CN116540070A - LED chip function test equipment - Google Patents
LED chip function test equipment Download PDFInfo
- Publication number
- CN116540070A CN116540070A CN202310445832.3A CN202310445832A CN116540070A CN 116540070 A CN116540070 A CN 116540070A CN 202310445832 A CN202310445832 A CN 202310445832A CN 116540070 A CN116540070 A CN 116540070A
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- plate
- side wall
- fixedly connected
- led chip
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- 238000012360 testing method Methods 0.000 title claims abstract description 47
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 72
- 239000000741 silica gel Substances 0.000 claims abstract description 72
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 25
- 230000008093 supporting effect Effects 0.000 claims abstract description 24
- 238000002474 experimental method Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims description 45
- 238000011990 functional testing Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 abstract description 23
- 230000008859 change Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 46
- 230000000903 blocking effect Effects 0.000 description 12
- 239000000428 dust Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000481 breast Anatomy 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to the technical field of LED chip testing, in particular to LED chip function testing equipment, which comprises a steam experiment box; a test bin is arranged on the side wall of the steam experiment box; the outer side wall of the steam experiment box is rotatably connected with a box door at the position of the test bin; a pair of guide rails are fixedly connected to the inner side wall of the test bin; the middle parts of the pair of guide rails are connected with a supporting plate in a sliding manner; a plurality of groups of silica gel plates are arranged on the surface of the supporting plate; through utilizing silica gel board self deformability, can carry out corresponding position change to the chip of different models, carry out the position restriction to the LED chip, keep the stability of chip self position in the test process, reduce the distance nearer between the chip, cause the emergence of chip mixed condition when the position appears.
Description
Technical Field
The invention belongs to the technical field of LED chip testing, and particularly relates to LED chip function testing equipment.
Background
The LED chip is a semiconductor device in the modern society, is a core component of the LED lamp group, can generate light by converting electric energy into light energy, and the LED lamp group can replace light sources such as traditional incandescent lamps, tungsten filament lamps and the like by better brightness and service life.
In the prior art, in the production process of an LED chip, various tests are often required to be passed, wherein PCT high-pressure accelerated aging test is an important one, and the LED chip can be tested by high-temperature steam or pressure cooker cooking.
In use, in the process of testing the LED chips, the conventional chip test is often carried out in the same group type, when the number of the tested chips is large, the back and forth replacement operation is complicated, meanwhile, when the simultaneous tests are carried out in different types, the LED chips burst due to the influence of high temperature on the components in the LED chips, and the chip displacement is mixed, so that the LED chip functional test equipment is provided for the problems.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to LED chip function test equipment, which comprises a steam experiment box; a test bin is arranged on the side wall of the steam experiment box; the outer side wall of the steam experiment box is rotatably connected with a box door at the position of the test bin; a pair of guide rails are fixedly connected to the inner side wall of the test bin; the middle parts of the pair of guide rails are connected with a supporting plate in a sliding manner; a plurality of groups of silica gel plates are arranged on the surface of the supporting plate; during operation, the step utilizes the variability of the silica gel plate, can carry out corresponding position change aiming at chips of different models, limits the positions of the LED chips, keeps the stability of the positions of the chips in the testing process, reduces the distance between the chips to be relatively close, and causes the occurrence of chip mixing condition when the positions appear.
Preferably, the top of the supporting plate is provided with a first base chute at the position where the plurality of groups of silica gel plates are positioned; a positioning plate is fixedly connected to the middle of the first chute; a pressing plate is connected above the positioning plate in a sliding manner; the positioning plate is connected with the pressing plate through a spring; the end parts of the pressing plates slide on the top surfaces of the supporting plates and are positioned among a plurality of groups of silica gel plates; a limiting plate is fixedly connected to the side wall of the top of the first chute; the silica gel plate is sleeved on the limiting plate; a spring is connected between the side wall of the silica gel plate and the side wall of the test bin; one end of a first connecting belt is fixedly connected to the side wall of the pressing plate; the other end of the first connecting belt is fixedly connected to the side wall of the silica gel plate; during operation, this step utilizes the movable effect of pressing the board, can drive the silica gel board and carry out long distance position, further increases the adaptability to different models LED chips, and the spring can assist the silica gel board to carry out the centre gripping to the LED chip lateral wall and handle simultaneously to the supporting effect of silica gel board, increases the stability of LED chip when carrying out the test.
Preferably, the top of the pressing plate is fixedly connected with a placing plate; a plurality of groups of second sliding grooves are formed in the top surface of the placement plate; a plurality of groups of positioning piles are fixedly connected inside the second chute; the top surface of the positioning pile is fixedly connected with a conical column; during operation, this step utilizes the support effect of placing the board to the chip, can keep the chip position stable through the support effect of multiunit toper post simultaneously, reduces the area of contact of placing board and LED chip to stability when increasing the LED chip and testing reduces the emergence that the uneven condition of heating appears in the LED chip.
Preferably, a plurality of groups of collision plates are fixedly connected below the first connecting belt on the side wall of the bottom of the first chute; one end of a second connecting belt is fixedly connected to the side wall of the first connecting belt; the other end of the second connecting belt is fixedly connected with a collision column; the collision column is contacted with the side wall of the placing plate; during operation, the step utilizes the removal effect of connecting band No. one, can drive the collision post and constantly produce between multiunit collision board and remove, and then produce the collision effect, can clear up the dust impurity that exists on the silica gel board through the transmission of vibrations, increases the follow-up fixed effect to the LED chip.
Preferably, a plurality of groups of third sliding grooves are formed in the side walls of two sides of the collision plate; a first rotating shaft is hinged to the side wall of the third sliding groove; the first rotating shaft and the third sliding groove are connected through a torsion spring; a side baffle is fixedly connected to the side wall of the first rotating shaft; a pair of arc plates are connected between the side wall of the side baffle and the side wall of the third chute; during operation, the blocking effect of the side baffle is utilized, so that the impact force between the collision column and the side wall of the collision plate can be increased, the impact effect is increased, the vibration condition is triggered, the adhesion of dust and impurities on equipment is reduced, and the fixing effect on the chip is improved.
Preferably, a cavity is reserved between the positioning plate and the pressing plate; the side wall of the pressing plate is fixedly connected with an air duct; the air duct is communicated with the cavity; a shaking ball is arranged at the bottom of the placing plate; the shaking ball is connected with the placing plate through a connecting rope; during operation, this step utilizes the movable effect of pressing the board, can make the air between pressing board and the locating plate contact through dryer and silica gel board lateral wall, contacts the dust impurity that exists on the silica gel board lateral wall upward, increases follow-up silica gel board and carries out the centre gripping effect to the LED chip, rocks the ball and can produce the horizontal hunting under the air current influence simultaneously, strikes placing board and silica gel board lateral wall, reduces the attachment of dust impurity.
Preferably, a plurality of groups of silica gel plates are respectively provided with clamping plates on the corresponding side walls; a plurality of groups of fourth sliding grooves are formed in the side wall of the clamping plate; a plurality of groups of semi-cylinders are fixedly connected between the plurality of groups of fourth sliding grooves on the side wall of the clamping plate; during operation, the clamping plate arranged on the side wall of the silica gel plate is utilized in the step, the contact area between the silica gel plate and the LED chip can be reduced through the supporting effect of the fourth chute and the half cylinder, so that the overall heating uniformity of the LED chip is improved, and the occurrence of uneven heating is reduced.
Preferably, the bottom of the clamping plate is fixedly connected with a second rotating shaft; the second rotating shaft is rotatably connected to the side wall of the silica gel plate; the side wall of the silica gel plate is connected with the side wall of the top of the clamping plate through a connecting plate; the connecting plate can be folded, and the middle part of the connecting plate is connected through a torsion spring; during operation, the torsion spring supporting effect of the connecting plate is utilized in the step, the side wall of the LED chip can be clamped when different types of LED chips are tested, the stability of the chip in the testing process is improved, and the blocking effect on the upper side of the chip is improved.
Preferably, the inner side wall of the first chute is rotatably connected with a plurality of groups of third rotating shafts; the side wall of the third rotating shaft is contacted with the side wall of the first connecting belt; during operation, the rotatable effect of the three rotary shafts of the plurality of groups is utilized, the transverse pulling effect between the first connecting belt and the silica gel plate can be kept when the first connecting belt moves, the running stability of equipment is improved, meanwhile, the contact between the first connecting belt and the side wall of the first sliding groove is reduced, and friction is reduced.
Preferably, the end parts of the plurality of groups of side baffles, which are far away from the first rotating shaft, are fixedly connected with baffle plates; during operation, the baffle plates arranged on the end parts of the side baffle plates can provide blocking for the collision columns, so that the collision columns provide blocking effect when contacting with the plurality of groups of collision plates, and the collision effect on the side walls of the plurality of groups of collision plates is continuously increased.
The beneficial effects of the invention are as follows:
1. the invention provides LED chip function test equipment, which can carry out corresponding position change aiming at chips of different types by utilizing the variability of a silica gel plate, limit the positions of the LED chips, keep the stability of the positions of the chips in the test process, reduce the distance between the chips to be relatively close, and cause the occurrence of chip mixing when the positions appear.
2. The invention provides LED chip function test equipment, which can drive a silica gel plate to carry out long-distance positions by utilizing the movable effect of a pressing plate, further increase the adaptability to LED chips of different types, and simultaneously assist the silica gel plate to clamp the side wall of the LED chip due to the supporting effect of a spring on the silica gel plate, so that the stability of the LED chip during test is increased.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the door of the present invention opened;
fig. 3 is a perspective view of the support plate of the present invention;
FIG. 4 is a partial cross-sectional view of a support plate of the present invention;
FIG. 5 is a schematic structural view of a crash panel of the present invention;
FIG. 6 is a perspective view of a silicone plate of the present invention;
legend description:
1. a steam experiment box; 11. a door; 12. a test bin; 13. a guide rail; 14. a support plate; 15. a silicone plate; 2. a first chute; 21. a positioning plate; 22. pressing the plate; 23. a limiting plate; 24. a first connecting belt; 3. placing a plate; 31. positioning piles; 32. a second chute; 33. a tapered column; 4. a collision plate; 41. a collision column; 42. a second connecting belt; 5. a third chute; 51. side baffles; 52. a first rotating shaft; 53. an arc plate; 6. an air duct; 61. shaking the ball; 7. a clamping plate; 71. a fourth chute; 72. a semi-cylinder; 8. a second rotating shaft; 81. a connecting plate; 9. a third rotating shaft; 101. and a breast board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 4, an LED chip function test apparatus includes a steam experiment box 1; a test bin 12 is arranged on the side wall of the steam experiment box 1; the outer side wall of the steam experiment box 1 is rotatably connected with a box door 11 at the position of the test bin 12; a pair of guide rails 13 are fixedly connected to the inner side wall of the test bin 12; the middle parts of the pair of guide rails 13 are slidably connected with a supporting plate 14; a plurality of groups of silica gel plates 15 are arranged on the surface of the supporting plate 14; during operation, in the process that the staff carries out PCT high-voltage accelerated ageing test to different models of LED chips, the staff can open chamber door 11, later through the movable effect of backup pad 14, take backup pad 14 out along guide rail 13 place, later buckle silica gel board 15, make interval between the multiple groups of silica gel boards 15 change, place the chip of different models, this step utilizes silica gel board 15 self variability, can carry out corresponding position change to different models of chips, carry out the position restriction to the LED chip, keep the stability of chip self position in the test process, reduce the distance between the chip nearer, cause the emergence of chip mixed condition when the position appears.
Referring to fig. 4, a first chute 2 is formed at a position where the top of the supporting plate 14 is located at the plurality of groups of silica gel plates 15; a positioning plate 21 is fixedly connected to the middle part of the first chute 2; a pressing plate 22 is connected above the positioning plate 21 in a sliding manner; the positioning plate 21 and the pressing plate 22 are connected through a spring; the end parts of the pressing plates 22 slide on the top surface of the supporting plate 14 and are positioned among the groups of silica gel plates 15; a limiting plate 23 is fixedly connected to the side wall of the top of the first chute 2; the silica gel plate 15 is sleeved on the limiting plate 23; a spring is connected between the side wall of the silica gel plate 15 and the side wall of the test bin 12; one end of a first connecting belt 24 is fixedly connected to the side wall of the pressing plate 22; the other end of the first connecting belt 24 is fixedly connected to the side wall of the silica gel plate 15; during operation, in the process that the staff placed the LED chip of different models, can produce the effect of pressing to pressing plate 22 in advance, make pressing plate 22 produce the downward removal, thereby produce the effect of pulling to connecting band 24, drive silica gel board 15 and shift, after the staff placed the chip, LED chip self weight is less than pressing plate 22 and the spring force between locating plate 21, can make pressing plate 22 reset, lose the effect of pulling to connecting band 24, make silica gel board 15 contact with the LED chip lateral wall under the spring effect, carry out the centre gripping operation to it, this step utilizes the movable effect of pressing plate 22, can drive the silica gel board 15 and carry out long distance position, further increase the adaptability to the LED chip of different models, the spring is to the supporting effect of silica gel board 15 simultaneously, can assist silica gel board 15 to carry out centre gripping processing to the LED chip lateral wall, stability when carrying out the test to the LED chip is increased.
Referring to fig. 3-4, a placement plate 3 is fixedly connected to the top of the pressing plate 22; a plurality of groups of second sliding grooves 32 are formed in the top surface of the placement plate 3; a plurality of groups of positioning piles 31 are fixedly connected inside the second chute 32; the top surface of the positioning pile 31 is fixedly connected with a conical column 33; during operation, placing board 3 can support the chip at the in-process that tests the LED chip, and at this moment, multiunit No. two spouts 32 of seting up on placing board 3 can cooperate toper post 33 and LED chip to contact, reduce the area of contact between placing board 3 and the LED chip, this step utilizes the supporting effect of placing board 3 to the chip, can keep the chip stable in position through the supporting effect of multiunit toper post 33 simultaneously, reduce the area of contact of placing board 3 and LED chip to stability when increasing the LED chip and testing reduces the emergence of the uneven condition of heating of LED chip.
Referring to fig. 4-5, a plurality of groups of collision plates 4 are fixedly connected below the first connecting belt 24 on the bottom side wall of the first chute 2; one end of a second connecting belt 42 is fixedly connected to the side wall of the first connecting belt 24; the other end of the second connecting belt 42 is fixedly connected with a collision column 41; the collision column 41 contacts with the side wall of the placing plate 3; during operation, in the process that the first connecting belt 24 is pulled to move, the second connecting belt 42 is driven to move along with the movement of the first connecting belt 24, so that the collision columns 41 move among the plurality of groups of collision plates 4 to generate collision effects with the plurality of groups of collision columns 41, the step utilizes the movement effects of the first connecting belt 24 to drive the collision columns 41 to move among the plurality of groups of collision plates 4 continuously, the collision effects are generated, dust impurities existing on the silica gel plate 15 can be cleaned through the transmission of vibration, and the fixing effect of the LED chip is increased.
Referring to fig. 4-5, a plurality of groups of third sliding grooves 5 are formed in the side walls of two sides of the plurality of groups of collision plates 4; a first rotating shaft 52 is hinged to the side wall of the third sliding chute 5; the first rotating shaft 52 is connected with the third sliding chute 5 through a torsion spring; a side baffle plate 51 is fixedly connected to the side wall of the first rotating shaft 52; a pair of arc plates 53 are connected between the side wall of the side baffle plate 51 and the side wall of the third chute 5; during operation, in the process that the collision column 41 moves under the pulling effect of the second connecting belt 42, the third sliding grooves 5 formed in the two sides of the collision plate 4 can allow the side baffles 51 to spread towards the two sides of the collision plate 4 from left to right and contact the collision column 41, at this time, the collision column 41 can produce an extrusion effect on the side baffles 51 under the pulling effect, when the extrusion force of the collision column 41 is greater than the torsion force of the first rotating shaft 52, the side baffles 51 can be driven to be recycled into the third sliding grooves 5, the collision column 41 can be directly contacted with the side walls of the collision plate 4 after the blocking is lost, the blocking effect of the side baffles 51 is utilized in the step, the impact force between the collision column 41 and the side walls of the collision plate 4 can be increased, so that the impact effect is increased, the vibration condition is initiated, the attachment of dust impurities on equipment is reduced, and the fixing effect on a chip is improved.
Referring to fig. 4, a cavity is left between the positioning plate 21 and the pressing plate 22; the side wall of the pressing plate 22 is fixedly connected with an air duct 6; the air duct 6 is communicated with the cavity; a rocking ball 61 is arranged at the bottom of the placing plate 3; the rocking ball 61 and the placing plate 3 are connected through a connecting rope; during operation, in the process that the pressing plate 22 is pressed to move, the cavity between the pressing plate 22 and the positioning plate 21 is compressed, internal gas is discharged outwards through the air duct 6, air flow drives the shaking ball 61 to swing left and right when the air flow is discharged, the shaking ball 61 contacts with the silica gel plate 15 and the side wall of the placing plate 3 to generate collision, the movable effect of the pressing plate 22 is utilized, air between the pressing plate 22 and the positioning plate 21 can contact with the side wall of the silica gel plate 15 through the air duct 6, dust impurities existing on the side wall of the silica gel plate 15 are contacted, the clamping effect of the subsequent silica gel plate 15 on the LED chips is increased, meanwhile, the shaking ball 61 swings left and right under the influence of the air flow, the placing plate 3 and the side wall of the silica gel plate 15 are impacted, and the adhesion of the dust impurities is reduced.
Referring to fig. 6, a plurality of groups of silica gel plates 15 are provided with clamping plates 7 on corresponding sidewalls thereof; a plurality of groups of fourth sliding grooves 71 are formed in the side wall of the clamping plate 7; a plurality of groups of semi-cylinders 72 are fixedly connected between the plurality of groups of fourth sliding grooves 71 on the side wall of the clamping plate 7; during operation, in the process that the silica gel plate 15 contacts with the LED chip, the clamping plate 7 arranged on the side wall of the silica gel plate 15 can support the side wall of the chip through the presence of the plurality of groups of the number four sliding grooves 71 matched with the half cylinders 72 arranged on the side wall of the silica gel plate 15, so that the clamping effect is increased, the step utilizes the clamping plate 7 arranged on the side wall of the silica gel plate 15, and the supporting effect of the number four sliding grooves 71 and the half cylinders 72 can be realized, so that the contact area between the silica gel plate 15 and the LED chip is reduced, the overall heating uniformity of the LED chip is increased, and the occurrence of uneven heating is reduced.
Referring to fig. 6, a second rotating shaft 8 is fixedly connected to the bottom of the clamping plate 7; the second rotating shaft 8 is rotatably connected to the side wall of the silica gel plate 15; the side wall of the silica gel plate 15 is connected with the side wall of the top of the clamping plate 7 through a connecting plate 81; the connecting plate 81 can be folded, and the middle part is connected through a torsion spring; during operation, in the process that grip block 7 and LED chip contacted, no. two pivot 8 of installation on the grip block 7 bottom can drive grip block 7 under the torsional spring support of connecting plate 81 and rotate, contact with the LED chip lateral wall, this step utilizes the torsional spring support effect of connecting plate 81, can carry out the centre gripping to the LED chip lateral wall when different model LED chips are tested, increase the stability of chip in the test process, increase the blocking effect to the chip top.
Referring to fig. 4, a plurality of groups of third rotating shafts 9 are rotatably connected to the inner side wall of the first chute 2; the side wall of the third rotating shaft 9 is contacted with the side wall of the first connecting belt 24; during operation, in the process that the first connecting band 24 is pulled by the pressing plate 22 to move, the multiple groups of third rotating shafts 9 mounted in the first sliding groove 2 can utilize the rotatable effect of the pressing plate, the moving track of the first connecting band 24 is changed, the rotatable effect of the multiple groups of third rotating shafts 9 is utilized in the step, the transverse pulling effect between the first connecting band 24 and the silica gel plate 15 can be kept when the first connecting band 24 moves, the running stability of equipment is improved, meanwhile, the contact between the first connecting band 24 and the side wall of the first sliding groove 2 is reduced, and friction is reduced.
Referring to fig. 5, the end portions of the side baffles 51 away from the first rotating shaft 52 are fixedly connected with a baffle 101; in operation, the side dams 51 are provided with a partial blocking effect on the side dams 41 by the side dams 101 mounted on the ends of the side dams 51 during contact between the collision posts 41 and the side dams 51, and this step provides a blocking effect on the collision posts 41 by the side dams 101 mounted on the ends of the side dams 51 so that the collision posts 41 provide a blocking effect on contact with the plurality of sets of collision plates 4, and the collision effect on the side walls of the plurality of sets of collision plates 4 is increased.
Working principle: in the process of carrying out PCT high-voltage accelerated aging test on LED chips with different models by a worker, the worker can open the box door 11, then draw the supporting plate 14 out along the position of the guide rail 13 through the movable effect of the supporting plate 14, then bend the silica gel plate 15, change the spacing between the groups of the silica gel plates 15, place chips with different models, press the pressing plate 22 in advance in the process of placing LED chips with different models by the worker, enable the pressing plate 22 to move downwards, thereby producing a pulling effect on the first connecting belt 24 to drive the silica gel plate 15 to displace, after placing chips by the worker, the weight of the LED chips is smaller than the spring force between the pressing plate 22 and the positioning plate 21, the pressing plate 22 is reset to lose the pulling effect on the first connecting belt 24, so that the silica gel plate 15 contacts with the side wall of the LED chip under the action of the spring to clamp the LED chip, the placing plate 3 can support the chip in the process of testing the LED chip, at the moment, the plurality of groups of second sliding grooves 32 formed on the placing plate 3 can be matched with the conical columns 33 to contact with the LED chip, the contact area between the placing plate 3 and the LED chip is reduced, the second connecting belt 42 is driven to move along with the movement of the first connecting belt 24 in the process of pulling the first connecting belt 24, the collision columns 41 are continuously moved between the plurality of groups of collision plates 4 to generate the collision effect between the plurality of groups of collision columns 41, and in the process of moving the collision columns 41 under the pulling effect of the second connecting belt 42, the third sliding groove 5 arranged at two sides of the collision plate 4 can allow the side baffle plate 51 to be unfolded towards two sides of the collision plate 4 from left to right downwards at the torsion spring to contact with the collision column 41, at this time, the collision column 41 can generate extrusion effect on the side baffle plate 51 under the pulling effect, when the extrusion force of the collision column 41 is larger than the torsion force of the first rotating shaft 52, the side baffle plate 51 can be driven to be recycled into the third sliding groove 5, the collision column 41 can directly contact with the side wall of the collision plate 4 after blocking is lost, in the process that the pressing plate 22 is pressed to move, the cavity between the pressing plate 22 and the positioning plate 21 can be compressed, the internal gas can be discharged outwards through the wind barrel 6, the air current can drive the shaking ball 61 to swing left and right when the air current is discharged, the shaking ball 61 contacts with the side wall of the silica gel plate 15 and the placing plate 3 to generate collision, in the process that the silica gel plate 15 contacts with the LED chip, the clamping plate 7 installed on the side wall of the silica gel plate 15 can support the side wall of the chip through the presence of a plurality of groups of sliding grooves 71 which are formed in the side wall of the clamping plate 7 and matched with semi-cylinders 72, so that the clamping effect is improved, the second rotating shaft 8 installed on the bottom of the clamping plate 7 can drive the clamping plate 7 to rotate under the support of the torsion spring of the connecting plate 81 to contact with the side wall of the LED chip, the plurality of groups of third rotating shafts 9 installed inside the first sliding groove 2 can utilize the rotatable effect of the pressing plate 22 to change the moving track of the first connecting belt 24, and the baffle plate 101 installed on the end part of the side baffle plate 51 can provide partial blocking effect for the collision post 41 in the contact process of the collision post 41 and the side baffle plate 51.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (10)
1. An LED chip function test device comprises a steam experiment box (1); a test bin (12) is arranged on the side wall of the steam experiment box (1); the outer side wall of the steam experiment box (1) is rotatably connected with a box door (11) at the position where the test bin (12) is located; the method is characterized in that: a pair of guide rails (13) are fixedly connected to the inner side wall of the test bin (12); the middle parts of the pair of guide rails (13) are connected with a supporting plate (14) in a sliding manner; and a plurality of groups of silica gel plates (15) are arranged on the surface of the supporting plate (14).
2. The LED chip functional test apparatus of claim 1, wherein: a first base chute (2) is formed in the position of the top of the supporting plate (14) where the plurality of groups of silica gel plates (15) are located; a positioning plate (21) is fixedly connected to the middle of the first chute (2); a pressing plate (22) is connected above the positioning plate (21) in a sliding manner; the positioning plate (21) is connected with the pressing plate (22) through a spring; the end parts of the pressing plates (22) slide on the top surface of the supporting plate (14) and are positioned among a plurality of groups of silica gel plates (15); a limiting plate (23) is fixedly connected to the side wall of the top of the first chute (2); the silica gel plate (15) is sleeved on the limiting plate (23); a spring is connected between the side wall of the silica gel plate (15) and the side wall of the test bin (12); one end of a first connecting belt (24) is fixedly connected to the side wall of the pressing plate (22); the other end of the first connecting belt (24) is fixedly connected to the side wall of the silica gel plate (15).
3. The LED chip functional test apparatus of claim 2, wherein: a placing plate (3) is fixedly connected to the top of the pressing plate (22); a plurality of groups of second sliding grooves (32) are formed in the top surface of the placement plate (3); a plurality of groups of positioning piles (31) are fixedly connected inside the second chute (32); the top surface of the positioning pile (31) is fixedly connected with a conical column (33).
4. The LED chip functional test apparatus of claim 2, wherein: a plurality of groups of collision plates (4) are fixedly connected below the first connecting belt (24) on the side wall of the bottom of the first sliding chute (2); one end of a second connecting belt (42) is fixedly connected to the side wall of the first connecting belt (24); the other end of the second connecting belt (42) is fixedly connected with a collision column (41); the collision column (41) is in contact with the side wall of the placement plate (3).
5. The LED chip functional test apparatus of claim 4, wherein: a plurality of groups of third sliding grooves (5) are formed in the side walls of two sides of the collision plates (4); a first rotating shaft (52) is hinged to the side wall of the third sliding groove (5); the first rotating shaft (52) is connected with the third sliding groove (5) through a torsion spring; a side baffle plate (51) is fixedly connected to the side wall of the first rotating shaft (52); a pair of arc plates (53) are connected between the side wall of the side baffle plate (51) and the side wall of the third chute (5).
6. A LED chip functional test apparatus according to claim 3, characterized in that: a cavity is reserved between the positioning plate (21) and the pressing plate (22); the side wall of the pressing plate (22) is fixedly connected with an air duct (6); the air duct (6) is communicated with the cavity; a shaking ball (61) is arranged at the bottom of the placing plate (3); the shaking ball (61) is connected with the placing plate (3) through a connecting rope.
7. The LED chip functional test apparatus of claim 1, wherein: clamping plates (7) are arranged on the corresponding side walls of the plurality of groups of silica gel plates (15); a plurality of groups of sliding grooves (71) are formed in the side wall of the clamping plate (7); and a plurality of groups of semi-cylinders (72) are fixedly connected between the plurality of groups of sliding grooves (71) on the side wall of the clamping plate (7).
8. The LED chip functional test apparatus of claim 7, wherein: a second rotating shaft (8) is fixedly connected to the bottom of the clamping plate (7); the second rotating shaft (8) is rotatably connected to the side wall of the silica gel plate (15); the side wall of the silica gel plate (15) is connected with the side wall of the top of the clamping plate (7) through a connecting plate (81); the connecting plate (81) can be folded, and the middle part is connected through a torsion spring.
9. The LED chip functional test apparatus of claim 2, wherein: a plurality of groups of rotating shafts (9) are rotatably connected to the inner side wall of the first chute (2); the side wall of the third rotating shaft (9) is contacted with the side wall of the first connecting belt (24).
10. The LED chip functional test apparatus of claim 5, wherein: the end parts of the plurality of groups of side baffles (51) far away from the first rotating shaft (52) are fixedly connected with baffle plates (101).
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