CN116539658A - Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface - Google Patents
Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface Download PDFInfo
- Publication number
- CN116539658A CN116539658A CN202310490203.2A CN202310490203A CN116539658A CN 116539658 A CN116539658 A CN 116539658A CN 202310490203 A CN202310490203 A CN 202310490203A CN 116539658 A CN116539658 A CN 116539658A
- Authority
- CN
- China
- Prior art keywords
- layered
- thermal expansion
- dimensional material
- expansion coefficient
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 142
- 238000000691 measurement method Methods 0.000 title description 5
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000000126 substance Substances 0.000 claims abstract description 21
- 238000005452 bending Methods 0.000 claims description 15
- 230000005587 bubbling Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- 238000001228 spectrum Methods 0.000 claims description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000000833 X-ray absorption fine structure spectroscopy Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 25
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 10
- 230000006399 behavior Effects 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000013590 bulk material Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 4
- 238000011056 performance test Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910002665 PbTe Inorganic materials 0.000 description 1
- 239000005922 Phosphane Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 238000001237 Raman spectrum Methods 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 1
- 238000000619 electron energy-loss spectrum Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000329 molecular dynamics simulation Methods 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229910000064 phosphane Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/16—Investigating or analyzing materials by the use of thermal means by investigating thermal coefficient of expansion
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention provides a method for measuring the thermal expansion coefficient of a layered two-dimensional material surface and application thereof, wherein the method comprises the following steps: measuring the flexural rigidity delta of a layered two-dimensional material in a direction perpendicular to a plane and the coefficient of thermal expansion alpha of chemical bonds in the layered two-dimensional material bond Substituting into the formula (1) to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；α s ＝2α bond -50/delta (1). The invention provides a method for obtaining the thermal expansion coefficient of the two-dimensional material through conversion by combining the two test schemes for the first time. The measuring method has the advantages of simple operation, movable test data, wide coverage temperature range and stable result.
Description
Technical Field
The invention relates to the technical field of measurement, in particular to a measurement method and application of a thermal expansion coefficient of a layered two-dimensional material surface.
Background
With the miniaturization and microminiaturization of electronic equipment and the development of flexible electronic materials, research and development of a new generation of nano functional devices are needed, and two-dimensional materials represented by graphene, black phosphane, molybdenum disulfide and the like have natural nano thickness, good flexibility and rich functional characteristics, so that the nano functional devices have great application potential. However, two-dimensional materials typically have lamellar properties, with layers often bonded in the form of stronger covalent bonds, and layers often bonded in weaker van der Waals forces. The layered characteristic determines that a laminated structure is inevitably adopted from processing preparation to application service of the two-dimensional material, so that a heterojunction between the two-dimensional material and a matrix or between different two-dimensional materials is formed, and the problem of thermal matching between different materials becomes a key problem for determining the functional characteristic of the two-dimensional material, and at the moment, the thermal expansion coefficients of the different two-dimensional materials need to be measured or estimated.
The coefficient of thermal expansion is defined as the rate of change of the dimensions of a material with temperature. Therefore, for bulk materials, the principle of measuring the thermal expansion coefficient is simple, and only the dimensions (length, area, volume and the like) of the materials at different temperatures need to be measured. However, for two-dimensional materials, the thermal fluctuation of the material is huge due to the small size of the material, so that the temperature of the material is difficult to accurately measure, and the material often has a transparent state, so that the size of the material is difficult to accurately measure, and the thermal expansion coefficient of the two-dimensional material is difficult to directly measure like a bulk material. The existing method for directly measuring the thermal expansion coefficient is mainly a thermal bubbling method, namely, the suspended material is heated, the deflection change of the suspended material is measured, and then the corresponding thermal expansion coefficient is calculated. More indirect methods are used, such as raman spectroscopy, electron energy loss spectroscopy, etc., to map the temperature or size of the system with the target observed quantity, and then to obtain the thermal expansion coefficient. However, most indirect testing methods have difficulty in eliminating the effect of the substrate material on thermal expansion properties.
Disclosure of Invention
In order to solve the technical problems, the invention provides a measurement method and application of a thermal expansion coefficient of a layered two-dimensional material surface, and also provides a measurement method and application of a thermal expansion coefficient of a layered two-dimensional material surface.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the invention provides a method for measuring the thermal expansion coefficient of a layered two-dimensional material surface,the method comprises the following steps: measuring the flexural rigidity delta of a layered two-dimensional material in a direction perpendicular to a plane and the coefficient of thermal expansion alpha of chemical bonds in the layered two-dimensional material bond Substituting into the formula (1) to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；α s ＝2α bond -50/delta (1). The invention provides a method for obtaining the thermal expansion coefficient of the two-dimensional material through conversion by combining the two test schemes for the first time.
Further, the units of bending rigidity and thermal expansion coefficient are respectively 10 and eV -6 ·K -1 . If other units are used, the coefficient of thermal expansion of the material can be estimated using this relationship after conversion.
Further, the flexural rigidity delta of the layered two-dimensional material in the direction perpendicular to the plane is measured by a pressurized bubbling method.
Further, the thermal expansion coefficient alpha of the chemical bond in the layered two-dimensional material bond X-ray absorption fine structure spectrum measurement was used.
Further, the method specifically comprises the following steps: preparing a layered two-dimensional material; measuring the coefficient of thermal expansion alpha of chemical bonds in said layered two-dimensional material by means of X-ray absorption fine structure spectroscopy bond The method comprises the steps of carrying out a first treatment on the surface of the Transferring the layered two-dimensional material to a substrate material with small holes, and measuring the bending rigidity delta of the layered two-dimensional material in the direction perpendicular to the plane by a pressurized bubbling method; coefficient of thermal expansion alpha of chemical bond to be measured bond And bending stiffness delta are substituted into formula (1) to calculate to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；α s ＝2α bond -50/delta (1). The invention is mainly intended to protect the evaluation of the thermal expansion coefficient of a two-dimensional layered material by bending stiffness and chemical bond characteristics. The method provides a simple and feasible scheme only for the preparation of two-dimensional materials, the bending stiffness test and the test of chemical bond thermal expansion behavior. And other methods (physical or chemical vapor deposition) are adopted to prepare the two-dimensional material, the mechanical property and the chemical bond thermal expansion coefficient are measured, and the quantitative relationship in the invention can be adopted to obtain the thermal expansion coefficient of the material.
Further, in the preparing a layered two-dimensional material, it includes: the layered two-dimensional material is prepared by adopting a mechanical stripping method, a physical vapor deposition method or a chemical vapor deposition method.
The invention also provides application of the measuring method for the thermal expansion coefficient of the layered two-dimensional material surface in the field of measuring or evaluating the thermal expansion coefficients of different two-dimensional materials.
Compared with the prior art, the technical scheme provided by the invention has at least the following advantages:
1. the invention changes the complex thermal performance test into mechanical performance test, does not need to analyze the flexing morphology of the material, and only needs to measure the height of the bubbling, thus greatly reducing the test difficulty and improving the test accuracy.
2. The test data may be migrated. This is mainly aimed at the thermal expansion behavior of covalent bonds, which can be recorded by only testing once for the same system, and the invention discovers that the thermal expansion behavior of covalent bonds is an intrinsic property of the bonds and has no relation with the size, state and dimension of materials. Once the database is established, the test can be omitted, and the test cost is greatly reduced.
3. The coverage temperature range is wide. In the range of 0-500K (the service temperature range of most two-dimensional materials is covered), the physical quantity changes of the materials such as bending stiffness, thermal expansion coefficient and the like are very small, so that the thermal expansion behavior of the materials in a wider range can be evaluated by only testing once.
4. The result was stable. The quantitative relation between the bending rigidity and the thermal expansion coefficient in the layered two-dimensional material is stable and reliable, and is suitable for different material systems.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, which are not to be construed as limiting the embodiments unless specifically indicated otherwise.
FIG. 1 is a flow chart of a test method provided by an embodiment of the present invention;
FIG. 2 shows stones of different layer thicknesses in the examples of the inventionGraphene and MoS 2 A value of a change in bond length of the covalent bond with temperature;
FIG. 3 is a graph showing the variation of dimensions of different two-dimensional materials with temperature in an embodiment of the present invention;
FIG. 4 is a graph showing the quantitative relationship between the thermal expansion coefficients and the flexural rigidity of different materials in the examples of the present invention.
Detailed Description
The inventors have found that existing experimental methods for determining the coefficient of thermal expansion of a two-dimensional material can be divided into two categories, namely a direct method and an indirect method.
The direct method is to measure the dimensional change of the material at different temperatures so as to directly obtain the thermal expansion coefficient of the material. It is common practice to heat a suspended two-dimensional material, then the material is deformed by flexing due to thermal expansion, and the dimensional change is determined by measuring the deformed length. The method has the main problems that the preparation of a test sample is complex, the success rate is low, the subsequent test needs to observe the change of the morphology of the material, the method is complex, and errors can be artificially introduced. This not only increases the test cost but also reduces the test efficiency and accuracy.
The indirect method is to build a mapping between the temperature or the size of the system and the target observed quantity by means of Raman spectrum, electron energy loss spectrum and other methods, and then to obtain the thermal expansion coefficient. However, most indirect testing methods have difficulty in eliminating the effect of the substrate material on thermal expansion properties. The thermal expansion performance of the material is obviously different on different substrates, and the thermal expansion behaviors of different materials on the same substrate cannot be directly compared. Thus, the results measured by this method are not intrinsic properties of the material, and the measured results have poor mobility and poor comparability.
The invention is based on finding out the quantitative relation between the thermal expansion coefficient of the two-dimensional material and the mechanical property (bending stiffness) and the intrinsic thermal expansion behavior of the chemical bond, and indirectly obtains the thermal expansion coefficient of the two-dimensional material by using a mature bending stiffness test technology and a chemical bond thermal expansion performance test technology. The method has the advantages of simplicity in operation, lower cost and higher efficiency. It should be noted in particular that the intrinsic thermal expansion behavior of the chemical bonds is independent of the dimensions (number of layers) of the material, and therefore, for the same material system, this property needs to be tested only once, which can greatly reduce the test cost and improve the efficiency.
The invention provides a method for measuring the thermal expansion coefficient of a layered two-dimensional material surface, which comprises the following steps:
measuring the flexural rigidity delta of a layered two-dimensional material in a direction perpendicular to a plane and the coefficient of thermal expansion alpha of chemical bonds in the layered two-dimensional material bond Substituting into the formula (1) to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；
α s ＝2α bond –50/δ (1)。
The present invention will be described in detail with reference to the following embodiments.
Examples
The invention provides a method for indirectly obtaining the thermal expansion coefficient of a two-dimensional material, which comprises the following steps of firstly measuring the bending stiffness delta of the two-dimensional material and the thermal expansion coefficient alpha of a chemical bond bond The coefficient of thermal expansion of the material was then calculated from the quantitative relationship found in the present invention (equation (1)). A specific test scheme flow chart is shown in fig. 1.
Fig. 1 is a flowchart of a test method according to an embodiment of the present invention. The test protocol of the present invention is divided into 4 steps, wherein step 1 is the preparation of layered two-dimensional materials, which uses a mechanical exfoliation method that can prepare the vast majority of layered two-dimensional materials. Step 2 is measuring the coefficient of thermal expansion of chemical bonds in the material by X-ray absorption of the fine structure spectrum. Step 3 is to measure the flexural rigidity of the material by bubbling, before the measurement, the material should be transferred to a substrate material where small holes are dug. Step 4, substituting the obtained thermal expansion coefficient alpha of the chemical bond into the calculation bond And the flexural rigidity delta is directly substituted into the formula (1) to be calculated, so that the thermal expansion coefficient of the material can be directly obtained.
α s ＝2α bond –50/δ (1)。
Firstly, there are various preparation methods of two-dimensional materials, but the invention selects the most widely used stripping method to prepare the two-dimensional materials, and almost all layered two-dimensional materials can be obtained by using the method. The two-dimensional material prepared by the method has the advantages of large area, few defects, easy transfer, controllable layer number and the like.
Secondly, carrying out X-ray absorption fine structure spectrum test on the bulk material, measuring the change of covalent bond length along with temperature in the material, and further obtaining the thermal expansion coefficient alpha of the chemical bond bond . It is worth noting that we do not directly measure the X-ray absorption fine structure spectrum of a two-dimensional material, but rather directly measure a bulk material, since for a layered two-dimensional material the covalent bonds inside are the same as in the bulk. The test difficulty and the test cost of the block body are greatly reduced compared with those of the layered two-dimensional material. Furthermore, the present invention also found that the coefficient of thermal expansion of the covalent bonds did not have a significant layer thickness dependence (as shown in FIG. 2). Thus, alpha of bulk material can be used bond . It should be noted that, corresponding to a two-dimensional material, it is a bulk material, i.e., a material having length characteristics in three dimensions. By two-dimensional material is meant that the in-plane dimension of the material is much larger than the dimension perpendicular to the plane. The two-dimensional material can be prepared by a mechanical stripping method, and the state before stripping is corresponding to a block material, for example, the block material corresponding to graphene is graphite.
In FIG. 2, graphene and MoS are respectively formed in different layer thicknesses at (a) and (b) 2 The covalent bond length of (c) varies with temperature. This bond length change is the result of molecular dynamics simulation. The slope of the dotted line in the figure is then compared with alpha for each material bond Proportional to the ratio. It is calculated that, despite the different layer thicknesses of the materials, α is bond There is little distinction.
Thirdly, measuring the flexural rigidity of the layered two-dimensional material by a bubbling method. The basic principle is that a two-dimensional material is covered on a small hole, and the bubbling of the material is realized through a pressure difference p on two sides of the hole. The pressure difference p, the radius of the hole a, the thickness of the material t and the height of the blister h are all observables. The relationship between these observations and the Young's modulus E and bending stiffness delta of the material can be obtained according to equation (2).
Where A (v) is approximately equal to (0.7179-0.1406 v-0.1495v 2) -3, as a function of the Poisson's ratio v of the material. Therefore, the bending stiffness delta of the material can be obtained by measuring the bubbling height of the material under different pressure differences.
And finally substituting the flexural rigidity of the material obtained by measurement into the formula (1) and the thermal expansion coefficient of the chemical bond to obtain the thermal expansion coefficient of the layered two-position material.
Fig. 3 shows the variation of the dimensions of different two-dimensional materials with temperature. It can be seen that the material dimensions change linearly over a given temperature interval, representing a constant coefficient of thermal expansion. In FIG. 3, (a) is a single layer of hBN, (b) is a single layer of PbTe, (c) is 1-3 layers of graphene, and (d) is 1-3 layers of MoS 2 Is a function of temperature. The stable linear relationship represents a material having a constant coefficient of thermal expansion over a given temperature interval.
From fig. 4, it can be seen that the quantitative relationship shown in formula (1) is satisfied between the thermal expansion coefficient and the flexural rigidity of the different materials.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of implementing the present application and that various changes in form and details may be made therein without departing from the spirit and scope of the present application. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention shall be defined by the appended claims.
Claims (7)
1. A method for measuring the thermal expansion coefficient of a layered two-dimensional material surface, which is characterized by comprising the following steps:
measuring the flexural rigidity delta of a layered two-dimensional material in a direction perpendicular to a plane and the coefficient of thermal expansion alpha of chemical bonds in the layered two-dimensional material bond Substituting into the formula (1) to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；
α s ＝2α bond –50/δ(1)。
2. The method for measuring the thermal expansion coefficient of a layered two-dimensional material surface according to claim 1, wherein the units of bending rigidity δ are eV and the units of thermal expansion coefficient are 10 -6 ·K -1 。
3. The method for measuring the thermal expansion coefficient of the layered two-dimensional material according to claim 1, wherein the flexural rigidity δ of the layered two-dimensional material in the direction perpendicular to the plane is measured by a pressurized bubbling method.
4. The method for measuring the thermal expansion coefficient of a layered two-dimensional material according to claim 1, wherein the thermal expansion coefficient α of a chemical bond in the layered two-dimensional material bond X-ray absorption fine structure spectrum measurement was used.
5. The method for measuring the thermal expansion coefficient of the layered two-dimensional material surface according to claim 1, wherein the method specifically comprises the following steps:
preparing a layered two-dimensional material;
measuring the coefficient of thermal expansion alpha of chemical bonds in said layered two-dimensional material by means of X-ray absorption fine structure spectroscopy bond ；
Transferring the layered two-dimensional material to a substrate material with small holes, and measuring the bending rigidity delta of the layered two-dimensional material in the direction perpendicular to the plane by a pressurized bubbling method;
the thermal expansion coefficient alpha of the chemical bond to be measured bond And bending stiffness delta are substituted into formula (1) to calculate to obtain the surface thermal expansion coefficient alpha of the layered two-dimensional material s ；
α s ＝2α bond –50/δ(1)。
6. The method for measuring the thermal expansion coefficient of the layered two-dimensional material according to claim 5, wherein the preparing of the layered two-dimensional material comprises: the layered two-dimensional material is prepared by adopting a mechanical stripping method, a physical vapor deposition method or a chemical vapor deposition method.
7. Use of the method for measuring the thermal expansion coefficient of a surface of a layered two-dimensional material according to any one of claims 1 to 6 in the field of measuring or evaluating the thermal expansion coefficients of different two-dimensional materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310490203.2A CN116539658A (en) | 2023-05-04 | 2023-05-04 | Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310490203.2A CN116539658A (en) | 2023-05-04 | 2023-05-04 | Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116539658A true CN116539658A (en) | 2023-08-04 |
Family
ID=87449968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310490203.2A Pending CN116539658A (en) | 2023-05-04 | 2023-05-04 | Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116539658A (en) |
-
2023
- 2023-05-04 CN CN202310490203.2A patent/CN116539658A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Vazirisereshk et al. | Nanoscale friction behavior of transition-metal dichalcogenides: Role of the chalcogenide | |
| US8302494B2 (en) | Sensor for quantitative measurement of electromechanical properties and microstructure of nano-materials and method for making the same | |
| Gao et al. | Using metallic noncontact atomic force microscope tips for imaging insulators and polar molecules: tip characterization and imaging mechanisms | |
| Sui et al. | Directional sensing based on flexible aligned carbon nanotube film nanocomposites | |
| Bi et al. | Layer-dependent anisotropic frictional behavior in two-dimensional monolayer hybrid perovskite/ITO layered heterojunctions | |
| Ji et al. | Flexible thin-film acoustic wave devices with off-axis bending characteristics for multisensing applications | |
| Druzhinin et al. | Nanoscale polysilicon in sensors of physical values at cryogenic temperatures | |
| Zhang et al. | Friction anisotropy of violet phosphorene and its surface structure direction identification | |
| Zhang et al. | Determining the surface tension of two-dimensional nanosheets by a low-rate advancing contact angle measurement | |
| CN116539658A (en) | Measurement method and application of thermal expansion coefficient of layered two-dimensional material surface | |
| Bai et al. | Deformation coupled moiré mapping of superlubricity in graphene | |
| Shen et al. | Measuring nanoscale thermal gradients in suspended MoS2 with STEM-EELS | |
| Liu et al. | A coarse-grained model for mechanical behavior of phosphorene sheets | |
| Choi et al. | Ambient-pressure atomic force microscope with variable pressure from ultra-high vacuum up to one bar | |
| Huang et al. | Slippage toughness measurement of soft interface between stiff thin films and elastomeric substrate | |
| CN107907450B (en) | Two-dimensional nano material hydrophilic angle testing method based on atomic force microscope | |
| Wang et al. | Design and optimization of isotropic stretchable strain sensors for multidirectional monitoring | |
| Chil et al. | Buckling of graphene under compressive strain: DFT calculations and second generation REBO potential | |
| Nayak et al. | Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective | |
| CN107764466A (en) | A kind of pressure resistance type vacuum meter based on graphene and preparation method thereof | |
| Castro et al. | μ-Si strain gauge array on flexible substrate for dynamic pressure measurement | |
| Prinzi et al. | Investigation of the mechanical compliance of highly conductive and durable carbon nanotube-polymer composite thermal interface materials | |
| Alzoubi et al. | Stability of interdigitated microelectrodes of flexible chemiresistor sensors | |
| Smith et al. | Modeling Graphene–Polymer Heterostructure MEMS Membranes with the Föppl–von Kármán Equations | |
| Johari | Development of MEMS sensors for measurements of pressure, relative humidity, and temperature |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |