CN116564875B - Monolithic wafer positioning equipment - Google Patents
Monolithic wafer positioning equipment Download PDFInfo
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- CN116564875B CN116564875B CN202310829016.2A CN202310829016A CN116564875B CN 116564875 B CN116564875 B CN 116564875B CN 202310829016 A CN202310829016 A CN 202310829016A CN 116564875 B CN116564875 B CN 116564875B
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- 230000005540 biological transmission Effects 0.000 claims abstract description 74
- 238000006073 displacement reaction Methods 0.000 claims abstract description 23
- 238000005096 rolling process Methods 0.000 claims description 37
- 230000000149 penetrating effect Effects 0.000 claims description 17
- 230000000694 effects Effects 0.000 claims description 6
- 239000000284 extract Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000002040 relaxant effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 24
- 238000011084 recovery Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a monolithic wafer positioning device, comprising: a base having a first air chamber, a Bernoulli system coaxially disposed on the base and holding the wafer in a horizontal posture, a plurality of clamping units circumferentially disposed on the base to clamp the wafer, and a driving assembly for driving the clamping units to displace radially outward to relax the wafer; the base is configured as a stopper for restricting a radial inward displacement distance of the clamping unit so that the clamping unit is maintained in a clamping state for clamping the wafer; the drive assembly includes: a piston block axially arranged in the first air chamber, and a gas transmission unit for inputting or extracting gas into the first air chamber; the outer contour of the piston block is attached to the first air cavity, the air conveying unit inputs air into the first air cavity, and the piston block is driven to axially and upwards displace so as to drive the clamping unit to radially and outwards displace to relax the wafer. By the application, the wafer can be accurately ensured to be kept in a centered state with the Bernoulli system all the time, so that the process flow is smoothly implemented on the wafer.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to single-chip wafer positioning equipment.
Background
In the process of wafer manufacturing, an automation device is generally used to implement a process flow, for example, cleaning, etching, developing, gluing, and turning and transporting the wafer during the process, so that a positioning device is required to clamp and position the wafer. Including a positioning device that uses bernoulli's principle to hold the wafer above the surface of the device and to maintain the wafer in a suspended state. And whether the position of the circle center of the wafer accurately determines whether the automation equipment can smoothly implement the process flow on the wafer, if the position coordinates of the wafer deviate, the automation equipment cannot implement the operation correctly, and even serious errors in the process of the wafer can be caused, so that the process errors of a chip area on the upper surface of the wafer can be caused, and the whole wafer is scrapped. Therefore, the wafer needs to be centered to determine the position of the center of the wafer before the process flow is performed on the wafer by the automated equipment.
The chinese patent publication No. CN112635376B discloses a wafer handling device, in which the clamping members included in the wafer handling device are stretched along the extending direction of the arm body, so that the clamping heads of the clamping arms clamp different positions of the edge of the wafer to be handled, and the middle part of the wafer to be handled is supported on the supporting surface of the wafer supporting plate supporting module, so as to avoid the suspended bending of the middle part of the wafer during the handling process.
However, in the above prior art, the clamping member stretches along the extending direction of the arm body, so that it is difficult to ensure that the center of the wafer is centered with the support module during the process of clamping different positions of the wafer to be carried by the clamping head, thereby affecting smooth implementation of the subsequent process flow.
In view of the foregoing, there is a need for an improved wafer handling device in the prior art that addresses the above-described issues.
Disclosure of Invention
The application aims to disclose a single-wafer type wafer positioning device which is used for solving a plurality of defects of a wafer carrying device in the prior art, and particularly aims to accurately ensure that a wafer can always keep a centering state with a Bernoulli system, so that a process flow can be smoothly implemented on the wafer.
To achieve the above object, the present application provides a monolithic wafer positioning apparatus comprising: a base having a first air chamber, a Bernoulli system coaxially disposed on the base and holding a wafer in a horizontal posture, a plurality of clamping units circumferentially disposed on the base to clamp the wafer, and a driving assembly for driving the clamping units to displace radially outward to relax the wafer;
the base is configured as a stopper for restricting a radial inward displacement distance of the clamping unit so that the clamping unit is maintained in a clamping state for clamping a wafer;
the drive assembly includes: a piston block axially arranged in the first air chamber, and a gas transmission unit for inputting or extracting gas into the first air chamber;
the outer contour of the piston block is attached to the first air cavity, the air conveying unit inputs air into the first air cavity, and drives the piston block to move upwards along the axial direction so as to drive the clamping unit to move outwards along the radial direction to relax the wafer.
As a further improvement of the application, the base forms an upper cover body connected with the Bernoulli system, and the upper cover body is axially and downwardly convexly provided with the limiting piece which extends into the piston block and is circumferentially separated from the piston block.
As a further improvement of the application, the piston block is axially and upwardly displaced, one end of the piston block, which is close to the upper cover body, is sleeved outside the limiting piece, and the clamping unit is radially and outwardly displaced, so that the clamping unit is kept in a relaxed state for loosening the wafer;
the piston block moves downwards along the axial direction, one end, close to the upper cover body, of the piston block is separated from the outer side of the limiting piece, and the clamping unit moves inwards along the radial direction, so that the clamping unit is kept in the clamping state formed by the clamping unit limited by the limiting piece.
As a further improvement of the present application, the base is configured as a gas delivery passage through which a gas delivery unit inputs and/or withdraws gas into the first air chamber;
the gas transmission unit inputs gas into the first gas cavity through a gas transmission channel and drives the piston block to move upwards along the axial direction;
the gas transmission unit extracts the gas input into the first gas cavity through the gas transmission channel so as to cancel the acting force applied to the piston block and applied to the axial upward displacement, and negative pressure is formed in the first gas cavity so as to drive the piston block to axially and downwardly displace, and the clamping state formed by the clamping unit is limited by the limiting piece.
As a further improvement of the present application, the driving assembly further includes: a first elastic member axially clamped between the base and the piston block;
the base is configured to form a gas transmission channel for inputting and/or exhausting gas into the first air cavity by the gas transmission unit;
the gas transmission unit inputs gas into the first gas cavity through a gas transmission channel to drive the piston block to axially and upwards displace, and the piston block stretches or compresses the first elastic piece when axially and upwards displaces;
the gas transmission unit extracts the gas input into the first gas cavity through the gas transmission channel so as to cancel the acting force applied to the piston block and enabling the piston block to move upwards along the axial direction, the first elastic piece forms elastic acting force on the piston block along the axial direction so as to drive the piston block to move downwards along the axial direction, and the limiting piece is used for limiting the clamping state formed by the clamping unit.
As a further improvement of the application, the first elastic member is clamped between the piston block and the first air cavity along the axial direction, and the piston block stretches the first elastic member when being displaced upwards along the axial direction;
or, the piston block is configured to form an engagement cavity, the first elastic member is clamped between the engagement cavity and the base in the axial direction, and the piston block compresses the first elastic member when being displaced upwards in the axial direction;
or, the piston block is constructed into a connection cavity, the base is convexly provided with a top block which axially extends into the connection cavity, the first elastic piece is sleeved on the outer side of the top block and is axially clamped between the connection cavity and the base, and the piston block compresses the first elastic piece when axially and upwards displaces.
As a further improvement of the present application, the clamping unit includes: the transmission rod radially penetrates through the upper cover body, a clamping column used for clamping the edge of the wafer is arranged at one end, extending out of the upper cover body, of the transmission rod, a rolling piece is arranged at one end, penetrating through the upper cover body, of the transmission rod, and the second elastic piece is sleeved on the transmission rod and abuts against the rolling piece and the upper cover body along the length direction of the transmission rod;
the second elastic piece forms elastic acting force on the rolling piece along the penetrating direction of the transmission rod penetrating through the upper cover body, the rolling piece is propped against the limiting piece, and the limiting piece limits the radial inward displacement distance of the transmission rod so as to keep the clamping state.
As a further improvement of the application, one end of the piston block, which is close to the upper cover body, forms a guiding ring surface which tapers inwards in radial direction;
the piston block moves upwards along the axial direction to drive the guide ring surface to contact the rolling piece so as to guide the rolling piece to move outwards in the radial direction and compress the second elastic piece, and the rolling piece synchronously drives the transmission rod and the clamping column to move outwards in the radial direction so as to relax the wafer.
As a further improvement of the application, the piston block is axially downwardly displaced, the acting force applied to the clamping unit for radially outwardly displacing the piston block is cancelled, the second elastic piece forms an elastic acting force on the rolling piece along the penetrating direction of the transmission rod penetrating through the base so as to drive the transmission rod and the clamping column to radially inwardly displace, the rolling piece is abutted against the limiting piece, and the limiting piece limits the radially inwardly displacing distance of the transmission rod so as to maintain the clamping state.
As a further development of the application, the piston block nests a number of seals circumferentially against the first air chamber.
As a further improvement of the application, the base is configured as a guide ring body coaxially embedded in the upper cover body;
the upper cover body and the guide ring body are continuously concavely provided with a movable channel and a limiting channel which are used for the transmission rod to penetrate through, and one end, away from the rolling piece, of the second elastic piece is propped against the limiting channel.
As a further improvement of the present application, the bernoulli system includes: the outer disc body is arranged at the top end of the upper cover body, the inner disc body is arranged in the outer disc body, an annular cavity is formed between the outer disc body and the inner disc body, an annular gap communicated with the annular cavity is formed between the outer edge of the inner disc body and the outer disc body, and an air injection pipe penetrates through the outer disc body and is used for injecting air into the annular cavity;
the gas nozzles inject gas into the annular chamber, the gas circulates in the annular chamber and is exhausted through the annular gap to generate Bernoulli effect, and the wafer is held on the inner disk body in a horizontal posture.
Compared with the prior art, the application has the beneficial effects that:
when the Bernoulli system generates the Bernoulli effect to stably keep the wafer on the Bernoulli system in a horizontal posture and the wafer center is not centered with the axis P of the Bernoulli system, the gas input into the first air cavity is canceled through the gas transmission unit, the piston block loses the acting force of axially upward displacement to axially downward displace, the clamping units synchronously displace along the radial direction and can contact the edge of the wafer in the process of displacing the clamping units so as to drive the wafer to horizontally displace on the Bernoulli system, when one end of the clamping unit formed in the base radially abuts against the limiting piece, the limiting piece prevents the clamping unit from radially inward displacing, and at the moment, the clamping units can accurately clamp the edge of the wafer so as to drive the wafer center to be centered with the axis P of the Bernoulli system, and the clamping units are kept in a clamping state for clamping the wafer, so that the wafer can be always kept in a centering state with the Bernoulli system when the wafer is supported by the Bernoulli system, and the subsequent process flow is smoothly carried out, and the influence on the subsequent process flow is avoided.
Drawings
FIG. 1 is a perspective view of a single wafer positioning apparatus according to the present disclosure;
FIG. 2 is a cross-sectional view of the base and Bernoulli system taken along line A-A of FIG. 1;
FIG. 3 is a schematic view of the clamping unit releasing a wafer after the piston block in FIG. 2 moves axially upward;
FIG. 4 is a perspective view of the upper housing connected to the clamping unit;
FIG. 5 is an exploded schematic view of the application for embodying the mating relationship between the Bernoulli system, the upper housing, and the clamping unit;
FIG. 6 is an enlarged schematic view of a portion of FIG. 5 at circle B;
fig. 7 is a cross-sectional view of the outer disc and the inner disc connected.
Description of the embodiments
The present application will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present application, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present application by those skilled in the art.
It should be understood that, in the present application, the terms "center", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present technical solution and simplifying the description, and do not indicate or imply that the indicated devices or elements must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present technical solution.
In particular, in the following embodiments, the term "axial direction" refers to the direction indicated by the central axis P in fig. 2. The term "longitudinal" refers to a direction parallel to the axial direction. The term "radial" refers to a direction through the axis P in a radial plane.
One embodiment of a monolithic wafer positioning apparatus is disclosed with reference to fig. 1-7.
Referring to fig. 1 to 3, in the present embodiment, the single wafer positioning apparatus 100 includes: a susceptor 10 having a first air chamber 101, a Bernoulli system 20 coaxially disposed at the susceptor 10 and holding a wafer in a horizontal posture, a plurality of clamping units 30 circumferentially disposed at the susceptor 10 to clamp the wafer 200, and a driving assembly 40 for driving the clamping units 30 to displace radially outward to relax the wafer 200; the susceptor 10 is configured as a stopper 110 that limits a radially inward displacement distance of the clamping unit 30 so that the clamping unit 30 is maintained in a clamped state in which the wafer 200 is clamped; the driving assembly 40 includes: a piston block 41 axially disposed in the first gas chamber 101, and a gas delivery unit (not shown) for delivering or extracting gas into the first gas chamber 101; the outer contour of the piston block 41 is attached to the first air cavity 101, and the air delivery unit inputs air into the first air cavity 101 to drive the piston block 41 to move upwards along the axial direction so as to drive the clamping unit 30 to move outwards along the radial direction to relax the wafer 200. A gas (e.g., compressed air) is first introduced into the first gas chamber 101 by a gas delivery unit (not shown), by which gas the piston block 41 is pushed to displace in an axially upward direction (in a direction indicated by an arrow Z2 in fig. 3), the plurality of clamping units 30 are simultaneously contacted during the axially upward displacement of the piston block 41, and the plurality of clamping units 30 are driven to displace synchronously in a radially outward direction (in a direction indicated by an arrow X2 in fig. 3), so that the clamping units 30 are maintained in a state to be clamped (or referred to as a "relaxed state", i.e., a state in which the wafer 200 is not clamped), and when a bernoulli effect is generated by the bernoulli system 20 to stably hold the wafer 200 on the bernoulli system 20 in a horizontal posture and the center of the wafer 200 is not aligned with the axis P of the bernoulli system 20, the gas is not introduced into the first gas chamber 101 by the gas delivery unit (not shown), compressed air), the piston block 41 loses the acting force of the axial upward displacement, so as to displace axially downward, so that the driving force of the piston block 41 on the radial outward displacement formed by the clamping units 30 is cancelled, and then the clamping units 30 displace synchronously in the radial inward direction (the direction indicated by the arrow X1 in fig. 2), and can contact the edge of the wafer in the process of displacing the clamping units 30, so as to drive the wafer 200 to displace horizontally on the bernoulli system 20, when one end of the clamping unit 30 formed in the base 10 abuts against the limiting piece 110 in the radial direction, the limiting piece 110 prevents the clamping unit 30 from displacing radially inward, at this time, the clamping units 30 can clamp the edge of the wafer 200 accurately, so as to drive the center of the circle of the wafer 200 to be centered with the axis P of the bernoulli system 20, the clamping unit 30 is kept in a clamping state of clamping the wafer 200 as shown in fig. 2, so that the wafer 200 can be always kept in a centered state with the bernoulli system 20 when being supported by the bernoulli system 20, and the problem that in the prior art, the clamping piece is difficult to ensure that the center of the wafer is centered with the supporting module in the process of stretching along the extending direction of the arm body to clamp different positions of the edge of the wafer to be carried by the clamping head is solved, so that the influence on the smooth implementation of the subsequent process flow is avoided.
As shown in fig. 2 and 4, the base 10 is connected to the upper housing 11 of the bernoulli system 20, and the upper housing 11 is axially downwardly convex to form a stopper 110 extending into the piston block 41 and circumferentially separated from the piston block 41. The upper cover 11 can limit the axial upward displacement distance of the piston block 41. In addition, the piston block 41 slides along the outer sidewall of the stopper 110 while being displaced upward in the axial direction and contacting the clamping unit 30, so as to drive the clamping unit 30 to displace outward in the radial direction.
As shown in fig. 2 and 3, the piston block 41 is axially displaced upwards, one end of the piston block 41, which is close to the upper cover 11, is sleeved outside the limiting member 110, and the clamping unit 30 is radially displaced outwards, so that the clamping unit 30 is kept in a relaxed state for loosening the wafer 200; the piston block 41 slides along the outer sidewall of the stopper 110 while being moved upward in the axial direction and contacting the clamping unit 30, so as to drive the clamping unit 30 to be moved outward in the radial direction, and to maintain the clamping unit 30 in a relaxed state, so that the clamping action on the wafer 200 is canceled. The piston block 41 is axially downwardly displaced, and an end of the piston block 41, which is close to the upper housing 11, is separated from the outside of the stopper 110, and the clamping unit 30 is radially inwardly displaced, so that the clamping unit 30 is held in a clamped state in which the stopper 110 restricts the clamping unit 30. When the piston block 41 is axially downwardly displaced, one end of the piston block 41, which is close to the upper cover 11, slides along the outer side wall of the limiting piece 110 until the piston block is separated from the outer side of the limiting piece 110, so that the driving force of the piston block 41 on the radial outward displacement formed by the clamping units 30 is cancelled, the clamping units 30 are synchronously displaced in the radial direction, the edge of the wafer can be contacted and the wafer 200 is driven to horizontally displace on the bernoulli system 20 in the displacement process of the clamping units 30, until one end of the clamping units 30 formed in the base 10 radially abuts against the limiting piece 110, the limiting piece 110 prevents the clamping units 30 from radially inwardly displacing, the clamping units 30 can accurately clamp the edge of the wafer 200 and drive the center of the circle of the wafer 200 to be centered with the axis P of the bernoulli system 20, and the clamping units 30 are kept in a clamping state.
In this embodiment, as shown in fig. 2, 3 and 5, the driving assembly 40 further preferably includes: a first elastic member 43 axially sandwiched between the base 10 and the piston block 41; the base 10 is configured with a gas delivery passage 103 for the gas delivery unit to input and/or withdraw gas into the first gas chamber 101; the gas transmission unit inputs quantitative gas into the first gas cavity 101 through the gas transmission channel 103, drives the piston block 41 to axially upwards displace, and stretches or compresses the first elastic piece 43 when the piston block 41 axially upwards displaces; the gas delivery unit extracts the quantitative gas input into the first gas cavity 101 through the gas delivery channel 103 to cancel the acting force applied to the piston block 41 to enable the piston block 41 to displace upwards along the axial direction, the first elastic piece 43 forms an elastic acting force to the piston block 41 along the axial direction to drive the piston block 41 to displace downwards along the axial direction, and the limiting piece 110 is restored to limit the clamping state formed by the clamping unit 30. When the piston block 41 is required to be displaced axially upward, a gas delivery unit (not shown) pushes the piston block 41 to be displaced axially upward by inputting a certain amount of compressed air into the first gas chamber 101, and drives the plurality of clamping units 30 to be displaced radially outward in synchronization, so that the clamping units 30 are maintained in a state to be clamped as shown in fig. 3. When the piston block 41 needs to be displaced downwards along the axial direction, the air conveying unit pumps out quantitative compressed air input into the first air cavity 101 through the air conveying channel 103, so that the pressure in the first air cavity 101 is restored to a state before the compressed air is injected; excess compressed air may also be drawn out to create a negative pressure within the first air chamber 101. Then, the first elastic member 43 forms an elastic force on the piston block 41 downward along the axial direction, so as to drive the piston block 41 to displace downward along the axial direction, and the clamping state formed by the clamping unit 30 is restored and maintained by the limiting member 110.
For example, in some embodiments, the first resilient member 43 is omitted (corresponding descriptions of this embodiment are not shown in the drawings), and the base 10 is configured with a gas delivery channel 103 for the gas delivery unit to input and/or withdraw gas into the first gas chamber 101; the gas transmission unit inputs gas into the first gas cavity 101 through the gas transmission channel 103 to drive the piston block 41 to move upwards along the axial direction; the gas transmission unit extracts the gas input into the first gas cavity 101 through the gas transmission channel 103 to cancel the acting force applied to the piston block 41 and applied to the axial upward displacement, and negative pressure is formed in the first gas cavity 101 to drive the piston block 41 to displace downwards along the axial direction, so that the clamping state formed by the clamping unit 30 is limited by the limiting piece 110. When the piston block 41 is required to be displaced upward in the axial direction, a gas delivery unit (not shown) inputs compressed air into the first gas chamber 101 through the gas delivery passage 103, pushes the piston block 41 to be displaced upward in the axial direction by the compressed air, and drives the plurality of clamping units 30 to be displaced outward in synchronization in the radial direction, so that the clamping units 30 are maintained in the state to be clamped as shown in fig. 3. When the piston block 41 needs to be displaced downwards in the axial direction, the air delivery unit draws out the compressed air in the first air cavity 101 through the air delivery channel 103, and makes the first air cavity 101 form negative pressure, so as to drive the piston block 41 to displace downwards in the axial direction, and restore and keep the clamping state formed by the limiting piece 110 limiting the clamping unit 30.
As shown in fig. 2, 3 and 5, the piston block 41 is nested with a plurality of seals 413 circumferentially abutting the first air chamber 101. The sealing member 413 can improve the air tightness of the piston block 41 in the first air chamber 101.
As shown in fig. 2, 3 and 5, in the present embodiment, preferably, as shown in fig. 2, 3 and 5, the piston block 41 is configured as an engagement cavity 412, the base 10 is convexly provided with a top block 102 extending axially into the engagement cavity 412, the first elastic member 43 is sleeved outside the top block 102 and is axially clamped between the engagement cavity 412 and the base 10, the piston block 41 compresses the first elastic member 43 when being axially displaced upwards, and two ends of the first elastic member 43 in the axial direction are respectively connected with the upper cover 11 and the piston block 41. The first elastic member 43 is compressed when the piston block 41 is displaced axially upwards, and after the air delivery unit draws out the compressed air in the first air cavity 101 through the air delivery channel 103, the compressed first elastic member 43 will recover to an uncompressed state, and an elastic force is formed on the piston block 41 in an axially downward direction during recovery, so that the piston block 41 is driven to displace axially downwards, and the clamping state formed by the limiting member 110 limiting the clamping unit 30 is recovered and maintained. And the piston block 41 can be made to play a role in limiting the displacement distance of the piston block 41 in the process of being displaced upward in the axial direction by the top block 102.
For example, in some embodiments, the first elastic member 43 is axially clamped between the piston block 41 and the first air cavity 101, and when the piston block 41 is axially displaced upwards, the first elastic member 43 will be stretched, and two ends of the first elastic member 43 in the axial direction are respectively fixedly connected with the piston block 41 and the base 10; when the piston block 41 moves upwards in the axial direction, the first elastic piece 43 is stretched to deform, after the compressed air in the first air cavity 101 is pumped out by the air conveying unit through the air conveying channel 103, the stretched first elastic piece 43 is restored to an unstretched state, and in the restoring process, an elastic acting force is formed on the piston block 41 downwards in the axial direction, the piston block 41 is driven to move downwards in the axial direction, and the clamping state formed by the limiting piece 110 limiting the clamping unit 30 is restored and maintained. Alternatively, in some embodiments, the piston block 41 is configured with an engagement cavity 412, the first elastic member 43 is axially clamped between the engagement cavity 412 and the base 10, and when the piston block 41 is axially displaced upwards, the first elastic member 43 is compressed, and two ends of the first elastic member 43 in the axial direction are respectively connected to the upper cover 11 and the piston block 41; the first elastic member 43 is compressed when the piston block 41 is displaced axially upwards, and after the air delivery unit draws out the compressed air in the first air cavity 101 through the air delivery channel 103, the compressed first elastic member 43 will recover to an uncompressed state, and an elastic force is formed on the piston block 41 in an axially downward direction during recovery, so that the piston block 41 is driven to displace axially downwards, and the clamping state formed by the limiting member 110 limiting the clamping unit 30 is recovered and maintained.
As shown in fig. 2 to 6, the clamping unit 30 includes: the transmission rod 31 radially penetrates through the upper cover body 11, a clamping column 32 for clamping the edge of the wafer 200 is arranged at one end, extending out of the upper cover body 11, of the transmission rod 31, a rolling piece 33 is arranged at one end, penetrating through the upper cover body 11, of the transmission rod 31, and a second elastic piece 34 is sleeved on the transmission rod 31 and abuts against the rolling piece 33 and the upper cover body 11 along the length direction of the transmission rod 31; the second elastic member 34 forms an elastic force on the rolling member 33 along the penetrating direction of the transmission rod 31 penetrating the upper cover 11, the rolling member 33 abuts against the limiting member 110, and the limiting member 110 limits the radial inward displacement distance of the transmission rod 31 so as to maintain the clamping state. In the process that the piston block 41 moves upwards in the axial direction and contacts the rolling element 33, one end of the piston block 41, which is close to the upper cover body 11, slides along the outer side wall of the limiting element 110 in a fitting way, so that the rolling element 33 rolls along the outer side wall surface of the end of the piston block 41, which is close to the upper cover body 11, is driven by the piston block 41 to move outwards in the radial direction, compresses the second elastic element 34, and synchronously drives the transmission rod 31 and the clamping column 32 to move outwards in the radial direction, so that the clamping column 32 is kept in a state to be clamped as shown in fig. 3; when the piston block 41 is displaced downwards in the axial direction, one end of the piston block 41, which is close to the upper cover 11, slides along the outer side wall of the limiting piece 110 until the piston block is separated from the outer side of the limiting piece 110, so that the driving force of the piston block 41 on the radial outward displacement of the rolling piece 33 is cancelled, the second elastic piece 34 forms an elastic force on the rolling piece 33 along the penetrating direction (i.e. the radial direction) that the transmission rod 31 penetrates through the base 10, so as to drive the transmission rod 31 and the clamp posts 32 to displace inwards in the radial direction, the rolling piece 33 abuts against the limiting piece 110, the limiting piece 110 limits the radial inward displacement distance of the transmission rod 31, and therefore the clamp posts 32 can accurately clamp the edge of the wafer 200 and drive the center of the circle of the wafer 200 to be centered with the axis P of the Bernoulli system 20, so that the clamp posts 32 are kept in a clamped state, and the wafer 200 can always kept in a centered state with the Bernoulli system 20 when being supported by the Bernoulli system 20.
Further, the end of the piston block 41 adjacent to the upper housing 11 forms a radially inwardly tapered guide annulus 411; the piston block 41 moves upwards in the axial direction, and drives the guide ring surface 411 to contact the rolling element 33, so that the rolling element 33 rolls along the guide ring surface 411 to guide the rolling element 33 to displace outwards in the radial direction, and compresses the second elastic element 34, and the rolling element 33 synchronously drives the transmission rod 31 and the clamping column 32 to displace outwards in the radial direction, so that the clamping column 32 is kept in a state to be clamped as shown in fig. 3. The piston block 41 is displaced downwards along the axial direction, the acting force applied to the clamping unit 30 for radially outwards displacing the piston block is cancelled, the second elastic piece 34 forms an elastic acting force on the rolling piece 33 along the penetrating direction of the transmission rod 31 penetrating the base 10 so as to drive the transmission rod 31 and the clamping column 32 to radially inwards displace, the rolling piece 33 is abutted against the limiting piece 110, and the limiting piece 110 limits the radially inwards displacing distance of the transmission rod 31, so that the clamping column 32 is kept in a clamped state.
As shown in fig. 5 and 6, the base 10 is configured as a guide ring 12 coaxially embedded in the upper cover 11; the upper cover 11 and the guide ring 12 are continuously concavely provided with a movable channel 13 and a limiting channel 14 for the transmission rod 31 to penetrate, and one end of the second elastic piece 34, which is far away from the rolling piece 33, is propped against the limiting channel 14. The transmission rod 31 performs radial displacement between the movable channel 13 and the limiting channel 14 to play a role in guiding displacement of the transmission rod 31. When the transmission rod 31 is displaced radially outwards through the limiting channel 14, the second elastic member 34 is prevented from being displaced synchronously, so that the rolling member 33 compresses the second elastic member 34.
As shown in fig. 1, 5 and 7, the bernoulli system 20 includes: an outer disk 21 disposed at the top end of the upper housing 11, an inner disk 22 disposed inside the outer disk 21, an annular chamber 23 formed between the outer disk 21 and the inner disk 22, an annular gap 24 formed between the outer edge of the inner disk 22 and the outer disk 21 and communicating with the annular chamber 23, and an air injection pipe 25 penetrating the outer disk 21 and injecting air into the annular chamber 23; the gas nozzles 25 inject gas into the annular chamber 23, the gas flows through the annular chamber 23 and is exhausted through the annular gap 24 to generate a bernoulli effect, and the wafer 200 is held on the inner disk 22 in a horizontal posture. The sealing ring 26 is axially abutted between the outer disc 21 and the inner disc 22 so as to improve the air tightness between the outer disc 21 and the inner disc 22. The gas lance 25 is externally connected to a gas supply unit (not shown) for providing a gas source. The gas supply unit sprays gas into the annular cavity 23 through the gas spraying pipe 25, the gas circulates in the annular cavity 23 and is discharged through the annular gap 24 to generate the Bernoulli effect, the wafer 200 is kept on the inner disc 22 in a horizontal posture, the wafer 200 is clamped by the clamping unit 30, and in the embodiment, the wafer 200 is limited only by the clamping unit 30 without applying clamping force, and the wafer 200 can be kept in a centering state with the Bernoulli system 20 all the time when being supported by the Bernoulli system 20, so that the process flow can be smoothly implemented on the wafer 200, and damage to the wafer 200 due to overlarge stress is avoided.
The above list of detailed descriptions is only specific to practical embodiments of the present application, and they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the spirit of the present application should be included in the scope of the present application.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (11)
1. A monolithic wafer positioning apparatus, comprising:
a base having a first air chamber, a Bernoulli system coaxially disposed on the base and holding a wafer in a horizontal posture, a plurality of clamping units circumferentially disposed on the base to clamp the wafer, and a driving assembly for driving the clamping units to displace radially outward to relax the wafer;
the base is configured as a stopper for restricting a radial inward displacement distance of the clamping unit so that the clamping unit is maintained in a clamping state for clamping a wafer;
the drive assembly includes: a piston block axially arranged in the first air chamber, and a gas transmission unit for inputting or extracting gas into the first air chamber;
the outer contour of the piston block is attached to the first air cavity, the air transmission unit inputs air into the first air cavity, and drives the piston block to axially and upwards displace so as to drive the clamping unit to radially and outwards displace to relax a wafer;
the drive assembly further includes: a first elastic member axially clamped between the base and the piston block;
the base is configured to form a gas transmission channel for inputting and/or exhausting gas into the first air cavity by the gas transmission unit;
the gas transmission unit inputs gas into the first gas cavity through a gas transmission channel to drive the piston block to axially and upwards displace, and the piston block stretches or compresses the first elastic piece when axially and upwards displaces;
the gas transmission unit extracts the gas input into the first gas cavity through the gas transmission channel so as to cancel the acting force applied to the piston block and enabling the piston block to move upwards along the axial direction, the first elastic piece forms elastic acting force on the piston block along the axial direction so as to drive the piston block to move downwards along the axial direction, and the limiting piece is used for limiting the clamping state formed by the clamping unit.
2. The single wafer positioning apparatus of claim 1, wherein the base forms an upper housing that connects to the bernoulli system, the upper housing projecting axially downwardly to form the stop extending into and circumferentially spaced from the piston block.
3. The single wafer positioning apparatus according to claim 2, wherein the piston block is displaced upward in the axial direction, one end of the piston block near the upper cover body is sleeved outside the stopper, and the clamping unit is displaced outward in the radial direction so that the clamping unit is kept in a relaxed state for relaxing the wafer;
the piston block moves downwards along the axial direction, one end, close to the upper cover body, of the piston block is separated from the outer side of the limiting piece, and the clamping unit moves inwards along the radial direction, so that the clamping unit is kept in the clamping state formed by the clamping unit limited by the limiting piece.
4. The single wafer positioning apparatus of claim 3, wherein the base is configured as a gas delivery channel for a gas delivery unit to input and/or withdraw gas into the first gas cavity;
the gas transmission unit inputs gas into the first gas cavity through a gas transmission channel and drives the piston block to move upwards along the axial direction;
the gas transmission unit extracts the gas input into the first gas cavity through the gas transmission channel so as to cancel the acting force applied to the piston block and applied to the axial upward displacement, and negative pressure is formed in the first gas cavity so as to drive the piston block to axially and downwardly displace, and the clamping state formed by the clamping unit is limited by the limiting piece.
5. The single wafer positioning apparatus of claim 4, wherein the first resilient member is axially clamped between the piston block and the first gas chamber, the piston block will stretch the first resilient member upon axial upward displacement;
or, the piston block is configured to form an engagement cavity, the first elastic member is clamped between the engagement cavity and the base in the axial direction, and the piston block compresses the first elastic member when being displaced upwards in the axial direction;
or, the piston block is constructed into a connection cavity, the base is convexly provided with a top block which axially extends into the connection cavity, the first elastic piece is sleeved on the outer side of the top block and is axially clamped between the connection cavity and the base, and the piston block compresses the first elastic piece when axially and upwards displaces.
6. The single wafer positioning apparatus according to claim 4 or 5, wherein the clamping unit comprises: the transmission rod radially penetrates through the upper cover body, a clamping column used for clamping the edge of the wafer is arranged at one end, extending out of the upper cover body, of the transmission rod, a rolling piece is arranged at one end, penetrating through the upper cover body, of the transmission rod, and the second elastic piece is sleeved on the transmission rod and abuts against the rolling piece and the upper cover body along the length direction of the transmission rod;
the second elastic piece forms elastic acting force on the rolling piece along the penetrating direction of the transmission rod penetrating through the upper cover body, the rolling piece is propped against the limiting piece, and the limiting piece limits the radial inward displacement distance of the transmission rod so as to keep the clamping state.
7. The single wafer positioning apparatus of claim 6, wherein an end of the piston block adjacent the upper housing forms a radially inwardly tapered guide annulus;
the piston block moves upwards along the axial direction to drive the guide ring surface to contact the rolling piece so as to guide the rolling piece to move outwards in the radial direction and compress the second elastic piece, and the rolling piece synchronously drives the transmission rod and the clamping column to move outwards in the radial direction so as to relax the wafer.
8. The apparatus according to claim 7, wherein the piston block is displaced downward in the axial direction, the force applied to the clamping unit to displace it outward in the radial direction is canceled, the second elastic member forms an elastic force to the rolling member in the penetrating direction of the transmission rod penetrating the base so as to drive the transmission rod to displace inward in the radial direction with the clamping column, the rolling member abuts against the stopper, and the stopper restricts the transmission rod to displace inward in the radial direction by a distance to maintain the clamped state.
9. The single wafer positioning apparatus of claim 4, wherein the piston block nests a plurality of seals circumferentially abutting the first air cavity.
10. The single wafer positioning apparatus of claim 6, wherein the base is configured as a guide ring coaxially embedded within the upper housing;
the upper cover body and the guide ring body are continuously concavely provided with a movable channel and a limiting channel which are used for the transmission rod to penetrate through, and one end, away from the rolling piece, of the second elastic piece is propped against the limiting channel.
11. The single wafer positioning apparatus of claim 2, wherein the bernoulli system comprises: the outer disc body is arranged at the top end of the upper cover body, the inner disc body is arranged in the outer disc body, an annular cavity is formed between the outer disc body and the inner disc body, an annular gap communicated with the annular cavity is formed between the outer edge of the inner disc body and the outer disc body, and an air injection pipe penetrates through the outer disc body and is used for injecting air into the annular cavity;
the gas nozzles inject gas into the annular chamber, the gas circulates in the annular chamber and is exhausted through the annular gap to generate Bernoulli effect, and the wafer is held on the inner disk body in a horizontal posture.
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| CN118062575B (en) * | 2024-04-19 | 2024-06-18 | 山东利福特玻璃科技股份有限公司 | Conveying system for toughened mirror preparation |
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|---|---|---|---|---|
| JP2009141027A (en) * | 2007-12-04 | 2009-06-25 | Hirata Corp | Aligner and edge clamp detecting method using the same |
| CN105762094A (en) * | 2014-12-19 | 2016-07-13 | 沈阳芯源微电子设备有限公司 | Device for clamping edge of wafer during automatic wafer cleaning process and clamping method of device |
| KR20220144637A (en) * | 2021-04-20 | 2022-10-27 | 주식회사 영테크 | Wafer grip unit |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141027A (en) * | 2007-12-04 | 2009-06-25 | Hirata Corp | Aligner and edge clamp detecting method using the same |
| CN105762094A (en) * | 2014-12-19 | 2016-07-13 | 沈阳芯源微电子设备有限公司 | Device for clamping edge of wafer during automatic wafer cleaning process and clamping method of device |
| KR20220144637A (en) * | 2021-04-20 | 2022-10-27 | 주식회사 영테크 | Wafer grip unit |
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Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |