CN116581229A - Display panel, preparation method of optical filter and forming method of display panel - Google Patents

Display panel, preparation method of optical filter and forming method of display panel Download PDF

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Publication number
CN116581229A
CN116581229A CN202310645655.3A CN202310645655A CN116581229A CN 116581229 A CN116581229 A CN 116581229A CN 202310645655 A CN202310645655 A CN 202310645655A CN 116581229 A CN116581229 A CN 116581229A
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light
layer
metal layer
display panel
light emitting
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Chinese (zh)
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林冬冬
孙天鹏
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Shenzhen Zhouming Technology Co Ltd
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Shenzhen Zhouming Technology Co Ltd
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Priority to CN202310645655.3A priority Critical patent/CN116581229A/en
Publication of CN116581229A publication Critical patent/CN116581229A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application relates to a display panel, a preparation method of a light filter and a forming method of the display panel, wherein the display panel comprises a light-emitting layer and the light filter, the light filter comprises a first metal layer, a micro-nano structure layer and a second metal layer which are sequentially arranged along the direction far away from the light-emitting layer, the micro-nano structure layer is used for focusing the light rays of the light-emitting layer, the first metal layer is used for allowing the light rays of the light-emitting layer to pass through, one side of the first metal layer and one side of the second metal layer, which face each other, are used for repeatedly reflecting part of the light rays of the light-emitting layer, the second metal layer is used for allowing part of the light rays of the light-emitting layer to pass out, and the light rays of the second metal layer are sequentially emitted to interfere with each other. So set up, can improve the luminous efficacy through micro-nano structure layer. The first metal layer and the second metal layer are matched to improve the light emitting effect of the display panel. The preparation method of the optical filter can prepare the optical filter included in the display panel lock, so that the display panel with high light efficiency can be manufactured conveniently. The method for forming the display panel is used for forming the display panel with high light emitting efficiency.

Description

Display panel, preparation method of optical filter and forming method of display panel
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of an optical filter and a forming method of the display panel.
Background
With the development of display technology, mini-LED COB display screens gradually appear. The Mini-LED COB display screen is characterized in that LED chips are packaged on a PCB, and smaller spacing can be realized among the LED chips, so that the display screen can realize high resolution under larger size.
However, the existing Mini-LED display screen has low light emitting efficiency, so that the whole energy consumption of the product is high.
Disclosure of Invention
Based on this, it is necessary to provide a display panel, a method for manufacturing an optical filter, and a method for forming a display panel, aiming at the problem of low light-emitting efficiency of a display screen.
A display panel, the display panel comprising:
a light emitting layer;
the optical filter comprises a first metal layer, a micro-nano structure layer and a second metal layer which are sequentially arranged along the direction away from the light-emitting layer, wherein the micro-nano structure layer is used for focusing light rays of the light-emitting layer, the first metal layer is used for allowing the light rays of the light-emitting layer to pass through, one side of the first metal layer and one side of the second metal layer, which face each other, are used for repeatedly reflecting part of the light rays of the light-emitting layer, the second metal layer is used for allowing part of the light rays of the light-emitting layer to pass out, and the light rays of the second metal layer are sequentially emitted to interfere with each other.
In one embodiment, the first metal layer comprises at least one of metallic chromium, metallic silver, a chromium compound, and a silver compound.
In one embodiment, the second metal layer comprises at least one of metallic aluminum, metallic nickel, an aluminum compound, and a silver compound.
In one embodiment, the thickness of the first metal layer is 4nm-6nm; and/or
The thickness of the second metal layer is 15nm-50nm; and/or
The thickness of the micro-nano structure layer is 325nm-405nm.
In one embodiment, the light emitting layer includes a plurality of light emitting chips arranged in an array at intervals, and the micro-nano structure layer includes a plurality of light condensing portions distributed corresponding to the light emitting chips, at least one of the light condensing portions corresponds to one of the light emitting chips.
In one embodiment, the light emitting layer further includes a filling layer, the filling layer is filled between the light emitting chips, the filling layer is further disposed between the light emitting chips and the optical filter, and the filling layer is made of a light-permeable and light-guiding material.
In one embodiment, the thickness dimension of the filling layer between the light emitting chip and the optical filter is smaller than 0.5mm along the direction that the light emitting chip points to the optical filter.
In one embodiment, the light emitting layer further includes a PCB substrate, the light emitting chip is encapsulated on the PCB substrate, and the PCB substrate is located at a side of the light emitting chip away from the optical filter.
A method of manufacturing an optical filter, the method comprising the steps of:
providing a substrate and a template with a micro-nano structure pattern;
forming a first metal layer on the substrate, wherein the first metal layer is used for light to pass through;
arranging a medium to be molded on the first metal layer;
transferring the micro-nano structure pattern on the template to the medium to be formed through imprinting to form a micro-nano structure layer;
removing the template;
and forming a second metal layer on the micro-nano structure layer, wherein one side of the second metal layer and one side of the first metal layer facing each other are used for repeatedly reflecting light, part of light passes through the second metal layer, and the light sequentially exiting the second metal layer interferes with each other.
A method of forming a display panel, the method comprising:
providing a PCB substrate;
packaging a plurality of light emitting chips on the PCB substrate;
filling optical glue between the light emitting chips, so that the optical glue covers a plurality of the light emitting chips to be in a flat state to form a filling layer;
the optical filter is prepared by the preparation method described in the above embodiment, and the optical filter is disposed on the side of the filling layer facing away from the light emitting chip.
In the display panel, the micro-nano structure layer can focus the light of the light-emitting chip, so that the light intensity is increased, the light-emitting efficiency of the display panel is improved, and the energy consumption of the display panel is relatively reduced. The first metal layer and the second metal layer are matched to improve the light emitting effect of the display panel.
Specifically, the first metal layer allows the light of the light emitting layer to pass through, and the light passing through the first metal layer is repeatedly reflected on one side of the first metal layer and the second metal layer facing each other, and the other part of the light can pass through the second metal layer and exit when passing through the second metal layer. Therefore, the light interference of the second metal layer emitted in sequence can be enhanced by controlling the thickness of the micro-nano structure layer. By means of the arrangement, the display panel can be provided with the characteristic of high saturated color by reasonably arranging the thicknesses of the first metal layer, the micro-nano structure layer and the second metal layer and combining the interference principle.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the application.
Fig. 2 is an axial schematic view of the filter in the display panel shown in fig. 1.
FIG. 3 shows the effect of the thickness of the first metal layer on the reflection spectrum.
FIG. 4 shows the effect of the thickness of the second metal layer on the reflection spectrum.
FIG. 5 is a graph showing the effect of micro-nanostructure layer thickness on reflectance spectra.
Fig. 6 is a schematic view of light condensation of the micro-nano structure in the optical filter shown in fig. 2.
Fig. 7 is a flowchart of a preparation method of an optical filter according to an embodiment of the application.
Reference numerals: 10. a display panel; 100. a light emitting layer; 110. a light emitting chip; 120. a PCB substrate; 130. a filling layer; 200. a light filter; 210. a first metal layer; 220. a micro-nano structural layer; 221. a light-gathering section; 230. a second metal layer; 240. a substrate; 300. outer adhesive layer
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
The inventor of the present application found that in order to realize a small distance, an LED chip is generally used as a light emitting component, namely, the Mini-LED display screen. In the Mini-LED display screen, as the whole structure of the LED chip is small, light is provided by the LED chip, so that the distance between pixels can be smaller, higher definition can be realized conveniently, and splicing is convenient.
At present, a Mini-LED display screen is generally packaged outside an LED chip by adopting optical cement added with a dispersing agent so as to conduct light. However, it is difficult to manually mix the optical cement to ensure that the ratio is the same each time. In addition, the diffusing agent usually uses silicon dioxide as a main raw material, and if the silicon dioxide is not sufficiently uniformly ground, the diffusing agent is easy to generate the phenomena of caking and the like when being mixed with the optical cement, and the phenomena of low light emitting efficiency, light emitting modularity, large light emitting angle deviation and the like of the display screen are caused.
In order to solve the above problems, the present application provides a display panel, a method for manufacturing an optical filter, and a method for forming a display panel. The display panel comprises an optical filter, and the optical filter is provided with a first metal layer, a micro-nano structure layer and a second metal layer. The light emitted by the light emitting chip can be focused by the optical filter through the micro-nano structure layer, and the transmittance of the optical filter is increased by improving the intensity of the light, so that the light emitting efficiency of the display panel is higher. The light emitting effect of the display panel can be improved through the mutual matching of the first metal layer and the second metal layer. The display panel, the method for manufacturing the optical filter and the method for forming the display panel provided by the application are described in detail below with reference to the detailed description and the accompanying drawings.
Referring to fig. 1 and 2, in one embodiment, the display panel 10 includes a light emitting layer 100 and a filter 200, wherein the light emitting layer 100 can emit light. The optical filter 200 includes a first metal layer 210, a micro-nano structure layer 220, and a second metal layer 230 sequentially arranged in a direction away from the light emitting layer 100. The micro-nano structured layer 220 is used to focus the light of the light emitting layer 100. The first metal layer 210 is used for passing light of the light emitting layer 100, one side of the first metal layer 210 and one side of the second metal layer 230 facing each other are used for repeatedly reflecting part of the light emitting layer 100, the second metal layer 230 is used for passing out part of the light emitting layer 100, and the light of the second metal layer 230 sequentially exits to interfere with each other.
In the display panel 10, the micro-nano structure layer 220 can focus the light of the light emitting chip 110, so as to increase the light intensity, thereby improving the light emitting efficiency of the display panel 10, i.e. relatively reducing the energy consumption of the display panel 10. The first metal layer 210 and the second metal layer 230 cooperate to enhance the light emitting effect of the display panel 10.
Specifically, the first metal layer 210 allows the light of the light emitting layer 100 to pass through, and a portion of the light passing through the first metal layer 210 is repeatedly reflected on a side of the first metal layer 210 and the second metal layer 230 facing each other, and another portion of the light can pass through the second metal layer 230 and exit. Thus, by controlling the thickness of the micro-nano structure layer 220, the interference of light rays emitted from the second metal layer 230 in sequence can be enhanced. By reasonably setting the thicknesses of the first metal layer 210, the micro-nano structure layer 220 and the second metal layer 230, the display panel 10 can have the characteristic of high saturated color by combining the interference principle.
In one embodiment, in order to enable light to be repeatedly reflected between the first metal layer 210 and the second metal layer 230, a material with a higher reflectivity may be used for the first metal layer 210 and the second metal layer 230. For example, the first metal layer 210 may include metallic chromium or a chromium compound. Taking chromium as an example, since chromium has a large influence on the reflection spectrum, it is known from the study of the reflection spectrum that as the thickness of the first metal layer 210 increases, the reflection peak wavelength shifts in the long-wave direction, and the reflection spectrum bandwidth becomes narrower and wider. The reflection spectrum bandwidth is minimized by properly setting the thickness of the first metal layer 210. At this time, the filter 200 has the highest color difference saturation, and the display effect is better. Chromium and chromium compounds are also highly absorptive. Thus, the degree of freedom in color development of the display panel 10 can be increased by a combination of interference and absorption.
In one embodiment, the second metal layer 230 may include aluminum and aluminum compounds. When the second metal layer 230 includes aluminum, the second metal layer 230 has a high reflectivity and plays a role of high reflection. The thickness of the second metal layer 230 is gradually increased within a certain range, and the reflection peak is gradually increased, but the reflection bandwidth is not changed.
For the micro-nano structured layer 220, as the thickness of the micro-nano structured layer 220 increases, the light emitted from the light emitting layer 100 will appear as a plurality of interference level layers. In the same level of layer, the reflected peak wavelength shifts toward the long wave as the micronano-structured layer 220 thickness. Thus, by reasonably adjusting the thicknesses of the first metal layer 210, the micro-nano structure layer 220 and the second metal layer 230, the color of the light can be controlled. It can be understood that, for the optical filter 200 including the multilayer film in the embodiments, to realize controllable light emitted from the display panel 10, the transmission matrix can be used to calculate the light propagation in the optical filter 200, so as to obtain the thickness relationship between the reflection spectrum and the first metal layer 210, the second metal layer 230 and the micro-nano structure layer 220 in the optical filter 200 by combining the interference principle, so that the color of the light emitted from each light emitting chip 110 can be controlled, and the required image can be formed conveniently. See fig. 1 and reference K in the drawings for the thickness direction.
Of course, in one embodiment, the material of the first metal layer 210 is not limited to chromium or a chromium compound, and the first metal layer 210 may include metallic silver or a silver compound. That is, the first metal layer 210 may include at least one of metallic chromium, metallic silver, a chromium compound, and a silver compound. Of course, other materials having similar properties may be used for the first metal layer 210.
In one embodiment, the material of the second metal layer 230 is not limited to aluminum or aluminum compound, and the first metal layer 210 may further include metallic nickel or nickel compound. That is, the first metal layer 210 may include at least one of metallic aluminum, metallic nickel, an aluminum compound, and a nickel compound. Of course, other materials having similar properties may be used for the second metal layer 230.
For ease of understanding and description, the following description will be given with respect to the first metal layer 210 including metallic chromium and the second metal layer 230 including metallic aluminum, with the understanding that the same applies to other materials.
In one embodiment, the first metal layer 210 has a thickness of 4nm-6nm, in conjunction with fig. 3 below. It can be understood that the influence of chromium on the reflection spectrum is larger, as the thickness of the first metal layer 210 increases, the reflection peak wavelength shifts toward the long-wave direction, the reflection spectrum bandwidth is narrowed first and then widened, and the reflection spectrum bandwidth can have the smallest point when the thickness of the first metal layer 210 is 4nm-6nm, and the color difference saturation of the optical filter 200 is the highest, so that the light emitting effect of the display panel 10 is better. The thickness of the first metal layer 210 may be specifically 5nm.
Referring to fig. 4, in one embodiment, the thickness of the second metal layer 230 is 15nm-50nm. The reflection peak value of aluminum gradually increases when the thickness thereof gradually increases from 0 to 50nm, and the reflection bandwidth does not change. When the thickness of the second metal layer 230 is less than 15nm, the second metal layer 230 is thinner and the light wave transmission energy loss is large. The thickness of the second metal layer 230 may be selected to be 15nm-50nm.
Referring to FIG. 5, in one embodiment, the micro-nano structured layer 220 has a thickness of 325nm-405nm. The micro-nano structure layer 220 is used as an intermediate dielectric layer between the first metal layer 210 and the second metal layer 230, and according to the influence of the thickness of the dielectric film on the reflection spectrum, the thickness of the intermediate dielectric layer obtains red-green reflection at 325nm and 405nm.
Thus, the spectrum is calculated according to the transmission matrix method and tested by using a spectrophotometer, and when the incident light is incident at 8%, the red-green light reflection peak wavelengths are 644mm and 538mm respectively, and the corresponding peak reflectivity is about 89%. The filter 200 is thus arranged, and the micro-nano structure is utilized as a single pixel, so that more efficient color efficiency and light emission can be presented.
Referring to fig. 1 and fig. 6, in an embodiment, the light emitting layer 100 includes a plurality of light emitting chips 110 arranged at intervals in an array, and the micro-nano structure layer 220 includes a plurality of light condensing portions 221 distributed corresponding to the light emitting chips 110. At least one of the light condensing parts 221 corresponds to one of the light emitting chips 110. In this way, the light emitted from the corresponding light emitting chip 110 can be focused by the light condensing unit 221, and the light can be adjusted to be parallel light.
The light condensing portions 221 provided on the micro-nano structure layer 220 are matched with each other, so that the light emitted from the entire display panel 10 can be more uniform. Specifically, since the light emitting chips 110 are arranged at intervals, the light emitted from each light emitting chip 110 is emitted in a straight line, and thus local light distribution unevenness is likely to occur, so that the entire display panel 10 emits light unevenly. The micro-nano structure layer 220 focuses the light through the light condensing portion 221, and changes the light emitting angle to redistribute the light, thereby improving the uniformity of the light emitted from the display panel 10. Meanwhile, the corners of the light passing through the micro-nano structure layer 220 can be considered during propagation, and refraction can still be performed according to the original direction.
Referring to fig. 6, in one embodiment, the light focusing portion 221 includes a concave curved surface to achieve the effect of focusing light. The concave curved surface can comprise a spherical surface, an ellipsoidal surface and the like, and can be correspondingly arranged according to actual light condensation requirements, and the description is omitted here.
In one embodiment, one light emitting chip 110 may also correspond to a plurality of light condensing parts 221. That is, the light condensing portions 221 may be matched with each other to focus light rays of different regions of the same light emitting chip 110 to form parallel light.
In one embodiment, the light emitting chips 110 may be grouped into one group, and the display panel 10 includes a plurality of groups of the light emitting chips 110. The group of light emitting chips 110 includes a light emitting chip 110 capable of emitting red light, a light emitting chip 110 capable of emitting green light, and a light emitting chip 110 capable of emitting blue light. The three pixels of red, green and blue are used to jointly form the picture to be displayed on the display panel 10.
Referring to fig. 1, in one embodiment, the light emitting layer 100 further includes a filling layer 130, and the filling layer 130 is filled between the plurality of light emitting chips 110. The filling layer 130 is further disposed between the light emitting chip 110 and the optical filter 200, and the filling layer 130 is made of a light-permeable and light-guiding material. Thus, the filling layer 130 fills the space between the light emitting chips 110, thereby achieving a uniform light effect, and the display panel 10 improves the problem of uneven light emission.
In one embodiment, the filler layer 130 may employ an optical adhesive. In this way, the filter 200 and the light emitting chip 110 can be connected to each other so that they have a stable relative position. The filler layer 130 may be specifically made of epoxy resin to which a diffusing agent is added. Since the epoxy resin is made of a transparent material, the light-emitting effect and the light-homogenizing effect can be enhanced. The refractive index of the filler layer 130 using epoxy resin with a diffusion agent added thereto was 1.56.
In one embodiment, first metal layer 210 includes chromium and/or a chromium compound. The refractive index of chromium is about 2.97, i.e., the refractive index of chromium is relatively high, which can improve the light extraction efficiency of the display panel 10. The refractive index of the chromium compound, for example, chromium oxide, is about 2.705, that is, the refractive index of the chromium compound, for example, chromium oxide, is relatively high, and the light-emitting efficiency of the display panel 10 can be improved.
In one embodiment, the micro-nano structure layer 220 may include an optical paste, and the micro-nano structure layer 220 may focus light by forming a micro-nano structure with the light condensing part 221 on the optical paste. The micro-nano structure layer 220 may specifically include an ultraviolet curing glue, where the ultraviolet curing glue can be cured rapidly under the irradiation of an ultraviolet lamp, so as to form the micro-nano structure layer 220. The micro-nano structure layer 220 is formed by ultraviolet curing glue, and is convenient for transmitting light. The refractive index of the micro-nano structured layer 220 formed of the uv curable glue is about 1.55.
In one embodiment, the thickness dimension of the filling layer 130 between the light emitting chip 110 and the optical filter 200 is less than 0.5mm along the direction in which the light emitting chip 110 is directed toward the optical filter 200. In this way, the effect of light propagation by the filler layer 130 is reduced, while the light-homogenizing effect is increased by the filler layer 130. It is understood that, on the basis that the surface of each light emitting chip 110 can be covered with the filling layer 130 to be flat, the smaller the thickness dimension of the filling layer 130 between the light emitting chip 110 and the optical filter 200 is, the better. In actual production, the thickness dimension of the filling layer 130 between the light emitting chip 110 and the optical filter 200 may be controlled to be between 0.01mm and 0.5mm to control the cost.
In one embodiment, the light emitting layer 100 further includes a PCB substrate 120, the light emitting chip 110 is encapsulated on the PCB substrate 120, and the PCB substrate 120 is located at a side of the light emitting chip 110 away from the optical filter 200. The PCB substrate 120 serves as a driving means of the light emitting chip 110 for providing a driving voltage to the light emitting chip 110.
In one embodiment, the display panel 10 further includes an outer adhesive layer 300, and the outer adhesive layer 300 is coated and cured on a side of the optical filter 200 away from the light emitting chip 110, and by coating the outer adhesive layer 300 on the surface of the optical filter 200, the structure of the optical filter 200 can be protected, and the light emitting effect can be improved.
In order to facilitate understanding of the structure of the display panel 10, the following will briefly explain the overall structure of the display panel 10. The display panel 10 sequentially includes a PCB substrate 120, a light emitting chip 110, a filling layer 130, a first metal layer 210, a micro-nano structure layer 220, a second metal layer 230, and an outer adhesive layer 300. The PCB substrate 120 is used to drive the light emitting chip 110 to emit light. The filling layer 130 is filled between the light emitting chips 110, and the filling layer 130 is also filled between the optical filter 200 and the light emitting chips 110 to improve the connection between the optical filter 200 and the substrate and the light emitting chips 110. Along the direction away from the light emitting chip 110, the first metal layer 210, the micro-nano structure layer 220 and the second metal layer 230 are sequentially distributed, and the filter 200 can have high transmittance through the arrangement of the micro-nano structure layer 220; the saturation of the color representation of the filter 200 is improved by the first metal layer 210 in combination with the second metal layer 230. In this way, the light output efficiency is higher when the light passes through the filter 200, so that the energy consumption of the panel can be relatively reduced.
In the present application, the transmittance of the display panel 10 can be between 98% and 99.7% by the above embodiments.
An embodiment of the present application further provides a method for preparing the optical filter 200, as shown in fig. 7, which includes the following steps S41 to S46.
In step S41, a substrate 240 and a template with micro-nano structure patterns are provided.
Wherein the substrate 240 may be a PET (polyethylene terephthalate) film substrate 240. The template may be a 500 μm point array nickel template.
In step S42, a first metal layer 210 containing chromium is formed on the substrate 240, and the first metal layer 210 is provided for light to pass through.
The first metal layer 210 may include chromium, a chromium compound, silver, or a silver compound, among others. The manner of forming the first metal layer 210 on the substrate 240 may include electrolysis, sputtering, vacuum deposition, high temperature diffusion, and the like.
In step S43, a medium to be molded is disposed on the first metal layer 210.
The medium to be formed is used for bearing the light condensing portion 221, and finally forms the micro-nano structure layer 220. The medium to be molded can be ultraviolet curing glue. Step S43 further includes steps S431 and S432,
in step S431, a dielectric paste to be formed is coated on a side of the first metal layer 210 facing away from the light emitting chip 110.
In step S432, the medium glue to be molded is baked to cure the medium to be molded, even if the medium to be molded has a relatively fixed shape.
Wherein, the baking time length can be adaptively adjusted according to the components of the medium to be molded. For example, when the medium to be molded includes an ultraviolet curable paste, the baking time may be 1 minute.
In step S44, the micro-nano structure pattern on the template is transferred to the medium to be molded by imprinting, so as to form the micro-nano structure layer 220.
The imprinting can be performed by a nano imprinting machine, so that the micro-nano structure on the template is transferred onto the medium to be molded to form the micro-nano structure layer 220, so that the micro-nano structure layer 220 can realize light condensation, and the light emitting effect of the display panel 10 is improved.
It will be appreciated that the imprinting described in this embodiment is one way of forming the micro-nano structured layer 220. Etching or the like may be used to form the micro-nano structure layer 220 having the micro-nano structure of the light condensing portion 221 on the medium to be formed.
Step S45, removing the template.
In step S46, a second metal layer 230 containing aluminum is formed on the micro-nano structural layer 220, and one side of the second metal layer 230 and one side of the first metal layer 210 facing each other are used for repeatedly reflecting light, and the second metal layer 230 allows part of the light to pass through and the light sequentially exiting the second metal layer 230 interferes with each other. Thus, by controlling the thickness of the micro-nano structure layer 220, the interference of light rays emitted from the second metal layer 230 in sequence can be enhanced. By reasonably setting the thicknesses of the first metal layer 210, the micro-nano structure layer 220 and the second metal layer 230, the display panel 10 can have the characteristic of high saturated color by combining the interference principle.
The second metal layer 230 may include aluminum, a compound of aluminum, nickel, or a compound of nickel, among others. The second metal layer 220 may be deposited on the micro-nano structured layer 220 by ion beam sputter deposition techniques. Of course, the second metal layer 220 having high reflectivity may be formed on the micro-nano structure layer 220 in other manners.
An embodiment of the present application also provides a method for forming the display panel 10, including the steps of:
in step S1, a PCB substrate 120 is provided.
In step S2, the plurality of light emitting chips 110 are packaged on the PCB substrate 120. In this manner, the light emitting chip 110 can be driven to emit light through the PCB substrate 120.
In step S3, the optical cement is filled between the light emitting chips 110, so that the optical cement covers the light emitting chips 110 to a flat state to form the filling layer 130. In this way, the light uniformity effect of the display panel 10 can be improved, and the phenomenon of uneven light emission can be reduced.
In step S4, the optical filter 200 is prepared by using the preparation method of the optical filter 200 as described in the above embodiment, and the optical filter 200 is disposed on the side of the filling layer 130 facing away from the light emitting chip 110. Thus, the light emitted from the display panel 10 is more uniform and the light emitting efficiency is high when the light passes through the filter 200.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (10)

1. A display panel, the display panel comprising:
a light emitting layer;
the optical filter comprises a first metal layer, a micro-nano structure layer and a second metal layer which are sequentially arranged along the direction away from the light-emitting layer, wherein the micro-nano structure layer is used for focusing light rays of the light-emitting layer, the first metal layer is used for allowing the light rays of the light-emitting layer to pass through, one side of the first metal layer and one side of the second metal layer, which face each other, are used for repeatedly reflecting part of the light rays of the light-emitting layer, the second metal layer is used for allowing part of the light rays of the light-emitting layer to pass out, and the light rays of the second metal layer are sequentially emitted to interfere with each other.
2. The display panel of claim 1, wherein the first metal layer comprises at least one of metallic chromium, metallic silver, a chromium compound, and a silver compound.
3. The display panel of claim 2, wherein the second metal layer comprises at least one of metallic aluminum, metallic nickel, an aluminum compound, and a silver compound.
4. A display panel according to claim 3, wherein the thickness of the first metal layer is 4nm-6nm; and/or
The thickness of the second metal layer is 15nm-50nm; and/or
The thickness of the micro-nano structure layer is 325nm-405nm.
5. The display panel according to claim 1, wherein the light emitting layer includes a plurality of light emitting chips arranged in an array at intervals, and the micro-nano structure layer includes a plurality of light condensing portions distributed corresponding to the light emitting chips, at least one of the light condensing portions corresponding to one of the light emitting chips.
6. The display panel of claim 5, wherein the light-emitting layer further comprises a filler layer filled between the plurality of light-emitting chips, the filler layer further disposed between the light-emitting chips and the optical filter, the filler layer being of a light-transmissive, light-conductive material.
7. The display panel of claim 6, wherein a thickness dimension of the filler layer between the light emitting chip and the filter along a direction in which the light emitting chip is directed toward the filter is less than 0.5mm.
8. The display panel of any one of claims 5-7, wherein the light emitting layer further comprises a PCB substrate, the light emitting chip is encapsulated on the PCB substrate, and the PCB substrate is located on a side of the light emitting chip away from the optical filter.
9. The preparation method of the optical filter is characterized by comprising the following steps of:
providing a substrate and a template with a micro-nano structure pattern;
forming a first metal layer on the substrate, wherein the first metal layer is used for light to pass through;
arranging a medium to be molded on the first metal layer;
transferring the micro-nano structure pattern on the template to the medium to be formed through imprinting to form a micro-nano structure layer;
removing the template;
and forming a second metal layer on the micro-nano structure layer, wherein one side of the second metal layer and one side of the first metal layer facing each other are used for repeatedly reflecting light, part of light passes through the second metal layer, and the light sequentially exiting the second metal layer interferes with each other.
10. A method of forming a display panel, the method comprising:
providing a PCB substrate;
packaging a plurality of light emitting chips on the PCB substrate;
filling optical glue between the light emitting chips, so that the optical glue covers a plurality of the light emitting chips to be in a flat state to form a filling layer;
a filter prepared by the preparation method according to claim 9 and disposed on a side of the filling layer facing away from the light emitting chip.
CN202310645655.3A 2023-06-01 2023-06-01 Display panel, preparation method of optical filter and forming method of display panel Pending CN116581229A (en)

Priority Applications (1)

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CN202310645655.3A CN116581229A (en) 2023-06-01 2023-06-01 Display panel, preparation method of optical filter and forming method of display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310645655.3A CN116581229A (en) 2023-06-01 2023-06-01 Display panel, preparation method of optical filter and forming method of display panel

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CN116581229A true CN116581229A (en) 2023-08-11

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