CN116609885A - Full-automatic planar waveguide coupling equipment based on nanoscale perception contact - Google Patents
Full-automatic planar waveguide coupling equipment based on nanoscale perception contact Download PDFInfo
- Publication number
- CN116609885A CN116609885A CN202310592321.4A CN202310592321A CN116609885A CN 116609885 A CN116609885 A CN 116609885A CN 202310592321 A CN202310592321 A CN 202310592321A CN 116609885 A CN116609885 A CN 116609885A
- Authority
- CN
- China
- Prior art keywords
- axis
- input
- output
- theta
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 89
- 238000010168 coupling process Methods 0.000 title claims abstract description 60
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 57
- 230000008447 perception Effects 0.000 title claims description 4
- 230000003287 optical effect Effects 0.000 claims abstract description 38
- 239000000835 fiber Substances 0.000 claims abstract description 28
- 238000006073 displacement reaction Methods 0.000 claims abstract description 27
- 230000033001 locomotion Effects 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 238000005259 measurement Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 description 18
- 238000004891 communication Methods 0.000 description 10
- 230000006872 improvement Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses full-automatic planar waveguide coupling equipment based on nanoscale sensing contact, which comprises a chip placement component, an input component and an output component; the input assembly and the output assembly are respectively connected with a stepping motor in a transmission way; the stepping motor is electrically connected with a driver; the coupling software controls the driver to control the stepping motor to drive the input assembly and the output assembly to carry out displacement in different directions respectively, so that the FA fiber core and the chip waveguide are subjected to mode field matching, the preliminary alignment of the optical waveguide is realized, the coupling software automatically switches the displacement step distance, and the accurate alignment is realized through the input assembly and the output assembly again; the coupling software controls the driver so as to control the step pitch and the movement of the angle stepping motor to realize multichannel equalization; the invention adopts the high-precision stepper motor to be matched with the high-precision sensing contact sensor, fully realizes the full-automatic high-progress coupling of the planar optical waveguide to light, improves the precision of the planar waveguide coupling to light, and fully realizes the high-precision automatic angle adjustment function.
Description
Technical Field
The invention relates to the technical field of coupling equipment, in particular to full-automatic planar waveguide coupling equipment based on nanoscale sensing contact.
Background
With the long-term development of the optical communication technology in China, mobile interconnection and data popularization are fast carried out in China, the communication capacity is also increased, and the optical fiber communication is further developed towards miniaturization and integration. The development of photonic integrated technology and electronic integrated technology is rapid, and the development based on planar optical waveguide technology is more refined and miniaturized. Planar silicon optical technology has been widely used in recent years. Planar waveguides are a very important step in the manufacturing process of optical devices, and input electrical signals or optical signals are precisely aligned with the receiving or transmitting end of a chip, and output signals or optical signals are precisely aligned with the receiving or transmitting end of the chip, which is called optical coupling. At present, the light coupling process is mainly finished by manual debugging or semi-automatic debugging under a microscope, the debugging is long in time consumption, the repeatability and the stability of the debugging are influenced by the skill level of staff, and the individual difference is large. In addition, the light path debugging has higher requirements on the proficiency of operators and the familiarity of equipment, and the training period is long, so that the rapid mass production of optical devices is not facilitated. Therefore, the traditional manual or semi-automatic debugging method is not suitable for coupling light requirements of optical devices with more channels, smaller size and higher precision.
With the rapid development of communication technology and business thereof, the research of a high-capacity optical fiber communication system has great application value. The maximum transmission capacity of the optical fiber obtained so far is only equivalent to 0.24 of its potential capacity. The dense wavelength division and coarse wavelength division multiplexing technology can well excavate the transmission potential of the optical fiber. With the rising of the data center, the demand of optical devices based on planar waveguide silicon optical chips, SPLITTER, AWG, CWDM, CWDM8 and the like is rapidly increased, new requirements are provided for planar waveguide packaging technology, the coupling technology is monopolized by manufacturers such as Japan United states and the like at present, the cost of general equipment is high, the subsequent upgrade maintenance cost is extremely high, the method cannot be applied to industrial manufacturers in China on a large scale, and I have promoted I to develop a novel domestic full-automatic high-precision high-efficiency low-cost coupling based on planar waveguides to meet the market demand of optical equipment.
Orders in the field of digital communication have proliferated in the last two years, and prices have also drastically dropped; the cost is reduced and the weight of each 100G optical module manufacturer is increased; the new material and the new scheme are thousands of times, the AWG scheme is distinguished from the CWDM4/LR4 packaging scheme, and the novel material and the new scheme have larger impact on the traditional diaphragm type CWDM; among the high-speed optical modules, the CWDM product has the highest value except for the laser, and the AWG scheme has the advantages of low batch cost, replicable PLC packaging technology and huge cost advantage in future.
Under the push of Intel and IBM, silicon optical technology is rapidly becoming popular in the data center and supercomputer fields. However, this technology is very difficult to be usefully employed in the consumer industry: the intelligent device and the PC have no more chips, and naturally use the optical signal transmission between chips which are not high and large. New technologies will influence our lives more in an indirect way: the rapid increase of the performance of the cloud computing platform in the future can provide faster and better information service for common users, and one of the ministerial technologies behind the cloud computing platform is the silicon optical technology. Before the semiconductor process reaches the physical limit, revolutionary new computers have not emerged, silicon optical technology will be responsible for filling the gap, extending moore's law as much as possible.
The planar waveguide and the array waveguide device are core photoelectronic devices for supporting the high-speed development of the optical fiber communication in the 21 st century. The coupling encapsulation of the array waveguide device is a manufacturing process for carrying out optical alignment coupling and fixedly connecting on the waveguide chip and the input and output array optical fibers by utilizing a motion platform with full space and 6 degrees of freedom, so as to obtain the complete function of the device. On one hand, the coupling encapsulation of the planar array waveguide device is the optical alignment of submicron positioning precision, full space and multiple channels, and the insufficient alignment precision of any channel can lead to the loss of signal transmission or conversion functions of the array waveguide device, so that the whole device becomes waste; on the other hand, the bonding strength and stress distribution directly determine the additional micro-displacement of the coupling interface and the reliability of the device. The coupling encapsulation of the array waveguide device integrates the related theory and the front edge technology of guided wave optics, integrated optics, control science, micro-machining and material science, is one of key technologies for manufacturing the array waveguide device, and becomes a technical bottleneck for restricting the high-speed development of the integrated optoelectronic device.
Disclosure of Invention
The invention aims to provide full-automatic planar waveguide coupling equipment based on nanoscale sensing contact, which adopts a high-precision stepper motor to be matched with a high-precision sensing contact sensor, so that full-automatic high-progress coupling of planar optical waveguides is realized, the precision of planar waveguide coupling is improved, and a high-precision automatic angle adjusting function is realized.
The invention is realized by the following technical scheme:
a full-automatic planar waveguide coupling device based on nanoscale perception contact comprises a chip placement component, an input component and an output component which are symmetrically arranged left and right; the input assembly and the output assembly are respectively in transmission connection with a stepping motor; wherein: the stepping motor is electrically connected with a driver; the coupling software controls the driver to control the stepping motor to drive the input assembly and the output assembly to carry out displacement in different directions respectively, so that the FA fiber core and the chip waveguide are subjected to mode field matching, the preliminary alignment of the optical waveguide is realized, the coupling software automatically switches the displacement step distance, and the accurate alignment is realized through the input assembly and the output assembly again; the coupling software controls the driver to control the step pitch and movement of the angle stepping motor to realize multichannel equalization.
Further as an improvement of the technical scheme of the invention, the input assembly comprises an input Z axis, an input X axis, an input Y axis, an input theta Z axis, an input theta X axis, an input theta Y axis, an input ranging sensor, an input moving guide rail and an input clamp; the input Z axis is connected with the input X axis; the input X-axis is connected with the input theta Z-axis; the input theta Z axis is connected with the input Y axis; the input Y-axis is connected with the input theta X-axis; the input theta X axis is connected with the input theta Y axis; the input ranging sensor and the input moving guide rail are respectively arranged on the input theta X axis; the input clamp is arranged on the input moving guide rail; the FA fiber core is fixed on the input jig.
Further as an improvement of the technical scheme of the invention, the output assembly comprises an output Z axis, an output X axis, an output Y axis, an output theta Z axis, an output theta X axis, an output theta Y axis, an output ranging sensor, an output movable guide rail and an output clamp; the output Z axis is connected with the output X axis; the output X axis is connected with the output theta Z axis; the output theta Z axis is connected with the output Y axis; the output Y-axis is connected with the output theta X-axis; the output theta X axis is connected with the output theta Y axis; the output ranging sensor and the output movable guide rail are respectively arranged on the output theta X axis; the output clamp is arranged on the output movable guide rail; the FA core is fixed on the output jig.
Further as an improvement of the technical scheme of the invention, the chip placement component comprises a chip clamp and a chip mounting seat; the chip clamp is arranged at the top of the chip mounting seat; the chip is placed on the chip holder.
Further as the improvement of the technical scheme of the invention, the coupling software can control the stepping motor to automatically adjust the angle and the distance between the FA fiber core and the chip, and the thickness of the adhesive layer is precisely controlled by the distance measurement of the input distance measurement sensor and the output distance measurement sensor; and automatically and quickly finding the coupling position between the FA fiber core and the chip by matching the input Z axis, the input X axis, the input Y axis, the output Z axis, the output X axis and the output Y axis with a coupling software algorithm.
Further as an improvement of the technical scheme of the invention, the position distance A between the FA fiber core and the left side of the chip is detected by the displacement of the input theta X axis to the left side, the position distance B between the FA fiber core and the right side of the chip is detected by the displacement of the input theta X axis to the right side, the horizontal position is calculated by the coupling software through the position relation between the A and the B, and the stepping motor drives the input assembly to automatically run to the position parallel to the chip.
Further as an improvement of the technical scheme of the invention, the position distance C between the FA fiber core and the left side of the chip is detected by the displacement of the output theta X axis to the left side, the position distance D between the FA fiber core and the right side of the chip is detected by the displacement of the output theta X axis to the right side, the horizontal position is calculated by the coupling software through the position relation between C and D, and the stepping motor drives the output assembly to automatically run to the position parallel to the chip.
Further as an improvement of the technical scheme of the invention, the stroke of the input Z axis is 30mm; the strokes of the input X axis and the input Y axis are 20mm; the axial strokes of the input theta Z axis, the input theta X axis and the input theta Y axis are all +/-8 degrees.
Further as an improvement of the technical scheme of the invention, the stroke of the output Z axis is 30mm; the strokes of the output X axis and the output Y axis are 20mm; the axial strokes of the output theta Z axis, the output theta X axis and the output theta Y axis are all +/-8 degrees.
Further as an improvement of the technical scheme of the invention, the precision of the input ranging sensor and the output ranging sensor is +/-0.1 um.
The invention has the beneficial effects that:
the invention adopts the high-precision stepper motor to match with the high-precision nanoscale sensing sensor to detect the distance, automatically adjusts the angle precision to +/-1 um through a coupling software algorithm, integrates the angle precision into an automatic focusing platform, realizes high-precision low-cost full-automatic planar waveguide coupling, completely realizes the high-precision automatic angle adjustment function, realizes technical innovation, improves the precision of planar waveguide coupling focusing, and solves the automatic angle adjustment process puzzled by the industry. Compared with the conventional equipment, the visual mode precision is directly improved by 2um, and the silicon optical chip technology coupling completely replaces the expensive equipment abroad to play a key role in the optical communication industry, especially in future laser coupling.
Drawings
FIG. 1 is a schematic plan view of a full-automatic planar waveguide coupling device based on nanoscale perceived contact according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a three-dimensional structure of a full-automatic planar waveguide coupling device based on nanoscale perceived contact according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second three-dimensional structure of a full-automatic planar waveguide coupling device based on nanoscale sensing contact according to an embodiment of the present invention.
In the accompanying drawings: 1-a chip placement assembly; 2-an input assembly; 3-an output assembly; 11-a chip clamp; 12-a chip mount; 21-input Z-axis; 22-input X-axis; 23-input Y-axis; 24-input θZ axis; 25-input θX axis; 26-input θy axis; 27-input ranging sensor; 28-input moving guide rail; 29-input clamps; 31-outputting a Z axis; 32-outputting an X axis; 33-output Y-axis; 34-outputting a theta Z axis; 35-outputting a theta X axis; 36-output θY axis; 37-output ranging sensor; 38-outputting a moving guide rail; 39-output clamps.
Detailed Description
The present invention will now be described in detail with reference to the drawings and the specific embodiments thereof, which are illustrative embodiments and illustrations of the invention, but are not to be construed as limiting the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, back, upper, lower, top, bottom … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicators are correspondingly changed.
In the present invention, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first", "a second" may include at least one such feature, either explicitly or implicitly; in addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
As shown in fig. 1 to 3, a full-automatic planar waveguide coupling device based on nanoscale sensing contact comprises a chip placement component 1, an input component 2 and an output component 3 which are symmetrically arranged left and right; the input assembly 2 and the output assembly 3 are respectively in transmission connection with a stepping motor; wherein: the stepping motor is electrically connected with a driver; the coupling software controls the driver to control the stepping motor to drive the input assembly 2 and the output assembly 3 to carry out displacement in different directions respectively, so that the FA fiber core and the chip waveguide are subjected to mode field matching, the preliminary alignment of the optical waveguide is realized, the coupling software automatically switches the displacement step distance, and the accurate alignment is realized through the input assembly 2 and the output assembly 3 again; the coupling software controls the driver to control the step pitch and movement of the angle stepping motor to realize multichannel equalization.
Specifically, in this embodiment, the input assembly 2 includes an input Z axis 21, an input X axis 22, an input Y axis 23, an input θz axis 24, an input θx axis 25, an input θy axis 26, an input ranging sensor 27, an input moving rail 28, and an input gripper 29; the input Z axis 21 is connected with the input X axis 22; the input X-axis 22 is connected to the input θz-axis 24; the input theta Z axis 24 is connected with the input Y axis 23; the input Y-axis 23 is connected with the input θX-axis 25; the input θX axis 25 is connected to the input θY axis 26; the input distance measuring sensor 27 and the input moving guide rail 28 are respectively installed on the input ox axis 25; the input clamp 29 is mounted on the input moving rail 28; the FA core is fixed to the input jig 29.
Specifically, in this embodiment, the output assembly 3 includes an output Z axis 31, an output X axis 32, an output Y axis 33, an output θz axis 34, an output θx axis 35, an output θy axis 36, an output ranging sensor 37, an output moving rail 38, and an output fixture 39; the output Z axis 31 is connected with the output X axis 32; the output X-axis 32 is connected to the output θZ-axis 34; the output θz axis 34 is connected to the output Y axis 33; the output Y-axis 33 is connected to the output ox-axis 35; the output θx axis 35 is connected to the output θy axis 36; the output distance measuring sensor 37 and the output moving guide 38 are respectively installed on the output θx axis 35; the output clamp 39 is mounted on the output moving rail 38; the FA core is fixed to the output jig 39.
Specifically, in this embodiment, the chip placement module 1 includes a chip fixture 11 and a chip mount 12; the chip clamp 11 is arranged on the top of the chip mounting seat 12; the chip is placed on the chip holder 11. The invention fixes the input FA on the input clamp 29, the chip is fixed on the chip clamp 11, the chip to be coupled is contacted by micro-step displacement of the stepping motor, when the FA contacts the chip, the input moving guide rail 28 is displaced, and the distance of the displacement detected by the input ranging sensor 27 is fed back to the computer coupling software.
Specifically, in the scheme of the embodiment, the coupling software controls the stepping motor to automatically adjust the angle and the distance between the FA fiber core and the chip, and the thickness of the adhesive layer is precisely controlled by the distance measurement of the input distance measurement sensor 27 and the output distance measurement sensor 37; the coupling position between the FA fiber core and the chip is automatically and rapidly found through the matching of the input Z axis 21, the input X axis 22, the input Y axis 23, the output Z axis 31, the output X axis 32 and the output Y axis 33 with a coupling software algorithm.
The invention controls the driver through the coupling software so as to control the movement of various steps of the stepping motor, and the step of displacement is set to be 1um. Firstly, a chip is fixed on a chip clamp 11, and a stepping motor realizes mode field matching between an FA (fiber array) fiber core and a chip waveguide through displacement of an input component 3 and an output component 3 in three different directions (XYZ axes), so that the preliminary alignment of the optical waveguide is realized. After the preliminary alignment is completed, the coupling software automatically switches the displacement step distance to be set to be 0.05um, and the accurate alignment is realized through the displacement XYZ axes again. The coupling software controls the driver to control the step pitch and the movement of the angle stepping motor to realize multichannel equalization, and the specific steps are as follows:
step 1: selecting channels at two ends as channels for detecting optical power, wherein any channel is a center channel of mode field coupling;
step 2: the center channel is aligned by adopting a single-channel mode field coupling method:
step 3: the scanning shaft is used for calculating the extreme value offset of the two channels and the value of the inclination angle S according to the formula; if & less than the given threshold (set to 0.2 m);
step 4: driving a six-dimensional alignment platform, adjusting an angle S, and turning to the step 2;
step 5: stopping.
The coupling software controls the stepping motor to automatically adjust the angle and the distance between the fiber cores of the FA (fiber array) and the chip, and the thickness of the adhesive layer is precisely controlled by ranging through the ranging sensor. And automatically and quickly finding the coupling position between the FA and the chip by the XYZ axis matched with a software algorithm, and automatically optimizing the signal to the optimal state. The whole process personnel only need install the material on the frock clamp of coupling platform, and this equipment carries out the parallel automatic waveguide of automatically regulated and aims at, and is the maximum with the optical power coupling value automatically. The angle is basically calculated through visual photographing in the automatic angle adjustment in the current market, and the highest precision can only achieve +/-3 um. The invention automatically adjusts the angle precision to +/-1 um through a high-precision nanoscale sensing sensor and integrates the angle precision into an automatic focusing platform by a coupling software algorithm, thereby realizing high-precision low-cost full-automatic planar waveguide coupling.
Specifically, in this embodiment, the position distance a between the FA fiber core and the left side of the chip is detected by the displacement of the input ox axis 25 to the left, the position distance B between the FA fiber core and the right side of the chip is detected by the displacement of the input ox axis 25 to the right, the horizontal position is calculated by the coupling software through the position relationship between a and B, and the stepper motor drives the input assembly 2 to automatically run to the position parallel to the chip.
Specifically, in this embodiment, the position distance C between the FA fiber core and the left side of the chip is detected by the displacement of the output θx axis 35 to the left, the position distance D between the FA fiber core and the right side of the chip is detected by the displacement of the output θx axis 35 to the right, the coupling software calculates the horizontal position by the position relationship between C and D, and the stepper motor drives the output assembly 3 to automatically run to the position parallel to the chip. The input assembly 2 automatically scans to the maximum optical power through the input XY axis, and the output assembly 3 automatically scans to the maximum optical power through the output XY axis.
Specifically, in this embodiment, the stroke of the input Z axis 21 is 30mm; the strokes of the input X axis 22 and the input Y axis 23 are 20mm; the axial strokes of the input theta Z axis 24, the input theta X axis 25 and the input theta Y axis 26 are all +/-8 degrees.
Specifically, in this embodiment, the stroke of the output Z axis 31 is 30mm; the strokes of the output X axis 32 and the output Y axis 33 are 20mm; the axial strokes of the output θz axis 34, the output θx axis 35, and the output θy axis 36 are all ±8°.
Specifically, in this embodiment, the accuracy of the input ranging sensor 27 and the output ranging sensor 37 is ±0.1um.
The invention is a set of full-automatic coupling system for realizing full-automatic coupling light and nano-level position measurement, thereby ensuring the coupling precision requirement. The invention discloses a butt coupling method of a planar waveguide device, and judges whether a stepping motor stays at an optimal position or not by monitoring loss in optical waveguide coupling. Firstly, an analog quantity control structure is adopted on a hardware circuit, the PD is used for collecting optical power and feeding back software to control the motor to move, so that the XYZ-direction positioning is realized, and the automatic adjustment of the angle in the theta XYZ-direction is realized. The mechanical structure is characterized in that the motor is connected with the motor through a tool clamp, the clamp ensures the rotation and rotation center point of an optical axis, and the coupling clamp is designed according to the positions and the sizes of devices and proximity sensors.
The device of the invention has the following advanced characteristics: (1) unattended full-automatic coupling; (2) high system stability and repeatability; (3) the thickness error of the adhesive layer is within 1 um; (4) single device coupling time is within 60 seconds; (5) automatic angle calibration; (6) automatic UV curing; and (7) automatically feeding back abnormal state alarm.
The invention has the beneficial effects that:
the invention adopts the high-precision stepper motor to match with the high-precision nanoscale sensing sensor to detect the distance, automatically adjusts the angle precision to +/-1 um through a coupling software algorithm, integrates the angle precision into an automatic focusing platform, realizes high-precision low-cost full-automatic planar waveguide coupling, completely realizes the high-precision automatic angle adjustment function, realizes technical innovation, improves the precision of planar waveguide coupling focusing, and solves the automatic angle adjustment process puzzled by the industry. Compared with the conventional equipment, the visual mode precision is directly improved by 2um, and the silicon optical chip technology coupling completely replaces the expensive equipment abroad to play a key role in the optical communication industry, especially in future laser coupling.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (10)
1. A full-automatic planar waveguide coupling device based on nanoscale perception contact comprises a chip placement component, an input component and an output component which are symmetrically arranged left and right; the input assembly and the output assembly are respectively in transmission connection with a stepping motor; the method is characterized in that: the stepping motor is electrically connected with a driver; the coupling software controls the driver to control the stepping motor to drive the input assembly and the output assembly to carry out displacement in different directions respectively, so that the FA fiber core and the chip waveguide are subjected to mode field matching, the preliminary alignment of the optical waveguide is realized, the coupling software automatically switches the displacement step distance, and the accurate alignment is realized through the input assembly and the output assembly again; the coupling software controls the driver to control the step pitch and movement of the angle stepping motor to realize multichannel equalization.
2. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 1, wherein: the input assembly comprises an input Z axis, an input X axis, an input Y axis, an input theta Z axis, an input theta X axis, an input theta Y axis, an input ranging sensor, an input movable guide rail and an input clamp; the input Z axis is connected with the input X axis; the input X-axis is connected with the input theta Z-axis; the input theta Z axis is connected with the input Y axis; the input Y-axis is connected with the input theta X-axis; the input theta X axis is connected with the input theta Y axis; the input ranging sensor and the input moving guide rail are respectively arranged on the input theta X axis; the input clamp is arranged on the input moving guide rail; the FA fiber core is fixed on the input jig.
3. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 1, wherein: the output assembly comprises an output Z axis, an output X axis, an output Y axis, an output theta Z axis, an output theta X axis, an output theta Y axis, an output ranging sensor, an output movable guide rail and an output clamp; the output Z axis is connected with the output X axis; the output X axis is connected with the output theta Z axis; the output theta Z axis is connected with the output Y axis; the output Y-axis is connected with the output theta X-axis; the output theta X axis is connected with the output theta Y axis; the output ranging sensor and the output movable guide rail are respectively arranged on the output theta X axis; the output clamp is arranged on the output movable guide rail; the FA core is fixed on the output jig.
4. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 1, wherein: the chip placement component comprises a chip clamp and a chip mounting seat; the chip clamp is arranged at the top of the chip mounting seat; the chip is placed on the chip holder.
5. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 1, wherein: the coupling software controls the stepping motor to automatically adjust the angle and the distance between the FA fiber core and the chip, and the thickness of the adhesive layer is accurately controlled through the distance measurement of the input distance measurement sensor and the output distance measurement sensor; and automatically and quickly finding the coupling position between the FA fiber core and the chip by matching the input Z axis, the input X axis, the input Y axis, the output Z axis, the output X axis and the output Y axis with a coupling software algorithm.
6. The fully automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 5, wherein: and detecting the position distance A between the FA fiber core and the left side of the chip by the displacement of the input theta X axis to the left side, detecting the position distance B between the FA fiber core and the right side of the chip by the displacement of the input theta X axis to the right side, calculating the horizontal position by the coupling software through the position relation between the A and the B, and driving the input assembly to automatically run to the position parallel to the chip by the stepping motor.
7. The fully automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 5, wherein: and detecting the position distance C between the FA fiber core and the left side of the chip by the displacement of the output theta X axis to the left side, detecting the position distance D between the FA fiber core and the right side of the chip by the displacement of the output theta X axis to the right side, calculating the horizontal position by coupling software through the position relation between C and D, and driving the output assembly to automatically run to the position parallel to the chip by a stepping motor.
8. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 2, wherein: the stroke of the input Z axis is 30mm; the strokes of the input X axis and the input Y axis are 20mm; the axial strokes of the input theta Z axis, the input theta X axis and the input theta Y axis are all +/-8 degrees.
9. The full-automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 8, wherein: the stroke of the output Z axis is 30mm; the strokes of the output X axis and the output Y axis are 20mm; the axial strokes of the output theta Z axis, the output theta X axis and the output theta Y axis are all +/-8 degrees.
10. The fully automatic planar waveguide coupling apparatus based on nanoscale perceived contact of claim 9, wherein: the accuracy of the input ranging sensor and the accuracy of the output ranging sensor are +/-0.1 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310592321.4A CN116609885A (en) | 2023-05-24 | 2023-05-24 | Full-automatic planar waveguide coupling equipment based on nanoscale perception contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310592321.4A CN116609885A (en) | 2023-05-24 | 2023-05-24 | Full-automatic planar waveguide coupling equipment based on nanoscale perception contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116609885A true CN116609885A (en) | 2023-08-18 |
Family
ID=87674278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310592321.4A Pending CN116609885A (en) | 2023-05-24 | 2023-05-24 | Full-automatic planar waveguide coupling equipment based on nanoscale perception contact |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116609885A (en) |
-
2023
- 2023-05-24 CN CN202310592321.4A patent/CN116609885A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7612881B2 (en) | Method of alignment of an optical module and an optical module using thereof | |
| CN109683082B (en) | Test system and test method for optical chip | |
| US20160246014A1 (en) | Optical transmission and receiving device for implementing passive alignment of components and method for passively aligning components | |
| JP2017521696A (en) | Multi-channel optical receiver module and optical alignment method for multi-channel optical receiver module | |
| US6356688B2 (en) | Alignment of optical building elements | |
| CN1380987A (en) | Method and device for passive alignment | |
| CN205263364U (en) | Optical module passive coupling alignment device | |
| CN116609885A (en) | Full-automatic planar waveguide coupling equipment based on nanoscale perception contact | |
| CN208156255U (en) | Based on slab guide to Light coupling devices | |
| US7325981B2 (en) | Optical module, mounting method of the same and optical system having optical module mounted on substrate | |
| Noriki et al. | Self-aligned optical connector assembly on polymer waveguide integrated package substrate for co-packaged optics | |
| Betschon et al. | Mass production of planar polymer waveguides and their applications | |
| CN116577883A (en) | Single-tube tail fiber tube penetrating machine device and method | |
| JP2011048020A (en) | Method of mounting guide member of optical fiber, mounting device using the same, and guide member of optical fiber | |
| EP2031427B1 (en) | Optical terminal | |
| JP2017198778A (en) | Optical wiring packaging structure, optical module, and electronic apparatus | |
| CN216285839U (en) | Photon chip and coupling device | |
| CN111443442B (en) | Coupling device and method for SNSPD array and optical waveguide array | |
| US11675136B2 (en) | Optoelectronic structure | |
| CN207798378U (en) | A kind of Manifold Light Way test equipment driving optical detector using lead screw motor | |
| Holland et al. | Optical fiber circuits | |
| CN109541746B (en) | Optical wavelength division multiplexer and preparation method thereof | |
| CN111707400A (en) | Optical fiber cutting knife tensile force calibrating device | |
| KR100659587B1 (en) | Optical triplex transceiver module and a method for manufacturing the same | |
| KR102535603B1 (en) | Optical module platform structure and fabrication method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |