CN116544198B - 一种电力装置组件及其制造方法 - Google Patents

一种电力装置组件及其制造方法 Download PDF

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Publication number
CN116544198B
CN116544198B CN202310094982.4A CN202310094982A CN116544198B CN 116544198 B CN116544198 B CN 116544198B CN 202310094982 A CN202310094982 A CN 202310094982A CN 116544198 B CN116544198 B CN 116544198B
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CN
China
Prior art keywords
power device
power
assembly
cavity
substrate
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Active
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CN202310094982.4A
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English (en)
Chinese (zh)
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CN116544198A (zh
Inventor
周锋
刘阳河
请川纮嗣
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Toyota Motor Engineering and Manufacturing North America Inc
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Toyota Motor Engineering and Manufacturing North America Inc
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Publication of CN116544198A publication Critical patent/CN116544198A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
CN202310094982.4A 2022-02-01 2023-02-01 一种电力装置组件及其制造方法 Active CN116544198B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/590,232 2022-02-01
US17/590,232 US11997838B2 (en) 2022-02-01 2022-02-01 Power device assemblies and methods of fabricating the same

Publications (2)

Publication Number Publication Date
CN116544198A CN116544198A (zh) 2023-08-04
CN116544198B true CN116544198B (zh) 2025-05-20

Family

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CN202310094982.4A Active CN116544198B (zh) 2022-02-01 2023-02-01 一种电力装置组件及其制造方法

Country Status (3)

Country Link
US (1) US11997838B2 (enExample)
JP (1) JP7564261B2 (enExample)
CN (1) CN116544198B (enExample)

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JP2022073782A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073783A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073781A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073784A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073780A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022094242A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094239A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094241A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094238A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094240A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP7367715B2 (ja) * 2021-03-02 2023-10-24 株式会社三洋物産 遊技機
US20230328933A1 (en) * 2022-04-11 2023-10-12 Honeywell International Inc. Integrated heat spreader
US12108563B2 (en) * 2022-07-27 2024-10-01 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having embedded power electronics devices
US11869760B1 (en) * 2022-07-27 2024-01-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating layer
US12165954B2 (en) * 2022-08-19 2024-12-10 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating S-cells
US12096596B2 (en) * 2022-10-18 2024-09-17 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics device assemblies including dual graphite layers and cold plates incorporating the same
US20250227894A1 (en) * 2024-01-05 2025-07-10 Toyota Motor Engineering & Manufacturing North America, Inc. Electronic-cell assemblies including single-layer graphite layer

Citations (1)

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JP2005005528A (ja) * 2003-06-12 2005-01-06 Hitachi Metals Ltd 半導体素子搭載用モジュール

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US6906404B2 (en) 2003-05-16 2005-06-14 Ballard Power Systems Corporation Power module with voltage overshoot limiting
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Also Published As

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US11997838B2 (en) 2024-05-28
US20230247807A1 (en) 2023-08-03
JP7564261B2 (ja) 2024-10-08
JP2023112686A (ja) 2023-08-14
CN116544198A (zh) 2023-08-04

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