CN116634831A - Display panel manufacturing method and display panel - Google Patents

Display panel manufacturing method and display panel Download PDF

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Publication number
CN116634831A
CN116634831A CN202310577624.9A CN202310577624A CN116634831A CN 116634831 A CN116634831 A CN 116634831A CN 202310577624 A CN202310577624 A CN 202310577624A CN 116634831 A CN116634831 A CN 116634831A
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CN
China
Prior art keywords
substrate
color organic
light emitting
organic light
layer
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Pending
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CN202310577624.9A
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Chinese (zh)
Inventor
邓琼
高宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Hefei Visionox Technology Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Hefei Visionox Technology Co Ltd
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Application filed by Kunshan Govisionox Optoelectronics Co Ltd, Hefei Visionox Technology Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to CN202310577624.9A priority Critical patent/CN116634831A/en
Publication of CN116634831A publication Critical patent/CN116634831A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application relates to a manufacturing method of a display panel and the display panel. The method comprises the following steps: providing a substrate, wherein the substrate is provided with a first sub-pixel area, a second sub-pixel area and a third sub-pixel area; forming a first color organic light emitting material layer on a substrate; patterning the first color organic light emitting material layer by using a photolithography process, and reserving a portion of the first color organic light emitting material layer located in the first sub-pixel region to form a first color organic light emitting layer; forming a second color organic light emitting material layer on the substrate; patterning the second color organic light emitting material layer by using a photolithography process, and reserving a portion of the second color organic light emitting material layer located in the second sub-pixel region to form a second color organic light emitting layer; forming a third color organic light emitting material layer on the substrate; and patterning the third color organic luminescent material layer by utilizing a photoetching process, and reserving the part of the third color organic luminescent material layer, which is positioned in the third sub-pixel area, so as to form the third color organic luminescent layer.

Description

Display panel manufacturing method and display panel
Technical Field
The present application relates to the field of display technologies, and in particular, to a method for manufacturing a display panel and a display panel.
Background
In recent years, OLEDs (Organic Light-Emitting diodes) have been attracting attention in recent years due to their huge application market in the display field. Compared with other display technologies, the OLED display panel has more advantages, such as wide viewing angle, high response speed, no need of backlight illumination, and flexible display.
The related art OLED display panel is limited by the fabrication process, and PPI (pixel density) thereof is difficult to further increase.
Disclosure of Invention
Accordingly, there is a need for a method for manufacturing a display panel and a display panel, which aim to increase the pixel density of the display panel.
According to an aspect of the present application, there is provided a manufacturing method of a display panel, the manufacturing method including:
providing a substrate, wherein the substrate is provided with a first sub-pixel area, a second sub-pixel area and a third sub-pixel area;
forming a first color organic light emitting material layer on the substrate;
patterning the first color organic light emitting material layer by using a photolithography process, and reserving a portion of the first color organic light emitting material layer located in the first sub-pixel region to form a first color organic light emitting layer;
forming a second color organic light emitting material layer on the substrate;
patterning the second color organic light emitting material layer by using a photolithography process, and reserving a portion of the second color organic light emitting material layer located in the second sub-pixel region to form a second color organic light emitting layer;
forming a third color organic light emitting material layer on the substrate;
and patterning the third color organic luminescent material layer by utilizing a photoetching process, and reserving the part of the third color organic luminescent material layer, which is positioned in the third sub-pixel area, so as to form the third color organic luminescent layer.
According to the manufacturing method of the display panel, the first color organic light emitting layer, the second color organic light emitting layer and the third color organic light emitting layer are correspondingly manufactured in the first sub-pixel area, the second sub-pixel area and the third sub-pixel area through multiple times of photoetching processes. Thereby, the use of FMM is replaced. Since the manufacturing accuracy of the photolithography process is significantly higher than that of vapor deposition using the FMM and there is no shadow effect, the pixel density of the display panel can be improved. In addition, the FMM is omitted in the manufacturing process, so that the manufacturing cost is saved.
In some embodiments, the providing a substrate comprises:
forming a driving circuit layer on a substrate;
a plurality of first electrodes are formed on the driving circuit layer.
In some embodiments, the providing a substrate further comprises:
and forming a pixel definition layer on one side of the first electrode away from the substrate, wherein the pixel definition layer defines the first sub-pixel area, the second sub-pixel area and the third sub-pixel area.
In some embodiments, before the step of forming the first color organic light emitting material layer on the substrate, the fabrication method further includes:
and forming a plurality of hole injection layers and a plurality of hole transport layers on the substrate, wherein the hole injection layers and the hole transport layers are distributed in the first sub-pixel area, the second sub-pixel area and the third sub-pixel area, and the hole transport layers are positioned on one side of the hole injection layers away from the substrate.
In some embodiments, after the step of forming the third color organic light emitting layer, the fabrication method further includes:
forming a plurality of electron transport layers and a plurality of electron injection layers, wherein the electron transport layers and the electron injection layers are distributed in the first sub-pixel area, the second sub-pixel area and the third sub-pixel area, the electron transport layers are positioned on one side of the first color organic light emitting layer far away from the substrate, one side of the second color organic light emitting layer far away from the substrate or one side of the third color organic light emitting layer far away from the substrate, and the electron injection layers are positioned on one side of the electron transport layers far away from the substrate.
In some embodiments, after the step of forming the plurality of electron transport layers and the plurality of electron injection layers, the fabrication method further comprises:
a second electrode is formed on a side of the electron injection layer remote from the substrate.
In some embodiments, after the step of forming the second electrode on a side of the electron injection layer remote from the substrate, the fabrication method further includes:
and forming an encapsulation layer covering the substrate and the second electrode.
In some embodiments, the step of forming a first color organic light emitting material layer on the substrate includes:
and evaporating and forming a first color organic luminescent material layer on the substrate.
In some embodiments, the step of forming a second color organic light emitting material layer on the substrate includes:
and evaporating and forming a second color organic luminescent material layer on the substrate.
In some embodiments, the step of forming a third color organic light emitting material layer on the substrate includes:
and evaporating and forming a third color organic luminescent material layer on the substrate.
According to still another aspect of the present application, there is provided a display panel manufactured by the manufacturing method of the display panel in any of the above embodiments.
Drawings
FIG. 1 is a flow chart of a method for fabricating a display panel according to an embodiment of the application;
fig. 2 to fig. 9 are schematic views illustrating structural changes of a display panel during implementation of a method for manufacturing a display panel according to an embodiment of the application.
Reference numerals:
100. a substrate;
110. a substrate; 120. a driving circuit layer; 130. a first electrode; 140. a pixel definition layer;
200. a first color organic light emitting material layer;
210. a first color organic light emitting layer;
300. a second color organic light emitting material layer;
310. a second color organic light emitting layer;
400. a third color organic light emitting material layer;
410. a third color organic light emitting layer;
510. a hole injection layer; 520. a hole transport layer; 530. an electron transport layer; 540. an electron injection layer;
600. a second electrode;
700. and an encapsulation layer.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In describing positional relationships, when an element such as a layer, film or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present unless otherwise indicated. Further, when a layer is referred to as being "under" another layer, it can be directly under, or one or more intervening elements may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening elements may also be present.
Where the terms "comprising," "having," and "including" are used herein, another component may also be added unless explicitly defined as such, e.g., "consisting of … …," etc. Unless mentioned to the contrary, singular terms may include plural and are not to be construed as being one in number.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.
It will be further understood that when interpreting an element, although not explicitly described, the element is intended to include the range of errors which should be within the acceptable limits of deviation from the particular values identified by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, and is not limited herein.
Further, in the specification, the phrase "planar distribution diagram" refers to the drawing when the target portion is viewed from above, and the phrase "cross-sectional diagram" refers to the drawing when the cross section taken by vertically cutting the target portion is viewed from the side.
Further, the drawings are not 1:1, and the relative dimensions of the various elements are drawn by way of example only in the drawings and are not necessarily drawn to true scale.
In recent years, OLEDs (Organic Light-Emitting diodes) have been attracting attention in recent years due to their huge application market in the display field. Compared with other display technologies, the OLED display panel has more advantages, such as wide viewing angle, high response speed, no need of backlight illumination, and flexible display.
In the related art, the sub-pixels of the OLED display panel are manufactured by an FMM (fine metal mask), and the PPI of the display panel is difficult to further improve due to the accuracy limitation of the FMM. In addition, in the process of performing vapor deposition by using the FMM to fabricate the sub-pixel light emitting layer, the shadow effect (shadow effect) is inevitably affected, and the existence of the shadow effect is one of factors limiting the further improvement of the PPI.
In view of the foregoing, an embodiment of a first aspect of the present application provides a method for manufacturing a display panel. As shown in fig. 1, the manufacturing method includes:
s100: a substrate 100 is provided, where the substrate 100 has a first sub-pixel region, a second sub-pixel region, and a third sub-pixel region.
Specifically, the display panel has a display area and a non-display area disposed to surround the display area. The first sub-pixel region, the second sub-pixel region and the third sub-pixel region on the substrate 100 are all in the display area of the display panel. In addition, the substrate 100 may be flexible or rigid. In the case where the substrate 100 is flexible, the display panel is a flexible display panel, and in the case where the substrate 100 is rigid, the display panel is a rigid display panel.
S200: as shown in fig. 2, a first color organic light emitting material layer 200 is formed on a substrate 100.
Specifically, the first color may be one of red, green, and blue. The formed first color organic light emitting material layer 200 has an effect of forming an entire surface coverage of the substrate 100 on one side of the substrate 100.
S300: as shown in fig. 3, the first color organic light emitting material layer 200 is patterned using a photolithography process, and a portion of the first color organic light emitting material layer 200 located in the first sub-pixel region is remained to form a first color organic light emitting layer 210.
Specifically, the implementation of the photolithography process may be: coating a photoresist layer on the first color organic light emitting material layer 200; exposing the photoresist layer through the mask plate, and developing the photoresist layer by using a developing solution; the first color organic light emitting material layer 200 is etched to remove a portion of the first color organic light emitting material layer 200 located outside the first sub-pixel region, and only a portion of the first color organic light emitting material layer 200 located in the first sub-pixel region remains, thereby forming a first color organic light emitting layer 210.
S400: as shown in fig. 4, a second color organic light emitting material layer 300 is formed on the substrate 100.
Specifically, the second color is one of red, green, and blue, and the second color is a different color from the first color. The second color organic light emitting material layer 300 formed has an effect of covering the entire surface of the substrate 100 on one side of the substrate 100, and of course, also covers the first color organic light emitting layer 210.
S500: as shown in fig. 5, the second color organic light emitting material layer 300 is patterned using a photolithography process, and a portion of the second color organic light emitting material layer 300 located in the second sub-pixel region is remained to form a second color organic light emitting layer 310.
Specifically, the implementation of the photolithography process may be: coating a photoresist layer on the second color organic light emitting material layer 300; exposing the photoresist layer through the mask plate, and developing the photoresist layer by using a developing solution; the second color organic light emitting material layer 300 is etched to remove a portion of the second color organic light emitting material layer 300 located outside the second sub-pixel region, and only a portion of the second color organic light emitting material layer 300 located in the second sub-pixel region remains, thereby forming a second color organic light emitting layer 310.
S600: as shown in fig. 6, a third color organic light emitting material layer 400 is formed on the substrate 100.
Specifically, the third color is one of red, green, and blue, and the third color is a color different from both the first color and the second color. The third color organic light emitting material layer 400 formed has an effect of covering the entire surface of the substrate 100 on one side of the substrate 100, and of course, covers both the first color organic light emitting layer 210 and the second color organic light emitting layer 310.
S700: as shown in fig. 7, the third color organic light emitting material layer 400 is patterned using a photolithography process, and a portion of the third color organic light emitting material layer 400 located in the third sub-pixel region is remained to form a third color organic light emitting layer 410.
Specifically, the implementation of the photolithography process may be: coating a photoresist layer on the third color organic light emitting material layer 400; exposing the photoresist layer through the mask plate, and developing the photoresist layer by using a developing solution; the third color organic light emitting material layer 400 is etched to remove a portion of the third color organic light emitting material layer 400 located outside the third sub-pixel region, and only a portion of the third color organic light emitting material layer 400 located in the third sub-pixel region remains, thereby forming a third color organic light emitting layer 410.
In the method for manufacturing a display panel according to the embodiment of the application, the first color organic light emitting layer 210, the second color organic light emitting layer 310 and the third color organic light emitting layer 410 are correspondingly manufactured in the first sub-pixel region, the second sub-pixel region and the third sub-pixel region by implementing photolithography processes for a plurality of times. Thereby, the use of FMM is replaced. Since the manufacturing accuracy of the photolithography process is significantly higher than that of vapor deposition using the FMM and there is no shadow effect, the pixel density of the display panel can be improved. In addition, the FMM is omitted in the manufacturing process, so that the manufacturing cost is saved.
In some embodiments, providing a substrate 100 includes:
forming a driving circuit layer 120 on the substrate 110;
a plurality of first electrodes 130 are formed on the driving circuit layer 120.
Specifically, the substrate 110 may be a flexible substrate 110, such as a polyimide substrate 110, or may be a rigid substrate 110, such as a quartz substrate 110 or a glass substrate 110. It is understood that when the substrate 110 is a flexible substrate 110, the substrate 100 is flexible, and when the substrate 110 is a rigid substrate 110, the substrate 100 is rigid.
In addition, the first electrode 130 is an anode of the OLED light emitting device, and one first electrode 130 is provided for each subpixel of the display panel. The material of the first electrode 130 may be a transparent or semitransparent material with a high work function such as Indium Tin Oxide (ITO), silver (Ag), nickel oxide (NiO), aluminum (Al), graphene, or the like.
In addition, the driving circuit layer 120 may include thin film transistors arranged in an array for controlling the OLED light emitting device to emit light or not. The thin film transistor includes an active layer, a gate electrode, a source electrode, and a drain electrode, and the first electrode 130 is connected to the source electrode or the drain electrode. The first electrodes 130 may be disposed in one-to-one correspondence with the thin film transistors. The thin film transistor may be a top gate type or a bottom gate type, which is not limited in the present application.
In some embodiments, providing a substrate 100 further comprises:
a pixel defining layer 140 is formed on a side of the first electrode 130 remote from the substrate 110, and the pixel defining layer 140 defines a first sub-pixel region, a second sub-pixel region, and a third sub-pixel region.
The material of the pixel defining layer 140 may be silicon oxide (SiO), silicon nitride (SiN), ceramic powder, metal oxide, or the like. It is understood that the pixel defining layer 140 is provided with pixel openings, and the pixel openings define sub-pixel regions.
In some embodiments, before the step of forming the first color organic light emitting material layer 200 on the substrate 100, the fabrication method further includes:
a plurality of hole injection layers 510 and a plurality of hole transport layers 520 are formed on the substrate 100, the plurality of hole injection layers 510 and the plurality of hole transport layers 520 are distributed in the first sub-pixel region, the second sub-pixel region and the third sub-pixel region, and the hole transport layers 520 are located at a side of the hole injection layers 510 away from the substrate 100.
Before the first color organic light emitting material layer 200 is fabricated, a hole injection layer 510 and a hole transport layer 520 are formed in the first, second, and third sub-pixel regions on the substrate 100. Thus, the first, second and third color organic light emitting layers 210, 310 and 410 are formed with the hole injection layer 510 and the hole transport layer 520 between the first electrode 130, and thus, hole injection and transport capabilities may be improved, thereby advantageously improving the light emitting efficiency of the OLED light emitting device.
In some embodiments, as shown in fig. 8, after the step of forming the third color organic light emitting layer 410, the manufacturing method further includes:
the plurality of electron transport layers 530 and the plurality of electron injection layers 540 are formed, the plurality of electron transport layers 530 and the plurality of electron injection layers 540 are distributed in the first sub-pixel region, the second sub-pixel region and the third sub-pixel region, the electron transport layers 530 are located at a side of the first color organic light emitting layer 210 away from the substrate 100 or a side of the second color organic light emitting layer 310 away from the substrate 100 or a side of the third color organic light emitting layer 410 away from the substrate 100, and the electron injection layers 540 are located at a side of the electron transport layers 530 away from the substrate 100.
After the first color organic light emitting layer 210, the second color organic light emitting layer 310, and the third color organic light emitting layer 410 are fabricated, the electron transport layer 530 and the electron injection layer 540 are fabricated. Thus, the electron transport layer 530 and the electron injection layer 540 are provided between the first, second and third color organic light emitting layers 210, 310 and 410 and the cathode of the OLED light emitting device, and thus, electron injection and transport capability may be improved, thereby contributing to an improvement in light emitting efficiency of the OLED light emitting device.
In some embodiments, as shown in fig. 9, after the step of forming the plurality of electron transport layers 530 and the plurality of electron injection layers 540, the fabrication method further includes:
the second electrode 600 is formed on a side of the electron injection layer 540 remote from the substrate 100.
It is understood that the second electrode 600 is a cathode of the OLED light emitting device. Specifically, the material of the second electrode 600 may be a transparent metal oxide, such as ITO (indium tin oxide), IZO (indium zinc oxide), ITZO (indium tin zinc oxide), IGZO (indium gallium zinc oxide), or the like.
In some embodiments, as shown in fig. 9, after the step of forming the second electrode 600 on the side of the electron injection layer 540 away from the substrate 100, the fabrication method further includes:
an encapsulation layer 700 is formed to cover the substrate 100 and the second electrode 600.
It will be appreciated that the encapsulation layer 700 is used for packaging the OLED light-emitting device, and has the function of blocking water vapor and oxygen for the OLED light-emitting device. Specifically, the encapsulation layer 700 may include a first encapsulation film layer, a second encapsulation film layer, and a third encapsulation film layer that are stacked. In a specific example, the materials of the first and third encapsulation films may be inorganic materials, such as silicon nitride (SiN), silicon oxide (SiO), silicon oxynitride (SiO) x N y ) Etc. The material of the second encapsulation film layer may be an organic material, such as Polyimide (PI), epoxy, and the like. The second packaging film layer is used for providing flexibility, and the first packaging film layer and the third packaging film layer play a role in isolating water vapor and oxygen.
In some embodiments, the step of forming the first color organic light emitting material layer 200 on the substrate 100 includes:
the first color organic light emitting material layer 200 is formed on the substrate 100 by evaporation.
That is, the first color organic light emitting material layer 200 covering the entire substrate 100 is formed on one side of the substrate 100 by means of evaporation. The first color organic light emitting material layer 200 is patterned by a photolithography process, and a portion of the first color organic light emitting material layer 200 located in the first sub-pixel region is remained to form a first color organic light emitting layer 210 in the first sub-pixel region.
In some embodiments, the step of forming the second color organic light emitting material layer 300 on the substrate 100 includes:
the second color organic light emitting material layer 300 is formed on the substrate 100 by evaporation.
That is, the second color organic light emitting material layer 300 covering the entire substrate 100 and the first color organic light emitting layer 210 is formed on one side of the substrate 100 by means of evaporation. The second color organic light emitting material layer 300 is patterned by a photolithography process, and a portion of the second color organic light emitting material layer 300 located in the second sub-pixel region is remained to form a second color organic light emitting layer 310 in the second sub-pixel region.
In some embodiments, the step of forming the third color organic light emitting material layer 400 on the substrate 100 includes:
a third color organic light emitting material layer 400 is vapor deposited on the substrate 100.
That is, the third color organic light emitting material layer 400 covering the entire substrate 100 and the first and second color organic light emitting layers 210 and 310 is formed on one side of the substrate 100 by vapor deposition. The third color organic light emitting material layer 400 is patterned by a photolithography process, and a portion of the third color organic light emitting material layer 400 located in the third sub-pixel region is remained to form a third color organic light emitting layer 410 in the third sub-pixel region.
An embodiment of a first aspect of the present application provides a display panel manufactured by the method for manufacturing a display panel in any one of the above embodiments. The display panel in the embodiment of the application has the beneficial effects of the manufacturing method of the display panel in any embodiment.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (10)

1. A method for manufacturing a display panel, comprising:
providing a substrate, wherein the substrate is provided with a first sub-pixel area, a second sub-pixel area and a third sub-pixel area;
forming a first color organic light emitting material layer on the substrate;
patterning the first color organic light emitting material layer by using a photolithography process, and reserving a portion of the first color organic light emitting material layer located in the first sub-pixel region to form a first color organic light emitting layer;
forming a second color organic light emitting material layer on the substrate;
patterning the second color organic light emitting material layer by using a photolithography process, and reserving a portion of the second color organic light emitting material layer located in the second sub-pixel region to form a second color organic light emitting layer;
forming a third color organic light emitting material layer on the substrate;
and patterning the third color organic luminescent material layer by utilizing a photoetching process, and reserving the part of the third color organic luminescent material layer, which is positioned in the third sub-pixel area, so as to form the third color organic luminescent layer.
2. The method of claim 1, wherein providing a substrate comprises:
forming a driving circuit layer on a substrate;
a plurality of first electrodes are formed on the driving circuit layer.
3. The method of claim 2, wherein providing a substrate further comprises:
and forming a pixel definition layer on one side of the first electrode away from the substrate, wherein the pixel definition layer defines the first sub-pixel area, the second sub-pixel area and the third sub-pixel area.
4. The method of manufacturing a display panel according to claim 1, wherein before the step of forming the first color organic light emitting material layer on the substrate, the method further comprises:
and forming a plurality of hole injection layers and a plurality of hole transport layers on the substrate, wherein the hole injection layers and the hole transport layers are distributed in the first sub-pixel area, the second sub-pixel area and the third sub-pixel area, and the hole transport layers are positioned on one side of the hole injection layers away from the substrate.
5. The method of fabricating a display panel according to claim 4, wherein after the step of forming the third color organic light emitting layer, the method further comprises:
forming a plurality of electron transport layers and a plurality of electron injection layers, wherein the electron transport layers and the electron injection layers are distributed in the first sub-pixel area, the second sub-pixel area and the third sub-pixel area, the electron transport layers are positioned on one side of the first color organic light emitting layer far away from the substrate, one side of the second color organic light emitting layer far away from the substrate or one side of the third color organic light emitting layer far away from the substrate, and the electron injection layers are positioned on one side of the electron transport layers far away from the substrate.
6. The method of manufacturing a display panel according to claim 5, wherein after the step of forming the plurality of electron transport layers and the plurality of electron injection layers, the method further comprises:
forming a second electrode on a side of the electron injection layer away from the substrate;
preferably, after the step of forming the second electrode on the side of the electron injection layer away from the substrate, the fabrication method further includes:
and forming an encapsulation layer covering the substrate and the second electrode.
7. The method of manufacturing a display panel according to any one of claims 1 to 6, wherein the step of forming the first color organic light emitting material layer on the substrate includes:
and evaporating and forming a first color organic luminescent material layer on the substrate.
8. The method of manufacturing a display panel according to any one of claims 1 to 6, wherein the step of forming the second color organic light emitting material layer on the substrate includes:
and evaporating and forming a second color organic luminescent material layer on the substrate.
9. The method of manufacturing a display panel according to any one of claims 1 to 6, wherein the step of forming a third color organic light emitting material layer on the substrate comprises:
and evaporating and forming a third color organic luminescent material layer on the substrate.
10. A display panel produced by the method of producing a display panel according to any one of claims 1 to 9.
CN202310577624.9A 2023-05-18 2023-05-18 Display panel manufacturing method and display panel Pending CN116634831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310577624.9A CN116634831A (en) 2023-05-18 2023-05-18 Display panel manufacturing method and display panel

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Application Number Priority Date Filing Date Title
CN202310577624.9A CN116634831A (en) 2023-05-18 2023-05-18 Display panel manufacturing method and display panel

Publications (1)

Publication Number Publication Date
CN116634831A true CN116634831A (en) 2023-08-22

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