CN116564946A

CN116564946A - Power module

Info

Publication number: CN116564946A
Application number: CN202210100744.5A
Authority: CN
Inventors: 苏仁濬
Original assignee: Super Group Semiconductor Co Ltd
Current assignee: Super Group Semiconductor Co Ltd
Priority date: 2022-01-27
Filing date: 2022-01-27
Publication date: 2023-08-08

Abstract

The invention discloses a power module. The power module includes an electrical interconnect assembly and at least one electronic component set. The electrical interconnection assembly includes a conductive structure and a circuit board. The conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and mutually insulated. The circuit board is arranged on the conductive structure. The circuit board defines an opening, and the opening corresponds to the first conductive member locally and corresponds to the second conductive member locally. The at least one electronic component group comprises a power component, and the power component is provided with a first connecting pad, a second connecting pad and a third connecting pad. The first connecting pad and the second connecting pad are respectively and electrically connected to the first conductive piece and the second conductive piece through the openings, and the third connecting pad is arranged on the circuit board.

Description

Power module

Technical Field

The present invention relates to a power module, and more particularly, to a power module having high withstand voltage.

Background

The power module may be used in household variable frequency systems, electric vehicles, and industrial control systems (industrial control system) to convert electrical energy or control circuitry. In conventional circuitry, power devices, gate drive devices, and control devices are typically integrated. In the prior art, after a specific circuit layout is formed on a circuit board in advance according to a circuit design, a plurality of discrete power elements, control elements, gate driving elements and other related parts are assembled on a main control circuit board to integrate a power module.

However, in some circuits, such as: the voltage conversion circuit, the power module may need to operate under high power conditions such as high voltage or high current. Therefore, the power module is required to have characteristics of high withstand voltage and high current operation.

Disclosure of Invention

The invention aims to solve the technical problem of providing a power module aiming at the defects of the prior art, so that the power module has high voltage resistance and can be operated under high current.

In order to solve the technical problems, one technical scheme adopted by the invention is to provide a power module. The power module includes an electrical interconnect assembly and at least one electronic component set. The electrical interconnect assembly includes a conductive structure and a first circuit board. The conductive structure comprises a first conductive piece, a second conductive piece and a third conductive piece which are arranged side by side and mutually insulated. The second conductive piece and the third conductive piece are respectively positioned at two opposite sides of the first conductive piece. The first circuit board partially covers the conductive structure. The first electronic component group comprises a first power component and a second power component. The first power element is bridged between the first conductive piece and the second conductive piece and is electrically connected with the first circuit board, and the second power element is bridged between the first conductive piece and the third conductive piece and is electrically connected with the first circuit board. The second power element is connected in series with the first power element through the first conductive member.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a power module. The power module includes an electrical interconnect assembly and at least one electronic component set. The electrical interconnection assembly includes a conductive structure and a circuit board. The conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and mutually insulated. The circuit board is arranged on the conductive structure. The circuit board defines an opening, and the opening corresponds to the first conductive member locally and corresponds to the second conductive member locally. The at least one electronic component group comprises a power component, and the power component is provided with a first connecting pad, a second connecting pad and a third connecting pad. The first connecting pad and the second connecting pad are respectively and electrically connected to the first conductive piece and the second conductive piece through the openings, and the third connecting pad is arranged on the circuit board.

The power module provided by the invention has the beneficial effects that the power module can be operated under high voltage and high current by the technical scheme that the conductive structure comprises a first conductive piece and a second conductive piece which are mutually arranged side by side and mutually insulated, the circuit board partially covers the conductive structure, the first connecting pad and the second connecting pad of the power element are respectively and electrically connected with the first conductive piece and the second conductive piece, and the third connecting pad is arranged on the circuit board.

For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic perspective view of a power module according to a first embodiment of the invention.

Fig. 2 is an exploded perspective view of a power module according to a first embodiment of the invention, wherein a package layer is omitted.

Fig. 3 is an exploded perspective view of a power module according to a first embodiment of the invention with a omitted package layer at another angle.

Fig. 4 is a partially exploded perspective view of a power module according to a first embodiment of the invention, wherein the heat sink and the encapsulation layer are omitted.

Fig. 5 is a schematic cross-sectional view taken along line V-V in fig. 1.

Fig. 6 is an enlarged partial schematic view of the region VI in fig. 5.

Fig. 7 is an enlarged partial cross-sectional view of a power module according to another embodiment of the invention.

Fig. 8 is a schematic cross-sectional view taken along line VIII-VIII in fig. 1.

Fig. 9 is a schematic cross-sectional view of a power module according to a second embodiment of the invention.

Fig. 10 is a schematic cross-sectional view of a power module according to a third embodiment of the invention.

Fig. 11 is an exploded perspective view of a power module according to a fourth embodiment of the invention, wherein the encapsulation layer is omitted.

Fig. 12 is an exploded perspective view of a power module according to a fifth embodiment of the invention, wherein the heat sink and the package layer are omitted.

Fig. 13 is a partially enlarged schematic illustration of the region XIII in fig. 12.

Fig. 14 is an exploded perspective view of a power module according to a sixth embodiment of the invention, wherein the heat sink and the package layer are omitted.

Fig. 15 is a partially enlarged schematic view of the region XV in fig. 14.

Detailed Description

The following specific examples are given to illustrate the embodiments of the present invention disclosed herein with respect to "power module", and those skilled in the art will be able to understand the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1 to 3, fig. 1 is a schematic perspective view of a power module according to a first embodiment of the invention, and fig. 2 and 3 are schematic perspective exploded views of the power module at different angles respectively. The power module M1 of the present embodiment can be applied to a circuit design of an electronic product, and is suitable for operating under high voltage and high current. In the present embodiment, the power module M1 includes an electrical interconnection assembly 1, at least one electronic component group 2a,2b (two are shown in fig. 2 as an example), heat dissipation members 3a,3b, a plurality of input/output pins 4, and a package layer 5.

The electrical interconnect assembly 1 is configured to carry the electronic component sets 2a,2b and to establish electrical connection between the plurality of electronic components within the electronic component sets 2a,2 b. The detailed structure of the electrical interconnection element 1 and the electrical connection relationship between the electrical interconnection element 1 and the electronic component groups 2a,2b according to the embodiments of the present invention are further described below. In this embodiment, a part of the circuits forming the voltage conversion system circuit will be described as an example.

Referring to fig. 2, the electrical interconnection assembly 1 includes a conductive structure 10, a first circuit board 11 and a second circuit board 12. The conductive structure 10 of the present embodiment includes a first conductive member 101, a second conductive member 102, and a third conductive member 103. The first conductive member 101, the second conductive member 102, and the third conductive member 103 are disposed side by side in the first direction D1 and are insulated from each other. The second conductive element 102 and the third conductive element 103 are respectively located on opposite sides of the first conductive element 101.

Further, the first to third conductive members 101 to 103 can be used to construct current transmission paths of a plurality of electronic components in the electronic component groups 2a,2 b. In the present embodiment, each of the first to third conductive members 101 to 103 has a plate shape, and the thickness may range from 0.5mm to 4mm. In addition, the material constituting the first to third conductive members 101 to 103 may be selected to have a high conductivity, such as: copper or alloys thereof to reduce parasitic resistance. Thus, the first to third conductive members 101 to 103 allow a larger current to pass therethrough, so that the power module M1 can be operated under the conditions of a large voltage and a large current.

In this embodiment, the first conductive element 101 and the second conductive element 102 are separated from each other to define a slot h1. In addition, the first conductive element 101 and the third conductive element 103 are also separated from each other, so as to define another slot h2. In this embodiment, the electrical interconnection assembly 1 further includes an insulating bonding material 104, and the insulating bonding material 104 is located in the slot h1 between the first conductive member 101 and the second conductive member 102 to connect the first conductive member 101 and the second conductive member 102. In addition, another insulating bonding material 104 is further disposed in the slot h2 between the first conductive member 101 and the third conductive member 103 to connect the first conductive member 101 and the third conductive member 103.

As shown in fig. 1 and 2, the first conductive member 101 has a first end 101e, the second conductive member 102 has a second end 102e, and the third conductive member 103 has a third end 103e. The second end 102e and the third end 103e are disposed in the same direction, while the first end 101e and the second end 102e (or the third end 103 e) are disposed in opposite directions. In addition, the power module M1 may be connected to another system circuit through the first to third terminals 101e-103 e. For example, the first end 101e may be electrically connected to a voltage switching terminal, one of the second end 102e and the third end 103e is electrically connected to a power voltage terminal, and the other is electrically connected to a ground terminal. In addition, the first to third conductive members 101 to 103 have high rigidity (stiffness) and strength, so that the power module M1 of the present invention can be connected to another system circuit by means of a plug-in unit.

In addition, in the embodiment of fig. 2, the upward surfaces of the first conductive element 101, the second conductive element 102 and the third conductive element 103 together define an element disposing surface SA, and the downward surfaces of the first conductive element 101, the second conductive element 102 and the third conductive element 103 together define another element disposing surface SB.

Please refer to fig. 1 and fig. 2 in combination. In the present embodiment, the first circuit board 11 and the second circuit board 12 are respectively located at two opposite sides of the conductive structure 10. In other words, the first wiring board 11 and the second wiring board 12 are separated from each other by the conductive structure 10. It should be noted that, by disposing the first circuit board 11 and the second circuit board 12 on opposite sides of the conductive structure 10, warpage of the electrical interconnection assembly 1 due to high temperature during a process (e.g., reflow process) can be avoided.

At least one of the first circuit board 11 and the second circuit board 12 may be a single-layer circuit board or a multi-layer circuit board, and the other may be an insulating board without wires, a single-layer circuit board or a multi-layer circuit board. That is, the surface and the inside of one of the first circuit board 11 and the second circuit board 12 are provided with a plurality of traces (not shown) and pads (not shown) according to practical requirements. Accordingly, the plurality of electronic components in the electronic component groups 2a,2b may be disposed on the first circuit board 11 or the second circuit board 12 according to the actual circuit design.

It should be noted that, in the present embodiment, the thickness of the first circuit board 11 and the thickness of the second circuit board 12 are smaller than the thickness of the conductive structure 10. Further, the thickness of the first wiring board 11 (or the second wiring board 12) is about 150 μm to 400 μm. In addition, the sum of the thicknesses of the first circuit board 11 and the second circuit board 12 is also smaller than the thickness of the conductive structure 10.

Referring to fig. 2 and fig. 4 in combination, fig. 4 is a partially exploded perspective view of a power module according to a first embodiment of the invention, wherein a heat sink and a package layer are omitted. Further, the first circuit board 11 of the present embodiment has two openings 11ha,11hb. One of the openings 11ha corresponds to the slot h1 between the first conductive member 101 and the second conductive member 102, and exposes the first conductive member 101 and the second conductive member 102 locally. Accordingly, the width of the opening 11ha is larger than the width of the slot h1 in the first direction D1. The opening 11ha may define a first pad setting area 101a and a second pad setting area 102a on the first conductive element 101 and the second conductive element 102, respectively.

Similarly, the position of the other opening 11hb corresponds to the slot h2 between the first conductive member 101 and the third conductive member 103, and the first conductive member 101 and the third conductive member 103 are partially exposed. Accordingly, the opening 11hb defines another first pad setting area 101a on the first conductive member 101, and defines a third pad setting area 103a on the third conductive member 103. That is, the first circuit board 11 partially covers the first conductive member 101, the second conductive member 102, and the third conductive member 103.

Referring to fig. 3, similar to the first circuit board 11, the second circuit board 12 also has two openings 12ha,12hb. One of the openings 12ha corresponds to the slot h1 between the first conductive member 101 and the second conductive member 102, and exposes the first conductive member 101 and the second conductive member 102 locally. The other opening 12hb is located corresponding to the slot h2 between the first conductive member 101 and the third conductive member 103, and partially exposes the first conductive member 101 and the third conductive member 103. By partially exposing the first conductive member 101, the second conductive member 102, and the third conductive member 103, transmission of a large current load can be handled separately from control signals using the first wiring board 11 and the second wiring board 12.

Accordingly, the second circuit board 12 may define two first pad setting areas 101b on the bottom side of the first conductive element 101, and define another second pad setting area 102b and another third pad setting area 103b on the bottom sides of the second conductive element 102 and the third conductive element 103, respectively. However, the present invention is not limited thereto, and in another embodiment, the second circuit board 12 may have only one of the openings 12ha,12hb. That is, the first wiring board 11 partially covers the component mounting area SA, and the second wiring board 12 partially covers the other component mounting surface SB.

It should be noted that, in the present embodiment, the first circuit board 11 and the second circuit board 12 are embedded at two sides of the conductive structure 10. Referring to fig. 2 and 4, the first conductive element 101 has a first recessed region (not numbered) recessed with respect to the two first pad-setting regions 101a on a side facing the first circuit board 11. In other words, the first pad-setting areas 101a of the first conductive elements 101 are all bosses. In addition, the first circuit board 11 has a first circuit configuration portion 111 located on the first conductive member 101, and an edge contour of the first circuit configuration portion 111 matches an edge contour of the first pad setting region 101a (or the first recess region) and is disposed in the first recess region.

Similarly, referring to fig. 3, on the side facing the first circuit board 11, the second conductive member 102 also has a second concave region (not numbered) concave with respect to the second pad setting region 102a, and the third conductive member 103 has a third concave region (not numbered) concave with respect to the third pad setting region 103 a. In addition, the first circuit board 11 further has a second circuit arrangement portion 112 disposed in the second recess region, and a third circuit arrangement portion 113 disposed in the third recess region. In this embodiment, the edge profile of the second circuit configuration portion 112 matches the edge profile of the second pad setting area 102a, and the edge profile of the third circuit configuration portion 113 matches the edge profile of the third pad setting area 103 a.

In other words, the two side edge profiles of the opening 11ha of the first circuit board 11 are respectively matched with the edge profiles of the first pad setting area 101a and the second pad setting area 102a, and the two side edge profiles of the opening 11hb are respectively matched with the edge profiles of the other first pad setting area 101a and the third pad setting area 103 a.

Referring to fig. 3, the first to third conductive members 101 to 103 may also have a first recess region, a second recess region and a third recess region formed on a side facing the second circuit board 12. The edge profile of the second circuit board 12 at the opening 12ha matches the edge profiles of the first pad setting area 101b and the second pad setting area 102b, and the edge profile of the opening 12hb matches the edge profile of the other first pad setting area 101b and the edge profile of the third pad setting area 103 b. However, the invention is not limited thereto. In another embodiment, the surfaces of the first to third conductive members 101 to 103 facing the second wiring board 12 may also be flat surfaces.

Referring to fig. 2 to 4, two electronic component groups 2a,2b are disposed on the electrical interconnection element 1 and are respectively located on two opposite sides of the electrical interconnection element 1, but the invention is not limited thereto. Each of the electronic component sets 2a,2b may include one or more electronic components (a plurality of which are shown in fig. 1 and 2, for example). The electronic component may be a power component, a control component, a diode component, a passive component, a protection component, or the like, and the present invention is not limited thereto. In addition, the electronic component groups 2a,2b may also include one or more of a power component, a control component, a diode component, a passive component, or a protection component.

The power element is, for example, an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT), a Metal-Oxide-semiconductor field effect transistor (MOSFET), or any combination thereof. The material of the power element is, for example, silicon carbide, silicon or gallium nitride. In addition, the diode element is, for example, a fast forward diode (FRD) or a power diode. When the power module M1 is applied to a voltage conversion circuit, the electronic component groups 2A,2B may include a plurality of power components 21,22 arranged in an array.

Referring to fig. 4 and 5, each power device 21,22 may include a first pad 21s,22s, a second pad 21d,22d, and a third pad 21g,22g. The first pads 21s,22s may be source pads, the second pads 21d,22d may be drain pads, and the third pads 21g,22g may be gate pads. In detail, each power device 21,22 may include a power chip 210,220 and conductive connectors 211,221 connected to the power chip 210, 220. The first pads 21s,22s and the third pads 21g,22g are located on the active surfaces of the power chips 210, 220. Conductive connections 211,221 are provided on the back side of the power chips 210,220 and have pin portions 211t,221t. The second pads 21d,22d are disposed at the ends of the lead portions 211t,221t.

For convenience of description, the electronic component group 2A is defined as a first electronic component group, and the electronic component group 2B is defined as a second electronic component group. In addition, in the first electronic component group 2A, the power element 21 connected to the first conductive member 101 and the second conductive member 102 is defined as a first power element, and the power element 22 connected to the first conductive member 101 and the third conductive member 103 is defined as a second power element. The plurality of first power elements 21 arranged in the same row in the second direction D2 may be connected in parallel to each other by the conductive structure 10. Similarly, a plurality of second power elements 22 arranged in another row in the second direction D2 may also be connected in parallel with each other by the conductive structure 10.

Referring to fig. 4 and 5 in combination, fig. 5 is a schematic cross-sectional view along the line V-V in fig. 1. In detail, the first pad 21s (source pad) and the second pad 21d (drain pad) of each first power device 21 can be electrically connected to the first conductive element 101 and the second conductive element 102 through the openings 11ha,12ha of the first circuit board 11 or the second circuit board 12, respectively. In addition, the third pad 21g (gate pad) of each first power device 21 is disposed on the first circuit configuration portion 111,121 of the first circuit board 11 or the second circuit board 12, and is electrically connected to a circuit (not shown) in the first circuit board 11.

In detail, the first pad 22s (source pad) and the second pad 22d (drain pad) of each second power device 22 can be electrically connected to the first conductive element 101 and the third conductive element 103 through the other openings 11hb,12hb of the first circuit board 11 or the second circuit board 12, respectively. In addition, the third pad 22g (gate pad) of each second power device 22 is disposed on the third circuit arrangement portion 113,123 of the first circuit board 11 or the second circuit board 12, and is electrically connected to a circuit (not shown) in the first circuit board 11.

Based on the above, as shown in fig. 5, the first pads 21s (source pads) of the first power elements 21 and the second pads 22D (drain pads) of the second power elements 22 arranged in the same row in the first direction D1 are commonly connected to the first conductive member 101, so that the first power elements 21 and the second power elements 22 are connected in series with each other. It should be noted that the number of the power elements 21,22 and the electrical connection relationship thereof can be adjusted according to actual requirements, and the present invention is not limited thereto.

Referring to fig. 4 again, in the present embodiment, a plurality of input/output pins 4 are disposed on one side of the electrical interconnection assembly 1, so that the power module M1 can be electrically connected to another external circuit. Further, a plurality of input/output pins 4 may be defined for receiving or outputting a plurality of different signals. In one embodiment, the input/output pins 4 may be used to transmit a gate driving signal to control the operation of the power devices 21, 22. Accordingly, each input/output pin 4 may be disposed on the first circuit board 11 or the second circuit board 12 and electrically connected to the third pads 21g,22g (gate pads) of the corresponding power device 21,22 through the wires in the first circuit board 11 or the second circuit board 12.

Referring to fig. 5 and fig. 6 in combination, fig. 6 is a partially enlarged schematic view of the region VI in fig. 5. It should be noted that, in the present embodiment, there is almost no difference in height between the top end surface of any one of the first pad-setting areas 101a of the first conductive member 101 (or the bottom end surface of the first pad-setting area 101 b) and the surface of the first wiring arrangement portion 111 of the first wiring board 11 (or the first wiring arrangement portion 121 of the second wiring board 12).

As shown in fig. 6, in the preferred embodiment, the top end surface (or bottom end surface) of any one of the first pad arrangement regions 101a (101 b) is coplanar with the surface of the first wiring arrangement portion 111 (121) by the same height. Similarly, the top end surface of the third pad arrangement region 103a (or the bottom end surface of the third pad arrangement region 103 b) has no level difference from the surface of the third wiring arrangement portion 111 of the first wiring board 11 (or the third wiring arrangement portion 123 of the second wiring board 12).

In addition, as shown in fig. 5, in the present embodiment, the top end surfaces of any two of the first pad arrangement region 101a, the second pad arrangement region 102a and the third pad arrangement region 103a on one side of the conductive structure 10 are coplanar, so that the power elements 21,22 are arranged on the electrical interconnection assembly 1 by the surface mount technology (surface mount technology, SMT). Similarly, the bottom end surfaces of any two of the first pad setting region 101b, the second pad setting region 102b, and the third pad setting region 103b on the other side of the conductive structure 10 are coplanar.

However, the invention is not limited to the embodiment shown in fig. 6. Fig. 7 is an enlarged partial cross-sectional view of a power module according to another embodiment of the invention. In this embodiment, the top surface of the first pad setting area 101a and the top surface of the second pad setting area 102a may also have a height difference H1, where the height difference H1 may be greater than 10 μm and between 10 μm and 200 μm. Accordingly, the length of the lead portion 211t of the conductive connection member 211 of the first power device 21 can be adjusted corresponding to the height difference H1, so that the second pad 21d located at the lead portion 211t is connected to the second pad setting area 102a.

In the embodiment of fig. 7, the top end surface of the second pad setting area 102a protrudes from the top end surface of the first pad setting area 101 a. Accordingly, the thickness of the second conductive member 102 is greater than the thickness of the first conductive member 101. That is, the thicknesses of the first to third conductive members 101 to 103 are not necessarily all the same. In addition, in the present embodiment, the bottom surface of the second pad setting area 102b also protrudes from the bottom surface of the first pad setting area 101b, but the invention is not limited thereto. In another embodiment, the top surface of the second pad-setting area 102a may be convex or concave with respect to the top surface of the first pad-setting area 101a, but the bottom surface of the second pad-setting area 102b is still coplanar with the bottom surface of the first pad-setting area 101b, and vice versa.

Referring to fig. 4 again, in the present embodiment, the first and second electronic component groups 2a,2b may further include a diode element 23 (a plurality of examples are shown in fig. 4), and the diode element 23 may be connected in parallel with the first power element 21 or the second power element 22. Taking the diode element 23 connected in parallel with the first power element 21 as an example, the diode element 23 and the first power element 21 are arranged in the same row in the second direction D2, and the two electrodes 23a,23b of the diode element 23 are connected to the first conductive member 101 and the second conductive member 102 respectively through the opening 11 ha.

However, in other embodiments, the diode element 23 may also be omitted. In another embodiment, the first and second electronic component groups 2a,2b may further include control components, passive components, protection components, or the like according to actual requirements. The electronic components may be disposed on the electrical interconnection assembly 1 together with the power components 21,22, and electrically connected to the power components 21,22 through the electrical interconnection assembly 1 to form a part of the normalization circuit.

It should be noted that, when the electronic components of the first and second electronic component groups 2a,2b are operated, the heat energy generated by the electronic components can be dissipated through the conductive structure 10. That is, the conductive structure 10 not only can electrically connect the electronic components, but also can assist in heat dissipation.

As shown in fig. 4 and 5, the second electronic component group 2B may be disposed on the electrical interconnection assembly 1 in a similar manner. Specifically, the second electronic component group 2B and the second circuit board 12 are both located on the same side of the conductive structure 10, and include one or more power components 21,22. For convenience of description, in the second electronic component group 2B, the power element 21 connected to the first conductive element 101 and the second conductive element 102 is defined as a third power element, and the power element 22 connected to the first conductive element 101 and the third conductive element 103 is defined as a fourth power element.

Accordingly, the first power element 21 in the first electronic element group 2A may be connected in parallel to the third power element 21 in the second electronic element group 2B through the first conductive element 101 and the second conductive element 102. And the second power device 22 in the first electronic device group 2A may be connected in parallel to the fourth power device 22 in the second electronic device group 2B through the first conductive member 101 and the third conductive member 103. Thus, the power density (power density) of the power module M1 can be increased without increasing the area of the electrical interconnect assembly 1. It should be noted that the number of electronic components in the first and second electronic component groups 2a,2b is not necessarily the same.

Referring to FIG. 8, a schematic cross-sectional view along line VIII-VIII in FIG. 1 is shown. In the present embodiment, in the first and second electronic component groups 2a,2b, the electronic components (e.g., the first and third power components 21) located on opposite sides of the conductive structure 10 are aligned with each other, but the invention is not limited thereto.

Referring to fig. 2, 3 and 5, the power module M1 of the first embodiment includes two heat dissipation elements 3a,3b, and the two heat dissipation elements 3a,3b are respectively located at two opposite sides of the conductive structure 10. Each heat dissipation element 3a,3b is disposed on the plurality of power elements 21,22 for dissipating heat generated during operation of the plurality of power elements 21, 22. That is, a plurality of power elements 21,22 are disposed between the heat sinks 3a,3b and the electrical interconnect assembly 1. In one embodiment, the heat sinks 3a,3b are, for example, copper-clad ceramic substrates (Direct Bonded Copper, DBC) or directly electroplated copper ceramic substrates (Direct Plated Copper, DPC), but the invention is not limited thereto.

As shown in fig. 5, the heat sink 3a,3b may include a first conductive pattern layer 31, a second conductive pattern layer 32, and an insulating heat conductor 33 between the first conductive pattern layer 31 and the second conductive pattern layer 32. The first conductive pattern layer 31 has two conductive portions (not numbered) separated from each other, one of which is directly provided on the plurality of first power elements 21 and the other of which is directly provided on the plurality of second power elements 22. The insulating heat conductor 33 is, for example, a ceramic plate or an insulating adhesive material with a high thermal conductivity, which is not limited by the present invention. The second conductive pattern layer 32 is disposed on the insulating heat conductor 33 and has a larger area than the first conductive pattern layer 31.

In addition, the encapsulation layer 5 covers the electrical interconnect assembly 1 and at least one of the electronic component groups 2a,2b. However, the electrical interconnection assembly 1, the heat sinks 3a,3b and the plurality of input/output pins 4 are partially exposed outside the encapsulation layer 5. As shown in fig. 5, the second conductive pattern layers 32 of the heat dissipation elements 3a,3b are exposed outside the package layer 5, so that the heat generated during the operation of the power module M1 is more effectively dissipated to the outside.

In addition, when the power module M1 is applied to another system circuit (not shown), the plurality of power devices 21,22 and other electronic devices in the power module M1 can be electrically connected to the system circuit by connecting the plurality of input/output pins 4 of the power module M1 and the three exposed ends 101e-103e of the electrical interconnection assembly 1 to specific voltage terminals.

Second embodiment

Fig. 9 is a schematic cross-sectional view of a power module according to a second embodiment of the invention. Elements of this embodiment that are the same as those of the embodiment of fig. 8 have the same or similar reference numerals and are not described again. In the power module M2 of the present embodiment, the electronic components (e.g., the first and third power components 21) in the first and second electronic component groups 2a,2b located at opposite sides of the conductive structure 10 are not aligned but are offset from each other. That is, the vertical projection of any one of the electronic components in the first electronic component group 2A only partially overlaps the electronic component in the second electronic component group 2B. Therefore, the heat energy generated during the operation of the electronic element can be prevented from being concentrated in a specific area, so that the heat energy is easier to be rapidly dissipated.

Third embodiment

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of a power module according to a third embodiment of the invention. Elements of this embodiment that are the same as those of the embodiment of fig. 9 have the same or similar reference numerals and are not described again. In the power module M3 of the present embodiment, there is only one electronic component group 2A. In the present embodiment, the surface of the conductive structure 10 used to dispose the second circuit board 12 may be a flat surface without any recessed area.

In addition, in the present embodiment, the electronic component set 2A further includes a control element 24. The control element 24 may be disposed on the first circuit board 11 and electrically connected to the third pads 21g,22g (gate pads) of the power devices 21,22 through the first circuit board 11 to control each of the power devices 21,22. In this embodiment, the plurality of input/output pins 4 may be omitted.

Fourth embodiment

Fig. 11 is a perspective exploded view of a power module according to a fourth embodiment of the invention, wherein a package layer is omitted. The same elements of the power module M4 of the present embodiment as those of the power module M1 of the first embodiment have the same or similar reference numerals, and will not be described again. In the electrical interconnection assembly 1' of the present embodiment, the conductive structure 10 only has the first conductive element 101 and the second conductive element 102 insulated from each other and disposed side by side. The first conductive element 101 and the second conductive element 102 are separated from each other to define a slot h1.

The first circuit board 11 is disposed on one side of the conductive structure 10 with the opening 11h corresponding to the slot h1, and the second circuit board 12 is disposed on the other side of the conductive structure 10 with the opening 12h corresponding to the slot h 1. When the two electronic component groups 2a,2b are disposed on opposite sides of the electrical interconnection assembly 1', the power components 21 of the two electronic component groups 2a,2b may be connected in parallel to each other through the first conductive member 101 and the second conductive member 102.

Fifth embodiment

Referring to fig. 12 and 13, a schematic perspective view and a schematic enlarged partial view of a power module according to a fifth embodiment of the invention are shown. The same or similar elements of the power module M3 of the present embodiment have the same reference numerals, and the same parts will not be described again.

In the present embodiment, the first end 101e of the first conductive member 101, the second end 102e of the second conductive member 102, and the third end 103e of the third conductive member 103 are oriented in the same direction. In addition, the electrical interconnection assembly 1 of the present embodiment further includes a circuit laminated board 13 and an insulating connection portion 14. The circuit laminated board 13 and the conductive structure 10 are arranged side by side, and the circuit laminated board 13 and the conductive structure 10 can be separated by an insulating connection part 14.

Referring to fig. 13, the circuit laminated board 13 of the present embodiment includes two circuit boards 131 and 132 and a conductive board 130, and the conductive board 130 is located between the two circuit boards 131 and 132. It should be noted that, the conductive board 130 and the conductive structure 10 of the circuit laminated board 13 of the present embodiment may be completed in the same process, and the circuit boards 131 and 132, the first circuit board 11 and the second circuit board 12 may be completed in the same process. In one embodiment, the circuit board 131 is a part of the first circuit board 11, and the circuit board 132 is a part of the second circuit board 12. It should be noted that at least one of the circuit boards 131 and 132 may be a single-layer circuit board or a multi-layer circuit board, and the other circuit board may be a wire-free insulating board, a single-layer circuit board or a multi-layer circuit board. In the present embodiment, the circuit board 131 is a single-layer circuit board or a multi-layer circuit board, and has a plurality of traces (not shown) and pads (not shown) on the surface and inside.

Referring to fig. 12 again, the circuit laminated board 13 includes a plurality of via holes 13h, and each via hole 13h extends from the circuit board 131 through the conductive board 130 to the other circuit board 132. In this way, by providing pins (pins) (not shown) in the via holes 13h, the circuit of the wiring board 131 (or the wiring board 132) can be connected to an external circuit or the circuits in the two-layer wiring boards 131,132 can be connected.

In addition, in the present embodiment, the electronic component set 2A further includes a control element 24 and at least one passive element 25 (two are shown in fig. 12 as an example). The control element 24 is disposed on the wiring laminate 13, and the passive element 25 is disposed on the first wiring board 11. In detail, the control element 24 of the present embodiment is disposed on the circuit board 131, but the present invention is not limited thereto. In another embodiment, the control element 24 may also be provided on another circuit board 132. The passive element 25 is, for example, a resistor, but the invention is not limited thereto.

It should be noted that, the first circuit board 11 is provided with a plurality of leads 6, and each lead 6 is electrically connected to the corresponding first power device 21 or the second power device 22. In addition, a portion of the leads 6 are connected to the passive components 25, and another portion is used to connect the first circuit board 11 and the circuits in the circuit board 131. The plurality of leads 6 may extend from the first wiring board 11 to the surface of the wiring laminate 13.

In detail, in the present embodiment, each lead wire 6 has an extension 6a instead of the input/output pin 4 shown in the third embodiment. In addition, the extension section 6a extends from the first wiring board 11 to the surface of the wiring laminated board 13. Further, the extension portion 6a of each lead 6 of the present embodiment is connected to the outermost circuit board 131 through the insulation connection portion 14 for being electrically connected to the control element 24.

Sixth embodiment

Referring to fig. 14 and 15, a schematic perspective view and a schematic partial enlarged view of a power module according to a sixth embodiment of the invention are shown. Elements of the present embodiment that are the same as or similar to those of the embodiment of fig. 12 have the same reference numerals, and the same parts will not be repeated. The present embodiment is different from the previous embodiment in that the wiring laminated board 13 of the present embodiment includes four layers of wiring boards 131 to 134.

The surface of the circuit laminated board 13 of the present embodiment has at least one contact pad 28 (fig. 14 shows a plurality of examples). The contact pads 28 may be electrically connected to the circuits in the circuit board 131. At least one contact pad 28 can be connected to the corresponding lead 6 by a connection carrier 29.

However, the present invention is not limited to the manner of connection as long as each lead 6 can be connected to the wiring laminate 13. In another embodiment, the contact pads 28 may be replaced by conductive contact holes, and one end of the connection carrier 29 is connected to the corresponding lead wire 6, and the other end is inserted into the corresponding conductive contact hole, so that the lead wire 6 is connected to the circuit laminated board 13.

Advantageous effects of the embodiment

One of the advantages of the present invention is that the power module provided by the present invention can make the power modules M1-M4 operate under high voltage and high current by the technical scheme of "a first conductive element 101 and a second conductive element 102 which are arranged side by side and insulated from each other", "the circuit boards 11,12 are arranged on the conductive structure 10", and "the first pads 21s,22s and the second pads 21d,22d of the power elements 21,22 are electrically connected to the first conductive element 101 and the second conductive element 102, respectively, and the third pad 21g is arranged on the circuit boards 11, 12".

Furthermore, in the electrical interconnect assembly 1 of the present embodiment, the circuit boards 11,12 are combined with the conductive structures 10 to serve as current transmission paths for a plurality of electronic components in the electronic component groups 2a,2 b. The conductive structure 10 can increase the path of current passing therethrough, can allow a large current to pass therethrough, and has good heat dissipation capability. On the other hand, control elements, passive elements or protection elements may be disposed on the circuit boards 11,12 according to actual requirements, so that the power modules M1-M4 of the embodiment of the present invention have a larger component expandability (expandability), and are suitable for forming various normalization circuits.

In an embodiment, by disposing the first circuit board 11 and the second circuit board 12 on two opposite sides of the conductive structure 10, the number of electronic components can be increased without increasing the area of the electrical interconnection assembly 1, so as to increase the power density (power density) of the power modules M1, M2, M4.

In addition, a part of the encapsulation layer 5 is filled in the slot h1 between the first conductive member 101 and the second conductive member 102 and the slot h2 between the second conductive member 102 and the third conductive member 103, so that the power modules M1-M4 can be prevented from being damaged due to arc discharge (arcing) when operated at high voltage, and the voltage withstanding capability of the power modules M1-M4 can be further improved.

The above disclosure is only a preferred embodiment of the present invention and is not intended to limit the claims of the present invention, so that all equivalent technical changes made by the application of the specification and the drawings of the present invention are included in the claims of the present invention.

Claims

1. A power module, the power module comprising:

an electrical interconnect assembly, comprising:

the conductive structure comprises a first conductive piece, a second conductive piece and a third conductive piece which are arranged side by side and are insulated from each other; a kind of electronic device with high-pressure air-conditioning system

A first circuit board partially covering the conductive structure; and

the first power element is bridged between the first conductive piece and the second conductive piece and is electrically connected with the first circuit board, the second power element is bridged between the first conductive piece and the third conductive piece and is electrically connected with the first circuit board, and the second power element is connected with the first power element in series through the first conductive piece.

2. The power module of claim 1 wherein the first conductive member, the second conductive member, and the third conductive member define a component placement surface, the first circuit board partially covering the component placement surface.

3. The power module of claim 1 wherein the electrical interconnect assembly further comprises a circuit laminate and a plurality of leads, the circuit laminate being juxtaposed to the conductive structure, the plurality of leads being disposed on the first circuit board and extending from the first circuit board to a surface of the circuit laminate.

4. The power module of claim 3 wherein the wiring laminate has a plurality of vias.

5. The power module of claim 3 wherein said circuit laminate includes two layers of circuit boards and a conductive plate positioned between said two layers of circuit boards, said electronic component assembly further comprising: the control element is arranged on one of the circuit boards and is electrically connected with the first power element and the second power element through a plurality of leads.

6. The power module of claim 1 wherein the electrical interconnect assembly further comprises a circuit board stack and a plurality of leads, the circuit board stack being disposed side-by-side on the conductive structure, the plurality of leads being disposed on the first circuit board, the surface of the circuit board stack having at least one contact pad and the at least one contact pad being connected to the corresponding leads by a connection carrier.

7. The power module of claim 1, wherein the first circuit board partially covers the first conductive member and partially covers the second conductive member, the first power device has a source pad, a drain pad and a gate pad, the source pad is electrically connected to the first conductive member, the drain pad is electrically connected to the second conductive member, and the gate pad is disposed on the first circuit board.

8. The power module of claim 1, wherein the first circuit board partially covers the third conductive member, the second power device has a source pad, a drain pad and a gate pad, the source pad is electrically connected to the third conductive member, the drain pad is electrically connected to the first conductive member, and the gate pad is disposed on the first circuit board.

9. The power module of claim 1 wherein the first set of electronic components further comprises: and the diode element is arranged on the conductive structure and is connected in parallel with the first power element or the second power element.

10. The power module of claim 1 wherein the electrical interconnect assembly further comprises: the first circuit board and the second circuit board are respectively positioned on the upper side and the lower side of the conductive structure.

11. The power module of claim 10, wherein the power module further comprises: the second electronic element group is arranged on the electrical interconnection assembly, wherein the second electronic element group and the second circuit board are positioned on the same side of the conductive structure and are provided with a third power element and a fourth power element, the first power element is connected with the third power element in parallel through the first conductive piece and the second conductive piece, and the second power element is connected with the fourth power element in parallel through the first conductive piece and the third conductive piece.

12. The power module of claim 11, wherein the first power element and the third power element are offset from each other, and the second power element and the fourth power element are offset from each other.

13. A power module, the power module comprising:

An electrical interconnect assembly, comprising:

the conductive structure comprises a first conductive piece and a second conductive piece which are arranged side by side and mutually insulated; a kind of electronic device with high-pressure air-conditioning system

A circuit board disposed on the conductive structure, wherein the circuit board has an opening, and the opening partially corresponds to the first conductive member and partially corresponds to the second conductive member; and

the electronic component group comprises a power component, the power component is provided with a first connecting pad, a second connecting pad and a third connecting pad, wherein the first connecting pad and the second connecting pad are respectively and electrically connected with the first conductive piece and the second conductive piece through the opening, and the third connecting pad is arranged on the circuit board.

14. The power module of claim 13, wherein the opening defines a first pad-set area in the first conductive member, a surface of the circuit board is at the same height as a top surface of the first pad-set area, and the first pad is connected to the first pad-set area.

15. The power module of claim 13, wherein the opening defines a first pad placement area on the first conductive member and a second pad placement area on the second conductive member, the first pad placement area having a height difference between a top surface and a top surface of the second pad placement area.

16. The power module of claim 13 wherein the first conductive member and the second conductive member are spaced apart from each other to define a slot, the electrical interconnect assembly further comprising: and the insulating bonding material is positioned in the groove and connected between the first conductive piece and the second conductive piece.

17. The power module of claim 13 wherein the set of electronic components further comprises: the diode element is arranged on the conductive structure, wherein two electrodes of the diode element are electrically connected with the first conductive piece and the second conductive piece respectively through the opening and are connected with the power element in parallel.

18. The power module of claim 13, wherein the power module further comprises: and the heat dissipation piece is arranged on the power element.

19. The power module of claim 13 wherein the set of electronic components further comprises: the control element is arranged on the circuit board and is electrically connected with the power element through the circuit board.