CN116558689A - Novel device and method for measuring residual stress of sample by layer cutting method - Google Patents
Novel device and method for measuring residual stress of sample by layer cutting method Download PDFInfo
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- CN116558689A CN116558689A CN202310542140.0A CN202310542140A CN116558689A CN 116558689 A CN116558689 A CN 116558689A CN 202310542140 A CN202310542140 A CN 202310542140A CN 116558689 A CN116558689 A CN 116558689A
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005520 cutting process Methods 0.000 title claims description 14
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000003801 milling Methods 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 26
- 238000012360 testing method Methods 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000032798 delamination Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0047—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to residual stresses
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The utility model provides a novel layer cuts device of method measurement sample residual stress, including measuring base, two supporting seats, three magnetic force gauge stand, three location pin, amesdial, two supporting seats are installed on measuring base top surface, and are located the both sides of measuring the base respectively, wherein two magnetic force gauge stand are installed in measuring base top surface rear, and another magnetic force gauge stand is installed in measuring base top surface one side, and is located one side of a support, the place ahead of supporting seat magnetic force gauge stand, the amesdial is placed on measuring base top surface.
Description
Technical Field
The invention belongs to the technical field of material analysis, and particularly relates to a novel device and a method for measuring residual stress of a sample by a layer cutting method.
Background
When a load is applied to the component, some local stresses exceed the yield limit, these parts will deform plastically, but the remainder of the component is still in the elastic deformation range. If the load is released again, the portion that has undergone plastic deformation cannot be restored to the original size, and the restoration of the elastically deformed portion is inevitably hindered, thereby causing stress of internal interaction, which is called residual stress.
The aluminum alloy plate undergoes rolling, heat treatment, prestretching and other processes in the production process, and residual stress can be generated in the plate. The stress changes along with the thickness of the plate, the overall balance is maintained, and the plate maintains a certain overall dimension. For sheet samples with residual stresses, if a thin layer is machined off of one of the extruded surfaces of the sample, the residual stresses of the sheet sample with residual thickness will be redistributed and some bending deformation of the sample will occur to form a new balance.
The principle of the layer cutting method for testing the residual stress of the plate sample is as follows:
one rolling surface of the plate sample is taken as a reference plane, and the other rolling surface opposite to the reference plane is defined as a sliced surface. And removing the uniform thickness thin layers of the layer cutting surface layer by layer, and measuring the deformation deflection of the reference plane and the thickness of the sample at the middle length position of the sample. According to Young's modulus, poisson's ratio, deformation deflection of a sample, sample thickness and the like of the material, a formula established by a deflection model is substituted, residual stress of the sample and the plate at different thicknesses is calculated, and a layer cutting method (also called a peeling method) is applied to detection method standards of Boeing and sky and passengers.
For the layer cutting test, no test method standard exists in China, and no special test equipment exists in the market. When the residual stress of the plate is tested by the layer cutting method according to the air standard or the Boeing standard, a self-made testing device according to a standard drawing (shown in figure 11) is generally adopted. From the standard drawings, the end and side positioning bars for sample positioning are fixed to the base by mechanical structures.
The test device given by the original standard has several disadvantages:
(1) The side positioning blocks and the end positioning blocks are relatively complex to manufacture;
(2) The placing positions of the side positioning blocks and the end positioning blocks on the testing device are fixed, and if the size of the sample changes, the positions of the positioning blocks are not easy to adjust.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a novel device and a method for measuring the residual stress of a sample by using a layer cutting method.
The application provides a novel layer cutting method measures device of sample residual stress, including measuring base, two supporting seats, three magnetometer seat, three location pin, amesdial, two supporting seats are installed on measuring base top surface, and are located the both sides of measuring the base respectively, and wherein two magnetometer seats are installed in measuring base top surface rear, and another magnetometer seat is installed in measuring base top surface one side, and is located one side of a support, and the supporting seat is located the place ahead of magnetometer seat, and the amesdial is placed on measuring base top surface.
A new method for measuring residual stress of a sample by a layer cutting method comprises the following steps:
1) Placing the measuring device on a flat test bed, and ensuring no vibration interference in the measuring process;
2) According to the length L, the width W, the thickness T and the corresponding supporting distance L of the sample, the mounting positions of the supporting points are adjusted and fixed, and the supporting distance is controlled within the range of l+/-1 mm;
step two, positioning a measurement datum point:
1) Marking the exact center of the reference plane on the sample, drawing arrow marks on any two adjacent sides of the reference plane of the sample, placing the sample on a deformation measuring device, enabling the side surface with the arrow marks to face a positioning stop lever,
2) The position of the sample on the supporting point is adjusted to enable the axis of the sample to be parallel to the axes of the supporting point and the measuring point, the side positioning stop lever is adjusted to be in contact with the sample, the positioning stop lever is locked, the dial indicator is moved to enable the dial indicator measuring head to be in contact with the center of the reference plane, initial displacement of not less than 0.5mm is achieved, the dial indicator bracket is locked, and the dial indicator pointer is adjusted to the zero scale position;
3) The method comprises the steps of abutting a sample against a positioning stop lever, lifting one end without the positioning stop lever, slowly falling, lifting to ensure that the numerical change of a dial indicator can be observed, slowly moving a pointer can be observed when the sample falls to the pointer type dial indicator, slowly changing the number can be observed before the sample falls to a stop, then pushing the sample against the positioning stop lever, observing whether the dial indicator is still at a zero position or not, repeating the step, and continuously displaying the value within the range of (0.000+/-0.001) mm for 3 times, wherein the current position of a measuring head of the dial indicator is a measuring reference point;
step three, milling and testing processes:
1) Milling layer thickness calculation, wherein the thickness of the removed layer milled each time is t/20+/-0.25 mm for ensuring that at least 10 data points are tested;
2) Testing the thickness of the sample, wherein the thickness is measured at the middle position of the length of the sample;
3) The sample base is stably placed on a fixture seat guide rail to be clamped, a threaded hole of the base faces upwards, a counter bore of the sample corresponds to the threaded hole of the base, and the sample is fixed on the sample base by bolts;
4) Setting processing parameters and milling, wherein sample milling processing is divided into two stages of rough processing and finish processing, and milling processing is carried out according to the thickness calculated in 1), and severe processing vibration is avoided in the processing process; 5) The method comprises the steps of measuring deflection, wherein the total deflection of a measurement datum point after milling of an ith layer removing layer is represented by a symbol omega (i), according to the sequence of processing the removing layer, omega (0) represents the initial total deflection of a sample, namely omega (0) =0mm, the total deflection after removing the 1 st layer is omega (1), and the like, the deformation direction of the sample can be divided into positive and negative directions, the deformation quantity of the sample is correspondingly recorded as positive and negative values, the sample is taken down for size measurement after milling of each removing layer, the sample is placed on a measuring device, a reference plane of the sample is downward, two sides of the reference plane with arrow marks are abutted against a positioning stop lever, one end without the positioning stop lever is lifted, the sample slowly falls down again, and is repeated for 3 times, and if the value change of the dial gauge is not more than +/-0.001 mm, the current reading of the dial gauge is read as the total deflection of the sample;
6) Repeating the steps of 2) to 5) until the thickness of the sample reaches half of the original thickness, and recording the sequence of removing the layers, the thickness of the sample and the total deflection each time.
Specifically, in the third step 2), the symbol T (i) is used, i is a milling sequence, the original thickness of the sample is denoted as T (0), that is, T (0) =t, and the thickness of the sample after removing the i-th layer is denoted as T (i).
Compared with the prior art, the invention has the following beneficial effects:
1. the magnetic gauge stand is adopted to fix the positioning stop lever, so that the deflection testing device is simpler, and a complicated side and end positioning mechanism is not needed to be processed.
2. The base of the whole testing device does not need to be provided with a plurality of holes for fixing and positioning the stop lever.
3. Aiming at samples with different lengths, the magnetic meter base is more flexible to position and is not limited by the punching position of the base.
4. The whole measuring device has lower manufacturing cost and is convenient for large-scale use of the measuring method. Since the layer cutting method requires milling off one rolled surface of the test specimen layer by layer, each milling requires measuring the deformation deflection of the test specimen on the measuring device. Therefore, the measurement efficiency is very low, and it usually takes more than 4 hours to complete the measurement of one sample, and for thicker samples (with a thickness greater than 160 mm), it often takes 6-7 hours to complete one sample. If the production needs to be tested in a large scale, the test efficiency needs to be improved, the only method is to increase the number of the test devices, namely, a plurality of measurement devices are used for testing simultaneously, and the waiting time of the experiment is shortened. In this case, it is important to reduce the manufacturing costs of the measuring device, making the measuring process easier to operate, and the solution proposed by the present invention can solve this problem exactly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it will be obvious that the drawings in the following description are some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1 is a schematic diagram of a measuring device; FIG. 2 is a top view of FIG. 1; FIG. 3 is a schematic view of support distance adjustment; FIG. 4 is a schematic drawing of a mark drawn on a sample reference plane; FIG. 5 is a schematic view of the adjustment sample and the position of each lever; FIG. 6 is a schematic illustration of test specimen thickness; FIG. 7 is a schematic view of a sample fastened to a milling fixture; FIG. 8 is a schematic representation of sample thickness and sample disturbance versus schematic symbol; FIG. 9 is a schematic illustration of the deformation direction of the sample; FIG. 10 is a schematic diagram showing the direction of deformation of the sample in the negative direction; fig. 11 is a standard drawing.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The utility model provides a novel layer cuts device of method measurement sample residual stress, including measuring base 1, two supporting seats 2, three magnetometer seat 3, three location pin 4, the amesdial 5, two supporting seats 2 are installed on measuring base 1 top surface, and are located the both sides of measuring base 1 respectively, wherein two magnetometer seats 3 are installed in measuring base 1 top surface rear, another magnetometer seat 3 is installed in measuring base 1 top surface one side, and is located one side of supporting 2, supporting seat 2 is located the place ahead of magnetometer seat 3, the amesdial is placed on measuring base 1 top surface.
A new method for measuring residual stress of a sample by a layer cutting method comprises the following steps:
1) Placing the measuring device on a flat test bed, and ensuring no vibration interference in the measuring process;
2) According to the length L, the width W, the thickness T and the corresponding supporting distance L of the sample, the mounting positions of the supporting points are adjusted and fixed, and the supporting distance is controlled within the range of l+/-1 mm; as shown in fig. 3;
step two, positioning a measurement datum point:
1) The sample 6 is marked with the exact center of the reference plane, and the arrow marks are drawn on any two adjacent sides of the reference plane of the sample, the sample is placed on the deformation measuring device, the side marked with the arrow faces the positioning stop rod, as shown in figure 4,
2) The position of the sample on the supporting point is adjusted to enable the axis of the sample to be parallel to the axes of the supporting point and the measuring point, the side positioning stop lever is adjusted to be in contact with the sample, the positioning stop lever is locked, the dial indicator is moved to enable the dial indicator measuring head to be in contact with the center of the reference plane, initial displacement of not less than 0.5mm is achieved, the dial indicator bracket is locked, and the dial indicator pointer is adjusted to the zero scale position; as shown in figure 5 of the drawings,
3) The method comprises the steps of abutting a sample against a positioning stop lever, lifting one end without the positioning stop lever, slowly falling, lifting to ensure that the numerical change of a dial indicator can be observed, slowly moving a pointer can be observed when the sample falls to the pointer type dial indicator, slowly changing the number can be observed before the sample falls to a stop, then pushing the sample against the positioning stop lever, observing whether the dial indicator is still at a zero position or not, repeating the step, and continuously displaying the value within the range of (0.000+/-0.001) mm for 3 times, wherein the current position of a measuring head of the dial indicator is a measuring reference point;
step three, milling and testing processes:
1) Milling layer thickness calculation, wherein the thickness of the removed layer milled each time is t/20+/-0.25 mm for ensuring that at least 10 data points are tested;
2) Testing the thickness of the sample, wherein the thickness is measured at the middle position of the length of the sample; as shown in figure 6 of the drawings,
3) The sample base is stably placed on a fixture seat guide rail to be clamped, a threaded hole of the base faces upwards, a counter bore of the sample corresponds to the threaded hole of the base, and the sample is fixed on the sample base by bolts; as shown in figure 7 of the drawings,
4) Setting processing parameters and milling, wherein sample milling processing is divided into two stages of rough processing and finish processing, typical processing parameters are shown in a table, milling processing is carried out according to the thickness calculated in 1), and severe processing vibration is avoided in the processing process;
table 1 exemplary processing parameters table
| Stage(s) | Single feed amount | Diameter of tool | Maximum feed speed | Rotational speed |
| Rough machining | 1mm | φ60～φ160 | 4500mm/min | 3000r/min. |
| Finishing work | 0.3mm | φ60～φ160 | 800mm/min | 3000r/min. |
5) Measuring deflection, wherein the total deflection of a measurement datum point after the milling of an ith layer is finished is represented by a symbol omega (i), according to the sequence of processing the removed layers, omega (0) represents the initial total deflection of a sample, namely omega (0) =0 mm, the total deflection after the removal of a 1 st layer is omega (1), and the like, the deformation direction of the sample can be divided into positive and negative directions (as shown in fig. 9 and 10), the deformation quantity of the sample can be correspondingly recorded as positive and negative values, the sample is taken down for size measurement after the milling of each removed layer is finished, the sample is placed on a measuring device, a sample reference plane is downward, two sides of the reference plane marked by arrows are abutted against a positioning stop lever, one end without the positioning stop lever is lifted, the sample slowly falls down again, and the sample is repeatedly repeated for 3 times, and if the value change of the dial gauge is not more than +/-0.001 mm, and the current reading of the dial gauge is taken as the total deflection of the sample;
6) Repeating the steps of 2) to 5) until the thickness of the sample reaches half of the original thickness, and recording the sequence of removing the layers, the thickness of the sample and the total deflection each time.
Specifically, in the third step 2), the symbol T (i) is used, i is a milling sequence, the original thickness of the sample is denoted as T (0), that is, T (0) =t, and the thickness of the sample after removing the i-th layer is denoted as T (i).
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. The utility model provides a novel layer cuts device of method measurement sample residual stress which characterized in that: including measuring base (1), two supporting seat (2), three magnetic meter seat (3), three location pin (4), amesdial (5), two supporting seat (2) are installed on measuring base (1) top surface, and are located the both sides of measuring base (1) respectively, wherein two magnetic meter seat (3) are installed in measuring base (1) top surface rear, and another magnetic meter seat (3) is installed in measuring base (1) top surface one side, and is located one side of supporting (2), and supporting seat (2) are located the place ahead of magnetic meter seat (3), and the amesdial is placed on measuring base (1) top surface.
2. A novel method for measuring residual stress of a sample by a layer cutting method, which is characterized by comprising the following steps of: the method comprises the following steps of:
1) Placing the measuring device on a flat test bed, and ensuring no vibration interference in the measuring process;
2) According to the length L, the width W, the thickness T and the corresponding supporting distance L of the sample, the mounting positions of the supporting points are adjusted and fixed, and the supporting distance is controlled within the range of l+/-1 mm;
step two, positioning a measurement datum point:
1) Marking the exact center of the reference plane on the sample (6), drawing arrow marks on any two adjacent sides of the sample reference plane, placing the sample on a deformation measuring device, enabling the side surface with the arrow marks to face a positioning stop rod,
2) The position of the sample on the supporting point is adjusted to enable the axis of the sample to be parallel to the axes of the supporting point and the measuring point, the side positioning stop lever is adjusted to be in contact with the sample, the positioning stop lever is locked, the dial indicator is moved to enable the dial indicator measuring head to be in contact with the center of the reference plane, initial displacement of not less than 0.5mm is achieved, the dial indicator bracket is locked, and the dial indicator pointer is adjusted to the zero scale position;
3) The method comprises the steps of abutting a sample against a positioning stop lever, lifting one end without the positioning stop lever, slowly falling, lifting to ensure that the numerical change of a dial indicator can be observed, slowly moving a pointer can be observed when the sample falls to the pointer type dial indicator, slowly changing the number can be observed before the sample falls to a stop, then pushing the sample against the positioning stop lever, observing whether the dial indicator is still at a zero position or not, repeating the step, and continuously displaying the value within the range of (0.000+/-0.001) mm for 3 times, wherein the current position of a measuring head of the dial indicator is a measuring reference point;
step three, milling and testing processes:
1) Milling layer thickness calculation, wherein the thickness of the removed layer milled each time is t/20+/-0.25 mm for ensuring that at least 10 data points are tested;
2) Testing the thickness of the sample, wherein the thickness is measured at the middle position of the length of the sample;
3) The sample base is stably placed on a fixture seat guide rail to be clamped, a threaded hole of the base faces upwards, a counter bore of the sample corresponds to the threaded hole of the base, and the sample is fixed on the sample base by bolts;
4) Setting processing parameters and milling, wherein sample milling processing is divided into two stages of rough processing and finish processing, and milling processing is carried out according to the thickness calculated in 1), and severe processing vibration is avoided in the processing process;
5) The method comprises the steps of measuring deflection, wherein the total deflection of a measurement datum point after milling of an ith layer removing layer is represented by a symbol omega (i), according to the sequence of processing the removing layer, omega (0) represents the initial total deflection of a sample, namely omega (0) =0mm, the total deflection after removing the 1 st layer is omega (1), and the like, the deformation direction of the sample can be divided into positive and negative directions, the deformation quantity of the sample is correspondingly recorded as positive and negative values, the sample is taken down for size measurement after milling of each removing layer, the sample is placed on a measuring device, a reference plane of the sample is downward, two sides of the reference plane with arrow marks are abutted against a positioning stop lever, one end without the positioning stop lever is lifted, the sample slowly falls down again, and is repeated for 3 times, and if the value change of the dial gauge is not more than +/-0.001 mm, the current reading of the dial gauge is read as the total deflection of the sample;
6) Repeating the steps of 2) to 5) until the thickness of the sample reaches half of the original thickness, and recording the sequence of removing the layers, the thickness of the sample and the total deflection each time.
3. A method of measuring residual stress of a test specimen by a new delamination method according to claim 2, wherein: in the step three, the step 2) is represented by a symbol T (i), i is a milling sequence, the original thickness of the sample is represented by T (0), namely T (0) =t, and the thickness of the sample after the ith layer is removed is recorded as T (i).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310542140.0A CN116558689A (en) | 2023-05-15 | 2023-05-15 | Novel device and method for measuring residual stress of sample by layer cutting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310542140.0A CN116558689A (en) | 2023-05-15 | 2023-05-15 | Novel device and method for measuring residual stress of sample by layer cutting method |
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| CN116558689A true CN116558689A (en) | 2023-08-08 |
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| CN202310542140.0A Pending CN116558689A (en) | 2023-05-15 | 2023-05-15 | Novel device and method for measuring residual stress of sample by layer cutting method |
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| Country | Link |
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| CN (1) | CN116558689A (en) |
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- 2023-05-15 CN CN202310542140.0A patent/CN116558689A/en active Pending
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