CN116647800A - Speaker module and electronic equipment - Google Patents
Speaker module and electronic equipment Download PDFInfo
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- CN116647800A CN116647800A CN202310905351.6A CN202310905351A CN116647800A CN 116647800 A CN116647800 A CN 116647800A CN 202310905351 A CN202310905351 A CN 202310905351A CN 116647800 A CN116647800 A CN 116647800A
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- annular body
- black hole
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The embodiment of the application provides a loudspeaker module and electronic equipment, wherein the loudspeaker module comprises a shell, a loudspeaker core, an acoustic black hole vibration reduction structure and a damping layer, the shell is provided with a containing cavity, the loudspeaker core divides at least part of the containing cavity into a front cavity and a rear cavity, a through hole is formed in the shell of the rear cavity, and the acoustic black hole vibration reduction structure comprises: the first annular body is provided with a first side and a second side far away from the first side, the thickness of the first annular body increases gradually from the second side to the first side in an exponential function mode, the second annular body is connected with the second side, the thickness of the second annular body is equal to the minimum thickness of the first annular body, the first side or the second side is connected with the shell of the rear cavity, and the damping layer is arranged on the side, far away from the first side, of the acoustic black hole damping structure. The loudspeaker module and the electronic equipment provided by the embodiment of the application can effectively improve the problem of shell vibration of the electronic equipment so as to improve the use experience of consumers.
Description
Technical Field
The embodiment of the application relates to the technical field of electronic equipment, in particular to a loudspeaker module and electronic equipment.
Background
With the rapid development of technology, electronic devices have been generally popularized in people's lives. Particularly portable electronic devices such as notebook computers, tablet computers, cell phones, etc. In order to make the electronic devices have an audio playing function, a speaker module is provided, where the speaker module includes a speaker core, and the speaker core is a transducer device that converts an electrical signal into an acoustic signal, and audio electric energy makes a cone or a diaphragm in the speaker core vibrate through electromagnetic, piezoelectric or electrostatic reaction and generate resonance with surrounding air to make a sound.
In a conventional speaker module, the internal rear cavity is generally a closed space. According to the design principle of the cavity of the loudspeaker module, the volume of the rear cavity has a large influence on the low frequency of the loudspeaker module. When the volume of the rear cavity is increased, the low-frequency resonant frequency is also reduced, and the low-frequency performance is obviously improved. According to the above principle, the volume of the rear cavity should be increased as much as possible, so that the low frequency level of the speaker module can be exerted to the highest degree. Thus, an open rear cavity has been created. The open rear cavity is a rear cavity of the speaker module, which is equivalent to the rear cavity of the speaker module, namely, the inner space of the whole electronic equipment, so that the volume of the rear cavity is greatly increased, and the low-frequency performance of the speaker module is improved.
However, the speaker module without the rear cavity can make the energy generated by resonance between the speaker core and the surrounding air transferred to the housing of the electronic device, which results in serious vibration problem of the housing of the electronic device, and greatly affects the experience of consumers.
Disclosure of Invention
The embodiment of the application provides a loudspeaker module and electronic equipment, which can effectively improve the influence of shell vibration of the electronic equipment and improve the use experience of consumers.
In one aspect, an embodiment of the present application provides a speaker module, including: shell, speaker kernel, the black hole vibration damping structure of acoustics and damping layer, the shell has the holding chamber, the speaker kernel sets up the holding intracavity, set up the sound channel on the shell, the sound channel intercommunication holding chamber and external world, the speaker kernel will be at least part the holding chamber is separated into front chamber and back chamber, the back chamber set up the through-hole on the shell, the black hole vibration damping structure of acoustics includes: the thickness of the first annular body increases gradually from the second side to the first side in an exponential function mode, the second annular body is connected with the second side, the thickness of the second annular body is equal to the minimum thickness of the first annular body, the first side or the second side is connected with the shell of the rear cavity, and the damping layer is arranged on the side, away from the first side, of the acoustic black hole damping structure.
According to the loudspeaker module provided by the embodiment of the application, the through hole is formed in the shell of the rear cavity, so that when the loudspeaker module is assembled in the electronic equipment, the rear cavity of the loudspeaker module can be communicated with the internal space of the electronic equipment, and the low-frequency level of the loudspeaker module can be exerted to the highest degree. And be provided with the acoustic black hole damping structure on the shell of the back chamber of speaker module, the acoustic black hole damping structure includes first cyclic annular body and second cyclic annular body, the thickness of first cyclic annular body increases gradually with the exponential function form from the second side to first side, the second cyclic annular body links to each other with the second side of first cyclic annular body, the thickness of second cyclic annular body equals the minimum thickness of first cyclic annular body, and be provided with the damping layer in the side that is kept away from first side of acoustic black hole damping structure, when the energy wave that the speaker kernel in speaker module produced is transmitted to the acoustic black hole damping structure, the propagation velocity of energy wave can reduce along with the thickness reduction of first cyclic annular body, the wavelength reduces, the vibration amplitude of wave increases and gathers to the region that the thickness is little, when reaching the second cyclic annular body, the damping layer can reduce the reflection coefficient of energy wave by a wide margin, and dissipate the wave energy that gathers here, realize good vibration suppression effect, thereby effectively improve electronic equipment's casing vibration problem, in order to improve consumer's use experience.
In one possible embodiment, at least a portion of the acoustic black hole vibration reduction structure in the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and one end of the cylinder in the axial direction is connected with the shell of the rear cavity.
In one possible embodiment, at least a portion of the acoustic black hole vibration reduction structure in the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and the second side is connected with the shell of the rear cavity.
In one possible embodiment, both sides of the first side in the thickness direction are flush with both ends of the cylinder in the axial direction, respectively.
In one possible embodiment, the first annular body, the second annular body and the cylinder are integrally formed to form the acoustic black hole vibration damping structure.
In one possible embodiment, the thickness of the first annular body is exponentially functional from the second side to the first sideIncrement (I)>For the radial distance of different points on said first annular body to said first side +.>Is->A corresponding thickness value of the first annular body, and (2) >For the order of thickness variation, +.>Is the coefficient of variation.
In one possible embodiment, the total area of the openings of the through holes is greater than or equal to 6 square millimeters.
In one possible embodiment, a dust-proof member is provided at the through hole.
In one possible embodiment, the damping layer includes: at least one of a silica gel damping layer, a rubber damping layer and a polyurethane damping layer.
Another aspect of an embodiment of the present application provides an electronic device, including: the shell and the loudspeaker module are arranged in the shell, the shell is provided with the sound outlet hole, and the sound outlet hole is communicated with a sound outlet channel of the loudspeaker module.
According to the electronic equipment provided by the embodiment of the application, the through hole is formed in the shell of the rear cavity of the speaker module, and the rear cavity of the speaker module can be communicated with the internal space of the electronic equipment, so that the low-frequency level of the speaker module can be exerted to the highest degree. And be provided with the acoustic black hole damping structure on the shell of the back chamber of speaker module, the acoustic black hole damping structure includes first cyclic annular body and second cyclic annular body, the thickness of first cyclic annular body increases gradually with the exponential function form from the second side to first side, the second cyclic annular body links to each other with the second side of first cyclic annular body, the thickness of second cyclic annular body equals the minimum thickness of first cyclic annular body, and be provided with the damping layer in the side that is kept away from first side of acoustic black hole damping structure, when the energy wave that the speaker kernel in speaker module produced is transmitted to the acoustic black hole damping structure, the propagation velocity of energy wave can reduce along with the thickness reduction of first cyclic annular body, the wavelength reduces, the vibration amplitude of wave increases and gathers to the region that the thickness is little, when reaching the second cyclic annular body, the damping layer can reduce the reflection coefficient of energy wave by a wide margin, and dissipate the wave energy that gathers here, realize good vibration suppression effect, thereby effectively improve electronic equipment's casing vibration problem, in order to improve consumer's use experience.
In one possible embodiment, the method further comprises: the acoustic black hole vibration reduction structure and damping layer, the acoustic black hole vibration reduction structure includes: the thickness of the first annular body increases gradually from the second side to the first side in an exponential function mode, the second annular body is connected with the second side, the thickness of the second annular body is equal to the minimum thickness of the first annular body, the first side or the second side is connected with the shell, and the damping layer is arranged on the side, away from the first side, of the acoustic black hole vibration reduction structure.
In one possible embodiment, at least a portion of the acoustic black hole vibration reduction structure in the acoustic black hole vibration reduction structure further comprises: the first side is connected with the outer side face of the cylinder, and one end of the cylinder in the axial direction is connected with the shell.
In one possible embodiment, at least a portion of the acoustic black hole vibration reduction structure in the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and the second side is connected with the shell.
In one possible embodiment, both sides of the first side in the thickness direction are flush with both ends of the cylinder in the axial direction, respectively.
In one possible embodiment, the first annular body, the second annular body and the cylinder are integrally formed to form the acoustic black hole vibration damping structure.
In one possible embodiment, the thickness of the first annular body is exponentially functional from the second side to the first sideIncrement (I)>For the radial distance of different points on said first annular body to said first side +.>Is->A corresponding thickness value of the first annular body, and (2)>For the order of thickness variation, +.>Is the coefficient of variation.
In one possible embodiment, the damping layer includes: at least one of a silica gel damping layer, a rubber damping layer and a polyurethane damping layer.
In one possible embodiment, the housing comprises: and the acoustic black hole vibration reduction structure is arranged on the rear cover.
Drawings
In order to more clearly illustrate the application or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the application, and other drawings can be obtained according to the drawings without creating effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic diagram of a split structure of an electronic device according to an embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a speaker module according to the related art;
FIG. 4 is a schematic diagram of a one-dimensional acoustic black hole structure;
FIG. 5 is a schematic diagram of the propagation of elastic waves in a one-dimensional acoustic black hole structure;
fig. 6 is a schematic structural diagram of a speaker module according to an embodiment of the application;
fig. 7 is a diagram showing distribution of front and rear cavities in a speaker module according to an embodiment of the present application;
FIG. 8 is a top view of an acoustic black hole vibration damping structure and damping layer according to an embodiment of the present application;
FIG. 9 is a cross-sectional view of the acoustic black hole vibration damping structure and damping layer of FIG. 8;
fig. 10 is a schematic structural diagram of a speaker module according to an embodiment of the application;
FIG. 11 is a top view of an acoustic black hole vibration damping structure and damping layer according to an embodiment of the present application;
FIG. 12 is a cross-sectional view of the acoustic black hole vibration damping structure and damping layer of FIG. 11;
FIG. 13 is a schematic diagram illustrating the connection between an acoustic black hole vibration damping structure and a housing according to an embodiment of the present application;
FIG. 14 is a schematic cross-sectional view of FIG. 13;
fig. 15 is a schematic structural diagram of a speaker module according to an embodiment of the application;
Fig. 16 is a schematic structural diagram of a speaker module according to an embodiment of the application;
fig. 17 is a schematic structural diagram of a speaker module according to an embodiment of the present application;
fig. 18 is a schematic structural diagram of a rear cover of an electronic device according to an embodiment of the present application.
Reference numerals illustrate:
1-a speaker module; 2-a housing; a 3-speaker core;
4-front cavity; 5-a rear cavity; 6-through holes;
100-an electronic device;
10-a housing; 11-a middle frame; 111-middle plate;
112-frame; 1121-sockets; 1122-sound outlet hole; 12-a rear cover;
20-screen; 21-a display screen; 22-a light-transmitting cover plate;
30-a circuit board; 31-a main circuit board; 32-a secondary circuit board;
40-cell; 50-a camera module; 60-a speaker module;
61-sound outlet channel; 62-a housing; 63-a speaker core; 64-front cavity; 65-rear cavity; 66-through holes;
67-an acoustic black hole vibration damping structure; 671-a first ring; 6711-first side; 6712-second side;
672-a second ring; 673-column;
68-a damping layer; 70-connection structure.
Detailed Description
The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.
In embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The electronic device provided by the application can comprise, but is not limited to, mobile or fixed terminals with audio playing functions, such as mobile phones, tablet computers, notebook computers, ultra-mobile Personal Computer (UMPC), handheld computers, interphones, netbooks, POS machines, personal digital assistants (Personal Digital Assistant, PDA), wearable devices, security devices, televisions, loudspeaker boxes and the like. The embodiment of the application is illustrated by taking a mobile phone as an example.
Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application, fig. 2 is a schematic structural diagram of a split electronic device 100 according to an embodiment of the present application, and referring to fig. 1 and fig. 2, the electronic device 100 according to an embodiment of the present application may include: the electronic device includes a housing 10, a screen 20, a circuit board 30, a battery 40, an image pickup module 50, a universal serial bus (Universal serial bus, USB) device (not shown), and a speaker module 60.
It should be understood that fig. 1 and 2 are not drawn to actual scale of the various parts, as are other figures, and therefore the application should not be limited to the scale, dimensions, etc. shown in the drawings. In addition, in the present application, "connected" or "electrically connected" may mean not only that the two are directly connected, but also that the two are connected through one or more intermediate devices. "mounted" or "assembled" in the present application may include any existing mounting means, for example, one component may be secured to, below, or within another component by means of connectors (e.g., bolts, rivets, etc.) and/or adhesives, etc. These understandings fall within the scope of the embodiments of the application. In addition, when the electronic apparatus 100 is an apparatus of some other forms, the electronic apparatus 100 may not include at least one of the screen 20, the circuit board 30, the battery 40, the camera module 50, and the USB device.
Specifically, referring to fig. 1 and 2, the housing 10 may provide a structural frame for the electronic device 100, for example, in fig. 1 and 2, the housing 10 may include a middle frame 11 and a rear cover 12, and may also have a screen 20 when the electronic device 100 has a display function. A middle frame 11, a circuit board 30, a battery 40, a camera module 50, a USB device, and a speaker module 60 are provided between the screen 20 and the rear cover 12. In which the middle frame 11 may serve as a structural "skeleton" of the electronic apparatus 100, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 may be disposed on the middle frame 11, for example, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 may be disposed on a side of the middle frame 11 facing the rear cover 12, or the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 may be disposed on a side of the middle frame 11 facing the screen 20.
Wherein, middle frame 11 may include middle plate 111 and rim 112, rim 112 is disposed around the periphery of middle plate 111 a week. In general, the frame 112 may include a top frame, a bottom frame, a left side frame, and a right side frame. The top frame, the bottom frame, the left side frame and the right side frame enclose a frame with a square ring structure. The middle plate 111 may be an aluminum plate, an aluminum alloy, or a magnesium alloy. The frame 112 may be a metal frame or a ceramic frame. The middle plate 111 and the frame 112 may be clamped, welded, bonded or integrally formed, or the metal middle plate 111 and the frame 112 are fixedly connected by injection molding.
It is to be readily appreciated that the housing 10 of the electronic device 100 provided by the present application includes, but is not limited to, the above-described structure, for example, in some other embodiments, the housing 10 may be an integral or separate housing made of metal or plastic, etc. In the embodiment of the present application, the case 10 is specifically described by taking the structure of the middle frame 11 and the rear cover 12 as an example. When the electronic apparatus 100 does not include the middle frame 11, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 may be fixed on the surface of the screen 20 facing the rear cover 12 by screwing, clamping, welding, or the like, or may be fixed on the surface of the rear cover 12 facing the screen 20 by screwing, clamping, welding, or the like.
It should be noted that, in the electronic device 100, the middle frame 11 and the rear cover 12 include, but are not limited to, the structures shown in fig. 1 and 2, and in some other embodiments, the rear cover 12 may be connected to the rim 112 to form an integrally formed housing, for example, the electronic device 100 may include: screen 20, midplane 111, and a housing, which may be integrally formed with bezel 112 and back cover 12. In this way, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 are disposed in the accommodation space formed by the middle plate 111 and the housing.
The screen 20 is used to display images, videos, and the like. The screen 20 may include a light-transmissive cover plate 22 and a display screen 21 (also referred to as a display panel). The light-transmitting cover plate 22 is laminated with the display screen 21 and fixedly connected by means of gluing or the like. The light-transmitting cover plate 22 is mainly used for protecting the display screen 21 and preventing dust. The material of the transparent cover plate 22 includes, but is not limited to, glass. The display 21 may be a flexible display or a rigid display. For example, the display screen 21 may be an Organic Light-Emitting Diode (OLED) display screen, an Active-Matrix Organic Light-Emitting Diode (AMOLED) display screen, a mini-Light-Emitting Diode (Mini Organic Light-Emitting Diode) display screen, a micro-Light-Emitting Diode (Micro Organic Light-Emitting Diode) display screen, a micro-Organic Light-Emitting Diode (Micro Organic Light-Emitting Diode) display screen, a quantum dot Light-Emitting Diode (Quantum dot Light Emitting Diodes, QLED) display screen, a liquid crystal display screen (Liquid Crystal Display, LCD) or the like.
The rear cover 12 is used to protect the internal electronics of the electronic device 100, and the material of the rear cover 12 includes, but is not limited to, metal, ceramic, plastic, and glass. In order to ensure the light and thin electronic device 100 and the structural strength of the rear cover 12, the rear cover 12 may be made of metal. The transparent cover 22, the frame 112 and the rear cover 12 enclose an internal accommodating space of the electronic device 100. The accommodation space accommodates the display screen 21, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60.
With continued reference to fig. 2, in the electronic device 100 provided in the embodiment of the present application, the circuit board 30 may include: a main circuit board 31 and a sub circuit board 32.
The main circuit board 31 is used for integrating the control chip. The control chip may be, for example, an application processor (Application Processor, AP), a Double Data Rate synchronous dynamic random access memory (DDR), a universal memory (Universal Flash Storage, UFS), etc. In some embodiments, the main circuit board 31 is electrically connected to the display screen 21, and the main circuit board 31 is used to control the display screen 21 to display images or videos. The main circuit board 31 may be a hard circuit board, a flexible circuit board, or a combination of a hard and soft circuit board. The main circuit board 31 may be an FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, or the like. Here, FR-4 is a code of a flame resistant material grade, and the Rogers dielectric board is a high frequency board.
The secondary circuit board 32 is used to integrate electronic components such as an antenna (e.g., 5G antenna) rf front end, a universal serial bus (Universal Serial bus, USB) device, etc. The secondary circuit board 32 may be a hard circuit board, a flexible circuit board, or a combination of a hard and soft circuit board. The secondary circuit board 32 may be an FR-4 dielectric board, a Rogers dielectric board, a hybrid dielectric board of FR-4 and Rogers, or the like.
The secondary circuit board 32 is electrically connected with the primary circuit board 31 through the connection structure 70 to realize data and signal transmission between the secondary circuit board 32 and the primary circuit board 31. The connection structure 70 may be a flexible circuit board (Flexible Printed Circuit, FPC), among others. In other embodiments, the connection structure 70 may be a wire or an enameled wire.
Of course, in other embodiments, the circuit board 30 may be one or more pieces, and the number of the circuit boards 30 is not limited in the present application.
The battery 40 is used to supply power to electronic devices such as the display 21, the main circuit board 31, the sub-circuit board 32, the camera module 50, the speaker module 60, and the like in the electronic apparatus 100. In some embodiments, a battery mounting groove may be provided in a surface of the middle frame 11 facing the rear cover 12, in which the battery 40 is mounted.
The camera module 50 can realize photographing and shooting functions of the electronic device 100, and the camera module 50 is electrically connected with the circuit board 30. The camera module 50 may be a front camera, a rear camera, or the like, and the number of the front camera and the rear camera may be one or more, as shown in fig. 2, and in the embodiment of the present application, the camera module 50 is illustrated by taking three rear cameras as an example.
The USB device is connected to the sub-circuit board 32, and is an interface device conforming to the USB standard specification. Specifically, the USB device may be a Mini USB device, a Micro USB device, a USB Type C device, or the like. The USB device is used to connect a charger to charge the electronic device 100 via the jack 1121 on the bezel 112, and may also be used to transfer data between the electronic device 100 and a peripheral device, and may also be used to connect headphones through which audio is played. USB devices may also be used to connect other electronic devices, such as augmented reality (Augmented Reality, AR) devices, etc.
The speaker module 60 is used for reproducing audio electric signals such as music and voice into sound, and can support the audio playback function. In some embodiments, the speaker module 60 is electrically connected to the secondary circuit board 32. At this time, the audio signal transmitted from the main circuit board 31 is transmitted to the speaker module 60 through the sub circuit board 32, and is converted into a sound signal by the speaker module 60 to be output. Specifically, referring to fig. 2 in combination with fig. 1, the housing of the speaker module 60 is provided with an acoustic channel 61. The sound signal output by the speaker module 60 is output from the sound output channel 61, and the frame 112 is provided with a sound output hole 1122, and the sound output hole 1122 is communicated with the sound output channel 61. The sound output from the sound output channel 61 is output from the sound output hole 1122 to the outside of the electronic device 100.
In other embodiments, the speaker module 60 may also be directly electrically connected to the main circuit board 31 through FPC, wires, varnished wires, and the like.
In the drawings, the speaker module 60 is one of the embodiments of the present application. Of course, the number of speaker modules 60 may be plural, for example, in other embodiments of the present application, two speaker modules 60 may be provided, wherein one speaker module 60 is disposed at the top of the mobile phone and the other speaker module 60 is disposed at the bottom of the mobile phone. In addition, the setting position of the speaker module 60 may be set according to specific needs, including but not limited to the setting positions in the above examples.
Fig. 3 is a schematic cross-sectional view of a speaker module 1 according to the related art, referring to fig. 3, in which the speaker module 1 includes: the shell 2 and the loudspeaker core 3 arranged in the shell 2, wherein the loudspeaker core 3 divides the accommodating space formed by the enclosure of the shell 2 into a front cavity 4 and a rear cavity 5. The front cavity 4 is a sound reflection area, has the effect of expanding sound, and the rear cavity 5 has the effect of enhancing the intensity of sound.
It should be noted that fig. 3 is a simple schematic diagram of the speaker module 1, and only some components included in the speaker module 1 are schematically shown, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 3.
According to the design principle of the speaker module cavity, the rear cavity 5 has a larger influence on the low frequency of the speaker module 1. When the volume of the rear cavity 5 is increased, the low-frequency resonance frequency is also reduced, and the low-frequency performance is obviously improved. According to the above principle, the volume of the rear chamber 5 should be increased as much as possible, and the low frequency level of the speaker module 1 can be exerted to the highest degree. However, the volume of the rear cavity 5 of the speaker module 1 is limited by the space of the mobile phone, and thus, the volume of the rear cavity is not greatly increased, as shown in fig. 3, in the related art, a through hole 6 is formed in the housing 2 of the rear cavity 5, so that the rear cavity 5 is communicated with the internal space of the mobile phone, which is equivalent to the whole internal space of the speaker module 1, so that the volume of the rear cavity is greatly increased, thereby improving the low-frequency performance of the speaker module 1.
However, in the above embodiment, the energy generated by resonance between the speaker core 3 and the surrounding air is transferred to the housing of the mobile phone, which causes serious vibration of the housing of the mobile phone, and greatly affects the experience of consumers.
In order to solve the above-mentioned problems, an embodiment of the present application provides a speaker module, in which a through hole is formed in a housing of a rear cavity of the speaker module, and when the speaker module is assembled in an electronic device, the rear cavity of the speaker module can communicate with an internal space of the electronic device, so that a low frequency level of the speaker module can be exerted to the highest extent. And be provided with the acoustic black hole damping structure on the shell of the back chamber of speaker module, the acoustic black hole damping structure includes first cyclic annular body and second cyclic annular body, the thickness of first cyclic annular body increases gradually with the exponential function form from the second side to first side, the second cyclic annular body links to each other with the second side of first cyclic annular body, the thickness of second cyclic annular body equals the minimum thickness of first cyclic annular body, and be provided with the damping layer in the side that is kept away from first side of acoustic black hole damping structure, when the energy wave that the speaker kernel in speaker module produced is transmitted to the acoustic black hole damping structure, the propagation velocity of energy wave can reduce along with the thickness reduction of first cyclic annular body, the wavelength reduces, the vibration amplitude of wave increases and gathers to the region that the thickness is little, when reaching the second cyclic annular body, the damping layer can reduce the reflection coefficient of energy wave by a wide margin, and dissipate the wave energy that gathers here, realize good vibration suppression effect, thereby effectively improve electronic equipment's casing vibration problem, in order to improve consumer's use experience.
The speaker module and the electronic device provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings and specific embodiments.
First, an acoustic black hole (Acoustic black holes, ABH) is described, which is a specific form of structure in the acoustic field, which has "phagocytic" effect on the internal bending wave concentration, and is a natural wave trap. When the structural form satisfies the condition that the acoustic black hole effect gradually decreases to zero in the thickness direction as an exponential function form as shown in fig. 4, the specific effect is represented by that when the bending wave propagates in the thickness decreasing direction as shown in fig. 5, the wavelength is compressed, the wave speed gradually decreases, the accumulated phase gradually increases, and in an ideal case (the thickness of the edge of the structure decreases to zero), the wave is completely absorbed when reaching the edge, and no reflection occurs.
Fig. 6 is a schematic structural diagram of a speaker module 60 according to an embodiment of the present application, and referring to fig. 6, the speaker module 60 according to an embodiment of the present application includes: a housing 62, a speaker core 63, an acoustic black hole vibration damping structure 67, and a damping layer 68.
Specifically, the housing 62 has a receiving cavity, the speaker core 63 is disposed in the receiving cavity, the housing 62 is provided with a sound emitting channel 61 (shown in fig. 2), the sound emitting channel 61 communicates the receiving cavity with the outside, and when the speaker module 60 is disposed in the electronic device 100, the sound emitting channel 61 can communicate with a sound emitting hole 1122 formed in the electronic device 100 to emit sound generated by vibration between the speaker core 63 and ambient air out of the electronic device 100.
With continued reference to fig. 6, a speaker core 63 disposed in the housing cavity of the housing 62 separates at least a portion of the housing cavity into a front cavity 64 and a rear cavity 65, where "at least a portion of the housing cavity" means: all or part of the accommodation chambers. It should be noted that the front cavity 64 and the rear cavity 65 in the speaker module 60 have specific meanings in the art, including, but not limited to, the front cavity 64 being disposed at a top position of the speaker core 63 as in fig. 6, the rear cavity 65 being disposed at a bottom position of the speaker core 63, and the front cavity 64 being disposed at a top position of the speaker core 63 as in fig. 7, and the rear cavity 65 being disposed at a side position of the speaker core 63. The air flow formed by the front cavity 64 of the speaker module 60 may be guided out by the sound outlet channel 61, and the rear cavity 65 enhances the sound.
With continued reference to fig. 6, the housing 62 of the rear cavity 65 of the speaker module 60 is provided with a through hole 66, so that when the speaker module 60 is mounted in the electronic device 100, the rear cavity 65 of the speaker module 60 can communicate with the internal space of the electronic device 100, and the low frequency level of the speaker module 60 can be exhibited to the highest degree.
In order to ensure good connectivity between the rear cavity 65 of the speaker module 60 and the internal space of the electronic device 100, in some embodiments of the present application, the total area of the through holes 66 formed in the housing 62 of the rear cavity 65 of the speaker module 60 is set to be greater than or equal to 6 square millimeters. The number of the through holes 66 and the open form of the through holes 66 are not limited, the number of the through holes 66 may be one or more, and the through holes 66 may be round holes, square holes, irregular holes, or the like.
In order to ensure the dustproof performance of the accommodating cavity of the speaker module 60, in some embodiments of the present application, a dustproof member, such as a dustproof net or other film materials with similar functions, may be further disposed at the opened through hole 66.
Fig. 8 is a top view of an acoustic black hole vibration damping structure 67 and a damping layer 68 according to an embodiment of the present application, and fig. 9 is a cross-sectional view of the acoustic black hole vibration damping structure 67 and the damping layer 68 in fig. 8, and referring to fig. 8 and 9 in combination with fig. 6, the acoustic black hole vibration damping structure 67 includes: a first annular body 671 and a second annular body 672, the first annular body 671 having a first side 6711 and a second side 6712 remote from the first side 6711, the first side 6711 being located outside the second side 6712, the thickness of the first annular body 671 increasing exponentially from the second side 6712 to the first side 6711. The second annular body 672 may be located inside the first annular body 671, the second annular body 672 is connected to the second side 6712 of the first annular body 671, the second annular body 672 may or may not be integral with the first annular body 671, and the broken line is shown only for better distinguishing the first annular body 671 from the second annular body 672. The thickness of the second annular body 672 is equal to the minimum thickness of the first annular body 671.
The damping layer 68 is disposed on a side of the acoustic black hole vibration attenuation structure 67 remote from the first side 6711 of the first annular body 671, and as illustrated in fig. 8 and 9, the damping layer 68 may be disposed on a side of the second annular body 672 remote from the first annular body 671, for example. In other embodiments, the damping layer 68 may be disposed on the upper surface or the lower surface of the second annular body 672, or the damping layer 68 may be disposed on at least part of the upper surface or the lower surface of the first annular body 671 and the second annular body 672. The thickness of the second annular body 672 is equal to the minimum thickness of the first annular body 671, which on the one hand facilitates the conduction of bending waves from the first annular body 671 to the second annular body 672 and on the other hand facilitates the attachment of the damping layer 68.
Wherein the damping layer 68 is a viscoelastic material, such as a silicone damping layer 68, a rubber damping layer 68, a polyurethane damping layer 68, or the like.
Referring to fig. 6, the acoustic black hole vibration damping structure 67 may be connected to the housing 62 of the rear cavity 65 by connecting the first side 6711 of the first annular body 671 to the housing 62 of the rear cavity 65. The acoustic black hole vibration damping structure 67 may be integrated with the housing 62 of the rear cavity 65, or may not be integrated, and when not integrated, the acoustic black hole vibration damping structure 67 may be assembled on the housing 62 of the rear cavity 65 by a series of conventional connection methods such as bonding, welding, and clamping, and at this time, the housing 62 of the rear cavity 65 may be regarded as an acoustic black hole.
When the speaker core 63 is in operation, the housing 62 of the rear cavity 65 of the speaker module 60 will vibrate due to the air pressure fluctuation caused by the speaker core 63, the first side 6711 of the first annular body 671 receives the bending wave transmitted from the housing 62 of the rear cavity 65 of the speaker module 60 and the bending wave transmitted from the air, and the bending wave is transmitted from the first side 6711 of the first annular body 671 to the second side 6712 of the first annular body 671 and the second annular body 672, so that the damping layer 68 attached to the second annular body 672 and/or at least part of the first annular body 671 effectively dissipates the fluctuation energy collected there due to the acoustic black hole effect, thereby realizing effective vibration suppression effect, improving the influence of the housing vibration of the electronic device 100 and improving the use experience of consumers.
Fig. 10 is a schematic structural diagram of a speaker module 60 according to an embodiment of the present application, fig. 11 is a top view of an acoustic black hole vibration damping structure 67 and a damping layer 68 according to an embodiment of the present application, fig. 12 is a cross-sectional view of the acoustic black hole vibration damping structure 67 and the damping layer 68 in fig. 11, and referring to fig. 10 to 12, the acoustic black hole vibration damping structure 67 includes: a first annular body 671 and a second annular body 672, the first annular body 671 having a first side 6711 and a second side 6712 remote from the first side 6711, the first side 6711 also being located inside the second side 6712, the thickness of the first annular body 671 increasing exponentially from the second side 6712 to the first side 6711. The second annular body 672 may be further located outside the first annular body 671, the second annular body 672 is connected to the second side 6712 of the first annular body 671, the second annular body 672 may be integral with the first annular body 671 or not, and the broken line is shown only for better distinguishing the first annular body 671 and the second annular body 672. The thickness of the second annular body 672 is equal to the minimum thickness of the first annular body 671.
The damping layer 68 is disposed on a side of the acoustic black hole vibration damping structure 67 remote from the first side 6711 of the first annular body 671, and as illustrated in fig. 12, the damping layer 68 may be disposed on a lower surface of the second annular body 672 and a portion of the first annular body 671, for example. In other embodiments, the damping layer 68 may also be disposed on the upper or lower surface of the second annular body 672, or the damping layer 68 may also be disposed on at least a portion of the upper surfaces of the first annular body 671 and the second annular body 672. The thickness of the second annular body 672 is equal to the minimum thickness of the first annular body 671, which on the one hand facilitates the conduction of bending waves from the first annular body 671 to the second annular body 672 and on the other hand facilitates the attachment of the damping layer 68.
The acoustic black hole vibration reduction structure 67 may be coupled to the housing 62 of the rear cavity 65 by coupling the second side 6712 of the first annular body 671 to the housing 62 of the rear cavity 65 via the second annular body 672.
When the speaker core 63 is in operation, the first side 6711 of the first annular body 671 receives the bending wave transmitted from the air, and the bending wave is transmitted from the first side 6711 of the first annular body 671 to the second side 6712 of the first annular body 671 and the second annular body 672, so that the vibration energy accumulated in the second annular body 672 and/or at least part of the damping layer 68 of the first annular body 671 due to the acoustic black hole effect is efficiently dissipated, and an effective vibration suppression effect is achieved, thereby improving the influence of the housing vibration of the electronic device 100 and improving the use experience of consumers.
It should be noted that the number of the acoustic black hole vibration damping structures 67 is not limited in the embodiment of the present application, for example, the acoustic black hole vibration damping structures 67 may be one or more. The structure, dimensions and material parameters of the plurality of acoustic black hole vibration reduction structures 67 may be the same or different. The arrangement position of the acoustic black hole vibration damping structure 67 on the housing 62 of the rear cavity 65 is also not limited in the embodiment of the present application, and may be, for example, arranged on a side wall of the rear cavity 65, a bottom wall of the rear cavity 65, or the like.
It can be appreciated that, in the speaker module 60 provided by the embodiment of the present application, the through hole 66 is formed on the housing 62 of the rear cavity 65, when the speaker module 60 is assembled in the electronic device 100, the rear cavity 65 of the speaker module 60 can be communicated with the internal space of the electronic device 100, so that the low frequency level of the speaker module 60 can be exerted to the maximum extent. And, an acoustic black hole vibration reduction structure 67 is provided on the housing 62 of the rear chamber 65 of the speaker module 60, the acoustic black hole vibration reduction structure 67 includes a first annular body 671 and a second annular body 672, the thickness of the first annular body 671 increases gradually from the second side 6712 to the first side 6711 in an exponential function form, the second annular body 672 is connected with the second side 6712 of the first annular body 671, the thickness of the second annular body 672 is equal to the minimum thickness of the first annular body 671, and a damping layer 68 is provided on the side of the acoustic black hole vibration reduction structure 67 away from the first side 6711, when the energy wave generated by the speaker core 63 in the speaker module 60 is transferred to the acoustic black hole vibration reduction structure 67, the propagation speed of the energy wave decreases with the decrease in the thickness of the first annular body 671, the vibration amplitude of the wave increases and gathers to the area where the thickness becomes smaller, and the damping layer 68 can greatly reduce the reflection coefficient of the energy wave and dissipate the amount of the wave energy gathered there, thereby realizing a good suppression effect, thereby effectively improving the vibration experience of the housing 10 and the consumer using the device 100.
Of course, more than just this, fig. 13 is a schematic diagram illustrating connection between the acoustic black hole vibration damping structure 67 and the housing 62 according to an embodiment of the present application, fig. 14 is a schematic diagram illustrating a cross-sectional structure of fig. 13, and referring to fig. 13 and 14, in some embodiments of the present application, at least a portion of the acoustic black hole vibration damping structure 67 in the acoustic black hole vibration damping structure 67 further includes: the column 673, the column 673 may be a cylinder 673, a square column 673, etc., and the column 673 is exemplified as the column 673 in the present application. The first side 6711 of the first annular body 671 is connected to an outer surface of the cylinder 673, and one end of the cylinder 673 in the axial direction is connected to the housing 62 of the rear chamber 65, for example, one end of the cylinder 673 in the axial direction is connected to an inner wall or an outer wall of the housing 62 of the rear chamber 65. In this connection, it can be understood that the first side 6711 of the first annular body 671 is connected to the housing 62 of the rear chamber 65. The post 673 may be attached to the housing 62 of the rear cavity 65 by a series of conventional attachment means such as adhesive or bolting, without limitation. In this manner of connection, on the one hand, the overall rigidity and strength of the housing 62 can be ensured to be intact, and on the other hand, the excellent vibration suppressing ability of the acoustic black hole vibration damping structure 67 can be exhibited.
When the speaker core 63 is in operation, the housing 62 of the rear cavity 65 of the speaker module 60 will vibrate due to the air pressure fluctuation caused by the speaker core 63, the cylinder 673 receives the bending wave transmitted from the housing 62 of the rear cavity 65 of the speaker module 60 and the bending wave transmitted from the air, the bending wave is transmitted from the first side 6711 of the first annular body 671 to the second side 6712 of the first annular body 671 and the second annular body 672, and the vibration energy accumulated there due to the acoustic black hole effect is efficiently dissipated by the damping layer 68 attached to the second annular body 672 and/or at least part of the first annular body 671, so as to realize an effective vibration suppression effect, thereby improving the influence of the housing vibration of the electronic device 100 and improving the use experience of consumers.
Wherein "at least a portion of the acoustic black hole vibration reduction structures 67 further comprise pillars 673" means that all of the acoustic black hole vibration reduction structures 67 comprise pillars 673, it being understood that all of the acoustic black hole vibration reduction structures 67 on the housing 62 of the rear cavity 65 are shown in fig. 13 and 14; alternatively, a part of the acoustic black hole vibration reduction structure 67 includes a column 673, and it is understood that a part of the acoustic black hole vibration reduction structure 67 on the housing 62 of the rear cavity 65 may be configured as shown in fig. 8 and 9, a part may be configured as shown in fig. 11 and 12, and a part may be configured as shown in fig. 13 and 14, that is, the acoustic black hole vibration reduction structures 67 of different structures may be mixed and matched. For example, as shown in FIG. 15, three structurally different acoustic black hole vibration reduction structures 67 may be disposed on the housing 62 of the rear cavity 65.
Fig. 16 is a schematic structural diagram of a speaker module 60 according to an embodiment of the present application, and referring to fig. 16, in some embodiments of the present application, at least a portion of the acoustic black hole damping structures 67 in the acoustic black hole damping structures 67 further include: the column 673, the column 673 may be a cylinder 673, a square column 673, etc., and the column 673 is exemplified as the column 673 in the present application. The first side 6711 of the first annular body 671 is connected to the outer surface of the post 673, and the second side 6712 of the first annular body 671 is connected to the housing 62 of the rear chamber 65 through the second annular body 672. The second annular body 672 may be coupled to the housing 62 of the rear cavity 65 by a series of conventional couplings such as adhesive or bolting, without limitation.
Also, the arrangement of the acoustic black hole vibration reduction structure 67 in the housing 62 of the rear cavity 65 of the speaker module 60 includes, but is not limited to, those shown in fig. 16, but also may be a mixture of acoustic black hole vibration reduction structures 67 of different structures, and as shown in fig. 17, the speaker module 60 includes four acoustic black hole vibration reduction structures 67 of different structures.
When the speaker core 63 is in operation, the cylinder 673 receives the bending wave transmitted from the air, and the bending wave is transmitted from the cylinder 673 to the first side 6711 of the first annular body 671 and then to the second side 6712 of the first annular body 671 and the second annular body 672, so that the vibration energy accumulated in the second annular body 672 and/or at least part of the damping layer 68 of the first annular body 671 due to the acoustic black hole effect is efficiently dissipated, and an effective vibration suppression effect is achieved, thereby improving the influence of the housing vibration of the electronic device 100 and improving the use experience of consumers.
Wherein, as shown in fig. 14, in some embodiments of the present application, two sides of the first side 6711 of the first annular body 671 in the thickness direction are respectively flush with two ends of the column 673 in the axial direction, so that the conduction of bending waves in the whole acoustic black hole vibration damping structure 67 can be facilitated.
The first annular body 671, the second annular body 672 and the column 673 may be separate components. In order to facilitate the conduction of bending waves throughout the acoustic black hole vibration damping structure 67, in some embodiments of the present application, the first annular body 671, the second annular body 672, and the post 673 are integrally formed as a single piece, forming the acoustic black hole vibration damping structure 67. The acoustic black hole vibration absorbing structure 67 may be made of metal or nonmetal.
Wherein the thickness of the first annular body 671 is exponentially formed from the second side 6712 to the first side 6711Increment (I)>For radial distances from different points on the first annulus 671 to the first side 6711,is->The thickness value of the corresponding first loop 671, ">For the order of thickness variation, +.>Is the coefficient of variation.
When the acoustic black hole vibration reduction structure 67 is as shown in the structure in fig. 14, the thickness of the acoustic black hole vibration reduction structure 67 in the radial direction can be expressed by the following expression: ，/>Is the height of cylinder 673, +.>Is the radius of the cylinder 673; />，/>Is the thickness of second ring 672, +.>From the second side 6712 of the first annulus 671 to a cylinderRadial distance of circle center of body 673; />，/>Is the radial distance from the side of the second annular body 672 away from the first annular body 671 to the center of the cylinder 673.
The electronic device 100 provided in the embodiment of the present application may further include, in addition to the speaker module 60 shown above, an additional acoustic black hole vibration damping structure 67, where the acoustic black hole vibration damping structure 67 may be disposed on the housing 10 of the electronic device 100 and connected to the housing 10, for example, disposed on the middle frame 11 and/or the rear cover 12, so as to further improve the housing vibration influence of the electronic device 100, thereby improving the use experience of consumers. Referring to fig. 18, in some embodiments of the application, an additional acoustic black hole vibration reduction structure 67 is provided on the back cover 12.
In the embodiment of the present application, the arrangement mode, structure and effect of the acoustic black hole vibration reduction structure 67 in the electronic device 100 on the housing 10 are the same as the arrangement mode, structure and effect of the acoustic black hole vibration reduction structure 67 on the housing 62 of the rear cavity 65 in the speaker module 60, and are not described in detail herein.
In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through an intermediary, in communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the embodiments of the present application, and are not limited thereto; although embodiments of the present application have been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (18)
1. A speaker module, comprising: the loudspeaker comprises a shell, a loudspeaker core, an acoustic black hole vibration reduction structure and a damping layer;
the shell is provided with a containing cavity, the loudspeaker inner core is arranged in the containing cavity, the shell is provided with a sound outlet channel, and the sound outlet channel is communicated with the containing cavity and the outside;
the loudspeaker inner core divides at least part of the accommodating cavity into a front cavity and a rear cavity, and a through hole is formed in the shell of the rear cavity;
the acoustic black hole vibration reduction structure comprises: a first annular body having a first side and a second side remote from the first side, the thickness of the first annular body increasing exponentially from the second side toward the first side, the second annular body being connected to the second side, the thickness of the second annular body being equal to the minimum thickness of the first annular body;
the first side or the second side is connected with the shell of the rear cavity, and the damping layer is arranged on one side, far away from the first side, of the acoustic black hole vibration reduction structure.
2. The speaker module of claim 1, wherein at least a portion of the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and one end of the cylinder in the axial direction is connected with the shell of the rear cavity.
3. The speaker module of claim 2, wherein at least a portion of the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and the second side is connected with the shell of the rear cavity.
4. A speaker module according to claim 2 or 3, wherein both sides of the first side in the thickness direction are flush with both ends of the column body in the axial direction, respectively.
5. A loudspeaker module according to claim 2 or 3, wherein the first annular body, the second annular body and the cylinder are integrally formed to form the acoustic black hole vibration damping structure.
6. A loudspeaker module according to any one of claims 1-3, wherein the thickness of the first annular body is exponentially functional from the second side to the first sideIncrement (I)>For the radial distance of different points on said first annular body to said first side +.>Is->A corresponding thickness value of the first annular body, and (2)>For the order of thickness variation, +.>Is the coefficient of variation.
7. A loudspeaker module according to any one of claims 1-3, wherein the total area of the openings of the through holes is greater than or equal to 6 square millimeters.
8. A loudspeaker module according to any one of claims 1-3, wherein a dust guard is provided at the through hole.
9. A loudspeaker module according to any one of claims 1-3, wherein the damping layer comprises: at least one of a silica gel damping layer, a rubber damping layer and a polyurethane damping layer.
10. An electronic device, comprising: a housing and a speaker module according to any one of claims 1-9;
the loudspeaker module is arranged in the shell, a sound outlet hole is formed in the shell, and the sound outlet hole is communicated with a sound outlet channel of the loudspeaker module.
11. The electronic device of claim 10, further comprising: an acoustic black hole vibration reduction structure and a damping layer;
the acoustic black hole vibration reduction structure comprises: a first annular body having a first side and a second side remote from the first side, the thickness of the first annular body increasing exponentially from the second side toward the first side, the second annular body being connected to the second side, the thickness of the second annular body being equal to the minimum thickness of the first annular body;
The first side or the second side is connected with the shell, and the damping layer is arranged on one side, far away from the first side, of the acoustic black hole vibration reduction structure.
12. The electronic device of claim 11, wherein at least a portion of the acoustic black hole vibration reduction structure further comprises: the first side is connected with the outer side face of the cylinder, and one end of the cylinder in the axial direction is connected with the shell.
13. The electronic device of claim 11, wherein at least a portion of the acoustic black hole vibration reduction structure further comprises: and the first side is connected with the outer side surface of the cylinder, and the second side is connected with the shell.
14. The electronic apparatus according to claim 12 or 13, wherein both sides of the first side in the thickness direction are flush with both ends of the column in the axial direction, respectively.
15. The electronic device of claim 12 or 13, wherein the first annular body, the second annular body, and the post are integrally formed to form the acoustic black hole vibration damping structure.
16. The electronic device of any of claims 11-13, wherein a thickness of the first annular body is exponentially functional from the second side to the first side Increment (I)>For the radial distance of different points on said first annular body to said first side +.>Is->A corresponding thickness value of the first annular body, and (2)>For the order of thickness variation, +.>Is the coefficient of variation.
17. The electronic device of any of claims 11-13, wherein the damping layer comprises: at least one of a silica gel damping layer, a rubber damping layer and a polyurethane damping layer.
18. The electronic device of any one of claims 11-13, wherein the housing comprises: and the acoustic black hole vibration reduction structure is arranged on the rear cover.
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| CN117412228A (en) * | 2023-09-20 | 2024-01-16 | 荣耀终端有限公司 | Electronic equipment |
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| JPH10164681A (en) * | 1996-11-26 | 1998-06-19 | Toshio Okawa | Damper plate, damper device using the plate, and loudspeaker cabinet and music box using the device |
| CN106023974A (en) * | 2016-05-23 | 2016-10-12 | 南京航空航天大学 | Imperfect acoustic black hole section structure |
| CN108185824A (en) * | 2018-01-02 | 2018-06-22 | 美的集团股份有限公司 | The shell and its electrical equipment of a kind of home appliance |
| CN108419188A (en) * | 2018-02-12 | 2018-08-17 | 歌尔股份有限公司 | A kind of loud speaker module |
| CN108717850A (en) * | 2018-04-28 | 2018-10-30 | 南京航空航天大学 | A kind of doubling plate chamber vibration and noise reducing structure |
| CN113314088A (en) * | 2021-05-18 | 2021-08-27 | 北京航空航天大学 | Heterogeneous/special-shaped acoustic black hole and phonon crystal mixed vibration and noise reduction enhancement structure |
| CN113793586A (en) * | 2021-08-24 | 2021-12-14 | 武汉理工大学 | Low-frequency ultra-wideband acoustic black hole acoustic material structure |
| JP2023087202A (en) * | 2021-12-13 | 2023-06-23 | 日産自動車株式会社 | Vibration control structure, interior component and vehicle |
| CN114885245A (en) * | 2022-03-10 | 2022-08-09 | 富立康泰医疗器械(厦门)有限公司青岛分公司 | Open type earphone |
| CN218957391U (en) * | 2022-11-03 | 2023-05-02 | 四川大学 | Acoustic black hole and thin film metamaterial composite low-frequency noise reduction structure |
| CN218381630U (en) * | 2022-11-04 | 2023-01-24 | 上海工程技术大学 | Piezoelectric energy harvesting and sensing combined type structure of railway vehicle |
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| CN117412228A (en) * | 2023-09-20 | 2024-01-16 | 荣耀终端有限公司 | Electronic equipment |
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