CN116562202B - Filtering component analysis method and device - Google Patents
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Abstract
The application provides a filter component analysis method and a device, wherein the method comprises the following steps: acquiring a three-dimensional model, excitation source data, a power switch tube model, a direct-current support capacitor and an S parameter model of an X/Y capacitor of a filter assembly; adding an X/Y capacitor, a direct current support capacitor and a port of a power switch tube into the three-dimensional model to obtain a target three-dimensional model; building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct-current support capacitor and the S parameter model; respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source; judging whether the target simulation parameters meet preset requirements or not; if yes, outputting a one-dimensional simulation circuit, a three-dimensional model and simulation parameters. Therefore, the method and the device can simultaneously consider the analysis of electromagnetic compatibility, thermal performance and safety performance, and have wide application range and comprehensive analysis, thereby realizing the accurate analysis and optimization of the performance of the filter assembly.
Description
Technical Field
The application relates to the technical field of power electronic equipment, in particular to a filter component analysis method and device.
Background
The filter component is an important component in the power electronic equipment, is indispensable to a power supply and an inverter in particular, namely, the switch noise is limited in the equipment as much as possible, other equipment which is connected to a power grid or operates at the periphery together is not influenced by a conduction or radiation way, and the noise from the power grid or the periphery is prevented from influencing the normal operation of the equipment. In the existing method, simulation analysis of only a single target can be carried out aiming at a filter component, and simulation analysis of electromagnetic compatibility, thermal performance, safety performance and other performances cannot be simultaneously considered. Therefore, the existing filter component analysis method is incomplete and has a small application range, so that the performance of the filter component cannot be accurately analyzed and optimized.
Disclosure of Invention
The embodiment of the application aims to provide a filter component analysis method and device, which can simultaneously analyze electromagnetic compatibility, thermal performance and safety performance, and has wide application range and comprehensive analysis, so that the performance of a filter component can be accurately analyzed and optimized.
The first aspect of the present application provides a filter component analysis method, including:
acquiring a three-dimensional model, excitation source data, a power switch tube model, a direct-current support capacitor and an S parameter model of an X/Y capacitor of a filter assembly;
Adding a port of an X/Y capacitor, a port of a direct current support capacitor and a port of a power switch tube into the three-dimensional model to obtain a target three-dimensional model;
building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor;
respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source; the target simulation parameters comprise simulation parameters of a one-dimensional simulation circuit and simulation parameters of a three-dimensional model, the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
judging whether the target simulation parameters meet preset requirements or not;
and if so, outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters.
In the implementation process, the method can preferentially acquire the three-dimensional model, excitation source data, power switch tube model, direct-current support capacitor and S parameter model of X/Y capacitor of the filter assembly; adding a port of the X/Y capacitor, a port of the direct current support capacitor and a port of the power switch tube into the three-dimensional model to obtain a target three-dimensional model; then, building a one-dimensional simulation circuit according to the target three-dimensional model, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor; then, respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the direct current/alternating current excitation source; finally, judging whether the target simulation parameters meet the preset requirements or not; and outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters when the simulation parameters meet the preset requirements. Therefore, the method can simultaneously analyze electromagnetic compatibility, thermal performance and safety performance, has wide application range and comprehensive analysis, and can accurately analyze and optimize the performance of the filter assembly.
Further, the building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor comprises the following steps:
solving an S parameter model of the target three-dimensional model;
and building a one-dimensional simulation circuit according to the S parameter model of the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor.
Further, the method further comprises:
when the target simulation parameters are judged to not meet the preset requirements, respectively optimizing the one-dimensional simulation circuit and the three-dimensional model through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model, and executing the S parameter model according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the X/Y capacitor to build a one-dimensional simulation circuit.
Further, the optimizing the one-dimensional simulation circuit and the three-dimensional model through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model respectively comprises the following steps:
Determining a first target to be optimized and a second target to be optimized according to the target simulation parameters;
acquiring a first optimization range of the first target to be optimized and a first target weight of the first target to be optimized; acquiring a second optimization range of the second target to be optimized and a second target weight of the second target to be optimized;
adding the first target to be optimized, the first optimization range and the first target weight into the one-dimensional simulation circuit to obtain a target one-dimensional simulation circuit; adding the second target to be optimized, the second optimization range and the second target weight into the three-dimensional model to obtain a three-dimensional model to be processed;
and respectively carrying out optimization iteration on the target one-dimensional simulation circuit and the three-dimensional model to be processed through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model.
Further, the respectively solving the target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the direct current/alternating current excitation source comprises the following steps:
calculating simulation parameters of the one-dimensional simulation circuit when the switching tube is turned on/off according to the one-dimensional simulation circuit; the simulation parameters of the one-dimensional simulation circuit comprise a current-voltage time domain waveform and an insertion loss spectrum curve;
Determining a solution variable of the target three-dimensional model;
setting the solving variable as a preset value to obtain a three-dimensional model to be simulated;
after direct current/alternating current excitation is added into the three-dimensional model to be simulated, simulation parameters of the three-dimensional model are obtained; the simulation parameters of the three-dimensional model comprise a temperature rise time domain curve and a frequency distribution diagram of the insulation field intensity;
summarizing simulation parameters of the one-dimensional simulation circuit and simulation parameters of the three-dimensional model to obtain target simulation parameters.
Further, the determining whether the target simulation parameter meets a preset requirement includes:
judging whether the waveform peak of the current-voltage time domain waveform meets the preset waveform peak requirement or not;
if the waveform peak requirement is met, judging whether the corresponding frequency band suppression in the insertion loss spectrum curve meets the preset frequency band suppression requirement or not;
if the frequency band suppression requirement is met, judging whether the temperature of the temperature rise time domain curve exceeds a preset temperature range within a preset operation time range;
if the temperature range does not exceed the preset temperature range, judging whether the insulation field intensity of the insulation materials in the laminated busbar exceeds a preset material acceptable range according to the frequency distribution diagram of the insulation field intensity;
And if the acceptable range of the material is not exceeded, determining that the target simulation parameters meet preset requirements.
A second aspect of the present application provides a filter component analysis apparatus comprising:
the acquisition unit is used for acquiring a three-dimensional model of the filter component, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor;
the port adding unit is used for adding a port of the X/Y capacitor, a port of the direct current support capacitor and a port of the power switch tube into the three-dimensional model to obtain a target three-dimensional model;
the building unit is used for building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor;
the solving unit is used for respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source; the target simulation parameters comprise simulation parameters of a one-dimensional simulation circuit and simulation parameters of a three-dimensional model, the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
The judging unit is used for judging whether the target simulation parameters meet preset requirements or not;
and the output unit is used for outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters when judging that the target simulation parameters meet the preset requirements.
In the implementation process, the device can acquire the three-dimensional model, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor of the filter assembly through an acquisition unit; adding a port of the X/Y capacitor, a port of the direct current support capacitor and a port of the power switch tube into the three-dimensional model through a port adding unit to obtain a target three-dimensional model; building a one-dimensional simulation circuit according to the target three-dimensional model, excitation source data, a power switch tube model, a direct-current support capacitor and an S parameter model of an X/Y capacitor by a building unit; respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source through a solving unit; judging whether the target simulation parameters meet preset requirements or not through a judging unit; and then when the simulation parameters are judged to meet the preset requirements through the output unit, outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters. Therefore, the device can simultaneously analyze electromagnetic compatibility, thermal performance and safety performance, has wide application range and comprehensive analysis, and can accurately analyze and optimize the performance of the filter assembly.
Further, the construction unit comprises:
the first solving subunit is used for solving an S parameter model of the target three-dimensional model;
and the building subunit is used for building a one-dimensional simulation circuit according to the S parameter model of the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor.
Further, the filtering component analysis apparatus further includes:
and the optimizing unit is used for respectively optimizing the one-dimensional simulation circuit and the three-dimensional model through a preset random optimizing algorithm and a preset local optimizing algorithm when the target simulation parameter does not meet the preset requirement, obtaining an optimized one-dimensional simulation circuit and an optimized three-dimensional model, triggering the constructing unit to execute the S parameter model according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the X/Y capacitor, and constructing the operation of the one-dimensional simulation circuit.
Further, the optimizing unit includes:
the first determining subunit is used for determining a first target to be optimized and a second target to be optimized according to the target simulation parameters;
The first acquisition subunit is used for acquiring a first optimization range of the first target to be optimized and a first target weight of the first target to be optimized; acquiring a second optimization range of the second target to be optimized and a second target weight of the second target to be optimized;
the adding subunit is used for adding the first target to be optimized, the first optimization range and the first target weight in the one-dimensional simulation circuit to obtain a target one-dimensional simulation circuit; adding the second target to be optimized, the second optimization range and the second target weight into the three-dimensional model to obtain a three-dimensional model to be processed;
and the optimizing subunit is used for respectively carrying out optimization iteration on the target one-dimensional simulation circuit and the three-dimensional model to be processed through a preset random optimizing algorithm and a preset local optimizing algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model.
Further, the solving unit includes:
the second solving subunit is used for calculating simulation parameters of the one-dimensional simulation circuit when the switching tube is turned on/off according to the one-dimensional simulation circuit; the simulation parameters of the one-dimensional simulation circuit comprise a current-voltage time domain waveform and an insertion loss spectrum curve;
A second determining subunit, configured to determine a solution variable of the target three-dimensional model;
the setting subunit is used for setting the solving variable to be a preset value to obtain a three-dimensional model to be simulated;
the second acquisition subunit is used for acquiring simulation parameters of the three-dimensional model after direct current/alternating current excitation is added in the three-dimensional model to be simulated; the simulation parameters of the three-dimensional model comprise a temperature rise time domain curve and a frequency distribution diagram of the insulation field intensity;
and the summarizing subunit is used for summarizing the simulation parameters of the one-dimensional simulation circuit and the simulation parameters of the three-dimensional model to obtain target simulation parameters.
Further, the judging unit includes:
the judging subunit is used for judging whether the waveform peak of the current-voltage time domain waveform meets the preset waveform peak requirement or not;
the judging subunit is further configured to judge whether corresponding frequency band suppression in the insertion loss spectrum curve meets a preset frequency band suppression requirement when the waveform peak requirement is met;
the judging subunit is further configured to judge whether the temperature of the temperature rise time domain curve in a preset operation time range exceeds a preset temperature range when the frequency band suppression requirement is met;
The judging subunit is further configured to judge, according to the frequency distribution diagram of the insulation field intensity, whether the insulation field intensity of the insulation material in the laminated busbar exceeds a preset material acceptable range when the preset temperature range is not exceeded;
and the third determination subunit is used for determining that the target simulation parameters meet preset requirements when the acceptable range of the material is not exceeded.
A third aspect of the present application provides an electronic device comprising a memory for storing a computer program and a processor for running the computer program to cause the electronic device to perform the filter component analysis method of any one of the first aspects of the present application.
A fourth aspect of the application provides a computer readable storage medium storing computer program instructions which, when read and executed by a processor, perform the filter component analysis method of any one of the first aspects of the application.
The beneficial effects of the application are as follows: the method and the device can simultaneously analyze electromagnetic compatibility, thermal performance and safety performance, and have wide application range and comprehensive analysis, so that the performance of the filter assembly can be accurately analyzed and optimized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a method for analyzing a filtering component according to an embodiment of the present application;
FIG. 2 is a flow chart of another method for analyzing a filtering component according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a filtering component analysis device according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of another filtering component analysis device according to an embodiment of the present application;
fig. 5 is a schematic flow chart of an exemplary filter component analysis method according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
Example 1
Referring to fig. 1, fig. 1 is a flow chart of a filter component analysis method according to the present embodiment. The filter component analysis method comprises the following steps:
s101, acquiring a three-dimensional model, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of an X/Y capacitor of the filter assembly.
In this embodiment, the excitation source is a dc/ac excitation source.
S102, adding a port of an X/Y capacitor, a port of a direct current support capacitor and a port of a power switch tube into the three-dimensional model to obtain a target three-dimensional model.
And S103, building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct-current support capacitor and the S parameter model of the X/Y capacitor.
S104, respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the direct current/alternating current excitation source.
In this embodiment, the target simulation parameters include simulation parameters of a one-dimensional simulation circuit and simulation parameters of a three-dimensional model, the simulation parameters of the one-dimensional simulation circuit include a current-voltage time domain waveform and an insertion loss spectrum curve, and the simulation parameters of the three-dimensional model include a temperature rise time domain curve and a frequency distribution diagram of an insulation field intensity.
S105, judging whether the target simulation parameters meet the preset requirements, if so, executing a step S106; if not, the process is ended.
In this embodiment, the method may acquire simulation parameters of a plurality of optimization targets, and determine whether the target requirements are satisfied. Specifically, the method can judge whether the target requirement is met according to the current and voltage time domain waveform, the insertion loss frequency spectrum curve, the temperature rise time domain curve and the frequency distribution diagram of the insulation field intensity.
S106, outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters.
In this embodiment, the insertion loss is usually solved according to the standard port impedance for the filter component, which has a limited application range. According to the method, a one-dimensional simulation circuit is built by using a voltage excitation source and a nonlinear model of a switching tube or a port impedance model of the switching tube, so that the actual working state of the equivalent switching circuit is better, and different IGBT or SIC devices are flexibly replaced by introducing the nonlinear models of different switching tubes, so that filter assemblies which are better adapted to switching tubes of different manufacturers, different batches and different materials are obtained.
Meanwhile, aiming at the defects that the filter component can only be designed and optimized in a single target and cannot be considered in terms of electromagnetic compatibility, thermal performance, safety performance and the like. According to the method, through one-dimensional simulation circuit and three-dimensional electromagnetic thermal field analysis, multiple targets such as insertion loss, voltage/current time domain waveform of on/off of a switching tube, temperature rise distribution, insulation field intensity and the like and weights thereof are set and optimized and iterated, so that a filter assembly meeting electromagnetic compatibility and safety performance requirements can be obtained at one time in a forward design stage, and the filter assembly with the optimal performance can be obtained through progressive optimization of a mature random optimization algorithm and a local optimization algorithm.
In this embodiment, the execution subject of the method may be a computing device such as a computer or a server, which is not limited in this embodiment.
In this embodiment, the execution body of the method may be an intelligent device such as a smart phone or a tablet computer, which is not limited in this embodiment.
Therefore, by implementing the filter component analysis method described in the embodiment, the filter component meeting the requirements of electromagnetic compatibility and safety performance can be obtained at one time in the forward design stage by using the multi-physical field and multi-disciplinary analysis and optimization method, and the filter component analysis method has good completeness. Based on a mature optimization algorithm, the method can adopt a random optimization algorithm to obtain a global optimal solution, further adopts a local optimization algorithm such as gradient/quasi-Newton and the like to obtain the global optimal solution, and can also carry out optimization and iteration on the topological structure of the filter component according to a self-defined optimization algorithm. In addition, the method can fully utilize the advantages of the laminated busbar, so that the local distribution parameters of the busbar are relatively concentrated, a reasonable filtering path is provided for electromagnetic compatibility, the structure is compact, the reflux path is symmetrical, and the differential mode/common mode interconversion is minimized. In addition, the method is also suitable for evaluating and optimizing the filter performance and the safety performance of the filter in the radio frequency microwave equipment, and the evaluation and optimization of the filter performance in the radio frequency microwave equipment can be carried out according to the method provided by the method by only changing the AC/DC excitation and IGBT port impedance model into a 50 ohm standard impedance port and changing the magnetic ring inductance into the S parameter model of the air core inductance for the radio frequency microwave equipment. Therefore, the method has wider application range and more comprehensive analysis capability. In conclusion, the method can be applied to forward designs of a plurality of self-research projects, can effectively ensure the safety performance and electromagnetic compatibility of the filter component, and has strong practicability.
Example 2
Referring to fig. 2, fig. 2 is a flow chart of a filter component analysis method according to the present embodiment. The filter component analysis method comprises the following steps:
s201, acquiring a three-dimensional model of the filter assembly, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor.
In this embodiment, the method may specifically introduce a three-dimensional model of the filter assembly, where geometric parameters and material parameters of the magnetic ring and the busbar are set as variables.
In this embodiment, the method may introduce a three-dimensional model of the filter assembly, and set the length, width, outer diameter, inner diameter of the magnetic ring, width and thickness of the positive and negative bus bars, magnetic permeability of the magnetic ring, dielectric constant of the insulating paper, and the like as variables.
S202, adding a port of an X/Y capacitor, a port of a direct current support capacitor and a port of a power switch tube into the three-dimensional model to obtain a target three-dimensional model.
In the embodiment, the method can add ports in the positions of the X/Y capacitor, the direct current support capacitor and the power switch tube in the three-dimensional model of the filter component.
In this embodiment, the method may add lumped ports to the X/Y capacitance, dc support capacitance, and power switch tube locations in the three-dimensional model of the filter assembly.
S203, solving an S parameter model of the target three-dimensional model.
S204, building a one-dimensional simulation circuit according to an S parameter model of the target three-dimensional model, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor.
In the embodiment, the method can build a one-dimensional simulation circuit.
In the embodiment, the method can solve the S parameter of the three-dimensional model of the filter assembly, build a one-dimensional simulation circuit with the S parameter model of the direct current/alternating current excitation source, the power switch tube model and the X/Y capacitor, and set the scanning frequency range DC-200MHz.
S205, calculating simulation parameters of the one-dimensional simulation circuit when the switching tube is turned on/off according to the one-dimensional simulation circuit.
In this embodiment, the simulation parameters of the one-dimensional simulation circuit include a current-voltage time domain waveform and an insertion loss spectrum curve.
S206, determining a solving variable of the target three-dimensional model.
S207, setting a solving variable as a preset value to obtain the three-dimensional model to be simulated.
S208, after direct current/alternating current excitation is added into the three-dimensional model to be simulated, simulation parameters of the three-dimensional model are obtained.
In this embodiment, the simulation parameters of the three-dimensional model include a temperature rise time domain curve and a frequency distribution diagram of the insulation field intensity.
In this embodiment, the method may also solve for the three-dimensional field distribution under unit excitation. Specifically, the method sets the parameters of the device and the busbar as preselected values, and solves the three-dimensional field distribution such as surface current density distribution, near electric field and the like, which is usually 1V or 1W, of the three-dimensional model to be simulated under unit excitation.
S209, summarizing simulation parameters of the one-dimensional simulation circuit and simulation parameters of the three-dimensional model to obtain target simulation parameters.
S210, judging whether the waveform peak of the current-voltage time domain waveform meets the preset waveform peak requirement, if so, executing step S211; if not, step S215 is performed.
S211, judging whether the corresponding frequency band inhibition in the insertion loss frequency spectrum curve meets the preset frequency band inhibition requirement, if so, executing a step S212; if not, step S215 is performed.
S212, judging whether the temperature of the temperature rise time domain curve exceeds a preset temperature range within a preset operation time range, if so, executing a step S215; if not, step S213 is performed.
S213, judging whether the insulation field intensity of the insulation materials in the laminated busbar exceeds a preset material acceptable range according to the frequency distribution diagram of the insulation field intensity, if so, executing a step S215; if not, step S214 is performed.
S214, determining that the target simulation parameters meet the preset requirements, and executing step S219.
S215, determining a first target to be optimized and a second target to be optimized according to the target simulation parameters.
S216, acquiring a first optimization range of a first target to be optimized and a first target weight of the first target to be optimized; and acquiring a second optimization range of the second target to be optimized and a second target weight of the second target to be optimized.
S217, adding a first target to be optimized, a first optimization range and first target weight into the one-dimensional simulation circuit to obtain a target one-dimensional simulation circuit; and adding a second target to be optimized, a second optimization range and a second target weight into the three-dimensional model to obtain the three-dimensional model to be processed.
In this embodiment, the method may add multiple optimization targets and weights to the one-dimensional simulation circuit when the requirements are not satisfied. Specifically, the method can add each optimization target and range in the one-dimensional simulation circuit, and set weight for each optimization target.
And S218, respectively carrying out optimization iteration on the target one-dimensional simulation circuit and the three-dimensional model to be processed through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model, and executing step S203.
In this embodiment, the method may utilize a random optimization algorithm to perform optimization and iteration, so that the simulation result approaches or meets the optimization objective, and updates each parameter. Specifically, the method can set a random optimization algorithm to enable the simulation result to approach or meet the optimization target, and update parameters of each busbar, each magnetic ring and each capacitor.
In this embodiment, the method may perform optimization and iteration by using a local optimization algorithm, so that all optimization targets meet the requirements, and update each parameter. Specifically, the method can set a local optimization algorithm, so that the simulation result meets the optimization target and achieves the optimal, and the parameters of each busbar, each magnetic ring and each capacitor are updated.
S219, outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters.
Referring to fig. 5, fig. 5 is a schematic flow chart of an exemplary filter component analysis method according to an embodiment of the application. The three-dimensional solid model of the filtering component is imported, and is usually obtained in the earlier stage of forward development of the equipment. The three-dimensional solid model comprises a direct current busbar, a magnetic ring, a switch tube package, a shell and the like. At this time, the length, width, outer diameter, inner diameter of the magnetic ring, width and thickness of the positive and negative busbar, magnetic ring permeability, dielectric constant of insulating paper and the like are set as variables and adjustable ranges are added, the parameters can be set as absolute variables, and related variables relative to another variable, such as the inner diameter of the magnetic ring can be set as one related variable of busbar thickness. Meanwhile, in order to ensure the feasibility of processing, the corresponding variable value of the geometric dimension parameter of the filter assembly should be discrete, and not continuous any more. Lumped ports are added at the positions of the X/Y capacitor, the direct-current supporting capacitor and the power switch tube in the three-dimensional model of the filter component.
Then, S parameters of the three-dimensional model of the filter assembly are solved, and a scanning frequency range DC-200MHz is set. The filtering assembly S parameter model and the S parameter models of the direct current/alternating current excitation source, the power switch tube model and the X/Y capacitor build a one-dimensional simulation circuit. The alternating current excitation source is used for obtaining the insertion loss of the filter component, and the direct current excitation source is used for obtaining a time domain curve of the voltage/current in the on/off process of the power switch tube; the power switch tube model can be a port impedance model or a nonlinear model, and the X/Y capacitance S parameter model is provided by a device manufacturer and can be obtained by testing impedance parameters. According to parameters of the device and the busbar, setting the parameters as preselected values, solving three-dimensional field distribution such as surface current density distribution, near electric field and the like under unit excitation, and adding a direct current/alternating current excitation source to obtain temperature rise and insulation field intensity of the three-dimensional solid model of the filter assembly, and positions of the maximum value and the maximum value of the temperature rise and insulation field intensity.
In this embodiment, the frequency distribution patterns of the current and voltage time domain waveforms, the insertion loss spectrum curve, the temperature rise time domain curve, and the insulation field intensity are targeted as follows:
judging whether the peak of the current/voltage time domain waveform meets the requirement or not;
Judging whether the corresponding frequency band inhibition in the insertion loss curve meets the requirement or not;
judging whether the temperature of the temperature rise curve exceeds a preset range in the operation time range;
and judging whether the insulation field intensity of the insulation materials in the laminated busbar exceeds the acceptable range of the materials.
In this embodiment, if the requirements are not satisfied, each of the optimization targets and the allowable ranges mentioned above are added to the one-dimensional simulation circuit, and weights are set for each optimization target, and the weights of the temperature rise and the insertion loss are generally high. Setting a random optimization algorithm to enable the simulation result to approach or meet the optimization target, and updating parameters of each busbar, each magnetic ring and each capacitor. And further setting a local optimization algorithm to ensure that the simulation result meets the optimization target and achieves the optimal, and updating parameters of each busbar, each magnetic ring and each capacitor, wherein the local optimization algorithm comprises a gradient optimization algorithm, a quasi-Newton optimization algorithm and other algorithms. Whether or not the optimization target is satisfied by the random optimization algorithm, the optimization of the local optimization algorithm is necessary. When the random optimization algorithm meets the optimization target, the optimization target can be properly tightened and then the local optimization algorithm is performed, so that an optimization result is obtained as an optimal solution. When the local optimization algorithm cannot meet the optimization target requirement, the optimization target can be properly relaxed, or the topology structure of the filter assembly is optimized according to the self-defined optimization algorithm, and then iteration and optimization of the random and local optimization algorithm are carried out.
In this embodiment, after each target requirement is satisfied, the result is output.
In this embodiment, the execution subject of the method may be a computing device such as a computer or a server, which is not limited in this embodiment.
In this embodiment, the execution body of the method may be an intelligent device such as a smart phone or a tablet computer, which is not limited in this embodiment.
Therefore, by implementing the filter component analysis method described in the embodiment, the filter component meeting the requirements of electromagnetic compatibility and safety performance can be obtained at one time in the forward design stage by using the multi-physical field and multi-disciplinary analysis and optimization method, and the filter component analysis method has good completeness. Based on a mature optimization algorithm, the method can adopt a random optimization algorithm to obtain a global optimal solution, further adopts a local optimization algorithm such as gradient/quasi-Newton and the like to obtain the global optimal solution, and can also carry out optimization and iteration on the topological structure of the filter component according to a self-defined optimization algorithm. In addition, the method can fully utilize the advantages of the laminated busbar, so that the local distribution parameters of the busbar are relatively concentrated, a reasonable filtering path is provided for electromagnetic compatibility, the structure is compact, the reflux path is symmetrical, and the differential mode/common mode interconversion is minimized. In addition, the method is also suitable for evaluating and optimizing the filter performance and the safety performance of the filter in the radio frequency microwave equipment, and the evaluation and the optimization of the filter performance in the radio frequency microwave equipment can be carried out according to the method provided by the method only by replacing the AC/DC excitation and IGBT port impedance model with a radio frequency power source and a 50 ohm standard impedance port and replacing the magnetic ring inductance with an S parameter model of the air core inductance for the radio frequency microwave equipment. Therefore, the method has wider application range and more comprehensive analysis capability. In conclusion, the method can be applied to forward designs of a plurality of self-research projects, can effectively ensure the safety performance and electromagnetic compatibility of the filter component, and has strong practicability.
Example 3
Referring to fig. 3, fig. 3 is a schematic structural diagram of a filtering component analysis device according to the present embodiment. As shown in fig. 3, the filter component analysis apparatus includes:
an acquisition unit 310, configured to acquire a three-dimensional model of the filter component, excitation source data, a power switching tube model, an S-parameter model of the dc support capacitor and the X/Y capacitor;
the port adding unit 320 is configured to add a port of the X/Y capacitor, a port of the dc support capacitor, and a port of the power switch tube to the three-dimensional model, so as to obtain a target three-dimensional model;
the building unit 330 is configured to build a one-dimensional simulation circuit according to the target three-dimensional model, excitation source data, a power switch tube model, an S-parameter model of the direct current support capacitor and the X/Y capacitor;
the solving unit 340 is configured to solve target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the dc/ac excitation source respectively; the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
A judging unit 350, configured to judge whether the target simulation parameter meets a preset requirement;
and an output unit 360, configured to output the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameter when it is determined that the target simulation parameter meets the preset requirement.
In this embodiment, the explanation of the filter component analysis device may refer to the description in embodiment 1 or embodiment 2, and the description is not repeated in this embodiment.
Therefore, the filter component analysis device described in the embodiment can utilize the multi-physical field and multi-disciplinary analysis and optimization device, so that the filter component meeting the requirements of electromagnetic compatibility and safety performance can be obtained at one time in the forward design stage, and the filter component analysis device has good completeness. Based on a mature optimization algorithm, the device can acquire a global optimal solution by adopting a random optimization algorithm, further acquire the global optimal solution by adopting a local optimization algorithm such as gradient/quasi-Newton and the like, and can perform optimization and iteration on the topological structure of the filter component according to a self-defined optimization algorithm. In addition, the device can fully utilize the advantages of the laminated busbar, so that the local distribution parameters of the busbar are relatively concentrated, a reasonable filtering path is provided for electromagnetic compatibility, the structure is compact, the reflux path is symmetrical, and the differential mode/common mode interconversion is minimized. In addition, the device is also suitable for evaluating and optimizing the filter performance and the safety performance of the filter in the radio frequency microwave equipment, and the evaluation and the optimization of the filter performance in the radio frequency microwave equipment can be carried out according to the device provided by the device by only changing the AC/DC excitation and IGBT port impedance model into a radio frequency power source and a 50 ohm standard impedance port and changing the magnetic ring inductance into an S parameter model of the air core inductance for the radio frequency microwave equipment. Therefore, the device has wider application range and more comprehensive analysis capability. In conclusion, the device can be applied to forward designs of a plurality of self-research projects, can effectively ensure the safety performance and electromagnetic compatibility of the filter component, and has strong practicability.
Example 4
Referring to fig. 4, fig. 4 is a schematic structural diagram of a filtering component analysis device according to the present embodiment. As shown in fig. 4, the filter component analysis apparatus includes:
an acquisition unit 310, configured to acquire a three-dimensional model of the filter component, excitation source data, a power switching tube model, an S-parameter model of the dc support capacitor and the X/Y capacitor;
the port adding unit 320 is configured to add a port of the X/Y capacitor, a port of the dc support capacitor, and a port of the power switch tube to the three-dimensional model, so as to obtain a target three-dimensional model;
the building unit 330 is configured to build a one-dimensional simulation circuit according to the target three-dimensional model, excitation source data, a power switch tube model, an S-parameter model of the direct current support capacitor and the X/Y capacitor;
the solving unit 340 is configured to solve target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the dc/ac excitation source respectively; the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
A judging unit 350, configured to judge whether the target simulation parameter meets a preset requirement;
and an output unit 360, configured to output the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameter when it is determined that the target simulation parameter meets the preset requirement.
As an alternative embodiment, the construction unit 330 comprises:
the first solving subunit 331 is configured to solve an S-parameter model of the target three-dimensional model;
the building subunit 332 is configured to build a one-dimensional simulation circuit according to an S parameter model of the target three-dimensional model, excitation source data, a power switch tube model, a dc support capacitor, and an S parameter model of the X/Y capacitor.
As an alternative embodiment, the filtering component analysis apparatus further includes:
and the optimizing unit 370 is configured to optimize the one-dimensional simulation circuit and the three-dimensional model through a preset random optimizing algorithm and a preset local optimizing algorithm when it is determined that the target simulation parameter does not meet the preset requirement, obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model, and trigger the setting up unit 330 to execute an S parameter model according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the X/Y capacitor, so as to set up the operation of the one-dimensional simulation circuit.
As an alternative embodiment, the optimizing unit 370 includes:
a first determining subunit 371, configured to determine a first target to be optimized and a second target to be optimized according to the target simulation parameters;
a first obtaining subunit 372, configured to obtain a first optimization range of a first target to be optimized and a first target weight of the first target to be optimized; obtaining a second optimization range of a second target to be optimized and a second target weight of the second target to be optimized;
an adding subunit 373, configured to add a first target to be optimized, a first optimization range, and a first target weight to the one-dimensional simulation circuit, so as to obtain a target one-dimensional simulation circuit; adding a second target to be optimized, a second optimization range and a second target weight into the three-dimensional model to obtain a three-dimensional model to be processed;
and the optimization subunit 374 is configured to perform optimization iteration on the target one-dimensional simulation circuit and the three-dimensional model to be processed through a preset random optimization algorithm and a preset local optimization algorithm, so as to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model.
As an alternative embodiment, the solving unit 340 includes:
a second solving subunit 341, configured to calculate simulation parameters of the one-dimensional simulation circuit when the switching tube is turned on/off according to the one-dimensional simulation circuit; the simulation parameters of the one-dimensional simulation circuit comprise a current-voltage time domain waveform and an insertion loss spectrum curve;
A second determining subunit 342, configured to determine a solution variable of the target three-dimensional model;
a setting subunit 343, configured to set a solution variable to a preset value, so as to obtain a three-dimensional model to be simulated;
a second obtaining subunit 344, configured to obtain simulation parameters of the three-dimensional model after adding dc/ac excitation to the three-dimensional model to be simulated; the simulation parameters of the three-dimensional model comprise a temperature rise time domain curve and a frequency distribution diagram of the insulation field intensity;
and the summarizing subunit 345 is configured to summarize the simulation parameters of the one-dimensional simulation circuit and the simulation parameters of the three-dimensional model, so as to obtain the target simulation parameters.
As an alternative embodiment, the judging unit 350 includes:
a judging subunit 351, configured to judge whether a waveform peak of the current-voltage time domain waveform meets a preset waveform peak requirement;
the judging subunit 351 is further configured to judge whether the corresponding frequency band suppression in the insertion loss spectrum curve meets a preset frequency band suppression requirement when the waveform peak requirement is met;
the judging subunit 351 is further configured to judge whether the temperature of the temperature rise time domain curve in a preset operation time range exceeds a preset temperature range when the frequency band suppression requirement is met;
the judging subunit 351 is further configured to judge, according to the frequency distribution diagram of the insulation field strength, whether the insulation field strength of the insulation material in the laminated busbar exceeds a preset material acceptable range when the preset temperature range is not exceeded;
And a third determining subunit 352, configured to determine that the target simulation parameter meets the preset requirement when the material acceptable range is not exceeded.
In this embodiment, the explanation of the filter component analysis device may refer to the description in embodiment 1 or embodiment 2, and the description is not repeated in this embodiment.
Therefore, the filter component analysis device described in the embodiment can utilize the multi-physical field and multi-disciplinary analysis and optimization device, so that the filter component meeting the requirements of electromagnetic compatibility and safety performance can be obtained at one time in the forward design stage, and the filter component analysis device has good completeness. Based on a mature optimization algorithm, the device can acquire a global optimal solution by adopting a random optimization algorithm, further acquire the global optimal solution by adopting a local optimization algorithm such as gradient/quasi-Newton and the like, and can perform optimization and iteration on the topological structure of the filter component according to a self-defined optimization algorithm. In addition, the device can fully utilize the advantages of the laminated busbar, so that the local distribution parameters of the busbar are relatively concentrated, a reasonable filtering path is provided for electromagnetic compatibility, the structure is compact, the reflux path is symmetrical, and the differential mode/common mode interconversion is minimized. In addition, the device is also suitable for evaluating and optimizing the filter performance and the safety performance of the filter in the radio frequency microwave equipment, and the evaluation and the optimization of the filter performance in the radio frequency microwave equipment can be carried out according to the device provided by the device by only changing the AC/DC excitation and IGBT port impedance model into a radio frequency power source and a 50 ohm standard impedance port and changing the magnetic ring inductance into an S parameter model of the air core inductance for the radio frequency microwave equipment. Therefore, the device has wider application range and more comprehensive analysis capability. In conclusion, the device can be applied to forward designs of a plurality of self-research projects, can effectively ensure the safety performance and electromagnetic compatibility of the filter component, and has strong practicability.
An embodiment of the present application provides an electronic device, including a memory and a processor, where the memory is configured to store a computer program, and the processor is configured to execute the computer program to cause the electronic device to execute a filter component analysis method in embodiment 1 or embodiment 2 of the present application.
Embodiments of the present application provide a computer readable storage medium storing computer program instructions that, when read and executed by a processor, perform the filter component analysis method of embodiment 1 or embodiment 2 of the present application.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The apparatus embodiments described above are merely illustrative, for example, of the flowcharts and block diagrams in the figures that illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, functional modules in the embodiments of the present application may be integrated together to form a single part, or each module may exist alone, or two or more modules may be integrated to form a single part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A method of filter component analysis, comprising:
acquiring a three-dimensional model, excitation source data, a power switch tube model, a direct-current support capacitor and an S parameter model of an X/Y capacitor of a filter assembly;
adding a port of an X/Y capacitor, a port of a direct current support capacitor and a port of a power switch tube into the three-dimensional model to obtain a target three-dimensional model;
building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor;
respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source; the target simulation parameters comprise simulation parameters of a one-dimensional simulation circuit and simulation parameters of a three-dimensional model, the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
judging whether the target simulation parameters meet preset requirements or not;
and if so, outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters.
2. The filter assembly analysis method according to claim 1, wherein constructing a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switching tube model, the dc support capacitor and the S parameter model of the X/Y capacitor comprises:
solving an S parameter model of the target three-dimensional model;
and building a one-dimensional simulation circuit according to the S parameter model of the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor.
3. The filter component analysis method of claim 1, wherein the method further comprises:
when the target simulation parameters are judged to not meet the preset requirements, respectively optimizing the one-dimensional simulation circuit and the three-dimensional model through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model, and executing the S parameter model according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the X/Y capacitor to build a one-dimensional simulation circuit.
4. The method for analyzing a filter assembly according to claim 3, wherein the optimizing the one-dimensional simulation circuit and the three-dimensional model by a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model respectively includes:
determining a first target to be optimized and a second target to be optimized according to the target simulation parameters;
acquiring a first optimization range of the first target to be optimized and a first target weight of the first target to be optimized; acquiring a second optimization range of the second target to be optimized and a second target weight of the second target to be optimized;
adding the first target to be optimized, the first optimization range and the first target weight into the one-dimensional simulation circuit to obtain a target one-dimensional simulation circuit; adding the second target to be optimized, the second optimization range and the second target weight into the three-dimensional model to obtain a three-dimensional model to be processed;
and respectively carrying out optimization iteration on the target one-dimensional simulation circuit and the three-dimensional model to be processed through a preset random optimization algorithm and a preset local optimization algorithm to obtain an optimized one-dimensional simulation circuit and an optimized three-dimensional model.
5. The method according to claim 1, wherein the separately solving the target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under the dc/ac excitation source comprises:
calculating simulation parameters of the one-dimensional simulation circuit when the switching tube is turned on/off according to the one-dimensional simulation circuit; the simulation parameters of the one-dimensional simulation circuit comprise a current-voltage time domain waveform and an insertion loss spectrum curve;
determining a solution variable of the target three-dimensional model;
setting the solving variable as a preset value to obtain a three-dimensional model to be simulated;
after direct current/alternating current excitation is added into the three-dimensional model to be simulated, simulation parameters of the three-dimensional model are obtained; the simulation parameters of the three-dimensional model comprise a temperature rise time domain curve and a frequency distribution diagram of the insulation field intensity;
summarizing simulation parameters of the one-dimensional simulation circuit and simulation parameters of the three-dimensional model to obtain target simulation parameters.
6. The method of claim 1, wherein determining whether the target simulation parameter meets a preset requirement comprises:
judging whether the waveform peak of the current-voltage time domain waveform meets the preset waveform peak requirement or not;
If the waveform peak requirement is met, judging whether the corresponding frequency band suppression in the insertion loss spectrum curve meets the preset frequency band suppression requirement or not;
if the frequency band suppression requirement is met, judging whether the temperature of the temperature rise time domain curve exceeds a preset temperature range within a preset operation time range;
if the temperature range does not exceed the preset temperature range, judging whether the insulation field intensity of the insulation materials in the laminated busbar exceeds a preset material acceptable range according to the frequency distribution diagram of the insulation field intensity;
and if the acceptable range of the material is not exceeded, determining that the target simulation parameters meet preset requirements.
7. A filter component analysis apparatus, characterized in that the filter component analysis apparatus comprises:
the acquisition unit is used for acquiring a three-dimensional model of the filter component, excitation source data, a power switch tube model, a direct current support capacitor and an S parameter model of the X/Y capacitor;
the port adding unit is used for adding a port of the X/Y capacitor, a port of the direct current support capacitor and a port of the power switch tube into the three-dimensional model to obtain a target three-dimensional model;
the building unit is used for building a one-dimensional simulation circuit according to the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor;
The solving unit is used for respectively solving target simulation parameters of the one-dimensional simulation circuit and the three-dimensional model under a direct current/alternating current excitation source; the target simulation parameters comprise simulation parameters of a one-dimensional simulation circuit and simulation parameters of a three-dimensional model, the simulation parameters of the one-dimensional simulation circuit comprise current-voltage time domain waveforms and insertion loss frequency spectrum curves, and the simulation parameters of the three-dimensional model comprise temperature rise time domain curves and frequency distribution diagrams of insulation field intensity;
the judging unit is used for judging whether the target simulation parameters meet preset requirements or not;
and the output unit is used for outputting the one-dimensional simulation circuit, the three-dimensional model and the target simulation parameters when judging that the target simulation parameters meet the preset requirements.
8. The filter assembly analysis device according to claim 7, wherein the construction unit comprises:
the first solving subunit is used for solving an S parameter model of the target three-dimensional model;
and the building subunit is used for building a one-dimensional simulation circuit according to the S parameter model of the target three-dimensional model, the excitation source data, the power switch tube model, the direct current support capacitor and the S parameter model of the X/Y capacitor.
9. An electronic device comprising a memory for storing a computer program and a processor that runs the computer program to cause the electronic device to perform the filter component analysis method of any one of claims 1 to 6.
10. A readable storage medium having stored therein computer program instructions which, when read and executed by a processor, perform the filter component analysis method of any one of claims 1 to 6.
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