed surface 496 and a wall surface 497 extending from the planar recessed surface. When molded against a glass workpiece having a recess 495 of such a shape, the molded glass workpiece may include a first portion that is a generally planar central portion and a second portion that extends from the first portion and is at least partially out of the plane defined by the first portion. For example, the second portion may be angled with respect to a generally planar central portion, as previously described with respect to fig. 2. The molded glass work piece may also include a third portion defining a peripheral portion of the molded glass work piece, also referred to herein as a flange. An example of such a shape (which may also be referred to as a "dish" shape) is shown in fig. 2, and the description provided with respect to fig. 2 applies generally herein. The groove shape of the mold tool 492 is exemplary and not limiting, and in additional examples, the groove can be shaped to define any of a variety of shapes of curved center portions, raised features (as shown in fig. 1B), or molded glass workpieces.

The mold tool 498 is positioned above the glass workpiece 452. The die tool 498 defines an opening 499. The opening 499 may be positioned over the glass workpiece as shown in the cross-sectional views of fig. 5A-7. The opening provides a conduit for heated fluid to enter the mold tool 498 and contact the glass workpiece 452, as shown in the cross-sectional view of fig. 5B.

Fig. 5A and 5B show partial cross-sectional views of stages in a process for manufacturing a glazing component. Fig. 5A shows a glass workpiece 552 assembled with a mold tool 592 and a mold tool 598 prior to a forming operation. The glass workpiece 552 has a horizontal orientation and is positioned between the mold tool 592 and the mold tool 598. The mold tool 592 defines a recess 595. In the example of fig. 5A, the second region 556 of the glass workpiece 552 is positioned between the mold tool 592 and the mold tool 598, and the first region 554 is positioned above the recess 595. A small gap 571 is formed between the glass workpiece 552 and the mold tool 598. The gap may allow the glass workpiece 552 to be drawn inward during the forming operation.

Fig. 5B shows the molded glass workpiece 553 after the forming operation. The heating fluid 560 deforms the glass workpiece 552 of FIG. 5A to form a molded glass workpiece 553. The molded glass work piece 553 conforms to the recess 595 of the mold tool 592. Molded glass work piece 553 includes a central first portion 562, a second portion 564 angled relative to first portion 562, and a third portion 566 that acts as a flange. A transition 563 between the first portion 562 and the second portion 564 and a transition 565 between the second portion 564 and the third portion 566 are also shown in fig. 5B.

In the example of fig. 5B, heating fluid 560 fills opening 599 previously shown in fig. 5A. However, this example is not limiting, and a tool such as a plunger for pressurizing the heating fluid may also be present within the opening. In some cases, the gap 571 may be small enough to limit the intrusion of the heating fluid 560 between the molded glass workpiece 553 and the mold tool 598, and thus slidably seal the assembly of the glass workpiece and the mold tool. In additional cases, a sealing element may be provided to limit intrusion of the heating fluid 560, as shown in fig. 6A and 6B.

Fig. 6A and 6B show partial cross-sectional views of a sealing arrangement. Fig. 6A shows an example of a sealing element 672 disposed between a first mold tool 692 and a second mold tool 698. When this type of sealing element is used, the glass workpiece 652 is free to draw inward during the forming process. Some movement of the glass workpiece 652 in the z-direction (a vertical direction perpendicular to the plane defined by the first mold tool or the second mold tool) may also occur. As shown in fig. 6A, a small gap 671 is formed between the glass workpiece 652 and the second mold tool 692, and the first mold tool 698 defines a recess 695.

Fig. 6B shows an example of a sealing element 673 placed between a glass workpiece 652 and a second mold tool 698. With this type of sealing element, the glass workpiece 652 may have some ability to be drawn inward during the forming process, while movement in the z-direction may be limited. The sealing element 673 of fig. 6B may be thin and, in some cases, may be formed from a foil such as a graphite foil. As shown in fig. 6B, a small gap 671 is formed between the glass workpiece 652 and the second mold tool 692, and the first mold tool 698 defines a recess 695.

Fig. 7 shows a partial cross-sectional view of another sealing arrangement. For example, the second mold-tool 798 may be pressed against the glass workpiece 752 to limit the intrusion of heated fluid between the glass workpiece 752 and the second mold-tool 798. The pressing of the second mold-tool 798 against the glass workpiece 752 may also limit movement of the glass workpiece 752 in the horizontal (x, y) and vertical (z) directions. As shown in fig. 7, the first mold-tool 792 defines a groove 795.

Fig. 8 is a schematic illustration of the operation of removing a molded glass workpiece 553 from two mold tools 492, 498. In the example of fig. 8, the molded glass work piece 553 defines a generally planar central first portion 562 and a second portion 564 extending at an obtuse angle relative to the central first portion, an example of which was previously shown in fig. 2. A peripheral third portion 566 of the molded glass piece extends from the second portion 564 and may serve as a flange. At the end of the molding operation, at least a portion of the peripheral third portion 566 is positioned between the first mold tool and the second mold tool. The peripheral third portion can be trimmed as necessary to produce the desired shape of the glazing component.

Fig. 9 shows an example of a glazing component 934 defining a three-dimensional shape having an undercut. Glazing 934 may be an example of a housing of an electronic device. Glazing component 934 defines a substantially planar rear portion 944 and a curved side portion 946 extending from the rear surface and defining an undercut. The undercut may be formed in part by deforming the glass workpiece into a suitably shaped recess of the mold tool.

In the example of fig. 9, curved side portions 946 extend around the perimeter of planar rear portion 944 and define the side walls of the glazing component. The substantially planar rear portion 944 and the curved side portion 946 together define a cavity 948, and the curved side portion defines an opening 947 to the cavity. The curved side portions 946 are shaped such that the inner surfaces of the side walls define undercuts (e.g., recessed portions) relative to the openings 947. In cross-section along the width of glazing component 934, curved side portion 946 may also define a concave curvature. The curved side portions 946 shown in fig. 9 are shaped such that the outer surface of the side walls define a convex curve in cross section along the width of the glazing component 934. In some embodiments, the glass component may have a wall thickness in the range of 300 microns to 2 mm.

Fig. 10 shows an example of a molded glass workpiece 1054 in a mold tool 1072a. Molded glass workpiece 1054 of fig. 10 may be trimmed to obtain glass part 934 as previously described with respect to fig. 3 and 8. In particular, the peripheral portion 1066 of the molded glass piece may be removed to create a glass component with undercut, as previously described with respect to fig. 9. The shape of molded glass workpiece 1054 may be created using a two-part mold insert for the lower mold tool. Fig. 10 shows one portion 1072a of such a two-part mold insert.

In some cases, the molded glass workpiece 1054 is formed by deforming a glass workpiece such that stretching of the glass workpiece occurs. To facilitate stretching of the glass workpiece, a peripheral portion of the glass workpiece may be secured between the first mold tool and the second mold tool such that sliding of the glass workpiece between the mold tools is limited. In some cases, the glass workpiece may be sized to allow for thickness reduction during stretching. To produce a shape with undercut features similar to the shape of molded glass workpiece 1054, the thickness of the glass workpiece prior to the forming operation may be about 1mm to about 3mm or about 1.5mm to about 2.5mm. The temperature of the portion that is forming the glass may be approximately equal to the operating point. The thickness of the molded portion of the molded glass piece may be substantially uniform or the thickness may be varied as desired.

FIG. 11 shows a block diagram of a sample electronic device that can incorporate glass components as described herein. The schematic diagram depicted in fig. 11 may correspond to the apparatus depicted in fig. 1A and 1B. However, fig. 11 may also more generally represent other types of electronic devices having glass components as described herein.

In an embodiment, the electronic device 1100 may include sensors 1120 to provide information about the configuration and/or orientation of the electronic device in order to control the output of the display. For example, a portion of the display 1108 may be turned off, disabled, or placed in a low-energy state when all or a portion of the viewable area of the display 1108 is blocked or substantially obscured. As another example, display 1108 is adapted to rotate the display of graphical output based on a change in orientation of device 1100 (e.g., 90 degrees or 180 degrees) in response to rotation of device 1100.

The electronic device 1100 also includes a processor 1106 operatively coupled to the computer-readable memory 1102. The processor 1106 is operatively coupled to the memory 1102 components via an electronic bus or bridge. The processor 1106 may be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer-readable instructions. Processor 1106 may include a Central Processing Unit (CPU) of device 1100. Additionally or alternatively, the processor 1106 may include other electronic circuitry within the device 1100, including Application Specific Integrated Chips (ASICs) and other microcontroller devices. The processor 1106 may be configured to perform the functions described in the examples above.

Memory 1102 may include various types of non-transitory computer-readable storage media including, for example, read Access Memory (RAM), read Only Memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 1102 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

The electronic device 1100 may include control circuitry 1110. The control circuit 1110 may be implemented in a single control unit and need not be implemented as distinct circuit elements. As used herein, "control unit" will be used synonymously with "control circuit". The control circuit 1110 may receive signals from the processor 1106 or from other elements of the electronic device 1100.

As shown in fig. 11, the electronic device 1100 includes a battery 1114 configured to provide power to the components of the electronic device 1100. The battery 1114 may include one or more power storage units coupled together to provide an internal power supply. The battery 1114 may be operatively coupled to a power management circuit configured to provide appropriate voltages and power levels for various components or groups of components within the electronic device 1100. The battery 1114 may be configured to receive power from an external power source, such as an ac power outlet, via the power management circuitry. The battery 1114 may store the received power such that the electronic device 1100 may operate without being connected to an external power source for an extended period of time, which may range from hours to days.

In some implementations, the electronic device 1100 includes one or more input devices 1118. The input device 1118 is a device configured to receive input from a user or an environment. For example, the input device 1118 may include a push button, a touch activated button, a capacitive touch sensor, a touch screen (e.g., a touch sensitive display or a force sensitive display), a capacitive touch button, a dial, a crown, and so forth. In some implementations, the input device 1118 may provide dedicated or primary functions including, for example, a power button, a volume button, a home button, a scroll wheel, and a camera button.

The device 1100 may also include one or more sensors or sensor modules 1120, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, and the like. In some cases, device 1100 includes a sensor array (also referred to as a sensing array) that includes a plurality of sensors 1120. For example, the sensor array associated with the raised features of the cover member may include an ambient light sensor, a lidar sensor, and a microphone. As previously discussed with respect to fig. 1B, one or more camera modules may also be associated with the raised feature. The sensor 1120 is operably coupled to the processing circuit. In some embodiments, the sensor 1120 may detect deformation and/or a change in configuration of the electronic device and is operably coupled to processing circuitry that controls the display based on the sensor signal. In some implementations, the output from the sensor 1120 is used to reconfigure the display output to correspond to the orientation or folded/unfolded configuration or state of the device. Exemplary sensors 1120 for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of position/orientation sensing devices. In additional examples, the sensor 1120 may include a microphone, an acoustic sensor, a light sensor (including ambient light, infrared (IR) light, and Ultraviolet (UV) light), an optical facial recognition sensor, a depth measurement sensor (e.g., a time-of-flight sensor), a health monitoring sensor (e.g., an Electrocardiogram (ERG) sensor, a heart rate sensor, a photoplethysmogram (PPG) sensor, and/or a pulse oximeter), a biometric sensor (e.g., a fingerprint sensor), or other type of sensing device.

In some implementations, the electronic device 1100 includes one or more output devices 1104 configured to provide output to a user. The output device 1104 may include a display 1108 that presents visual information generated by the processor 1106. The output device 1104 may also include one or more speakers to provide audio output. The output device 1104 may also include one or more haptic devices configured to produce haptic or tactile output along an external surface of the device 1100.

The display 1108 may include a Liquid Crystal Display (LCD), a Light Emitting Diode (LED) display, an LED backlight LCD display, an Organic Light Emitting Diode (OLED) display, an active layer organic light emitting diode (AMOLED) display, an organic Electroluminescent (EL) display, an electrophoretic ink display, and the like. If the display 1108 is a liquid crystal display or an electrophoretic ink display, the display 1108 may also include a backlight component that may be controlled to provide a variable display brightness level. If the display 1108 is an organic light emitting diode or an organic electroluminescent display, the brightness of the display 1108 may be controlled by modifying the electrical signal provided to the display element. Further, information regarding the configuration and/or orientation of the electronic device may be used to control the output of the display, as described with respect to input device 1118. In some cases, a display is integrated with the touch sensors and/or force sensors to detect touches and/or forces applied along the external surface of the device 1100.

The electronic device 1100 may also include a communication port 1112 configured to transmit and/or receive signals or electrical communications from an external device or a separate device. The communication port 1112 may be configured to be coupled to an external device via a cable, adapter, or other type of electrical connector. In some implementations, the communication port 1112 can be used to couple the electronic device 1100 to a host computer.

The electronic device 1100 may also include at least one accessory 1116, such as a camera, a flash for a camera, or other such devices. The camera may be part of a camera assembly that may be connected to other portions of the electronic device 1100, such as the control circuit 1110.

As used herein, the phrase "one or more of" after separating a series of items of any of the items with the term "and" or "is a modification of the list as a whole, rather than modifying each member of the list. The phrase "one or more of" does not require the selection of at least one of each item listed; rather, the phrase allows for the inclusion of a minimum of any of the items and/or a minimum of any combination of the items and/or a minimum of each of the items. For example, the phrase "one or more of A, B and C" or "one or more of A, B or C" each refer to a alone, B alone, or C alone; A. any combination of B and C; and/or one or more of each of A, B and C. Furthermore, as used herein, the phrase "one or more" (wherein the term "and" or "separates" items) preceding a series of items does not require selection of one of each item listed; rather, the phrase allows for the inclusion of a minimum of any of the items and/or a minimum of any combination of the items and/or a minimum of each of the items. Similarly, it should be understood that the order of elements presented for a combined list or a separate list provided herein should not be construed as limiting the disclosure to only the order provided.

As used herein, the terms "about," "approximately," "substantially," "approximately," "similar," and the like are used to explain relatively small changes, such as +/-10%, +/-5%, +/-2%, or +/-1% changes. Furthermore, the term "about" with respect to the endpoints of the ranges may be used to indicate a variation of +/-10%, +/-5%, +/-2%, or +/-1% of the endpoint value. Further, disclosing ranges wherein at least one endpoint is described as "about" a particular value includes disclosing ranges wherein the endpoint is equal to the particular value.

The following discussion applies to the electronic devices described herein insofar as these devices may be used to obtain personally identifiable information data. It is well known that the use of personally identifiable information should follow privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining user privacy. In particular, personally identifiable information data should be managed and processed to minimize the risk of inadvertent or unauthorized access or use, and the nature of authorized use should be specified to the user.

For purposes of explanation, the foregoing descriptions use specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the embodiments. Thus, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art in light of the above teachings.

Claims (20)

1. A method for manufacturing a glazing component for an electronic device, the method comprising:

heating each of the first and second mold tools to a first temperature;

positioning a glass workpiece between the first mold tool and the second mold tool, the second mold tool defining an opening positioned over the glass workpiece;

securing the first mold tool with the second mold tool to form a sealing interface at a parting line between the first mold tool and the second mold tool;

introducing a forming liquid at a second temperature into the opening;

pressurizing the forming liquid to deform the glass workpiece into the groove feature of the first mold tool, the second temperature being higher than the first temperature;

depressurizing the molding liquid and removing the molding liquid from the opening;

separating the first and second mold tools and removing the molded glass work piece; and

finishing the molded glass workpiece to produce the glass component.

2. The method according to claim 1, wherein:

the forming liquid comprises molten tin; and is also provided with

The operation of pressurizing the shaping liquid comprises introducing a pressurized gas into the region of the shaping fluid, the pressurized gas being introduced at a pressure in the range of 0.25MPa to 0.75 MPa.

3. The method of claim 1, wherein the securing the first mold tool with the second mold tool further comprises slidably sealing the glass workpiece to the second mold tool.

4. The method of claim 1, wherein the securing the first mold tool with the second mold tool further comprises providing a sealing element between the first mold tool and the second mold tool.

5. The method of claim 1, wherein the glass component defines an undercut formed in part by deforming the glass workpiece into the groove feature.

6. The method according to claim 1, wherein:

the first temperature is in a range from a strain point to a softening point of the glass workpiece;

the second temperature is in a range of greater than or equal to a working point of the glass workpiece to less than a melting point of the glass workpiece; and is also provided with

Each of the first and second mold tools is heated to a temperature less than or equal to a glass transition temperature of the glass workpiece.

7. The method of claim 1, wherein the operation of finishing the molded glass workpiece comprises trimming a peripheral portion of the molded glass workpiece.

8. A method for manufacturing a glazing component for an electronic device, the method comprising:

heating a first mold tool and a second mold tool of a mold to a first temperature;

positioning a glass workpiece within the first and second mold tools, a portion of the glass workpiece defining a fluid seal between the first and second mold tools;

introducing a heating fluid into the mold, the heating fluid in contact with the first surface of the glass workpiece, the heating fluid at a second temperature greater than the first temperature;

pressurizing the heating fluid to deform a second surface of the glass workpiece opposite the first surface into the groove features of the second mold tool to form a molded glass workpiece;

depressurizing the heating fluid and expelling the heating fluid from the mold;

removing the molded glass workpiece from the mold; and

Finishing the molded glass workpiece to produce the glass component.

9. The method of claim 8, wherein the heating fluid is one or more of: molten tin or molten salt.

10. The method of claim 8, wherein the first mold tool contacts the second mold tool along a sealing interface around the glass workpiece.

11. The method of claim 8, wherein the heating fluid is pressurized to a pressure above atmospheric pressure and less than or equal to 1 MPa.

12. The method of claim 8, wherein the positioning the glass workpiece within the first and second mold tools further comprises including a sealing element between the glass workpiece and the second mold tool to form the fluid seal.

13. The method of claim 8, wherein the positioning the glass workpiece within the first and second mold tools further comprises pressing the second mold tool against the glass workpiece to form the fluid seal.

14. The method of claim 8, wherein the glass workpiece is an aluminosilicate glass sheet and the sheet has a thickness of 300 microns to about 2 mm.

15. A glazing component for an electronic device, the glazing component defining:

a planar rear portion; and

a curved side portion extending from the planar rear portion and defining:

undercut; and

an opening that opens into the glazing component.

16. The glazing component of claim 15, wherein:

the curved side portion extends around a perimeter of the planar rear portion and defines a sidewall of the glazing component; and is also provided with

The outer surface of the sidewall defines a convex curvature in a cross-section along the width of the glazing component.

17. The glass component of claim 15, wherein the glass component is formed from aluminosilicate glass.

18. The glazing component of claim 15, wherein the glazing component has a wall thickness in the range of 300 microns to 2 mm.

19. The glazing component of claim 15, wherein the opening to the glazing component is configured to receive a display.

20. The glazing component of claim 15, wherein each of the outer and inner surfaces of the glazing component is chemically strengthened by ion exchange.