CN116611465A - Manufacturing method and equipment of electronic tag - Google Patents

Manufacturing method and equipment of electronic tag Download PDF

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Publication number
CN116611465A
CN116611465A CN202310698527.5A CN202310698527A CN116611465A CN 116611465 A CN116611465 A CN 116611465A CN 202310698527 A CN202310698527 A CN 202310698527A CN 116611465 A CN116611465 A CN 116611465A
Authority
CN
China
Prior art keywords
layer
inlay
manufacturing
holes
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310698527.5A
Other languages
Chinese (zh)
Inventor
黄志铭
施子斌
袁志芳
周建峰
赵云鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN XINDECO IOT TECHNOLOGY Ltd
Original Assignee
XIAMEN XINDECO IOT TECHNOLOGY Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN XINDECO IOT TECHNOLOGY Ltd filed Critical XIAMEN XINDECO IOT TECHNOLOGY Ltd
Priority to CN202310698527.5A priority Critical patent/CN116611465A/en
Publication of CN116611465A publication Critical patent/CN116611465A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

The present invention relates to the field of electronic tags, and in particular, to a method and apparatus for manufacturing an electronic tag. The invention discloses a manufacturing method of an electronic tag, which comprises a bottom paper layer, a middle layer, an Inlay layer and a surface layer which are sequentially laminated from bottom to top, wherein the middle layer is provided with holes, and a chip of the Inlay layer is embedded in the holes, and the manufacturing method comprises the following steps: s1, punching the middle layer on line, and entering a step S2; s2, compounding the punched middle layer with the bottom paper layer to form a two-layer composite material with holes, and entering a step S3; s3, controlling the two layers of composite materials with holes to enable the holes to be aligned with the chips of the Inlay layers and to be composited with the Inlay layers to form three layers of composite materials, and entering step S4; s4, coating a surface layer on the Inlay layer of the three-layer composite material to form a four-layer composite material, and entering a step S5; s5, die cutting, waste discharging and slitting are carried out on the four layers of composite materials, and a product is formed. The invention also discloses a manufacturing device of the electronic tag.

Description

Manufacturing method and equipment of electronic tag
Technical Field
The invention belongs to the field of electronic tags, and particularly relates to a manufacturing method and equipment of an electronic tag.
Background
The RFID electronic tag can play a role in identification, article tracking and information acquisition. At present, the RFID electronic tag is widely applied to various fields such as supermarkets, logistics, production lines and the like as an information carrier of the Internet of things so as to facilitate intelligent management of articles.
The existing RFID electronic tag with a four-layer material structure is composed of two layers of bright white PET materials, an Inlay layer and a bottom paper layer. The middle layer (the bright white PET material) needs to be perforated for placing the chip, so that the problem that printing white spots are not clear due to the fact that bumps are generated at the chip after the Inlay layers are directly compounded is solved.
According to the traditional double-layer material positioning mode, only the position of the chip and the punching hole are required to be positioned by stretching the Inlay layer, but the bonding of the antenna and the chip of the Inlay layer can be possibly damaged by directly stretching the Inlay layer, so that the product performance is affected. Therefore, the electronic tags are mostly manufactured in a secondary processing mode in the market at present. The method comprises the following steps: firstly, printing a black mark on an intermediate layer material and punching; then, cutting the Inlay layer in the same size (without pulling the jump distance), and turning the chip position of the Inlay layer onto the hole; the method is divided into two production procedures, and four layers of materials are compounded. However, this production mode has several problems:
1. the interlayer material requires either off-line processing or off-line printing and punching, resulting in additional off-line processing costs, and the unit price of conventional off-line printing plus punching is high.
2. The outsourcing processing punching working procedure can cause that a certain proportion of punching waste remains on the material, and the quality incoming material is difficult to inspect and the problem that the hole remains is difficult to monitor in the secondary production process of the production line on the material, causes the loss in production.
The same-size cutting (without pulling the jump distance) speed of the Inlay layer can reach 8-10m/min at the highest speed, the daily output of one common domestic device is only 12 ten thousand, and the production efficiency is low.
The same-size cutting (jumping distance is not pulled) process of the Inlay layer has higher requirements on a cutting knife fixture, and a large amount of PET cutting filament residues are easy to exist in the same-size cutting process, so that the appearance quality of a product is affected.
5. The quality problems generated in the compounding process are more, so that the label replacing efficiency of the subsequent process can be affected.
In summary, the production mode has the problems of low efficiency, high cost, unstable quality and the like.
Disclosure of Invention
The present invention is directed to a method for manufacturing an electronic tag, which is used for solving the above-mentioned technical problems.
In order to achieve the above purpose, the invention adopts the following technical scheme: the manufacturing method of the electronic tag comprises a bottom paper layer, a middle layer, an Inlay layer and a surface layer which are sequentially stacked from bottom to top, wherein the middle layer is provided with holes, and chips of the Inlay layer are embedded in the holes, and the manufacturing method comprises the following steps:
s1, punching the middle layer on line, and entering a step S2;
s2, compounding the punched middle layer with the bottom paper layer to form a two-layer composite material with holes, and entering a step S3;
s3, controlling the two layers of composite materials with holes to enable the holes to be aligned with the chips of the Inlay layers and to be composited with the Inlay layers to form three layers of composite materials, and entering step S4;
s4, coating a surface layer on the Inlay layer of the three-layer composite material to form a four-layer composite material, and entering a step S5;
s5, die cutting, waste discharging and slitting are carried out on the four layers of composite materials, and a product is formed.
Further, in step S1, online punching is performed according to the jump distance setting of the Inlay layer.
Furthermore, the middle of the middle is extruded by a carving knife thimble to punch holes.
Further, in step S1, the waste pore material is sucked away by vacuum waste suction.
Further, in step S3, the hole is aligned to the chip of the Inlay layer by detecting Mark points of the hole and the Inlay layer to correspondingly control pulling the two composite layers with the hole.
Further, in step S3, mark points of the hole and the Inlay layer are detected by using a Mark tracking electric eye, respectively.
Further, the middle layer and the surface layer are PET layers.
Further, the middle layer and the surface layer are both bright white PET layers.
Further, the bottom paper layer is a glassine bottom paper layer.
The invention also provides equipment for manufacturing the electronic tag, which is used for implementing the method for manufacturing the electronic tag.
The beneficial technical effects of the invention are as follows:
the middle layer does not need to print Mark black dots, so that the printing cost is saved; the intermediate layer online on-line punching has no extra high processing procedures and processing cost; no quality risks such as perforation residues, printing deviation and the like are brought by the first processing; the same-size composite is adopted, the same-size cutting of an Inlay layer is not needed, the production speed is greatly improved, one cutting procedure is reduced, the loss of the jig is reduced, and the quality risk caused by the same-size cutting process is avoided; the chip position of the Inlay layer is sleeved by controlling to pull the two layers of composite materials with holes, the Inlay layer is not damaged, and the quality of products is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of manufacturing an embodiment of the present invention;
FIG. 2 is an exploded view of an electronic tag according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the product structure after step S1;
FIG. 4 is a schematic diagram of the product structure after step S3;
fig. 5 is a schematic diagram of the product structure after step S5.
Detailed Description
For further illustration of the various embodiments, the invention is provided with the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments and together with the description, serve to explain the principles of the embodiments. With reference to these matters, one of ordinary skill in the art will understand other possible embodiments and advantages of the present invention. The components in the figures are not drawn to scale and like reference numerals are generally used to designate like components.
The invention will now be further described with reference to the drawings and detailed description.
As shown in fig. 1-5, the electronic tag includes a base paper layer 1, an intermediate layer 2, an Inlay layer 3 and a surface layer 4 which are sequentially stacked from bottom to top, the base paper layer 1 and the intermediate layer 2 are adhered and fixed through a first adhesive layer 12, the intermediate layer 2 and the Inlay layer 3 are adhered and fixed through a second adhesive layer 23, the Inlay layer 3 and the surface layer 4 are adhered and fixed through a third adhesive layer 34, the intermediate layer 2 is provided with a hole 21, a chip 31 on the lower surface of the Inlay layer 3 is embedded in the hole 21, correspondingly, the second adhesive layer 23 is provided with a yielding hole 231, and the chip 31 of the Inlay layer 3 is embedded in the hole 21 through the yielding hole 231. The manufacturing method of the electronic tag comprises the following steps:
s1, punching the middle layer 2 on line, and as shown in FIG. 3, entering step S2.
Specifically, a punching mechanism is newly added near the unreeling shaft of the middle layer 2, so that online punching of the composite equipment is realized, off-line processing or outsourcing processing punching is not needed, mark black dots are not needed to be printed, printing cost is saved, and extra high processing procedures and processing cost are avoided. And meanwhile, quality risks brought by processing the printing ink, such as perforation residues, printing deviation and the like, are avoided.
In this embodiment, the punching mechanism is provided with a carving tool thimble, and the middle layer 2 is extruded by the carving tool thimble to punch, so that the structure is simple, the punching is easy, but the punching is not limited to this, and in some embodiments, other existing punching mechanisms can be adopted to punch.
After punching, waste pore materials are sucked away by vacuum waste suction, so that the phenomenon that the waste pore materials remain on the middle layer 2 to influence the product quality is avoided.
In the embodiment, the punching mechanism performs online punching according to the jump distance setting of the Inlay layer 3, and the method is simple in process and easy to realize.
In the present embodiment, the hole 21 is a round hole, but the present invention is not limited thereto, and in some embodiments, the hole 21 may be a square hole.
Preferably, in this embodiment, the upper surface of the middle layer 2 is provided with the adhesive layer 23, and the punching mechanism simultaneously punches the adhesive layer 23 to form the abdication hole 231.
In particular, in this embodiment, the intermediate layer 2 is preferably a bright white PET (polyethylene terephthalate) layer, which has the advantages of excellent physical and mechanical properties in a wide temperature range, excellent electrical insulation, creep resistance, fatigue resistance, abrasion resistance, and dimensional stability, and of course, in some embodiments, the intermediate layer 2 may be made of other materials.
S2, compounding the punched middle layer 2 with the bottom paper layer 1 to form a two-layer composite material 100 with holes, and entering step S3.
Specifically, the upper surface of the bottom paper layer 1 is provided with a glue layer 12, the perforated middle layer 2 and the bottom paper layer 1 are compounded through a compounding roller, and the middle layer 2 and the bottom paper layer 1 are bonded and fixed through the glue layer 12.
In this embodiment, the backing paper layer 1 is preferably, but not limited to, a glassine backing paper layer.
S3, by controlling the two-layer composite material 100 with holes, the holes 21 are aligned with the chips 31 of the Inlay layer 3 and are compounded with the Inlay layer 3 to form a three-layer composite material 200, as shown in FIG. 4, and the step S4 is performed.
The invention adopts the same-size compounding, does not need the cutting of the Inlay layer 3 in the same size, greatly improves the production speed, reduces the loss of the jig because of reducing one cutting procedure, and avoids the quality risk caused by the cutting process in the same size; the two layers of composite materials 100 with holes are controlled to be pulled to cover the chip 31 position of the Inlay layer 3, the Inlay layer 3 is not damaged, and the quality of products is ensured.
Specifically, the hole 21 is aligned with the chip 31 of the Inlay layer 3 by detecting Mark points of the hole 21 and the Inlay layer 3 to control pulling of the two-layer composite layer 100 with the hole 21 accordingly.
In this embodiment, mark points of the hole 21 and the Inlay layer 3 are detected by using the Mark tracking electric eyes, respectively, which has a simple structure, is easy to implement, and has low cost, but is not limited thereto, and in some embodiments, mark points of the hole 21 and the Inlay layer 3 may be detected by using other existing sensors.
S4, coating an upper layer 4 on the Inlay layer 3 of the three-layer composite material 200 to form a four-layer composite material 300, and proceeding to step S5.
In particular, in this embodiment, the surface layer 4 is preferably a bright white PET layer, which has the advantages of excellent physical and mechanical properties in a wide temperature range, excellent electrical insulation, creep resistance, fatigue resistance, abrasion resistance, and dimensional stability, and of course, in some embodiments, the surface layer 4 may be made of other materials.
The lower surface of the surface layer 4 is provided with an adhesive layer 34, and the inlay layer 3 and the surface material 4 are bonded and fixed through the adhesive layer 34.
And S5, die cutting, waste discharging and slitting are carried out on the four-layer composite material 300, and a product is formed as shown in fig. 5.
Specifically, the die cutting, waste discharging and cutting of the four-layer composite material 300 can refer to the existing die cutting, waste discharging and cutting process flow of electronic tag manufacturing, which is not described in detail. The products after die cutting, waste discharge and cutting are collected into coiled products on a finished product collecting roller.
The invention also provides equipment for manufacturing the electronic tag, which is used for implementing the method for manufacturing the electronic tag.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The manufacturing method of the electronic tag comprises a bottom paper layer, a middle layer, an Inlay layer and a surface layer which are sequentially stacked from bottom to top, wherein the middle layer is provided with holes, and chips of the Inlay layer are embedded in the holes, and the manufacturing method is characterized by comprising the following steps:
s1, punching the middle layer on line, and entering a step S2;
s2, compounding the punched middle layer with the bottom paper layer to form a two-layer composite material with holes, and entering a step S3;
s3, controlling the two layers of composite materials with holes to enable the holes to be aligned with the chips of the Inlay layers and to be composited with the Inlay layers to form three layers of composite materials, and entering step S4;
s4, coating a surface layer on the Inlay layer of the three-layer composite material to form a four-layer composite material, and entering a step S5;
s5, die cutting, waste discharging and slitting are carried out on the four layers of composite materials, and a product is formed.
2. The method for manufacturing an electronic tag according to claim 1, wherein: in step S1, online punching is performed according to the jump distance setting of the Inlay layer.
3. The method for manufacturing an electronic tag according to claim 2, wherein: and (5) extruding the middle part by using a carving tool thimble to punch holes.
4. The method for manufacturing an electronic tag according to claim 2, wherein: in the step S1, waste pore materials are sucked away by adopting vacuum waste suction.
5. The method according to claim 1, wherein in step S3, the holes are aligned with the chips of the Inlay layer by detecting Mark points of the holes and the Inlay layer to control pulling of the two composite layers with holes accordingly.
6. The method according to claim 5, wherein in step S3, mark points of the hole and the Inlay layer are detected by using a Mark tracking electric eye, respectively.
7. The method for manufacturing an electronic tag according to claim 1, wherein: the middle layer and the surface layer are PET layers.
8. The method for manufacturing an electronic tag according to claim 7, wherein: the middle layer and the surface layer are both bright white PET layers.
9. The method of manufacturing an electronic label according to claim 1, wherein the base paper layer is a glassine base paper layer.
10. An electronic tag manufacturing apparatus for implementing the electronic tag manufacturing method according to any one of claims 1 to 9.
CN202310698527.5A 2023-06-13 2023-06-13 Manufacturing method and equipment of electronic tag Pending CN116611465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310698527.5A CN116611465A (en) 2023-06-13 2023-06-13 Manufacturing method and equipment of electronic tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310698527.5A CN116611465A (en) 2023-06-13 2023-06-13 Manufacturing method and equipment of electronic tag

Publications (1)

Publication Number Publication Date
CN116611465A true CN116611465A (en) 2023-08-18

Family

ID=87683584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310698527.5A Pending CN116611465A (en) 2023-06-13 2023-06-13 Manufacturing method and equipment of electronic tag

Country Status (1)

Country Link
CN (1) CN116611465A (en)

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