CN116629302A - Three-dimensional integrated nameplate electronic tag and manufacturing method thereof - Google Patents
Three-dimensional integrated nameplate electronic tag and manufacturing method thereof Download PDFInfo
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- CN116629302A CN116629302A CN202310516568.8A CN202310516568A CN116629302A CN 116629302 A CN116629302 A CN 116629302A CN 202310516568 A CN202310516568 A CN 202310516568A CN 116629302 A CN116629302 A CN 116629302A
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The application discloses a three-dimensional integrated nameplate electronic tag and a manufacturing method thereof, wherein the electronic tag sequentially comprises a surface layer metal plate, a tag Inlay, a plastic middle plate and a bottom layer metal plate from top to bottom; the surface of the surface layer metal plate is engraved with nameplate information of the equipment by laser; a label gap is formed in the surface layer metal plate, and a label Inlay on the top of the plastic middle plate is combined with the label gap through an in-mold injection molding process; the bottom metal plate is welded on the plastic column on the bottom surface of the plastic middle plate through an ultrasonic welding process. In addition, the manufacturing method comprises the steps of label Inlay manufacturing, metal sheet metal part stamping, in-mold injection molding, ultrasonic welding, radio frequency performance detection, laser engraving and ID writing. The traditional equipment metal nameplate is combined with the electronic tag, so that the electronic tag has an anti-metal function, and can be rapidly used for identifying and checking the equipment nameplate tag by matching with the RFID reader-writer, so that the digital management of the whole life cycle of the equipment is realized.
Description
Technical Field
The application relates to the technical field of electronic labels, in particular to a three-dimensional integrated nameplate electronic label and a manufacturing method thereof.
Background
Radio Frequency Identification (RFID) is a radio frequency identification technology (RadioFrequencyIdentification, RFID), is one of automatic identification technologies, performs non-contact two-way data communication in a radio frequency mode, and reads and writes a recording medium (an electronic tag or a radio frequency card) in a radio frequency mode so as to achieve the purposes of identification targets and data exchange, and is considered as one of information technologies with the most development potential in the 21 st century.
The radio frequency identification technology realizes non-contact two-way communication by combining radio wave with a rapid information exchange and storage technology and combining radio communication with a data access technology and then connecting a database system, thereby achieving the purpose of identification, being used for data exchange and being connected in series to form a very complex system. In the identification system, reading, writing and communication of the electronic tag are realized through electromagnetic waves. The electronic tag is used as a data carrier which is commonly used in the communication technology, and wireless encryption reading transmission of data is realized by carrying out contactless radio frequency coupling with specific reading equipment. In particular, the electronic tag has obvious technical advantages in certain occasions with higher requirements on data transmission safety and confidentiality.
However, in the existing RFID application scenario for some metal surface articles such as precise instruments and equipment, the metal affects the resonant frequency and radiation direction of the tag, and the common tag cannot work due to metal interference.
Disclosure of Invention
Based on the above, the embodiment of the application provides a three-dimensional integrated nameplate electronic tag and a manufacturing method thereof, which can combine a traditional equipment metal nameplate with the electronic tag, have an anti-metal function, and can quickly identify and inventory the equipment nameplate tag by matching with an RFID reader-writer so as to realize the digital management of the whole life cycle of equipment.
In a first aspect, a three-dimensional integrative nameplate electronic tag is provided, this electronic tag includes surface layer metal sheet from top to bottom in proper order, label Inlay, plastic medium plate, bottom metal sheet:
the surface of the surface layer metal plate is engraved with nameplate information of equipment by laser; the nameplate information also comprises two-dimensional code information;
the surface layer metal plate is provided with a label gap, and a label Inlay on the top of the plastic middle plate is combined with the label gap through an in-mold injection molding process; the tag chip stores the ID code and the device information;
the bottom metal plate is welded on the plastic column on the bottom surface of the plastic middle plate through an ultrasonic welding process.
Optionally, the label Inlay substrate is made of a PFC flexible board, the substrate is a PI polyimide copper-plated flexible board with the thickness of 0.25mm, and a PI polyimide board with the thickness of 0.5mm is selected as a local reinforcing sheet.
Optionally, the label Inlay on top of the plastic middle plate is combined with the label gap through an in-mold injection molding process, including:
and implanting the label Inlay and the surface layer metal plate into an injection mold, and combining the plastic middle plate with the label Inlay and the surface layer metal plate into a whole after injection molding by using PC polycarbonate plastic.
Optionally, the plastic column on the plastic middle plate passes through the fixing hole of the bottom metal plate, and the top of the plastic column is melted into a mushroom head structure by using an ultrasonic welding machine so as to fix the bottom metal plate.
In a second aspect, a method for manufacturing a three-dimensional integrated nameplate electronic tag is provided, and the method is used for manufacturing the electronic tag in the first aspect, and includes:
label Inlay manufacturing, stamping of metal sheet metal parts, in-mold injection molding, ultrasonic welding, radio frequency performance detection, laser engraving and ID writing.
Optionally, the label Inlay manufacturing specifically includes:
electronic material incoming inspection, solder paste printing steel mesh manufacturing, solder paste printing, SPI solder paste inspection, SMT component mounting, reflow soldering, AOI optical detection, PI local reinforcement, split plate cutting and TS frequency point detection.
Optionally, the stamping of the metal sheet part specifically includes:
coiled material feeding, sheet metal stamping and full-inspection appearance, wherein sheet metal parts can be made of aluminum alloy sheets, copper alloy sheets and stainless steel sheets.
Optionally, the in-mold injection specifically includes:
and implanting the label Inlay and the surface layer metal plate into an injection mold, and combining the plastic middle plate with the label Inlay and the surface layer metal plate into a whole after injection molding by using PC polycarbonate plastic.
Optionally, the ultrasonic welding specifically includes:
the plastic column on the plastic middle plate passes through the fixing hole of the bottom metal plate, and the top of the plastic column is melted into a mushroom head structure by using an ultrasonic welding machine so as to fix the bottom metal plate.
Optionally, the radio frequency performance detection includes TF detection to scan a center frequency point using a tagport radio frequency tester to ensure compliance with a design, and TS detection to detect product radio frequency consistency using a tagport tester;
the laser engraving specifically comprises the steps of engraving the equipment nameplate information on the surface layer metal plate by using a laser engraving machine;
the ID writing specifically comprises the step of writing the equipment ID code into a product chip for storage by using an RFID radio frequency card sender.
According to the technical scheme provided by the embodiment of the application, the electronic tag sequentially comprises a surface layer metal plate, a tag Inlay, a plastic middle plate and a bottom layer metal plate from top to bottom; the surface of the surface layer metal plate is engraved with nameplate information of the equipment by laser; a label gap is formed in the surface layer metal plate, and a label Inlay on the top of the plastic middle plate is combined with the label gap through an in-mold injection molding process; the bottom metal plate is welded on the plastic column on the bottom surface of the plastic middle plate through an ultrasonic welding process. In addition, the manufacturing method comprises the steps of label Inlay manufacturing, metal sheet metal part stamping, in-mold injection molding, ultrasonic welding, radio frequency performance detection, laser engraving and ID writing.
The technical scheme provided by the embodiment of the application has the beneficial effects that at least:
(1) The metal nameplate of the three-dimensional integrated nameplate electronic tag and the surface layer metal plate structure form a coupling feed antenna with the tag Inlay, the tag Inlay mainly plays a role in impedance matching, and the surface layer metal plate is used as a radiation unit and radiates signals outwards. Meanwhile, the surface of the surface layer metal plate can be engraved by laser or can be printed with equipment nameplate information.
(2) The bottom metal plate of the three-dimensional integrated nameplate electronic tag can be used as a reflector, the rear lobe radiation energy of the antenna is reflected and overlapped to the front, the forward radiation gain of the antenna is increased, the anti-metal property is realized, and the electronic tag is suitable for surface mounting of metal equipment.
(3) The tag chip storage area can store equipment ID codes and equipment information, and can be matched with an RFID reader-writer to rapidly identify and check equipment nameplate tags, so that the digital management of the whole life cycle of equipment is realized.
(4) All production flows of the manufacturing method of the three-dimensional integrated nameplate electronic tag are determined, and batch production can be realized according to the production flows.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those skilled in the art from this disclosure that the drawings described below are merely exemplary and that other embodiments may be derived from the drawings provided without undue effort.
Fig. 1 is an exploded view of the whole structure of a three-dimensional integrated nameplate electronic tag according to an embodiment of the present application;
fig. 2 is a schematic diagram of a three-dimensional integrated nameplate electronic tag according to an embodiment of the present application;
FIG. 3 is a three-dimensional integrated nameplate information layout diagram provided by an embodiment of the present application;
fig. 4 is a flowchart of manufacturing a three-dimensional integrated nameplate electronic tag according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the description of the present application, the terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements but may include other steps or elements not expressly listed but inherent to such process, method, article, or apparatus or steps or elements added based on further optimization of the inventive concept.
The application relates to a three-dimensional integrated nameplate electronic tag, a manufacturing method and application thereof. The electronic tag has the functions of a metal nameplate, a two-dimensional code and an RFID electronic tag, and the three functions are organically combined to realize three-dimensional integration. Meanwhile, the patent discloses a manufacturing process of the laser engraving device, which comprises the production process flows of label Inlay manufacturing, metal sheet metal part stamping, integral injection Molding insert_molding, ultrasonic welding, radio frequency performance detection, laser engraving and the like. The technological process can be applied to mass production and manufacture, the manufactured three-dimensional integrated nameplate electronic tag is suitable for complex environments, can be applied to various metal and nonmetal equipment, has equipment information of a traditional nameplate on the surface, and can be used for asset inventory, trace and the like of the equipment by utilizing the RFID tag function, so that the digital management of the whole life cycle of the equipment is realized.
In the present application, inlay is a term specific to the smart card industry and refers to a pre-laminated product comprising a multi-layer PVC sheet laminated together with chips and coils. Typically consisting of two or three layers. The surface of the product has no printing pattern, and the Inlay product is suitable for the early mass production of various cards. The materials with different printing patterns on the upper and lower surfaces of the Inlay are laminated again to form the colorful non-contact card.
Insert Molding refers specifically to in-mold injection Molding, and specifically to a process of placing articles or the like to be injection molded into a mold for injection Molding.
Specifically, please refer to fig. 1, which illustrates a three-dimensional integrated nameplate electronic tag provided by the embodiment of the application, wherein the whole product is composed of a surface layer metal plate, a tag Inlay, a plastic middle plate and a bottom layer metal plate. The structure of the device specifically comprises:
the electronic tag is provided with a surface layer metal plate, a tag Inlay, a plastic middle plate and a bottom layer metal plate from top to bottom in sequence: the surface of the surface layer metal plate is engraved with nameplate information of the equipment by laser; the nameplate information also comprises two-dimensional code information; a label gap is formed in the surface layer metal plate, and a label Inlay on the top of the plastic middle plate is combined with the label gap through an in-mold injection molding process; and the label Inlay, the surface metal plate and the plastic middle plate are integrally molded by using an Insert-Molding injection Molding process, so that the structural strength is higher, and all the components are combined more tightly.
As in fig. 2, a schematic diagram of an electronic tag is given. The tag chip stores the ID code and the device information; the bottom metal plate is welded on the plastic column on the bottom surface of the plastic middle plate through an ultrasonic welding process.
In the embodiment of the application, the label Inlay substrate is made of a PFC flexible board, the substrate is a PI polyimide copper-plated flexible board with the thickness of 0.25mm, and a PI polyimide board with the thickness of 0.5mm is selected as a local reinforcing sheet. The step of combining the label Inlay at the top of the plastic middle plate with the label gap through an in-mold injection molding process comprises the step of implanting the label Inlay and the surface metal plate into an injection mold, wherein PC polycarbonate plastic is used, and the plastic middle plate, the label Inlay and the surface metal plate are combined into a whole after injection molding.
Specifically, the label Inlay is integrally made of FPCA made of PI polyimide, the thickness is 0.25mm, and a local reinforcing sheet with the thickness of 0.5mm is attached to the surface of the label Inlay. The label Inlay is positioned between the plastic middle plate and the surface metal plate, and the label Inlay, the surface metal plate and the plastic middle plate are combined through an Insert-Molding injection Molding process. The label Inlay mainly plays a role in impedance matching, and the surface layer metal plate serves as a radiation unit and radiates signals outwards. In the embodiment of the application, the PI polyimide plate is used for local reinforcement, so that the holes of the surface layer metal plate radiating units can be filled, meanwhile, the PI polyimide plate is used for combined positioning, and the surface of the reinforcing plate can be printed with two-dimensional code information coded by equipment.
The surface layer metal plate is positioned at the topmost layer, and the surface can be used for carrying out laser engraving equipment nameplate information. As shown in fig. 3, a nameplate information layout of the present application is presented.
The bottom metal plate is positioned at the lowest layer below the plastic middle plate and welded on the plastic column at the back of the plastic middle plate through an ultrasonic welding process.
The bottom metal plate is used as a reflector, the back lobe radiation energy of the antenna is reflected and overlapped to the front surface, the forward radiation gain of the antenna is increased, the anti-metal property is realized, and the antenna is suitable for surface mounting of metal equipment. The surface layer metal plate is used as a coupling antenna radiator, has the function of a traditional nameplate, and can be used for engraving and printing nameplate information of equipment.
In the embodiment of the application, the storage area of the electronic tag chip can store ID codes of equipment and assets, and the read-write equipment can realize quick and non-contact reading and storage by utilizing electromagnetic waves, so that the asset management cost is reduced, and the digital management is realized. The three-dimensional integrated nameplate electronic tag is of an anti-metal design, the bottom metal plate is used as a reflector, the rear lobe radiation energy of the antenna is reflected and overlapped to the front, and the forward radiation gain of the antenna is increased, so that the tag can be applied to the surfaces of various metal and nonmetal assets.
The manufacturing method of the three-dimensional integrated nameplate electronic tag is created, and batch production can be realized.
As shown in fig. 4, the manufacturing method of the three-dimensional integrated nameplate electronic tag provided by the application further comprises three-dimensional integrated nameplate electronic tags and mass production manufacturing processes, and mainly comprises the production process flows of tag Inlay manufacturing, metal sheet metal part stamping, injection Molding insert_molding, ultrasonic welding, radio frequency performance detection, laser engraving, ID writing and the like, and application of realizing digital management of the whole life cycle of equipment.
Specifically, the label Inlay manufacturing process comprises electronic material incoming inspection, solder paste printing steel mesh manufacturing, solder paste printing, SPI solder paste inspection, SMT component mounting, reflow soldering, AOI optical detection, PI local reinforcement, split plate cutting and TS frequency point detection, wherein a label Inlay substrate is made of a PFC flexible plate, a PI polyimide copper plating flexible plate with the thickness of 0.25mm is selected as a substrate, a PI polyimide plate is selected as PI local reinforcement, the thickness is about 0.5mm, or an applicable thickness is selected according to actual structural requirements.
The SPI solder paste inspection specifically detects solder paste printing quality through an SPI solder paste thickness gauge. AOI optical detection comprises detecting whether solder paste printing, mounting and reflow soldering are bad or not through an AOI automatic optical detector. PI local reinforcement is used for filling metal plate antenna holes and assembling and positioning.
The stamping process of the metal sheet metal part comprises coiled material feeding, sheet metal stamping and full-detection appearance, wherein the sheet metal part is made of aluminum alloy sheets, copper alloy sheets, stainless steel sheets and the like.
The injection Molding insert_molding process comprises the steps of implanting a label Inlay and a surface layer metal plate into an injection mold, using PC polycarbonate plastic, and combining the plastic middle plate with the label Inlay and the surface layer metal plate into a whole after injection Molding.
The ultrasonic welding process comprises the steps of enabling plastic columns on a plastic middle plate to penetrate through fixing holes of a bottom metal plate, using an ultrasonic welding machine to melt the tops of the plastic columns into a mushroom head structure so as to fix the bottom metal plate, and finally welding bottom metal plate metal pieces onto plastic middle plate pieces through ultrasonic welding.
The RF performance test process includes the TF test to scan the center frequency point with the Tagfromance RF tester to ensure the conformity with the design and the TS test to test the RF consistency of the product with the Tagsurance tester.
And in the laser engraving process, equipment nameplate information is engraved on the surface layer metal plate by using a laser engraving machine.
And in the ID writing process, for using the RFID radio frequency card sender, the device ID code is written into the product chip for storage.
The method can further comprise the step of performing appearance full inspection and packaging on the electronic tag after the ID writing process.
In conclusion, the three-dimensional integrated nameplate electronic tag disclosed by the application solves the following problems:
(1) The traditional equipment metal nameplate is combined with the electronic tag.
Generally, the surface of the electronic tag cannot be made of metal materials, and the radio frequency magnetic field of the electronic tag can be shielded. The metal nameplate of the three-dimensional integrated nameplate electronic tag and the surface layer metal plate structure form a coupling feed antenna with the tag Inlay, the tag Inlay mainly plays a role in impedance matching, and the surface layer metal plate is used as a radiation unit and radiates signals outwards. Meanwhile, the surface of the surface layer metal plate can be engraved by laser or can be printed with equipment nameplate information.
(2) The label has a metal resistance function.
Aiming at RFID application scenes of metal surface articles such as precise instruments and equipment, the resonance frequency and the radiation direction of the tag can be influenced by metal, and the common tag cannot work due to metal interference. The bottom metal plate of the three-dimensional integrated nameplate electronic tag can be used as a reflector, the rear lobe radiation energy of the antenna is reflected and overlapped to the front, the forward radiation gain of the antenna is increased, the anti-metal property is realized, and the electronic tag is suitable for surface mounting of metal equipment.
(3) And realizing the digital management of the whole life cycle of the equipment.
The tag chip storage area can store equipment ID codes and equipment information, and can be matched with an RFID reader-writer to rapidly identify and check equipment nameplate tags, so that the digital management of the whole life cycle of equipment is realized.
(4) Realize the mass production of three-dimensional integrative data plate electronic tags.
All production flows of the manufacturing method of the three-dimensional integrated nameplate electronic tag are determined, and batch production can be realized according to the production flows.
In conclusion, the manufacturing method and the application of the three-dimensional integrated nameplate electronic tag provided by the application can be used for mass production and manufacturing, and the manufactured three-dimensional integrated nameplate electronic tag can be suitable for complex environments. The nameplate function and the RFID tag function of the system can be applied to full life cycle management of various devices, such as various switch cabinets, ring main units, transformers, capacitors and the like in power equipment, and provide services such as asset inventory, tracing, cycle management and the like for the power industry.
The unique ID code given to the electric asset based on the three-dimensional integrated nameplate electronic tag is used for developing service application based on the real ID of the asset in professional management activities such as development, construction, materials, equipment, regulation and control, and the like, and establishing interconnection and intercommunication relation among equipment, personnel and the like around links such as planning, production, supply, installation, debugging, operation, maintenance and overhaul, so that the whole process data accumulation is completed, the field operation efficiency is greatly improved, the integrity and reliability of service data are ensured, and convenience, high efficiency and intellectualization of field operation are promoted.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. The utility model provides a three-dimensional integrative data plate electronic tags, its characterized in that, electronic tags is from top to bottom including surface layer metal sheet, label Inlay, plastic medium plate in proper order, bottom metal sheet:
the surface of the surface layer metal plate is engraved with nameplate information of equipment by laser; the nameplate information also comprises two-dimensional code information;
the surface layer metal plate is provided with a label gap, and a label Inlay on the top of the plastic middle plate is combined with the label gap through an in-mold injection molding process; the tag chip stores the ID code and the device information;
the bottom metal plate is welded on the plastic column on the bottom surface of the plastic middle plate through an ultrasonic welding process.
2. The three-dimensional integrated nameplate electronic tag of claim 1, wherein the tag Inlay base material is made of a PFC flexible plate, the base material is a PI polyimide copper-plated flexible plate with the thickness of 0.25mm, and a PI polyimide plate with the thickness of 0.5mm is used as a local reinforcing sheet.
3. The three-dimensional integrated nameplate electronic tag of claim 1, wherein the tag Inlay on top of the plastic middle plate is combined with the tag gap by an in-mold injection molding process, comprising:
and implanting the label Inlay and the surface layer metal plate into an injection mold, and combining the plastic middle plate with the label Inlay and the surface layer metal plate into a whole after injection molding by using PC polycarbonate plastic.
4. The three-dimensional integrated nameplate electronic tag of claim 1, wherein plastic posts on the plastic middle plate penetrate through fixing holes of the bottom metal plate, and an ultrasonic welding machine is used for melting tops of the plastic posts into a mushroom head structure so as to fix the bottom metal plate.
5. A method for manufacturing a three-dimensional integrated nameplate electronic tag, which is used for manufacturing the electronic tag according to any one of claims 1-4, and is characterized in that the manufacturing method comprises the following steps:
label Inlay manufacturing, stamping of metal sheet metal parts, in-mold injection molding, ultrasonic welding, radio frequency performance detection, laser engraving and ID writing.
6. The manufacturing method according to claim 5, wherein the label Inlay manufacturing specifically includes:
electronic material incoming inspection, solder paste printing steel mesh manufacturing, solder paste printing, SPI solder paste inspection, SMT component mounting, reflow soldering, AOI optical detection, PI local reinforcement, split plate cutting and TS frequency point detection.
7. The method of manufacturing according to claim 5, wherein the stamping of the sheet metal part specifically comprises:
coiled material feeding, sheet metal stamping and full-inspection appearance, wherein sheet metal parts can be made of aluminum alloy sheets, copper alloy sheets and stainless steel sheets.
8. The method of claim 5, wherein the in-mold injection molding specifically comprises:
and implanting the label Inlay and the surface layer metal plate into an injection mold, and combining the plastic middle plate with the label Inlay and the surface layer metal plate into a whole after injection molding by using PC polycarbonate plastic.
9. The method according to claim 5, wherein the ultrasonic welding specifically comprises:
the plastic column on the plastic middle plate passes through the fixing hole of the bottom metal plate, and the top of the plastic column is melted into a mushroom head structure by using an ultrasonic welding machine so as to fix the bottom metal plate.
10. The method of claim 5, wherein the rf performance test comprises TF test to scan a center frequency point using a tagport rf tester to ensure compliance with design, TS test to test product rf compliance using a tagport tester;
the laser engraving specifically comprises the steps of engraving the equipment nameplate information on the surface layer metal plate by using a laser engraving machine;
the ID writing specifically comprises the step of writing the equipment ID code into a product chip for storage by using an RFID radio frequency card sender.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310516568.8A CN116629302A (en) | 2023-05-09 | 2023-05-09 | Three-dimensional integrated nameplate electronic tag and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310516568.8A CN116629302A (en) | 2023-05-09 | 2023-05-09 | Three-dimensional integrated nameplate electronic tag and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116629302A true CN116629302A (en) | 2023-08-22 |
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| CN202310516568.8A Pending CN116629302A (en) | 2023-05-09 | 2023-05-09 | Three-dimensional integrated nameplate electronic tag and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN116629302A (en) |
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- 2023-05-09 CN CN202310516568.8A patent/CN116629302A/en active Pending
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