CN116530962A

CN116530962A - Intracranial pressure probe and manufacturing method thereof

Info

Publication number: CN116530962A
Application number: CN202310670140.9A
Authority: CN
Inventors: 樊建锋; 杨汉高; 吴杨洁
Original assignee: Guangzhou Jianwei Medical Technology Co ltd
Current assignee: Guangzhou Jianwei Medical Technology Co ltd
Priority date: 2023-06-07
Filing date: 2023-06-07
Publication date: 2023-08-04

Abstract

The application provides an intracranial pressure probe and a manufacturing method thereof. The intracranial pressure probe comprises a first shell provided with a pressure sensor chip and a second shell provided with a window, wherein the first shell and the second shell are combined and welded and fixed. The manufacturing method of the intracranial pressure probe provided by the application comprises the following steps: machining or providing a first housing to which a pressure sensor chip may be mounted; machining or providing a second housing having a window; mounting the pressure sensor chip welded with the lead wire on the first shell; and assembling the second shell and the first shell together and welding and fixing the second shell and the first shell. The intracranial pressure probe provided by the application has the split type shell, is favorable for accurately installing a pressure sensor chip in place, reduces the problems of wire falling, breakage and the like, and accordingly improves the yield, production efficiency, measurement accuracy and consistency of the intracranial pressure probe.

Description

Intracranial pressure probe and manufacturing method thereof

Technical Field

The application belongs to the field of medical instruments, and particularly relates to an intracranial pressure probe and a manufacturing method thereof.

Background

The pressure exerted by the contents of the cranial cavity on the wall of the cranial cavity is known as intracranial pressure (intracranial pressure), also known as brain pressure. The increased intracranial pressure (increased intracranial pressure) is a common clinical pathological syndrome of neurosurgery, and is a common sign of craniocerebral injury, brain tumor, cerebral hemorrhage, hydrocephalus, intracranial inflammation and the like, and the disease increases the volume of the content of the cranial cavity, so that the intracranial pressure is continuously above 20 mmHg. Increased intracranial pressure can trigger cerebral herniation crisis, which can cause death of patients due to respiratory failure. Therefore, it is important to measure intracranial pressure in time in patients with increased intracranial pressure.

Currently, probes for intracranial pressure measurement mainly adopt an air sac type probe and a pressure chip type probe for measurement. Wherein the balloon probe is measured indirectly, the intracranial pressure is transmitted to the air in the balloon through the thin wall of the balloon and then is converted into an electronic signal by the pressure sensor, and the measurement data of the method is not very accurate. Sensors used for pressure chip type probes are classified into optical fiber chip pressure sensors and MEMS (micro electro mechanical system) pressure chip sensors. The optical fiber chip pressure sensor adopts optical fiber conduction, but the optical fiber material can not be bent, so that the optical fiber chip pressure sensor is easy to break in the manufacturing process and the operation process of a patient after the manufacturing process is finished. For intracranial pressure probes loaded with MEMS pressure sensor chips, the diameter size of the intracranial pressure probe is often required to be very small, e.g., the housing diameter cannot exceed 1.5mm, due to the intracranial use environment. The pressure sensor chip is to be mounted in the intracranial pressure probe, so that the size of the pressure sensor chip is more minute. The pressure sensor chip is arranged in the tiny shell, so that the manufacturing difficulty is very high, the yield is low, the cost is high, and the price of the intracranial pressure probe on the market is generally high.

At present, the shells of the intracranial pressure probes are integrally formed, namely, a cylindrical shell with at least one end open is adopted, and then a pressure sensor chip welded with a lead is delivered and installed into the shell. For example, patent publication number CN204274440U discloses a probe contact of an intracranial pressure monitoring system and a probe having the same. The probe comprises an integrated shell and a chip arranged in the shell, and a wire with smaller size is connected to the chip. In the process of loading the chip into the shell, the lead on the chip is easy to fall off and bend, so that the intracranial pressure probe is failed to manufacture. In addition, the probe is provided with the step-shaped positioning part, but prevents the chip from being installed in the integrated shell, the chip cannot realize axial positioning by virtue of the positioning part, so that the chip is difficult to ensure to be accurately installed at a design position, the measurement precision of a single probe is poor, and the measurement consistency of different probes is poor.

Disclosure of Invention

In order to reduce the manufacturing difficulty of an intracranial pressure measuring probe, improve the product qualification rate and reduce the production cost, the application provides an intracranial pressure probe and a manufacturing method thereof.

The intracranial pressure probe provided by the embodiment of the application comprises a shell and a pressure sensor chip arranged in the shell, wherein the intracranial pressure probe comprises a first shell and a second shell, the first shell is provided with a window, and the second shell is combined and welded and fixed with the first shell.

In at least one embodiment, a positioning groove is provided in the first housing, the pressure sensor chip is disposed in the positioning groove, the positioning groove restricts movement of the pressure sensor chip in a first direction and a second direction of the intracranial pressure probe, the first direction being parallel to an axial direction of the intracranial pressure probe, the second direction being perpendicular to the first direction and parallel to a surface of the pressure sensor chip.

In at least one embodiment, the front end of the intracranial pressure probe is of an arc-shaped structure, the front end of the first shell is provided with a first arc-shaped part, the front end of the second shell is provided with a second arc-shaped part, and the arc-shaped structure of the intracranial pressure probe is formed by combining the first arc-shaped part of the first shell and the second arc-shaped part of the second shell.

In at least one embodiment, the first housing is provided with a first assembly step, the second housing is provided with a second assembly step, and the first housing and the second housing are positioned, clamped and welded to each other through the first assembly step and the second assembly step.

In at least one embodiment, the window on the second housing corresponds to the pressure sensor chip, the window is filled with a probe protection layer, the probe protection layer seals the window and covers the pressure sensor chip, and the thickness of the probe protection layer in the axial direction of the intracranial pressure probe takes a form of thick two ends and thin middle.

In at least one embodiment, the probe protection layer comprises a probe protection layer middle portion and two probe protection layer end portions connected with edges of the window, the probe protection layer middle portion is located between the two probe protection layer end portions, and the thickness of the probe protection layer end portions is larger than that of the probe protection layer middle portion.

In at least one embodiment, a metal film is provided on the outside of the probe protective layer.

In at least one embodiment, the intracranial pressure probe further comprises a temperature sensor chip mounted in the first housing, the intracranial pressure probe comprising the first housing mounted with the pressure sensor chip and the temperature sensor chip combined with the second housing having the window and welded together.

In at least one embodiment, the pressure sensor chip and the temperature sensor chip are welded with wires, and welding spot protective coatings are arranged at welding positions of the pressure sensor chip and/or the temperature sensor chip and the wires, and the welding spot protective coatings comprise protective films and/or glue.

In at least one embodiment, the intracranial pressure probe has a diameter of 0.6 to 1.5mm and the first and second housings have a length of 3 to 12mm.

In at least one embodiment, the material of the shell is stainless steel, or one of titanium, platinum, palladium, iridium, niobium and tantalum, or an alloy containing at least one of stainless steel, titanium, platinum, palladium, iridium, niobium and tantalum.

In at least one embodiment, the length, width and height of the pressure sensor chip are not more than 1.3mm, the length of the positioning groove is 0.6-1.5 mm, and the width of the positioning groove is 0.3-1.0 mm.

The manufacturing method of the intracranial pressure probe provided by the embodiment of the application comprises the following steps:

machining or providing a first housing to which a pressure sensor chip may be mounted;

machining or providing a second housing having a window;

mounting a pressure sensor chip soldered with a wire to the first housing; and

and assembling the second shell and the first shell together and welding and fixing the second shell and the first shell.

In at least one embodiment, the second housing and the first housing are welded and fixed by laser welding.

In at least one embodiment, the laser welding uses one or more of a fiber laser, a carbon dioxide laser and a semiconductor laser, the wavelength of the laser is 500-1500 nm, the welding width of the laser focus of the laser is 1-2 times of the welding seam, and the welding depth of the laser focus is 1/3-2/3 of the thickness of the first shell or the second shell.

In at least one embodiment, further comprising: the temperature sensor chip with the wire welded is mounted in the first housing before the second housing is assembled with the first housing and welded and fixed.

In at least one embodiment, the method of bonding the wire to the pressure sensor chip and/or the temperature sensor chip is one or more of reflow soldering, wire bonding, current soldering, hot press soldering, dip soldering in surface mount technology.

In at least one embodiment, after the wire is soldered to the pressure sensor die and/or the temperature sensor die, a solder joint protective coating is applied over the solder joint, the solder joint protective coating comprising a protective film and/or glue.

The intracranial pressure probe provided by the embodiment of the application is provided with the split type first shell and the split type second shell, after the pressure sensor chip is installed in the first shell, the second shell and the first shell can be combined and welded and fixed, so that the manufacturing difficulty of the intracranial pressure probe is reduced, the accurate installation of the pressure sensor chip in place is facilitated, the problems of wire falling, breakage and the like are reduced, and the yield, the production efficiency, the measurement accuracy and the consistency of the intracranial pressure probe are improved.

The method for manufacturing the intracranial pressure probe provided by the embodiment of the application can manufacture the intracranial pressure probe, so that the method also has the advantages.

Drawings

Fig. 1 shows a schematic structural diagram of an intracranial pressure probe according to an embodiment of the present application.

Fig. 2 shows a schematic structural view of a first housing in which a pressure sensor chip and a temperature sensor chip are mounted in an intracranial pressure probe according to an embodiment of the present application.

Fig. 3 shows a schematic structural view of a second housing of an intracranial pressure probe according to an embodiment of the application.

Fig. 4 shows a schematic diagram of the structure of a probe cover showing an intracranial pressure probe according to an embodiment of the application.

Fig. 5 shows a schematic structural view of a first housing and a second housing of an intracranial pressure probe according to an embodiment of the application.

FIG. 6 illustrates a side view of an intracranial pressure probe according to an embodiment of the present application.

Fig. 7 shows a schematic structural view of an end portion of an intracranial pressure probe according to an embodiment of the present application.

Description of the reference numerals

1 a first housing; 11 positioning grooves; 12 a first assembly step; 13 a first arcuate portion; 2 a second housing; a 21 window; 22 a second assembly step; 23 a second arcuate portion; 3 a pressure sensor chip; 33 a probe protective layer; 331 the middle part of the probe protective layer; 332 probe protective layer end; 4, conducting wires; 5 a welding spot protective coating; 6 a temperature sensor chip.

Detailed Description

Exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are merely illustrative of how one skilled in the art may practice the present application and are not intended to be exhaustive of all of the possible ways of practicing the present application nor to limit the scope of the present application.

The embodiment of the application provides an intracranial pressure probe and a manufacturing method thereof.

Example 1

Referring to fig. 1, an intracranial pressure probe can include a first housing 1, a second housing 2, and a pressure sensor chip 3, with a lead 4 connected to the pressure sensor chip 3. After the pressure sensor chip 3 with the leads 4 attached thereto is fitted into the first housing 1, the first housing 1 and the second housing 2 may be fixed together by welding.

It will be appreciated that the size of the intracranial pressure probe is generally small (e.g. 0.6 to 1.5mm in diameter of the housing) and that the sensor chip used is to be mounted within the probe housing and therefore is smaller in size than the probe housing. To manufacture such a small and high-precision probe, at present, mechanical manufacturing cannot be realized only by a manual mode. In the prior art, the shells of the intracranial pressure probes are integrally formed, after the pressure sensor chip is welded with the lead, the sensor chip connected with the lead is installed in the probe shell, the manufacturing difficulty is very high, in addition, in the manufacturing process of the probe, the sensor chip connected with the lead can only be installed in the shell by the probe of the integrated shell in a push-pull mode, and the lead connected with the sensor chip is easy to fall off and bend in the mode, so that the intracranial pressure probe is failed to manufacture.

According to the intracranial pressure probe, the shell of the intracranial pressure probe is arranged into the split type, the sensor chip can be directly mounted at the set position from the upper part of the first shell, the sensor chip can be mounted, fixed and accurately positioned at a high speed, the manufacturing difficulty of the probe is greatly reduced, the problems that a welded wire on the sensor chip falls off, breaks and the like in the mounting process are solved, and therefore the yield and the production efficiency of the intracranial pressure probe are improved.

Further, a positioning groove 11 is provided in the first housing 1, and the pressure sensor chip 3 may be provided in the positioning groove 11. For convenience of description, the first direction X, the second direction Y, and the third direction Z are introduced. Wherein the first direction X is parallel to the axial direction of the intracranial pressure probe, the second direction Y is perpendicular to the axial direction of the intracranial pressure probe and parallel to the surface of the pressure sensor chip 3, and the third direction Z is perpendicular to the first direction X and the second direction Y. The pressure sensor chip 3 may be sized to be caught by the positioning groove 11, thereby restricting the movement of the pressure sensor chip 3 in the first direction X, the second direction Y.

Because the intracranial pressure probe is very small in size, the processing of the positioning groove in the integrated probe shell is very difficult, so that the prior art can be used for processing the positioning step at most, the movement of the sensor chip in the left-right direction (Y direction) can be limited, but the accurate positioning of the sensor chip in the axial direction of the probe cannot be ensured, so that the probe has poor precision and the measurement consistency of different probes is poor.

The design of the positioning groove is beneficial to rapidly mounting the pressure sensor chip to a preset position in the manufacturing process, and can limit the position of the pressure sensor chip to deviate in the front-back and left-right directions, so that the chip drift is reduced, and the measurement accuracy of the probe and the consistency of measurement results of different time points are improved. In addition, based on split type casing design, can reduce the processing degree of difficulty of constant head tank, be favorable to guaranteeing the position uniformity of the constant head tank of different probes in the industrialization to ensure that the chip of different probe products is all installed at the horizontal position of equiheight, improve the uniformity of measuring result between the different probe products.

Specifically, referring to fig. 2, 3 and 5, the housing of the present application includes a split first housing 1 and a second housing 2, and after the pressure sensor chip 3 connected with the lead wire 4 is installed in the positioning slot 11 of the first housing 1, the second housing 2 and the first housing 1 may be combined and welded and fixed. The pressure sensor chip 3 welded with the lead can be directly placed from the upper part of the first shell 1 and then fixed, and the lead is not blocked in the installation process, so that the problems that the lead 4 is easy to fall off and bend due to push-pull dragging in the traditional installation method and the pressure sensor chip 3 is difficult to accurately position are avoided. In this embodiment, pressure sensor chip 3 can direct mount in constant head tank 11, is showing the reduction installation degree of difficulty, and pressure sensor chip 3 installation is simple, and the mounted position is accurate, has greatly improved the yield, has improved the accuracy of probe, has improved the measurement uniformity between the different probes.

In one embodiment of the present application, the length of the first housing 1 and the second housing 2 may be 3 to 12mm, and the diameter of the housing of the intracranial pressure probe formed by combining the first housing 1 and the second housing 2 may be 0.6 to 1.5mm. The length of the positioning groove 11 can be 0.6-1.5 mm, and the width can be 0.3-1.0 mm. The length, width and height of the pressure sensor chip 3 are not more than 1.3mm. The dimensions of the positioning groove 11 are matched to the dimensions of the pressure sensor chip 3. Glue may be provided between the pressure sensor chip 3 and the positioning groove 11, so as to limit the movement of the pressure sensor chip in the third direction Z.

Referring to fig. 1 and 6, the first housing 1 may be provided with a first assembling step 12, the second housing 2 may be provided with a second assembling step 22, and the first housing 1 and the second housing 2 realize positioning assembling with the second assembling step 22 through the first assembling step 12, so that a positioning matching process is simplified. The first casing 1 and the second casing 2 can be connected and fixed in a laser welding mode after being assembled.

Referring to fig. 5 and 7, the front end of the intracranial pressure probe (the end remote from the lead 4, e.g., the left end in the figures) is of arcuate configuration. The front end of the first shell 1 is provided with a first arc-shaped part 13, the front end of the second shell 2 is provided with a second arc-shaped part 23, and the first arc-shaped part 13 and the second arc-shaped part 23 are combined to form an arc-shaped structure of the front end of the intracranial pressure probe. The arc structure can be a hemispherical structure, an arc structure of other types and the like, so that the damage to intracranial tissues caused by the too sharp end part of the shell is avoided.

In the intracranial pressure probe in the prior art, although the front end of the shell is also provided with an arc structure, the arc structure is formed by dispensing, specifically, the intracranial pressure probe shell with openings at two ends is adopted, and after a sensor chip is installed in the shell, the front end of the probe shell is sealed by dispensing so as to form the arc structure. Compared with the arc end formed by dispensing in the prior art, the end structure of the intracranial pressure probe in the application is an inherent structure of the shell, is the same as the material of the probe shell and is not easy to fall off, the arc shape is easy to control, the end dispensing step is omitted, the cost is reduced, and the production efficiency is improved.

In one embodiment of the present application, the materials of the first casing 1 and the second casing 2 may be stainless steel, or one of titanium, platinum, palladium, iridium, niobium, and tantalum, or an alloy containing at least one of stainless steel, titanium, platinum, palladium, iridium, niobium, and tantalum. The biocompatibility of the materials is good, so that the shell is more suitable for intracranial environment.

Referring to fig. 1 and 2, in one embodiment of the present application, the intracranial pressure probe further includes a temperature sensor chip 6, the temperature sensor chip 6 is mounted in the first housing 1, the intracranial pressure probe includes a first housing 1 mounted with the pressure sensor chip 3 and the temperature sensor chip 6 and a second housing 2 having a window 21, and the first housing 1 and the second housing 2 are combined and welded.

The temperature sensor chip 6 can be used to measure intracranial temperature, increasing the function of the intracranial pressure probe. The temperature sensor chip 6 may be an NTC (negative temperature coefficient) thermistor, for example.

A temperature sensor chip 6 may be provided in the first housing 1, and the temperature sensor chip 6 may be located at one side in the axial direction of the pressure sensor chip 3. The first housing 1 may or may not be provided with a positioning groove at a position for mounting the temperature sensor chip 6, and preferably is provided with a positioning groove, the size of which matches the size of the temperature sensor chip (6). The temperature sensor chip (6) is installed in the positioning groove. In this way, accurate mounting and displacement prevention of the temperature sensor chip 6 are facilitated.

Further, the wires 4 may be connected to pads of the pressure sensor chip 3 and/or the temperature sensor chip 6 by soldering. Referring to fig. 1, a welding spot protection coating 5 may be disposed at the welding position of the wire 4 and the pressure sensor chip 3 and/or the temperature sensor chip 6, and the welding spot protection coating 5 helps to connect the wire 4 with the pressure sensor chip 3 and the temperature sensor chip 6 firmly, so as to avoid separation of the wire 4 from the pressure sensor chip 3 and the temperature sensor chip 6, and prevent subsequent assembly and production processes from being broken. The solder joint protection layer 5 may comprise a protection film and/or glue. The thickness of the solder joint protective coating 5 may be 0.1 to 0.5mm.

The MEMS pressure sensor chip and the temperature sensor pad are provided with welding wires, and the wires are used for transmitting pressure signals sensed by the pressure sensor chip and temperature signals measured by the temperature sensor chip to an external circuit, and finally displaying the pressure signals and the temperature signals on an external host screen after conditioning and amplifying the circuit.

Referring to fig. 1 and 3, in one embodiment of the present application, a window 21 is provided on the second housing 2, and the position of the window 21 corresponds to the positioning groove 11 of the first housing 1 and the pressure sensor chip 3. The intracranial pressure can be transferred to the pressure sensor chip 3 through the window 21, so that the pressure sensor chip 3 can accurately measure the pressure of the intracranial cerebrospinal fluid.

Further, referring to fig. 4, the window 21 is filled with a probe protection layer 33, and the probe protection layer 33 seals the window 21 and covers over the pressure sensor chip 3. In the axial direction of the intracranial pressure probe, the thickness of the probe protective layer is in a form of thick at two ends and thin in the middle. Preferably, the probe cover 33 is biocompatible and dense without holes.

The probe protective layer 33 arranged between the edge of the window 21 and the pressure sensor chip 3 can prevent the sensor chip from directly contacting intracranial substances and prevent the sensor chip from being damaged by biocompatibility, and can also seal the probe to prevent the intracranial substances such as cerebrospinal fluid from penetrating into the sensor chip and other positions of the intracranial pressure probe to corrode the sensor chip and the intracranial pressure probe and affecting the use.

In the axial direction of the intracranial pressure probe, the probe protective layer is arranged in a form of being thick at two ends and thin in the middle, so that the influence of the probe protective layer on the measurement of the pressure sensor chip can be reduced, the accuracy and the sensitivity of the intracranial pressure measurement are improved, the effect of being thick at two ends of the probe protective layer is to prevent leakage, and compact protection is provided. Preferably, the protective layer over the pressure sensor chip sensing membrane is made as thin as possible while satisfying the sealability.

Specifically, in the axial direction of the intracranial pressure probe, the probe cover 33 may include a probe cover middle 331 and two probe cover ends 332 connected to the edges of the window 21. The probe protection layer middle 331 may cover the center of the pressure sensor chip 3, and the probe protection layer middle 331 is located between the two probe protection layer ends 332. The thickness of the probe cover end 332 may be greater than the thickness of the probe cover middle 331. Therefore, the influence of the probe protection layer on the measurement work of the pressure sensor chip 3 can be reduced, the measurement accuracy and sensitivity are improved, the leak prevention of the sealing performance of the probe can be ensured, and compact protection is provided.

Illustratively, the thickness of the probe cover middle 331 may be 0.1-0.8 mm, and the thickness of the probe cover end 332 may be 0.5-1.8 mm, and the probe cover end 332 may be flush with the outer circumferential surface of the second housing 2, so that transition is uniform there, and intracranial tissue is prevented from colliding there. Of course, the probe cover end 332 may be slightly higher than the outer peripheral surface of the second housing 2.

In one embodiment of the present application, the thickness of the probe protection layer end 332 gradually increases from the center to both ends (or to the periphery), so that the probe protection layer 33 transitions smoothly, and the thickness of the probe protection layer end 332 may refer to the thickness of the thickest part of the probe protection layer end 332.

The probe cover 33 may be glue, such as one or more of silicone, epoxy, ultraviolet glue, and glass glue. The probe protection layer 33 may be a film made of polyimide, parylene, silicon oxide, silicon nitride, or the like. Of course, the probe cover 33 can also function to fix the pressure sensor chip 3 in the positioning groove 11.

The probe protective layer 33 may also be provided with a metal film for further improving the compactness of the probe, preventing leakage, and improving the service life and stability of the intracranial pressure probe. The metal film is preferably a dense metal film. The material of the metal film can comprise gold, titanium, platinum, niobium and the like, and the thickness of the metal film can be 0.01-0.2 mm. The metal film can be formed on the intracranial pressure probe by one or more of leaching, electroplating, plating film and the like, wherein the plating film comprises magnetron sputtering, vapor plating, magnetron sputtering, electron beam vapor plating, plasma enhanced chemical vapor deposition, chemical vapor deposition and the like.

Example 2

The embodiment of the application also provides a manufacturing method of the intracranial pressure probe, which is used for manufacturing the intracranial pressure probe, and the manufacturing method comprises the following steps:

a first housing 1 to which a pressure sensor chip 3 can be attached is machined or provided;

a second housing 2 with a window 21 is machined or provided;

mounting the pressure sensor chip 3 with the wire 4 soldered thereto onto the first housing 1; and

the second housing 2 is assembled with the first housing 1 and welded and fixed.

The casing of the intracranial pressure probe is arranged into a first casing and a second casing which are separated, a pressure sensor chip welded with a wire is firstly arranged on the first casing, and then the second casing with a window is combined with the first casing and welded and fixed. Compared with the preparation of the intracranial pressure probe with the integrally formed shell in the prior art, the preparation method of the intracranial pressure probe obviously reduces the preparation difficulty of the probe, reduces the problems of wire falling, breakage and the like of a sensor chip, and improves the yield and the production efficiency of products.

Preferably, the positioning groove 11 is provided on the first housing, and mounting the pressure sensor chip 3 welded with the wire 4 to the first housing 1 means that the pressure sensor chip 3 is mounted in the positioning groove 11, and glue is provided between the pressure sensor chip 3 and the positioning groove 11.

Further, the first shell 1 and the second shell 2 are respectively provided with positioning assembly steps, and the first shell and the second shell are assembled after the sensor chip is assembled, and only alignment clamping is needed.

Further, the first casing 1 and the second casing 2 may be welded and fixed by means of laser welding. For example, a laser welding apparatus is used to weld one turn along the joint gap of the first housing and the second housing. After the laser welding is finished, the first shell and the second shell can be completely fused into a whole, and the welding position is smooth and has no crack.

Further, one or more of a fiber laser, a carbon dioxide laser and a semiconductor laser are used for laser welding, the wavelength of the used laser is 500-1500 nm, the welding width of a laser focus of the laser is 1-2 times of that of a welding line, and the welding depth of the laser focus is 1/3-2/3 of that of the first shell (1) or the second shell (2), so that the welding strength and the non-leakage are ensured. The laser may be continuously or intermittently emitted during welding, and is preferably continuously emitted.

Illustratively, the jig matched with the first and second cases 1, 2 is prepared before welding. During laser welding, the first shell 1 and the second shell 2 are fixed by the jig to prevent displacement, then laser is aligned to a gap between the first shell 1 and the second shell 2, and the jig drives the first shell 1 and the second shell 2 to rotate at a constant speed, so that laser welding is realized. After welding, the good standard of the intracranial pressure probe can be that the first shell 1 and the second shell 2 are integrated, and the welding is smooth and has no cracks.

Further, the intracranial pressure probe can comprise a temperature sensor chip 6. Before the second housing 2 is assembled with the first housing 1 and soldered, the temperature sensor chip 6 soldered with the wires is mounted in the first housing 1.

Further, a positioning groove for mounting and restricting the displacement of the temperature sensor chip 6 may be provided on the first housing 1. The temperature sensor chip 6 is arranged in the positioning groove, and glue is arranged between the temperature sensor chip 6 and the positioning groove.

Further, the method of soldering the wires to the pressure sensor chip 3 and/or the temperature sensor chip 6 is one or more of reflow soldering, wire bonding, current soldering, thermocompression bonding, and solder dipping in the surface mount technology (STM).

Further, after soldering the wires 4 to the pressure sensor chip 3 and/or the temperature sensor chip 6, a solder joint protective coating 5 may be applied on the solder joints, preventing subsequent assembly and production processes from being broken. The solder joint protective coating 5 comprises a protective film and/or glue, and the thickness of the solder joint protective coating 5 may be 0.1-0.5 mm. The protective film can be implemented by vacuum coating, electroplating, depositing and the like, and the glue can be implemented by dispensing by a dispenser, precise dispensing, leaching and the like.

Further, after the first case and the second case are welded and fixed, a probe protection layer 33 is provided from the window 21 to the surface of the pressure sensor chip 3.

The probe protective layer 33 may be provided by dispensing, leaching, coating, etc. using a dispenser, wherein the coating technique may include magnetron sputtering, electron beam evaporation, plasma enhanced chemical vapor deposition, etc.

Further, after the probe protective layer 33 is provided, a metal film is provided on the surface of the window protective layer probe protective layer 33.

The metal film may be provided by leaching, electroplating, vapor deposition, magnetron sputtering, electron beam vapor deposition, plasma enhanced chemical vapor deposition, or the like.

Of course, the order and details of the steps may be modified in a simple manner.

While the foregoing is directed to the preferred embodiments of the present application, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the present application, such changes and modifications are to be considered as within the scope of the present application.

Claims

1. An intracranial pressure probe comprising a housing and a pressure sensor chip (3) arranged in the housing, characterized in that the intracranial pressure probe comprises a first housing (1) on which the pressure sensor chip (3) is mounted and a second housing (2) having a window (21), the first housing (1) and the second housing (2) being combined and welded.

2. The intracranial pressure probe as recited in claim 1, characterized in that a positioning groove (11) is provided in the first housing (1), the pressure sensor chip (3) being arranged in the positioning groove (11), the positioning groove (11) limiting the movement of the pressure sensor chip (3) in a first direction (X) and a second direction (Y) of the intracranial pressure probe, the first direction (X) being parallel to the axial direction of the intracranial pressure probe, the second direction (Y) being perpendicular to the first direction (X) and parallel to the surface of the pressure sensor chip (3).

3. The intracranial pressure probe as recited in claim 1, wherein the front end of the intracranial pressure probe is of an arc-shaped structure, the front end of the first housing (1) is provided with a first arc-shaped part (13), the front end of the second housing (2) is provided with a second arc-shaped part (23), and the arc-shaped structure of the intracranial pressure probe is formed by combining the first arc-shaped part (13) of the first housing (1) and the second arc-shaped part (23) of the second housing (2).

4. The intracranial pressure probe according to claim 1, wherein the first housing (1) is provided with a first assembly step (12), the second housing (2) is provided with a second assembly step (22), and the first housing (1) and the second housing (2) are positioned and clamped and welded to each other by the first assembly step (12) and the second assembly step (22).

5. The intracranial pressure probe according to claim 1, wherein the window (21) on the second housing (2) corresponds to the pressure sensor chip (3), the window (21) is filled with a probe protection layer (33), the probe protection layer (33) seals the window (21) and covers over the pressure sensor chip (3), and the thickness of the probe protection layer (33) takes on a form of being thick at both ends and thin in the axial direction of the intracranial pressure probe.

6. The intracranial pressure probe according to claim 5, wherein the probe protection layer (33) comprises a probe protection layer middle portion (331) and two probe protection layer end portions (332) connected to the edges of the window (21), the probe protection layer middle portion (331) being located between the two probe protection layer end portions (332), the probe protection layer end portions (332) having a thickness greater than the thickness of the probe protection layer middle portion (331).

7. The intracranial pressure probe as recited in claim 5, characterized in that the outer side of the probe protection layer (33) is provided with a metallic film.

8. The intracranial pressure probe according to any one of claims 1 to 7, further comprising a temperature sensor chip (6), the temperature sensor chip (6) being mounted in the first housing (1), the intracranial pressure probe comprising the first housing (1) mounted with the pressure sensor chip (3) and the temperature sensor chip (6) and the second housing (2) having the window (21), the first housing (1) and the second housing (2) being combined and welded.

9. Intracranial pressure probe according to claim 8, wherein the pressure sensor chip (3) and the temperature sensor chip (6) are welded with wires (4), and the welding place of the pressure sensor chip (3) and/or the temperature sensor chip (6) and the wires (4) is provided with a welding spot protection coating (5), and the welding spot protection coating (5) comprises a protection film and/or glue.

10. The intracranial pressure probe as recited in any one of claims 1 to 7, characterized in that the diameter of the intracranial pressure probe is 0.6 to 1.5mm and the length of the first housing (1) and the second housing (2) is 3 to 12mm.

11. The intracranial pressure probe as recited in any one of claims 1 to 7, wherein the housing is made of stainless steel, or a single body of one of titanium, platinum, palladium, iridium, niobium, tantalum, or an alloy comprising at least one of stainless steel, titanium, platinum, palladium, iridium, niobium, tantalum.

12. The intracranial pressure probe as recited in claim 2, wherein the pressure sensor chip (3) has a length, width and height of no more than 1.3mm, and the positioning slot (11) has a length of 0.6-1.5 mm and a width of 0.3-1.0 mm.

13. A method of manufacturing an intracranial pressure probe, the method comprising:

-machining or providing a first housing (1) to which a pressure sensor chip (3) can be mounted;

-machining or providing a second housing (2) with a window (21);

mounting a pressure sensor chip (3) soldered with a wire (4) onto the first housing (1); and

and assembling the second shell (2) with the first shell (1) and welding and fixing the second shell and the first shell.

14. The method for manufacturing an intracranial pressure probe according to claim 13, wherein the second housing (2) and the first housing (1) are welded and fixed by laser welding.

15. The method according to claim 14, wherein the laser welding uses one or more of a fiber laser, a carbon dioxide laser and a semiconductor laser, the wavelength of the laser used is 500 to 1500nm, the welding width of the laser focal point of the laser is 1 to 2 times of the welding line, and the welding depth of the laser focal point is 1/3 to 2/3 of the thickness of the first housing (1) or the second housing (2).

16. The method of making an intracranial pressure probe as recited in claim 13, further comprising: before the second housing (2) is assembled with the first housing (1) and welded and fixed, a temperature sensor chip (6) welded with wires is mounted in the first housing (1).

17. The method of manufacturing an intracranial pressure probe according to claim 16, wherein the method of soldering the wire to the pressure sensor chip (3) and/or the temperature sensor chip (6) is one or more of reflow soldering, soldering by iron, current soldering, hot-pressing, soldering by immersion tin in surface mount technology.

18. Method of manufacturing an intracranial pressure probe according to claim 16 or 17, characterized in that after welding the wires (4) to the pressure sensor chip (3) and/or the temperature sensor chip (6), a solder joint protective coating (5) is applied on the solder joint, the solder joint protective coating (5) comprising a protective film and/or glue.