CN116564867A - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
- Publication number
- CN116564867A CN116564867A CN202310498535.5A CN202310498535A CN116564867A CN 116564867 A CN116564867 A CN 116564867A CN 202310498535 A CN202310498535 A CN 202310498535A CN 116564867 A CN116564867 A CN 116564867A
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- CN
- China
- Prior art keywords
- mounting
- positioning
- wall
- wafer
- side groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 claims abstract description 46
- 235000012431 wafers Nutrition 0.000 claims description 156
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 238000006748 scratching Methods 0.000 description 4
- 230000002393 scratching effect Effects 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The embodiment of the application discloses a wafer bearing device, which comprises a box body, a cover body, two side groove plates and two mounting structures, wherein the box body is provided with a containing space, the containing space is provided with a mounting opening and two oppositely arranged mounting inner walls, and the containing space is also provided with a bottom wall opposite to the mounting opening; the cover body can be connected with the box body and is arranged at the installation opening; the two side groove plates are arranged in a split manner with the box body and are respectively arranged in one-to-one correspondence with the two mounting inner walls; two mounting structures are connected with the corresponding side groove plates and the corresponding mounting inner walls respectively, so that the corresponding side groove plates are detachably connected to the corresponding mounting inner walls in a drawing and inserting mode, when the wafer bearing device is required to be cleaned, the two side groove plates can be detached from the accommodating space of the box body, the accommodating space of the box body and the side groove plates can be conveniently cleaned, and therefore the wafer placed in the box body can be kept in a clean state.
Description
Technical Field
The application relates to the technical field of semiconductor wafer auxiliary production equipment, in particular to a wafer bearing device.
Background
In the related art, after the wafer is produced, the wafer needs to be transported through the wafer carrying device, but the wafer carrying device is usually integrally arranged, so that the interior of the wafer carrying device is not convenient to clean.
Disclosure of Invention
The embodiment of the application provides a wafer bears device, aims at setting up box and side channel plate split type to be convenient for dismantle the side channel plate, thereby can wash side channel plate and/or box, and then can make the wafer of placing in the box keep clean state.
The embodiment of the application provides a wafer bearing device, which comprises a box body, a cover body, two side groove plates and two mounting structures, wherein the box body is provided with a containing space, the containing space is provided with a mounting opening and two oppositely arranged mounting inner walls, and the containing space is also provided with a bottom wall opposite to the mounting opening; the cover body can be connected with the box body and is arranged at the installation opening; the two side groove plates are arranged in a split manner with the box body and are respectively arranged in one-to-one correspondence with the two mounting inner walls; the two mounting structures are respectively connected with the corresponding side groove plates and the corresponding mounting inner walls so as to detachably connect the corresponding side groove plates to the corresponding mounting inner walls in a drawing and inserting mode.
Based on the above embodiment, when the wafer carrying device is required to be cleaned, the two side groove plates can be detached from the accommodating space of the box body, so that the accommodating space of the box body and the side groove plates can be conveniently cleaned, and impurities adhered to the inner wall of the accommodating space and/or adhered to the side groove plates are prevented from adhering to the surface of the wafer, so that the wafer placed in the box body can be kept in a clean state. After cleaning the wafer bearing device, the side groove plates are moved in the accommodating space along the drawing and inserting direction, the inner wall and the side groove plates are connected and installed through the installation structures at the corresponding sides, so that the connection between the box body and the side groove plates is realized, the wafer is conveniently placed in the accommodating space, the wafer bearing device is utilized to provide protection for the wafer, the wafer is prevented from being damaged, and reliable guarantee is provided for the quality of the wafer.
In some embodiments, each mounting structure comprises a mounting assembly and a positioning assembly, wherein the mounting assembly is connected with the side groove plate and the mounting inner wall and is used for fixedly mounting the side groove plate on the mounting inner wall; the locating component is connected with the side groove plate and the installation inner wall and is arranged at intervals with the installation component, and the locating component is used for locating the side groove plate when the side groove plate is inserted into the accommodating space.
Based on the above embodiment, the side groove plate is conveniently connected with the mounting inner wall by the mounting assembly, and the positioning assembly can position the side groove plate when the side groove plate is mounted, so that the mounting precision between the side groove plate and the mounting inner wall is improved.
In some embodiments, the side groove plate is provided with a mounting surface facing the bottom wall, the mounting assembly comprises a boss and two clamping pieces, the boss is convexly arranged on one side of the mounting inner wall, which is close to the bottom wall, the boss is provided with a boss abutting surface facing away from the bottom wall, and the mounting surface is abutted with the boss abutting surface; the two clamping pieces are symmetrically arranged on the mounting surface and are respectively clamped on the two opposite sides of the boss.
Based on the above embodiment, when installing the side groove plate, along drawing and inserting direction, move the side groove plate to the direction that is close to the boss until two joint spare moves to the opposite sides of boss respectively, continue to remove the side groove plate, until two joint spare joint respectively in the opposite sides of boss to realize the connection of side groove plate and installation inner wall, convenient and fast. When the side groove plate needs to be disassembled, the two clamping pieces are disconnected with the boss in a clamping manner, the side groove plate is moved along the drawing and inserting direction in a direction away from the boss until the side groove plate moves out of the accommodating space, so that the side groove plate is disassembled, the inner wall of the box body and the side groove plate are cleaned, and a wafer placed in the box body can be kept in a clean state.
In some embodiments, the mounting assembly further comprises a plurality of grooving pieces and a plurality of plug connectors, the grooving pieces are convexly arranged on one side of the mounting inner wall, close to the bottom wall, and are arranged at intervals with the boss, each grooving piece is provided with a grooving surface deviating from the bottom wall, each grooving surface is abutted with the mounting surface, and each grooving piece is provided with a mounting groove; the plurality of plug connectors are arranged on the mounting surface and are in one-to-one correspondence with the plurality of grooving pieces, and each plug connector is correspondingly inserted in the mounting groove.
Based on the above embodiment, when installing the side groove plate, along the direction of inserting, move the side groove plate to the direction that is close to the boss, until two joint pieces respectively joint in the opposite sides of boss, at this moment, the plug connector that corresponds is pegged graft in the mounting groove that corresponds to increase the connection stability between side groove plate and the installation inner wall.
In some embodiments, the boss abutting surface is further provided with boss positioning holes, each slotted surface is provided with at least one insertion positioning hole, the insertion positioning holes are arranged at intervals with the mounting groove, the positioning assembly comprises a first positioning column and a plurality of second positioning columns, the first positioning column is arranged on the mounting surface and is arranged at intervals with the clamping piece, and the first positioning column penetrates through the boss positioning holes; the second positioning columns are arranged on the mounting surface, are arranged at intervals with the plug connectors, and are plugged in the plug-in positioning holes in a one-to-one correspondence manner.
Based on the above-mentioned embodiment, when installing the side frid, along taking out and inserting the direction, to the direction that is close to the boss removal side frid, first reference column can peg graft in boss locating hole, can improve the joint precision of two joint spare and boss, and the second reference column that corresponds can peg graft in the locating hole that corresponds, can improve the grafting precision that the plug connector pegged graft in the mounting groove.
In some embodiments, the mounting assembly comprises a boss and two grooving pieces, the positioning assembly further comprises a first positioning block, two second positioning blocks, a first positioning piece and two second positioning pieces, the first positioning block is arranged on the mounting inner wall, the boss is arranged on one side of the first positioning block, which is away from the mounting inner wall, the first positioning block is provided with a first positioning surface facing the mounting opening, the first positioning surface is provided with a third positioning column, and the first positioning block is provided with a symmetrical axis arranged along the drawing and inserting direction; the two second positioning blocks are arranged on the mounting inner wall, the two second positioning blocks are axially symmetrically arranged on the symmetry axis, the two grooving pieces are arranged on one side of the second positioning blocks, which is away from the mounting inner wall, in a one-to-one correspondence manner, each second positioning block is provided with a second positioning surface facing the mounting opening, and each second positioning surface is provided with a fourth positioning column; the first positioning piece is arranged on the surface of the side groove plate, facing the mounting inner wall, and is in butt joint with the first positioning surface, the first positioning piece is provided with a third positioning hole, and a third positioning column is arranged in the third positioning hole in a penetrating manner; the two second locating pieces are arranged on the surface of the side groove plate, facing the installation inner wall, and are respectively abutted to the two second locating faces, the second locating pieces are arranged at intervals with the first locating pieces, the two second locating pieces are arranged in one-to-one correspondence with the two second locating pieces, each second locating piece is provided with a fourth locating hole, and the fourth locating columns penetrate through the fourth locating holes in one-to-one correspondence.
Based on the above embodiment, the installation of the side groove plate and the side of the installation inner wall far away from the bottom wall is realized by utilizing the matching of the third positioning hole and the third positioning column and the matching of the corresponding fourth positioning hole and the corresponding fourth positioning column, and the installation precision of the side groove plate and the installation inner wall is further improved.
In some embodiments, a positioning groove is formed between the first positioning piece and the second positioning piece, the positioning assembly further comprises two positioning bosses, the two positioning bosses are respectively arranged on the two second positioning surfaces and extend towards the mounting opening, and the two positioning bosses respectively penetrate through the corresponding positioning grooves.
Based on the embodiment, the two positioning bosses penetrate through the two corresponding positioning grooves, so that positioning can be provided for the movement of the first positioning piece and the two second positioning pieces, the third positioning column is conveniently inserted into the third positioning hole, and the corresponding fourth positioning column is conveniently inserted into the corresponding fourth positioning hole.
In some embodiments, the side slot plate has two opposite sides extending along the insertion direction, and the wafer carrying device further includes at least two guiding elements and a guiding strip, where the at least two guiding elements are respectively disposed on the two sides of the side slot plate; the guide strips extend along the drawing and inserting direction, at least two guide strips are arranged on each installation inner wall, and each guide piece is slidably clamped with the corresponding guide strip.
Based on the above-mentioned embodiment, when installing the side frid, guide piece and corresponding gib block sliding connection can provide the direction for the installation of side frid to utilize the joint cooperation of guide piece and guide way, prevent that the side frid from torsion, thereby can improve the connection stability of side frid with installation inner wall.
In some of these embodiments, the wafer carrier further includes a locking assembly coupled to the side pocket plate and the mounting inner wall for limiting movement of the side pocket plate relative to the mounting inner wall.
Based on the embodiment, after the side groove plate is connected with the installation inner wall through the installation structure, the locking component can be used for limiting the movement of the side groove plate relative to the installation inner wall, so that the connection stability of the side groove plate and the installation inner wall is improved; when dismantling the side frid, open locking subassembly, follow the drawing and inserting direction, remove the side frid to the direction of keeping away from the diapire, until the side frid breaks away from the box to realize the dismantlement of side frid.
In some embodiments, the locking assembly comprises a locking block and a lock body, wherein the locking block is connected with one side of the mounting inner wall far away from the bottom wall and is arranged at intervals with the boss; the lock body is in sliding connection with one side of the side groove plate, which is far away from the mounting surface, the lock body at least has a locking state and an opening state in the process of moving relative to the side groove plate, when the lock body is in the locking state, the side groove plate is positioned between the lock block and the boss, the mounting surface is abutted with the abutment surface of the boss, the lock body is abutted with the surface of the lock block, which faces the side groove plate, and the lock body is in clamping connection with the lock block; when the lock body is in an open state, the lock body is separated from the lock block.
Based on the above embodiment, after the side groove plate is connected with the installation inner wall through the installation structure, the lock body is slid so that the lock body is clamped with the locking block, thereby limiting the movement of the lock body relative to the side groove plate by utilizing the limiting locking block, and further limiting the movement of the side groove plate relative to the installation inner wall by utilizing the matching of the locking block and the lock body, so as to improve the connection stability of the side groove plate and the installation inner wall.
In some embodiments, the locking assembly further comprises a support member connected with one side of the side groove plate facing the mounting inner wall, and the lock body comprises a lock body and an elastic clamping part, and the lock body is connected with the support member in a sliding manner; one end of the elastic clamping part is connected with the lock body, and the other end is used for being clamped with the lock block.
In some embodiments, the locking assembly further comprises an abutting block, the abutting block is connected with one side of the installation inner wall far away from the bottom of the accommodating space and is arranged at intervals with the locking block, the lock body is provided with an avoidance groove, the avoidance groove is aligned with the abutting block when the lock body is in an open state, and the lock body is separated from the locking block; when the lock body is in a locking state, one side of the lock body, which is far away from the lock block, is abutted with the abutting block.
Based on the embodiment, when the lock body is in the open state, the avoidance groove is aligned with the abutting block, and the lock body is separated from the lock block, so that the side groove plate can move relative to the installation inner wall conveniently; when the lock body is in a locking state, one side of the lock body, which is far away from the lock block, is abutted with the abutting block, so that the connection stability of the side groove plate and the installation inner wall can be improved.
In some embodiments, the housing is a transparent housing, each side channel plate has a plurality of slots for receiving wafers, the slots being disposed through the side channel plate, the side channel plate having a number on a surface thereof facing the mounting wall.
Based on the above embodiment, since the case is a transparent case, a worker can observe the number on the side slot plate through the transparent case and observe whether the wafer is in the slot corresponding to the number, thereby facilitating the picking and placing of the wafer at the designated position.
In some embodiments, the groove wall of the clamping groove is provided with a supporting part, the supporting part comprises a supporting sub-strip part and a supporting sub-surface part, the supporting sub-strip part is close to the mounting opening compared with the supporting sub-surface part, the supporting sub-surface part is close to the bottom wall compared with the supporting sub-strip part, one side of the supporting sub-strip part far away from the groove wall and one side of the supporting sub-surface part far away from the groove wall are located in the same plane, and the supporting sub-strip part is used for being abutted with the side face of the wafer after the wafer is placed in the clamping groove so as to support the wafer.
Based on the above embodiment, after the wafer is placed in the clamping groove from the mounting opening, one surface of the wafer can be contacted with the supporting sub-strip part and the supporting sub-surface part, so that the contact area between the wafer and the wall of the clamping groove can be reduced, the probability of scratching the surface of the wafer in a large area can be reduced, and reliable guarantee is provided for the quality of the wafer. The support sub-strip portion and the support sub-face portion can be integrally formed with the side groove plate, so that structural strength of the support sub-strip portion and the support sub-face portion is improved, and the support sub-strip portion and the support sub-face portion are high in connection stability with the side groove plate. The support sub-strip portion and the support sub-face portion may be connected to the side groove plate by screwing, clamping or gluing, and in this embodiment of the present application, the connection manner between the support sub-strip portion and the support sub-face portion and the side groove plate is not limited.
In some embodiments, the slot wall of the slot is provided with a limiting part, and the limiting part and the supporting part are located on the same slot wall, the limiting part is arranged on one side of the slot close to the mounting opening and is adjacent to or spaced from the supporting sub-strip part, the limiting part has a first height compared with the slot wall of the slot, the supporting sub-strip part has a second height compared with the slot wall of the slot, the first height is greater than the second height, and in two opposite side slot plates, a distance between the two corresponding slots is smaller than the diameter of the wafer.
Based on the embodiment, after the wafer is placed in the box body, the wafer is limited to move along the drawing and inserting direction; further, since the inert gas such as nitrogen is injected into the box body to replace air in the box body in order to prevent the wafer from being contacted with oxygen after the wafer is placed in the box body, the box body can be in a positive pressure state, and the wafer has a tendency to move from the mounting opening to the outside of the box body when the cover body is opened, the movement of the wafer to the mounting opening can be limited by the limiting part when the cover body is opened, so that protection can be provided for the wafer to prevent the wafer from falling and damaging.
In some embodiments, the height of the limiting portion gradually increases from the side of the mounting opening to the side near the bottom wall, and gradually increases to the first height.
Based on the above embodiment, the height of the limiting portion is gradually increased from one side of the mounting opening to one side close to the bottom wall compared with the height of the slot wall of the clamping slot, and gradually increased to the first height, so that the wafer can be placed on the supporting portion by guiding the movement of the wafer when the wafer is placed. And because the height of the limiting part is gradually increased from one side of the mounting opening to one side close to the bottom wall compared with the height of the slot wall of the clamping slot, the surface contacted with the wafer is an inclined plane in the process of placing the wafer, and therefore the probability of damage caused by overlarge radial stress of the wafer can be reduced.
In some embodiments, the limiting portion has a first width in a direction perpendicular to the insertion direction, and the first width gradually decreases from a side of the mounting opening to a side near the bottom wall.
Based on the above embodiment, along the direction perpendicular to the inserting direction, the limiting portion has a first width, and the first width gradually decreases from one side of the mounting opening to one side close to the bottom wall, so that the first width of the limiting portion on one side close to the mounting opening is larger, and when the wafer is placed, the limiting portion is close to the first mounting opening and can be contacted with the wafer as soon as possible, so that guiding can be provided for the movement of the wafer as soon as possible, and the wafer can enter the clamping groove to be contacted with the supporting portion.
In some embodiments, the surface of the limiting part facing away from the bottom of the clamping groove is an arc surface.
Based on the above embodiment, the surface of the limiting part, which deviates from the bottom of the clamping groove, is an arc surface, so that after the wafer is placed in the box body, the arc surface can face the wafer, thereby preventing the limiting part from scratching the wafer, and reducing the probability of wafer damage.
Based on the wafer carrying device, when the wafer carrying device is required to be cleaned, the two side groove plates can be detached from the accommodating space of the box body, so that the accommodating space of the box body and the side groove plates can be conveniently cleaned, impurities adhered to the inner wall of the accommodating space and/or the side groove plates are prevented from adhering to the surface of the wafer, and the wafer placed in the box body can be kept in a clean state. After cleaning the wafer bearing device, the side groove plates are moved in the accommodating space along the drawing and inserting direction, the inner wall and the side groove plates are connected and installed through the installation structures at the corresponding sides, so that the connection between the box body and the side groove plates is realized, the wafer is conveniently placed in the accommodating space, the wafer bearing device is utilized to provide protection for the wafer, the wafer is prevented from being damaged, and reliable guarantee is provided for the quality of the wafer.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer carrier according to one embodiment of the present disclosure;
FIG. 2 is an exploded view of a wafer carrier according to one embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view of a case according to an embodiment of the present disclosure;
FIG. 4 is a schematic view showing an exploded structure of a side slot plate and a lock body according to an embodiment of the present application;
FIG. 5 is a schematic view of a side channel plate according to an embodiment of the present disclosure;
FIG. 6 is an enlarged schematic view of the structure shown at A in FIG. 5;
FIG. 7 is an enlarged schematic view of the structure shown at B in FIG. 5;
FIG. 8 is a schematic view of a partial structure of a side channel plate according to an embodiment of the present application;
fig. 9 is a schematic view of another partial structure of a side channel plate in an embodiment of the present application.
Reference numerals illustrate: 1. a wafer carrying device; 11. a case; 11A, accommodation space; 11B, mounting openings; 11C, mounting an inner wall; 12. side groove plates; 12A, a mounting surface; 12B, sides; 12C, a clamping groove; 12D, number; 13. a mounting structure; 131. a mounting assembly; 1311. a boss; 1311A, boss abutment surfaces; 1311B, boss locating holes; 1312. a clamping piece; 1313. a slotting member; 1313A, grooved face; 1313B, mounting slots; 1313C, inserting into a locating hole; 1314. a plug-in component; 132. a positioning assembly; 1321. a first positioning column; 1322. a second positioning column; 1323. a first positioning block; 1323A, a first positioning surface; 1323B, symmetry axis; 1324. a second positioning block; 1324A, a second locating surface; 1325. a first positioning member; 1325A, third positioning holes; 1326. a second positioning member; 1326A, fourth positioning hole; 1327. a third positioning column; 1328. a fourth positioning column; 1329. positioning the boss; 1329A, positioning slots; 14. a guide member; 15. a guide bar; 16. a locking assembly; 161. a locking piece; 162. a lock body; 1621. a lock body; 1621A, avoidance groove; 1622. an elastic clamping part; 163. a support; 164. an abutment block; 17. a cover body; 18. a support part; 181. supporting the sub-strip portion; 182. a support sub-face portion; 19. a limit part; l1, a first height; l2, second height; l3, a first width; x, drawing and inserting direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
Referring to fig. 1-4, an embodiment of a wafer carrier 1 is provided, which includes a case 11, two side boards 12, two mounting structures 13, and a cover 17.
The case 11 has an accommodation space 11A, the accommodation space 11A having a mounting opening 11B and two oppositely disposed mounting inner walls 11C, the accommodation space 11A further having a bottom wall opposite to the mounting opening 11B, and the cover 17 is connectable to the case 11 and located at the mounting opening 11B. The wafer can be placed in the accommodating space 11A through the mounting opening 11B, and then the cover 17 is covered at the mounting opening 11B of the box 11 to prevent the wafer from being separated from the accommodating space 11A from the mounting opening 11B, so that the wafer in the accommodating space 11A can be transported or stored through the box 11 to protect the wafer in the accommodating space 11A by using the box 11 and prevent the wafer from being damaged. The material of the case 11 may be PC (Polycarbonate) or PP (polypropylene), so that the weight of the case 11 can be reduced to facilitate the transfer of the case 11 and the wafers in the case 11 by the handling device. The box 11 can be integrally formed through an injection molding process, so that the structural strength of the box 11 is improved, and the quality of the wafer can be reliably guaranteed.
The two side groove plates 12 are arranged in the accommodating space 11A and are arranged separately from the box body 11, and the two side groove plates 12 are respectively arranged in one-to-one correspondence with the two mounting inner walls 11C. When the wafer is placed in the accommodation space 11A, the side groove plates 12 can support the wafer so that two adjacent wafers can be arranged at intervals, thereby preventing collision between the two adjacent wafers to prevent the wafer from being damaged. The material of the side slot plate 12 may also be PC or ACP (polycarbonate+ Poly tetra fluoroethylene ), so that the side slot plate 12 has a relatively light weight, so that the side slot plate 12 is mounted in the box 11, and further, the side slot plate 12 may be integrally formed through an injection molding process, so that the side slot plate 12 has relatively high structural strength, and thus, the side slot plate 12 can provide stable support for a wafer, so as to prevent the wafer from being damaged.
The mounting structure 13 can be used to connect the corresponding side channel plate 12 with the corresponding mounting inner wall 11C, so as to improve the connection stability of the side channel plate 12 with the mounting inner wall 11C, so that the side channel plate 12 can provide stable support for the wafer; when the case 11 and/or the side groove plates 12 need to be cleaned, the side groove plates 12 can be detached from the corresponding mounting inner walls 11C, so that the case 11 and/or the side groove plates 12 can be cleaned to prevent impurities adhering to the inner walls of the accommodation space 11A and/or adhering to the side groove plates 12 from adhering to the wafer surface, so that the wafer is kept clean.
In this embodiment, when the wafer carrier 1 is required to be cleaned, the two side boards 12 may be detached from the accommodating space 11A of the case 11, so that the accommodating space 11A of the case 11 and the side boards 12 may be cleaned conveniently, and impurities adhered to the inner wall of the accommodating space 11A and/or adhered to the side boards 12 may be prevented from adhering to the wafer surface, so that the wafer quality may be improved. After the wafer carrying device 1 is cleaned, the side groove plate 12 is moved in the drawing and inserting direction X toward the accommodating space 11A, and the mounting inner wall 11C and the side groove plate 12 are connected through the mounting structure 13 on the corresponding side, so that the connection between the box 11 and the side groove plate 12 is realized, and the wafer is conveniently placed in the accommodating space 11A, so that the wafer carrying device 1 is utilized to provide protection for the wafer, and the wafer is prevented from being damaged.
Referring to fig. 1-4, in a specific embodiment, each side slot plate 12 has a plurality of slots 12C for placing wafers, and the slots 12C are disposed through the side slot plate 12 so that the wafers can be stably placed in each slot 12C, and a space is formed between two adjacent wafers by using the slot walls of the slots 12C to prevent collision between the two adjacent wafers, thereby preventing the wafers from being damaged.
Referring to fig. 1-4, in a specific embodiment, each mounting structure 13 includes a mounting assembly 131 and a positioning assembly 132, where the mounting assembly 131 is connected to the side channel plate 12 and the mounting inner wall 11C for fixedly mounting the side channel plate 12 to the mounting inner wall 11C; the positioning component 132 is connected with the side groove plate 12 and the installation inner wall 11C, and is arranged at intervals with the installation component 131, and is used for positioning the side groove plate 12 when the side groove plate 12 is inserted into the accommodating space 11A, the installation component 131 is utilized to facilitate connection of the side groove plate 12 and the installation inner wall 11C, the positioning component 132 can position the side groove plate 12 when the side groove plate 12 is installed, so that the installation precision between the side groove plate 12 and the installation inner wall 11C is improved, and the wafer is accurately placed in the accommodating space 11A.
Referring to fig. 3 and 4, in a specific embodiment, the side slot plate 12 has a mounting surface 12A facing the bottom wall, the mounting assembly 131 includes a boss 1311 and two clamping members 1312, the boss 1311 is convexly disposed on one side of the mounting inner wall 11C near the bottom wall, the boss 1311 has a boss abutment surface 1311A facing away from the bottom wall, and the mounting surface 12A abuts against the boss abutment surface 1311A; the two clamping pieces 1312 are symmetrically arranged on the mounting surface 12A and are respectively clamped on the opposite sides of the boss 1311, when the side groove plate 12 is mounted, the side groove plate 12 is moved along the drawing and inserting direction X towards the direction close to the boss 1311 until the two clamping pieces 1312 respectively move to the opposite sides of the boss 1311, and the side groove plate 12 is continuously moved until the two clamping pieces 1312 are respectively clamped on the opposite sides of the boss 1311, so that the connection between the side groove plate 12 and the mounting inner wall 11C is realized, and convenience and quickness are realized. When the side groove plate 12 needs to be disassembled, the clamping connection between the two clamping pieces 1312 and the boss 1311 is disconnected, the side groove plate 12 is moved along the drawing and inserting direction X in the direction away from the boss 1311 until the side groove plate 12 moves out of the accommodating space 11A, so that the side groove plate 12 is disassembled, the inner wall of the box 11 and the side groove plate 12 are cleaned conveniently, and the wafer can be kept to be high in quality.
Referring to fig. 3 and 4, in a specific embodiment, the mounting assembly 131 further includes a plurality of slotting members 1313 and a plurality of connectors 1314, wherein the plurality of slotting members 1313 are convexly disposed on one side of the mounting inner wall 11C near the bottom wall and are spaced apart from the boss 1311, each slotting member 1313 has a slotting surface 1313A facing away from the bottom wall, each slotting surface 1313A abuts against the mounting surface 12A, and each slotting member 1313 has a mounting slot 1313B; the plurality of plugging members 1314 are disposed on the mounting surface 12A and are disposed in a one-to-one correspondence with the plurality of slotting members 1313, each plugging member 1314 is plugged into the corresponding mounting slot 1313B, when the side slot plate 12 is mounted, the side slot plate 12 is moved along the plugging direction X toward the direction near the bottom until the two clamping members 1312 are respectively clamped on opposite sides of the boss 1311, at this time, the corresponding plugging member 1314 is plugged into the corresponding mounting slot 1313B, thereby increasing the connection stability between the side slot plate 12 and the mounting inner wall 11C.
Referring to fig. 3 and fig. 4, in a specific embodiment, the boss abutting surface 1311A further has a boss positioning hole 1311B, each slotted surface 1313A has at least one insertion positioning hole 1313C, the insertion positioning holes 1313C are spaced apart from the mounting slots 1313B, the positioning assembly 132 includes a first positioning post 1321 and a plurality of second positioning posts 1322, the first positioning post 1321 is disposed on the mounting surface 12A and spaced apart from the clamping member 1312, and the first positioning post 1321 is disposed in the boss positioning hole 1311B in a penetrating manner; the plurality of second positioning columns 1322 are disposed on the mounting surface 12A, are disposed at intervals with the connectors 1314, and are inserted into the insertion positioning holes 1313C in a one-to-one correspondence manner, when the side slot plate 12 is mounted, the side slot plate 12 is moved along the drawing and inserting direction X toward a direction close to the boss 1311, the first positioning columns 1321 can be inserted into the boss positioning holes 1311B, so that the fastening precision of the two fastening members 1312 and the boss 1311 can be improved, the corresponding second positioning columns 1322 can be inserted into the corresponding insertion positioning holes 1313C, and the inserting precision of the connectors 1314 in the mounting groove 1313B can be improved.
Referring to fig. 2-4, in a specific embodiment, the mounting assembly 131 includes a boss 1311 and two slotting members 1313, the positioning assembly 132 further includes a first positioning block 1323, two second positioning blocks 1324, a first positioning member 1325 and two second positioning members 1326, the first positioning block 1323 is disposed on the mounting inner wall 11C, the boss 1311 is disposed on a side of the first positioning block 1323 facing away from the mounting inner wall 11C, the first positioning block 1323 has a first positioning surface 1323A facing the mounting opening 11B, the first positioning surface 1323A is provided with a third positioning post 1327, and the first positioning block 1323 has a symmetry axis 1323B disposed along the drawing direction X; the two second positioning blocks 1324 are arranged on the mounting inner wall 11C, the two second positioning blocks 1324 are axisymmetrically arranged with the symmetry axis 1323B, the two grooving pieces 1313 are arranged on one side of the second positioning blocks 1324 away from the mounting inner wall 11C in a one-to-one correspondence manner, each second positioning block 1324 is provided with a second positioning surface 1324A facing the mounting opening 11B, and each second positioning surface 1324A is provided with a fourth positioning column 1328; the first positioning member 1325 is disposed on a surface of the side slot plate 12 facing the mounting inner wall 11C and abuts against the first positioning surface 1323A, the first positioning member 1325 has a third positioning hole 1325A, and the third positioning post 1327 is disposed in the third positioning hole 1325A in a penetrating manner; the two second positioning pieces 1326 are disposed on the surface of the side slot plate 12 facing the mounting inner wall 11C and are respectively abutted against the two second positioning surfaces 1324A, the second positioning pieces 1326 are disposed at intervals with the first positioning pieces 1325, the two second positioning pieces 1326 are disposed in one-to-one correspondence with the two second positioning pieces 1324, each second positioning piece 1326 has a fourth positioning hole 1326A, the fourth positioning column 1328 is disposed in the fourth positioning hole 1326A in one-to-one correspondence, and the side slot plate 12 and the mounting inner wall 11C are mounted far from the bottom wall by utilizing the matching of the third positioning hole 1325A and the third positioning column 1327 and the matching of the corresponding fourth positioning hole 1326A and the corresponding fourth positioning column 1328, so that the mounting accuracy of the side slot plate 12 and the mounting inner wall 11C is further improved.
Referring to fig. 2-4, in a specific embodiment, a positioning groove 1329A is formed between the first positioning member 1325 and the second positioning member 1326, the positioning assembly 132 further includes two positioning bosses 1329, the two positioning bosses 1329 are respectively disposed on the two second positioning surfaces 1324A and extend toward the mounting opening 11B, the two positioning bosses 1329 respectively pass through the corresponding positioning grooves 1329A, and the two positioning bosses 1329 pass through the two corresponding positioning grooves 1329A, so that positioning can be provided for movement of the first positioning member 1325 and the two second positioning members 1326, so that the third positioning post 1327 is inserted into the third positioning hole 1325A, and the corresponding fourth positioning post 1328 is also inserted into the corresponding fourth positioning hole 1326A.
Referring to fig. 2 to 4, in a specific embodiment, the side slot plate 12 has two opposite sides 12B extending along the insertion direction X, and the wafer carrier 1 further includes at least two guiding members 14 and a guiding strip 15, where the at least two guiding members 14 are respectively disposed on the two sides 12B of the side slot plate 12; the guide strips 15 extend along the drawing and inserting direction X, at least two guide strips 15 are arranged on each installation inner wall 11C, each guide piece 14 is slidably clamped with the corresponding guide strip 15, when the side groove plate 12 is installed, the guide piece 14 is slidably connected with the corresponding guide strip 15, guidance can be provided for the installation of the side groove plate 12, the side groove plate 12 is prevented from being twisted by means of clamping fit of the guide piece 14 and the guide groove, and accordingly connection stability of the side groove plate 12 and the installation inner wall 11C can be improved.
Referring to fig. 2-4, in a specific embodiment, the wafer carrier 1 further includes a locking assembly 16, where the locking assembly 16 is connected to the side slot plate 12 and the mounting inner wall 11C and is used to limit the movement of the side slot plate 12 relative to the mounting inner wall 11C, and after the side slot plate 12 is connected to the mounting inner wall 11C through the mounting structure 13, the locking assembly 16 may be used to limit the movement of the side slot plate 12 relative to the mounting inner wall 11C, so as to increase the connection stability between the side slot plate 12 and the mounting inner wall 11C; when the side channel plate 12 is detached, the locking assembly 16 is opened, and the side channel plate 12 is moved in the insertion direction X in a direction away from the bottom wall until the side channel plate 12 is separated from the case 11, so that the side channel plate 12 is detached.
Referring to fig. 2-4, in a specific embodiment, the locking assembly 16 includes a locking block 161 and a lock body 162, wherein the locking block 161 is connected to a side of the mounting inner wall 11C away from the bottom wall and is spaced from the boss 1311; the lock body 162 is slidably connected to a side of the side channel plate 12 away from the mounting surface 12A, the lock body 162 has at least a locked state and an unlocked state in the process of moving relative to the side channel plate 12, when the lock body 162 is in the locked state, the side channel plate 12 is located between the lock block 161 and the boss 1311, the mounting surface 12A abuts against the boss abutment surface 1311A, the lock body 162 abuts against a surface of the lock block 161 facing the side channel plate 12, and the lock body 162 is clamped with the lock block 161; when the lock body 162 is in the open state, the lock body 162 is separated from the lock block 161, and after the side groove plate 12 is connected with the installation inner wall 11C through the installation structure 13, the lock body 162 is slid so that the lock body 162 is clamped with the lock block 161, thereby restricting the movement of the lock body 162 relative to the side groove plate 12 by using the restricting lock block 161, and restricting the movement of the side groove plate 12 relative to the installation inner wall 11C by using the cooperation of the lock block 161 and the lock body 162, so as to improve the connection stability of the side groove plate 12 and the installation inner wall 11C.
Referring to fig. 2-4, in a specific embodiment, the locking assembly 16 further includes a supporting member 163, the supporting member 163 is connected to a side of the side slot plate 12 facing the mounting inner wall 11C, the lock body 162 includes a lock body 1621 and an elastic clamping portion 1622, and the lock body 1621 is slidably connected to the supporting member 163; one end of the elastic clamping portion 1622 is connected with the lock body 1621, and the other end is used for being clamped with the locking piece 161, so that the movement of the lock body 1621 relative to the side groove plate 12 is limited, and the movement of the side groove plate 12 relative to the mounting inner wall 11C is further limited, so that the connection stability of the side groove plate 12 and the mounting inner wall 11C is improved.
Referring to fig. 2-4, in a specific embodiment, the locking assembly 16 further includes an abutment block 164, where the abutment block 164 is connected to a side of the mounting inner wall 11C away from the bottom of the accommodating space 11A and is spaced from the locking block 161, and the lock body 1621 has an avoidance groove 1621A, and when the lock body 1621 is in an open state, the avoidance groove 1621A is aligned with the abutment block 164, and the lock body 1621 is disengaged from the locking block 161, so that the abutment block 164 can pass through the avoidance groove 1621A when the side slot plate 12 is moved along the insertion direction X, so as not to affect the movement of the side slot plate 12; when the lock body 162 is in a locking state, one side of the lock body 1621 away from the lock block 161 is abutted against the abutment block 164, and when the lock body 1621 is in an opening state, the avoiding groove 1621A is aligned with the abutment block 164, and the lock body 1621 is separated from the lock block 161, so that the side groove plate 12 can move relative to the mounting inner wall 11C conveniently; when the lock body 162 is in the locked state, the side of the lock body 1621 remote from the lock block 161 abuts against the abutment block 164, so that the connection stability of the side channel plate 12 and the mounting inner wall 11C can be increased.
Referring to fig. 1-4, in a specific embodiment, the case 11 is a transparent case 11, and the surface of the side slot plate 12 facing the mounting inner wall 11C has a number 12D. Because the box 11 is the transparent box 11, the staff can see through the transparent box 11, observe the number 12D on the side slot plate 12, and observe whether there is a wafer in the clamping slot 12C corresponding to the number 12D, thereby being convenient for get the wafer of putting to the appointed position.
Referring to fig. 2 and fig. 5-7, in a specific embodiment, the groove wall of the clamping groove 12C is provided with a supporting portion 18, the supporting portion 18 includes a supporting sub-strip portion 181 and a supporting sub-surface portion 182, the supporting sub-strip portion 181 is close to the mounting opening 11B compared with the supporting sub-surface portion 182, the supporting sub-surface portion 182 is close to the bottom wall compared with the supporting sub-strip portion 181, and a side of the supporting sub-strip portion 181 away from the groove wall of the clamping groove 12C and a side of the supporting sub-surface portion 182 away from the groove wall are located in the same plane, so that after the wafer is placed in the clamping groove 12C from the mounting opening 11B, a surface of the wafer can be contacted with the supporting sub-strip portion 181 and the supporting sub-surface portion 182, so that a contact area between the wafer and the groove wall of the clamping groove 12C can be reduced, and a probability of scratching the surface of the wafer in a large area can be reduced, thereby providing a reliable guarantee for the quality of the wafer. Exemplary, the supporting sub-strip portion 181 and the supporting sub-face portion 182 can be integrally formed with the side groove plate 12, so as to improve the structural strength of the supporting sub-strip portion 181 and the supporting sub-face portion 182, and make the supporting sub-strip portion 181 and the supporting sub-face portion 182 have higher connection stability with the side groove plate 12. For example, the supporting sub-strip portion 181 and the supporting sub-face portion 182 may be connected to the side slot plate 12 by screwing, clamping or gluing, and in this embodiment, the connection manner between the supporting sub-strip portion 181 and the supporting sub-face portion 182 and the side slot plate 12 is not limited.
Referring to fig. 2 and fig. 5-8, in a specific embodiment, a limiting portion 19 is disposed on a wall of the clamping groove 12C and is located on the same wall as the supporting portion 18, the limiting portion 19 is disposed on a side of the clamping groove 12C near the mounting opening 11B and is adjacent to or spaced from the supporting sub-strip portion 181, the limiting portion 19 has a first height L1 compared to the wall of the clamping groove 12C, the supporting sub-strip portion 181 has a second height L2 compared to the wall of the clamping groove 12C, the first height L1 is greater than the second height L2, and a distance between the two corresponding clamping grooves 12C in the two opposite side groove plates 12 is smaller than a diameter of the wafer, so that the wafer can be limited to move along the extracting direction X after the wafer is placed in the box 11.
Referring to fig. 2 and fig. 5-7, further, after the wafer is placed in the case 11, in order to prevent the wafer from contacting with oxygen, an inert gas such as nitrogen is injected into the case 11 to replace air in the case 11, and meanwhile, a positive pressure state is also provided in the case 11, and when the cover 17 is opened, the wafer tends to move from the mounting opening 11B to the outside of the case 11, so that when the cover 17 is opened, the movement of the wafer in the direction of the mounting opening 11B can be limited by the limiting portion 19, thereby protecting the wafer from falling damage.
Referring to fig. 2 and fig. 5-8, in one embodiment, the height of the limiting portion 19 is gradually increased from the side of the mounting opening 11B to the side close to the bottom wall compared to the height of the slot wall of the clamping slot 12C, and gradually increased to the first height L1, so that the movement of the wafer can be guided when the wafer is placed, so that the wafer is placed on the supporting portion 18. And because the height of the limiting part 19 is gradually increased from one side of the mounting opening 11B to one side close to the bottom wall compared with the height of the slot wall of the clamping slot 12C, the surface of the limiting part 19, which is contacted with the wafer, is an inclined plane in the process of placing the wafer, so that the probability of damage caused by overlarge radial stress of the wafer can be reduced.
Referring to fig. 2 and fig. 5-9, in a specific embodiment, along a direction perpendicular to the inserting direction X, the limiting portion 19 has a first width L3, and the first width L3 gradually decreases from a side of the mounting opening 11B to a side close to the bottom wall, so that the size of the first width L3 of the limiting portion 19 on the side close to the mounting opening 11B is larger, and thus, when placing a wafer, the side of the limiting portion 19 close to the mounting opening 11B can contact the wafer as soon as possible, so as to provide guidance for movement of the wafer as soon as possible, so that the wafer enters the clamping groove 12C to contact the supporting portion 18.
Referring to fig. 2 and fig. 5-9, in a specific embodiment, the surface of the limiting portion 19 facing away from the bottom of the clamping groove 12C is an arc surface, so that after the wafer is placed in the case 11, the arc surface faces toward the wafer, thereby preventing the limiting portion 19 from scratching the wafer, and reducing the probability of damaging the wafer.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, this is for convenience of description and simplification of the description, but does not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely used for illustration and are not to be construed as limitations of the present application, and specific meanings of the terms described above may be understood by those of ordinary skill in the art according to specific circumstances.
The foregoing description of the preferred embodiment of the present invention is not intended to limit the invention to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (16)
1. A wafer carrier, comprising:
the box body is provided with an accommodating space, the accommodating space is provided with an installing opening and two oppositely arranged installing inner walls, and the accommodating space is also provided with a bottom wall opposite to the installing opening;
the cover body can be connected with the box body and is arranged at the mounting opening;
the two side groove plates are arranged in a split mode with the box body and are respectively arranged in one-to-one correspondence with the two mounting inner walls;
the two mounting structures are respectively connected with the corresponding side groove plates and the corresponding mounting inner walls so as to detachably connect the corresponding side groove plates to the corresponding mounting inner walls in a drawing and inserting mode.
2. The wafer carrier of claim 1, wherein each of the mounting structures comprises:
the mounting assembly is connected with the side groove plate and the mounting inner wall and is used for fixedly mounting the side groove plate on the mounting inner wall;
the positioning assembly is connected with the side groove plate and the installation inner wall and is arranged at intervals with the installation assembly and used for positioning the side groove plate when the side groove plate is inserted into the accommodating space.
3. The wafer carrier of claim 2, wherein the side channel plate has a mounting surface facing the bottom wall, the mounting assembly comprising:
The boss is arranged on one side, close to the bottom wall, of the mounting inner wall in a protruding mode, the boss is provided with a boss abutting surface deviating from the bottom wall, and the mounting surface abuts against the boss abutting surface;
the two clamping pieces are symmetrically arranged on the mounting surface and are respectively clamped on two opposite sides of the boss.
4. The wafer carrier of claim 3, wherein the mounting assembly further comprises:
the grooving pieces are arranged on one side, close to the bottom wall, of the mounting inner wall in a protruding mode, are arranged at intervals with the boss, each grooving piece is provided with a grooving surface deviating from the bottom wall, each grooving surface is abutted with the mounting surface, and each grooving piece is provided with a mounting groove;
the inserting pieces are arranged on the mounting surface and correspond to the grooving pieces one by one, and each inserting piece is inserted into the mounting groove correspondingly.
5. The wafer carrier of claim 4, wherein the boss-abutment surface further has boss-positioning holes, each of the slotted surfaces has at least one insert-positioning hole, the insert-positioning holes being spaced from the mounting slots, the positioning assembly comprising:
The first positioning column is arranged on the mounting surface and is arranged at intervals with the clamping piece, and the first positioning column penetrates through the boss positioning hole;
the second positioning columns are arranged on the mounting surface, are arranged at intervals with the plug connectors, and are plugged in the plug-in positioning holes in a one-to-one correspondence manner.
6. The wafer carrier of claim 5, wherein the mounting assembly comprises one of the bosses and two of the slotting members, the positioning assembly further comprising:
the first positioning block is arranged on one side, away from the mounting inner wall, of the first positioning block, the first positioning block is provided with a first positioning surface facing the mounting opening, a third positioning column is arranged on the first positioning surface, and the first positioning block is provided with a symmetrical axis arranged along the drawing and inserting direction;
the two second positioning blocks are arranged on the inner mounting wall, the two second positioning blocks are axially symmetrically arranged on the symmetrical axis, the two grooving pieces are arranged on one side, away from the inner mounting wall, of each second positioning block in a one-to-one correspondence manner, each second positioning block is provided with a second positioning surface facing the mounting opening, and each second positioning surface is provided with a fourth positioning column;
The first positioning piece is arranged on the surface of the side groove plate, which faces the mounting inner wall, and is abutted against the first positioning surface, the first positioning piece is provided with a third positioning hole, and the third positioning column is arranged in the third positioning hole in a penetrating manner;
the two second locating pieces are arranged on the surface of the side groove plate, which faces the mounting inner wall, and are respectively abutted to the two second locating faces, the second locating pieces are arranged at intervals with the first locating pieces, the two second locating pieces are arranged in one-to-one correspondence with the two second locating pieces, each second locating piece is provided with a fourth locating hole, and the fourth locating columns are arranged in the fourth locating holes in a penetrating mode in one-to-one correspondence.
7. The wafer carrier of claim 6, wherein the first positioning member and the second positioning member have a positioning slot therebetween, the positioning assembly further comprising:
the two positioning bosses are respectively arranged on the two second positioning surfaces, extend towards the mounting opening and respectively penetrate through the corresponding positioning grooves.
8. The wafer carrier of claim 1, wherein the side channel plate has two oppositely disposed sides extending in a withdrawal direction, the wafer carrier further comprising:
At least two guide pieces which are respectively arranged on the two side edges of the side groove plate;
and the guide strips extend along the drawing and inserting direction, at least two guide strips are arranged on each installation inner wall, and each guide piece is slidably clamped with the corresponding guide strip.
9. The wafer carrier apparatus of claim 3, further comprising:
and the locking component is connected with the side groove plate and the installation inner wall and used for limiting the movement of the side groove plate relative to the installation inner wall.
10. The wafer carrier of claim 9, wherein the locking assembly comprises:
the locking piece is connected with one side of the installation inner wall far away from the bottom wall and is arranged at intervals with the boss;
the lock body is in sliding connection with one side, far away from the mounting surface, of the side groove plate, the lock body at least has a locking state and an opening state in the process of moving relative to the side groove plate, when the lock body is in the locking state, the side groove plate is positioned between the lock block and the boss, the mounting surface is in abutting joint with the boss abutting surface, the lock body is in abutting joint with the surface, facing the side groove plate, of the lock block, and the lock body is in clamping joint with the lock block; when the lock body is in the open state, the lock body is separated from the lock block.
11. The wafer carrier of claim 10, wherein the locking assembly further comprises a support member coupled to a side of the side channel plate facing the mounting inner wall, the lock body comprising:
the lock body is connected with the supporting piece in a sliding manner;
and one end of the elastic clamping part is connected with the lock body, and the other end of the elastic clamping part is used for being clamped with the lock block.
12. The wafer carrier of claim 11, wherein the locking assembly further comprises:
the abutting block is connected with one side, far away from the bottom of the accommodating space, of the mounting inner wall and is arranged at intervals with the locking block, the lock body is provided with an avoidance groove, when the lock body is in the open state, the avoidance groove is aligned with the abutting block, and the lock body is separated from the locking block; when the lock body is in a locking state, one side of the lock body, which is far away from the lock block, is abutted with the abutting block.
13. The wafer carrier of any one of claims 1-12, wherein the housing is a transparent housing, each side pocket plate having a plurality of slots for receiving wafers, the slots being disposed through the side pocket plate, a surface of the side pocket plate facing the mounting wall having a number.
14. The wafer carrier as claimed in claim 13, wherein a wall of the clamping groove is provided with a supporting portion, the supporting portion includes a supporting sub-strip portion and a supporting sub-face portion, the supporting sub-strip portion is closer to the mounting opening than the supporting sub-face portion, the supporting sub-face portion is closer to the bottom wall than the supporting sub-strip portion, a side of the supporting sub-strip portion away from the wall of the clamping groove is located in a same plane as a side of the supporting sub-face portion away from the wall of the clamping groove, and is used for abutting against a side face of the wafer after the wafer is placed in the clamping groove, so as to support the wafer.
15. The wafer carrier as claimed in claim 14, wherein a limiting portion is disposed on a wall of the clamping groove and is located on the same wall as the supporting portion, the limiting portion is disposed on a side of the clamping groove, which is close to the mounting opening, and is disposed adjacent to or spaced from the supporting sub-strip portion, the limiting portion has a first height compared to the wall of the clamping groove, the supporting sub-strip portion has a second height compared to the wall of the clamping groove, the first height is greater than the second height, and a distance between two corresponding clamping grooves in two opposite side groove plates is smaller than a diameter of the wafer.
16. The wafer carrier of claim 15, wherein the height of the limiting portion increases gradually from the side of the mounting opening to the side near the bottom wall and gradually increases to the first height along the insertion direction; and/or
The limiting part is provided with a first width along the direction perpendicular to the drawing and inserting direction, and the first width gradually decreases from one side of the mounting opening to one side close to the bottom wall; and/or
The surface of the limiting part, which is away from the bottom of the clamping groove, is a cambered surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310498535.5A CN116564867B (en) | 2023-05-05 | 2023-05-05 | Wafer bearing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310498535.5A CN116564867B (en) | 2023-05-05 | 2023-05-05 | Wafer bearing device |
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| CN116564867A true CN116564867A (en) | 2023-08-08 |
| CN116564867B CN116564867B (en) | 2024-02-20 |
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| WO2014103808A1 (en) * | 2012-12-24 | 2014-07-03 | 淀川ヒューテック株式会社 | Box for accommodating plate body |
| US20170263479A1 (en) * | 2014-09-05 | 2017-09-14 | SCREEN Holdings Co., Ltd. | Substrate container, load port apparatus, and substrate treating apparatus |
| CN206259327U (en) * | 2016-02-23 | 2017-06-16 | 中勤实业股份有限公司 | Container for receiving substrate |
| CN113707587A (en) * | 2021-05-07 | 2021-11-26 | 上海大族富创得科技有限公司 | Edge searching device and edge searching method for wafer |
| CN114914181A (en) * | 2022-06-30 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor process equipment |
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| CN116564867B (en) | 2024-02-20 |
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