CN116612115B - Bonding wire point compensation method and device, computer equipment and storage medium - Google Patents
Bonding wire point compensation method and device, computer equipment and storage medium Download PDFInfo
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- CN116612115B CN116612115B CN202310877452.7A CN202310877452A CN116612115B CN 116612115 B CN116612115 B CN 116612115B CN 202310877452 A CN202310877452 A CN 202310877452A CN 116612115 B CN116612115 B CN 116612115B
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 141
- 238000010438 heat treatment Methods 0.000 claims abstract description 48
- 238000012360 testing method Methods 0.000 claims description 58
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 238000003754 machining Methods 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 7
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- 239000000463 material Substances 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
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Abstract
The application relates to the technical field of welding, in particular to a method for compensating welding wire points, which comprises the steps of obtaining first compensation parameters of corresponding welding wire grids of the welding wire points on an actual welding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter; obtaining heating parameters of the to-be-welded wire piece on the actual welding wire area, and determining second compensation parameters according to the heating parameters and the thermal expansion coefficients and initial size parameters respectively corresponding to the to-be-welded wire piece; and compensating the position of the bonding wire point according to the first compensation parameter and the second compensation parameter. The application also provides a bonding wire point compensation device, computer equipment and a storage medium. The application effectively improves the position accuracy of the welding line point.
Description
Technical Field
The present application relates to the field of welding technologies, and in particular, to a method and apparatus for compensating a welding point, a computer device, and a storage medium.
Background
Currently, in the field of semiconductor packaging, wire bonding equipment mainly realizes wire bonding of a semiconductor core part through a solder ball bonding mode.
When the solder ball is in the off-set state, the existing solution is to manually correct the position of the solder head by an operator. This correction method has the following drawbacks: 1. only the position to which the solder ball target moves and the position of the solder ball in the image acquired by the vision equipment can be determined to be accurate, whether the specific position of the ball actually welded on the surface of the material is correct or not can not be ensured, and defects such as incapability of real-time correction in the process of welding wires exist only when the correction is carried out by using the wire heads; 2. because the welding wire equipment and the vision equipment generate heat in the continuous operation process and the heating equipment generates heat, the workpiece to be welded is easily heated, expanded and deformed, and the position accuracy of the welding wire point is affected.
Disclosure of Invention
The embodiment of the application provides a method, a device, computer equipment and a storage medium for compensating a bonding wire point, which are used for solving the problem of low position accuracy of the bonding wire point.
In order to solve the above technical problems, an embodiment of the present application provides a method for compensating a bonding wire point, which adopts the following technical scheme:
a bonding wire point compensation method comprises the following steps:
acquiring a first compensation parameter of a corresponding welding wire grid of a welding wire point on an actual welding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter;
obtaining heating parameters of the to-be-welded wire piece on the actual welding wire area, and determining second compensation parameters according to the heating parameters and the thermal expansion coefficients and the initial size parameters respectively corresponding to the to-be-welded wire piece;
and compensating the position of the bonding wire point according to the first compensation parameter and the second compensation parameter.
Further, before the step of obtaining the first compensation parameter of the wire grid corresponding to the wire bonding point on the actual wire bonding area, the method further includes:
acquiring a preset machining precision grade, and determining the dividing number according to the preset machining precision grade;
and dividing the actual welding line areas equally according to the dividing number to obtain a plurality of welding line grids.
Further, after the step of equally dividing the actual bonding wire areas according to the dividing number to obtain a plurality of bonding wire grids, the method further includes:
marking each bonding wire grid according to a preset marking rule to obtain an identification number corresponding to each bonding wire grid;
the step of obtaining the first compensation parameter of the bonding wire grid corresponding to the bonding wire point on the actual bonding wire area comprises the following steps:
taking the identification number of the welding wire lattice corresponding to the welding wire point in the actual welding wire area as a target identification number;
and acquiring a first compensation parameter corresponding to the target identification number.
Further, the actual welding line area is arranged on the carrier; the step of obtaining the heating parameters of the piece to be welded on the actual welding line area comprises the following steps:
acquiring the current temperature of the carrier as an initial temperature parameter, and continuously acquiring the heating temperature of the carrier as a latest temperature parameter;
and calculating a parameter difference between the initial temperature parameter and the latest temperature parameter to obtain the heating parameter.
Further, before the step of determining the second compensation parameter according to the heating parameter and the thermal expansion coefficient and the initial dimension parameter corresponding to the piece to be bonded, the method further includes:
acquiring a test temperature set; wherein the test temperature set comprises at least two test temperature parameters;
according to each test temperature parameter, heating the to-be-welded wire piece, and calibrating the welding wire head at the test temperature parameter to obtain test calibration parameters corresponding to the welding wire head in different test temperature parameters;
fitting is carried out according to the test temperature parameters and the test calibration parameters, and the thermal expansion coefficient corresponding to the piece to be welded is obtained.
Further, the second compensation parameter is determined by the following formula:
；
wherein ,for the second compensation parameter, +.>For the thermal expansion coefficient, +.>As a function of the parameters of the initial dimensions,is the heating parameter.
Further, after the step of compensating the position of the bonding wire point according to the first compensation parameter and the second compensation parameter, the method further includes:
acquiring a solder ball image of the solder wire point, and extracting the center coordinates of the solder ball in the solder ball image;
if the circle center coordinates are equal to the preset circle center coordinates, determining that the solder balls are not eccentrically welded;
if the circle center coordinates are not equal to the preset circle center coordinates, calculating coordinate difference parameters of the circle center coordinates and the preset circle center coordinates, and compensating the positions of the welding line points according to the coordinate difference parameters.
In order to solve the technical problems, the embodiment of the application also provides a bonding wire point compensating device, which adopts the following technical scheme:
a wire bond point compensation device, comprising:
the first acquisition module is used for acquiring first compensation parameters of the corresponding welding wire grids of the welding wire points on the actual welding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter;
the first determining module is used for obtaining heating parameters of the to-be-welded wire piece on the actual welding wire area, and determining second compensation parameters according to the heating parameters and the thermal expansion coefficients and the initial size parameters respectively corresponding to the to-be-welded wire piece;
the first compensation module is used for compensating the position of the welding line point according to the first compensation parameter and the second compensation parameter.
In order to solve the above technical problems, the embodiment of the present application further provides a computer device, which adopts the following technical schemes:
a computer device comprising a memory and a processor, the memory having stored therein a computer program, the processor when executing the computer program implementing the steps of the wire bonding point compensation method as described above.
In order to solve the above technical problems, an embodiment of the present application further provides a computer readable storage medium, which adopts the following technical schemes:
a computer readable storage medium having stored thereon a computer program which when executed by a processor implements the steps of a wire bonding point compensation method as described above.
Compared with the prior art, the embodiment of the application has the following main beneficial effects: acquiring a first compensation parameter of a welding wire grid corresponding to a welding wire point on an actual welding wire area, acquiring a heating parameter of a piece to be welded on the actual welding wire area, and determining a second compensation parameter according to the heating parameter and a thermal expansion coefficient and an initial size parameter respectively corresponding to the piece to be welded so as to compensate the position of the welding wire point according to the first compensation parameter and the second compensation parameter; therefore, the first compensation parameter is used for correcting the deviation of the relative positions of the welding line points and the welding line grid, and the second compensation parameter is used for correcting the deviation of the relative positions of the workpiece to be welded and the welding line points due to the thermal expansion phenomenon of the workpiece to be welded at different temperatures, so that the accuracy of the positions of the welding line points is further improved.
Drawings
In order to more clearly illustrate the solution of the present application, a brief description will be given below of the drawings required for the description of the embodiments of the present application, it being apparent that the drawings in the following description are some embodiments of the present application, and that other drawings may be obtained from these drawings without the exercise of inventive effort for a person of ordinary skill in the art.
FIG. 1 is an exemplary system architecture diagram in which the present application may be applied;
FIG. 2 is a flow chart of one embodiment of a wire bonding point compensation method according to the present application;
FIG. 3 is a schematic diagram showing the arrangement of the bonding wires in the bonding wire region according to the bonding wire point compensation method of the present application;
FIG. 4 is a schematic diagram showing the arrangement of the bonding wires in the bonding wire region according to the bonding wire point compensation method of the present application;
FIG. 5 is a schematic diagram showing the bonding wire cells in the bonding wire region in a row-by-row order in the bonding wire point compensation method according to the present application;
FIG. 6 is a schematic diagram of an embodiment of a wire bonding point compensation device according to the present application;
FIG. 7 is a schematic diagram of an embodiment of a computer device in accordance with the application.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In order to make the person skilled in the art better understand the solution of the present application, the technical solution of the embodiment of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, a system architecture 100 may include terminal devices 101, 102, 103, a network 104, and a server 105. The network 104 is used as a medium to provide communication links between the terminal devices 101, 102, 103 and the server 105. The network 104 may include various connection types, such as wired, wireless communication links, or fiber optic cables, among others.
The user may interact with the server 105 via the network 104 using the terminal devices 101, 102, 103 to receive or send messages or the like. Various communication client applications, such as a web browser application, a shopping class application, a search class application, an instant messaging tool, a mailbox client, social platform software, etc., may be installed on the terminal devices 101, 102, 103.
The terminal devices 101, 102, 103 may be various electronic devices having a display screen and supporting web browsing, including but not limited to smartphones, tablet computers, electronic book readers, MP3 players (Moving Picture Experts Group Audio Layer III, dynamic video expert compression standard audio plane 3), MP4 (Moving Picture Experts Group Audio Layer IV, dynamic video expert compression standard audio plane 4) players, laptop and desktop computers, and the like.
The server 105 may be a server providing various services, such as a background server providing support for pages displayed on the terminal devices 101, 102, 103.
It should be noted that, the method for compensating the bonding wire point provided by the embodiment of the present application is generally executed by a server/terminal device, and accordingly, the bonding wire point compensating device is generally disposed in the server/terminal device.
It should be understood that the number of terminal devices, networks and servers in fig. 1 is merely illustrative. There may be any number of terminal devices, networks, and servers, as desired for implementation.
With continued reference to fig. 2, a flow chart of one embodiment of a method of wire bonding point compensation according to the present application is shown. The bonding wire point compensation method comprises the following steps:
step S210, obtaining a first compensation parameter of a corresponding bonding wire grid of a bonding wire point on an actual bonding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter.
In this step, the electronic device (e.g., the server/terminal device shown in fig. 1) on which the wire bonding point compensation method operates may obtain the first compensation parameter of the wire bonding grid corresponding to the wire bonding point on the actual wire bonding area through a wired connection manner or a wireless connection manner. It should be noted that the wireless connection may include, but is not limited to, 3G/4G connections, wiFi connections, bluetooth connections, wiMAX connections, zigbee connections, UWB (ultra wideband) connections, and other now known or later developed wireless connection means.
In the step, the position of the welding wire head is adjusted to change the position of the welding wire point corresponding to the welding wire head; it is understood that the positions corresponding to each bonding wire grid are different, and the bonding wire heads can be controlled to move according to the positions of the bonding wire grids in the actual bonding wire area, so that the bonding wire grids corresponding to the bonding wire points on the actual bonding wire area are changed.
In this step, each bonding wire grid corresponds to a first compensation parameter, so that when the bonding wire point corresponds to any bonding wire grid in the actual bonding wire area, the position of the bonding wire point is compensated in a targeted manner by the first compensation parameter of the bonding wire grid, thereby improving the accuracy of the position of the bonding wire point.
In some embodiments, the bonding wire head may be a ceramic nozzle, and the ceramic nozzle is mounted on the bonding wire apparatus.
In some embodiments, each wire grid corresponds to a coordinate parameter, which is used as an actual position parameter of the wire grid; the preset calibration parameter is a distance between the welding wire head and the visual recognition device, that is, the preset calibration parameter is a Bond Tip Offset (BTO) parameter.
The method comprises the steps of firstly, calibrating a welding wire head to obtain preset calibration parameters; for example, by controlling the wire bonding head to move to the target position and controlling the wire bonding head to perform dotting on the carrier formed with the actual wire bonding area, a base point is formed, the coordinate parameter of the target position is determined as the coordinate parameter of the base point, and then the difference between the coordinate parameter of the vision equipment when aligning the reference point and the coordinate parameter of the base point is used as the offset distance parameter of the wire bonding point.
In some embodiments, a center point of the wire grid may be used as a locating point, or a corner point of the wire grid may be used as a locating point, and a coordinate parameter corresponding to the locating point may be used as an actual position parameter.
Step 220, obtaining a heating parameter of the piece to be welded on the actual welding line area, and determining a second compensation parameter according to the heating parameter and the thermal expansion coefficient and the initial size parameter respectively corresponding to the piece to be welded.
In this step, the thermal expansion coefficient is the expansion degree of the piece to be bonded under the influence of temperature change.
In the same welding wire piece, the thermal expansion coefficient is the same as the initial size parameter, and the second compensation parameters corresponding to different heating parameters are different.
In different wire bonding members, the thermal expansion coefficients and/or initial dimensional parameters of the different wire bonding members may be different; correspondingly, under the same heating parameter, the second compensation parameters corresponding to different parts to be welded can be the same or different.
In the step, the expansion degree of the different parts to be welded subjected to temperature change is represented by the thermal expansion coefficient, and the second compensation parameters are respectively corresponding to the different parts to be welded to different expansion degrees based on the difference of the thermal expansion of the parts to be welded in different heating parameters, so that the accuracy of the compensation of the welding points is improved.
And step 230, compensating the position of the bonding wire point according to the first compensation parameter and the second compensation parameter.
In the step, the deviation of the relative positions of the welding line points and the welding line lattice is corrected by using the first compensation parameter, and the deviation of the relative positions of the parts to be welded and the welding line points caused by the thermal expansion phenomenon of the parts to be welded at different temperatures is corrected by using the second compensation parameter, so that the accuracy of the positions of the welding line points is further improved, and the unqualified material loss of the welding line of the parts to be welded due to the partial welding is avoided.
In this step, after the first compensation parameter and the second compensation parameter are obtained respectively, the sum of the first compensation parameter and the second compensation parameter is calculated, and the position of the welding line point is compensated by using the sum, so that the compensation efficiency of the position of the welding line point can be improved.
In some optional implementations, step S210, before the step of obtaining the first compensation parameter of the wire grid corresponding to the wire bonding point on the actual wire bonding area, further includes:
step S211, obtaining a preset machining precision grade, and determining the dividing number according to the preset machining precision grade.
In this step, the number of divisions corresponding to different preset machining precision levels is different. For example, the preset machining precision grade is divided into a first grade, a second grade and a third grade, and the number of divisions is increased along with the increase of the preset machining precision grade; if the number of divisions corresponding to the first-stage preset machining precision level is 10, the number of divisions corresponding to the second-stage preset machining precision level is 20, and the number of divisions corresponding to the first-stage preset machining precision level is 30.
And step S212, dividing the actual welding line areas according to the dividing number to obtain a plurality of welding line grids.
In some embodiments, the actual bonding wire areas may be divided according to the dividing number in an equal manner, so as to obtain a plurality of bonding wire grids with equal sizes, and the greater the number of bonding wire grids, the higher the accuracy of the positions of the bonding wire points, so as to improve the dividing efficiency.
For example, the actual bonding wire area is 1×1 square, and the number of the bonding wire areas is 20, and the size of each bonding wire cell is 5cm×5cm.
In some embodiments, the size of each bonding wire grid can be preset according to the dividing number based on the size of the actual bonding wire area, so as to meet different processing requirements.
In some optional implementations, step S212, after the step of dividing the actual bonding wire area by the dividing number to obtain a plurality of bonding wire grids, further includes:
and step S213, marking each bonding wire grid according to a preset marking rule to obtain an identification number corresponding to each bonding wire grid.
For example, in order to make the person skilled in the art better understand the solution of the present application, the following will illustrate step S213 with reference to the accompanying drawings. Wherein the total number of the identification numbers is N, and N is a positive integer.
(1) Referring to fig. 3, the preset marking rule is from inside to outside; for example, the bonding wire grid selected to be located in the middle in the actual bonding wire area is marked as the identification number 1, and then the remaining bonding wire grids in the actual bonding wire area are marked sequentially around the bonding wire grid with the identification number 1 along the clockwise or anticlockwise direction, so as to obtain bonding wire grids corresponding to the identification numbers 2, 3, 4 and 5 … … N respectively.
(2) Referring to fig. 4, the preset marking rule is to mark column by column; for example, the leftmost or rightmost column is taken as the starting column, each bonding wire grid in the starting column is marked sequentially from top to bottom, and the identification numbers of the remaining bonding wire grids in the actual bonding wire area are marked sequentially in a pushing manner, so that the bonding wire grids respectively corresponding to the identification numbers 1, 2, 3, 4 and 5 … … N are obtained.
Similarly, the bonding wire grids in the actual bonding wire area can be marked from bottom to top or marked by marking the bonding wire grids in the middle first and then marking the bonding wire grids above and below the bonding wire grid in the middle alternately.
(3) Referring to fig. 5, the preset marking rule is a line-by-line marking; for example, the uppermost or the lowermost row is taken as the initial row, each bonding wire grid in the initial row is marked in sequence from left to right, and the identification numbers of the remaining bonding wire grids in the actual bonding wire area are marked in sequence in a pushing manner, so that the bonding wire grids respectively corresponding to the identification numbers 1, 2, 3, 4 and 5 … … N are obtained.
Similarly, the bonding wire grids in the actual bonding wire area can be marked from right to left or marked first by marking the bonding wire grid in the middle of the row and then marking the bonding wire grid on the left and right of the bonding wire grid in the middle in a staggered manner.
In the step S210, the step of obtaining the first compensation parameter of the wire grid corresponding to the wire bonding point on the actual wire bonding area includes:
step S214, taking the identification number of the wire bonding grid corresponding to the wire bonding point in the actual wire bonding area as a target identification number;
step S215, acquiring a first compensation parameter corresponding to the target identification number.
In the step S214 and the step S215, each bonding wire grid on the actual bonding wire area corresponds to an identification number; at the beginning, the first compensation parameters corresponding to each welding wire grid are respectively determined, and the first compensation parameters corresponding to each welding wire grid are associated with the identification numbers, so that the first compensation parameters associated with the welding wire grid can be called according to the identification numbers.
In some optional implementations, the actual bonding wire region is disposed on a carrier; in the step S220, the step of obtaining the heating parameter of the workpiece to be bonded on the actual bonding wire area includes:
step S221, obtaining the current temperature of the carrier as an initial temperature parameter, and continuously obtaining the heating temperature of the carrier as a latest temperature parameter.
In this step, initially, an area formed around the edge of the carrier is used as a maximum bonding wire area, and after a target bonding wire area on the carrier is determined based on the size of the workpiece to be bonded or an operator gives the target bonding wire area on the carrier, a portion where the maximum bonding wire area overlaps the target bonding wire area is used as an actual bonding wire area.
In the step, before heating the carrier, the current temperature of the carrier is measured to be used as an initial temperature parameter; and after the carrier is heated, the temperature of the carrier is monitored in real time, the temperature of the carrier which is monitored latest is used as the latest temperature parameter, and the heating of the carrier is realized by utilizing the principle of heat conduction, so that the workpiece to be welded, which is arranged on the actual welding wire area of the carrier, is heated.
Step S222, calculating a parameter difference between the initial temperature parameter and the latest temperature parameter, to obtain the heating parameter.
In this step, the heating parameter is obtained by calculating the difference between the initial temperature parameter and the latest temperature parameter.
In some optional implementations, the step S220, before the step of determining the second compensation parameter according to the heating parameter and the thermal expansion coefficient and the initial dimension parameter corresponding to the piece to be bonded, further includes:
step S223, acquiring a test temperature set; wherein the set of test temperatures includes at least two test temperature parameters.
In this step, the test temperature parameters in the test temperature set are different, and the more the test temperature parameters in the test temperature set are, the higher the accuracy of fitting in the subsequent step is.
And setting a target temperature parameter of the carrier at the initial stage, and determining a test temperature parameter in the test temperature set based on the target temperature parameter, wherein the target temperature parameter is greater than or equal to the test temperature parameter. The target temperature parameter is, for example, 200 ℃, at which time the test temperature set includes five test temperature parameters of 100 ℃, 125 ℃, 150 ℃, 175 ℃ and 200 ℃.
Step S224, performing heat treatment on the workpiece to be welded according to each of the test temperature parameters, and calibrating the welding wire head at the test temperature parameters to obtain test calibration parameters corresponding to the welding wire head in different test temperature parameters.
In the step, in practical application, the carrier is heated to different test temperature parameters in sequence, so that after the carrier is heated to the corresponding test temperature parameters, calibration treatment is performed on the wire heads again, and test calibration parameters corresponding to the wire heads in the different test temperature parameters are obtained.
And step S225, fitting according to the test temperature parameters and the test calibration parameters to obtain the thermal expansion coefficient corresponding to the piece to be welded.
In the step, the thermal expansion coefficient corresponding to the piece to be welded is determined by predicting the data change trend and rule according to each test temperature parameter and each test calibration parameter in a fitting mode.
The fitting mode of each test temperature parameter and each test calibration parameter comprises, but is not limited to, linear fitting, high-order fitting and the like.
Example: fitting each test temperature parameter and each test calibration parameter in a linear fitting mode, wherein one of the test temperature parameter and the calibration value is taken as an X value, the other is taken as a Y value, the fitting is carried out by each test temperature parameter and each test calibration parameter, and a primary function is utilized:and find +.>Obtaining the thermal expansion coefficient.
In some alternative implementations, step S220 above, the second compensation parameter is determined by the following formula:
；
wherein ,for the second compensation parameter, +.>For the thermal expansion coefficient, +.>As a function of the parameters of the initial dimensions,is the heating parameter.
In some optional implementations, the step S230, after the step of compensating the position of the bonding wire point according to the first compensation parameter and the second compensation parameter, further includes:
step S231, a solder ball image of the solder wire point is obtained, and the center coordinates of the solder ball in the solder ball image are extracted.
In the step, edge extraction is carried out on the solder ball image to obtain a plurality of edge points, continuity detection is carried out on each edge point to detect whether continuity exists between two edge points, and if continuity exists between the two edge points, the edge of the solder ball is formed; and finally, performing circle fitting based on the coordinate parameters corresponding to each edge point to obtain a round model of the solder ball, thereby determining the center coordinates of the round model.
In some embodiments, the coordinate parameters corresponding to each edge point are fitted to a circle by a least square method, so that each parameter of the edge of the solder ball when the circle equation is fitted to the edge of the solder ball can be obtained, that is, the parameters such as the center coordinate and radius of the circle model of the solder ball are obtained, that is, the center coordinate of the solder ball is obtained.
Step S232, if the center coordinates are equal to the preset center coordinates, determining that the welding line point is not biased.
Step S233, if the center coordinates are not equal to the preset center coordinates, calculating a coordinate difference parameter between the center coordinates and the preset center coordinates as a third compensation parameter, and compensating the position of the welding line point with the third compensation parameter.
In step S232 and step S233, if the center coordinates are equal to the preset center coordinates, determining that the first compensation parameter and the second compensation parameter have corrected the positions of the welding line points, and further determining that the welding line points are not offset, if the center coordinates are not equal to the preset center coordinates, determining that the welding line points are offset, calculating the coordinate difference parameter between the preset center coordinates and the center coordinates of the solder balls as a third compensation parameter, and compensating the positions of the welding line points.
Therefore, after the first compensation parameter and the second compensation parameter are utilized to compensate the welding line point, whether the welding ball is eccentrically welded or not is judged in real time in the actual welding line based on the circle center coordinates of the welding ball and the preset circle center coordinates, so that the position accuracy of the welding line point is further improved, and the requirement for correcting the position of the welding line point in real time is met.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored in a computer-readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. The storage medium may be a nonvolatile storage medium such as a magnetic disk, an optical disk, a Read-Only Memory (ROM), or a random access Memory (Random Access Memory, RAM).
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
With further reference to fig. 6, as an implementation of the method shown in fig. 2, the present application provides an embodiment of a wire bonding point compensation device, which corresponds to the method embodiment shown in fig. 2, and which is particularly applicable to various electronic devices.
As shown in fig. 6, the bonding wire point compensating device 300 according to the present embodiment includes: a first acquisition module 301, a first determination module 302 and a first compensation module 303. Wherein:
the first obtaining module 301 is configured to obtain a first compensation parameter of a wire bonding grid corresponding to a wire bonding point on an actual wire bonding area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter;
the first determining module 302 is configured to obtain a heating parameter for a piece to be welded on the actual welding wire area, and determine a second compensation parameter according to the heating parameter and a thermal expansion coefficient and an initial size parameter corresponding to the piece to be welded respectively;
the first compensation module 303 is configured to compensate the position of the bonding wire point according to the first compensation parameter and the second compensation parameter.
And correcting the deviation of the relative positions of the welding wire points and the welding wire grid by using the first compensation parameters, and correcting the deviation of the relative positions of the parts to be welded and the welding wire points due to the thermal expansion phenomenon of the parts to be welded at different temperatures by using the second compensation parameters, so that the accuracy of the positions of the welding wire points is further improved.
In some optional implementations, the wire-bonding point compensation device 300 further includes a second determining module and a dividing module. Wherein:
the second determining module is used for obtaining a preset machining precision grade and determining the dividing number according to the preset machining precision grade;
the dividing module is used for dividing the actual welding wire areas according to the dividing number to obtain a plurality of welding wire grids.
In some alternative implementations, the wire point compensation device 300 further includes a marking module. Wherein:
and the marking module is used for marking each bonding wire grid according to a preset marking rule to obtain the corresponding identification number of each bonding wire grid.
In some alternative implementations, the first acquisition module 301 includes a determination sub-module and a first acquisition sub-module. Wherein:
the determining submodule is used for taking the identification number of the welding wire lattice corresponding to the welding wire point in the actual welding wire area as a target identification number;
and the first acquisition sub-module is used for acquiring the first compensation parameter corresponding to the target identification number.
In some optional implementations, the actual bonding wire region is disposed on a carrier; the first determining module 302 includes a second acquiring sub-module and a first calculating sub-module. Wherein:
the second acquisition sub-module is used for acquiring the current temperature of the carrier as an initial temperature parameter and continuously acquiring the heating temperature of the carrier as a latest temperature parameter;
and the first calculation sub-module is used for calculating the parameter difference between the initial temperature parameter and the latest temperature parameter to obtain the heating parameter.
In some optional implementations, the wire-bonding point compensation device 300 further includes a second acquisition module, a calibration module, and a fitting module. Wherein:
the second acquisition module is used for acquiring a test temperature set; wherein the test temperature set comprises at least two test temperature parameters;
the calibration module is used for respectively carrying out heating treatment on the to-be-welded wire piece according to each test temperature parameter, and calibrating the welding wire head at the test temperature parameter to obtain test calibration parameters respectively corresponding to the welding wire head in different test temperature parameters;
and the fitting module is used for fitting according to the test temperature parameters and the test calibration parameters to obtain the thermal expansion coefficient corresponding to the piece to be welded.
In some alternative implementations, the first determination module 302 includes a second calculation sub-module. Wherein:
the second calculation sub-module is used for the second compensation parameter according to the formula:calculating to obtain;
wherein ,for the second compensation parameter to be used,/>for the thermal expansion coefficient, +.>As a function of the parameters of the initial dimensions,is the heating parameter.
In some optional implementations, the wire-bonding point compensating device 300 further includes a third obtaining module, a third determining module, and a second compensating module. Wherein:
the third acquisition module is used for acquiring the solder ball image of the solder wire point and extracting the circle center coordinates of the solder ball in the solder ball image;
and the third determining module is used for determining that the welding line point is not biased if the circle center coordinates are equal to the preset circle center coordinates.
And the second compensation module is used for calculating coordinate difference parameters of the circle center coordinates and the preset circle center coordinates as third compensation parameters if the circle center coordinates are not equal to the preset circle center coordinates, and compensating the positions of the welding line points by the third compensation parameters.
In order to solve the technical problems, the embodiment of the application also provides computer equipment. Referring specifically to fig. 7, fig. 7 is a basic structural block diagram of a computer device according to the present embodiment.
The computer device 5 comprises a memory 41, a processor 42, a network interface 43 communicatively connected to each other via a system bus. It should be noted that only the computer device 5 with components 41-43 is shown in the figures, but it should be understood that not all of the illustrated components are required to be implemented and that more or fewer components may be implemented instead. It will be appreciated by those skilled in the art that the computer device herein is a device capable of automatically performing numerical calculations and/or information processing in accordance with predetermined or stored instructions, the hardware of which includes, but is not limited to, microprocessors, application specific integrated circuits (Application Specific Integrated Circuit, ASICs), programmable gate arrays (fields-Programmable Gate Array, FPGAs), digital processors (Digital Signal Processor, DSPs), embedded devices, etc.
The computer equipment can be a desktop computer, a notebook computer, a palm computer, a cloud server and other computing equipment. The computer equipment can perform man-machine interaction with a user through a keyboard, a mouse, a remote controller, a touch pad or voice control equipment and the like.
The memory 41 includes at least one type of readable storage medium including flash memory, hard disk, multimedia card, card memory (e.g., SD or DX memory, etc.), random Access Memory (RAM), static Random Access Memory (SRAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), programmable Read Only Memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the storage 41 may be an internal storage unit of the computer device 5, such as a hard disk or a memory of the computer device 5. In other embodiments, the memory 41 may also be an external storage device of the computer device 5, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash Card (Flash Card) or the like, which are provided on the computer device 5. Of course, the memory 41 may also comprise both an internal memory unit of the computer device 5 and an external memory device. In this embodiment, the memory 41 is typically used to store an operating system and various types of application software installed on the computer device 5, such as program codes of the X method, and the like. Further, the memory 41 may be used to temporarily store various types of data that have been output or are to be output.
The processor 42 may be a central processing unit (Central Processing Unit, CPU), controller, microcontroller, microprocessor, or other data processing chip in some embodiments. The processor 42 is typically used to control the overall operation of the computer device 5. In this embodiment, the processor 42 is configured to execute a program code stored in the memory 41 or process data, such as a program code for executing the wire bonding point compensation method.
The network interface 43 may comprise a wireless network interface or a wired network interface, which network interface 43 is typically used for establishing a communication connection between the computer device 5 and other electronic devices.
And correcting the deviation of the relative positions of the welding wire points and the welding wire grid by using the first compensation parameters, and correcting the deviation of the relative positions of the parts to be welded and the welding wire points due to the thermal expansion phenomenon of the parts to be welded at different temperatures by using the second compensation parameters, so that the accuracy of the positions of the welding wire points is further improved.
The present application also provides another embodiment, namely, a computer readable storage medium storing a wire bonding point compensation program, where the wire bonding point compensation program is executable by at least one processor, so that the at least one processor performs the steps of the wire bonding point compensation method as described above.
And correcting the deviation of the relative positions of the welding wire points and the welding wire grid by using the first compensation parameters, and correcting the deviation of the relative positions of the parts to be welded and the welding wire points due to the thermal expansion phenomenon of the parts to be welded at different temperatures by using the second compensation parameters, so that the accuracy of the positions of the welding wire points is further improved.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present application.
It is apparent that the above-described embodiments are only some embodiments of the present application, but not all embodiments, and the preferred embodiments of the present application are shown in the drawings, which do not limit the scope of the patent claims. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the scope of the application.
Claims (8)
1. The bonding wire point compensation method is characterized by comprising the following steps of:
acquiring a first compensation parameter of a corresponding welding wire grid of a welding wire point on an actual welding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter;
obtaining heating parameters of the to-be-welded wire piece on the actual welding wire area, and determining second compensation parameters according to the heating parameters and the thermal expansion coefficients and the initial size parameters respectively corresponding to the to-be-welded wire piece;
compensating the position of the welding line point according to the first compensation parameter and the second compensation parameter;
wherein, the actual welding wire area is arranged on the carrier; the step of obtaining the heating parameters of the piece to be welded on the actual welding line area comprises the following steps:
acquiring the current temperature of the carrier as an initial temperature parameter, and continuously acquiring the heating temperature of the carrier as a latest temperature parameter;
calculating a parameter difference between the initial temperature parameter and the latest temperature parameter to obtain the heating parameter;
wherein the second compensation parameter is determined by the following formula:；
wherein ,for the second compensation parameter, +.>For the thermal expansion coefficient, +.>For the initial size parameter,/a>Is the heating parameter.
2. The wire bonding point compensation method according to claim 1, further comprising, prior to the step of obtaining the first compensation parameter of the wire bonding grid corresponding to the wire bonding point on the actual wire bonding area:
acquiring a preset machining precision grade, and determining the dividing number according to the preset machining precision grade;
and dividing the actual welding line areas according to the dividing number to obtain a plurality of welding line grids.
3. The wire bonding point compensation method according to claim 2, further comprising, after the step of dividing the actual wire bonding area by the dividing number to obtain a plurality of wire bonding grids:
marking each bonding wire grid according to a preset marking rule to obtain an identification number corresponding to each bonding wire grid;
the step of obtaining the first compensation parameter of the bonding wire grid corresponding to the bonding wire point on the actual bonding wire area comprises the following steps:
taking the identification number of the welding wire lattice corresponding to the welding wire point in the actual welding wire area as a target identification number;
and acquiring a first compensation parameter corresponding to the target identification number.
4. A wire bonding point compensation method according to any one of claims 1 to 3, further comprising, prior to the step of determining a second compensation parameter based on the heating parameter and the coefficient of thermal expansion and initial dimensional parameter of the piece to be bonded, respectively:
acquiring a test temperature set; wherein the test temperature set comprises at least two test temperature parameters;
according to each test temperature parameter, heating the to-be-welded wire piece, and calibrating the welding wire head at the test temperature parameter to obtain test calibration parameters corresponding to the welding wire head in different test temperature parameters;
fitting is carried out according to the test temperature parameters and the test calibration parameters, and the thermal expansion coefficient corresponding to the piece to be welded is obtained.
5. A wire bonding point compensation method according to any one of claims 1 to 3, characterized by further comprising, after the step of compensating the position of the wire bonding point according to the first compensation parameter and the second compensation parameter:
acquiring a solder ball image of the solder wire point, and extracting the center coordinates of the solder ball in the solder ball image;
if the circle center coordinates are equal to the preset circle center coordinates, determining that the welding line point is not biased;
if the circle center coordinates are not equal to the preset circle center coordinates, calculating coordinate difference parameters of the circle center coordinates and the preset circle center coordinates as third compensation parameters, and compensating the positions of the welding line points by the third compensation parameters.
6. A wire bonding point compensation device, comprising:
the first acquisition module is used for acquiring first compensation parameters of the corresponding welding wire grids of the welding wire points on the actual welding wire area; the actual welding line area comprises a plurality of welding line grids, and the first compensation parameter is a parameter difference between an actual position parameter of the welding line grid and a preset calibration parameter;
the first determining module is used for obtaining heating parameters of the to-be-welded wire piece on the actual welding wire area, and determining second compensation parameters according to the heating parameters and the thermal expansion coefficients and the initial size parameters respectively corresponding to the to-be-welded wire piece;
the first compensation module is used for compensating the position of the welding line point according to the first compensation parameter and the second compensation parameter;
wherein, the actual welding wire area is arranged on the carrier; the first determining module comprises a second obtaining sub-module and a first calculating sub-module;
the second obtaining submodule is used for obtaining the current temperature of the carrying platform as an initial temperature parameter and continuously obtaining the heating temperature of the carrying platform as a latest temperature parameter;
the first calculation submodule is used for calculating the parameter difference between the initial temperature parameter and the latest temperature parameter to obtain the heating parameter;
wherein the first determination module includes a second calculation sub-module for determining the second compensation parameter by the following formula:；
wherein ,for the second compensation parameter, +.>For the thermal expansion coefficient, +.>For the initial size parameter,/a>Is the heating parameter.
7. A computer device comprising a memory and a processor, the memory having stored therein a computer program, the processor, when executing the computer program, implementing the steps of the wire bonding point compensation method of any one of claims 1 to 5.
8. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon a computer program which, when executed by a processor, implements the steps of the wire bonding point compensation method of any of claims 1 to 5.
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