CN116546723A - PCB card and error code instrument - Google Patents
PCB card and error code instrument Download PDFInfo
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- CN116546723A CN116546723A CN202310814742.7A CN202310814742A CN116546723A CN 116546723 A CN116546723 A CN 116546723A CN 202310814742 A CN202310814742 A CN 202310814742A CN 116546723 A CN116546723 A CN 116546723A
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- transmission line
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- 239000004020 conductor Substances 0.000 claims abstract description 71
- 230000008054 signal transmission Effects 0.000 claims abstract description 62
- 238000004088 simulation Methods 0.000 claims description 37
- 230000014509 gene expression Effects 0.000 claims description 23
- 239000003989 dielectric material Substances 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 230000035772 mutation Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 51
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L1/00—Arrangements for detecting or preventing errors in the information received
- H04L1/20—Arrangements for detecting or preventing errors in the information received using signal quality detector
- H04L1/203—Details of error rate determination, e.g. BER, FER or WER
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The application discloses PCB integrated circuit board and error code appearance relates to the data transmission field. In the scheme, the PCB board comprises a plurality of signal layers, a signal transmission line on a preset signal layer is fixedly connected with an inner conductor of a coaxial line of a connector, and a conductor on the preset signal layer is connected with an outer conductor of the coaxial line; and the cavity is adjacent to the fixed connection part of the signal transmission line and the inner conductor and is arranged on a plurality of signal layers adjacent to the preset signal layer. In this application, through being provided with the mode of cavity on the adjacent signal layer of fixed junction of signal transmission line and coaxial line's inner conductor, can adjust the impedance of fixed junction to when transmitting the signal to the coaxial line from the signal transmission line on the PCB integrated circuit board, avoid appearing the condition of impedance mutation, and then guaranteed the integrality of signal, and then be applied to in the error code appearance product with it, can reduce the error rate.
Description
Technical Field
The application relates to the field of board card design, in particular to a PCB board card and an error code instrument.
Background
In the production of the error code, along with the increase of bandwidth, higher requirements are put on the high-speed design of the PCB (Printed Circuit Board ) board card, especially on the signal integrity. The signal integrity on a PCB card is largely dependent on the routing of the chip high speed signal pins to the connector, which routing path is typically a microstrip or stripline on the PCB card, which translates into coaxial transmission of the connector. At the position where the PCB edge is connected with the connector, the transmission line model is in a transition state, namely, the transmission line model is converted into coaxial line transmission by a microstrip line or a strip line, and the signal reference ground is converted into an outer conductor of the coaxial connector by a copper foil on the PCB card.
The problem that often occurs in this conversion process is that, due to the field strength distribution, the impedance at the connection position of the connector and the inner conductor is relatively small, while the impedance of the coaxial line in the connector is relatively large, so that in the process of transmitting signals from the PCB board card to the connector, the situation of abrupt impedance change exists, which can affect the signal integrity, and generally represents a larger error rate for the error code meter product.
Disclosure of Invention
The utility model aims at providing a PCB integrated circuit board and error code appearance, through being provided with the mode of cavity on the adjacent signal layer of fixed junction of signal transmission line and coaxial line's inner conductor, can adjust the impedance of fixed junction to when transmitting the signal to the coaxial line from the signal transmission line on the PCB integrated circuit board, avoid appearing the condition of impedance mutation, and then guaranteed the integrality of signal, and then applied to in the error code appearance product with it, can reduce the error rate.
For solving the technical problem, the application provides a PCB board card, include:
the signal transmission lines on the preset signal layers are fixedly connected with the inner conductors of the coaxial lines of the connectors, and the conductors on the preset signal layers are connected with the outer conductors of the coaxial lines;
and the cavity is adjacent to the fixed connection part of the signal transmission line and the inner conductor and is arranged on a plurality of signal layers adjacent to the preset signal layer.
Preferably, the distance between the first central axis of the cavity and the second central axis of the fixed connection is not greater than a distance threshold;
the first central axis and the second central axis are axes perpendicular to the plane of the signal layer.
Preferably, the signal transmission line and the inner conductor are soldered.
Preferably, when the structure of the fixed connection part of the signal transmission line and the inner conductor is a rectangular structure, the projection of the cavity on the preset signal layer is rectangular.
Preferably, the length of the rectangular projection is the same as the length of the rectangular structure, and the width of the rectangular projection is determined according to the dielectric constant, the dielectric thickness and the width of the rectangular structure of the dielectric material of the PCB board card.
Preferably, when the structure of the fixed connection part of the signal transmission line and the inner conductor is a circular structure, the projection of the cavity on the preset signal layer is circular.
Preferably, the diameter of the circular projection is determined according to the dielectric constant, the dielectric thickness and the width of the rectangular structure of the dielectric material of the PCB board.
Preferably, the size of the cavity is determined in the following manner:
constructing a simulation model of the fixed connection part; analyzing the simulation model to obtain a simulation expression related to the impedance of the fixed connection; and determining parameters related to the impedance of the fixed connection according to the simulation expression, and determining the size of the cavity according to the determined parameters.
Preferably, the simulation expression includes at least: an impedance simulation expression of the coaxial line and/or an impedance simulation expression of the signal transmission line.
In order to solve the technical problem, the application further provides an error code instrument which comprises the PCB board card.
The application provides a PCB board card and error code appearance relates to the data transmission field. In the scheme, the PCB board comprises a plurality of signal layers, a signal transmission line on a preset signal layer is fixedly connected with an inner conductor of a coaxial line of a connector, and a conductor on the preset signal layer is connected with an outer conductor of the coaxial line; and the cavity is adjacent to the fixed connection part of the signal transmission line and the inner conductor and is arranged on a plurality of signal layers adjacent to the preset signal layer. In this application, through being provided with the mode of cavity on the adjacent signal layer of fixed junction of signal transmission line and coaxial line's inner conductor, can adjust the impedance of fixed junction to when transmitting the signal to the coaxial line from the signal transmission line on the PCB integrated circuit board, avoid appearing the condition of impedance mutation, and then guaranteed the integrality of signal, and then be applied to in the error code appearance product with it, can reduce the error rate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly explain the drawings needed in the prior art and embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an overall schematic diagram of a horizontal connection between a PCB card and a connector provided in the present application;
fig. 2 is a top view of a horizontal connection between a PCB card and a connector provided in the present application;
fig. 3 is a side view of a board edge of a PCB card and a connector provided in the present application with the connector hidden when the PCB card and the connector are horizontally connected;
fig. 4 is a side view of a board edge with connectors and signal transmission lines hidden when a PCB card and connectors are horizontally connected;
fig. 5 is an overall schematic diagram of a vertical connection between a PCB card and a connector provided in the present application;
fig. 6 is a schematic bottom view of a connector provided in the present application when a PCB card and the connector are vertically connected;
fig. 7 is a side view of a PCB card with a connector hidden when the PCB card and the connector are vertically connected;
FIG. 8 is a cut-away side view of a PCB card and a vertical connector at a solder joint when the PCB card and the connector are vertically connected;
FIG. 9 is a bottom cross-sectional view of a hollowed out portion under a connector pad when a PCB card and a connector are vertically connected;
FIG. 10 is a schematic diagram of simulation results when no cavity is provided in the prior art;
FIG. 11 is a schematic diagram of simulation results after the cavity is set;
reference numerals: the connector comprises a 1-connector, a 2-preset signal layer, a 3-signal transmission line, a 4-inner conductor, a 5-outer conductor, a 6-cavity, a 7-GND via hole, an 8-GND via Kong Qiemian and a 9-fixed connection part.
Detailed Description
The core of the application is to provide a PCB board card and error code appearance, through being provided with the mode of cavity on the adjacent signal layer of fixed junction of signal transmission line and coaxial line's inner conductor, can adjust the impedance of fixed junction to when transmitting the signal to the coaxial line from the signal transmission line on the PCB board card, avoid appearing the condition of impedance mutation, and then guaranteed the integrality of signal, and then applied to in the error code appearance product with it, can reduce the error rate.
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1 to 4, in the related art, a method for solving impedance discontinuity of a soldering section on a PCB board and a connector 1 is as follows: as shown in fig. 1, the microstrip line of the welding section of the coaxial line 4 of the connector 1 and the PCB board card is narrowed (i.e. the width of the connection between the inner conductor 4 and the signal transmission line 3 in fig. 1 is reduced), and the reference ground distance of the control surface layer is increased (i.e. the distance between the outer edge of the inner conductor 4 and the inner edge of the outer conductor 5 in fig. 1 is increased).
For solving the above technical problem, the present application provides a PCB board card, referring to fig. 3-5, the PCB board card includes:
the signal transmission lines 3 on the preset signal layer 2 are fixedly connected with the inner conductor 4 of the coaxial line of the connector 1, and the conductor on the preset signal layer 2 is connected with the outer conductor 5 of the coaxial line (the conductor on the preset signal layer 2 is usually referred to as signal ground, and is characterized by being connected with a large-area copper foil, and the signal layer are connected through a large number of GND through holes, as in the prior art, the conductor is not shown in the figure);
and the cavity 6 is adjacent to the fixed connection 9 of the signal transmission line 3 and the inner conductor 4 and is arranged on a plurality of signal layers adjacent to the preset signal layer 2.
Specifically, the design principle of the present application will be described first: according to the structural characteristics of the connection part of the connector 1 and the signal transmission line 3 on the PCB board card, and analysis of the simulation structure, compared with the field distribution of the coaxial section of the connector 1, the signal reference ground of the fixed connection part 9 of the inner conductor 4 and the signal transmission line 3 is not a cylindrical outer conductor 5 of a coaxial line any more, but a conductor (the conductor can be but is not limited to copper foil on the PCB board card) connected with the outer conductor 5 on the PCB board card; compared with the field distribution of the signal transmission line 3 on the PCB board card (the electromagnetic field of the signal transmission line 3 is mainly distributed in the medium), the field at the fixed connection 9 of the signal transmission line 3 and the inner conductor 4 of the connector 1 is distributed in the medium below the signal transmission line 3, but also in the air medium between the inner conductor 4 of the coaxial line and the copper foil connected with the outer conductor 5 on the PCB board card. The impedance of the fixed connection 9 of the inner conductor 4 of the coaxial line and the signal transmission line 3 thus has both the characteristics of the coaxial line and the characteristics of the signal transmission line 3.
Thus, the characteristic impedance of the inner conductor 4 of the coaxial line can be calculated as:the method comprises the steps of carrying out a first treatment on the surface of the Wherein Z0 is the impedance of the inner conductor 4, a is the diameter of the inner conductor 4 of the coaxial line, b is the inner diameter of the outer conductor 5 of the coaxial line, i.e. the outer diameter of the coaxial medium, +.>For permeability (I)>Is the dielectric constant of the dielectric material of the PCB board card.
The characteristic impedance calculation formula of the signal transmission line 3 is:
；
wherein Z1 is the impedance of the signal transmission line 3, W is the line width of the signal transmission line 3, d is the dielectric thickness,the relative dielectric constant of the dielectric material of the PCB board card.
As can be seen from the calculation formula of the characteristic impedance of the inner conductor 4 of the coaxial line, in order to increase the characteristic impedance Z0, the inner diameter of the outer conductor 5 of the coaxial line, that is, the distance from the inner conductor 4 to the signal reference ground, may be increased; as can be seen from the calculation formula of the characteristic impedance of the signal transmission line 3, the dielectric thickness, that is, the distance between the signal reference ground can be increased to increase the characteristic impedance Z1. Therefore, it can be deduced that the impedance at the position can be improved by increasing the distance between the fixed connection position 9 of the inner conductor 4 of the connector 1 and the signal transmission line 3 and the reference ground of the PCB board card, so that the impedance of the position is close to the impedance of the coaxial line, and further impedance continuity is realized.
According to the above principle, when the signal transmission line 3 on the preset signal layer 2 of the PCB board and the coaxial line inner conductor 4 of the connector 1 are connected in the present application, the fixed connection 9 is adjacent to the fixed connection, and a cavity 6 is disposed on one or several signal layers adjacent to the preset signal layer 2, which is generally understood as: a cavity 6 with a preset size is hollowed out on the adjacent signal layers of the fixed connection part 9 so as to increase the distance between the fixed connection part 9 and the reference ground of the PCB board card, and further increase the impedance of the fixed connection part 9 so as to realize the continuity of the impedance.
The periphery of the cavity 6 is surrounded by a signal layer and/or a fixed connection 9 and/or a surface layer of the connector 1, if one surface of the cavity 6 is not surrounded by the signal layer and/or the fixed connection 9 and/or the surface layer of the connector 1, the signal transmission line 3 is adjacent to the fixed connection 9 of the inner conductor 4, and notches of a plurality of signal layers adjacent to the preset signal layer 2 are formed, and both cases are within the protection scope of the present application, specifically according to practical situations, the present application is not limited herein.
It should be noted that, in the present application, if the PCB board card is placed horizontally, that is, when the signal layer is parallel to the ground, at this time, the plane where the fixed connection 9 is located is parallel to the ground, and then the cavity 6 may be located above or below the fixed connection 9. Similarly, if the PCB board card is placed perpendicular to the ground, that is, when the signal layer is perpendicular to the ground, at this time, the plane where the fixed connection 9 is located is perpendicular to the ground, and this cavity 6 may be located on the left side or the right side of the fixed connection 9, which is specific according to the actual situation, and this application is not limited herein.
Further, the signal transmission line may be a microstrip line or a strip line. The connection mode of the PCB board card and the connector 1 is not limited herein, and the connection mode may be horizontal connection between the PCB board card and the connector 1 shown in fig. 1-4, or vertical connection between the connector 1 and the PCB board card shown in fig. 5-9. The present application is not limited herein, as the specific circumstances may suggest.
In summary, through the mode of this embodiment, can increase the distance between the reference ground of fixed connection department 9 and PCB integrated circuit board, and then adjust the impedance of fixed connection department 9 to realize the continuity of impedance, avoid appearing the condition of impedance mutation, and then guaranteed the integrality of signal, and then applied to in the error code appearance product, can reduce the error rate.
As a preferred embodiment, the distance between the first central axis of the cavity 6 and the second central axis of the fixed connection 9 is not greater than a distance threshold;
the first central axis and the second central axis are both axes perpendicular to the plane of the signal layer.
Specifically, when the cavity 6 is disposed in the present application, the position of the cavity 6 may correspond to the position of the fixed connection 9, which is specifically expressed as that a distance between the first central axis of the cavity 6 and the second central axis of the fixed connection 9 is not greater than a distance threshold. I.e. the cavity 6 is defined below the fixed connection 9. The first central axis is not shown in the figure, but is fixed and unique when it has been defined that the first central axis is perpendicular to the signal layer and is the central axis of the cavity 6. Likewise, the second central axis is not shown in the figures, but after the fixed connection 9 has been defined and defines a second central axis perpendicular to the signal layer and being the central axis of the fixed connection 9, this second central axis is also fixed and unique.
In a specific embodiment, it may be that the first central axis of the cavity 6 coincides with the second central axis of the fixed connection 9. That is, if the fixed connection 9 is above the cavity 6, the cavity 6 may be, but is not limited to, directly below the fixed connection 9.
As a preferred embodiment, when the structure of the fixed connection 9 between the signal transmission line 3 and the inner conductor 4 is a rectangular structure, the projection of the cavity 6 on the preset signal layer 2 is rectangular.
Further, when the structure of the fixed connection portion 9 between the signal transmission line 3 and the inner conductor 4 is a rectangular structure (when the signal transmission line 3 and the inner conductor 4 are connected by welding, the welded section is a rectangular structure), correspondingly, the projection of the cavity 6 on the preset signal layer 2 may be set to be rectangular, so that the projection corresponds to the rectangular structure of the fixed connection portion 9, so that the effect of increasing the impedance of the fixed connection portion 9 is optimal.
As a preferred embodiment, the length of the rectangular projection is the same as the length of the rectangular structure, and the width of the rectangular projection is determined according to the dielectric constant of the dielectric material of the PCB card, the dielectric thickness and the width of the rectangular structure.
Specifically, when the projection of the cavity 6 on the preset signal layer 2 is set to be rectangular, the length of the rectangular projection (which refers to the length along the extending direction of the signal transmission line 3) may be set to be the same as the length of the rectangular structure of the fixed connection portion 9, and correspondingly, the width of the rectangular projection is determined according to the dielectric constant, the dielectric thickness and the width of the rectangular structure of the dielectric material of the PCB board card, and the difference between the impedance of the fixed connection portion 9 and the impedance of the coaxial line is within the preset range through the determined width and length of the rectangular projection and the height of the cavity 6.
According to the field distribution and the characteristic impedance formula analysis, impedance continuity can be realized by hollowing out the adjacent copper foil layers below the welding section of the inner conductor 4 of the connector 1 and the signal transmission line 3.
Specifically, when the cavity 6 is rectangular and the projection of the cavity 6 is rectangular (as shown in fig. 3 and 4), the length along the direction of the signal transmission line 3 is denoted by dy, and the length perpendicular to the direction of the signal transmission line 3 is denoted by dx. The dx and dy are the hollowed dimensions of the copper foil layer below the fixed connection position 9 (welding section) of the inner conductor 4 of the connector 1 and the signal transmission line 3, and dy is generally designed as the pad length of the inner conductor 4 of the connector 1 on the PCB board card, and dx needs to be determined according to the three parameters of the dielectric constant of the dielectric material, the dielectric thickness and the pad width of the inner conductor 4 of the connector 1. In the design of the PCB board card with a plurality of signal layers, according to the requirement of the optimal design, the copper foil of the adjacent layer below is sometimes hollowed out, and better impedance continuity cannot be obtained, so that the continuous hollowed-out treatment of the copper foil of the lower layer is needed to be considered. As a preferred embodiment, when the cavity 6 is provided with a plurality of signal layers, the shape and size of the cross section formed by the different signal layers and the cavity 6 may be the same or different. That is, the dx and dy values of the copper foil of different layers may take different values.
As a preferred embodiment, when the structure of the fixed connection 9 between the signal transmission line 3 and the inner conductor 4 is a circular structure, the projection of the cavity 6 on the preset signal layer 2 is a circle.
Further, when the structure of the fixed connection portion 9 between the signal transmission line 3 and the inner conductor 4 is a circular structure (when the signal transmission line 3 and the inner conductor 4 are connected by welding, the welded section is a circular structure), correspondingly, the projection of the cavity 6 on the preset signal layer 2 may be set to be circular, so that the projection corresponds to the circular structure of the fixed connection portion 9, so that the effect of increasing the impedance of the fixed connection portion 9 is optimal.
As a preferred embodiment, the diameter of the circular projection is determined according to the dielectric constant of the dielectric material of the PCB card, the dielectric thickness and the width of the rectangular structure.
Specifically, when the projection of the cavity 6 on the preset signal layer 2 is set to be circular, the diameter of the circular projection is determined according to the dielectric constant, the dielectric thickness and the width of the rectangular structure of the dielectric material of the PCB board card, and the difference between the impedance of the fixed connection 9 and the impedance of the coaxial line is within the preset range through the determined width, length and height of the circular projection.
As shown in fig. 5-9, one exemplary embodiment is: the connector 1 is vertically connected with the PCB board card, and the analysis manner is similar to that of the connector 1 shown in fig. 1-4, which is that the connector 1 is horizontally connected with the PCB board card, and a better impedance continuity is required to be obtained by hollowing out the lower part of the bonding pad. Specifically, a regular or irregular cylindrical structure is hollowed out below the bonding pad connected with the inner conductor 4 of the connector 1, and the impedance adjustment of the welding part can be realized by adjusting the diameter of the circular hollowed out, so that the impedance of the coaxial line is approximate to that of the coaxial line. The GND via hole 7 in fig. 7-9 is a conventional structure when the PCB board card is designed, and will not be described herein. Reference numeral 8 in fig. 8 is a GND through Kong Qiemian for connecting the ground signals of the respective layers. By "ground" is understood the real-time return path of the signal, which is typically a microstrip line.
As a preferred embodiment, the signal transmission line 3 and the inner conductor 4 are soldered.
The present embodiment is intended to define a specific way of connecting the signal transmission line 3 with the inner conductor 4, which may be, but is not limited to, by means of soldering. By means of welding, signals can be reliably transmitted between the signal transmission line 3 and the coaxial line.
As a preferred embodiment, the cavity 6 is dimensioned in such a way that:
constructing a simulation model of the fixed joint 9; analyzing the simulation model to obtain a simulation expression related to the impedance of the fixed connection 9; parameters related to the impedance of the fixed connection 9 are determined from the simulation expression and the dimensions of the cavity 6 are determined from the determined parameters.
Specifically, the embodiment provides a specific implementation manner of determining the size of the cavity 6, and in different PCB boards, the size of the cavity 6 to be designed may be different, and the specific manner of obtaining the size of the cavity 6 may be, but is not limited to,: a simulation model of the fixed connection 9 is built in advance (the simulation model comprises the fixed connection 9 and/or the cavity 6), the simulation model is analyzed to obtain a corresponding simulation expression, parameters related to the impedance of the fixed connection 9 are determined according to the simulation expression, and the size of the cavity 6 is determined according to the determined parameters.
That is, the size of the cavity 6 is calculated in a simulation manner, and the cavity 6 is designed on the PCB board card according to the calculated size.
As a preferred embodiment, the simulation expression includes at least: an impedance simulation expression of the coaxial line and/or an impedance simulation expression of the signal transmission line 3.
In view of the fact that the impedance of the fixed connection 9 is mainly related to the coaxial line and the signal transmission line 3, correspondingly, in the present application, when determining the simulation expression by means of the established simulation model, the simulation expression comprises at least an impedance simulation expression corresponding to the coaxial line and/or an impedance simulation expression corresponding to the signal transmission line 3.
In another embodiment, a simulated expression of the cavity 6 is included in addition to the two simulated expressions described above.
Specifically, as shown in fig. 10 and 11, fig. 10 is a schematic diagram of simulation results when no cavity is provided in the prior art. Fig. 11 is a schematic diagram of simulation results after the cavity is set. It can be seen that after the corresponding hollowing treatment is performed (that is, after the cavity 6 is arranged on the adjacent signal layer of the fixed connection part 9), the optimization effect of the S parameter is obvious, the high frequency band of the transmission return loss (S absolute value) is improved from about 10dB to 25dB, and the influence of standing wave superposition in the signal transmission process on the signal quality can be obviously improved. The structural design ensures that the transmission line has the characteristic of continuous impedance, reduces the energy of reflected wave and simultaneously transmits the signal energy to the maximum extent, so that better signal integrity can be obtained, and the error code meter equipment has lower error rate.
For solving above-mentioned technical problem, this application still provides an error code appearance, including foretell PCB integrated circuit board.
For the description of the error detector, refer to the above embodiments, and the description is omitted herein.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A PCB card, comprising:
the signal transmission lines on the preset signal layers are fixedly connected with the inner conductors of the coaxial lines of the connectors, and the conductors on the preset signal layers are connected with the outer conductors of the coaxial lines;
and the cavity is adjacent to the fixed connection part of the signal transmission line and the inner conductor and is arranged on a plurality of signal layers adjacent to the preset signal layer.
2. The PCB card of claim 1, wherein a distance between a first central axis of the cavity and a second central axis of the fixed connection is not greater than a distance threshold;
the first central axis and the second central axis are axes perpendicular to the plane of the signal layer.
3. The PCB card of claim 1, wherein the signal transmission line is soldered to the inner conductor.
4. The PCB card of claim 1, wherein when the structure of the fixed connection between the signal transmission line and the inner conductor is a rectangular structure, a projection of the cavity on the preset signal layer is rectangular.
5. The PCB card of claim 4, wherein a length of the rectangular projection is the same as a length of the rectangular structure, and a width of the rectangular projection is determined based on a dielectric constant of a dielectric material of the PCB card, a dielectric thickness, and a width of the rectangular structure.
6. The PCB card of claim 1, wherein when the structure of the fixed connection between the signal transmission line and the inner conductor is a circular structure, the projection of the cavity on the preset signal layer is circular.
7. The PCB card of claim 4, wherein the diameter of the circular projection is determined based on a dielectric constant of a dielectric material of the PCB card, a dielectric thickness, and a width of the rectangular structure.
8. The PCB card of any one of claims 1-7, wherein the cavity is sized in the manner of:
constructing a simulation model of the fixed connection part; analyzing the simulation model to obtain a simulation expression related to the impedance of the fixed connection; and determining parameters related to the impedance of the fixed connection according to the simulation expression, and determining the size of the cavity according to the determined parameters.
9. The PCB card of claim 8, wherein the simulation expression includes at least: an impedance simulation expression of the coaxial line and/or an impedance simulation expression of the signal transmission line.
10. An error code apparatus comprising a PCB card as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310814742.7A CN116546723A (en) | 2023-07-05 | 2023-07-05 | PCB card and error code instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310814742.7A CN116546723A (en) | 2023-07-05 | 2023-07-05 | PCB card and error code instrument |
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| CN116546723A true CN116546723A (en) | 2023-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310814742.7A Pending CN116546723A (en) | 2023-07-05 | 2023-07-05 | PCB card and error code instrument |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350312A (en) * | 1993-06-04 | 1994-12-22 | Nec Corp | Connection structure between coaxial connector and multi-layer printed circuit board |
| JP2001177311A (en) * | 1999-12-21 | 2001-06-29 | Oki Electric Ind Co Ltd | Connection structure between coaxial connector and planer circuit board |
| JP2009054667A (en) * | 2007-08-24 | 2009-03-12 | Nec Corp | Multiplayer printed circuit board, connection structure of the multilayer printed circuit board and coaxial connector |
| US20110234473A1 (en) * | 2008-12-16 | 2011-09-29 | Fujikura Ltd. | Cable connector and antenna component |
| CN110797618A (en) * | 2019-11-14 | 2020-02-14 | 陕西索飞电子科技有限公司 | Microstrip coaxial connection structure |
-
2023
- 2023-07-05 CN CN202310814742.7A patent/CN116546723A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350312A (en) * | 1993-06-04 | 1994-12-22 | Nec Corp | Connection structure between coaxial connector and multi-layer printed circuit board |
| JP2001177311A (en) * | 1999-12-21 | 2001-06-29 | Oki Electric Ind Co Ltd | Connection structure between coaxial connector and planer circuit board |
| JP2009054667A (en) * | 2007-08-24 | 2009-03-12 | Nec Corp | Multiplayer printed circuit board, connection structure of the multilayer printed circuit board and coaxial connector |
| US20110234473A1 (en) * | 2008-12-16 | 2011-09-29 | Fujikura Ltd. | Cable connector and antenna component |
| CN110797618A (en) * | 2019-11-14 | 2020-02-14 | 陕西索飞电子科技有限公司 | Microstrip coaxial connection structure |
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Application publication date: 20230804 |