CN116587120A - Wafer support ring processing method - Google Patents

Wafer support ring processing method Download PDF

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Publication number
CN116587120A
CN116587120A CN202310628161.4A CN202310628161A CN116587120A CN 116587120 A CN116587120 A CN 116587120A CN 202310628161 A CN202310628161 A CN 202310628161A CN 116587120 A CN116587120 A CN 116587120A
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CN
China
Prior art keywords
ring body
ring
processing
positioning seat
reverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310628161.4A
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Chinese (zh)
Inventor
杨军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Art Precision Machinery Co ltd
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Suzhou Art Precision Machinery Co ltd
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Publication date
Application filed by Suzhou Art Precision Machinery Co ltd filed Critical Suzhou Art Precision Machinery Co ltd
Priority to CN202310628161.4A priority Critical patent/CN116587120A/en
Publication of CN116587120A publication Critical patent/CN116587120A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The application relates to a wafer support ring processing method, S1, rough cutting treatment; s2, stress relief treatment; s3, finishing treatment; s4, polishing and checking. On one hand, the application can keep the corresponding processing area in an exposed state completely in the forward/reverse positioning of the support ring, realizes one-time processing and forming, and has high processing precision and high efficiency; on the other hand realizes the location of holding ring through the cooperation between bolt, positioning seat and the holding ring, and the holding ring atress is little, and stable in structure just is difficult for deformation, effectively improves the product yields.

Description

Wafer support ring processing method
Technical Field
The application belongs to the technical field of precision machining, and particularly relates to a wafer support ring machining method.
Background
When electroplating is carried out on one surface of the wafer, a supporting ring is required to be arranged to be abutted against the other surface of the wafer so as to form positioning and supporting, wherein the supporting ring comprises a first ring body and a second ring body which are concentric and have outer diameters gradually reduced along the central line of the first ring body and the second ring body.
Currently, in the processing for the above-mentioned support ring, the conventional processing steps include: a) Preparing materials, namely cutting a plate material by laser to obtain a blank body of the supporting ring; b) Coarsening; c) Stress relief treatment; d) Finish (grinding, milling, deburring, polishing, etc.); e) And packaging after inspection.
However, in the actual processing process, the supporting ring is a thin-wall part, the clamping position is lacking, and the traditional clamping mode (using clamps such as clamping blocks and pressing plates) is easy to deform, so that the later assembly of the product is influenced; moreover, the processing area on the surface of the support ring is easy to cover by the clamp, the clamping position of the clamp on the support ring needs to be frequently adjusted to ensure that all the processing areas of the support ring can be processed, the positioning reference is easy to deviate, the processing precision is low, the operation is complex, and the efficiency is low.
Disclosure of Invention
The application aims to overcome the defects of the prior art and provide a brand new wafer support ring processing method.
In order to solve the technical problems, the application adopts the following technical scheme:
a processing method of a wafer support ring comprises a first ring body and a second ring body which are concentric and have gradually reduced outer diameters, and the processing method comprises the following steps:
s1, coarse processing
Gradually processing the outer circle and the inner hole of the circular ring blank to form the outline of the first ring body and the outline of the second ring body, and reserving allowance for deformation;
s2, stress relieving treatment
Heating the ring blank subjected to rough cutting to 360-420 ℃, preserving heat for 3-5H, and then air-cooling to 35-45 ℃, and circulating at least twice;
s3, finishing treatment
a) Processing a plurality of connecting holes distributed around the periphery of the second ring body on the first ring body, and grinding the end face of the first ring body to be used as a processing reference surface;
b) The method comprises the steps of positively placing a circular ring blank on a forward positioning seat in a positioning device, attaching a machining reference surface on a first ring body to the top surface of the forward positioning seat, connecting the first ring body and the forward positioning seat from bottom to top by bolts, fixing the first ring body and the forward positioning seat, and then machining exposed surfaces and inner walls on the first ring body and the second ring body respectively;
c) Reversely placing the circular ring blank processed in the step b) on a reverse positioning seat in a positioning device, taking the self circumference and the end face of a second ring body as processing references and positioning the second ring body on the reverse positioning seat, supporting a first ring body on the reverse positioning seat, connecting the first ring body with the reverse positioning seat from top to bottom by bolts, fixing the first ring body with the reverse positioning seat, and then processing an exposed surface on the first ring body;
s4, polishing and checking
The finished surface of the support ring is polished and inspected for dimensions.
According to a preferred embodiment of the present application, in S1, all the positions of the first ring body and the second ring body where stress is easily generated are thickened to deform them and release the stress. In this case, deformation occurring during subsequent finishing is reduced, and the workpiece size is kept stable.
According to still another specific implementation preferred aspect of the present application, in S3, the positioning device used in step b) and step c) includes a working platform having a first station and a second station, and a forward positioning unit and a reverse positioning unit respectively disposed on the first station and the second station, where the forward positioning unit includes a forward positioning seat having a plurality of first through holes, a plurality of forward connecting bolts, an operation area for hand operation is formed between the forward positioning seat and the working platform, a supporting ring is placed on top of the forward positioning seat in a forward direction, and the plurality of forward connecting bolts are correspondingly connected to each connecting hole and the first through holes upward from the operation area; the reverse positioning unit comprises a reverse positioning seat with a plurality of second through holes and a plurality of reverse connecting bolts, wherein the reverse positioning seat is downwards recessed from the top surface and forms a positioning groove matched with the second ring body, during reverse positioning, the second ring body is inserted in the positioning groove, is attached to the inner wall of the positioning groove from the circumferential direction and is supported at the bottom of the positioning groove from the bottom, the first ring body is supported at the top of the reverse positioning seat, and the plurality of reverse connecting bolts are correspondingly connected with each second through hole and each connecting hole from top to bottom.
Preferably, the forward positioning seat comprises a plurality of cushion blocks arranged on the working platform and a seat plate horizontally arranged on the tops of the cushion blocks, wherein an operation area is formed between the seat plate and the working platform. The structure is simple, and the installation and the implementation are convenient.
Further, openings are formed around the operation area. Here, it is convenient for the worker to insert his hand into the operation area from any direction for operation.
Preferably, the top of each cushion block protrudes to one side and is arranged at the corresponding side of the seat plate; the forward positioning unit further comprises a first pressing part, wherein the first pressing part presses on the part of the top of the cushion block, which protrudes out of the seat plate. In this case, the seat plate and the workpiece are prevented from being biased by force during machining.
Specifically, the first compacting component comprises a supporting module supported on the working platform, a compacting module arranged at the top of the supporting module and an adjusting module connected between the compacting module and the working platform, wherein the compacting module is compacted at the top of the cushion block and correspondingly props against the side edge of the seat plate from the end part. Here, the stability of the seat plate is increased.
Further, at least two first compressing members are symmetrically arranged on two opposite sides of the seat plate.
Preferably, the reverse positioning unit further comprises a second pressing member pressing the reverse positioning seat on the working platform, wherein the second pressing member has the same structure as the first pressing member.
Preferably, a plurality of convex ribs are distributed in the circumferential direction of the second ring body, and the circumferential direction of the positioning groove is correspondingly formed into an inward concave avoidance groove which is correspondingly matched with the convex ribs one by one. In this case, deflection of the workpiece during machining is avoided.
Preferably, the working platform is formed with a plurality of junk slots.
Specifically, the plurality of junk slots are arranged side by side at intervals, wherein each junk slot extends along the arrangement direction of the first station and the second station. Here, be convenient for collect the sweeps, prevent that the sweeps from piling up at work platform surface influence processing.
Due to the implementation of the technical scheme, compared with the prior art, the application has the following advantages:
the existing support ring processing method has the defects that the deformation of the support ring is easy to cause, the processing area on the support ring is blocked, and the processing precision is low and the efficiency is low because frequent adjustment of the position is needed; on the other hand realizes the location of holding ring through the cooperation between bolt, positioning seat and the holding ring, and the holding ring atress is little, and stable in structure just is difficult for deformation, effectively improves the product yields.
Drawings
FIG. 1 is a schematic front view of a wafer support ring of the present application;
FIG. 2 is a schematic cross-sectional view of A-A of FIG. 1;
FIG. 3 is a schematic front view of a positioning device for processing a wafer support ring according to the present application;
FIG. 4 is a schematic top view of FIG. 3;
FIG. 5 is an enlarged schematic view of the reverse positioning seat in FIG. 4;
FIG. 6 is a schematic view in section B-B of FIG. 5;
wherein: H. a support ring; h1, a first ring body; k0, connecting holes; h2, a second ring body; j. convex ribs;
1. a working platform; w1, a first station; w2, a second station; 10. a chip removal groove;
2. a forward positioning unit; 20. a forward positioning seat; 200. a cushion block; 201. a seat plate; q, the operation area; k1, a first through hole; 21. a first pressing member; 210. a support module; 211. a compaction module; 213. an adjustment module; 22. a forward connecting bolt;
3. a reverse positioning unit; 30. a reverse positioning seat; 300. a positioning groove; c. an avoidance groove; k2, a second through hole; 31. a reverse connecting bolt; 32. and a second pressing member.
Detailed Description
The following detailed description of the present application will provide further details in order to make the above-mentioned objects, features and advantages of the present application more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships are merely for convenience in describing the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature. It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 to 4, the wafer supporting ring H according to the present embodiment includes a first ring body H1 and a second ring body H2 that are concentric and have gradually decreasing outer diameters, wherein a plurality of connection holes k0 are formed in the first ring body H1 and distributed around the outer circumference of the second ring body H2 in an array manner; the positioning device for processing a wafer support ring according to the embodiment comprises a working platform 1 with a first station w1 and a second station w2, a forward positioning unit 2 and a reverse positioning unit 3 which are respectively arranged on the first station w1 and the second station w 2.
Specifically, the first station w1 and the second station w2 are arranged at left and right sides at intervals, and a plurality of chip grooves 10 are formed on the working platform 1 at intervals side by side, wherein each chip groove 10 extends along the left and right directions.
In this example, the forward positioning unit 2 includes a forward positioning seat 20 having a plurality of first through holes k 1, a first pressing member 21, and a plurality of forward connecting bolts 22, an operation area q for hand operation is formed between the forward positioning seat 20 and the working platform 1, the supporting ring H is flatly placed on top of the forward positioning seat 20 in the forward direction, and the plurality of forward connecting bolts 22 are correspondingly connected with each connecting hole k0 and the first through hole k 1 from the operation area q.
Specifically, the forward positioning seat 20 includes four pads 200 disposed on the working platform 1, and a rectangular seat board 201 horizontally disposed on top of the four pads 200, wherein an operation area q is formed between the seat board 201 and the working platform 1, and the four pads 200 are supported at four corners of the seat board 201, so that open openings for hands of workers to enter and exit are formed around the operation area q.
For convenience of implementation, the top of each pad 200 is disposed to one side of the corresponding side of the seat plate 201, and the first pressing member 21 is pressed against the portion of the top of the pad 200 protruding from the seat plate 201.
Specifically, the first pressing members 21 are two and symmetrically disposed on opposite sides of the seat plate 201, wherein each first pressing member 21 includes a support module 210 supported on the work platform 1, a pressing module 211 disposed on top of the support module 210, and an adjusting module 213 connected between the pressing module 211 and the work platform 1, wherein the pressing module 211 presses on top of the corresponding pad 200 and abuts against the corresponding side edge of the seat plate 201 from the end; the adjustment module 213 employs a bolt member to adjust the pressing force of the pressing module 211 in the up-down direction.
In this example, the reverse positioning unit 3 includes a rectangular reverse positioning seat 30 having a plurality of second through holes k2, a plurality of reverse connecting bolts 31, and a second pressing member 32 for pressing the reverse positioning seat 30 on the working platform 1, wherein the reverse positioning seat 30 is recessed downward from the top surface and forms a positioning groove 300 matching with the second ring body H2, during reverse positioning, the second ring body H2 is inserted into the positioning groove 300 and is attached to the inner wall of the positioning groove 300 from the circumferential direction, is supported at the bottom of the positioning groove 300 from the bottom, the first ring body H2 is supported at the top of the reverse positioning seat 30, and the plurality of reverse connecting bolts 31 correspondingly connect each second through hole k2 and the connecting hole k0 from top to bottom.
Specifically, a plurality of ribs j are formed in the circumferential direction of the second ring body H2, avoidance grooves c matched with the plurality of ribs j in a one-to-one correspondence manner are formed in the inner wall of the positioning groove 200, and each rib j is correspondingly inserted into each avoidance groove c during reverse positioning.
In addition, the second pressing part 32 has the same structure as the first pressing part 21, and the second pressing parts 32 are symmetrically arranged at two opposite sides of the reverse positioning seat 30
In summary, the processing method of the present embodiment includes the following steps:
s1, coarse processing
Gradually processing the outer circle and the inner hole of the circular ring blank body to form the outline of the first ring body H1 and the outline of the second ring body H2, and reserving a allowance for deformation; simultaneously, all the positions on the first ring body H1 and the second ring body H2 which are easy to generate stress are thickened so as to deform and release the stress
S2, stress relieving treatment
Heating the ring blank subjected to rough cutting to 360-420 ℃, preserving heat for 3-5H, and then air-cooling to 35-45 ℃, and circulating at least twice;
s3, finishing treatment
a) Processing a plurality of connecting holes k0 distributed around the periphery of the second ring body H2 on the first ring body H1, and grinding the end face of the first ring body H1 to be used as a processing reference surface;
b) Placing the circular ring blank on the forward positioning seat 20 in the forward direction, wherein a machining reference surface on the first ring body H1 is attached to the top surface of the forward positioning seat 20, connecting the first ring body H1 and the forward positioning seat 20 from bottom to top by adopting a forward connecting bolt 22, and then machining the exposed surfaces and the inner walls on the first ring body H1 and the second ring body H2 respectively;
c) Reversely placing the circular ring blank processed in the step b) on a reverse positioning seat 30, wherein the second ring body H2 is positioned on the reverse positioning seat 30 by taking the circumferential direction and the end face as processing references (namely, the second ring body H2 is inserted into a positioning groove 300), the first ring body H1 is supported on the reverse positioning seat 30, and is connected from top to bottom by adopting a reverse connecting bolt 31, the first ring body H1 is fixed with the reverse positioning seat 30, and then the exposed surface on the first ring body H1 is processed;
s4, polishing and checking
The finished surface of the support ring is polished and inspected for dimensions.
Therefore, the present embodiment has the following technical advantages:
the existing support ring processing method has the defects that the deformation of the support ring is easy to cause, the processing area on the support ring is blocked, and the processing precision is low and the efficiency is low because frequent adjustment of the position is needed; on the other hand realizes the location of holding ring through the cooperation between bolt, positioning seat and the holding ring, and the holding ring atress is little, and stable in structure just is difficult for deformation, effectively improves the product yields.
The present application has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present application and to implement the same, but not to limit the scope of the present application, and all equivalent changes or modifications made according to the spirit of the present application should be included in the scope of the present application.

Claims (10)

1. The wafer support ring processing method is characterized in that the support ring comprises a first ring body and a second ring body which are concentric and have gradually reduced outer diameters, and the wafer support ring processing method is characterized in that: the processing method comprises the following steps:
s1, coarse processing
Gradually processing the outer circle and the inner hole of the circular ring blank to form the outline of the first ring body and the outline of the second ring body, and reserving allowance for deformation;
s2, stress relieving treatment
Heating the ring blank subjected to rough cutting to 360-420 ℃, preserving heat for 3-5H, and then air-cooling to 35-45 ℃, and circulating at least twice;
s3, finishing treatment
a) Processing a plurality of connecting holes distributed around the periphery of the second ring body on the first ring body, and grinding the end face of the first ring body to be used as a processing reference surface;
b) The method comprises the steps of positively placing a circular ring blank on a forward positioning seat in a positioning device, attaching a machining reference surface on a first ring body to the top surface of the forward positioning seat, connecting the first ring body and the forward positioning seat from bottom to top by bolts, fixing the first ring body and the forward positioning seat, and then machining exposed surfaces and inner walls on the first ring body and the second ring body respectively;
c) Reversely placing the circular ring blank processed in the step b) on a reverse positioning seat in a positioning device, taking the self circumference and the end face of a second ring body as processing references and positioning the second ring body on the reverse positioning seat, supporting a first ring body on the reverse positioning seat, connecting the first ring body with the reverse positioning seat from top to bottom by bolts, fixing the first ring body with the reverse positioning seat, and then processing an exposed surface on the first ring body;
s4, polishing and checking
The finished surface of the support ring is polished and inspected for dimensions.
2. The wafer support ring processing method of claim 1, wherein: in S1, all the positions on the first ring body and the second ring body where stress is easily generated are thickened so as to deform and release the stress.
3. The wafer support ring processing method of claim 1, wherein: in S3, the positioning device used in step b) and step c) includes a working platform having a first station and a second station, and a forward positioning unit and a reverse positioning unit respectively disposed on the first station and the second station, where the forward positioning unit includes a forward positioning seat having a plurality of first through holes, and a plurality of forward connecting bolts, an operation area for hand operation is formed between the forward positioning seat and the working platform, the support ring is flatly placed on top of the forward positioning seat in a forward direction, and the plurality of forward connecting bolts are correspondingly connected with each of the connecting holes and the first through holes upward from the operation area; the reverse positioning unit comprises a reverse positioning seat with a plurality of second through holes and a plurality of reverse connecting bolts, wherein the reverse positioning seat is downwards recessed from the top surface and forms a positioning groove matched with the second ring body, during reverse positioning, the second ring body is inserted into the positioning groove, circumferentially attached to the inner wall of the positioning groove and supported at the bottom of the positioning groove from the bottom, the first ring body is supported at the top of the reverse positioning seat, and the plurality of reverse connecting bolts are correspondingly connected with each second through hole and each connecting hole from top to bottom.
4. A method of processing a wafer support ring as set forth in claim 3, wherein: the forward positioning seat comprises a plurality of cushion blocks arranged on the working platform and a seat plate horizontally arranged at the tops of the cushion blocks, wherein an operation area is formed between the seat plate and the working platform; and openings are formed around the operation area.
5. The method of processing a wafer support ring of claim 4, wherein: the top of each cushion block protrudes out of the corresponding side edge of the seat plate to one side; the forward positioning unit further comprises a first pressing component, wherein the first pressing component presses the part of the top of the cushion block, which protrudes out of the seat plate, and the first pressing component comprises a supporting module, a pressing module and an adjusting module, wherein the supporting module is supported on the working platform, the pressing module is arranged at the top of the supporting module, the adjusting module is connected between the pressing module and the working platform, and the pressing module presses the top of the cushion block and correspondingly presses the side edge of the seat plate from the end part.
6. The method of processing a wafer support ring of claim 5, wherein: the first pressing pieces are at least two and are symmetrically arranged on two opposite sides of the seat plate.
7. The wafer support ring processing method according to claim 5 or 6, wherein: the reverse positioning unit further comprises a second pressing component for pressing the reverse positioning seat on the working platform, wherein the second pressing component has the same structure as the first pressing component.
8. A method of processing a wafer support ring as set forth in claim 3, wherein: the circumference of second ring body distributes has many protruding muscle, the circumference of constant head tank corresponds and forms inwards sunken and with the dodge the groove of many protruding muscle one-to-one matches.
9. The method of processing a wafer support ring of claim 8, wherein: and a plurality of chip grooves are formed on the working platform.
10. The wafer support ring processing method of claim 9, wherein: the chip discharging grooves are distributed side by side at intervals, and each chip discharging groove extends along the arrangement direction of the first station and the second station.
CN202310628161.4A 2023-05-31 2023-05-31 Wafer support ring processing method Pending CN116587120A (en)

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Application Number Priority Date Filing Date Title
CN202310628161.4A CN116587120A (en) 2023-05-31 2023-05-31 Wafer support ring processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310628161.4A CN116587120A (en) 2023-05-31 2023-05-31 Wafer support ring processing method

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Publication Number Publication Date
CN116587120A true CN116587120A (en) 2023-08-15

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CN202310628161.4A Pending CN116587120A (en) 2023-05-31 2023-05-31 Wafer support ring processing method

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