CN116541669A - Visual and predictive processing system for data acquisition of silicon wafer polishing machine - Google Patents
Visual and predictive processing system for data acquisition of silicon wafer polishing machine Download PDFInfo
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- CN116541669A CN116541669A CN202310285886.8A CN202310285886A CN116541669A CN 116541669 A CN116541669 A CN 116541669A CN 202310285886 A CN202310285886 A CN 202310285886A CN 116541669 A CN116541669 A CN 116541669A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000005498 polishing Methods 0.000 title claims abstract description 68
- 238000012545 processing Methods 0.000 title claims abstract description 33
- 230000000007 visual effect Effects 0.000 title claims description 3
- 238000012360 testing method Methods 0.000 claims abstract description 40
- 238000003745 diagnosis Methods 0.000 claims abstract description 20
- 238000012795 verification Methods 0.000 claims abstract description 12
- 230000006854 communication Effects 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims abstract description 8
- 230000007175 bidirectional communication Effects 0.000 claims abstract description 4
- 238000012423 maintenance Methods 0.000 claims description 18
- 230000008859 change Effects 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 9
- 238000012800 visualization Methods 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000013500 data storage Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 description 5
- 238000006731 degradation reaction Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/005—Testing of complete machines, e.g. washing-machines or mobile phones
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/10—Pre-processing; Data cleansing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/20—Administration of product repair or maintenance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
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- Business, Economics & Management (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Biology (AREA)
- Evolutionary Computation (AREA)
- Bioinformatics & Computational Biology (AREA)
- General Engineering & Computer Science (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Artificial Intelligence (AREA)
- Life Sciences & Earth Sciences (AREA)
- Human Resources & Organizations (AREA)
- Economics (AREA)
- Entrepreneurship & Innovation (AREA)
- Marketing (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Strategic Management (AREA)
- Tourism & Hospitality (AREA)
- General Business, Economics & Management (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a system which comprises a data acquisition and storage module, a data processing module and a diagnosis prediction module; the data acquisition and storage module is in bidirectional communication with the silicon wafer polishing machine through a communication interface, so that the silicon wafer polishing machine can receive and store verification test data of the silicon wafer polishing machine, and is in communication with the data processing module through a protocol interface, and daily test data of the silicon wafer polishing machine stored in a database are called to finish recognition and rejection of singular values; the data processing module is communicated with the diagnosis prediction module through a protocol interface.
Description
Technical Field
The invention relates to the technical field of silicon wafer polishing machines, in particular to a silicon wafer polishing machine data acquisition visualization and prediction processing system.
Background
At present, the measurement and detection at home and abroad are all based on a certain or a plurality of high-precision silicon wafer polishing machines, signals or data generated by the silicon wafer polishing machines are compared with standard signals or data, and when the error is within a specified range, the detected instrument is judged to be qualified. As whether the performance of the standard silicon wafer polishing machine is qualified or not, the current method is a method combining the self-inspection and the annual inspection of the silicon wafer polishing machine. The self-inspection can find out whether the silicon wafer polishing machine has faults or not, and prompt an appraiser to remove the faults in time; the annual inspection can find out the performance degradation condition when the silicon wafer polishing machine has not failed, but cannot find out the performance degradation condition and the performance change curve when the silicon wafer polishing machine has not failed in the annual inspection period.
If the silicon wafer polishing machine is subjected to preventive maintenance by utilizing reliability prediction and experience value estimation, the performance degradation and fault condition of the silicon wafer polishing machine can be reduced to a certain extent, but the condition that the performance degradation is not found in time still exists; and preventive maintenance is performed when performance degradation or failure of the silicon wafer polisher has not occurred, there may be an excessive maintenance situation, resulting in an increase in maintenance costs. Therefore, a state prediction processing system of a silicon wafer polishing machine is provided.
Disclosure of Invention
First, the technical problem to be solved
In order to overcome the defects in the prior art, a silicon wafer polishing machine data acquisition visualization and prediction processing system is provided, and the problems in the technical background can be solved.
(II) technical scheme
The invention is realized by the following technical scheme: the invention provides a data acquisition visualization and prediction processing system of a silicon wafer polishing machine, which comprises a data acquisition and storage module, a data processing module and a diagnosis prediction module; the data acquisition and storage module is in bidirectional communication with the silicon wafer polishing machine through a communication interface, so that the silicon wafer polishing machine can receive and store verification test data of the silicon wafer polishing machine, and is in communication with the data processing module through a protocol interface, and daily test data of the silicon wafer polishing machine stored in a database are called to finish recognition and rejection of singular values; the data processing module is communicated with the diagnosis prediction module through a protocol interface.
Further, the data acquisition and storage module comprises a data receiving unit, a data filtering unit, a format conversion unit, an identification binding unit and a data storage unit which are connected in sequence; the data receiving unit is used for recording verification test data of the silicon wafer polishing machine on the silicon wafer polishing machine and continuously or periodically collecting state characteristic parameters of the silicon wafer polishing machine; the data filtering unit is used for filtering the received verification detection data and extracting effective test data; the format conversion unit is used for converting the filtered effective test data or the manually input data into a uniform data format and binding the unique identifier of the silicon wafer polishing machine for each piece of data; the identification binding unit is used for receiving the unique identification input by man-machine interaction and binding the unique identification of the silicon wafer polishing machine with effective test data; the data storage unit is used for storing test data into a database.
Further, the data processing module comprises a data curve fitting unit, a singular value identification unit and a singular value eliminating unit which are connected in sequence; the data curve fitting single pair of the change curves of the test data are subjected to sectional fitting treatment, the average value of the test data of the previous two times and the test data of the current time is used as a curve fitting point, and each fitting point is connected into a curve; the singular value identification unit is used for identifying singular values of test data according to the test precision index of the tested silicon wafer polishing machine and the limit range of data jump and combining the data change curves before and after the jump point; the singular value eliminating unit is used for eliminating data which do not accord with the data change curve and obviously exceed the jump limit range.
Further, the diagnosis and prediction module comprises a fault diagnosis unit and a state prediction unit which are connected in sequence; the fault diagnosis unit is used for determining whether the related diagnosis object has faults or not according to the effective data after the data processing and the fault judgment criterion; the state prediction unit is used for visually displaying the evolution trend of each parameter of the silicon wafer polishing machine in a certain time range by inquiring and analyzing the effective data after data processing, and performing state prediction on the components or performance parameters with gradual change rules, so that a basis is provided for maintenance and replacement of the silicon wafer polishing machine.
(III) beneficial effects
Compared with the prior art, the invention has the following beneficial effects:
the state prediction processing system of the silicon wafer polishing machine, which is provided by the invention, utilizes the verification test data of the silicon wafer polishing machine to carry out analysis prediction, and does not directly test or detect the silicon wafer polishing machine instrument, and through a large amount of data analysis, whether the high-precision silicon wafer polishing machine instrument is in a normal state or is in a state development trend for a period of time in the future is determined, so that the technical state of the silicon wafer polishing machine instrument can be accurately mastered in time, the support is accurately maintained, the operation reliability of the system is improved, and the technical support is provided for the maintenance of the silicon wafer polishing machine instrument based on the state prediction; the system has the functions of health assessment, state prediction, decision suggestion, man-machine interaction and the like; the collected metering verification data is utilized, so that the data integrity is ensured, and meanwhile, the data analysis efficiency is improved; a multi-dimensional decision-making library and a maintenance scheme database are established, the maintenance scheme database covers all replaceable boards inside the instrument of the silicon wafer polishing machine, possible reasons of board faults and influences on the upper and lower levels are provided, maintenance suggestions comprising maintenance modes, maintenance time, maintenance personnel, maintenance spare parts, maintenance tools, detection equipment and the like are provided, a standardized maintenance operation flow is formed, the scientificity of maintenance decisions is improved, and the method is worthy of popularization and use.
Detailed Description
The present invention will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The silicon wafer polishing machine data acquisition visualization and prediction processing system comprises a data acquisition and storage module, a data processing module and a diagnosis prediction module; the data acquisition and storage module is in bidirectional communication with the silicon wafer polishing machine through a communication interface, so that the silicon wafer polishing machine can receive and store verification test data of the silicon wafer polishing machine, and is in communication with the data processing module through a protocol interface, and daily test data of the silicon wafer polishing machine stored in a database are called to finish recognition and rejection of singular values; the data processing module is communicated with the diagnosis prediction module through a protocol interface.
The data acquisition and storage module comprises a data receiving unit, a data filtering unit, a format conversion unit, an identification binding unit and a data storage unit which are connected in sequence; the data receiving unit is used for recording verification test data of the silicon wafer polishing machine on the silicon wafer polishing machine and continuously or periodically collecting state characteristic parameters of the silicon wafer polishing machine; the data filtering unit is used for filtering the received verification detection data and extracting effective test data; the format conversion unit is used for converting the filtered effective test data or the manually input data into a uniform data format and binding the unique identifier of the silicon wafer polishing machine for each piece of data; the identification binding unit is used for receiving the unique identification input by man-machine interaction and binding the unique identification of the silicon wafer polishing machine with effective test data; the data storage unit is used for storing test data into a database, and the data processing module comprises a data curve fitting unit, a singular value identification unit and a singular value eliminating unit which are connected in sequence; the data curve fitting single pair of the change curves of the test data are subjected to sectional fitting treatment, the average value of the test data of the previous two times and the test data of the current time is used as a curve fitting point, and each fitting point is connected into a curve; the singular value identification unit is used for identifying singular values of test data according to the test precision index of the tested silicon wafer polishing machine and the limit range of data jump and combining the data change curves before and after the jump point; the singular value eliminating unit is used for eliminating data which does not accord with the data change curve and obviously exceeds the jump limit range, and the diagnosis prediction module comprises a fault diagnosis unit and a state prediction unit which are connected in sequence; the fault diagnosis unit is used for determining whether the related diagnosis object has faults or not according to the effective data after the data processing and the fault judgment criterion; the state prediction unit is used for visually displaying the evolution trend of each parameter of the silicon wafer polishing machine in a certain time range by inquiring and analyzing the effective data after data processing, and performing state prediction on the components or performance parameters with gradual change rules, so that a basis is provided for maintenance and replacement of the silicon wafer polishing machine.
The above examples are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Various modifications and improvements of the technical scheme of the present invention will fall within the protection scope of the present invention without departing from the design concept of the present invention, and the technical content of the present invention is fully described in the claims.
Claims (4)
1. The visual and predictive processing system for the data acquisition of the silicon wafer polishing machine is characterized in that: the system comprises a data acquisition and storage module, a data processing module and a diagnosis prediction module; the data acquisition and storage module is in bidirectional communication with the silicon wafer polishing machine through a communication interface, so that the silicon wafer polishing machine can receive and store verification test data of the silicon wafer polishing machine, and is in communication with the data processing module through a protocol interface, and daily test data of the silicon wafer polishing machine stored in a database are called to finish recognition and rejection of singular values; the data processing module is communicated with the diagnosis prediction module through a protocol interface.
2. The silicon wafer polishing machine data acquisition visualization and prediction processing system as set forth in claim 1, wherein: the data acquisition and storage module comprises a data receiving unit, a data filtering unit, a format conversion unit, an identification binding unit and a data storage unit which are connected in sequence; the data receiving unit is used for recording verification test data of the silicon wafer polishing machine on the silicon wafer polishing machine and continuously or periodically collecting state characteristic parameters of the silicon wafer polishing machine; the data filtering unit is used for filtering the received verification detection data and extracting effective test data; the format conversion unit is used for converting the filtered effective test data or the manually input data into a uniform data format and binding the unique identifier of the silicon wafer polishing machine for each piece of data; the identification binding unit is used for receiving the unique identification input by man-machine interaction and binding the unique identification of the silicon wafer polishing machine with effective test data; the data storage unit is used for storing test data into a database.
3. The silicon wafer polishing machine data acquisition visualization and prediction processing system as set forth in claim 1, wherein: the data processing module comprises a data curve fitting unit, a singular value identification unit and a singular value rejection unit which are sequentially connected; the data curve fitting single pair of the change curves of the test data are subjected to sectional fitting treatment, the average value of the test data of the previous two times and the test data of the current time is used as a curve fitting point, and each fitting point is connected into a curve; the singular value identification unit is used for identifying singular values of test data according to the test precision index of the tested silicon wafer polishing machine and the limit range of data jump and combining the data change curves before and after the jump point; the singular value eliminating unit is used for eliminating data which do not accord with the data change curve and obviously exceed the jump limit range.
4. The silicon wafer polishing machine data acquisition visualization and prediction processing system as set forth in claim 1, wherein: the diagnosis prediction module comprises a fault diagnosis unit and a state prediction unit which are connected in sequence; the fault diagnosis unit is used for determining whether the related diagnosis object has faults or not according to the effective data after the data processing and the fault judgment criterion; the state prediction unit is used for visually displaying the evolution trend of each parameter of the silicon wafer polishing machine in a certain time range by inquiring and analyzing the effective data after data processing, and performing state prediction on the components or performance parameters with gradual change rules, so that a basis is provided for maintenance and replacement of the silicon wafer polishing machine.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310285886.8A CN116541669A (en) | 2023-03-22 | 2023-03-22 | Visual and predictive processing system for data acquisition of silicon wafer polishing machine |
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| CN202310285886.8A CN116541669A (en) | 2023-03-22 | 2023-03-22 | Visual and predictive processing system for data acquisition of silicon wafer polishing machine |
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| CN116541669A true CN116541669A (en) | 2023-08-04 |
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| CN202310285886.8A Pending CN116541669A (en) | 2023-03-22 | 2023-03-22 | Visual and predictive processing system for data acquisition of silicon wafer polishing machine |
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| Country | Link |
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| CN (1) | CN116541669A (en) |
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- 2023-03-22 CN CN202310285886.8A patent/CN116541669A/en active Pending
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