CN116541233A

CN116541233A - Solid state disk, monitoring system, method, server, equipment and medium

Info

Publication number: CN116541233A
Application number: CN202310368803.1A
Authority: CN
Inventors: 贾保明
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2023-04-07
Filing date: 2023-04-07
Publication date: 2023-08-04

Abstract

The invention provides a solid state disk, a monitoring system, a method, a server, equipment and a medium, wherein the solid state disk comprises: the device comprises a microcontroller, a flash memory controller, a plurality of flash memory chips, a shell, a plurality of temperature sensors and a first integrated circuit bus; each temperature sensor is connected with the microcontroller through a first integrated circuit bus and is used for collecting temperature data at a temperature sensitive position; the microcontroller is used for reading temperature data of the temperature sensor through the first integrated circuit bus and forwarding the temperature data to the target electronic device. According to the solid state disk, the monitoring system, the method, the server, the equipment and the medium, the solid state disk can realize the self-monitoring of the working temperature on the premise of not influencing the normal operation, the accuracy, the flexibility and the efficiency of the self-monitoring of the working temperature are higher, the operation stability of the solid state disk can be improved, and the perception of a user can be improved.

Description

Solid state disk, monitoring system, method, server, equipment and medium

Technical Field

The present invention relates to the field of computer technologies, and in particular, to a solid state disk, a monitoring system, a method, a server, a device, and a medium.

Background

The higher the sensitivity of the solid state disk to temperature is, the higher the working temperature of the solid state disk is, and the poorer the performance stability of the solid state disk is.

However, in the prior art, on the premise of not affecting the normal operation of the system in which the solid state disk is located, the working temperature of the solid state disk is difficult to accurately monitor. Therefore, how to monitor the working temperature of the solid state disk more accurately without affecting the normal operation of the system where the solid state disk is located is a technical problem to be solved in the art.

Disclosure of Invention

The invention provides a solid state disk, a monitoring system, a method, a server, equipment and a medium, which are used for solving the defect that the working temperature of the solid state disk is difficult to accurately monitor on the premise of not influencing the normal operation of the system in which the solid state disk is positioned in the prior art, and realizing more accurate monitoring of the working temperature of the solid state disk on the premise of not influencing the normal operation of the system in which the solid state disk is positioned.

The invention provides a solid state disk, comprising: the device comprises a microcontroller, a flash memory controller, a plurality of flash memory chips, a shell, a plurality of temperature sensors and a first integrated circuit bus;

each temperature sensor is connected with the microcontroller through the first integrated circuit bus and is used for collecting temperature information of a temperature sensitive position;

The microcontroller is used for reading the temperature data of the temperature sensor through the first integrated circuit bus and forwarding the temperature data to target electronic equipment;

each of the temperature sensitive locations is determined based on a plurality of locations of a target flash chip, a location of a heat sink on the housing, and a location of the flash controller; the target flash memory chip is the flash memory chip which is farthest from the shell in the flash memory chips.

According to the solid state disk provided by the invention, the temperature sensor is further used for sending the temperature data acquired by the temperature sensor to the microcontroller through the first integrated circuit bus under the condition of receiving the first query request;

the first query request is used for requesting the temperature acquired by the temperature sensor.

According to the solid state disk provided by the invention, the first query request is sent to the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that the target electronic device receives the first input.

The solid state disk provided by the invention further comprises: a standby power management chip;

The standby power management chip is connected with the microcontroller through the first integrated circuit bus;

the microcontroller is also used for reading the stored data in the standby power management chip through the first integrated circuit bus and forwarding the stored data to the target electronic device.

According to the solid state disk provided by the invention, the standby power management chip is further used for sending the storage data to the microcontroller through the first integrated circuit bus under the condition of receiving the second query request so that the microcontroller can forward the storage data to the target electronic equipment;

the second query request is used for requesting the stored data in the standby power management chip.

According to the solid state disk provided by the invention, the second query request is sent to the standby power management chip through the microcontroller and the first integrated circuit bus under the condition that the target electronic device receives the second input.

The solid state disk provided by the invention further comprises: a power consumption monitoring chip;

the power consumption monitoring chip is arranged at a preset position and is connected with the microcontroller through the first integrated circuit bus;

The power consumption monitoring chip is used for acquiring power consumption data of the solid state disk;

the microcontroller is further configured to read the power consumption data through the first integrated circuit bus and forward the power consumption data to the target electronic device;

and determining the preset position based on the position of the voltage output end pin of the standby power management chip.

According to the solid state disk provided by the invention, the power consumption monitoring chip is further used for sending the power consumption data to the microcontroller through the first integrated circuit bus under the condition of receiving a third query request;

the third query request is used for requesting the power consumption data acquired by the power consumption monitoring chip.

According to the solid state disk provided by the invention, the third query request is sent to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus under the condition that the target electronic device receives the third input.

The solid state disk provided by the invention further comprises: a universal asynchronous receiver transmitter serial port;

the flash memory controller is connected with the microcontroller through a second integrated circuit bus; the universal asynchronous receiver/transmitter serial port is arranged on the second integrated circuit bus;

The universal asynchronous receiver transmitter serial port is used for outputting first abnormal information representing that the flash memory controller is in an abnormal working state under the condition that the flash memory controller is in the abnormal working state;

the universal asynchronous receiver transmitter serial port is also used for outputting second abnormal information representing that the microcontroller is in an abnormal working state under the condition that the microcontroller is in the abnormal working state;

the universal asynchronous receiver transmitter serial port is further configured to output third abnormal information indicating a communication failure between the target electronic device and the temperature sensor in case of the communication failure between the target electronic device and the temperature sensor.

The solid state disk provided by the invention further comprises: a connection assembly and a system management bus;

the connecting component and the system management bus are used for connecting the target electronic device and the flash memory controller;

the connection component and the system management bus are also used to connect the target electronic device and the microcontroller.

The invention also provides a monitoring system comprising: the solid state disk and the target electronic device as described above; the target electronic equipment is respectively connected with a microcontroller and a flash memory controller in the solid state disk;

The target electronic device is used for reading working state information of the microcontroller and the flash memory controller through a first integrated circuit bus under the condition that a first input is received, reading a slave address of the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that target working state information which indicates that the microcontroller and the flash memory controller are in a normal working state is read, and sending a first query request to the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that the slave address of the temperature sensor is read;

the target electronic device is also used for receiving temperature data returned by the temperature sensor through the first integrated circuit bus and the microcontroller.

According to the monitoring system provided by the invention, the target electronic equipment is further used for reading the working state information of the microcontroller and the flash memory controller through the first integrated circuit bus under the condition that the second input is received, reading the slave address of the standby power management chip through the microcontroller and the first integrated circuit bus under the condition that the target working state information is read, and sending a second query request to the standby power management chip through the microcontroller and the first integrated circuit bus under the condition that the slave address of the standby power management chip is read;

The target electronic device is further used for receiving storage data returned by the standby power management chip through the first integrated circuit bus and the microcontroller.

According to the monitoring system provided by the invention, the target electronic device is further used for reading the working state information of the microcontroller and the flash memory controller through the first integrated circuit bus under the condition that the third input is received, reading the slave address of the power consumption monitoring chip through the microcontroller and the first integrated circuit bus under the condition that the target working state information is read, and sending a third query request to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus under the condition that the slave address of the power consumption monitoring chip is read;

the target electronic device is further configured to receive power consumption returned by the power consumption monitoring chip through the first integrated circuit bus and the microcontroller.

The invention also provides a monitoring method based on the monitoring system, which comprises the following steps:

under the condition of receiving the first input, reading working state information of a microcontroller and a flash memory controller in the solid state disk through a first integrated circuit bus;

Reading a slave address of a temperature sensor through the microcontroller and the first integrated circuit bus under the condition that target working state information indicating that the microcontroller and the flash memory controller are in a normal working state is read;

sending the first query request to the temperature sensor through the microcontroller and the first integrated circuit bus if the slave address of the temperature sensor is read;

and receiving the temperature returned by the temperature sensor through the first integrated circuit bus and the microcontroller.

According to the monitoring method provided by the invention, the method further comprises the following steps:

reading working state information of the microcontroller and the flash memory controller through a first integrated circuit bus under the condition that a second input is received;

under the condition that the target working state information is read, reading a slave address of a standby power management chip through the microcontroller and the first integrated circuit bus;

under the condition that the slave address of the standby power management chip is read, a second query request is sent to the standby power management chip through the microcontroller and the first integrated circuit bus;

And receiving storage data returned by the standby power management chip through the first integrated circuit bus and the microcontroller.

reading working state information of the microcontroller and the flash memory controller through a first integrated circuit bus under the condition that a third input is received;

under the condition that the target working state information is read, reading the slave address of the power consumption monitoring chip through the microcontroller and the first integrated circuit bus;

under the condition that the slave address of the power consumption monitoring chip is read, a third query request is sent to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus;

and receiving the power consumption returned by the power consumption monitoring chip through the first integrated circuit bus and the microcontroller.

The invention also provides a server, comprising: the solid state disk as described above.

The invention also provides an electronic device comprising a memory, a target electronic device and a computer program stored on the memory and operable on the target electronic device, the target electronic device implementing any one of the monitoring methods described above when executing the program.

The invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a target electronic device, implements a monitoring method as described in any of the above.

The invention also provides a computer program product comprising a computer program which when executed by a target electronic device implements a monitoring method as described in any of the above.

According to the solid state disk, the monitoring system, the method, the server, the equipment and the medium, the solid state disk can realize the self-monitoring of the working temperature on the premise of not influencing the normal operation, the accuracy, the flexibility and the efficiency of the self-monitoring of the working temperature are higher, the operation stability of the solid state disk can be improved, and the perception of a user can be improved.

Drawings

In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a solid state disk according to the present invention;

FIG. 2 is a schematic communication diagram of a solid state disk according to the present invention;

FIG. 3 is a circuit diagram of a standby power management chip in a solid state disk provided by the invention;

FIG. 4 is a schematic flow chart of the monitoring method according to the present invention;

FIG. 5 is a second flow chart of the monitoring method according to the present invention;

fig. 6 is a schematic structural diagram of an electronic device provided by the present invention.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that, with the continuous development of computer technology, the demand for data storage is also increasing.

A Solid State Disk (Solid State Disk or Solid State Drive, abbreviated as SSD) is a hard Disk made of a Solid State electronic memory chip array. Compared with the traditional mechanical Hard Disk (HDD for short), the solid state Hard Disk has the advantages of high read-write speed, low noise, low power consumption, shock resistance, falling resistance, portability and the like, and is widely applied to various fields such as military, vehicle-mounted, industrial control, video monitoring, network terminals, electric power, medical treatment, aviation, navigation equipment and the like.

Compared with a desktop-level solid state disk, the enterprise-level solid state disk matched with a server works, the data volume processed by the enterprise-level solid state disk is larger, the operation time is longer, the working temperature of the enterprise-level solid state disk is higher, and the requirement of the enterprise-level solid state disk on performance stability is far higher than that of the desktop-level solid state disk. Therefore, how to accurately monitor the working temperature of the solid state disk is of great significance for improving the performance stability of the solid state disk.

In the related art, when the working temperature of the solid state disk is monitored, the normal operation of the solid state disk is generally affected, so that the normal operation of a system where the solid state disk is located is affected, and the perception of a user is affected.

In contrast, the invention provides a solid state disk. The solid state disk provided by the invention can realize the self-monitoring of the working temperature of the solid state disk on the premise of not influencing the solid state disk and the normal operation of the system in which the solid state disk is positioned, can improve the operation stability of the solid state disk and can improve the perception of users.

Fig. 1 is a schematic structural diagram of a solid state disk provided by the present invention. As shown in fig. 1, the solid state disk 101 includes: a microcontroller 102, a flash controller 103, a plurality of flash chips 104, a housing 105, a plurality of temperature sensors 106, and a first integrated circuit bus 107;

each temperature sensor 106 is connected with the microcontroller 102 through a first integrated circuit bus 107, and each temperature sensor 106 is used for acquiring temperature data at a temperature sensitive position;

the microcontroller 102 is configured to read the temperature of the temperature sensor 106 via the first integrated circuit bus 107 and forward the temperature to the target electronic device;

each temperature sensitive location includes the location of the target flash chip 111, the location of the heat sink 109 on the housing 105, and the location of the flash controller 103; the target flash memory chip 111 is the flash memory chip 104 farthest from the casing 105 among the flash memory chips 104.

It should be noted that, in the embodiment of the present invention, the solid state disk 101 may realize self-monitoring of the working temperature, and may send the temperature data obtained by monitoring to the target electronic device.

It should be noted that the target electronic device may be an electronic device used by a user. The type of target electronic device may be a computer, a server, etc. The specific type of the target electronic device in the embodiment of the invention is not limited.

Specifically, an integrated circuit bus (Inter-Integrated Circuit, IIC) is a serial communication bus, and uses a multi-master-slave architecture to achieve the functions of arbitration, high-speed and low-speed device synchronization, etc. required by a multi-host system.

Fig. 2 is a communication schematic diagram of the solid state disk provided by the invention. As shown in fig. 2, in the embodiment of the present invention, the microcontroller 102 in the solid state disk 101 is determined as a master device, the temperature sensors 106 are determined as slave devices, and the microcontroller 102 is connected to each temperature sensor 106 through the first integrated circuit bus 107.

It should be noted that in the embodiment of the present invention, the number of the temperature sensitive locations is plural. A temperature sensor 106 may be provided at any temperature sensitive location.

It should be noted that, in general, when the board card of the solid state disk 101 is mounted, the main board and the auxiliary board need to be folded, and the surface of the flash memory chip 104 closest to the housing 105 is directly contacted with the housing 105 after the heat conducting gel 110 is applied, so that heat can be dissipated through the housing 105, and the flash memory chip 104 further away from the housing 105 has no direct heat dissipation path, so that the working temperature of the flash memory chip 104 further away from the housing 105 is higher than that of the flash memory chip 104 directly contacted with the housing 105. In order to improve the operation stability of the solid state disk 101, it is necessary to timely and accurately obtain the operating temperature of the flash memory chip 104 further away from the housing 105.

In the embodiment of the invention, the flash memory chip 104 farthest from the casing 105 in the solid state disk 101 may be determined as the target flash memory chip 111.

In the embodiment of the invention, the position of the target flash memory chip 111 in the solid state disk 101 can be determined as a temperature sensitive position.

It should be noted that, mechanical heat dissipation devices such as a heat dissipation fan are not generally included in the solid state disk 101, and heat needs to be dissipated through the heat dissipation fan in the system where the solid state disk 101 is located, so that the heat dissipation hole 109 is generally provided on the housing 105 of the solid state disk 101, so that wind blown by the heat dissipation fan in the system where the solid state disk 101 is located passes through the solid state disk 101, and heat in the solid state disk 101 is taken away, thereby implementing heat dissipation to the solid state disk 101.

The location of the heat sink 109 on the housing 105 may be referred to as determining a temperature sensitive location in embodiments of the present invention.

In general, in the running process of the solid state disk 101, the component with the highest heat generation is the Flash Controller 103 (Flash Controller).

In the embodiment of the invention, the position of the flash memory controller 103 in the solid state disk 101 can be determined as a temperature sensitive position.

Any of the temperature sensors 106 in the examples of the present invention may be disposed at a distance from the temperature sensitive location that does not exceed a preset distance, and that is provided with conditions for disposing the temperature sensor 106.

The preset distance can be determined according to priori knowledge and/or actual conditions; the conditions for providing the temperature sensor 106 may include not providing other components, fixing the temperature sensor 106, and the like.

Accordingly, the temperature sensor 106 for acquiring the temperature data of the target flash memory chip 111 may be referred to as the first temperature sensor 106 in the embodiment of the present invention; also referred to as a second temperature sensor 106, can be used to obtain temperature data at a heat sink 109 on the housing 105; the temperature sensor 106 for acquiring junction temperature data of the flash memory controller 103 may also be referred to as a third temperature sensor 106.

Alternatively, the first temperature sensor 106 can be a TMP112 temperature sensor 106, and the slave address of the first temperature sensor 106 can be set to 0X49.

Alternatively, the second temperature sensor 106 can be a TMP112 temperature sensor 106, and the slave address of the second temperature sensor 106 can be set to 0X48.

Alternatively, the third temperature sensor 106 can be a TMP421 temperature sensor 106, and the slave address of the third temperature sensor 106 can be set to 0X1C.

Any temperature sensor 106 may collect the temperature at the temperature sensitive location.

The microcontroller 102 in an embodiment of the present invention may actively read the temperature of some or all of the temperature sensors 106 via the first integrated circuit bus 107 and forward the temperature to the target electronic device 201.

After receiving the temperature, the target electronic device 201 may determine whether the working temperature of the solid state disk 101 is in a preset temperature interval and whether the solid state disk 101 has a fault risk or not based on the temperature; after receiving the temperature, the target electronic device 201 may also send the temperature to the display interface for display.

The solid state disk in the embodiment of the invention can realize the self-monitoring of the working temperature on the premise of not influencing the normal operation, has higher accuracy, flexibility and efficiency for carrying out the self-monitoring of the working temperature, can improve the operation stability of the solid state disk, and can improve the perception of users.

As an alternative embodiment, the temperature sensor 106 is further configured to send, to the microcontroller 102 via the first integrated circuit bus 107, temperature data collected by the temperature sensor 106 in the case of receiving the first query request;

wherein the first query request is for requesting temperature data collected by the temperature sensor 106.

Specifically, any one of the temperature sensors 106 in the embodiments of the present invention, upon receiving the first query request, sends the temperature data at the temperature sensitive location to the microcontroller 102 through the first integrated circuit bus 107.

Accordingly, after receiving the temperature data sent by the temperature sensor 106, the microcontroller 102 in the embodiment of the present invention forwards the temperature data to the target electronic device 201.

Alternatively, the first query request may be triggered in various situations, for example, the first query situation may be sent by the target electronic device 201 to the temperature sensor 106; alternatively, the first query may be sent to the temperature sensor 106 by the microcontroller 102 at regular intervals.

According to the temperature sensor provided by the embodiment of the invention, under the condition that the first query request is received, the temperature data at the temperature sensitive position is sent to the micro-controller, so that the microcontroller can send the temperature data to the target electronic equipment, the query requirement of a user can be better met, the flexibility of the self-monitoring of the working temperature of the solid state disk can be further improved, and the perception of the user can be improved.

As an alternative embodiment, the first query request is sent by the target electronic device 201 to the temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107 upon receipt of the first input.

Specifically, when the user needs to query the operating temperature of the solid state disk 101, a first input may be input in the target electronic device 201.

After receiving the first input, the target electronic device 201 may read the working state information of the microcontroller 102 and the flash memory controller 103 in the solid state disk 101.

In case the target electronic device 201 reads the target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in a normal operating state, the target electronic device 201 may also read the slave address of the temperature sensor 106 via the first integrated circuit bus 107.

In the case where the target electronic device 201 reads the slave address of the temperature sensor 106, indicating that the target electronic device 201 is successful in communicating with the temperature sensor 106, the target electronic device 201 may send a first query request to the temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107.

As an alternative embodiment, the user may choose to acquire temperature data at some or all of the temperature sensitive locations based on actual needs in embodiments of the present invention.

After determining the target location in each temperature sensitive location based on the actual demand, the user may input a first input carrying identification information of the target location in the target electronic device 201. Wherein the number of target locations may be one or more.

In the case where the target electronic device 201 reads the target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in the normal operating state, the target electronic device 201 may further determine, from among the temperature sensors 106, the target temperature sensor 106 disposed at the target position based on the identification of the target position carried in the first input, and may further read the slave address of the target temperature sensor 106 through the first integrated circuit bus 107.

In the case where the target electronic device 201 reads the slave address of the target temperature sensor 106, indicating that the target electronic device 201 is successful in communicating with the target temperature sensor 106, the target electronic device 201 may send a first query request to the target temperature sensor 106 via the microcontroller 102 and the first integrated circuit bus 107.

For example, in the case where the target temperature sensor 106 includes a first temperature sensor 106, if the target electronic device 201 reads 0X49 through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the first temperature sensor 106, and the target electronic device 201 may send a first query request to the first temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107;

In the case where the target temperature sensor 106 includes the second temperature sensor 106, if the target electronic device 201 reads 0X48 through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the second temperature sensor 106, and the target electronic device 201 may send a first query request to the second temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107;

in the case where the target temperature sensor 106 includes the third temperature sensor 106, if the target electronic device 201 reads 0X1C through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the third temperature sensor 106, and the target electronic device 201 may send a first query request to the third temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107.

The target temperature sensor 106, upon receiving the first query request, may acquire temperature data at the target location and send the temperature data to the microcontroller 102 via the first integrated circuit bus 107.

After the microcontroller 102 receives the temperature data, the temperature data may be forwarded to the target electronic device 201.

The first query request in the embodiment of the invention is triggered based on the first input of the user, and can better and more flexibly meet the query requirement of the user.

Based on the content of the above embodiments, the solid state disk 101 further includes: a standby power management chip 202;

the standby power management chip 202 is connected with the microcontroller 102 through the first integrated circuit bus 107;

the microcontroller 102 is further configured to read the stored data in the standby power management chip 202 via the first integrated circuit bus 107 and forward the stored data to the target electronic device 201.

Specifically, in order to reduce adverse effects of emergency such as temporary power failure on operation of the solid state disk 101 and ensure high availability of the solid state disk 101, the solid state disk 101 in the embodiment of the present invention further includes a power backup management chip 202.

As shown in fig. 2, the standby power management chip 202 may be connected to the microcontroller 102 via the first integrated circuit bus 107.

Fig. 3 is a circuit diagram of a standby power management chip in a solid state disk provided by the invention. As shown in fig. 3, in order to be compatible with the standby power management chip 202 provided by more manufacturers, the slave addresses of the standby power management chip 202 may be set to 0X59, 0X5A, and 0X5B in the embodiment of the present invention. The high level corresponds to slave address 0X59, the low level corresponds to slave address 0X5A, and the slave address 0X5B is floated. The slave address 0X59 of the standby power management chip 202 is obtained by adjusting the ADR or gate resistance in the standby power management chip 202 to realize the high level corresponding slave address 0X59, the low level corresponding slave address 0X5A and the floating corresponding slave address 0X5B, namely, under the condition that the R1 is not loaded with the R2; under the condition that R1 is not loaded with R2, the slave address of the standby power management chip 202 is 0X5A; under the condition that R1 and R2 are not on-demand, the slave address of the standby power management chip 202 is 0X5B.

Alternatively, the standby power management chip 202 may be a 72001 type standby power management chip.

The microcontroller 102 in the embodiment of the present invention may actively read the stored data in the standby power management chip 202 through the first integrated circuit bus 107, and forward the stored data to the target electronic device 201.

After receiving the storage data, the target electronic device 201 may send the storage data to a display interface for display.

The solid state disk in the embodiment of the invention comprises the standby power management chip, so that adverse effects of sudden events such as temporary power failure on the operation of the solid state disk can be reduced, and the high availability of the solid state disk can be ensured.

As an alternative embodiment, the standby power management chip 202 is further configured to send the storage data to the microcontroller 102 through the first integrated circuit bus 107, in the case of receiving the second query request, so that the microcontroller 102 forwards the storage data to the target electronic device 201;

the second query request is for requesting stored data in the standby power management chip 202.

Specifically, in the embodiment of the present invention, when the standby power management chip 202 receives the second query request, the storage data in the standby power management chip 202 is sent to the microcontroller 102 through the first integrated circuit bus 107.

Accordingly, after receiving the storage data sent by the standby power management chip 202, the microcontroller 102 in the embodiment of the present invention forwards the storage data to the target electronic device 201.

Alternatively, the second query request may be triggered in various situations, for example, the second query situation may be sent by the target electronic device 201 to the power backup management chip 202; alternatively, the second query may be sent to the power management chip 202 by the microcontroller 102 at regular time.

According to the standby power management chip provided by the embodiment of the invention, under the condition that the second query request is received, the storage data is sent to the micro-controller so that the micro-controller can send the storage data to the target electronic equipment, the query requirement of a user can be better met, the flexibility of acquiring the storage data in the standby power management chip can be further improved, and the perception of the user can be improved.

As an alternative embodiment, the second query request is sent by the target electronic device 201 to the standby management chip 202 via the microcontroller 102 and the first integrated circuit bus 107 upon receipt of the second input.

Specifically, in the case where the user needs to acquire the stored data stored in the standby power management chip 202, the second input may be input in the target electronic device 201.

After receiving the second input, the target electronic device 201 may read the working state information of the microcontroller 102 and the flash memory controller 103 in the solid state disk 101 through the first integrated circuit bus 107.

In case the target electronic device 201 reads the target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in a normal operating state, the target electronic device 201 may also read the slave address of the standby power management chip 202 through the first integrated circuit bus 107.

If the target electronic device 201 reads any one of 0X59, 0X5A, and 0X5B through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the standby power management chip 202, and the target electronic device 201 may send a second query request to the standby power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107.

In the case of receiving the second inquiry request, the standby power management chip 202 may send the storage data stored in the standby power management chip 202 to the microcontroller 102 through the first integrated circuit bus 107.

After the microcontroller 102 receives the stored data, the stored data may be forwarded to the target electronic device 201.

The second query request in the embodiment of the invention is triggered based on the second input of the user, and can better and more flexibly meet the query requirement of the user.

Based on the content of the above embodiments, the solid state disk 101 further includes: a power consumption monitoring chip 203;

the power consumption monitoring chip 203 is arranged at a preset position, and the power consumption monitoring chip 203 is connected with the microcontroller 102 through the first integrated circuit bus 107;

the power consumption monitoring chip 203 is used for acquiring power consumption data of the solid state disk 101;

the microcontroller 102 is further configured to read the power consumption data through the first integrated circuit bus 107 and forward the power consumption data to the target electronic device 201;

the preset position is determined based on the position of the voltage output terminal pin of the standby power management chip 202.

Specifically, in order to realize self-monitoring of power consumption of the solid state disk 101, the solid state disk 101 in the embodiment of the present invention further includes a power consumption monitoring chip 203.

Alternatively, the preset position may be determined based on the position of the P12V output pin of the standby power management chip 202.

In the embodiment of the invention, the position of the pin at the P12V output end of the standby power management chip 202, which does not exceed the preset distance and has the condition of setting the power consumption monitoring chip 203, can be determined as the preset position. The preset distance can be determined according to priori knowledge and/or actual conditions; the condition for providing the standby power management chip 202 may include that no other component is provided and the standby power management chip 202 can be fixed.

As shown in fig. 2, the power consumption monitoring chip 203 may be connected to the microcontroller 102 through the first integrated circuit bus 107.

Alternatively, the power consumption monitoring chip 203 may be a TPA626 power consumption monitoring chip 203. The slave address of the power consumption monitoring chip 203 may be set to 0X20.

The microcontroller 102 in the embodiment of the present invention may actively read the power consumption data obtained by the power consumption monitoring chip 203 through the first integrated circuit bus 107, and forward the power consumption data to the target electronic device 201.

After receiving the power consumption data, the target electronic device 201 may determine, based on the power consumption data, whether the solid state disk 101 has abnormal power consumption, whether the solid state disk 101 has a fault risk, and so on; after receiving the power consumption data, the target electronic device 201 may also send the power consumption data to the display interface for display.

The solid state disk in the embodiment of the invention further comprises the power consumption monitoring chip, so that the self-monitoring of the power consumption can be realized on the premise of not influencing the normal operation, the accuracy, the flexibility and the efficiency of the self-monitoring of the power consumption are higher, the operation stability of the solid state disk can be improved, and the perception of a user can be improved.

As an alternative embodiment, the power consumption monitoring chip 203 is further configured to send power consumption data to the microcontroller 102 through the first integrated circuit bus 107 in case of receiving the third query request;

The third inquiry request is for requesting the power consumption data acquired by the power consumption monitoring chip 203.

Specifically, in the embodiment of the present invention, when the power consumption monitoring chip 203 receives the third query request, the obtained power consumption data of the solid state disk 101 is sent to the microcontroller 102 through the first integrated circuit bus 107.

Accordingly, after receiving the power consumption data sent by the power consumption monitoring chip 203, the microcontroller 102 in the embodiment of the present invention forwards the power consumption data to the target electronic device 201.

Alternatively, the third query request may be triggered in various situations, for example, the third query situation may be sent by the target electronic device 201 to the temperature sensor 106; alternatively, the third inquiry scenario described above may also be that the microcontroller 102 periodically sends to the temperature sensor 106.

In the power consumption monitoring chip provided by the embodiment of the invention, under the condition of receiving the third query request, the acquired power consumption data of the solid state disk is sent to the micro-controller so that the microcontroller can send the power consumption data to the target electronic equipment, thus the query requirement of a user can be better met, the self-monitoring flexibility of the power consumption of the solid state disk can be further improved, and the perception of the user can be improved.

As an alternative embodiment, the third query request is sent by the target electronic device 201 to the power consumption monitoring chip 203 via the microcontroller 102 and the first integrated circuit bus 107 upon receipt of the third input.

Specifically, the user may input a third input in the target electronic device 201 in a case where the user needs to acquire the power consumption of the solid state disk 101.

After receiving the third input, the target electronic device 201 may read the working state information of the microcontroller 102 and the flash memory controller 103 in the solid state disk 101 through the first integrated circuit bus 107.

In case the target electronic device 201 reads the target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in a normal operating state, the target electronic device 201 may also read the slave address of the power consumption monitoring chip 203 through the first integrated circuit bus 107.

If the target electronic device 201 reads 0X20 through the first integrated circuit bus 107, it indicates that the target electronic device 201 and the power consumption monitoring chip 203 successfully communicate, and the target electronic device 201 may send a third query request to the power backup management chip 202 through the microcontroller 102 and the first integrated circuit bus 107.

In the case of receiving the third query request, the power consumption monitoring chip 203 may send the power consumption data of the solid state disk 101 to the microcontroller 102 through the first integrated circuit bus 107.

After receiving the power consumption data, the microcontroller 102 may forward the power consumption data to the target electronic device 201.

It should be noted that, in the above description, the first input, the second input, or the third input of the user may be represented as a touch output to the target electronic device 201, and the touch output may include, but is not limited to, a click input, a slide input, a press input, and the like. The first input, the second input, or the third input of the user may also be represented as a physical key input corresponding to the target electronic device 201. The first input, the second input, or the third input of the user may also be represented as a voice input of the user.

It is to be understood that each of the above listed inputs is an exemplary list, i.e., embodiments of the present application include, but are not limited to, each of the above listed inputs. In practical implementation, the first input of the user may further include any other possible input, which may be specifically determined according to the actual use requirement, and the embodiment of the present application is not limited.

The third query request in the embodiment of the invention is triggered based on the third input of the user, and can better and more flexibly meet the query requirement of the user.

Based on the content of the above embodiments, the solid state disk 101 further includes: a universal asynchronous receiver transmitter serial port 205;

the flash memory controller 103 is connected with the microcontroller 102 through a second integrated circuit bus 208; the universal asynchronous receiver transmitter serial port 205 is disposed on the second integrated circuit bus;

the universal asynchronous receiver transmitter serial port 205 is configured to output first abnormal information indicating that the flash memory controller 103 is in an abnormal operation state when the flash memory controller 103 is in the abnormal operation state;

the universal asynchronous receiver transmitter serial port 205 is further configured to output second abnormal information indicating that the microcontroller 102 is in an abnormal operating state when the microcontroller 102 is in the abnormal operating state;

the universal asynchronous receiver transmitter serial port 205 is further configured to output third anomaly information indicating a failure of communication between the target electronic device 201 and the temperature sensor 106 in the event of a failure of communication between the target electronic device 201 and the temperature sensor 106.

Note that a universal asynchronous receiver Transmitter (Universal Asynchronous Receiver/Transmitter, commonly referred to as UART) is a universal asynchronous receiver Transmitter that can transmit data through serial communication.

Optionally, the universal asynchronous receiver transmitter serial port 205 is further configured to output fourth exception information indicating that the communication between the target electronic device 201 and the standby power management chip 202 fails in the case that the communication between the target electronic device 201 and the standby power management chip 202 fails.

Optionally, the universal asynchronous receiver transmitter serial port 205 is further configured to output fifth exception information indicating a failure of communication between the target electronic device 201 and the power consumption monitoring chip 203 in the event of a failure of communication between the target electronic device 201 and the power consumption monitoring chip 203.

The solid state disk in the embodiment of the invention can output the abnormal information more efficiently and more conveniently by utilizing the serial port of the universal asynchronous receiving and transmitting transmitter, so that a user can more efficiently position and maintain the solid state disk, and the perception of the user can be improved.

Based on the content of the above embodiments, the solid state disk 101 further includes: a connection component 206 and a system management bus 207;

the connection component and the system management bus are used for connecting the target electronic device 201 and the flash memory controller 103;

the connection component and system management bus are also used to connect the target electronic device 201 and the microcontroller 102.

The system management bus (System Management Bus, SMBus) is a two-wire interface, and devices connected to the system management bus may communicate with each other through the system management bus.

In the embodiment of the present invention, the flash memory controller 103 is connected to the connection component 206 through the system management bus 207, and the connection component 206 is connected to the target electronic device 201 through the system management bus 207.

Optionally, in the embodiment of the present invention, the flash controller 103 may communicate with the connection component 206 through a PCIe protocol, and the connection component 206 may communicate with the target electronic device 201 through the PCIe protocol.

Alternatively, the connection assembly 206 in embodiments of the present invention may be a U.2 connector.

Based on the content of the above embodiments, the monitoring system includes: solid state disk 101 and target electronic device 201 of any of the above; the target electronic device 201 is respectively connected with the microcontroller 102 and the flash memory controller 103 in the solid state disk 101;

the target electronic device 201 is configured to read, when receiving a first input, operating state information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107, read, when reading target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in a normal operating state, a slave address of the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107, and send, when reading the slave address of the temperature sensor 106, a first query request to the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107;

The target electronics 201 is also configured to receive temperature data returned by the temperature sensor 106 via the first integrated circuit bus 107 and the microcontroller 102.

As an alternative embodiment, the target electronic device 201 is further configured to, when receiving the second input, read the operating state information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107, when reading the target operating state information, read the slave address of the standby power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107, and when reading the slave address of the standby power management chip 202, send a second query request to the standby power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107;

the target electronic device 201 is further configured to receive the stored data returned by the standby power management chip 202 via the first integrated circuit bus 107 and the microcontroller 102.

As an alternative embodiment, the target electronic device 201 is further configured to, upon receiving the third input, read the operating state information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107, and, upon reading the target operating state information, read the slave address of the power consumption monitoring chip 203 through the microcontroller 102 and the first integrated circuit bus 107, and, upon reading the slave address of the power consumption monitoring chip 203, send a third query request to the power consumption monitoring chip 203 through the microcontroller 102 and the first integrated circuit bus 107;

The target electronic device 201 is further configured to receive power consumption returned by the power consumption monitoring chip 203 via the first integrated circuit bus 107 and the microcontroller 102.

It should be noted that, the monitoring system in the embodiment of the present invention includes the solid state disk 101 and the target electronic device 201, and the specific process of interaction between the solid state disk 101 and the target electronic device 201 and self-monitoring of the working temperature of the solid state disk 101 may refer to the content of each embodiment, which is not described in detail in the embodiment of the present invention.

The monitoring system comprises the solid state disk and the target electronic equipment, can realize the self-monitoring of the working temperature of the solid state disk on the premise of not influencing the normal operation of the solid state disk, has higher accuracy, flexibility and efficiency for the self-monitoring of the working temperature, can improve the operation stability of the solid state disk, and can improve the perception of users.

Fig. 4 is a schematic flow chart of a monitoring method provided by the present invention. The following describes the monitoring method provided by the present invention with reference to fig. 4, and the monitoring method provided by the present invention is implemented based on the monitoring system described above. As shown in fig. 4, the method includes: step 401, under the condition of receiving a first input, reading working state information of the microcontroller 102 and the flash memory controller 103 in the solid state disk 101 through the first integrated circuit bus 107;

Step 402, in the case of reading the target operation state information indicating that the microcontroller 102 and the flash memory controller 103 are in the normal operation state, reading the slave address of the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107;

step 403, in case of reading the slave address of the temperature sensor 106, sending a first query request to the temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107;

step 404, receiving temperature data returned by the temperature sensor 106 via the first integrated circuit bus 107 and the microcontroller 102.

It should be noted that, the execution subject of the embodiment of the present invention may be the target electronic device 201.

It should be noted that, the monitoring method provided by the present invention is implemented based on the monitoring system described above, and specific execution steps may refer to the content of each embodiment, which is not described in detail in the embodiments of the present invention.

According to the embodiment of the invention, under the condition that the first input is received, the microcontroller and the flash memory controller in the solid state disk are in a normal working state, after the microcontroller and the flash memory controller are in normal communication with the temperature sensor, the microcontroller and the first integrated circuit are used for sending a first query request to the temperature sensor, and the first integrated circuit bus and the microcontroller are used for receiving temperature data returned by the temperature sensor, so that the working temperature of the solid state disk can be monitored more accurately, flexibly and efficiently on the premise that the normal working of the solid state disk and a system where the solid state disk is located is not influenced, the running stability of the solid state disk can be improved, and the user perception can be improved.

Based on the content of the above embodiments, the method further includes: in case of receiving the second input, reading the operating state information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107;

in the case of reading the target operating state information, the slave address of the standby power management chip 202 is read through the microcontroller 102 and the first integrated circuit bus 107;

in case of reading the slave address of the standby power management chip 202, sending a second query request to the standby power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107;

the stored data returned by the standby power management chip 202 is received via the first integrated circuit bus 107 and the microcontroller 102.

In the embodiment of the invention, under the condition of receiving the second input, the microcontroller and the flash memory controller in the solid state disk are in a normal working state, and after the microcontroller and the flash memory controller are communicated with the standby power management chip normally, the microcontroller and the first integrated circuit are used for sending a second query request to the standby power management chip, and the first integrated circuit bus and the microcontroller are used for receiving the storage data returned by the standby power management chip, so that the adverse effect of sudden events such as temporary power failure on the operation of the solid state disk can be reduced, and the high availability of the solid state disk can be ensured.

Based on the content of the above embodiments, the method further includes: in case of receiving the third input, reading the operating state information of the microcontroller 102 and the flash memory controller 103 through the first integrated circuit bus 107;

in the case of reading the target operating state information, reading the slave address of the power consumption monitoring chip 203 through the microcontroller 102 and the first integrated circuit bus 107;

in the case of reading the slave address of the power consumption monitoring chip 203, sending a third inquiry request to the power consumption monitoring chip 203 through the microcontroller 102 and the first integrated circuit bus 107;

the power consumption returned by the power consumption monitoring chip 203 is received through the first integrated circuit bus 107 and the microcontroller 102.

In the embodiment of the invention, under the condition of receiving the third input, the microcontroller and the flash memory controller in the solid state disk are in a normal working state, and after the microcontroller and the flash memory controller are in normal communication with the power consumption monitoring chip, the microcontroller and the first integrated circuit are used for sending a third query request to the power consumption monitoring chip, and the first integrated circuit bus and the microcontroller are used for receiving the storage data returned by the power consumption monitoring chip, so that the power consumption of the solid state disk can be acquired more accurately and more efficiently, the running stability of the solid state disk can be improved, and the perception of a user can be improved.

In order to facilitate understanding of the monitoring method provided by the present invention, the monitoring method provided by the present invention is described below by way of an example. FIG. 5 is a second flow chart of the monitoring method according to the present invention.

As shown in fig. 5, after receiving the first input, the target electronic device 201 may send a request message to the operating state information of the microcontroller 102 and the flash controller 103 in the solid state disk 101, where the request message requests to read the operating state information of the microcontroller 102 and the flash controller 103 in the solid state disk 101.

In the solid state disk 101, when the microcontroller 102 and the flash controller 103 receive the request message, operation state information indicating the operation states of the microcontroller 102 and the flash controller 103 may be returned to the target electronic device 201.

If the target electronic device 201 receives the working state information indicating that the microcontroller 102 and the flash memory controller 103 are in the abnormal working state, the universal asynchronous receiver transmitter serial port 205 may output the abnormal information indicating that the microcontroller 102 and/or the flash memory controller 103 are in the abnormal working state;

if the target electronic device 201 receives the target operating state information indicating that the microcontroller 102 and the flash memory controller 103 are in a normal operating state, the target temperature sensor 106 disposed at the target position may be determined in each temperature sensor 106 based on the identifier of the target position carried in the first input, and then the slave address of the target temperature sensor 106 may be read through the first integrated circuit bus 107.

In the case where the target temperature sensor 106 includes a first temperature sensor 106, if the target electronic device 201 reads 0X49 through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the first temperature sensor 106, and the target electronic device 201 may send a first query request to the first temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107; if the target electronic device 201 does not read 0X49 through the first integrated circuit bus 107, it indicates that the communication between the target electronic device 201 and the first temperature sensor 106 is failed, and the abnormal information indicating that the communication between the target electronic device and the first temperature sensor 106 is failed may be output through the universal asynchronous receiver transmitter serial port 205;

in the case where the target temperature sensor 106 includes the second temperature sensor 106, if the target electronic device 201 reads 0X48 through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the second temperature sensor 106, and the target electronic device 201 may send a first query request to the second temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107; if the target electronic device 201 does not read 0X48 through the first integrated circuit bus 107, it indicates that the communication between the target electronic device 201 and the second temperature sensor 106 fails, and abnormal information indicating that the communication between the target electronic device and the second temperature sensor 106 fails may be output through the universal asynchronous receiver transmitter serial port 205;

In the case where the target temperature sensor 106 includes the third temperature sensor 106, if the target electronic device 201 reads 0X1C through the first integrated circuit bus 107, it indicates that the target electronic device 201 successfully communicates with the third temperature sensor 106, and the target electronic device 201 may send a first query request to the third temperature sensor 106 through the microcontroller 102 and the first integrated circuit bus 107; if the target electronic device 201 does not read 0X1C through the first integrated circuit bus 107, it indicates that the communication between the target electronic device 201 and the third temperature sensor 106 is failed, and the abnormality information indicating that the communication between the target electronic device and the third temperature sensor 106 is failed may be outputted through the universal asynchronous receiver transmitter serial port 205.

If the target electronic device 201 reads any one of 0X59, 0X5A and 0X5B through the first integrated circuit bus 107, it indicates that the target electronic device 201 and the standby power management chip 202 are successfully communicated, and the target electronic device 201 may send a second query request to the standby power management chip 202 through the microcontroller 102 and the first integrated circuit bus 107; if the target electronic device 201 does not read any of 0X59, 0X5A, and 0X5B via the first integrated circuit bus 107, the universal asynchronous receiver transmitter serial port 205 may output an exception message indicating that the communication between the target electronic device 201 and the standby power management chip 202 has failed.

In the case of receiving the second inquiry request, the standby power management chip 202 may send the stored data in the standby power management chip 202 to the microcontroller 102 through the first integrated circuit bus 107.

If the target electronic device 201 reads 0X20 through the first integrated circuit bus 107, it indicates that the communication between the target electronic device 201 and the power consumption monitoring chip 203 is successful, and the target electronic device 201 may send a third query request to the standby management chip 202 through the microcontroller 102 and the first integrated circuit bus 107; if the target electronic device 201 does not read 0X20 through the first integrated circuit bus 107, the UART serial 205 may output abnormal information indicating that the communication between the target electronic device 201 and the power consumption monitoring chip 203 fails.

According to the content of the above embodiments, a server includes any of the solid state disks 101 described above.

Specifically, the server in the embodiment of the invention comprises the solid state disk 101, and the solid state disk 101 can realize the self-detection of the working temperature on the premise of not influencing the normal operation of the server.

It should be noted that, the specific process of self-monitoring the working temperature of the solid state disk 101 may refer to the content of each embodiment, which is not described in detail in the embodiments of the present invention.

The server in the embodiment of the invention comprises the solid state disk, and the solid state disk can realize the self-monitoring of the working temperature on the premise of not influencing the normal operation of the server, so that the accuracy, flexibility and efficiency of the self-monitoring of the working temperature are higher, the operation stability of the server can be improved, and the perception of a user can be improved.

Fig. 6 illustrates a physical schematic diagram of an electronic device, as shown in fig. 6, which may include: processor 610, communication interface (Communications Interface) 620, memory 630, and communication bus 640, wherein processor 610, communication interface 620, and memory 630 communicate with each other via communication bus 640. The processor 610 may invoke logic instructions in the memory 630 to perform a monitoring method comprising: under the condition of receiving the first input, reading working state information of a microcontroller and a flash memory controller in the solid state disk through a first integrated circuit bus; reading the slave address of the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that target working state information indicating that the microcontroller and the flash memory controller are in a normal working state is read; in case of reading the slave address of the temperature sensor, sending a first query request to the temperature sensor through the microcontroller and the first integrated circuit bus; temperature data returned by the temperature sensor is received via the first integrated circuit bus and the microcontroller.

Further, the logic instructions in the memory 630 may be implemented in the form of software functional units and stored in a computer-readable storage medium when sold or used as a stand-alone product. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

In another aspect, the present invention also provides a computer program product comprising a computer program, the computer program being storable on a non-transitory computer readable storage medium, the computer program, when executed by a processor, being capable of performing the monitoring method provided by the methods described above, the method comprising: under the condition of receiving the first input, reading working state information of a microcontroller and a flash memory controller in the solid state disk through a first integrated circuit bus; reading the slave address of the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that target working state information indicating that the microcontroller and the flash memory controller are in a normal working state is read; in case of reading the slave address of the temperature sensor, sending a first query request to the temperature sensor through the microcontroller and the first integrated circuit bus; temperature data returned by the temperature sensor is received via the first integrated circuit bus and the microcontroller.

In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, is implemented to perform the monitoring method provided by the above methods, the method comprising: under the condition of receiving the first input, reading working state information of a microcontroller and a flash memory controller in the solid state disk through a first integrated circuit bus; reading the slave address of the temperature sensor through the microcontroller and the first integrated circuit bus under the condition that target working state information indicating that the microcontroller and the flash memory controller are in a normal working state is read; in case of reading the slave address of the temperature sensor, sending a first query request to the temperature sensor through the microcontroller and the first integrated circuit bus; temperature data returned by the temperature sensor is received via the first integrated circuit bus and the microcontroller.

The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.

From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A solid state disk, comprising: the device comprises a microcontroller, a flash memory controller, a plurality of flash memory chips, a shell, a plurality of temperature sensors and a first integrated circuit bus;

each temperature sensor is connected with the microcontroller through the first integrated circuit bus;

the temperature sensor is used for collecting temperature data at a temperature sensitive position;

each temperature sensitive location includes a location of a target flash memory chip, a location of a heat dissipation hole on the housing, and a location of the flash memory controller; the target flash memory chip is the flash memory chip which is farthest from the shell in the flash memory chips.

2. The solid state disk of claim 1, wherein the temperature sensor is further configured to send temperature data collected by the temperature sensor to the microcontroller through the first integrated circuit bus upon receiving a first query request;

the first query request is used for requesting temperature data acquired by the temperature sensor.

3. The solid state disk of claim 2, wherein the first query request is sent to the temperature sensor by the target electronic device over the microcontroller and first integrated circuit bus upon receipt of a first input.

4. The solid state disk of claim 1, further comprising: a standby power management chip;

5. The solid state disk of claim 4, wherein the power backup management chip is further configured to send the storage data to the microcontroller via the first integrated circuit bus for the microcontroller to forward the storage data to the target electronic device if a second query request is received;

6. The solid state disk of claim 5, wherein the second query request is sent to the standby power management chip by the target electronic device via the microcontroller and the first integrated circuit bus upon receiving a second input.

7. The solid state disk of claim 4, further comprising: a power consumption monitoring chip;

8. The solid state disk of claim 7, wherein the power consumption monitoring chip is further configured to send the power consumption data to the microcontroller via the first integrated circuit bus if a third query request is received;

9. The solid state disk of claim 8, wherein the third query request is sent to the power consumption monitoring chip by the target electronic device via the microcontroller and the first integrated circuit bus upon receipt of a third input.

10. The solid state disk of claim 1, further comprising: a universal asynchronous receiver transmitter serial port;

11. The solid state disk of any one of claims 1 to 10, further comprising: a connection assembly and a system management bus;

12. A monitoring system, comprising: the solid state disk and target electronic device of any one of claims 1 to 11; the target electronic equipment is respectively connected with a microcontroller and a flash memory controller in the solid state disk;

13. The monitoring system of claim 12, wherein the target electronic device is further configured to read, if a second input is received, operating state information of the microcontroller and the flash memory controller through a first integrated circuit bus, read, if the target operating state information is read, a slave address of a standby power management chip through the microcontroller and the first integrated circuit bus, and send, if the slave address of the standby power management chip is read, a second query request to the standby power management chip through the microcontroller and the first integrated circuit bus;

14. The monitoring system according to claim 12 or 13, wherein the target electronic device is further configured to read, in case a third input is received, operation state information of the microcontroller and the flash memory controller through a first integrated circuit bus, read, in case the target operation state information is read, a slave address of a power consumption monitoring chip through the microcontroller and the first integrated circuit bus, and send, in case the slave address of the power consumption monitoring chip is read, a third query request to the power consumption monitoring chip through the microcontroller and the first integrated circuit bus;

15. A monitoring method implemented on the basis of a monitoring system according to any one of claims 12 to 14, comprising:

and receiving temperature data returned by the temperature sensor through the first integrated circuit bus and the microcontroller.

16. The method of monitoring according to claim 15, further comprising:

17. The method of monitoring according to claim 15 or 16, wherein the method further comprises:

18. A server comprising a solid state disk as claimed in any one of claims 1 to 11.

19. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the monitoring method of any of claims 15 to 17 when the program is executed by the processor.

20. A non-transitory computer readable storage medium having stored thereon a computer program, which when executed by a target electronic device implements the monitoring method according to any of claims 15 to 17.