CN116599475A - Partition overheat protection method, device and system for automobile power amplifier - Google Patents
Partition overheat protection method, device and system for automobile power amplifier Download PDFInfo
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- CN116599475A CN116599475A CN202310872440.5A CN202310872440A CN116599475A CN 116599475 A CN116599475 A CN 116599475A CN 202310872440 A CN202310872440 A CN 202310872440A CN 116599475 A CN116599475 A CN 116599475A
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- 238000005192 partition Methods 0.000 title claims abstract description 261
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000003321 amplification Effects 0.000 claims description 130
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 130
- 238000010438 heat treatment Methods 0.000 claims description 91
- 239000003990 capacitor Substances 0.000 claims description 71
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 238000012545 processing Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/52—Circuit arrangements for protecting such amplifiers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
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Abstract
The application relates to the technical field of signal processing of an automobile power amplifier, and provides a partition overheat protection method, device and system of the automobile power amplifier.
Description
Technical Field
The application belongs to the technical field of signal processing of an automobile power amplifier, and particularly relates to a partition overheat protection method, device and system of the automobile power amplifier.
Background
The power amplification board of the automobile generally comprises circuit modules such as an electrolytic capacitor area, a power supply area, a calculation area and a power amplification chip area, and the layouts of the circuit modules such as the electrolytic capacitor area, the power supply area, the calculation area and the power amplification chip area on the power amplification board of the automobile of different manufacturers are different, so that the heat and the treatment strategy generated by the circuit modules on the power amplification board of the automobile are different. Common ways of processing heat of the automobile power amplifier board are to conduct external heat dissipation through cooling fins and cooling fans, and internal heat dissipation is conducted through internal circuit structure improvement of the circuit module. External heat dissipation generally increases the cost and complexity of the external structure of the automobile power amplifier board, while internal heat dissipation generally requires the circuit module to be near the heat-resistant limit and then to be overheat-protected by an internal protection circuit, which easily shortens the service life of the circuit module.
In summary, the existing heat dissipation technology of the automobile power amplification board has the technical problems of high cost, complex structure, easy shortening of the service life of the automobile power amplification board, and the like.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides a partition overheat protection method of an automobile power amplifier, which is used for reducing the heat dissipation cost of the automobile power amplifier board, simplifying the structure of the automobile power amplifier board and prolonging the service life of the automobile power amplifier board.
In a first aspect, the present application provides a partition overheat protection method for an automobile power amplifier, including the following steps:
obtaining a partition heating experience value of each partition circuit module in a plurality of partition circuit modules on an automobile power amplification board, wherein the circuit modules of each partition generate heat on the automobile power amplification board to generate different partition board surface temperatures;
setting a safe partition board temperature range according to the partition heating experience value of each partition circuit module, wherein the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
acquiring different partition board surface temperatures on the automobile power amplification board, wherein the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition boards on the automobile power amplification board;
and according to the partition board temperature and the safe partition board temperature range, overheat protection is carried out on the partition circuit module.
Further, the obtaining the partition heating experience value of each partition circuit module in the plurality of partition circuit modules on the automobile power amplification board, wherein the circuit module of each partition generates heat on the automobile power amplification board to generate different partition board surface temperatures comprises the following steps:
the method comprises the steps of obtaining a partition heating experience value of a circuit module of an electrolytic capacitor area on an automobile power amplification board, wherein the circuit module of the electrolytic capacitor area generates heat on the automobile power amplification board to generate the board surface temperature of the electrolytic capacitor area;
the method comprises the steps of obtaining a partition heating experience value of a circuit module of a power supply area on an automobile power amplification board, wherein the circuit module of the power supply area generates heat on the automobile power amplification board to generate the board surface temperature of the power supply area;
obtaining a partition heating experience value of a circuit module of a calculation area on an automobile power amplification board, wherein the circuit module of the calculation area generates heat on the automobile power amplification board to generate a board surface temperature of the calculation area;
and obtaining the partition heating experience value of the circuit module of the power amplification chip area on the automobile power amplification board, wherein the circuit module of the power amplification chip area generates heat on the automobile power amplification board to generate the board surface temperature of the power amplification chip area.
Further, the electrolytic capacitor area, the power supply area and the calculation area are distributed on the edge side of the automobile power amplifier board; the power amplifier chip area is positioned between the electrolytic capacitor area and the calculation area, and is separated from the electrolytic capacitor area and the calculation area by a set heat dissipation safety distance respectively.
Further, the setting of a safe partition board temperature range according to the partition heating experience value of the circuit module of each partition, wherein the safe partition board temperature range characterizes that the heating of the corresponding partition circuit module is in a safe area, includes:
setting a safe electrolytic capacitor area board temperature range according to the regional heating experience value of the circuit module of the electrolytic capacitor area, wherein the safe electrolytic capacitor area board temperature range represents that the heating of the circuit module of the electrolytic capacitor area is in a safe area;
setting a safe power supply area board temperature range according to the partition heating experience value of the circuit module of the power supply area, wherein the safe power supply area board temperature range represents that the heating of the circuit module of the power supply area is in a safe area;
setting a safe calculation area board temperature range according to the regional heating experience value of the circuit module of the calculation area, wherein the safe calculation area board temperature range represents that the heating of the circuit module of the calculation area is in a safe area;
and setting a safe power amplification chip area board surface temperature range according to the partitioned heating experience value of the circuit module of the power amplification chip area, wherein the safe power amplification chip area board surface temperature range represents that the heating of the circuit module of the power amplification chip area is in a safe area.
Further, obtain the subregion face temperature of difference on the car power amplifier board, the subregion face temperature of difference is by corresponding installation the temperature sensing chip collection on the subregion face of difference on the car power amplifier board provides, include:
acquiring the temperature of the plate surface of an electrolytic capacitor area on the automobile power amplification board, wherein the temperature of the plate surface of the electrolytic capacitor area is acquired and provided by a temperature sensing chip arranged on the plate surface of the electrolytic capacitor area on the automobile power amplification board;
acquiring the power supply area board surface temperature of a power supply area on the automobile power amplification board, wherein the power supply area board surface temperature is acquired and provided by a temperature sensing chip arranged on the power supply area board surface on the automobile power amplification board;
acquiring the temperature of a calculating area board surface of a calculating area on the automobile power amplification board, wherein the temperature of the calculating area board surface is acquired and provided by a temperature sensing chip arranged on the calculating area board surface of the automobile power amplification board;
the method comprises the steps of obtaining the surface temperature of a power amplification chip area on an automobile power amplification board, wherein the surface temperature of the power amplification chip area is provided by collecting a temperature sensing chip arranged on the surface of the power amplification chip area on the automobile power amplification board.
Further, the overheat protection for the partition circuit module according to the partition board temperature and the safe partition board temperature range includes:
according to the plate surface temperature of the electrolytic capacitor area and the safe plate surface temperature range of the electrolytic capacitor area, overheat protection is carried out on the circuit module of the electrolytic capacitor area;
according to the panel temperature of the power supply area and the safe panel temperature range of the power supply area, overheat protection is carried out on the circuit module of the power supply area;
according to the calculated area board temperature and the safe calculated area board temperature range, overheat protection is carried out on the circuit module of the calculated area;
and according to the panel temperature of the power amplification chip area and the safe panel temperature range of the power amplification chip area, overheat protection is carried out on the circuit module of the power amplification chip area.
Further, the safe electrolytic capacitor area plate surface temperature range is between-40 degrees and 105 degrees; the safe calculation area plate surface temperature range is between-40 degrees and 85 degrees; the safe power supply area plate surface temperature range is between-40 degrees and 125 degrees; the safe power amplifier chip area board temperature range is between-40 degrees and 125 degrees.
In a second aspect, the present application provides a partitioned overheat protection device for an automotive power amplifier, including:
the system comprises a partition heating experience value acquisition module, a control module and a control module, wherein the partition heating experience value acquisition module is used for acquiring partition heating experience values of circuit modules of each partition in a plurality of partition circuit modules on an automobile power amplification board, and the circuit modules of each partition generate different partition board surface temperatures when heating on the automobile power amplification board;
the safe partition board temperature range setting module is used for setting a safe partition board temperature range according to the partition heating experience value of the circuit module of each partition, and the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
the partition board surface temperature acquisition module is used for acquiring different partition board surface temperatures on the automobile power amplification board, and the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition board surfaces on the automobile power amplification board;
and the overheat protection module is used for overheat protecting the partition circuit module according to the partition board surface temperature and the safe partition board surface temperature range.
In a third aspect, the present application provides an automobile power amplifier board, including an MCU and a memory, where the memory stores a program module, and the program module runs in the MCU to implement the partition overheat protection method of the automobile power amplifier described in any one of the above.
In a fourth aspect, the application provides a zoned overheat protection system of an automobile power amplifier, which comprises an automobile power amplifier board and a temperature sensing chip; the automobile power amplifier board comprises a plurality of subareas, each subarea comprises a subarea circuit module, and the temperature sensing chips are respectively arranged on the board surfaces of different subareas; the partition overheat protection system of the automobile power amplifier operates the partition overheat protection method of the automobile power amplifier.
Compared with the prior art, the application has the following beneficial effects:
the application provides a partition overheat protection method, device and system for an automobile power amplifier, which are characterized in that partition overheat protection is carried out on partition circuit modules of each partition in circuit modules of a plurality of partitions on an automobile power amplifier board by acquiring partition heating experience values of the circuit modules of each partition, wherein the circuit modules of each partition generate different partition board surface temperatures on the automobile power amplifier board, a safe partition board surface temperature range is set according to the partition heating experience values of the circuit modules of each partition, the safe partition board surface temperature range represents that the heating of the corresponding partition circuit modules is in a safe area, different partition board surface temperatures on the automobile power amplifier board are acquired and provided by temperature sensing chips correspondingly arranged on different partition board surfaces on the automobile power amplifier board, and the partition circuit modules are overheat protected according to the partition board surface temperatures and the safe partition board surface temperature ranges, so that the radiating cost of the automobile power amplifier board is reduced, the structure of the automobile power amplifier board is simplified, and the service life of the automobile power amplifier board is prolonged.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. Some specific embodiments of the application will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers in the drawings denote the same or similar parts or portions, and it will be understood by those skilled in the art that the drawings are not necessarily drawn to scale, in which:
FIG. 1 is a schematic flow chart of a partition overheat protection method of an automobile power amplifier according to the present application;
FIG. 2 is a schematic diagram of a partition overheat protection system for an automotive power amplifier according to the present application;
fig. 3 is a schematic diagram of a partition overheat protection device of an automobile power amplifier according to the present application.
Detailed Description
In order to enable those skilled in the art to better understand the present application, the following description will make clear and complete descriptions of the technical solutions according to the embodiments of the present application with reference to the accompanying drawings. It will be apparent that the described embodiments are merely some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
Example 1
Referring to fig. 1-2, the embodiment provides a partition overheat protection method for an automobile power amplifier, which includes the following steps:
s1, acquiring a partition heating experience value of a circuit module of each partition in a plurality of partition circuit modules on an automobile power amplification board, wherein the circuit module of each partition generates heat on the automobile power amplification board to generate different partition board surface temperatures;
s2, setting a safe partition board surface temperature range according to the partition heating experience value of each partition circuit module, wherein the safe partition board surface temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
s3, acquiring different partition board surface temperatures on the automobile power amplification board, wherein the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition boards on the automobile power amplification board;
s4, performing overheat protection on the partition circuit module according to the partition board surface temperature and the safe partition board surface temperature range.
It should be noted that, the partition overheat protection method of the automobile power amplifier provided in the embodiment may be operated in a partition overheat protection system of the automobile power amplifier, and the partition overheat protection system of the automobile power amplifier may be used as an execution main body of all or part of the steps of the partition overheat protection method of the automobile power amplifier, and may execute part or all of the steps of the methods related below in addition to the steps S1, S2, S3 and S4 in the embodiment. In some embodiments, a zoned overheat protection system of an automotive power amplifier may include an automotive power amplifier board and a temperature sensing chip; the automobile power amplifier board comprises a plurality of partitions, each partition comprises a partition circuit module, and the temperature sensing chips are respectively arranged on different partition board surfaces.
In this embodiment, through obtaining the subregion experience value that generates heat of each subregion's among the circuit module of a plurality of subregions on the car power amplifier board, each subregion's circuit module is in generate heat on the car power amplifier board and produce different subregion face temperatures, according to the subregion experience value that generates heat of each subregion's circuit module sets up safe subregion face temperature range, the subregion face temperature range characteristic of safety corresponds subregion circuit module generates heat and is in safe region, obtains different subregion face temperatures on the car power amplifier board, different subregion face temperatures are gathered by the temperature sensing chip of corresponding installation on different subregion faces on the car power amplifier board, according to subregion face temperature with safe subregion face temperature range, to the subregion circuit module carries out overheat protection to reduce the heat dissipation cost of car power amplifier board, simplify the structure of car power amplifier board and increase car power amplifier board's life.
Specifically, in step S1, the partition overheat protection system of the automobile power amplifier obtains a partition heating experience value of each partition circuit module in the circuit modules of the partitions on the automobile power amplifier board, and the circuit modules of each partition generate heat on the automobile power amplifier board to generate different partition board surface temperatures. The partition heating experience value of the circuit module of each partition can be obtained through materials such as brands, models, related technical documents, specifications and the like of different automobile power amplifier boards or through actual measurement and the like. The partition heating experience value of the circuit module of each partition can be stored after being obtained, so that the partition overheat protection system of the automobile power amplifier can be obtained.
In some embodiments, step S1: the method for obtaining the partition heating experience value of each partition circuit module in the circuit modules of the partitions on the automobile power amplification board, wherein the circuit modules of the partitions generate different partition board surface temperatures when heating on the automobile power amplification board, can comprise the following steps: the method comprises the steps of obtaining a partition heating experience value of a circuit module of an electrolytic capacitor area on an automobile power amplification board, wherein the circuit module of the electrolytic capacitor area generates heat on the automobile power amplification board to generate the board surface temperature of the electrolytic capacitor area; the method comprises the steps of obtaining a partition heating experience value of a circuit module of a power supply area on an automobile power amplification board, wherein the circuit module of the power supply area generates heat on the automobile power amplification board to generate the board surface temperature of the power supply area; obtaining a partition heating experience value of a circuit module of a calculation area on an automobile power amplification board, wherein the circuit module of the calculation area generates heat on the automobile power amplification board to generate a board surface temperature of the calculation area; and obtaining the partition heating experience value of the circuit module of the power amplification chip area on the automobile power amplification board, wherein the circuit module of the power amplification chip area generates heat on the automobile power amplification board to generate the board surface temperature of the power amplification chip area. Further, the electrolytic capacitor area, the power supply area and the calculation area are distributed on the edge side of the automobile power amplifier board; the power amplifier chip area is positioned between the electrolytic capacitor area and the calculation area, and is separated from the electrolytic capacitor area and the calculation area by a set heat dissipation safety distance respectively.
It should be noted that, the circuit module of the electrolytic capacitor area, the circuit module of the power supply area, the circuit module of the calculation area and the circuit module of the power amplifier chip area on the automobile power amplifier board belong to the circuit module with larger heating, and key reference data can be provided for the regional overheat protection of the automobile power amplifier by acquiring the regional heating experience values of the circuit modules with larger heating, so that the effect of better protecting the automobile power amplifier board is realized. In addition, the electrolytic capacitor area, the power supply area and the calculation area are distributed on the edge side of the automobile power amplification board, the power amplification chip area is arranged between the electrolytic capacitor area and the calculation area and is separated from the electrolytic capacitor area and the calculation area by a set heat dissipation safety distance, so that heat dissipation of the circuit module can be improved, and heat transfer crosstalk between areas can be reduced.
Specifically, in step S2, the partition overheat protection system of the automobile power amplifier sets a safe partition board surface temperature range according to the partition heating experience value of the circuit module of each partition, and the safe partition board surface temperature range represents that the heating of the corresponding partition circuit module is in a safe area. The circuit modules of each partition generate heat on the automobile power amplification board to generate different partition board surface temperatures, and in normal cases, the heat generated by the circuit modules is transferred to the partition board surface where the circuit modules are located to become a main forming factor of the partition board surface temperatures, so that the partition board surface temperatures are generally lower than the temperatures of the circuit modules, for example, the lowest temperature of the partition board surface temperatures is lower than the lowest temperature of the circuit modules, and the highest temperature is lower than the highest temperature of the circuit modules. The partition overheat protection system of the automobile power amplifier can set a safe partition board surface temperature range according to the partition heating experience value of the circuit module of each partition, and the safe partition board surface temperature range is used for representing that the heating of the corresponding partition circuit module is in a safe area.
In some embodiments, step S2: setting a safe partition board temperature range according to the partition heating experience value of each partition circuit module, wherein the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area, and the method can comprise the following steps: setting a safe electrolytic capacitor area board temperature range according to the regional heating experience value of the circuit module of the electrolytic capacitor area, wherein the safe electrolytic capacitor area board temperature range represents that the heating of the circuit module of the electrolytic capacitor area is in a safe area; setting a safe power supply area board temperature range according to the partition heating experience value of the circuit module of the power supply area, wherein the safe power supply area board temperature range represents that the heating of the circuit module of the power supply area is in a safe area; setting a safe calculation area board temperature range according to the regional heating experience value of the circuit module of the calculation area, wherein the safe calculation area board temperature range represents that the heating of the circuit module of the calculation area is in a safe area; and setting a safe power amplification chip area board surface temperature range according to the partitioned heating experience value of the circuit module of the power amplification chip area, wherein the safe power amplification chip area board surface temperature range represents that the heating of the circuit module of the power amplification chip area is in a safe area. Further, the safe electrolytic capacitor area plate surface temperature range is between-40 degrees and 105 degrees; the safe calculation area plate surface temperature range is between-40 degrees and 85 degrees; the safe power supply area plate surface temperature range is between-40 degrees and 125 degrees; the safe power amplifier chip area board temperature range is between-40 degrees and 125 degrees.
It should be noted that, the circuit module of the electrolytic capacitor area, the circuit module of the power supply area, the circuit module of the calculation area and the circuit module of the power amplifier chip area on the automobile power amplifier board belong to the circuit module with larger heating, and the safe temperature range of the plate surface of the electrolytic capacitor area can be set by obtaining the regional heating experience values of the circuit modules with larger heating, for example, the temperature range of the plate surface of the electrolytic capacitor area is between-40 degrees and 105 degrees; a safe calculation area board temperature range can be set, for example, the safe calculation area board temperature range is between-40 degrees and 85 degrees; a safe power supply area board temperature range can be set, for example, the power supply area board temperature range is between-40 degrees and 125 degrees; the safe power amplifier chip area board temperature range can be set, for example, the power amplifier chip area board temperature range is between-40 degrees and 125 degrees.
In step S3, the partition overheat protection system of the automobile power amplifier obtains different partition panel temperatures on the automobile power amplifier panel, and the different partition panel temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition panels on the automobile power amplifier panel.
It should be noted that, through installing the temperature sensing chip on the subregion face of difference on the car power amplifier board and gathering different subregion face temperatures to can provide required different subregion face temperatures for the subregion overheat protection system of car power amplifier.
In some embodiments, step S3: obtain different subregion face temperatures on the car power amplifier board, different subregion face temperatures are provided by corresponding the temperature sensing chip collection of installing on the different subregion faces on the car power amplifier board, can include the following steps: acquiring the temperature of the plate surface of an electrolytic capacitor area on the automobile power amplification board, wherein the temperature of the plate surface of the electrolytic capacitor area is acquired and provided by a temperature sensing chip arranged on the plate surface of the electrolytic capacitor area on the automobile power amplification board; acquiring the power supply area board surface temperature of a power supply area on the automobile power amplification board, wherein the power supply area board surface temperature is acquired and provided by a temperature sensing chip arranged on the power supply area board surface on the automobile power amplification board; acquiring the temperature of a calculating area board surface of a calculating area on the automobile power amplification board, wherein the temperature of the calculating area board surface is acquired and provided by a temperature sensing chip arranged on the calculating area board surface of the automobile power amplification board; the method comprises the steps of obtaining the surface temperature of a power amplification chip area on an automobile power amplification board, wherein the surface temperature of the power amplification chip area is provided by collecting a temperature sensing chip arranged on the surface of the power amplification chip area on the automobile power amplification board.
Specifically, in step S4, the partition overheat protection system of the automobile power amplifier performs overheat protection on the partition circuit module according to the partition board temperature and the safe partition board temperature range.
It should be noted that, by comparing the preset safe partition board temperature range with the actually measured partition board temperature, the heating state of the partition circuit module can be estimated, so as to perform overheat protection on the partition circuit module.
In some embodiments, step S4: according to the partition board temperature and the safe partition board temperature range, overheat protection is performed on the partition circuit module, and the method may include the following steps: according to the plate surface temperature of the electrolytic capacitor area and the safe plate surface temperature range of the electrolytic capacitor area, overheat protection is carried out on the circuit module of the electrolytic capacitor area; according to the panel temperature of the power supply area and the safe panel temperature range of the power supply area, overheat protection is carried out on the circuit module of the power supply area; according to the calculated area board temperature and the safe calculated area board temperature range, overheat protection is carried out on the circuit module of the calculated area; and according to the panel temperature of the power amplification chip area and the safe panel temperature range of the power amplification chip area, overheat protection is carried out on the circuit module of the power amplification chip area.
Example two
On the basis of the above embodiment, the partition overheat protection method of the automobile power amplifier in the embodiment may further include the following steps:
performing integral operation on the plate surface temperature of the electrolytic capacitor area in a set time period, and obtaining the average temperature of the plate surface temperature of the electrolytic capacitor area in the set time period;
and comparing the average temperature with a preset safety temperature threshold, and if the average temperature exceeds the preset safety temperature threshold, reducing the power of the circuit module of the power supply area, the circuit module of the calculation area and the circuit module of the power amplifier chip area.
It should be noted that when the average temperature of the plate surface temperature of the electrolytic capacitor area exceeds the preset safety temperature threshold, the service life of the electrolytic capacitor is seriously affected, and at this time, the power of the circuit module of the power supply area, the power of the circuit module of the calculation area and the power amplifier chip area is reduced, so that overheat protection can be performed on the electrolytic capacitor.
Further, the partition overheat protection method of the automobile power amplifier can further comprise the following steps:
comparing the calculated area board temperature with a safe calculated area board temperature range;
and if the calculated area board temperature is not in the safe calculated area board temperature range, reducing the main frequency of the processor or forcibly restarting the system.
It should be noted that, when the temperature of the computing area board is not within the safe computing area board temperature range, the main frequency of the processor is reduced or the system is restarted forcedly, so that overheat protection can be formed for the computing area circuit module.
Further, the partition overheat protection method of the automobile power amplifier can further comprise the following steps:
comparing the panel temperature of the power supply area with the safe panel temperature range of the power supply area;
and if the power supply area board temperature is not in the safe power supply area board temperature range, reducing the working frequency and the load power of the power supply.
It should be noted that, compared with the module circuits of the electrolytic capacitor area, the calculation area and the power amplifier chip, the temperature sensitivity of the power supply is lower, and the circuit module of the power supply area can be overheat-protected by reducing the working frequency and the load power of the power supply.
Further, the partition overheat protection method of the automobile power amplifier can further comprise the following steps:
comparing the panel temperature of the power amplifier chip area with the panel temperature range of the safe power amplifier chip area;
if the power amplifier chip area board temperature is not in the safe power amplifier chip area board temperature range, the average value of the power amplifier chip area board temperature is calculated for a plurality of times, and if the average value exceeds a preset safety threshold value within a set time length, the power amplifier is turned off or restarted.
It should be noted that, because the power amplifier has the condition of overtemperature in a short time, the average value is obtained through multiple times of the surface temperature of the power amplifier chip area, if the average value exceeds the preset safety threshold value in the set time length, the power amplifier is turned off or restarted, so that the power amplifier can be protected, and erroneous judgment can be avoided.
Further, the partition overheat protection method of the automobile power amplifier can further comprise the following steps:
if the plate surface temperature of the electrolytic capacitor area is not in the safe electrolytic capacitor area plate surface temperature range, the power supply area plate surface temperature is not in the safe power supply area plate surface temperature range, the calculation area plate surface temperature is not in the safe calculation area plate surface temperature range, the power amplification chip area plate surface temperature is not in the safe power amplification chip area plate surface temperature range, the circuit module of the power amplification chip area is preferentially subjected to overheat protection, the circuit module of the power supply area is subjected to overheat protection, the circuit module of the calculation area is subjected to overheat protection, and the circuit module of the electrolytic capacitor area is subjected to overheat protection.
It should be noted that, according to different performances and temperature sensitivities of the circuit module of the power amplification chip area, the circuit module of the power supply area, the circuit module of the calculation area and the circuit module of the electrolytic capacitor area, different priority overheat protection is performed on the circuit module of the power amplification chip area, the circuit module of the power supply area, the circuit module of the calculation area and the circuit module of the electrolytic capacitor area, so that the circuit module of the partition overheat protection system of the whole automobile power amplifier can be protected from the layer of the partition overheat protection system, and a better overheat protection effect is achieved.
Example III
Referring to fig. 2, the embodiment provides a zoned overheat protection system of an automobile power amplifier, which comprises an automobile power amplifier board and a temperature sensing chip; the automobile power amplifier board comprises a plurality of subareas, each subarea comprises a subarea circuit module, and the temperature sensing chips are respectively arranged on the board surfaces of different subareas; the partition overheat protection system of the automobile power amplifier operates the partition overheat protection method of any one of the automobile power amplifiers. The automobile power amplifier board can comprise an MCU and a memory, wherein the memory stores a program module, and when the program module runs in the MCU, the partition overheat protection method of any automobile power amplifier can be realized.
In this embodiment, through obtaining the subregion experience value that generates heat of each subregion's among the circuit module of a plurality of subregions on the car power amplifier board, each subregion's circuit module is in generate heat on the car power amplifier board and produce different subregion face temperatures, according to the subregion experience value that generates heat of each subregion's circuit module sets up safe subregion face temperature range, the subregion face temperature range characteristic of safety corresponds subregion circuit module generates heat and is in safe region, obtains different subregion face temperatures on the car power amplifier board, different subregion face temperatures are gathered by the temperature sensing chip of corresponding installation on different subregion faces on the car power amplifier board, according to subregion face temperature with safe subregion face temperature range, to the subregion circuit module carries out overheat protection to reduce the heat dissipation cost of car power amplifier board, simplify the structure of car power amplifier board and increase car power amplifier board's life.
Example IV
Referring to fig. 3, this embodiment provides a partition overheat protection device for an automobile power amplifier, including:
the system comprises a partition heating experience value acquisition module, a control module and a control module, wherein the partition heating experience value acquisition module is used for acquiring partition heating experience values of circuit modules of each partition in a plurality of partition circuit modules on an automobile power amplification board, and the circuit modules of each partition generate different partition board surface temperatures when heating on the automobile power amplification board;
the safe partition board temperature range setting module is used for setting a safe partition board temperature range according to the partition heating experience value of the circuit module of each partition, and the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
the partition board surface temperature acquisition module is used for acquiring different partition board surface temperatures on the automobile power amplification board, and the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition board surfaces on the automobile power amplification board;
and the overheat protection module is used for overheat protecting the partition circuit module according to the partition board surface temperature and the safe partition board surface temperature range.
In this embodiment, through obtaining the subregion experience value that generates heat of each subregion's among the circuit module of a plurality of subregions on the car power amplifier board, each subregion's circuit module is in generate heat on the car power amplifier board and produce different subregion face temperatures, according to the subregion experience value that generates heat of each subregion's circuit module sets up safe subregion face temperature range, the subregion face temperature range characteristic of safety corresponds subregion circuit module generates heat and is in safe region, obtains different subregion face temperatures on the car power amplifier board, different subregion face temperatures are gathered by the temperature sensing chip of corresponding installation on different subregion faces on the car power amplifier board, according to subregion face temperature with safe subregion face temperature range, to the subregion circuit module carries out overheat protection to reduce the heat dissipation cost of car power amplifier board, simplify the structure of car power amplifier board and increase car power amplifier board's life.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (10)
1. The partition overheat protection method for the automobile power amplifier is characterized by comprising the following steps of:
obtaining a partition heating experience value of each partition circuit module in a plurality of partition circuit modules on an automobile power amplification board, wherein the circuit modules of each partition generate heat on the automobile power amplification board to generate different partition board surface temperatures;
setting a safe partition board temperature range according to the partition heating experience value of each partition circuit module, wherein the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
acquiring different partition board surface temperatures on the automobile power amplification board, wherein the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition boards on the automobile power amplification board;
and according to the partition board temperature and the safe partition board temperature range, overheat protection is carried out on the partition circuit module.
2. The method for protecting the overheat of the power amplifier of the automobile according to claim 1, wherein the step of obtaining the partition heating experience value of each of the plurality of partitioned circuit modules on the power amplifier board of the automobile, wherein the circuit module of each partition generates different partition board surface temperatures when heating on the power amplifier board of the automobile comprises the steps of:
the method comprises the steps of obtaining a partition heating experience value of a circuit module of an electrolytic capacitor area on an automobile power amplification board, wherein the circuit module of the electrolytic capacitor area generates heat on the automobile power amplification board to generate the board surface temperature of the electrolytic capacitor area;
the method comprises the steps of obtaining a partition heating experience value of a circuit module of a power supply area on an automobile power amplification board, wherein the circuit module of the power supply area generates heat on the automobile power amplification board to generate the board surface temperature of the power supply area;
obtaining a partition heating experience value of a circuit module of a calculation area on an automobile power amplification board, wherein the circuit module of the calculation area generates heat on the automobile power amplification board to generate a board surface temperature of the calculation area;
and obtaining the partition heating experience value of the circuit module of the power amplification chip area on the automobile power amplification board, wherein the circuit module of the power amplification chip area generates heat on the automobile power amplification board to generate the board surface temperature of the power amplification chip area.
3. The zoned overheat protection method of the automobile power amplifier of claim 2, wherein the electrolytic capacitor zone, the power supply zone and the calculation zone are distributed on the edge side of the automobile power amplifier board; the power amplifier chip area is positioned between the electrolytic capacitor area and the calculation area, and is separated from the electrolytic capacitor area and the calculation area by a set heat dissipation safety distance respectively.
4. The method for protecting the overheat of the partition of the power amplifier of claim 1, wherein the setting of the safe partition board temperature range according to the partition heating experience value of the circuit module of each partition, the safe partition board temperature range representing that the heating of the corresponding partition circuit module is in a safe area, comprises:
setting a safe electrolytic capacitor area board temperature range according to the regional heating experience value of the circuit module of the electrolytic capacitor area, wherein the safe electrolytic capacitor area board temperature range represents that the heating of the circuit module of the electrolytic capacitor area is in a safe area;
setting a safe power supply area board temperature range according to the partition heating experience value of the circuit module of the power supply area, wherein the safe power supply area board temperature range represents that the heating of the circuit module of the power supply area is in a safe area;
setting a safe calculation area board temperature range according to the regional heating experience value of the circuit module of the calculation area, wherein the safe calculation area board temperature range represents that the heating of the circuit module of the calculation area is in a safe area;
and setting a safe power amplification chip area board surface temperature range according to the partitioned heating experience value of the circuit module of the power amplification chip area, wherein the safe power amplification chip area board surface temperature range represents that the heating of the circuit module of the power amplification chip area is in a safe area.
5. The method for protecting the overheat of the power amplifier of the automobile according to claim 1, wherein the step of obtaining different partition board surface temperatures on the power amplifier board of the automobile, the different partition board surface temperatures being provided by the collection of temperature sensing chips correspondingly installed on different partition board surfaces on the power amplifier board of the automobile, comprises the steps of:
acquiring the temperature of the plate surface of an electrolytic capacitor area on the automobile power amplification board, wherein the temperature of the plate surface of the electrolytic capacitor area is acquired and provided by a temperature sensing chip arranged on the plate surface of the electrolytic capacitor area on the automobile power amplification board;
acquiring the power supply area board surface temperature of a power supply area on the automobile power amplification board, wherein the power supply area board surface temperature is acquired and provided by a temperature sensing chip arranged on the power supply area board surface on the automobile power amplification board;
acquiring the temperature of a calculating area board surface of a calculating area on the automobile power amplification board, wherein the temperature of the calculating area board surface is acquired and provided by a temperature sensing chip arranged on the calculating area board surface of the automobile power amplification board;
the method comprises the steps of obtaining the surface temperature of a power amplification chip area on an automobile power amplification board, wherein the surface temperature of the power amplification chip area is provided by collecting a temperature sensing chip arranged on the surface of the power amplification chip area on the automobile power amplification board.
6. The method for protecting the overheat of the partition of the power amplifier of claim 1, wherein the overheat protection of the partition circuit module according to the partition board temperature and the safe partition board temperature range comprises:
according to the plate surface temperature of the electrolytic capacitor area and the safe plate surface temperature range of the electrolytic capacitor area, overheat protection is carried out on the circuit module of the electrolytic capacitor area;
according to the panel temperature of the power supply area and the safe panel temperature range of the power supply area, overheat protection is carried out on the circuit module of the power supply area;
according to the calculated area board temperature and the safe calculated area board temperature range, overheat protection is carried out on the circuit module of the calculated area;
and according to the panel temperature of the power amplification chip area and the safe panel temperature range of the power amplification chip area, overheat protection is carried out on the circuit module of the power amplification chip area.
7. The zoned overheat protection method of the automobile power amplifier of claim 4, wherein the safe electrolytic capacitor zone plate surface temperature range is between-40 degrees and 105 degrees; the safe calculation area plate surface temperature range is between-40 degrees and 85 degrees; the safe power supply area plate surface temperature range is between-40 degrees and 125 degrees; the safe power amplifier chip area board temperature range is between-40 degrees and 125 degrees.
8. The utility model provides a subregion overheat protection device of car power amplifier which characterized in that includes:
the system comprises a partition heating experience value acquisition module, a control module and a control module, wherein the partition heating experience value acquisition module is used for acquiring partition heating experience values of circuit modules of each partition in a plurality of partition circuit modules on an automobile power amplification board, and the circuit modules of each partition generate different partition board surface temperatures when heating on the automobile power amplification board;
the safe partition board temperature range setting module is used for setting a safe partition board temperature range according to the partition heating experience value of the circuit module of each partition, and the safe partition board temperature range represents that the heating of the corresponding partition circuit module is in a safe area;
the partition board surface temperature acquisition module is used for acquiring different partition board surface temperatures on the automobile power amplification board, and the different partition board surface temperatures are acquired and provided by temperature sensing chips correspondingly arranged on different partition board surfaces on the automobile power amplification board;
and the overheat protection module is used for overheat protecting the partition circuit module according to the partition board surface temperature and the safe partition board surface temperature range.
9. An automobile power amplifier board, comprising an MCU and a memory, wherein the memory stores a program module, and the program module runs in the MCU to realize the partition overheat protection method of the automobile power amplifier according to any one of claims 1 to 7.
10. The zoned overheat protection system of the automobile power amplifier is characterized by comprising an automobile power amplifier board and a temperature sensing chip; the automobile power amplifier board comprises a plurality of subareas, each subarea comprises a subarea circuit module, and the temperature sensing chips are respectively arranged on the board surfaces of different subareas; the partition overheat protection system of the automobile power amplifier operates the partition overheat protection method of the automobile power amplifier according to any one of claims 1 to 7.
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| CN116599475B (en) | 2023-09-29 |
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