CN116539662A - Method, device, equipment and medium for measuring convective heat transfer coefficient - Google Patents
Method, device, equipment and medium for measuring convective heat transfer coefficient Download PDFInfo
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Abstract
The invention discloses a method, a device, equipment and a medium for measuring a convection heat transfer coefficient. Comprising the following steps: establishing a stable flow field based on a flat plate to be tested; acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature; and calculating the heat convection coefficient according to the temperature related information. The accuracy of the convective heat transfer coefficient measurement under the complex gas-heat environment is solved. Compared with a method for measuring the convective heat transfer coefficient based on a one-dimensional semi-infinite transient heat transfer model, the method is hardly influenced by the boundary condition of an initial temperature field. The application range is wide, and the method has good applicability to objects with high heat conductivity coefficients.
Description
Technical Field
The invention relates to the field of heat transfer science, in particular to a method, a device, equipment and a medium for measuring a convection heat transfer coefficient.
Background
In the flow heat exchange experimental research, a steady-state experimental method is used more, the requirements on experimental conditions are more severe, the steady state needs to reach heat balance, the experimental period is long, a large amount of manpower and material resources are required to be consumed, and the error is larger.
The transient method is widely applied to the convective heat transfer coefficient measurement experiment in recent years due to short experimental period and small error. At present, a transient heat exchange measurement method based on a one-dimensional semi-infinite transient heat conduction model is most commonly adopted, and has higher requirements on the aspects of high air flow temperature step speed, uniform temperature in solid, short heat non-penetration time (namely small heat conduction coefficient) and the like.
Disclosure of Invention
The invention aims to solve the problems of long experimental period, large consumption of manpower and material resources and large error in the prior art scheme, and provides a method, a device, equipment and a medium for measuring a convective heat transfer coefficient.
In a first aspect, an embodiment of the present disclosure provides a method for measuring a convective heat transfer coefficient, the method including:
establishing a stable flow field based on a flat plate to be tested;
acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature;
and calculating the heat convection coefficient according to the temperature related information.
Optionally, establishing a stable flow field based on the flat plate to be measured includes: obtaining target flow and determining an experimental section inlet of a flat plate to be tested; and opening an air source, and adjusting the flow at the inlet of the experimental section to the target flow so as to establish a stable flow field.
Optionally, obtaining temperature related information of the panel to be measured in the stable flow field includes: turning on the heater and determining a main flow temperature step phase of heating and a normal condition phase; determining the initial temperature and the main flow step temperature of the flat plate to be tested according to the main flow temperature step stage; determining the unsteady state temperature of the plate to be measured according to the normal condition stage; the initial temperature, the main stream step temperature and the unsteady state temperature are taken as temperature related information.
Optionally, determining the heated mainstream temperature step phase and the normal condition phase includes: when the main stream temperature at two sides of the flat plate to be detected is in step, determining the main stream temperature as a main stream temperature step stage; and determining the normal condition stage when the Fourier number is larger than a preset threshold value.
Optionally, determining the initial temperature and the main flow step temperature of the flat panel to be measured according to the main flow temperature step stage includes: determining initial time and final time corresponding to the main flow temperature step; acquiring the initial temperature of the plate to be measured in the stable flow field based on the initial moment; and acquiring the step temperature of the main flow at the two sides of the flat plate to be measured in the stable flow field based on the final moment.
Optionally, determining the unsteady state temperature of the plate to be measured according to the normal condition stage includes: acquiring appointed time, and determining target time when a panel to be tested enters a normal condition stage; and when the target time is consistent with the designated time, determining the wall surface temperature of the flat plate to be detected as the unsteady state temperature.
Optionally, calculating the heat convection coefficient according to the temperature related information includes: acquiring a convection heat transfer coefficient analysis equation and flat plate related information; and inputting the temperature related information and the plate related information into a convective heat transfer coefficient analysis equation to calculate a convective heat transfer coefficient, wherein the plate related information comprises plate thickness, heat conductivity coefficient, specific heat capacity and thermal diffusivity.
In a second aspect, embodiments of the present disclosure further provide a convective heat transfer coefficient measurement apparatus, the apparatus including:
the stable flow field establishing module is used for establishing a stable flow field based on the flat plate to be tested;
the temperature related information acquisition module is used for acquiring temperature related information of the flat plate to be detected in the stable flow field, wherein the temperature related information comprises an initial temperature, a main stream step temperature and an unsteady state temperature;
and the heat convection coefficient calculation module is used for calculating the heat convection coefficient according to the temperature related information.
In a third aspect, embodiments of the present disclosure further provide an electronic device, including:
at least one processor; and
a memory communicatively coupled to the at least one processor; wherein, the liquid crystal display device comprises a liquid crystal display device,
when the memory stores a computer program executable by the at least one processor, the computer program is executed by the at least one processor to enable the at least one processor to perform a method of measuring a heat transfer coefficient as in any embodiment of the present disclosure.
In a fourth aspect, embodiments of the present disclosure provide a computer storage medium having a computer program stored thereon, which when executed by a processor, implements a method of measuring a heat transfer coefficient as in any of the embodiments of the present disclosure.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Therefore, the invention has the following beneficial effects:
1. the technical defect of long steady-state experiment time and resource waste is overcome.
2. Compared to the one-dimensional semi-infinite method, is hardly affected by the initial temperature field boundary conditions.
3. The application range is wide, and the method has good applicability to objects with high heat conductivity coefficients.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for measuring a heat convection coefficient according to a first embodiment of the present invention;
FIG. 2 is a flow chart of another method for measuring a heat convection coefficient according to the first embodiment of the invention;
fig. 3 is a schematic diagram of a one-dimensional infinite plate-like transient heat exchange experimental model according to a second embodiment of the present invention;
FIG. 4 is a schematic diagram of a comparison result of heat convection coefficient verification according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a device for measuring a heat convection coefficient according to a third embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Fig. 1 is a flowchart of a method for measuring a heat convection coefficient according to an embodiment of the present invention, where the embodiment is applicable to a case of unsteady measuring a heat convection coefficient. The method may be performed by a convective heat transfer coefficient measurement apparatus provided by embodiments of the present disclosure, which may be implemented in software and/or hardware, and may be generally integrated in a computer device. The method of the embodiment of the disclosure specifically comprises the following steps:
s110: and establishing a stable flow field based on the plate to be tested.
The plate to be measured is a quasi-one-dimensional infinite plate, and the analytical solution of the unsteady heat conduction process is obtained through theoretical analysis based on the basic assumption of the one-dimensional infinite plate. In the experiment, a one-dimensional infinite plate was simulated by a plexiglass plate, and the temperature of the inlet air flow of the experimental section was measured by a thermocouple, as well as the change in wall temperature over time at different positions from the front edge of the plate. And finally, solving an analytical solution equation to obtain the convective heat transfer coefficient of the wall surface. The invention not only solves the technical defects of long steady-state experiment time and resource waste, but also is hardly influenced by the boundary condition of the initial temperature field compared with the one-dimensional semi-infinite method, and is also applicable to objects with high heat conductivity coefficient.
Optionally, establishing a stable flow field based on the flat plate to be measured includes: obtaining target flow and determining an experimental section inlet of a flat plate to be tested; and opening an air source, and adjusting the flow at the inlet of the experimental section to the target flow so as to establish a stable flow field.
S120, acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature.
Wherein the temperature related information is collected by a thermocouple. When the experimental environment is set, the periphery of the flow channel can be insulated, and a flat plate model made of organic glass is arranged in the center of the channel, so that flow fields on two sides of the flat plate are symmetrical. Thermocouples are arranged on the surface of the flat plate and the inlet of the experimental section, the number of the thermocouples can be two, the average value measured by the two thermocouples is taken as the main stream temperature, and then the thermocouples are arranged on the two sides of the flat plate at different distances from the front edge under the condition of ensuring that the flow field and the temperature field are not influenced.
Further, the data acquisition program is opened, and real-time measurement recording of the air flow and the temperature of the plane wall surface is completed through the thermocouple. A stable flow field is established firstly by introducing air with a certain flow rate. The temperature of the main stream is suddenly increased and kept stable at a certain moment, and the moment when the temperature is suddenly increased is taken as 0 moment, so that the time-varying data of the temperature of the flat plate is recorded.
Fig. 2 is a flowchart of a method for measuring a heat convection coefficient according to an embodiment of the present invention, and step S120 mainly includes steps S121 to S124 as follows:
s121, turning on the heater and determining a main stream temperature step phase of heating and a normal condition phase.
Optionally, determining the heated mainstream temperature step phase and the normal condition phase includes: when the temperature of the flat plate to be measured is subjected to main flow step, determining the main flow step as a main flow temperature step stage; and determining the normal condition stage when the Fourier number is larger than a preset threshold value.
S122, determining the initial temperature and the main flow step temperature of the flat plate to be tested according to the main flow temperature step stage.
Optionally, determining the initial temperature and the main flow step temperature of the flat panel to be measured according to the main flow temperature step stage includes: determining initial time and final time corresponding to the main flow temperature step stage; acquiring the initial temperature of the plate to be measured in the stable flow field based on the initial moment; and acquiring the step temperature of the main flow at the two sides of the flat plate to be measured in the stable flow field based on the final moment.
S123, determining the unsteady temperature of the plate to be tested according to the normal condition stage.
Optionally, determining the unsteady state temperature of the plate to be measured according to the normal condition stage includes: acquiring a designated time tau and determining a target time when a panel to be tested enters a normal condition stage; and when the target time is consistent with the designated time, determining the wall surface temperature of the flat plate to be detected as the unsteady state temperature.
And S124, taking the initial temperature, the main stream step temperature and the unsteady state temperature as temperature related information.
S130: and calculating the heat convection coefficient according to the temperature related information.
Optionally, calculating the heat convection coefficient according to the temperature related information includes: acquiring a convection heat transfer coefficient analysis equation and flat plate related information; and inputting the temperature related information and the plate related information into a convective heat transfer coefficient analysis equation to calculate a convective heat transfer coefficient, wherein the plate related information comprises plate thickness, heat conductivity coefficient, specific heat capacity and thermal diffusivity.
The convective heat transfer coefficient analytical equation is expressed by the following formula:
wherein delta is half thickness of the flat plate, x is distance from the center section of the flat plate, tau is time, starting timing with the time of starting the temperature step being 0s, h is convective heat transfer coefficient, lambda is thermal conductivity coefficient of the flat plate, c p Is the specific heat capacity of the plate, ρ is the density of the plate. Obtaining the temperature T at the x position at the 0 moment of the initial state of the flat plate through the step 2 0 Temperature T after main flow step ∞ At a certain moment tau in the unsteady state normal condition stage, and the temperatures T, eta at the corresponding moment x are dimensionless, the central position eta of the flat plate is=0, and the surface position eta of the flat plate is=1. a is thermal diffusivity, and a is an index of the capability of the material to propagate temperature change, and the larger the value is, the larger the capability of the internal temperature of the object to be leveled is. Excess temperature θ (η, τ) =t-T ∞ Is the temperature T of the solid at the position of the tau moment eta and the temperature T of the main flow ∞ Is a difference in (c). θ 0 Is the excess temperature at the initial time. Bi is the number of Pichia, and represents the relative magnitude of the heat conduction resistance and the surface convection heat conduction heat. Fo is the fourier number, the dimensionless time characterizing the depth of progression of the unsteady state process. The larger Fo, the deeper the thermal disturbance propagates into the interior of the object.
According to the technical scheme, a stable flow field is established based on the flat plate to be detected; acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature; and calculating the heat convection coefficient according to the temperature related information. The technical defect of long steady-state experiment time and resource waste is overcome. Compared to the one-dimensional semi-infinite method, is hardly affected by the initial temperature field boundary conditions. The application range is wide, and the method has good applicability to objects with high heat conductivity coefficients.
Example two
Fig. 3 is a schematic diagram of a one-dimensional infinite plate-like transient heat exchange experimental model according to a second embodiment of the present invention, and the present embodiment is described with reference to a specific application scenario on the basis of the first embodiment.
In fig. 3, 1 is a fluid field, 2 is a flat plate, 3 is a heat-insulating wall surface with low heat conductivity coefficient, 4 is a K-type thermocouple, 5 is an air flow inlet, 6 is an air flow outlet, 7 is a timer, 8 is a temperature scanning valve, and 9 is an acquisition system.
Illustratively, in this embodiment, the periphery of the flow channel is surrounded by a heat insulating material. The flat plate 2 made of organic glass is 20mm thick (y direction in fig. 3), 400mm long (x direction in fig. 3) and 260mm wide (z direction in fig. 3) and is fixed in the center of the flow channel, so that the flow fields on both sides of the flat plate are symmetrical. Thermocouples 4 are mounted on both side surfaces of the plate for measuring the temperature of the wall. The inlet of the test section is also provided with a thermocouple 4 for measuring the temperature of the main flow, and the acquisition system is connected with the temperature scanning valve to acquire temperature data.
Further, two thermocouples are installed at the inlet of the experimental section, and the average value measured by the two thermocouples is taken as the main stream temperature. Under the condition that the flow field and the temperature field are not affected, thermocouples are arranged on the two side surfaces of the flat plate at different distances from the front edge to measure the wall surface temperature of the flat plate, and the wiring of the thermocouples is along the z direction in fig. 3. The acquisition system 9 and the data acquisition program are opened, and the changes of parameters such as flow, temperature and the like in the experimental section can be monitored and recorded in real time through the acquisition program. The air source is opened, the flow of the inlet is regulated to be certain, and the flow field is stable. When the flow field reaches a stable state, the heater is turned on at a certain moment to keep the temperature stable after the main flow temperature is stepped, and the time is taken as 0 moment, and the data of the change of the wall surface temperature of the flat plate and the main flow temperature along with time are recorded through a data acquisition program and the thermocouple 4.
Specifically, after the experiment is completed, the convective heat transfer coefficient of the surface of the flat plate can be obtained by processing data. The collected experimental data can be output at intervals of 1s through a data collection program. And substituting the acquired initial temperature, main stream step temperature and turntable heat exchange to a certain moment tau in the normal state stage and the corresponding unsteady temperature into a convection heat exchange coefficient analysis equation to obtain a convection heat exchange coefficient.
Further, fig. 4 is a schematic diagram of a comparison result of convective heat transfer coefficient verification provided in the embodiment of the present invention, where fig. 4 includes a comparison result of a plate transient heat transfer experiment convective heat transfer coefficient result and an outward-swept plate empirical relation, where the heat transfer coefficient results at the corresponding positions are similar, and the maximum deviation is 5.3%. The accuracy of the method was verified from the results.
According to the technical scheme, a stable flow field is established based on the flat plate to be detected; acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature; and calculating the heat convection coefficient according to the temperature related information. The technical defect of long steady-state experiment time and resource waste is overcome. Compared to the one-dimensional semi-infinite method, is hardly affected by the initial temperature field boundary conditions. The application range is wide, and the method has good applicability to objects with high heat conductivity coefficients.
Example III
Fig. 5 is a schematic structural diagram of a device for measuring a heat convection coefficient according to a third embodiment of the present invention. The apparatus may be implemented in software and/or hardware and may generally be integrated in an electronic device for performing the method.
As shown in fig. 5, the apparatus includes: a stable flow field establishing module 310 for establishing a stable flow field based on the flat plate to be measured; the temperature related information obtaining module 320 is configured to obtain temperature related information of the flat panel to be measured in the stable flow field, where the temperature related information includes an initial temperature, a main flow step temperature, and an unsteady state temperature; and a heat convection coefficient calculating module 330 for calculating the heat convection coefficient according to the temperature related information.
Optionally, the stable flow field establishment module 310 is specifically configured to: obtaining target flow and determining an experimental section inlet of a flat plate to be tested; and opening an air source, and adjusting the flow at the inlet of the experimental section to the target flow so as to establish a stable flow field.
Optionally, the temperature related information obtaining module 320 specifically includes: a heating and stage determining unit for turning on the heater and determining a main flow temperature step stage and a normal condition stage of heating; the main flow temperature step stage temperature determining unit is used for determining the initial temperature and the main flow step temperature of the flat plate to be detected according to the main flow temperature step stage; the normal condition stage temperature determining unit is used for determining the unsteady state temperature of the flat plate to be detected according to the normal condition stage; and the temperature related information generating unit is used for taking the initial temperature, the main stream step temperature and the unsteady state temperature as temperature related information.
Optionally, the heating and stage determining unit is specifically configured to: when the temperature of the flat plate to be measured is subjected to main flow step, determining the main flow temperature step stage; and determining the normal condition stage when the Fourier number is larger than a preset threshold value.
Optionally, the main flow temperature step stage temperature determining unit is specifically configured to: determining initial time and final time corresponding to the main flow temperature step; acquiring the initial temperature of the plate to be measured in the stable flow field based on the initial moment; and acquiring the step temperature of the main flow at the two sides of the flat plate to be measured in the stable flow field based on the final moment.
Optionally, the normal condition phase temperature determining unit is specifically configured to: acquiring a designated time tau and determining a target time when a panel to be tested enters a normal condition stage; and when the target time is consistent with the designated time, determining the wall surface temperature of the flat plate to be detected as the unsteady state temperature.
Optionally, the heat convection coefficient calculating module 330 is specifically configured to: acquiring a convection heat transfer coefficient analysis equation and flat plate related information; and inputting the temperature related information and the plate related information into a convective heat transfer coefficient analysis equation to calculate a convective heat transfer coefficient, wherein the plate related information comprises plate thickness, heat conductivity coefficient, specific heat capacity and thermal diffusivity.
According to the technical scheme, a stable flow field is established based on the flat plate to be detected; acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature; and calculating the heat convection coefficient according to the temperature related information. The technical defect of long steady-state experiment time and resource waste is overcome. Compared to the one-dimensional semi-infinite method, is hardly affected by the initial temperature field boundary conditions. The application range is wide, and the method has good applicability to objects with high heat conductivity coefficients.
The convection heat transfer coefficient measuring device provided by the embodiment of the invention can execute the convection heat transfer coefficient measuring method provided by any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the executing method.
Example IV
Fig. 6 shows a schematic diagram of the structure of an electronic device 10 that may be used to implement an embodiment of the invention. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. Electronic equipment may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
As shown in fig. 6, the electronic device 10 includes at least one processor 11, and a memory, such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc., communicatively connected to the at least one processor 11, in which the memory stores a computer program executable by the at least one processor, and the processor 11 may perform various appropriate actions and processes according to the computer program stored in the Read Only Memory (ROM) 12 or the computer program loaded from the storage unit 18 into the Random Access Memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 may also be stored. The processor 11, the ROM 12 and the RAM 13 are connected to each other via a bus 14. An input/output (I/O) interface 15 is also connected to bus 14.
Various components in the electronic device 10 are connected to the I/O interface 15, including: an input unit 16 such as a keyboard, a mouse, etc.; an output unit 17 such as various types of displays, speakers, and the like; a storage unit 18 such as a magnetic disk, an optical disk, or the like; and a communication unit 19 such as a network card, modem, wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices via a computer network, such as the internet, and/or various telecommunication networks.
The processor 11 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as the convective heat transfer coefficient measurement method. Namely: establishing a stable flow field based on a flat plate to be tested; acquiring temperature related information of a plate to be detected in a stable flow field, wherein the temperature related information comprises an initial temperature, a main flow step temperature and an unsteady state temperature; and calculating the heat convection coefficient according to the temperature related information.
In some embodiments, the heat transfer coefficient measurement method may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 10 via the ROM 12 and/or the communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the convective heat transfer coefficient measurement method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the convective heat transfer coefficient measurement method in any other suitable manner (e.g., by means of firmware).
Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.
A computer program for carrying out methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions/acts specified in the flowchart and/or block diagram block or blocks to be implemented. The computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.
In the context of the present invention, a computer-readable storage medium may be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium may be a machine readable signal medium. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) through which a user can provide input to the electronic device. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.
The systems and techniques described here can be implemented in a computing system that includes a background component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such background, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), blockchain networks, and the internet.
The computing system may include clients and servers. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also called a cloud computing server or a cloud host, and is a host product in a cloud computing service system, so that the defects of high management difficulty and weak service expansibility in the traditional physical hosts and VPS service are overcome.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1.A method for measuring a convective heat transfer coefficient, comprising:
establishing a stable flow field based on a flat plate to be tested;
acquiring temperature related information of the flat plate to be detected in the stable flow field, wherein the temperature related information comprises an initial temperature, a main stream step temperature and an unsteady state temperature;
and calculating a heat convection coefficient according to the temperature related information.
2. The method for measuring a convective heat transfer coefficient according to claim 1, wherein the establishing a stable flow field based on the flat plate to be measured comprises:
obtaining target flow and determining an experimental section inlet of the flat plate to be tested;
and opening an air source, and adjusting the flow at the inlet of the experimental section to the target flow so as to establish the stable flow field.
3. The method for measuring a convective heat transfer coefficient according to claim 1, wherein the obtaining temperature-related information of the plate to be measured in the stable flow field comprises:
turning on the heater and determining a main flow temperature step phase of heating and a normal condition phase;
determining the initial temperature and the main stream step temperature of the flat panel to be tested according to the main stream temperature step stage;
determining the unsteady state temperature of the flat plate to be tested according to the normal condition stage;
and taking the initial temperature, the main stream step temperature and the unsteady state temperature as the temperature related information.
4. A method of measuring a convective heat transfer coefficient according to claim 3, wherein said determining a heated mainstream temperature step phase and a normal condition phase comprises:
when the temperature of the flat plate to be detected is subjected to main flow step, determining the main flow temperature step;
and determining the normal condition stage when the Fourier number is larger than a preset threshold value.
5. A method of measuring a convective heat transfer coefficient according to claim 3, wherein said determining the initial temperature and the mainstream step temperature of the flat panel to be measured from the mainstream temperature step phase comprises:
determining initial time and final time corresponding to the step of the main flow temperature;
acquiring the initial temperature of the flat plate to be detected in the stable flow field based on the initial moment;
and acquiring the step temperature of the main flow at the two sides of the flat plate to be detected in the stable flow field based on the final moment.
6. A method of measuring a heat convection coefficient according to claim 3, wherein said determining an unsteady state temperature of said plate under test based on said normal condition phase comprises:
acquiring appointed time, and determining target time of the plate heat exchange to be detected entering the normal condition stage;
and when the target time is consistent with the designated time, determining the wall surface temperature of the flat plate to be detected as the unsteady state temperature.
7. The method of claim 1, wherein calculating the convective heat transfer coefficient from the temperature-related information comprises:
acquiring a convection heat transfer coefficient analysis equation and flat plate related information;
and inputting the temperature related information and the flat plate related information into the convective heat transfer coefficient analysis equation to calculate a convective heat transfer coefficient, wherein the flat plate related information comprises a plate thickness, a heat conduction coefficient, a specific heat capacity and a thermal diffusivity.
8. A convective heat transfer coefficient measurement device, comprising:
the stable flow field establishing module is used for establishing a stable flow field based on the flat plate to be tested;
the temperature related information acquisition module is used for acquiring temperature related information of the flat plate to be detected in the stable flow field, wherein the temperature related information comprises an initial temperature, a main stream step temperature and an unsteady state temperature;
and the heat convection coefficient calculation module is used for calculating the heat convection coefficient according to the temperature related information.
9. An electronic device, the electronic device comprising:
at least one processor; and
a memory communicatively coupled to the at least one processor; wherein, the liquid crystal display device comprises a liquid crystal display device,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the method of claims 1-7.
10. A computer storage medium storing computer instructions for causing a processor to perform the method of claims 1-7 when executed.
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