CN116587522A - Low-temperature solid glue encapsulation process - Google Patents

Abstract

The application belongs to the technical field of rubber molding, and particularly relates to a low-temperature solid rubber encapsulation process, which comprises the steps of preparing a resin substrate; cleaning the resin substrate; coating an adhesive on the cleaned resin substrate; after the adhesive is coated, preheating is carried out; after preheating, installing a positioning module and installing a die; placing the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product; the method realizes encapsulation of the resin substrate, and the final product is produced, so that the quality of the product is ensured, and the production efficiency of the product is improved.

Description

Low-temperature solid glue encapsulation process

Technical Field

The application belongs to the technical field of rubber molding, and particularly relates to a low-temperature solid rubber encapsulation process.

Background

Rubber injection molding machines are devices with high temperature, high pressure and large mold closing and moving forces that require encapsulation of the resin substrate after it has been molded to form the finished product. The encapsulation process of the resin substrate can affect the quality of the final product.

Therefore, a new low-temperature solid state encapsulation process is needed to be designed based on the technical problems.

Disclosure of Invention

The application aims to provide a low-temperature solid glue encapsulation process.

In order to solve the technical problems, the application provides a low-temperature solid glue encapsulation process, which comprises the following steps:

preparing a resin substrate;

cleaning the resin substrate;

coating an adhesive on the cleaned resin substrate;

after the adhesive is coated, preheating is carried out;

after preheating, installing a positioning module and installing a die;

and (3) putting the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product.

Further, the preparing of the resin substrate includes:

and preparing a raw material of the resin substrate, and forming the resin substrate through a corresponding die after the preparation of the raw material is completed.

Further, the cleaning of the resin substrate includes:

removing residual sand on the surface of the resin substrate, in the inserts and in the sheep horns after sand blasting through an air gun;

the dirt adhered to the surface of the semi-finished product is wiped off by clean cotton cloth soaked with alcohol.

Further, the applying the adhesive on the cleaned resin substrate includes:

in a clean environment, pouring a preset amount of adhesive into a special container, dipping and uniformly coating the adhesive on the surface of a resin substrate by using a brush, and storing the rest adhesive.

Further, the preheating after the adhesive is applied comprises:

the resin substrate coated with the adhesive was placed in an oven at 70 ℃ for preheating.

Further, the preheating after the adhesive is coated further comprises:

preheating the upper and lower tooling modules of the die, so that the surface temperature of the upper and lower tooling modules reaches 100 ℃.

Further, the installing the positioning module after preheating and installing the die comprises:

cleaning the residual materials on the die by using a scraper knife and a compressed air spray gun;

uniformly spraying a release agent on the surface of the die, and wiping the die cleanly by clean gauze;

wiping the die-bonding surface by gauze;

before die filling, cleaning the movable die and the static die of the die through a compressed air spray gun;

installing a positioning frame;

the assembled resin substrate is placed into a mold.

Further, the step of placing the resin substrate into the mold and then closing, injecting and opening the mold to obtain the product includes:

after the assembled resin substrate is put into a die, die assembly is carried out, glue injection is carried out after die assembly, and pressure maintaining and vulcanization are carried out for 30 minutes;

and (5) carrying out pressure maintaining vulcanization, then opening the die, and taking out the product.

Further, the product was checked: withstand voltage test, size test, appearance test, partial discharge test, and error test.

Further, the size inspection includes: full-size inspection and full-size inspection.

The application has the beneficial effects that the resin substrate is prepared; cleaning the resin substrate; coating an adhesive on the cleaned resin substrate; after the adhesive is coated, preheating is carried out; after preheating, installing a positioning module and installing a die; placing the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product; the method realizes encapsulation of the resin substrate, and the final product is produced, so that the quality of the product is ensured, and the production efficiency of the product is improved.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.

In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of a low temperature solid state encapsulation process of the present application;

FIG. 2 is a flow chart of a low temperature solid state encapsulation process of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Example 1

As shown in fig. 1 and 2, embodiment 1 provides a low-temperature solid state encapsulation process, which includes: preparing a resin substrate; cleaning the resin substrate; coating an adhesive on the cleaned resin substrate; after the adhesive is coated, preheating is carried out; after preheating, installing a positioning module and installing a die; placing the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product; the method realizes encapsulation of the resin substrate, and the final product is produced, so that the quality of the product is ensured, and the production efficiency of the product is improved.

In this embodiment, the operator extracts the corresponding mold from the mold placement area for the product model before the encapsulation process is performed. Checking whether the die fittings and the tools are complete or not, and ensuring that the fittings and the tools are complete when the die returns. Checking whether the heating condition of the die and the equipment is normal. Whether the heating system has problems or not, whether the mold clamping compactness and the surface finish are qualified or not; the die is mounted on a machine table, and whether the die closing and the surface brightness of the die are qualified or not is checked (the die is mounted so as to ensure that no foreign matters exist on the upper surface and the lower surface of the die and the machine table). According to the mould structure and the product structure, an automatic action and glue injection program is set on the control cabinet. Heating the mold to the desired temperature by the process (table 1 below); and cleaning the upper tooling module and the lower tooling module at one time, preheating in an oven at 120 ℃ for at least 90 minutes, and uniformly preheating the tooling modules until the surface temperature reaches more than 100 ℃. The temperature of the die is set within the process range, and the temperature is measured at multiple points during temperature measurement.

Table 1: preheating thermometer

In this embodiment, the preparing a resin substrate includes: and preparing a raw material of the resin substrate, and forming the resin substrate through a corresponding die after the preparation of the raw material is completed.

In this embodiment, the cleaning of the resin substrate includes: removing residual sand on the surface of the resin substrate, in the inserts and in the sheep horns after sand blasting through an air gun; the dirt adhered to the surface of the semi-finished product is wiped off by clean cotton cloth soaked with alcohol. Eye, mouth and nose protection is noted during cleaning of the air gun. The finger is scratched on the surface of the product, and no trace can be formed on the finger.

In this embodiment, the applying the adhesive on the cleaned resin substrate includes: in a clean environment, pouring a preset amount of adhesive into a special container, dipping and uniformly coating the adhesive on the surface of a resin substrate by using a brush, and storing the rest adhesive; the environment, the designated position and the surrounding must not have pollution sources. The redundant adhesive is deposited and poured into a specified container, so that waste is avoided. During operation, liquid is prevented from splashing into eyes and mouths, and products coated with the adhesive are protected from pollution.

In this embodiment, preheating after the applying of the adhesive includes: and (5) placing the pretreated product into a 70 ℃ oven for preheating. The preheating quantity is proper with the production requirement of the duty, and redundant products are specially protected to prevent external pollution. The surface temperature of the upper and lower tooling modules reaches 100 ℃ to carry out the next working procedure. And taking out each die tooling module from the product, immediately cleaning, loading the semi-finished product into an oven, and preheating. If the work is carried out, the operator needs to be assisted in advance to put the processed semi-finished product into the oven to be hotter. And (5) loading the upper tooling module and the window module on a product to enter an oven for preheating. The semi-finished product is protected after assembly and cannot be polluted. Note that the mold temperature was measured at intervals of a predetermined time and recorded. The module is assembled tightly, and rubber cannot be drilled into the A, B phase goat horn, the secondary outlet terminal, the nameplate screw hole and the like.

In this embodiment, the installing the positioning module after preheating and installing the mold includes: cleaning the residual materials on the die by using a scraper knife and a compressed air spray gun (using the scraper knife to prevent scratches and scratches on the die); uniformly spraying a release agent on the surface of the die, wiping cleanly by clean gauze, and wiping cleanly (such as umbrella group, die closing seam, sealing groove and pouring gate) the cleanly by wrapping gauze with bamboo chips at the part which cannot be wiped, so as to prevent the release agent from being remained, and enable the surface of the part to have flow marks or matt marks; the die-closing surface is wiped by gauze, so that residual release agent is prevented from being extruded into a die cavity during die closing; before die filling, cleaning the movable and static dies of the die through a compressed air spray gun, and before die filling, thoroughly blowing the movable and static dies of the die through the compressed air spray gun to ensure that no sundries exist; installing a positioning frame; and putting the assembled resin substrate into a die, wearing gloves, and putting the assembled product into the die in cooperation by two persons, so that the tightness of the tool module and the die, the uniform and moderate spacing between a workpiece and the die and the design insulation distance control range are ensured. During the assembly and die-filling process, the user takes and releases the die lightly, so that the product and the die are prevented from being knocked. Avoiding the secondary grabbing and touching the part coated with the adhesive in the operation.

In this embodiment, the steps of placing the resin substrate into the mold, and then closing, injecting and opening the mold to obtain the product include: after the assembled resin substrate is put into a die, die assembly is carried out, glue injection is carried out after die assembly, and pressure maintaining and vulcanization are carried out for 30 minutes; and (5) carrying out pressure maintaining vulcanization, then opening the die, and taking out the product. And (3) die assembly and pressure maintaining: confirming whether the lower ejection is in place; and (5) longitudinally moving the movable mould, and closing and maintaining the pressure. And (3) glue injection: the method comprises the steps of glue storage, plasticizing and glue injection, wherein before glue storage, whether the rubber has impurities or not and chromatic aberration is checked, after the rubber is qualified, the rubber is put into a storage bin for plasticizing, and when the glue is injected, the pushing position of the glue injection bin is paid more attention to, so that the situation that the glue is insufficient is prevented; note the pressure gauge case. (if the pressure is relieved, the die joint is too thick, raw rubber and surface defects are caused); the injection pressure is shown in Table 2, and the injection time is 1.5-2 minutes.

Table 2: glue injection pressure gauge

	Flow rate	Pressure of
			Glue injection one	50％	100bar
Glue injection two	60％	100bar
			Glue injection three	70％	110bar
Beating head	20％	30bar

Pressure maintaining and vulcanizing: pressure maintaining and vulcanizing for 30 minutes; the whole material injection process needs to pay attention to the mold pressure, the glue injection speed and the discharging time. And (5) die sinking: firstly, slowly pulling the mould to observe that the product is stuck on the upper mould and then on the lower mould, if the product is stuck on the upper mould, the two ends of the product are prized by soft force of a crowbar until the product falls off the lower mould (the force is uniform, one end is not prized, and the product is easy to break); the movable mould is opened downwards to a proper position, longitudinally moved out and ejected downwards; unloading the product and placing the product in a designated workbench area; cleaning a die, and preparing for injecting a next die; disassembling the tooling, assembling a next die, and preheating for later use; and trimming, checking appearance, and putting the qualified products into a designated area. Burrs are avoided from being pulled hard by hand dead by using a special trimming tool. Trimming and leveling are required, and the phenomenon of uneven is avoided. Residual glue is avoided in each insert and on the threads of the screw cap. And rubber coverage is avoided on the plane of the insert of the secondary wire outlet end.

In this example, the product was inspected: withstand voltage test, size test, appearance test, partial discharge test, and error test. The process times per die are shown in table 3 below.

Table 3: process time per die

In this embodiment, the dimension test includes: and (5) full-size inspection and full-size inspection, and packaging and warehousing after the inspection is qualified.

In summary, the present application is directed to a method of preparing a resin substrate; cleaning the resin substrate; coating an adhesive on the cleaned resin substrate; after the adhesive is coated, preheating is carried out; after preheating, installing a positioning module and installing a die; placing the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product; the method realizes encapsulation of the resin substrate, and the final product is produced, so that the quality of the product is ensured, and the production efficiency of the product is improved.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The apparatus embodiments described above are merely illustrative, for example, of the flowcharts and block diagrams in the figures that illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In addition, functional modules in the embodiments of the present application may be integrated together to form a single part, or each module may exist alone, or two or more modules may be integrated to form a single part.

The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

With the above-described preferred embodiments according to the present application as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.

Claims (10)

1. The low-temperature solid glue encapsulation process is characterized by comprising the following steps of:

preparing a resin substrate;

cleaning the resin substrate;

coating an adhesive on the cleaned resin substrate;

after the adhesive is coated, preheating is carried out;

after preheating, installing a positioning module and installing a die;

and (3) putting the resin substrate into a die, and then carrying out die assembly, glue injection and die opening to obtain a product.

2. The method of preparing a resin substrate according to claim 1,

the preparation of the resin substrate includes:

and preparing a raw material of the resin substrate, and forming the resin substrate through a corresponding die after the preparation of the raw material is completed.

3. The method for producing a resin substrate according to claim 2, wherein,

the cleaning of the resin substrate includes:

removing residual sand on the surface of the resin substrate, in the inserts and in the sheep horns after sand blasting through an air gun;

the dirt adhered to the surface of the semi-finished product is wiped off by clean cotton cloth soaked with alcohol.

4. The method of preparing a resin substrate according to claim 3,

the step of coating the adhesive on the cleaned resin substrate comprises the following steps:

in a clean environment, pouring a preset amount of adhesive into a special container, dipping and uniformly coating the adhesive on the surface of a resin substrate by using a brush, and storing the rest adhesive.

5. The method for producing a resin substrate according to claim 4, wherein,

the preheating after the adhesive is coated comprises the following steps:

the resin substrate coated with the adhesive was placed in an oven at 70 ℃ for preheating.

6. The method of preparing a resin substrate according to claim 5,

preheating after the adhesive is coated further comprises:

preheating the upper and lower tooling modules of the die, so that the surface temperature of the upper and lower tooling modules reaches 100 ℃.

7. The method of preparing a resin substrate according to claim 6,

the installation positioning module after preheating and the installation die comprise:

cleaning the residual materials on the die by using a scraper knife and a compressed air spray gun;

uniformly spraying a release agent on the surface of the die, and wiping the die cleanly by clean gauze;

wiping the die-bonding surface by gauze;

before die filling, cleaning the movable die and the static die of the die through a compressed air spray gun;

installing a positioning frame;

the assembled resin substrate is placed into a mold.

8. The method of preparing a resin substrate according to claim 7,

after the resin substrate is put into a mold, mold closing, glue injection and mold opening are performed to obtain a product, wherein the step of obtaining the product comprises the following steps:

after the assembled resin substrate is put into a die, die assembly is carried out, glue injection is carried out after die assembly, and pressure maintaining and vulcanization are carried out for 30 minutes;

and (5) carrying out pressure maintaining vulcanization, then opening the die, and taking out the product.

9. The method of preparing a resin substrate according to claim 8,

and (3) checking the product: withstand voltage test, size test, appearance test, partial discharge test, and error test.

10. The method of preparing a resin substrate according to claim 9,

the dimension inspection includes: full-size inspection and full-size inspection.