CN116560014A - Vertically placed silicon photonics optical connector holder and mount - Google Patents

Vertically placed silicon photonics optical connector holder and mount Download PDF

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Publication number
CN116560014A
CN116560014A CN202310067757.1A CN202310067757A CN116560014A CN 116560014 A CN116560014 A CN 116560014A CN 202310067757 A CN202310067757 A CN 202310067757A CN 116560014 A CN116560014 A CN 116560014A
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CN
China
Prior art keywords
optics system
optical connector
coupled
frame
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310067757.1A
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Chinese (zh)
Inventor
戴维·约翰·肯尼思·麦都卡夫特
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Avago Technologies International Sales Pte Ltd
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Avago Technologies General IP Singapore Pte Ltd
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Filing date
Publication date
Priority claimed from US17/848,225 external-priority patent/US20230251442A1/en
Application filed by Avago Technologies General IP Singapore Pte Ltd filed Critical Avago Technologies General IP Singapore Pte Ltd
Publication of CN116560014A publication Critical patent/CN116560014A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/426Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel

Abstract

The present disclosure relates to vertically placed silicon photonics optical connector holders and mounting. A coupled optics system is disclosed. The coupled optics system includes an optics system. The optics system includes a frame, one or more interface lenses, a cover, and one or more frame alignment surfaces. The coupled optics system further includes an optical connector. The optical connector includes one or more connector lenses, an optical connector holder, and one or more holder alignment surfaces. The optics system is configured to be removably coupled to the optical connector and the one or more frame alignment surfaces are configured to be removably coupled to the one or more holder alignment surfaces.

Description

Vertically placed silicon photonics optical connector holder and mount
Filial piety of cross-shaped ginseng
The present disclosure claims the benefit of U.S. patent application serial No. 63/306,808 to us-provisional patent application serial No. 63/306,808 to da Weiyao hn kennys Mei Duo krofet (David John Kenneth Meadowcroft), entitled "vertical placement silicon photonics optical connector holder and MOUNT (VERTICAL PLACEMENT SILICON PHOTONICS OPTICAL CONNECTOR HOLDER & MOUNT)" filed on 4, month 2 of 2022, which is incorporated herein by reference in its entirety.
The present disclosure is also incorporated by reference in its entirety into the following applications: U.S. patent application Ser. No. 17/732,002 entitled "Via a collimated silicon photon edge coupled connector (SILICON PHOTONIC EDGE COUPLED CONNECTOR VIA COLLIMATION)" filed on 28, month 2022; and U.S. provisional patent applications entitled "via collimated silicon photon edge coupling connector (SILICON PHOTONIC EDGE COUPLED CONNECTOR VIA COLLIMATION)" filed on 2 and 4 of 2022, identified as Libecca-SheyVietz (Rebecca Schaevitz), neel-Margariti (Near Margalit), uygur Wei Ke Lavantan (Vivek Raghunathan), li Diji (Dicky Lee) and Ha Li Bottuy (Hari Potleri) with serial numbers 63/306,870.
Technical Field
The present disclosure relates to vertically placed silicon photonics optical connector holders and mounting.
Background
Co-packaged optics (CPO) is a high-level heterogeneous integration of optics and electronics in a single package with the aim of solving next-generation bandwidth and power challenges.
As data rates increase, there is a strong trend to move the high-speed electrical signals of the transceiver closer to the switch. This results in co-packaged optics (CPO) (e.g., transceiver optics mounted next to the switching silicon). These CPOs are becoming smaller and have led to the use of silicon photonics.
In general, photonic Integrated Circuits (PICs) have an optical input and an optical output. Typically, the input on the transmitter side of the PIC is Continuous Wave (CW) light that is modulated and sent into the output. The input on the receiver side of the PIC is modulated light, which is then converted into an electrical signal.
A typical solution for inputting and outputting light from a Photonic Integrated Circuit (PIC) would be to actively align a fiber block (e.g., a fiber block) and glue (e.g., glue with epoxy) the fiber in situ. This is called braiding (pigtening).
A problem with pigtail fiber optic cables is that the structure can become very cumbersome and difficult to manage, especially for CPOs having a switch chip that may have hundreds of input/output fibers.
Finally, a problem with the braided solution is that if one of the hundreds of fiber optic cables breaks accidentally, the entire structure may become useless and may need to be scrapped. This can be costly.
Disclosure of Invention
In one aspect, embodiments of the inventive concepts disclosed herein are directed to an optics system and an optical connector configured for removable coupling alignment.
In some embodiments, the optics system includes a frame, one or more interface lenses, a cover, and one or more frame alignment surfaces.
In some embodiments, the optical connector includes one or more connector lenses, an optical connector holder, and one or more holder alignment surfaces. In some embodiments, the optics system is configured to be removably coupled to the optical connector and the one or more frame alignment surfaces are configured to be removably coupled to the one or more holder alignment surfaces.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the scope of the claims. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concepts disclosed herein and together with the general description, serve to explain the principles.
Drawings
Numerous advantages of embodiments of the inventive concepts disclosed herein may be better understood by those skilled in the art by reference to the accompanying drawings in which:
FIG. 1 shows a schematic diagram of a coupled optics system;
FIG. 2 shows an optics system including a cover in an open position, according to an exemplary embodiment;
FIG. 3A shows an optical connector and optics system according to an exemplary embodiment;
FIG. 3B shows an optical connector removably coupled to an optics system including a cover in an open position, according to an exemplary embodiment;
FIG. 3C shows a coupled optics system including an optical connector guide and stop according to an exemplary embodiment;
FIG. 4 shows an optics system including a shelf and optics alignment surface according to an exemplary embodiment;
FIG. 5A shows a top view of an optical connector according to an exemplary embodiment;
FIG. 5B shows a bottom view of an optical connector according to an exemplary embodiment;
FIG. 6 shows an optics system in the context of a co-packaged optics system according to an exemplary embodiment;
FIG. 7 shows a cover including a cover according to an exemplary embodiment;
FIG. 8A shows a coupled optics system including a support member according to an exemplary embodiment; a kind of electronic device with high-pressure air-conditioning system
Fig. 8B shows a side view of an optics system including support members and spacers, according to an example embodiment.
Detailed Description
Before explaining at least one embodiment of the inventive concepts disclosed herein in detail, it is to be understood that the inventive concepts are not limited in their application to the details of construction and to the arrangements of the components or steps or methodologies set forth in the following description or illustrated in the drawings. In the following detailed description of embodiments of the inventive concepts, numerous specific details are set forth in order to provide a more thorough understanding of the inventive concepts. However, it will be apparent to one having ordinary skill in the art having had the benefit of the present disclosure that the inventive concepts disclosed herein may be practiced without these specific details. In other instances, well-known features may not be described in detail to avoid unnecessarily complicating the present disclosure. The inventive concepts disclosed herein have the ability of other embodiments, or can be practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting.
As used herein, letters following reference numerals are intended to reference embodiments (e.g., 1a, 1 b) that may be similar to, but not necessarily identical to, elements or features previously described with the same reference numerals. Such shorthand notations are for convenience purposes only and should not be construed to limit the inventive concepts disclosed herein in any way, unless explicitly stated to the contrary.
Furthermore, unless expressly stated to the contrary, "or" means an inclusive or and not an exclusive or. For example, condition a or B is satisfied by any one of the following: a is true (or present) and B is false (or not present), a is false (or not present) and B is true (or present), and both a and B are true (or present).
In addition, the use of "a" or "an" is used to describe elements and components of embodiments of the inventive concepts. This is done merely for convenience and to give a general sense of the inventive concept, and unless clearly indicated to the contrary, "a" and "an" are intended to include one or at least one and the singular also includes the plural.
Moreover, while various components may be described or depicted as being "coupled" or "connected," any two components capable of being so associated may also be viewed as being "couplable" to each other to achieve the desired functionality. Specific examples of couplable include, but are not limited to, physically matable, physically fixed relative to another component, and/or physically interacting components. Other examples include optical coupling, such as optically aligned and configured to direct an optical signal as two components. Moreover, although individual components may be described as being directly connected or coupled, direct connection or direct coupling is not required. For example, components may be indirectly coupled (e.g., couplable) through some interface, device, or intermediate component, whether physically (e.g., physical fit), optically, mechanically (e.g., via dynamically movable and physically interactable components), electrically, or otherwise. For example, the components may be in data communication (e.g., optical signal communication) with intervening components not illustrated or described. It should be appreciated that "data communication" refers to both direct and indirect data communication (e.g., intervening components may be present). In one example, the coupling is permanent (e.g., the two components are glued, fused, and/or the like with epoxy). In another example, the coupling is reversible (e.g., "removably" coupled/couplable). For example, "removably" coupled/coupleable may mean capable of being repeatedly and/or nondestructively coupled and decoupled (e.g., coupled by temporarily holding, clamping, stapling, latching, positioning, and/or the like, such as by in-situ). For example, in at least some embodiments, the optical connectors of the present disclosure may be removably coupled (e.g., couplable) to an optics system.
In addition, "edge" coupling, "edge" may be coupled, and the like, may mean in (and/or configured to be in) edge coupling into an edge (e.g., an edge of a chip and/or PIC, for example). Generally, two types of fiber-to-chip optical coupling are mainly used: out-of-plane (vertical, out-of-plane, and the like) coupling and in-plane (butt) coupling. The former typically uses grating coupling, while the latter uses edge coupling. For example, grating coupling provides out-of-plane coupling of light onto the PIC with an optical fiber positioned above the substrate/wafer surface (e.g., a portion of the length of the optical fiber is above and parallel to the substrate surface). On the other hand, the substrate may utilize a narrow etched area around the edge of the die to facilitate access to the edge coupler, for example.
Further, "aligned" may mean any alignment, such as structural and/or optical alignment. For example, the components may be optically aligned such that the optical axis of a first component is oriented relative to the optical axis of a second component (e.g., within a given tolerance such that the effective loss of optical signals between the optical axes of the two components is minimized). In another example, structural alignment may mean that one component is oriented (e.g., and/or configured to be oriented) relative to another component (e.g., via one or more degrees of freedom and/or within one or more alignment tolerances of such degrees of freedom). For example, one component may be aligned to another component to be within tolerances with respect to six degrees of freedom, such as within a number of translational units (e.g., 1 micron) in X, Y and Z directions and within a number of rotational units around X, Y and Z directions.
In at least some embodiments, alignment is provided by one or more alignment surfaces. For example, the alignment surfaces may be physically matable and/or guidable surfaces that may be configured to mate with and/or guide different alignment surfaces of different components, thereby providing alignment of different components via such matable (and/or guidable) alignment surfaces. For example, such an alignment surface (e.g., comprising a plurality of alignment surfaces in different orientations) may be configured to limit one or more degrees of freedom for different components (e.g., due to the shape and orientation of such alignment surfaces).
In general, active alignment is alignment performed in a well-controlled environment as compared to passive alignment. Active alignment processes are generally more expensive and time consuming to perform than passive alignment processes and are not practical in the art.
For example, "active" alignment, "actively" alignment, and the like may mean that active alignment techniques are necessary and/or advantageous for such alignment and/or that the system is configured to be fabricated/coupled using active alignment techniques (e.g., active placed within a particular alignment tolerance). For example, active alignment techniques may be considered as alignment (e.g., permanent alignment) provided to use well-controlled alignment processes and/or precision tools. Precision tools may mean tools that are not necessarily available when the aligned components are in the field (e.g., away from their manufacturing locations in actual and/or natural use cases). In one example, active alignment means that an imaging measurement system is used to align the optical fiber with a corresponding light source and test equipment to test the optical signal launched into the optical fiber by the light source as it passes out the opposite end of the fiber. By using these active alignment processes and active alignment equipment, a determination can be made as to whether the light source and the optical fiber are precisely aligned with each other. For example, a mechanical robotic gripper with precisely controllable (e.g., within a few microns or less) degrees of freedom may grip one or more optical fibers until a desired alignment tolerance is met, and hold the optical fibers when they are then permanently fixed in place (e.g., glued with epoxy).
Passive alignment, passively aligned, and the like, on the other hand, may mean that passive alignment techniques are necessary and/or beneficial for such alignment and/or that the system is configured to manufacture/couple using passive alignment techniques (e.g., within a particular alignment tolerance). For example, passive alignment may mean placement of the optical connector by hand or with a small tool (e.g., a hand tool such as forceps). This passive alignment may further mean assistance of passive guidance with one or more alignment surfaces (e.g., vertical pins, horizontal grooves). Passive guidance may mean guidance using little external tools (e.g., using only the user's hand and the alignment surface of the system itself). For example, one or more initial alignment surfaces (e.g., vertical pins) may initially remain constrained (passively) to relatively coarse tolerance components, while one or more second alignment surfaces (e.g., as matable surfaces, v-grooves) may provide more precise tolerance final (passive) alignment. This example is for illustrative purposes, and any combination and configuration of passive alignment surfaces and passive alignment processes may be used.
Finally, as used herein, any reference to "one embodiment," "an embodiment," or "some embodiments" means that a particular element, feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the inventive concepts disclosed herein. The appearances of the phrase "in at least one embodiment" in this specification are not necessarily all referring to the same embodiment. Embodiments of the disclosed inventive concepts may include any combination or sub-combination of one or more of the features or two or more of such features explicitly described or inherently present herein.
For purposes of this disclosure, in at least some embodiments, it should be noted that the Z-direction may be parallel to the optical axis of the lens (e.g., interface lens), the Y-axis may be normal to a plane (e.g., vertical) containing the optical axis of one or more interface lenses 204, and the X-direction is orthogonal to the optical axis (e.g., horizontal). It should be noted, however, that components described with respect to such directions are described for clarity purposes, and such description should not be construed as limiting all embodiments of the present disclosure. For example, in some embodiments, the optical axes of the interface lenses are not necessarily aligned such that one plane contains all of the optical axes, and in this embodiment, the Y-direction may be similarly defined, such as in the vertical direction, except for the normal to the plane containing the subset of the optical axes or based on the direction in which the optical connectors are placed.
Generally, lenses (e.g., interface lens 204, optical connector lens 312, surfaces of lenses, and the like) are components/elements that include at least partially transparent material configured (e.g., shaped) to direct a magnetic flux. For example, the lens may be configured to collimate, disperse, and/or concentrate one or more portions of a beam (or beams). For example, a lens may represent a single structure for guiding multiple beams (e.g., corresponding to multiple optical fibers 104).
Broadly, at least some embodiments of the inventive concepts disclosed herein are directed to an optical assembly that can be removably coupled. In some examples, the removable coupling may be between the optics system and the optical connector. Non-limiting examples of optics systems and optical connectors and various related elements are described in U.S. patent application No. 17/732,002 entitled "via collimated silicon photon edge coupled connector (SILICON PHOTONIC EDGE COUPLED CONNECTOR VIACOLLIMATION)" filed on 4/28 at 2022, which is incorporated herein by reference in its entirety. It should be noted that the concepts herein may be used with a variety of optics systems and optical connectors, such as, but not limited to, optics systems configured for non-collimated light, any optics systems and/or optical connectors known in the art, and the like.
In some embodiments, the optical connector and optics system are configured to be edge coupled. For example, the present disclosure includes at least one embodiment for co-packaged optics (CPO) alongside a switch Application Specific Integrated Circuit (ASIC) having an edge-coupled optical connector that utilizes collimated light and is coupled to the input and output of a silicon Photonic Integrated Circuit (PIC).
One of the challenges in silicon photonics is turning lamps on and off on silicon in a low cost, high volume manufacturable manner. In co-packaged optics (CPOs), silicon photons are located on the same package as other silicon Integrated Circuits (ICs), such as switch Application Specific Integrated Circuits (ASICs).
In some approaches, in order for the optical fiber to efficiently transmit optical signals, the interface lens of the optics system and the optical connector lens of the optical connector must be within specific alignment tolerances. This alignment allows the fiber to transmit its signal to the appropriate receiver at the appropriate/desired level of efficiency.
One method for coupling an optical fiber to a CPO system relies on butting (pigtailing) the fiber to a silicon photon and permanently fixing the fiber in place. For example, the optical fibers may be aligned (actively) and secured in place by an adhesive (e.g., epoxy). In this regard, the end of the fiber may be permanently attached to the silicon photon in some sense and the other end may use a standard optical connector (e.g., a multi-fiber push-in (MPO) or LC connector). It is contemplated herein that this configuration may work reasonably well in transceiver-based technologies, where the solution is typically fully encapsulated and alignment of the entire assembly is well controlled, but may present challenges in CPO applications.
The challenge with this configuration is that the optical connectors can generally be small, translucent, fragile, and difficult to handle and position. Other challenges of coupling optical fibers include that the optical fibers can transmit laser light that can damage the eyes of the user.
In at least some embodiments, the optical connector 302 is configured to be passively aligned and passively removably coupled to the optics system 202 via one or more surfaces (e.g., alignment/guide surfaces, typically such as, but not limited to, the frame alignment surface 502 and the optics alignment surface 206).
Some embodiments of the present disclosure address at least some of these challenges. For example, at least some embodiments of the present disclosure allow for coupled optics systems in which the fiber array is more easily positioned/aligned (e.g., optically coupled) and is not permanently attached (e.g., may be removably coupled, in particular). Some embodiments include a cover to aid in the protection and securement of the optical coupling. Furthermore, some embodiments allow an operator to insert and secure an optical connector for use with a co-packaged optics system with photonic integrated circuits (CPO PIC).
For some embodiments, coupled optics systems including optics systems and optical connectors may need to withstand numerous quality tests, including shock and vibration, unbiased wet heat, fiber pull testing, and the like. Through these tests, the optical connector may need to be held in place relative to the optics system with minimal variation in optical light input/output power. Various embodiments herein may help ensure that the coupled optics system can pass quality testing and is suitable for various purposes.
Referring to fig. 1, a schematic diagram of a coupled optics system 100 is shown. In at least some embodiments, the coupled optics system 100 includes an optics system 202 and an optical connector 302. In some embodiments, the optics system 202 may be an optical communication interface to and from a circuit (e.g., PIC) in a sense, and the optical connector 302 may provide optical coupling to this interface, allowing data to be transferred to and from the optical fiber 104. For example, optics system 202 may be part of and/or connected to a Photonic Integrated Circuit (PIC) such that optical signals may be transmitted to and/or received from the PIC.
In at least some embodiments, the optics system 202 is configured to be removably coupled with the optical connector 302. In this regard, the optical connector 302 may be non-destructively removed from coupling to the optical connector 302 when desired.
In at least some embodiments, the optics system 202 includes one or more covers 702. For example, the cover 702 may protect the coupled optics system 100 from dust and other contaminants and may prevent light from escaping the coupled optics system 100 in a direction that may harm a user. For example, the optical connector 302 may be configured to utilize class 4 (class 4) light that may be at least partially contained by the cover 702. This can provide safety for human vision.
Referring to fig. 2, an optics system 202 including two covers 702 in an open position is shown in accordance with one or more embodiments of the present disclosure.
In an embodiment, the pins 704 allow the lid 702 to rotate to the closed position and allow the lid 702 to rotate from the open position to the closed position. The cover 702 in the open position may allow for placement and/or removal/decoupling of the optical connector 302. It should be noted that although cylindrical pin 704 is shown as providing rotation of cover 702, any shape and/or rotation mechanism may be used, such as threaded bolts, bearings, ball joints, bendable materials having bending lines parallel to the X-direction, and/or the like. Pin 704 may be an intermediary component coupled between frame 504 and cover 702 such that cover 702 is indirectly coupled to frame 504 via pin 704.
In some embodiments, the optics system 202 may include one or more covers 702, each cover 702 being associated with one or more optical connectors 302. For example, each cover 702 may be associated with two or more optical connectors 302, as shown.
In an embodiment, the cover 702 is made of sheet metal. In some examples, the cover 702 is made from and configured to be made from a sheet metal stamping process. In some embodiments, the cover 702 is made of plastic.
In an embodiment, the cover 702 may include a spring 706. For example, as shown in fig. 2, the spring 706 may be built-in as a monolithic portion of the cover 702 and configured to be made via a stamping process. In an embodiment, spring 706 provides a downward force on optical connector 302 to maintain optical connector 302 in optical alignment with the interface lens. In some examples, the spring 706 is configured to provide a minimum 4 newtons downward force. For example, the spring 706 may be configured to provide a downward force of at least 4 newtons on the optical connector 302 when the cover 702 is in the closed position. In this regard, the spring 706 may push against the optical connector 302, which may help ensure that the optical connector 302 remains optimally aligned for effective optical coupling.
In some embodiments, the cover 702 includes two or more springs 706. For example, each spring 706 may be configured to provide a downward force on a different optical connector 302 such that a single cover may be associated with two or more optical connectors 302.
In some embodiments, the cover 702 includes one or more cover members 708. For example, the cover member 708 may be used to lock the cover 702 in a closed position and may be a tab, ridge, pin, slot, hole, and the like. For example, the cover member 708 may be configured to align with the cover member surface 710 when the cover 702 is in the closed position. For example, the cover member surface 710 may be a recess, hole, slot, and/or the like defined by elements of the optics system 202 (e.g., the frame 504, shelf 208, and/or the like) such that when the cover 702 is rotated to the closed position, the cover member surface 710 locks (e.g., snaps, slides into place, restrains movement, and/or the like) the cover 702 into the closed position. It should be noted that the cover member surface 710 may be configured to allow removable coupling of the cover to the open position, as this locking is non-destructive reversible. For example, the locking may be reversible by pulling the locking tab outward (e.g., by hand or forceps) to allow the cover 702 to be rotated to the open position. In another example, the cover member 708 and the cover member surface 710 allow the cover 702 to be opened with sufficient force in the Y-direction (i.e., without directly pulling the cover member 708 outward).
Referring to fig. 3A, a coupled optics system 100 including an optical connector 302 and optics system 202 is shown in accordance with one or more embodiments of the present disclosure. It should be noted that the optical connector 302 is positioned above the optics system 202 and ready to move into position.
In an embodiment, optics system 202 includes a frame 504. It should be noted that the illustrated frame 504 is not limiting and that the frame 504 may be any shape and coupled to various components. For example, the frame 504 may be configured to couple with any number of optical connectors 302 (e.g., 1, 2, 4, 10, etc.).
In an embodiment, optics system 202 includes one or more frame alignment surfaces 502. For example, the frame alignment surface 502 may help a user position/align the optical connector 302 relative to the optics system 202 during coupling. In some embodiments, the frame alignment surface 502 also facilitates strain relief for the optical connector 302 in the event that an external force is applied to the optical fiber 104. In some embodiments, the optical connector holder 304 includes and defines a frame alignment surface 502.
In one example, frame alignment surface 502 is coupled to frame 504. For example, the frame alignment surface 502 may be formed from a single piece of material (e.g., injection molded, cast, 3D printed, etc.). In other examples, frame alignment surface 502 is not part of frame 504 but is coupled with respect to frame 504. In this regard, the frame alignment surface 502 may allow for alignment of the optical connector 302 relative to the optics system 202.
In an embodiment, as shown, the frame alignment surface 502 is vertically aligned in the Y-direction. In this regard, the frame alignment surface 502 may provide X-direction and Z-direction alignment.
In an embodiment, the frame alignment surface 502 is shaped as a pin in the vertical Y-direction to provide an initial coarse alignment. It should be noted that the frame alignment surface 502 as shown is merely one non-limiting example, and that the frame alignment surface 502 may be any shape and/or in any alignment direction. For example, in addition to a circular pin shape, the frame alignment surface 502 may include a square, oval, rectangular, hexagonal, or similar shape. In another example, the size of the frame alignment surface 502 may taper along the Y-direction and/or may include an angled ramp (as shown) or the like at the top to aid in alignment. For example, the frame alignment surface 502 may be conical, pyramidal, or the like. In some examples, the frame alignment surface 502 is not aligned perpendicular to the Y-direction and may be aligned at one or more angles (e.g., 5 degrees, 10 degrees, and the like) relative to the Y-direction. Likewise, the shape and/or alignment of the holder alignment surface 308 may be any shape and/or alignment such that the holder alignment surface 308 matches (i.e., corresponds to) the frame alignment surface 502.
In some embodiments, the frame alignment surface 502 may be a rough alignment surface in a sense to aid in initial alignment. Without this coarse alignment, coupling of the optical connector 302 to the optics system 202 may be more difficult. For example, in a sense, the optics alignment surface 206 may be used for finer alignment later. Without initial coarse alignment, alignment of the optic alignment surface 206 may be difficult given that the user's field of view is likely to be blocked by the optical connector 302 when performing this alignment and the size of the optic alignment surface 206 may be relatively small. In some embodiments, a thicker initial alignment is obtained using the frame alignment surface 502, and a user may more quickly and easily align the optics alignment surface 206 with the connector alignment surface 314.
In an embodiment, as shown, at least one frame alignment surface 502 is positioned on one side of the optical axis of the optical connector 302 and at least one second frame alignment surface 502 is positioned on an opposite side of the optical axis. For example, as shown, one vertical alignment pin 502 may be on each side of the optical connector 302 to constrain all degrees of freedom (e.g., translation in the Y direction) except for one degree of freedom.
In an embodiment, the frame alignment surfaces 502 are staggered relative to the Z-direction in a plane including the X-direction and the Z-direction (as shown) to allow for relatively close positioning (i.e., efficient space use) of the optical connector 302.
Referring to fig. 3B, an optical connector 302 is shown removably coupled to an optics system 202 including a cover 702 in an open position in accordance with one or more embodiments of the present disclosure. In this regard, for illustrative purposes, the optical connector 302 is shown in the coupled position before the cover 702 is placed in the closed position, which will block this view. In some embodiments, the frame alignment surface 502 is coupled with the optical connector 302 as shown.
Referring to fig. 3C, a coupled optics system 100 including an optical connector guide 602 and a stop 604 is shown in accordance with one or more embodiments of the present disclosure.
In some embodiments, optics system 202 includes one or more optical connector guides 602 coupled to frame 504. For example, the optical connector guides 602 may be used to help in gathering/guiding the optical connectors 302 into place along the Y-direction during the coupling process in a manner. In some examples, the one or more optical connector guides 602 are made of injection molded plastic.
In some embodiments, optics system 202 includes one or more stops 604. For example, the stop 604 may be configured to constrain the optical connector 302 in a Z-direction defined along an optical axis of the one or more interface lenses 204. For example, one or more optical connector guides 602 may include such stops 604.
For reference to the non-limiting position of stop 604, reference is made to stop 604 in FIG. 3C. For example, one stop 604 may be a portion (surface) of the frame 504 and configured to limit a portion (surface) of the optical connector 302. For example, a surface of the spacer 804 (see fig. 8B) may be a stop 804 configured to constrain the intermediate element 306 (see fig. 5A) of the optical connector 302. Another stop 604 (as shown by stop 604 in the lower right portion of fig. 3C) may be positioned under the optical connector 302 and may be configured to align with an auxiliary portion or surface of the optics system 202. In some embodiments, stop 604 limits optical connector 302 to within 50 or 100 microns in the Z-direction to facilitate optical positioning of optical connector 302. For example, stop 604 may provide a range of movement of optical connector 302 of up to 50 microns in the Z-direction.
Referring to fig. 4, an optics system 202 including a shelf 208 is shown in accordance with one or more embodiments of the present disclosure. In an embodiment, the shelf 208 includes one or more optic-alignment surfaces 206. In an embodiment, shelf 208 includes a recess (not labeled) between optic alignment surfaces 206 and configured to receive a removable coupling of optical connector 302. In some examples, one or more interface lenses 204 are coupled to the shelf 208 such that components coupled and aligned to the optic alignment surface 206 (e.g., the optical connector 302) are also coupled and aligned to the one or more interface lenses 204. In this regard, the optic alignment surface 206 may be configured to allow precise optical coupling.
While the shelf 208 is shown as a single body with one optic-alignment surface 206 on each side of the intermediate portion (e.g., notch), the shelf 208 is not limited to this embodiment, and the shelf 208 may include, for example, various numbers, locations, shapes, and/or the like of optic-alignment surfaces 206, intermediate portions, and any other elements/limitations depicted or described. For example, the shelf 208 may have various sizes (e.g., relatively larger for coarse initial alignment in one direction, smaller for final precise alignment in a different direction), various shapes (grooves, such as V-grooves, rectangular notches, U-grooves, pyramidal surfaces, conical surfaces, vertical pins, and/or any other shape that facilitates alignment), and/or the optics alignment surface 206 in various positions of the shelf 208 (e.g., on a surface of a middle portion, on a top surface (as shown), on a bottom surface, on one or more exterior side surfaces, on a front surface, on a back surface, and/or the like). Similarly, any of the surfaces/elements/limitations of the optical connector 302 (e.g., connector alignment surface 314, retainer alignment surface 308) and frame alignment surface 502 described and depicted in this disclosure are not limited to what is described and depicted and may likewise differ in number, size, position, and/or the like.
Referring to fig. 5A, a top view of an optical connector 302 in accordance with one or more embodiments of the present disclosure is shown.
In an embodiment, the optical connector 302 includes one or more optical connector lenses 312 and an optical connector holder 304 coupled to the optical connector lenses 312. For example, the optical connector lens 312 may be configured to align with one or more interface lenses 204 and optically couple with the one or more interface lenses 204. In some examples, the optical connector holder 304 is metal. For example, the optical connector holder 304 may be configured to be stamped from a single layer of sheet metal.
In an embodiment, the optical connector includes a fiber block (but not labeled) as shown, which may be coupled to the optical connector lens 312 and/or the intermediate element 306. For example, a fiber block, such as a Fiber Array Unit (FAU), may be actively aligned with the optical fiber 104. In some examples, the fiber mass is made of glass.
In an embodiment, the one or more optical connector lenses 312 are configured for at least one of: receiving and/or transmitting a collimated light beam or at least a partially collimated light beam. Further, the interface lens 204 of the optics system may be configured for at least one of: receiving and/or transmitting a collimated light beam or at least a partially collimated light beam. In this regard, the coupled optics system 100 may be used with collimated light, which may relax the alignment tolerance requirements in X, Y and Z directions.
In some embodiments, the optical connector holder 304 is coupled to other elements of the optical connector 302 (e.g., the connector lens 312) via an intermediate element 306 (e.g., an adhesive (e.g., a soft foam adhesive)). The intermediate element 306 may help prevent the coefficient of thermal expansion mismatch from causing optical misalignment between the optical connector 302 and the optical connector holder 304.
In an embodiment, the optical connector holder 304 may include (but need not include) one or more holder alignment surfaces 308. For example, as shown in fig. 3A, the holder alignment surface 308 may be configured to align with a frame alignment surface 502 (e.g., a vertical pin) of the optics system 202. In this regard, the holder alignment surface 308 may allow for alignment of the optical connector 302 in the Z-direction and the X-direction. As shown, the holder alignment surface 308 may include a void defined by the optical connector holder 304. In some examples, the holder alignment surfaces 308 are coplanar. For example, the holder alignment surfaces 308 may be coplanar along a plane parallel to the Z-direction and the X-direction.
In an embodiment, the optical connector holder 304 may include/define a relief surface 310. The relief surface 310 may be configured to minimize the amount of thermal expansion in a direction relative to the alignment of the relief surface 310. For example, by minimizing thermal expansion, optimal optical alignment may be provided.
Referring to fig. 5B, a bottom view of an optical connector 302 including a connector alignment surface 314 is shown in accordance with one or more embodiments of the present disclosure.
In some embodiments, connector alignment surface 314 may help align/couple optical connector 302 with optics system 202. The connector alignment surface 314 may optically position and constrain the optical connector 302 in the X and/or Y directions relative to the optics system 202 (e.g., relative to the interface lens 204). For example, the optics system 202 may have a corresponding optics alignment surface 206 (e.g., a V-groove) configured to align with the connector alignment surface 314. This alignment may allow the optical connector 302 to be aligned within 10 (or 15 or 20) microns in the X and/or Y directions until sub-micron alignment (e.g., a tolerance of 1 micron in each direction).
In some embodiments, the optical alignment tolerance of the coupling between the optics system 202 and the optical connector 302 may be as low as 25 to 100 microns (e.g., 25, 50, or 100) in the Z-direction and/or as low as 5 to 20 (e.g., 5, 10, 15, or 20) microns in the X-direction and/or Y-direction.
In some examples, the connector alignment surface 314 is a connector alignment rod (i.e., on at least one side, a cylindrical rod shape). In an embodiment, for connector alignment surface 314, the dimensions of the component may include, but are not limited to, a length of about 5mm and/or a diameter of about 0.22 mm. The pitch (i.e., the spacing between rod centers) may be about 6.4mm. The frame alignment surfaces 502 may be 1.5mm in diameter and/or may have a spacing of 8mm between the frame alignment surfaces 502 (for the same optical connector 302 of the frame alignment surfaces 502).
Referring to fig. 6, an optics system 202 in the context of use with a co-packaged optics system 102 is shown in accordance with one or more embodiments of the present disclosure. For example, in some embodiments, optics system 202 includes and/or is configured to be compatible with some or all of the elements shown. In some examples, as shown, optics system 202 is configured for at least four optical connectors 302 per side.
Referring to fig. 7, a cover 702 including a cover 712 is shown in accordance with one or more embodiments of the present disclosure. Cover 712 may provide additional protection against dust, dirt, and the like, and additionally prevent light from escaping from optics system 202. For example, cover 712 may be coupled to cover 702 and move with cover 702. In some examples, the cover 712 is positioned to cover the aperture left by the stamped spring 706 and/or any other aperture.
In an embodiment, the frame 504 is configured to be thermally coupled to an Electronic Integrated Circuit (EIC), a Photonic Integrated Circuit (PIC), and/or any transceiver/receiver component such that the frame 504 acts as a heat sink for such components. For example, as shown in fig. 7, the frame 504 may extend toward the center of the CPO system 102, allowing for the absorption of thermal energy from surrounding areas. For example, a portion of framework 504 may be mated to an Application Specific Integrated Circuit (ASIC) side of the CPO system. This portion may dissipate heat to surfaces to which it is thermally coupled (e.g., surfaces above and below it). For example, the portion of the frame 504 on the left side of fig. 7 and the adhesive surface 506 may be thermally coupled together. The frame 504 may be configured to dissipate (e.g., from an optical connector) about 15 to 20 watts (e.g., up to 15 watts, 16 watts, 20 watts, etc.).
In embodiments, framework 504 may provide other functionality. For example, the frame 504 may be shaped to protect the exterior of the shelf 208 and the optical connector 302. For example, as shown, the frame 504 may enclose and/or partially enclose portions (e.g., front, sides, bottom, and the like) of the shelf 208 and/or the optical connector 302, such as portions not enclosed by the cover 702 or other components.
In an embodiment, the frame 504 may be made of metal. For example, the frame 504 may be copper tungsten. This material may have the same Coefficient of Thermal Expansion (CTE) as the other materials in the system so that the optical element (e.g., lens) remains aligned during temperature changes. In some examples, the frame 504 may have a relatively low CTE as compared to other adjacent components such that the expansion of the frame is less than such adjacent components.
Referring to fig. 8A, a coupled optics system 100 including a support member 802 is shown in accordance with one or more embodiments of the present disclosure.
In some embodiments, the support members 802 may be below the shelf 208 (in the Y-direction). The support members 802 may prevent the shelf 208 from breaking (i.e., provide structural support in the Y-direction) when the optical connector 302 is inserted. In this regard, the shelf 208 may be supported by the support member 802 along the X-direction. It should be noted that the shelf 208 may be quite fragile. For example, the shelf 208 may be made of at least one of glass and/or silicon.
In an embodiment, the support member 802 and the shelf 208 are glued together with epoxy. In some examples, shelf 208 is not glued to anything other than support member 802 with epoxy and is slidably placed on frame 504 as shown. This configuration may be used to prevent any thermal expansion mismatch in the elements/components of the optics system 202 from fracturing the shelf 208. To further prevent stress on the coupled optics system 100, the support members 802 may be made of copper tungsten (CuW) that thermally expands to match the shelf (e.g., silicon shelf) 208.
Referring to fig. 8B, a side view of an optics system 202 including a support member 802 and a spacer 804 is shown in accordance with one or more embodiments of the present disclosure.
In an embodiment, the optics system 202 may include spacers 804. Spacers 804 may be placed over the support member 802 (in the Y-direction) and coupled to the support member 802 as shown. For example, the spacer 804 may be disposed between the support member 802 and the shelf 208. The spacers 804 may be configured to vary in size depending on the gap between the support member 802 and the shelf 208. For example, active alignment of the shelf 208 may require a particular positioning of the shelf 208. The shelf 208 may be actively aligned (e.g., via a controlled robotic method) to this position and then coupled to the support member 802 using the spacer 804. For example, the spacer 804 may be flexible (e.g., initially, prior to curing, etc.) and/or made of a material or process that allows it to fill a wide range of gap sizes. For example, the spacer 804 may be an epoxy configured to fill a range of gap sizes when in a liquid state and configured to harden to a solid, inflexible state to constrain the shelf 208 in a particular position relative to the support member 802 and/or the interface lens 204.
Various embodiments of the optics system 202 and the optical connector 302 will now be discussed more generally.
In some embodiments, the optics system 202 and the optical connector 302 may be configured to be used with single mode (e.g., modal) photons. In some embodiments, the optics system 202 and the optical connector 302 may be configured to be used with Coarse Wavelength Division Multiplexed (CWDM) photons that may utilize multiple channels and/or wavelengths for communication.
In some embodiments, the collection of components that help to protect the optical coupling of optical connector 302 and optics system 202 may be collectively referred to as a "clamshell (clamshell) connector. In some embodiments, the interface lens 204 may also be referred to as a PIC lens and is coupled to the PIC. In some embodiments, the optical connector 302 may include (or may be) a fiber array unit.
It is believed that the inventive concepts disclosed herein and many of its attendant advantages will be understood by the foregoing description of the embodiments of the disclosed inventive concepts and it will be apparent that various changes may be made in the form, construction and arrangement of the components thereof without departing from the broad scope of the inventive concepts disclosed herein or without sacrificing all of its material advantages; and individual features from the various embodiments may be combined to yield other embodiments. The form herein before described being merely an explanatory embodiment thereof, it is the intention of the appended claims to encompass and include such changes. Furthermore, any of the features disclosed with respect to any of the individual embodiments may be incorporated into any other embodiment.

Claims (20)

1. An optics system, comprising:
a frame;
one or more interface lenses coupled to the frame;
a cover coupled to the frame and configured to rotate from an open position to a closed position,
wherein the optics system is configured to be removably coupled to an optical connector.
2. The optics system of claim 1, wherein the optics system further comprises two or more frame alignment surfaces.
3. The optics system of claim 2, the two or more frame alignment surfaces are pins orthogonal to an optical axis of the one or more interface lenses.
4. The optics system of claim 1, wherein the cover comprises one or more springs configured to apply a force to the optical connector when the cover is in the closed position.
5. The optics system of claim 1, wherein the optics system is configured to be edge-coupled with the optical connector.
6. The optics system of claim 1, wherein the one or more interface lenses are configured to be collimated.
7. The optics system of claim 1, wherein the optics system further comprises one or more optical alignment surfaces.
8. The optics system of claim 1, wherein the frame is configured to be thermally coupled to a co-packaged optics system.
9. The optics system of claim 1, wherein the cover is configured to have one or more cover members configured to align with cover member surfaces of the optics system when the cover is in the closed position to provide locking of the cover in the closed position.
10. The optics system of claim 1, wherein the optics system further comprises one or more optical connector guides configured to guide the optical connector to be removably coupled with the optics system.
11. The optics system of claim 1, wherein the optics system further comprises one or more stops configured to constrain the optical connector in a Z-direction defined along an optical axis of the one or more interface lenses.
12. The optics system of claim 1, wherein the optics system further comprises a shelf and a support member configured to provide structural support to the shelf.
13. The optics system of claim 12, wherein a spacer is disposed between the support member and the shelf.
14. The optics system of claim 1, wherein the optics system further comprises a pin coupled to the frame and to the cover, the pin being between the frame and the cover such that the cover coupled to the frame is an indirect coupling.
15. An optical connector, comprising:
one or more connector lenses;
an optical connector holder coupled to the one or more connector lenses; a kind of electronic device with high-pressure air-conditioning system
One or more retainer alignment surfaces, coupled to the optical connector retainer,
wherein the optical connector is configured to be removably coupled to an optics system.
16. The optical connector of claim 15, wherein the one or more retainer alignment surfaces comprise two or more voids defined by the optical connector retainer.
17. The optical connector of claim 15, wherein the optical connector comprises one or more connector alignment surfaces aligned parallel to an optical axis of the one or more connector lenses.
18. The optical connector of claim 17, wherein the one or more connector alignment surfaces are configured to removably couple with one or more optical alignment surfaces of the optics system.
19. A coupled optics system, comprising:
an optics system, comprising:
a frame;
one or more interface lenses coupled to the frame;
a cover coupled to the frame and configured to rotate from an open position to a closed position; a kind of electronic device with high-pressure air-conditioning system
One or more frame alignment surfaces;
an optical connector, comprising:
one or more connector lenses;
an optical connector holder coupled to the one or more connector lenses;
one or more retainer alignment surfaces, coupled to the optical connector retainer,
wherein the optics system is configured to be removably coupled to the optical connector and the one or more frame alignment surfaces are configured to be removably coupled to the one or more holder alignment surfaces.
20. The coupled optics system of claim 19, wherein the optics system is configured to be edge-coupled with the optical connector.
CN202310067757.1A 2022-02-04 2023-02-03 Vertically placed silicon photonics optical connector holder and mount Pending CN116560014A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US63/306,808 2022-02-04
US63/306,870 2022-02-04
US17/732,002 2022-04-28
US17/848,225 2022-06-23
US17/848,225 US20230251442A1 (en) 2022-02-04 2022-06-23 Vertical placement silicon photonics optical connector holder & mount

Publications (1)

Publication Number Publication Date
CN116560014A true CN116560014A (en) 2023-08-08

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Application Number Title Priority Date Filing Date
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