CN116613271B - Packaging method and packaging structure of COB display screen - Google Patents
Packaging method and packaging structure of COB display screen Download PDFInfo
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- CN116613271B CN116613271B CN202310493753.XA CN202310493753A CN116613271B CN 116613271 B CN116613271 B CN 116613271B CN 202310493753 A CN202310493753 A CN 202310493753A CN 116613271 B CN116613271 B CN 116613271B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 64
- 239000000110 cooling liquid Substances 0.000 claims description 22
- 238000001179 sorption measurement Methods 0.000 claims description 13
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 11
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims 3
- 238000010521 absorption reaction Methods 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a packaging method and a packaging structure of a COB display screen, wherein the packaging method comprises a display screen rear cover, an LED chip, a driven adjusting component of a temperature-sensing driving component and a liquid level early warning component.
Description
Technical Field
The invention relates to the technical field of display screen packaging, in particular to a packaging method and a packaging structure of a COB display screen.
Background
The Cob display is a display manufactured based on COB (Chip on Board) technology. The COB technology is to directly attach a chip to a substrate, and form dense contact between the chip and the substrate, thereby realizing a circuit design with high integration and high reliability. The COB display screen adopts the technology, and the display chip is directly adhered to the display screen substrate, so that the thickness and the volume of the display are reduced. The COB display screen is widely applied to the fields of digital products, instruments, electronic games and the like, such as computer display screens, instrument display screens and the like.
The display screen generally includes the shell and sets up the display screen body in the casing, conventional display screen packaging structure only through adopting evenly distributed's buckle structure and back lid joint at display screen casing edge, do not have the packaging structure to the big, inside electronic components's of data processing volume display screen and special design on the market at present, its heat dissipation demand also can corresponding increase when the inside electronic components of display are more, in the higher air of water content is poured into the display screen from the louvre easily in spring and summer, lead to the inside electronic components of display screen ageing of becoming damp, and the dust can be increased and accumulated in the louvre department along with the live time of display screen increases, influence its radiating efficiency, the display screen does not carry out corresponding encapsulation improvement design to the louvre on the shell at present.
Therefore, in order to solve the above-mentioned technical problems, it is necessary to provide a packaging method and a packaging structure of a COB display.
Disclosure of Invention
The invention aims to provide a packaging method and a packaging structure of a COB display screen, so as to solve the problems.
In order to achieve the above object, an embodiment of the present invention provides the following technical solution:
A packaging structure of a COB display screen, comprising:
the LED display comprises a display screen rear cover and an LED chip, wherein a temperature collecting groove and a pair of temperature guide grooves positioned at the left side and the right side of the temperature collecting groove are formed in the display screen rear cover, and the temperature collecting groove and the temperature guide grooves are positioned at the upper side of the LED chip;
The temperature-sensing driving assembly comprises a heat collecting rod, a rod covering film, a supporting rod and a driving block, wherein the heat collecting rod is arranged in a heat collecting groove, the lower end of the heat collecting rod is connected with an LED chip, the rod covering film is coated at the outer end of the heat collecting rod, the upper end of the heat collecting rod is abutted to the rod covering film, the supporting rod is fixedly connected with the upper end of the rod covering film, and one end, far away from the rod covering film, of the supporting rod is fixedly connected with the driving block;
The driven adjusting assembly comprises a cooling block, cooling liquid, sliding rods, driven balls, an adsorption block and a magnetic shielding block, wherein the cooling block is arranged in a heat conduction groove, the lower surface of the cooling block is attached to an LED chip, the inside of the cooling block is hollow, the cavity of the cooling block is filled with the cooling liquid, three groups of sliding rods are fixedly connected in the cooling block, the outer ends of the sliding rods are slidably connected with the driven balls, the adsorption block is fixedly connected on the inner wall, far away from one side of the driving block, of the cooling block, and the magnetic shielding block is fixedly connected on the inner wall, close to one side of the driving block, of the cooling block;
The liquid level early warning assembly comprises a sliding groove, a traction rope and a feedback plate, wherein the sliding groove is formed in the inner wall of the cooling block, the feedback plate is connected in a sliding manner in the sliding groove, and the traction rope is fixedly connected between the feedback plate and the inner top end of the cooling block.
As a further improvement of the LED lamp, the heat collecting rods are made of heat expansion materials, the expansion direction of the heat collecting rods is perpendicular to the LED chip, a plurality of heat collecting rods are arranged, and the heat collecting rods are distributed in a gradually shortened mode from the center to the periphery.
As a further improvement of the invention, the covering rod film is made of elastic materials, and the connection part of the supporting rod and the covering rod film is the geometric center of the covering rod film.
As a further improvement of the invention, the cooling block is made of light and thin heat conducting material, and the cooling liquid is a mixed solution of water body and glycerin.
As a further improvement of the invention, the driving block and the adsorption block are both made of magnetic materials, the driven ball is a ball body made of magnetic materials, the magnetic poles of the driven ball and the driving block and the magnetic poles of the end, close to each other, of the driven ball are opposite, and the magnetic attraction between the driving block and the driven ball is larger than the magnetic attraction between the adsorption block and the driven ball.
As a further improvement of the present invention, the number of the magnetic shield blocks is plural, and the pitch between every two magnetic shield blocks is matched with the height of the driving block.
As a further improvement of the invention, limit balls are arranged at the left end and the right end of the slide bar, a through hole is arranged at the inner end of the driven ball, and the aperture of the through hole is far smaller than the diameter of the limit ball.
As a further improvement of the invention, the driven ball at the uppermost side is higher than the bottom side of the chute body, and the feedback plate is made of hollow hard material.
As a further improvement of the invention, a connecting rod is fixedly connected between a pair of cooling blocks, and the upper end of the connecting rod is fixedly connected with a lifting rod.
As a further improvement of the invention, a packaging method of the COB display screen comprises the following steps:
s1, reserving a temperature gathering groove and a temperature guiding groove when the rear cover of the display screen is formed by injection molding;
S2, assembling a temperature sensing driving assembly in the temperature collecting groove, and connecting the heat collecting rod with the LED chip;
s3, assembling a driven adjusting assembly in the heat conduction groove, and enabling the lower surface of the cooling block to be attached to the LED chip.
Compared with the prior art, the invention has the advantages that:
According to the scheme, the ventilation type heat dissipation holes in the traditional display screen are abandoned, the temperature collecting groove and the temperature guiding groove are formed in the rear cover of the display screen, the temperature sensing driving assembly and the driven adjusting assembly are respectively assembled in the temperature collecting groove and the temperature guiding groove, the LED chip is continuously cooled through the cooling block and the cooling liquid, when the LED chip is overlarge in unit time processing data or the external environment temperature is high and rises, the corresponding expansion and elongation of the cooling block are carried out to drive the driving block to rise along with the cooling block, the driving block adsorbs the driven ball and sufficiently agitates cooling liquid in the cooling block in the process, the temperature of cooling liquid in each position in the cooling block is agitated and mixed, the cooling effect of the cooling liquid close to the LED chip is guaranteed, and the effects of guaranteeing the service performance of the display screen and prolonging the service life of the LED chip are achieved.
Drawings
FIG. 1 is a schematic diagram of a display screen according to the prior art;
FIG. 2 is a schematic structural diagram of a display screen with improved heat dissipation holes according to the present invention;
FIG. 3 is a front cross-sectional view of the present invention;
FIG. 4 is a schematic view of the state of FIG. 3 according to another embodiment of the present invention;
FIG. 5 is a front cross-sectional view of a cooling block of the present invention;
FIG. 6 is a side cross-sectional view of a cooling block of the present invention;
FIG. 7 is a schematic view of the structure of the present invention among the slide bar, the driven ball and the adsorption block;
fig. 8 is an enlarged view of fig. 2a in accordance with the present invention.
Fig. 9 is a flowchart of a method for packaging a COB display of the present invention.
The reference numerals in the figures illustrate:
1a display screen rear cover, 101 an LED chip, 102 a temperature collecting groove, 103 a temperature guiding groove, 2 a heat collecting rod, 3a rod covering film, 4a supporting rod, 5a driving block, 6a cooling block, 601 a sliding groove, 7 a sliding rod, 701 a limiting ball, 8 a driven ball, 801 a through hole, 9 an adsorption block, 10 a magnetic shielding block, 11a traction rope, 12 a feedback plate, 13 a connecting rod and 14 a lifting rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
Example 1:
referring to fig. 2-8, a packaging structure of a COB display screen includes:
the LED display screen comprises a display screen rear cover 1 and an LED chip 101, wherein a temperature collecting groove 102 and a pair of temperature guide grooves 103 positioned at the left side and the right side of the temperature collecting groove 102 are formed in the display screen rear cover 1, and the temperature collecting groove 102 and the temperature guide grooves 103 are positioned at the upper side of the LED chip 101;
Referring to fig. 3-4, the temperature-sensing driving assembly includes a heat collecting rod 2, a rod film 3, a supporting rod 4 and a driving block 5, wherein the heat collecting rod 2 is arranged in a heat collecting groove 102, the lower end of the heat collecting rod 2 is connected with an LED chip 101, the heat collecting rod 2 is made of a heated expansion material, the expansion direction of the heat collecting rod 2 is perpendicular to the LED chip 101, the heat collecting rods 2 are arranged in a plurality, the heat collecting rods 2 are distributed in a way of gradually shortening from the center to the periphery, when the LED chip 101 is excessively large in data processing per unit time or the temperature of the external environment is high, the shape of the heat collecting rod 2 is correspondingly expanded and elongated, the rod film 3 is coated at the outer end of the heat collecting rod 2, the upper end of the heat collecting rod 2 is abutted against the rod film 3, the rod film 3 is made of an elastic material, the upper end of the rod film 3 is fixedly connected with the supporting rod 4 after the expansion and elongation, the connecting position of the supporting rod 4 and the rod film 3 is gradually shortened from the center to the periphery, and the driving block 5 is far away from the center of the rod film 3, and the driving block 5 is driven to move away from the rod film 3;
Referring to fig. 3-6, the driven adjusting component comprises a cooling block 6, cooling liquid, a sliding rod 7, a driven ball 8, an adsorption block 9 and a magnetic shielding block 10, wherein the cooling block 6 is arranged in a heat conducting groove 103, the lower surface of the cooling block 6 is attached to an LED chip 101, the inside of the cooling block 6 is hollow, a cavity of the cooling block 6 is filled with the cooling liquid, a user can set a corresponding liquid injection hole on the upper surface of the cooling block 6 according to actual use conditions, the cooling block 6 is made of a light and thin heat conducting material, the cooling liquid is a mixed solution of water and glycerol, the water heat conducting performance is good, the evaporation rate of the water is reduced through the glycerol, the cooling block 6 attached to the LED chip 101 can cool the surface of the LED chip 101 better, so that the normal use of a display screen is ensured, and the temperature of the cooling liquid at the lower side of the cooling block 6 in the state is higher than that of the cooling liquid in other areas;
Referring to fig. 3-6, three groups of sliding rods 7 are fixedly connected in the cooling block 6, driven balls 8 are slidably connected at the outer ends of the sliding rods 7, adsorbing blocks 9 are fixedly connected on the inner wall of one side, far away from the driving block 5, of the cooling block 6, the driving block 5 and the adsorbing blocks 9 are made of magnetic materials, the driven balls 8 are spheres made of magnetic materials, the magnetic poles of the driven balls 8 are opposite to those of the driving block 5 and one ends, close to the driven balls 8, of the driven balls 8 are larger than those of the adsorbing blocks 9 and the driven balls 8, magnetic shielding blocks 10 are fixedly connected on the inner wall, close to the driving block 5, of the cooling block 6, the magnetic shielding blocks 10 are arranged in a plurality, the distance between every two magnetic shielding blocks 10 is matched with the height of the driving block 5, under the normal state, due to the magnetic shielding effect of the magnetic shielding blocks 10, all the driven balls 8 are adsorbed on one side close to the adsorption block 9, when the surface temperature of the LED chip 101 rises to cause the heat collecting rod 2 to expand after being heated, the driving block 5 moves upwards along with the heat collecting rod, every time the driving block 5 rises to a gap between two magnetic shielding blocks 10, the driving block 5 and the driven balls 8 are not influenced by the magnetic shielding blocks 10, the driven balls 8 corresponding to the positions of the driving block 5 move towards one side close to the driving block 5 under the influence of magnetic attraction, no matter the driving block 5 is in a continuous rising state or a descending state in the subsequent process, after the driving block 5 moves to a position flush with the magnetic shielding blocks 10, the driven balls 8 are adsorbed again by the adsorption block 9, cooling liquid in the cooling block 6 is stirred in the two processes, so that the cooling liquid with lower temperature in other areas in the cooling block 6 is fully mixed with the cooling liquid with higher temperature, so as to ensure that the temperature of the cooling liquid near the inner bottom end of the cooling block 6 and the side near the temperature gathering groove 102 is lower than before after each stirring action, thereby ensuring the cooling effect on the LED chip 101;
referring to fig. 7, limiting balls 701 are arranged at the left end and the right end of the sliding rod 7, a through hole 801 is formed at the inner end of the driven ball 8, the aperture of the through hole 801 is far smaller than the diameter of the limiting ball 701, the limiting ball 701 limits the movement travel of the driven ball 8, the impact on the cooling block 6 when the driven ball is attracted by the magnetic force of the driving block 5 or the adsorption block 9 is prevented, and the service life of the whole equipment is prolonged;
Referring to fig. 3-6 and fig. 8, the liquid level early warning assembly includes a chute 601, a traction rope 11 and a feedback plate 12, wherein the chute 601 is opened on the inner wall of the cooling block 6, the feedback plate 12 is connected in the chute 601 in a sliding manner, the level of the driven ball 8 at the uppermost side is higher than the level of the lowest side of the chute 601 body, the feedback plate 12 is made of hollow rigid material, when the cooling liquid in the cooling block 6 evaporates and decreases due to the increase of time, the feedback plate 12 descends along with the descending of the liquid level, after descending to a certain height, and the LED chip 101 is in a high temperature state, so that when the driving block 5 moves to a position flush with the driven ball 8 at the uppermost side, the driven ball 8 collides with the feedback plate 12 at the middle position due to the magnetic attraction force when moving towards one side of the driving block 5, and the cooling block 6 is required to be added by a user, the cooling block 6 is reminded of a display screen, the traction rope 11 is fixedly connected between the feedback plate 12 and the inner top ends of the cooling block 6, a connecting rod 13 is fixedly connected between the pair of cooling blocks 6, and when the connecting rod 14 is required to be pulled out by the connecting rod 14, and the cooling rod 14 is required to be easily pulled out.
Referring to fig. 9, a packaging method of a COB display screen includes the following steps:
s1, reserving a temperature collecting groove 102 and a temperature guiding groove 103 when the rear cover 1 of the display screen is formed by injection molding;
S2, assembling a temperature sensing driving assembly in the temperature collecting groove 102, and connecting the heat collecting rod 2 with the LED chip 101;
S3, a driven adjusting assembly is assembled in the temperature guide groove 103, and the lower surface of the cooling block 6 is attached to the LED chip 101.
According to the scheme, the ventilation type heat dissipation holes in the traditional display screen are abandoned, the temperature collecting groove 102 and the temperature guiding groove 103 are arranged on the rear cover 1 of the display screen, the temperature sensing driving component and the driven adjusting component are respectively assembled in the temperature collecting groove 102 and the temperature guiding groove 103, the LED chip 101 is continuously cooled through the cooling block 6 and the cooling liquid, when the LED chip 101 is overlarge in unit time processing data or the external environment temperature is higher and the temperature rises through the heat collecting rod 2, the corresponding expansion elongation is carried out to drive the driving block 5 to rise along with the processing data, the driving block 5 is enabled to absorb the driven ball 8 and fully stir the cooling liquid in the cooling block 6 in the process, the temperature of the cooling liquid in each position in the cooling block 6 is stirred and mixed, the cooling liquid temperature close to the position of the LED chip 101 is enabled to be reduced, the cooling effect on the LED chip 101 is guaranteed, and the effects of guaranteeing the service performance of the display screen and prolonging the service life of the LED chip 101 are achieved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment contains only one independent technical solution, and that such description is provided for clarity only, and that the technical solutions of the embodiments may be appropriately combined to form other embodiments that will be understood by those skilled in the art.
Claims (10)
1. The utility model provides a packaging structure of COB display screen which characterized in that: comprising the following steps:
The LED display device comprises a display screen rear cover (1) and an LED chip (101), wherein a temperature collecting groove (102) and a pair of temperature guide grooves (103) positioned at the left side and the right side of the temperature collecting groove (102) are formed in the display screen rear cover (1), and the temperature collecting groove (102) and the temperature guide grooves (103) are positioned at the upper side of the LED chip (101);
The temperature-sensing driving assembly comprises a heat collecting rod (2), a rod covering film (3), a supporting rod (4) and a driving block (5), wherein the heat collecting rod (2) is arranged in a heat collecting groove (102), the lower end of the heat collecting rod (2) is connected with an LED chip (101), the rod covering film (3) is coated at the outer end of the heat collecting rod (2), the upper end of the heat collecting rod (2) is abutted to the rod covering film (3), the supporting rod (4) is fixedly connected to the upper end of the rod covering film (3), and the driving block (5) is fixedly connected to one end, far away from the rod covering film (3), of the supporting rod (4);
Driven adjusting component, including cooling block (6), coolant liquid, slide bar (7), driven ball (8), absorption piece (9) and magnetic shielding piece (10), cooling block (6) set up in heat conduction groove (103), and the lower surface of cooling block (6) is laminated mutually with LED chip (101), the inside of cooling block (6) is hollow setting, the cavity intussuseption of cooling block (6) is filled with coolant liquid, three slide bars (7) of fixedly connected with in cooling block (6), the outer end sliding connection of slide bar (7) has driven ball (8), fixedly connected with absorption piece (9) on the inner wall of cooling block (6) one side of keeping away from driving block (5), fixedly connected with magnetic shielding piece (10) on the inner wall of cooling block (6) one side of being close to driving block (5).
The liquid level early warning assembly comprises a sliding groove (601), a traction rope (11) and a feedback plate (12), wherein the sliding groove (601) is formed in the inner wall of the cooling block (6), the feedback plate (12) is connected in a sliding manner in the sliding groove (601), and the traction rope (11) is fixedly connected between the feedback plate (12) and the inner top end of the cooling block (6).
2. The packaging structure of a COB display screen of claim 1, wherein: the heat collecting rods (2) are made of a heated expansion material, the expansion direction of the heat collecting rods (2) is perpendicular to the LED chip (101), the heat collecting rods (2) are arranged in a plurality, and the heat collecting rods (2) are distributed in a gradually shortened state from the center to the periphery.
3. The packaging structure of a COB display screen of claim 2, wherein: the covering rod membrane (3) is made of elastic materials, and the joint of the supporting rod (4) and the covering rod membrane (3) is the geometric center of the covering rod membrane (3).
4. The packaging structure of a COB display screen of claim 3, wherein: the cooling block (6) is made of light and thin heat conducting materials, and the cooling liquid is a mixed solution of water and glycerol.
5. The packaging structure of a COB display screen of claim 4, wherein: the driving block (5) and the adsorption block (9) are made of magnetic materials, the driven ball (8) is a ball made of magnetic materials, the magnetic poles of the driven ball (8) and the driving block (5) are opposite to those of one ends, close to each other, of the driven ball (8) and the adsorption block (9), and the magnetic attraction between the driving block (5) and the driven ball (8) is greater than that between the adsorption block (9) and the driven ball (8).
6. The packaging structure of a COB display screen of claim 5, wherein: the number of the magnetic shielding blocks (10) is plural, and the distance between every two magnetic shielding blocks (10) is matched with the height of the driving block (5).
7. The packaging structure of a COB display screen of claim 6, wherein: limiting balls (701) are arranged at the left end and the right end of the sliding rod (7), a through hole (801) is formed in the inner end of the driven ball (8), and the aperture of the through hole (801) is far smaller than the diameter of the limiting balls (701).
8. The packaging structure of a COB display screen of claim 7, wherein: the horizontal height of the driven ball (8) at the uppermost side is higher than that of the lowest side of the chute body (601), and the feedback plate (12) is made of hollow hard materials.
9. The packaging structure of a COB display screen of claim 1, wherein: a connecting rod (13) is fixedly connected between the pair of cooling blocks (6), and a lifting rod (14) is fixedly connected to the upper end of the connecting rod (13).
10. The packaging method of the packaging structure of the COB display screen of any one of claims 1 to 9, characterized by comprising the steps of: the method comprises the following steps:
s1, reserving a temperature collecting groove (102) and a temperature guiding groove (103) when the rear cover (1) of the display screen is formed by injection molding;
s2, assembling a temperature sensing driving assembly in the temperature collecting groove (102), and connecting the heat collecting rod (2) with the LED chip (101);
s3, assembling a driven adjusting assembly in the heat conducting groove (103), and enabling the lower surface of the cooling block (6) to be attached to the LED chip (101).
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209149709U (en) * | 2018-11-15 | 2019-07-23 | 英菲森（深圳）光电科技有限公司 | A kind of COB high clear screen with safeguard function |
| CN111760221A (en) * | 2020-06-01 | 2020-10-13 | 吴波 | Fire-retardant device of switch board with isolated air function |
| CN213691269U (en) * | 2020-07-27 | 2021-07-13 | 卓华光电科技集团有限公司 | COB packaging LED display screen based on flip chip technology |
| CN216849981U (en) * | 2022-03-10 | 2022-06-28 | 佛山灏壹光电科技有限公司 | COB packaging structure of high light efficiency |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205105503U (en) * | 2015-10-12 | 2016-03-23 | 酷码科技股份有限公司 | Thermal module , cooling system and circuit module |
| PL239897B1 (en) * | 2020-01-07 | 2022-01-24 | Kaluzny Piotr | COB LED lighting lamp cooled by a liquid agent, in particular water |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209149709U (en) * | 2018-11-15 | 2019-07-23 | 英菲森（深圳）光电科技有限公司 | A kind of COB high clear screen with safeguard function |
| CN111760221A (en) * | 2020-06-01 | 2020-10-13 | 吴波 | Fire-retardant device of switch board with isolated air function |
| CN213691269U (en) * | 2020-07-27 | 2021-07-13 | 卓华光电科技集团有限公司 | COB packaging LED display screen based on flip chip technology |
| CN216849981U (en) * | 2022-03-10 | 2022-06-28 | 佛山灏壹光电科技有限公司 | COB packaging structure of high light efficiency |
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