CN116626469A - Liquid cooling test system and liquid cooling test method - Google Patents
Liquid cooling test system and liquid cooling test method Download PDFInfo
- Publication number
- CN116626469A CN116626469A CN202310349118.4A CN202310349118A CN116626469A CN 116626469 A CN116626469 A CN 116626469A CN 202310349118 A CN202310349118 A CN 202310349118A CN 116626469 A CN116626469 A CN 116626469A
- Authority
- CN
- China
- Prior art keywords
- model
- temperature
- test
- parameters
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 134
- 239000007788 liquid Substances 0.000 title claims abstract description 89
- 238000001816 cooling Methods 0.000 title claims abstract description 66
- 238000010998 test method Methods 0.000 title claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 19
- 239000013598 vector Substances 0.000 claims description 24
- 238000004590 computer program Methods 0.000 claims description 17
- 239000000110 cooling liquid Substances 0.000 claims description 16
- 238000012795 verification Methods 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000010276 construction Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 10
- 230000006870 function Effects 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 238000005457 optimization Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 238000005485 electric heating Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Environmental & Geological Engineering (AREA)
- Data Mining & Analysis (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Databases & Information Systems (AREA)
- Software Systems (AREA)
- Computational Mathematics (AREA)
- Pure & Applied Mathematics (AREA)
- Mathematical Optimization (AREA)
- Algebra (AREA)
- Health & Medical Sciences (AREA)
- Mathematical Analysis (AREA)
- Toxicology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The application relates to the technical field of packaging test, in particular to a liquid cooling test system and a liquid cooling test method, wherein a test data set is obtained under the condition of fixed other conditions; constructing a micro-channel ceramic package heat dissipation model based on a plurality of test data sets; finding a plurality of expected parameters according to the micro-channel ceramic package heat dissipation model; and finally, verifying the accuracy of a plurality of expected parameters. And constructing a micro-channel ceramic packaging heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a test data set obtained by the test, searching model working condition optimization parameters based on the model, and verifying the accuracy of the optimization parameters based on experiments. Because the speed of searching parameters by the model is far higher than the process of experimental temperature balance, the speed of searching expected parameters is high, the consumed materials and manpower resources are less, and the efficiency is higher. After the parameters are found, the parameters are verified through testing, so that the accuracy and the reliability of the parameters are ensured.
Description
Technical Field
The application relates to the technical field of package testing, in particular to a liquid cooling test system and a liquid cooling test method.
Background
The heat flow density of the chip is from 10W/cm from 70 to 90 in the 20 th century 2 To 100W/cm 2 In order of magnitude, gaN (gallium nitride) chips currently under research have reached 500W/cm 2 . The continued increase in chip heat flux density presents new challenges for package heat dissipation techniques. The data show that the heat dissipation capacity of the traditional air cooling mode is less than 100W/cm 2 It follows that conventional air cooling approaches are difficult to meet the increasing heat dissipation requirements.
A new heat dissipation solution is to use a liquid cooling heat dissipation technology, for example, an embedded liquid cooling micro-channel ceramic package structure. The micro-channel ceramic packaging structure adopts liquid cooling heat dissipation from packaging to achieve the purpose of reducing the core temperature of the chip. The ceramic packaging structure body embedded with the liquid cooling micro-channel is a ceramic substrate, the micro-channel is embedded in the ceramic substrate, and the micro-channel is provided with a cooling liquid inlet and a cooling liquid outlet. In some implementations, the micro-fluidic channel includes a main liquid inlet channel, a main liquid outlet channel, a sub liquid inlet channel connected to the main liquid inlet channel, a sub liquid outlet channel connected to the main liquid outlet channel, and a plurality of micro-channels connected in parallel between the sub liquid inlet channel and the sub liquid outlet channel; the cooling liquid inlet is arranged in the liquid inlet main channel, the cooling liquid outlet is arranged in the liquid outlet main channel, and the channels are communicated mutually to form various different channel topological structures for cooling and radiating the chip core.
However, for the ceramic package embedded with the liquid cooling micro flow channel, no related equipment and method are required for testing the liquid cooling heat dissipation effect, and the purpose of reducing the core temperature of the chip can be achieved as the original design is achieved, and the necessary means for verification are lacking.
Based on this, a liquid cooling test method needs to be developed and designed.
Disclosure of Invention
The embodiment of the application provides a liquid cooling test system and a liquid cooling test method, which are used for solving the problem that the heat dissipation effect of a micro-channel ceramic package in the prior art is not easy to verify.
In a first aspect, an embodiment of the present application provides a liquid cooling test system, including:
the liquid supply system, the power supply system and the temperature detection system;
the liquid supply system is used for providing constant-temperature liquid, recovering the liquid, performing constant-temperature treatment on the recovered liquid and measuring the flow and the pressure of the liquid;
the power supply system comprises a controllable power supply and a heating plate electrically connected with the power supply;
the temperature detection system is used for detecting the temperature of the surface of the heating plate.
In one possible implementation, the liquid supply system includes:
the constant temperature water tank is used for keeping the temperature of the liquid in the constant temperature water tank by adjusting heat dissipation or heating power;
the inlet of the pump is communicated with the outlet of the constant-temperature water tank;
a flow meter that receives fluid from the pump outlet and measures a flow rate of the cooling target when connected to the cooling target;
a first pressure gauge that measures an inlet pressure of the cooling target when connected to the cooling target;
and a second pressure gauge that measures an outlet pressure of the cooling target when connected to the cooling target.
In a second aspect, an embodiment of the present application provides a liquid cooling test method, including:
acquiring a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition characterizes the constraint on the pressure difference of an inlet and an outlet of the micro-channel;
for the condition corresponding to each constraint condition, respectively adjusting parameters under the constraint of the constraint condition under the condition that other conditions are fixed to obtain a test data set, wherein the test data set comprises a test vector formed by a heating plate temperature and a plurality of experimental parameters, and the plurality of experimental parameters correspond to a plurality of conditions;
model construction: constructing a micro-channel ceramic package heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions;
according to the micro-channel ceramic package heat dissipation model, a plurality of expected parameters corresponding to a plurality of conditions are found when the temperature of the heating plate is limited;
and testing the ceramic packaging structure of the test micro-channel according to the expected parameter verification, and verifying the accuracy of the expected parameters.
In one possible implementation manner, the constructing a micro-channel ceramic package heat dissipation model for representing a relation between a temperature of a heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions includes:
obtaining a basic model representing the relation between the temperature of the heating plate and other conditions;
according to the corresponding relation with a plurality of variables of the basic model, sequentially inputting test vectors in the plurality of test data sets into the basic model to obtain a plurality of equations of a plurality of model parameters of the basic model;
solving a plurality of model parameters of the basic model according to the equations to obtain a plurality of parameter values corresponding to the model parameters;
substituting the parameter values into the basic model, and taking the basic model as the micro-channel ceramic package heat dissipation model.
In one possible implementation manner, the basic model includes a plurality of model parameters and variables corresponding to a plurality of conditions, where the number of the plurality of model parameters is less than or equal to the number of test vectors in the plurality of test data sets, and the basic model is:
wherein TEMP (Condition) is a temperature function, condition m As the m-th variable, a mn As a central model parameter, w mn For the proportional model parameters, N is the total number of correlations, M is the total number of variables, c is the biasA constant.
In one possible implementation manner, the solving, according to the equations, a plurality of model parameters of the base model to obtain a plurality of parameter values corresponding to the plurality of model parameters includes:
taking one equation out of the multiple equations according to a preset sequence to serve as an equation to be processed;
determining temperature indication deviation according to the temperature of the heating plate in the test vector corresponding to the equation to be processed and the temperature indication output by the equation to be processed;
if the indication deviation is greater than the indication deviation threshold, adjusting a plurality of model parameters of the basic model according to the temperature indication deviation, a test vector corresponding to the equation to be processed and a first formula, wherein the first formula is as follows:
wherein PARAM (t+1) is an adjusted model parameter value, Δp is an adjustment amount, b temp For temperature indication bias, parAM (t) is the current model parameter value and ParAM (t-1) is the previous model parameter value.
In one possible implementation manner, after the step of testing the test micro flow channel ceramic package structure according to the verification of the plurality of expected parameters, the step of verifying the accuracy of the plurality of expected parameters includes:
if the accuracy of the expected parameters is lower than the deviation expectation, the basic model is adjusted by increasing the total number of correlations, and the model construction step is skipped.
In a third aspect, an embodiment of the present application provides a liquid cooling test apparatus, configured to implement the liquid cooling test method according to the first aspect or any one of the possible implementation manners of the first aspect, where the liquid cooling test apparatus includes:
the constraint condition acquisition module is used for acquiring a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition represents the constraint on the pressure difference of an inlet and an outlet of the micro-channel;
the test data acquisition module is used for respectively carrying out parameter adjustment under the constraint condition of the constraint conditions under the condition that other conditions are fixed for the conditions corresponding to each constraint condition to obtain a test data set, wherein the test data set comprises a test vector formed by the temperature of a heating plate and a plurality of experimental parameters, and the experimental parameters correspond to the conditions;
the model construction module is used for constructing a micro-channel ceramic package heat dissipation model for representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions;
the expected parameter searching module is used for searching a plurality of expected parameters corresponding to a plurality of conditions when the temperature of the heating plate is limited according to the micro-channel ceramic package heat dissipation model;
the method comprises the steps of,
and the verification module is used for verifying the accuracy of the expected parameters according to the expected parameters to test the ceramic packaging structure of the test micro-channel.
In a fourth aspect, an embodiment of the present application provides a terminal comprising a memory and a processor, the memory storing a computer program executable on the processor, the processor implementing the steps of the method according to the first aspect or any one of the possible implementations of the first aspect when the computer program is executed.
In a fifth aspect, embodiments of the present application provide a computer readable storage medium storing a computer program which, when executed by a processor, implements the steps of the method as described above in the first aspect or any one of the possible implementations of the first aspect.
Compared with the prior art, the embodiment of the application has the beneficial effects that:
the embodiment of the application discloses a liquid cooling test method, which comprises the steps of firstly obtaining a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition represents the constraint on the pressure difference of an inlet and an outlet of a micro-channel; then, for the condition corresponding to each constraint condition, respectively adjusting parameters under the constraint of the constraint condition under the condition that other conditions are fixed, and obtaining a test data set, wherein the test data set comprises a test vector formed by the temperature of the heating plate and a plurality of experimental parameters, and the plurality of experimental parameters correspond to a plurality of conditions; and then a model construction step: constructing a micro-channel ceramic package heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions; then, according to the micro-channel ceramic package heat dissipation model, a plurality of expected parameters corresponding to a plurality of conditions are found when the temperature of the heating plate is limited; and finally, testing the ceramic packaging structure of the test micro-channel according to the expected parameter verification, and verifying the accuracy of the expected parameters. According to the embodiment of the application, a micro-channel ceramic package heat dissipation model representing the relation between the temperature of a heating plate and other test conditions is constructed based on a test data set obtained by testing, model working condition optimization parameters are searched based on the model, and accuracy of the optimization parameters is verified based on experiments. Because the speed of searching parameters by the model is far higher than the process of experimental temperature balance, the speed of searching expected parameters is high, the consumed materials and manpower resources are less, and the efficiency is higher. After the parameters are found, the parameters are verified through testing, so that the accuracy and the reliability of the parameters are ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments or the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a liquid cooling test system provided by an embodiment of the present application;
FIG. 2 is a schematic diagram of a liquid supply system provided in an embodiment of the present application;
FIG. 3 is a flow chart of a liquid cooling test method according to an embodiment of the present application;
FIG. 4 is a functional block diagram of a liquid cooling test apparatus according to an embodiment of the present application;
fig. 5 is a functional block diagram of a terminal according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following description will be made with reference to the accompanying drawings.
The following describes in detail the embodiments of the present application, and the present embodiment is implemented on the premise of the technical solution of the present application, and a detailed implementation manner and a specific operation procedure are given, but the protection scope of the present application is not limited to the following embodiments.
As shown in fig. 1, the schematic diagram of the liquid cooling test system provided by the embodiment of the application is shown.
Referring to fig. 1, an embodiment of the present application provides a liquid cooling test system, including:
a liquid supply system 101, a power supply system 102, and a temperature detection system 207;
the liquid supply system 101 is used for providing constant-temperature liquid, recovering the liquid, performing constant-temperature treatment on the recovered liquid and measuring the flow and the pressure of the liquid;
the power supply system 102 includes a controllable power source 206 and a heater chip electrically connected to the power source 206;
the temperature detection system 207 is used to detect the temperature of the heater chip surface.
As shown in fig. 2, which shows a schematic diagram of a liquid supply system, the system comprises:
a constant temperature water tank 201 for keeping the liquid inside the constant temperature water tank 201 constant by adjusting heat radiation or heating power;
a pump 202, the inlet of which is communicated with the outlet of the constant temperature water tank 201;
a flow meter 203 for receiving the fluid from the outlet of the pump 202 and measuring the flow rate of the cooling target when connected to the cooling target;
a first pressure gauge 204 that measures an inlet pressure of the cooling target when connected thereto;
and a second pressure gauge 205 that measures an outlet pressure of the cooling target when connected thereto.
Illustratively, in order to realize the liquid cooling test for the embedded ceramic micro-channel encapsulation, a liquid cooling test system for encapsulation is designed, and a processing test device is designed based on the system. The liquid cooling test for ceramic packaging integrates a liquid supply system 101, a power supply system 102 and a temperature detection system 207, and aims at an embedded ceramic micro-channel packaging product to be tested, the liquid supply system 101 provides liquid working medium and circulation thereof required by liquid cooling heat dissipation, the power supply system 102 provides a power supply 206 required by work for a heating chip, and the temperature detection system 207 measures the junction temperature of the chip in real time through a thermocouple so as to test the heat dissipation effect.
In some embodiments, power supply system 102 includes a power source 206 and heat patch that can regulate the output power, thereby controlling the power of the heat patch. And the temperature detection system 207 uses a thermocouple to obtain the temperature of the surface of the heater chip. In the liquid supply system 101, a water tank for heat dissipation or heating to keep the temperature of the internal liquid constant, a pump 202 for pumping the liquid from the constant temperature water tank 201, a flowmeter 203 for measuring the flow rate flowing through the micro-channel packaging structure, and two pressure gauges for measuring the inlet and outlet pressures of the micro-channel packaging structure are included.
In an application scenario, an electric heating plate is arranged in a structure provided with a micro-channel package, a test body of a sample 208 is formed, a first pressure gauge 204 and a second pressure gauge 205 are respectively connected with an inlet and an outlet of the micro-channel, the pressure difference of the micro-channel is measured, a flowmeter 203 measures the flow of the micro-channel, a temperature detection system 207 detects the temperature of the electric heating plate, when one of the three conditions of the temperature of a constant temperature water tank 201, the pressure difference of an inlet and an outlet of the micro-channel and the heating power of the electric heating plate is regulated, different temperature values can be obtained on the surface of the electric heating plate, so that the thermal resistance of the package provided with the micro-channel under different conditions is reflected, and designed reference data are further provided for the package structure.
Fig. 3 is a flowchart of a liquid cooling test method according to an embodiment of the present application.
As shown in fig. 3, a flowchart of an implementation of the liquid cooling test method according to an embodiment of the present application is shown, and the details are as follows:
in step 301, a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition are acquired, wherein the pressure difference constraint condition characterizes the constraint on the pressure difference of an inlet and an outlet of a micro-channel.
In step 302, for the condition corresponding to each constraint condition, parameters are adjusted under constraint conditions under the condition that other conditions are fixed, so as to obtain a test data set, where the test data set includes a test vector formed by a heating plate temperature and a plurality of experimental parameters, and the plurality of experimental parameters correspond to a plurality of conditions.
In step 303, a model building step: and constructing a micro-channel ceramic package heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions.
In some embodiments, the step 303 includes:
obtaining a basic model representing the relation between the temperature of the heating plate and other conditions;
according to the corresponding relation with a plurality of variables of the basic model, sequentially inputting test vectors in the plurality of test data sets into the basic model to obtain a plurality of equations of a plurality of model parameters of the basic model;
solving a plurality of model parameters of the basic model according to the equations to obtain a plurality of parameter values corresponding to the model parameters;
substituting the parameter values into the basic model, and taking the basic model as the micro-channel ceramic package heat dissipation model.
In some embodiments, the base model includes a plurality of model parameters and variables corresponding to a plurality of conditions, wherein a number of the plurality of model parameters is equal to or less than a number of test vectors in the plurality of test datasets, wherein the base model is:
wherein TEMP (Condition) is a temperature function, condition m As the m-th variable, a mn As a central model parameter, w mn For the proportional model parameters, N is the total number of correlations, M is the total number of variables, and c is the bias constant.
In some embodiments, the solving the plurality of model parameters of the base model according to the plurality of equations to obtain a plurality of parameter values corresponding to the plurality of model parameters includes:
taking one equation out of the multiple equations according to a preset sequence to serve as an equation to be processed;
determining temperature indication deviation according to the temperature of the heating plate in the test vector corresponding to the equation to be processed and the temperature indication output by the equation to be processed;
if the indication deviation is greater than the indication deviation threshold, adjusting a plurality of model parameters of the basic model according to the temperature indication deviation, a test vector corresponding to the equation to be processed and a first formula, wherein the first formula is as follows:
wherein PARAM (t+1) is an adjusted model parameter value, Δp is a baseBase adjustment amount b temp For temperature indication bias, parAM (t) is the current model parameter value and ParAM (t-1) is the previous model parameter value.
Illustratively, the constraint is indicative of performing an experiment within a set range of conditions, such as a pressure differential constraint, and means performing an experiment within the range of pressure differential, thereby obtaining experimental data. In practice, experimental data from one experiment is typically based on several conditions, such as pressure differential, flow, power supply, coolant temperature, and in some scenarios, conditions may also include ambient temperature. The data corresponding to a plurality of conditions obtained by each experiment and the temperature data of the electric heating plate are arranged according to a preset sequence, so that a test vector is formed. When multiple vectors are combined together, a test data set is constructed.
In the embodiment of the application, on the basis of the change of a certain condition, a test vector is obtained, for example, the pressure difference, the flow and the power supply power are fixed, the temperature of the cooling liquid is regulated, the temperature of the electric heating plate is obtained, and the cooling liquid regulation test data set is formed. The data set obtained in this way has the characteristics of good consistency of other conditions, and convenience in analysis and model construction.
As can be seen from the above discussion, the temperature of the electric heating plate is related to a plurality of influencing factors, and an excellent packaging design is a complex of a plurality of factors, so that a good heat dissipation effect cannot be obtained, the pressure difference of the packaging body is too large, or the flow is too large, or a low-temperature cooling liquid cannot be adopted, and the packaging volume is also as small as possible to reduce the cost of materials, which is a problem of multi-parameter optimization based on constraint conditions.
Therefore, the embodiment of the application provides modeling by adopting the existing data, searches the data of the working points under a plurality of constraint conditions on the basis of modeling, and then carries out experimental test by the data of the working points so as to accelerate verification of the heat dissipation effect of the package.
The basic model expression of this model is:
wherein TEMP (Condition) is a temperature function, condition m As the m-th variable, a mn As a central model parameter, w mn For the proportional model parameters, N is the total number of correlations, M is the total number of variables, and c is the bias constant.
The above basic model actually reflects the basic expression between the electric heater plate temperature and a plurality of conditions, and modeling can be accomplished by adjusting model parameters therein.
In order to solve the above problem, according to the embodiment of the present application, the obtained test vector is substituted into the basic model, and the deviation between the data indicating the temperature of the electric heating plate output by the model and the data indicating the temperature of the electric heating plate obtained through experiments is verified in an iterative manner, which is called as a temperature indication deviation, and a plurality of model parameter values of the model are adjusted by using a first formula according to the temperature indication deviation, specifically, the first formula is as follows:
wherein PARAM (t+1) is an adjusted model parameter value, Δp is an adjustment amount, b temp For temperature indication bias, parAM (t) is the current model parameter value and ParAM (t-1) is the previous model parameter value.
The processes of experimental testing, obtaining experimental data and modeling are completed through the steps.
In step 304, a plurality of expected parameters corresponding to a plurality of conditions when the temperature of the heating plate is limited are found according to the micro-channel ceramic package heat dissipation model.
In step 305, the test micro-fluidic channel ceramic package structure is tested according to the plurality of expected parameter verifications, and the accuracy of the plurality of expected parameters is verified.
In some embodiments, after the step 305, further includes:
if the accuracy of the expected parameters is lower than the deviation expectation, the basic model is adjusted by increasing the total number of correlations, and the model construction step is skipped.
For example, as described above, the temperature of the electric heater plate can be set to a fixed value, typically a limit value, when the model is provided, by which acceptable values are found, for example, when the temperature of the cooling liquid is high, a package structure with a small pressure difference and a small volume is adopted, so that the heat dissipation condition is satisfied.
When some parameters meeting the above conditions are found, because the model has a certain calculation deviation, the parameters also need to be verified through experiments according to the parameters, and whether the parameters can meet the design requirements as indicated by the model. In some application scenarios, the indication deviation of the model output is likely to be larger, and if the model adopts the equation of the basic model, we can increase the total number of the related models and adjust the complexity of the model, so as to achieve the purpose of improving the model precision, and after the model is adjusted, the steps of modeling and the like are repeated.
The liquid cooling test method comprises the steps of firstly obtaining a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition represents the constraint on the pressure difference of an inlet and an outlet of a micro-channel; then, for the condition corresponding to each constraint condition, respectively adjusting parameters under the constraint of the constraint condition under the condition that other conditions are fixed, and obtaining a test data set, wherein the test data set comprises a test vector formed by the temperature of the heating plate and a plurality of experimental parameters, and the plurality of experimental parameters correspond to a plurality of conditions; and then a model construction step: constructing a micro-channel ceramic package heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions; then, according to the micro-channel ceramic package heat dissipation model, a plurality of expected parameters corresponding to a plurality of conditions are found when the temperature of the heating plate is limited; and finally, testing the ceramic packaging structure of the test micro-channel according to the expected parameter verification, and verifying the accuracy of the expected parameters. According to the embodiment of the application, a micro-channel ceramic package heat dissipation model representing the relation between the temperature of a heating plate and other test conditions is constructed based on a test data set obtained by testing, model working condition optimization parameters are searched based on the model, and accuracy of the optimization parameters is verified based on experiments. Because the speed of searching parameters by the model is far higher than the process of experimental temperature balance, the speed of searching expected parameters is high, the consumed materials and manpower resources are less, and the efficiency is higher. After the parameters are found, the parameters are verified through testing, so that the accuracy and the reliability of the parameters are ensured.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present application.
The following are device embodiments of the application, for details not described in detail therein, reference may be made to the corresponding method embodiments described above.
Fig. 4 is a functional block diagram of a liquid cooling test apparatus according to an embodiment of the present application, and referring to fig. 4, the liquid cooling test apparatus 4 includes: constraint acquisition module 401, test data acquisition module 402, model construction module 403, expected parameter finding module 404, and verification module 405, wherein:
the constraint condition acquisition module 401 is configured to acquire a pressure difference constraint condition, a cooling liquid temperature constraint condition, and a heating plate temperature constraint condition, where the pressure difference constraint condition characterizes a constraint on a pressure difference between an inlet and an outlet of a micro-channel;
the test data acquisition module 402 is configured to, for each condition corresponding to the constraint condition, respectively adjust parameters under the constraint of the constraint condition under the condition that other conditions are fixed, and obtain a test data set, where the test data set includes a test vector formed by a heating plate temperature and a plurality of experimental parameters, and the plurality of experimental parameters correspond to the plurality of conditions;
the model building module 403 is configured to build a micro-channel ceramic package heat dissipation model that characterizes a relationship between a temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions;
the expected parameter searching module 404 is configured to find a plurality of expected parameters corresponding to a plurality of conditions when the temperature of the heating plate is limited according to the micro-channel ceramic package heat dissipation model;
and the verification module 405 is configured to verify that the accuracy of the plurality of expected parameters is verified by performing a test on the test micro-fluidic channel ceramic package structure according to the plurality of expected parameters.
Fig. 5 is a functional block diagram of a terminal according to an embodiment of the present application. As shown in fig. 5, the terminal 5 of this embodiment includes: a processor 500 and a memory 501, said memory 501 having stored therein a computer program 502 executable on said processor 500. The steps of the various liquid cooling test methods and embodiments described above, such as steps 301 through 305 shown in fig. 3, are implemented by the processor 500 when executing the computer program 502.
Illustratively, the computer program 502 may be partitioned into one or more modules/units that are stored in the memory 501 and executed by the processor 500 to accomplish the present application.
The terminal 5 may be a computing device such as a desktop computer, a notebook computer, a palm computer, a cloud server, etc. The terminal 5 may include, but is not limited to, a processor 500, a memory 501. It will be appreciated by those skilled in the art that fig. 5 is merely an example of the terminal 5 and is not limiting of the terminal 5, and may include more or fewer components than shown, or may combine some components, or different components, e.g., the terminal 5 may further include input-output devices, network access devices, buses, etc.
The processor 500 may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 501 may be an internal storage unit of the terminal 5, for example, a hard disk or a memory of the terminal 5. The memory 501 may also be an external storage device of the terminal 5, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash Card (Flash Card) or the like, which are provided on the terminal 5. Further, the memory 501 may also include both an internal storage unit and an external storage device of the terminal 5. The memory 501 is used for storing the computer program 502 and other programs and data required by the terminal 5. The memory 501 may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, and will not be described herein again.
In the foregoing embodiments, the descriptions of the embodiments are focused on, and the details or descriptions of other embodiments may be referred to for those parts of an embodiment that are not described in detail or are described in detail.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus/terminal and method may be implemented in other manners. For example, the apparatus/terminal embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated modules/units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on this understanding, the present application may also be implemented by implementing all or part of the procedures in the methods of the above embodiments, or by instructing the relevant hardware by a computer program, where the computer program may be stored in a computer readable storage medium, and the computer program may be implemented by implementing the steps of the embodiments of the methods and apparatuses described above when executed by a processor. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth.
The above embodiments are only for illustrating the technical solution of the present application, and are not limited thereto; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and they should be included in the protection scope of the present application.
Claims (10)
1. A liquid cooling test system, comprising:
the liquid supply system, the power supply system and the temperature detection system;
the liquid supply system is used for providing constant-temperature liquid, recovering the liquid, performing constant-temperature treatment on the recovered liquid and measuring the flow and the pressure of the liquid;
the power supply system comprises a controllable power supply and a heating plate electrically connected with the power supply;
the temperature detection system is used for detecting the temperature of the surface of the heating plate.
2. The liquid cooled testing system of claim 1, wherein the liquid supply system comprises:
the constant temperature water tank is used for keeping the temperature of the liquid in the constant temperature water tank by adjusting heat dissipation or heating power;
the inlet of the pump is communicated with the outlet of the constant-temperature water tank;
a flow meter that receives fluid from the pump outlet and measures a flow rate of the cooling target when connected to the cooling target;
a first pressure gauge that measures an inlet pressure of the cooling target when connected to the cooling target;
and a second pressure gauge that measures an outlet pressure of the cooling target when connected to the cooling target.
3. The liquid cooling test method is characterized by being used for testing the ceramic packaging structure of the micro-channel and comprising the following steps:
acquiring a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition characterizes the constraint on the pressure difference of an inlet and an outlet of the micro-channel;
for the condition corresponding to each constraint condition, respectively adjusting parameters under the constraint of the constraint condition under the condition that other conditions are fixed to obtain a test data set, wherein the test data set comprises a test vector formed by a heating plate temperature and a plurality of experimental parameters, and the plurality of experimental parameters correspond to a plurality of conditions;
model construction: constructing a micro-channel ceramic package heat dissipation model representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions;
according to the micro-channel ceramic package heat dissipation model, a plurality of expected parameters corresponding to a plurality of conditions are found when the temperature of the heating plate is limited;
and testing the ceramic packaging structure of the test micro-channel according to the expected parameter verification, and verifying the accuracy of the expected parameters.
4. The liquid cooling test method according to claim 3, wherein constructing a micro flow channel ceramic package heat dissipation model characterizing a relationship between a heating plate temperature and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions comprises:
obtaining a basic model representing the relation between the temperature of the heating plate and other conditions;
according to the corresponding relation with a plurality of variables of the basic model, sequentially inputting test vectors in the plurality of test data sets into the basic model to obtain a plurality of equations of a plurality of model parameters of the basic model;
solving a plurality of model parameters of the basic model according to the equations to obtain a plurality of parameter values corresponding to the model parameters;
substituting the parameter values into the basic model, and taking the basic model as the micro-channel ceramic package heat dissipation model.
5. The liquid cooling test method according to claim 4, wherein the basic model includes a plurality of model parameters and variables corresponding to a plurality of conditions, wherein the number of the plurality of model parameters is equal to or less than the number of test vectors in the plurality of test data sets, and wherein the basic model is:
wherein TEMP (Condition) is a temperature function, condition m As the m-th variable, a mn Is centered atModel parameters, w mn For the proportional model parameters, N is the total number of correlations, M is the total number of variables, and c is the bias constant.
6. The liquid cooling test method according to any one of claims 4-5, wherein solving a plurality of model parameters of the base model according to the plurality of equations to obtain a plurality of parameter values corresponding to the plurality of model parameters comprises:
taking one equation out of the multiple equations according to a preset sequence to serve as an equation to be processed;
determining temperature indication deviation according to the temperature of the heating plate in the test vector corresponding to the equation to be processed and the temperature indication output by the equation to be processed;
if the indication deviation is greater than the indication deviation threshold, adjusting a plurality of model parameters of the basic model according to the temperature indication deviation, a test vector corresponding to the equation to be processed and a first formula, wherein the first formula is as follows:
wherein PARAM (t+1) is an adjusted model parameter value, Δp is an adjustment amount, b temp For temperature indication bias, parAM (t) is the current model parameter value and ParAM (t-1) is the previous model parameter value.
7. The liquid cooling test method according to claim 5, wherein after the step of verifying the accuracy of the plurality of expected parameters by testing the test micro flow channel ceramic package structure according to the plurality of expected parameter verification, comprising:
if the accuracy of the expected parameters is lower than the deviation expectation, the basic model is adjusted by increasing the total number of correlations, and the model construction step is skipped.
8. A liquid cooling test apparatus for implementing the liquid cooling test method according to any one of claims 3 to 7, the liquid cooling test apparatus comprising:
the constraint condition acquisition module is used for acquiring a pressure difference constraint condition, a cooling liquid temperature constraint condition and a heating plate temperature constraint condition, wherein the pressure difference constraint condition represents the constraint on the pressure difference of an inlet and an outlet of the micro-channel;
the test data acquisition module is used for respectively carrying out parameter adjustment under the constraint condition of the constraint conditions under the condition that other conditions are fixed for the conditions corresponding to each constraint condition to obtain a test data set, wherein the test data set comprises a test vector formed by the temperature of a heating plate and a plurality of experimental parameters, and the experimental parameters correspond to the conditions;
the model construction module is used for constructing a micro-channel ceramic package heat dissipation model for representing the relation between the temperature of the heating plate and other test conditions based on a plurality of test data sets corresponding to a plurality of constraint conditions;
the expected parameter searching module is used for searching a plurality of expected parameters corresponding to a plurality of conditions when the temperature of the heating plate is limited according to the micro-channel ceramic package heat dissipation model;
the method comprises the steps of,
and the verification module is used for verifying the accuracy of the expected parameters according to the expected parameters to test the ceramic packaging structure of the test micro-channel.
9. A terminal comprising a memory and a processor, the memory having stored therein a computer program executable on the processor, characterized in that the processor implements the steps of the method according to any of the preceding claims 3 to 7 when the computer program is executed.
10. A computer readable storage medium storing a computer program, characterized in that the computer program when executed by a processor implements the steps of the method according to any of the preceding claims 3 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310349118.4A CN116626469A (en) | 2023-04-03 | 2023-04-03 | Liquid cooling test system and liquid cooling test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310349118.4A CN116626469A (en) | 2023-04-03 | 2023-04-03 | Liquid cooling test system and liquid cooling test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116626469A true CN116626469A (en) | 2023-08-22 |
Family
ID=87612310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310349118.4A Pending CN116626469A (en) | 2023-04-03 | 2023-04-03 | Liquid cooling test system and liquid cooling test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116626469A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117723163A (en) * | 2024-02-07 | 2024-03-19 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Junction temperature testing device and method for GaN HEMTs device |
| CN117874969A (en) * | 2024-03-13 | 2024-04-12 | 西门子电机(中国)有限公司 | Design method and device of motor heat dissipation rib, electronic equipment and storage medium |
-
2023
- 2023-04-03 CN CN202310349118.4A patent/CN116626469A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117723163A (en) * | 2024-02-07 | 2024-03-19 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Junction temperature testing device and method for GaN HEMTs device |
| CN117723163B (en) * | 2024-02-07 | 2024-06-18 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Junction temperature testing device and method for GaN HEMTs device |
| CN117874969A (en) * | 2024-03-13 | 2024-04-12 | 西门子电机(中国)有限公司 | Design method and device of motor heat dissipation rib, electronic equipment and storage medium |
| CN117874969B (en) * | 2024-03-13 | 2024-05-28 | 西门子电机(中国)有限公司 | Design method and device of motor heat dissipation rib, electronic equipment and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116626469A (en) | Liquid cooling test system and liquid cooling test method | |
| CN109063298A (en) | A kind of structure parameter optimizing method improving fluid channel heat dissipation performance | |
| CN112861302B (en) | Power battery thermal management simulation method, device and storage medium | |
| US9518875B2 (en) | Thermally determining flow and/or heat load distribution in parallel paths | |
| US20120323539A1 (en) | Method and Non-Transitory Computer Readable Medium Thereof for Thermal Analysis Modeling | |
| CN106124955B (en) | The transient electrical test method of liquid cold plate thermal resistance | |
| CN110110367B (en) | Electrochemical energy storage cabinet thermal simulation method and system | |
| CN106053527A (en) | Method for testing anisotropic heat diffusion coefficient of power battery at same time | |
| CN115169265B (en) | Method, system, equipment and medium for analyzing mixing coefficient based on numerical analysis | |
| US9651969B2 (en) | Adaptive voltage scaling using analytical models for interconnect delay | |
| CN114154334B (en) | Chip-level thermal characteristic analysis method and device and terminal equipment | |
| CN113420407B (en) | IGCT water-cooled radiator modeling and junction temperature calculation method | |
| CN112926259B (en) | Method for predicting junction temperature of semiconductor device based on RBF neural network model | |
| US20160239589A1 (en) | Automatic calibration of thermal models | |
| Sanchez et al. | Experimental and Numerical Investigation of Liquid-to-Air Heat Exchangers | |
| Witrant et al. | Shape identification for distributed parameter systems and temperature profiles in tokamaks | |
| Blackmore et al. | Including Electrothermal Effects in Electronics Design with Connected FANTASTIC BCI-ROMs | |
| CN117054763A (en) | Method, device and equipment for calculating charge of gas-liquid two-phase flow | |
| CN115964870A (en) | Heat transfer coefficient determination method and device for heat exchanger, electronic equipment and medium | |
| CN118569046B (en) | Method, device, equipment and storage medium for determining heat dissipation structure of fiber-optic gyroscope | |
| Soleymani et al. | Thermal and Hydraulic Characterization of a Double-sided Liquid Cold Plate Used in Artificial Intelligence Systems | |
| CN203855583U (en) | Polymerase chain reaction (PCR) instrument temperature calibration system | |
| Schiano et al. | Conjugate heat transfer analysis of a thin liquid cooling heat sink using free software | |
| CN116502348A (en) | Thermal resistance calculation method, system, storage medium and equipment for battery pack | |
| CN118656574A (en) | PSO fitting-based structure function acquisition method and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |