CN116528488B - Circuit board processing equipment - Google Patents
Circuit board processing equipment Download PDFInfo
- Publication number
- CN116528488B CN116528488B CN202310621900.7A CN202310621900A CN116528488B CN 116528488 B CN116528488 B CN 116528488B CN 202310621900 A CN202310621900 A CN 202310621900A CN 116528488 B CN116528488 B CN 116528488B
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- China
- Prior art keywords
- copper
- adjusting
- plate
- etching machine
- clad plate
- Prior art date
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Links
- 238000012545 processing Methods 0.000 title claims abstract description 29
- 238000005530 etching Methods 0.000 claims abstract description 48
- 239000007921 spray Substances 0.000 claims abstract description 35
- 238000007599 discharging Methods 0.000 claims abstract description 27
- 238000001125 extrusion Methods 0.000 claims description 21
- 230000007306 turnover Effects 0.000 claims description 19
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000001960 triggered effect Effects 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses circuit board processing equipment, which relates to the field of copper-clad plate corrosion equipment and comprises an etching machine, wherein a feeding table and a discharging table are respectively arranged on two sides of the etching machine, a plurality of rotating shafts are rotatably arranged on the etching machine, the feeding table and the discharging table, a plurality of conveying wheels are equidistantly arranged on the rotating shafts, and a plurality of spray pipes are arranged in the etching machine. In the invention, through the arrangement of the valve, when the copper-clad plate is extruded and pressed into blocks, the adjusting frame is forced to move, the valve is opened, and the opening of the valve can be adjusted according to the self weight of the copper-clad plate, so that the flow of the spray pipe can be adjusted, when the copper-clad plate passes through the automatic adjusting device, the purpose that the valve is adjusted by the automatic adjusting device can be triggered by the self weight is realized, the spray pipe can be used for adjusting the using amount of corrosive liquid according to the self weight of the copper-clad plate, and meanwhile, the spray pipe can be automatically opened and closed, so that the etching machine can be used for saving energy and protecting environment more.
Description
Technical Field
The invention relates to the technical field of copper-clad plate corrosion equipment, in particular to circuit board processing equipment.
Background
The copper-clad laminate is a plate-like material, called copper-clad plate for short, which is prepared by impregnating electronic glass fiber cloth or other reinforcing materials with resin, and coating copper foil on one or both sides and hot-pressing. Various printed circuit boards with different forms and different functions are manufactured by selectively performing working procedures such as processing, etching, drilling, copper plating and the like on a copper-clad plate. The copper-clad plate mainly plays roles of interconnection conduction, insulation and support on the printed circuit board, and has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in a circuit, so that the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost and long-term reliability and stability of the printed circuit board are greatly dependent on the copper-clad.
When the copper-clad plate is processed, metal on the copper-clad plate is generally required to be removed through an etching machine, so that the required circuit board is obtained. When the copper-clad plate is etched, a plurality of conveying wheels are driven to rotate through a rotating shaft, the copper-clad plate is conveyed into an etching machine, and is continuously corroded by spraying corrosive liquid, so that a required circuit board is finally obtained, but the copper-clad plate is different in size and therefore different in quality, and the spraying amount of the spraying pipe is fixed, so that when the smaller copper-clad plate is sprayed, a large amount of corrosive liquid is wasted due to the fact that the spraying pipe cannot be adjusted, meanwhile, due to the fact that intervals are arranged between the copper-clad plates, when one copper-clad plate leaves one spraying pipe, the spraying pipe in the neutral position in the middle is continuously sprayed, and further waste of the spraying liquid is caused.
Disclosure of Invention
The invention aims to provide a circuit board processing device for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the circuit board processing equipment comprises an etching machine, wherein a feeding table and a discharging table are respectively arranged on two sides of the etching machine, a plurality of rotating shafts are rotatably arranged on the etching machine, the feeding table and the discharging table, a plurality of conveying wheels are equidistantly arranged on the rotating shafts, a plurality of spray pipes are arranged in the etching machine, and a spray head is arranged on the bottom side of each spray pipe;
the etching machine is characterized in that a valve is arranged on the spray pipe and used for adjusting the flow rate and opening and closing of the spray pipe, a plurality of automatic adjusting devices are arranged in the etching machine at equal intervals, the automatic adjusting devices are positioned between two rotating shafts at corresponding positions, the automatic adjusting devices are respectively positioned on one sides of the spray pipes, and the automatic adjusting devices are used for adjusting the valve;
the positioning device is positioned above the conveying wheel and used for righting and positioning the copper-clad plate conveyed in the etching machine, and the positioning device is arranged on the inner walls of the two sides of the etching machine;
the copper-clad plate conveying device is used for conveying the copper-clad plate to be buffered, and the copper-clad plate conveying device is used for conveying the copper-clad plate to be buffered.
Further, in a preferred embodiment of the present invention, the automatic adjusting device includes an adjusting frame, an adjusting rod is mounted on the top side of the adjusting frame, a telescopic sleeve is movably sleeved on the adjusting rod, the top side of the telescopic sleeve is mounted on the inner wall of the top side of the etching machine, and two extrusion blocks are mounted on the adjusting frame;
the top of adjusting the pole is installed the slide, and reset spring is installed to the topside of slide, reset spring's top is installed on the topside inner wall of telescopic cover.
Further, in a preferred embodiment of the present invention, the adjusting frame is provided with a driving hole, a driving shaft is movably installed in the driving hole, a handle is movably sleeved on the driving shaft, and the handle is installed on an adjusting rod of the valve.
Further, in a preferred embodiment of the present invention, the positioning device includes two positioning plates, and two adjusting frames are respectively disposed on one sides of the two positioning plates, where the two sides are close to each other, and the two adjusting frames are used for adjusting positions of copper-clad plates in the etching machine;
two sliding holes are formed in the positioning plate, sliding rods are slidably arranged in the two sliding holes, and the sliding rods are arranged on the inner wall of the etching machine.
Further, in the preferred embodiment of the present invention, two moving holes are formed on the positioning plate, and extrusion rods are movably installed in the two moving holes, and the extrusion rods are installed on the adjusting frame;
the outside of extrusion pole has cup jointed spring and sheath, the spring is located in the sheath, the spring with the both sides of sheath are installed respectively the locating plate with the alignment jig is close to on one side each other.
Further, in the preferred embodiment of the present invention, the top sides of the two positioning plates are both provided with a driving frame, one of the rotating shafts near the middle position of the positioning plate is provided with two driving grooves, the bottom ends of the driving frames extend into the driving grooves, and the driving grooves are in annular inclined arrangement;
the rotating shaft drives the driving frame to move back and forth through the driving groove.
Further, in a preferred embodiment of the present invention, the buffer conveying device includes a turnover plate, the turnover plate is used for receiving the copper-clad plate sent out by the discharging table, a plurality of buffer springs are installed on the top side of the turnover plate, and a buffer plate is installed on the plurality of buffer springs.
Further, in the preferred embodiment of the present invention, support bases are provided on both sides of the turnover plate, the support bases are mounted on the discharging table, support shafts are rotatably mounted on the support bases, and the support shafts are mounted on one side of the turnover plate;
one side slidable mounting of ejection of compact platform has the link frame, the rotating turret is installed in the last rotation of link frame, the rotating turret cup joints on the back shaft, the last linkage shaft of rotating installation of link frame, the linkage shaft rotates and installs on the link frame.
Further, in the preferred embodiment of the invention, a motor is installed at the bottom side of the discharging table, a motor shaft is installed on an output shaft of the motor, a rotating rod is installed on the motor shaft, a movable hole is formed in the linkage frame, a movable shaft is movably installed in the movable hole, and the movable shaft is installed on the rotating rod.
Further, in the preferred embodiment of the present invention, a flat sliding groove is formed on one side of the discharging table, a flat sliding block is slidably mounted in the flat sliding groove, and the flat sliding block is mounted on the linkage frame.
The circuit board processing equipment provided by the invention has the beneficial effects that:
according to the invention, through the arrangement of the valve, when the copper-clad plate is extruded and pressed, the adjusting frame is forced to move, the valve is opened, and the opening of the valve can be adjusted according to the self weight of the copper-clad plate, so that the flow of the spray pipe can be adjusted, and the purpose that the valve is adjusted by triggering the automatic adjusting device through the self weight when the copper-clad plate passes through the automatic adjusting device is realized, so that the spray pipe can adjust the using amount of corrosive liquid according to the self weight of the copper-clad plate, and meanwhile, the spray pipe can be automatically opened and closed, so that the etching machine can be used more energy-saving and environment-friendly.
Further, in the invention, through the arrangement of the positioning device, when the copper-clad plate is conveyed on the conveying wheels, the driving frame drives the positioning plate to move back and forth, and then drives the adjusting frame to move to centralize and position the copper-clad plate, so that the copper-clad plate can be kept at a position corresponding to the spray pipe, further the etching quality of the copper-clad plate can be ensured, and meanwhile, when the copper-clad plate falls down through the discharging table, the copper-clad plate can be buffered by the buffering conveying device, and further the problem that the copper-clad plate is damaged after etching due to mutual collision caused by landing can be avoided.
Furthermore, in the invention, through the arrangement of the buffer conveying device, when the copper-clad plate is discharged, the copper-clad plate falls on the overturning plate at first, and under the rebound force of a plurality of buffer springs, the copper-clad plate can be buffered, so that the damage of the copper-clad plate caused by collision is avoided, and meanwhile, the starting motor can drive the overturning plate to overturn back and forth once, so that the copper-clad plate can rotate along with the overturning plate to fall down, and further, the problem of damage of the copper-clad plate caused by mutual collision caused by direct falling is avoided.
Drawings
Fig. 1 is a schematic perspective view of a circuit board processing device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a circuit board processing device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an adjusting device of a circuit board processing device according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of connection between a telescopic sleeve and an adjusting rod of a circuit board processing device according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional structure diagram of a positioning device of a circuit board processing apparatus according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional structure diagram of connection between a positioning plate and an adjusting frame of a circuit board processing device according to an embodiment of the present invention;
fig. 7 is a schematic view of a partial cross-sectional structure of a rotating shaft of a circuit board processing apparatus according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a partial structure of an etcher of a circuit board processing device according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a buffer conveying device of a cleaning rack of a circuit board processing device according to an embodiment of the present invention.
In the figure: 1-an etching machine; 2-rotating shaft; 3-conveying wheels; 4-spraying pipes; 5-spray head; 6-valve; 7-an automatic adjusting device; 701-an adjusting frame; 702-a telescopic sleeve; 703-adjusting the rod; 704-a skateboard; 705-return spring; 706-extruding a block; 707-drive holes; 708-a drive shaft; 709-handle; 8-positioning means; 801-positioning plates; 802-slide holes; 803-slide bar; 804-adjusting the rack; 805-moving the hole; 806-extruding the rod; 807-springs; 808-sheath; 809—a drive rack; 810-a drive slot; 9-buffer conveying device; 901-a roll-over plate; 902-a buffer plate; 903-a buffer spring; 904-a support base; 905-a support shaft; 906—turret; 907-linkage frame; 908—linkage shaft; 909-a motor; 910-rotating a rod; 911-activity hole; 912—a movable shaft; 913-a motor shaft; 914-a flat chute; 915—a flat slider; 10-a feeding table; 11-a discharging table.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In addition, in the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like are not intended to require that the component be absolutely vertical, but rather may be slightly inclined. As "vertical" merely means that its direction is more vertical than "horizontal" and does not mean that the structure must be perfectly vertical, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples
Referring to fig. 1-9 of the drawings, the circuit board processing device provided by the embodiment of the invention comprises an etching machine 1, wherein a feeding table 10 and a discharging table 11 are respectively arranged on two sides of the etching machine 1, a plurality of rotating shafts 2 are rotatably arranged on the etching machine 1, the feeding table 10 and the discharging table 11, a plurality of conveying wheels 3 are equidistantly arranged on the rotating shafts 2, a plurality of spray pipes 4 are arranged in the etching machine 1, and a spray head 5 is arranged on the bottom side of each spray pipe 4.
Further, a valve 6 is arranged on the spray pipe 4, and the valve 6 is used for adjusting the flow and opening and closing of the spray pipe 4; a plurality of automatic adjusting devices 7 are arranged in the etching machine 1 at equal intervals, the automatic adjusting devices 7 are positioned between the two rotating shafts 2 at corresponding positions, the plurality of automatic adjusting devices 7 are respectively positioned on one side of the plurality of spray pipes 4, and the automatic adjusting devices 7 are used for adjusting the valves 6. It should be noted that, in the embodiment of the present invention, through the setting of the valve 6, the flow of the spray pipe 4 can be adjusted through the valve, and when the copper-clad plate passes through the automatic adjusting device 7, the automatic adjusting device 7 can be triggered by its own weight, meanwhile, the automatic adjusting device 7 can adjust the valve 6, so as to realize that the amount of the corrosive liquid sprayed out of the spray pipe 4 can be controlled through the movement of the copper-clad plate, thereby not only saving the usage amount of the corrosive liquid, but also automatically closing the spray pipe 4 when the copper-clad plate leaves the automatic adjusting device 7, thereby changing the traditional direct spraying mode, and enabling the use of the etching machine 1 to be more economical and environment-friendly.
With continued reference to fig. 1-9 of the specification, the circuit board processing device provided in the embodiment of the invention further includes a positioning device 8, the positioning device 8 is located above the conveying wheel 3, the positioning device 8 is used for righting and positioning the copper-clad plate conveyed in the etching machine 1, and the positioning device 8 is installed on the inner walls of two sides of the etching machine 1; and the device also comprises a buffer conveying device 9, wherein the buffer conveying device 9 is arranged on one side of the discharging table 11, and the buffer conveying device 9 is used for buffering the copper-clad plate conveyed by the discharging table 11. In the embodiment of the invention, through the arrangement of the positioning device 8, when the copper-clad plate is conveyed on the plurality of conveying wheels 3, the copper-clad plate can be righted and positioned through the positioning device 8, so that the copper-clad plate can be kept at the position corresponding to the spray pipe 4, and the etching quality of the copper-clad plate can be further ensured; meanwhile, when the copper-clad plate falls down through the discharging table 11, the copper-clad plate can be buffered by the buffer conveying device 9, and further the problem that the copper-clad plate is damaged due to mutual collision caused by landing after etching of the copper-clad plate can be avoided.
Further, referring to fig. 1-4 of the specification, an automatic adjusting device 7 provided by the embodiment of the invention includes an adjusting frame 701, an adjusting rod 703 is mounted on the top side of the adjusting frame 701, a telescopic sleeve 702 is movably sleeved on the adjusting rod 703, the top side of the telescopic sleeve 702 is mounted on the inner wall of the top side of the etching machine 1, and two extrusion blocks 706 are mounted on the adjusting frame 701; a slide plate 704 is mounted on the top end of the adjusting rod 703, a return spring 705 is mounted on the top side of the slide plate 704, and the top end of the return spring 705 is mounted on the top side inner wall of the telescopic sleeve 702. In the embodiment of the invention, when the copper-clad plate moves, the copper-clad plate can move to the two extrusion blocks 706, so that the two extrusion blocks 706 are stressed to move downwards, the two extrusion blocks 706 can drive the adjusting frame 701 to move downwards, the adjusting frame 701 pulls the adjusting rod 703 when moving downwards, the adjusting rod 703 moves in the telescopic sleeve 702 and drives the reset spring 705 to stretch under stress, and when the copper-clad plate leaves the two extrusion blocks 706, each structure can be reset under the resilience force of the reset spring 705.
More specifically, in the embodiment of the present invention, a driving hole 707 is formed on the adjusting frame 701, a driving shaft 708 is movably installed in the driving hole 707, a handle 709 is movably sleeved on the driving shaft 708, and the handle 709 is installed on the adjusting rod of the valve 6. It should be noted that, in the embodiment of the present invention, when the adjusting frame 701 moves, the driving hole 707 drives the driving shaft 708 to move, and the driving shaft 708 can drive the handle 709 to move, so that the handle 709 can adjust the valve 6, and the states of the valve 6 before, during and after the contact between the copper-clad plate and the two extrusion blocks 706 are respectively from closing to opening to closing, and in the opening process, the handle 709 can rotate to a required angle along with the action of gravity of the copper-clad plate, so as to complete automatic adjustment of the valve 6, and further realize control and opening and closing of the flow of the spray pipe 4.
Further, referring to fig. 1 to 9 of the specification, in the circuit board processing apparatus provided by the embodiment of the invention, the positioning device 8 includes two positioning plates 801, one side of each positioning plate 801, which is close to the other side, is provided with two adjusting frames 804, and the two adjusting frames 804 are used for adjusting the positions of copper clad laminates in the etching machine 1; two slide holes 802 are formed in the positioning plate 801, slide bars 803 are slidably mounted in the two slide holes 802, and the slide bars 803 are mounted on the inner wall of the etching machine 1. In the embodiment of the present invention, when the copper clad laminate is transported, the two positioning plates 801 drive the two adjusting frames 804 to move, the two adjusting frames 804 can straighten and position the copper clad laminate, and when the positioning plates 801 move, the two adjusting frames can horizontally move on the two sliding rods 803 through the two sliding holes 802.
Referring to fig. 5-7 of the specification, in further detail, in the embodiment of the present invention, two moving holes 805 are formed on the positioning plate 801, and extrusion rods 806 are movably installed in the two moving holes 805, and the extrusion rods 806 are installed on the adjusting frame 804; the outer side of the pressing rod 806 is sleeved with a spring 807 and a sheath 808, the spring 807 is positioned in the sheath 808, and two sides of the spring 807 and the sheath 808 are respectively arranged on one side of the positioning plate 801 and the adjusting frame 804 which are close to each other. It should be noted that, in the embodiment of the present invention, when the adjusting frame 804 contacts with the copper clad laminate, if the size of the copper clad laminate is larger, the adjusting frame 804 can be driven to move and retract under force, and the adjusting frame 804 slides in the two moving apertures 805 through the two extrusion rods 806, so that the adjusting frame 804 is limited to move only horizontally, and meanwhile, the spring 807 is driven to bear force.
Referring to fig. 5-7 of the specification, in further detail, in the embodiment of the present invention, the top sides of the two positioning plates 801 are both provided with driving racks 809, one rotating shaft 2 near the middle position of the positioning plate 801 is provided with two driving grooves 810, the bottom ends of the driving racks 809 extend into the driving grooves 810, and the driving grooves 810 are in annular inclined arrangement; the rotation shaft 2 drives the driving rack 809 to move back and forth through the driving groove 810. It should be noted that, in the embodiment of the present invention, in the process of rotating the rotating shaft 2, the driving rack 809 is driven by the driving groove 810, the driving rack 809 can drive the positioning board 801 to move, and when the rotating shaft 2 rotates for one circle, the driving rack 809 can drive the positioning board 801 to move back and forth once, so that the positioning board 801 moves back and forth, and positions and centers the copper-clad plate.
Further, referring to fig. 8-9 of the specification, the buffer conveying device 9 provided by the embodiment of the invention includes a turnover plate 901, the turnover plate 901 is used for receiving the copper-clad plate sent out by the discharging table 11, a plurality of buffer springs 903 are mounted on the top side of the turnover plate 901, and a buffer plate 902 is mounted on the plurality of buffer springs 903. In the embodiment of the invention, when the copper-clad plate is discharged, the copper-clad plate falls on the overturning plate 901, so that the overturning plate 901 is stressed to move downwards and drive the plurality of buffer springs 903 to bear force, and further the copper-clad plate can be buffered under the rebound force of the plurality of buffer springs 903, so that the damage of the copper-clad plate due to collision is avoided.
Referring to fig. 8-9 of the drawings, in further detail, in the embodiment of the present invention, both sides of the overturning plate 901 are provided with supporting seats 904, the supporting seats 904 are installed on the discharging table 11, a supporting shaft 905 is rotatably installed on the supporting seats 904, and the supporting shaft 905 is installed on one side of the overturning plate 901; in addition, a linkage frame 907 is slidably mounted on one side of the discharge table 11, a rotating frame 906 is rotatably mounted on the linkage frame 907, the rotating frame 906 is sleeved on a supporting shaft 905, a linkage shaft 908 is rotatably mounted on the linkage frame 907, and the linkage shaft 908 is rotatably mounted on the linkage frame 907. It should be noted that, in the embodiment of the present invention, when the linkage frame 907 moves back and forth, the support base 904 is driven to rotate by the linkage shaft 908, the support base 904 drives the turnover plate 901 to rotate by the support shaft 905, and when the linkage frame 907 moves back and forth once, the turnover plate 901 can be driven to turn back and forth once, so that the copper-clad plate can drop along with the rotation of the turnover plate 901, and further, the problem of damage to the copper-clad plate caused by mutual impact due to direct dropping is avoided.
Referring to fig. 8-9 of the specification, in further detail, in the embodiment of the present invention, a motor 909 is installed at the bottom side of the discharging platform 11, a motor shaft 913 is installed on an output shaft of the motor 909, a rotating rod 910 is installed on the motor shaft 913, a movable hole 911 is opened on the linkage frame 907, a movable shaft 912 is movably installed in the movable hole 911, and the movable shaft 912 is installed on the rotating rod 910. In the embodiment of the present invention, when the blanking table 11 performs blanking, the motor 909 may be started, the motor 909 drives the rotating rod 910 to rotate through the motor shaft 913, the rotating rod 910 can drive the movable shaft 912 to rotate, the movable shaft 912 can push the linkage frame 907 to move when sliding in the movable hole 911, and the linkage frame 907 can be driven to move back and forth once when the rotating rod 910 rotates one circle.
Referring to fig. 8-9 of the drawings, in further detail, in the embodiment of the present invention, a flat chute 914 is formed on one side of the discharging platform 11, a flat sliding block 915 is slidably mounted in the flat chute 914, and the flat sliding block 915 is mounted on the linkage frame 907. In the embodiment of the present invention, the linkage frame 907 slides in the smooth groove 914 by the flat slider 915 when moving, so that the linkage frame 907 is limited to move only in the horizontal direction.
In summary, the working principle of the circuit board processing device provided by the embodiment of the invention is as follows:
when the etching machine is operated, the plurality of rotating shafts 2 rotate to drive the plurality of conveying wheels 3 to rotate so as to convey the copper-clad plate, the copper-clad plate moves to the two extrusion blocks 706, so that the two extrusion blocks 706 are stressed to move downwards, the two extrusion blocks 706 can drive the adjusting frame 701 to move downwards, the adjusting rod 703 is pulled when the adjusting frame 701 moves downwards, the adjusting rod 703 moves in the telescopic sleeve 702, and the reset spring 705 is driven to be stressed to stretch; when the adjusting frame 701 moves, the driving shaft 708 is driven to move by the driving hole 707, the driving shaft 708 can drive the handle 709 to move, so that the handle 709 can open the valve 6, the valve 6 can be adjusted according to the gravity of the copper-clad plate, the spray pipe 4 can be opened, and the flow of the spray pipe 4 can be adjusted; when the copper-clad plate leaves the two extrusion blocks 706, the resilience force of the return spring 705 can enable each structure to return, and when the handle 709 returns, the valve 6 can be closed, so that the automatic adjustment of the valve 6 can be finished, the control and the opening and closing of the flow of the spray pipe 4 are realized, the using amount of corrosive liquid can be effectively saved, and the etching machine 1 is more energy-saving and environment-friendly in use;
further, in the process of rotating the rotating shaft 2, the driving rack 809 is driven by the driving groove 810, the driving rack 809 can drive the positioning plates 801 to move, the two positioning plates 801 drive the two adjusting racks 804 to move, the adjusting racks 804 can straighten and position the copper-clad plate, and when the positioning plates 801 move, the two sliding holes 802 can horizontally move on the two sliding rods 803, so when the rotating shaft 2 rotates for one circle, the driving rack 809 can drive the positioning plates 801 to move back and forth once, and then the positioning plates 801 move back and forth, so that the copper-clad plate is positioned and straightened;
when the copper-clad plate is discharged, the copper-clad plate falls on the overturning plate 901 at first, so that the overturning plate 901 is stressed to move downwards and drives the plurality of buffer springs 903 to bear force, and then the copper-clad plate can be buffered under the rebound force of the plurality of buffer springs 903, so that the copper-clad plate is prevented from being damaged due to collision; meanwhile, the motor 909 is started, the motor 909 drives the rotating rod 910 to rotate through the motor shaft 913, the rotating rod 910 can drive the movable shaft 912 to rotate, and the movable shaft 912 can push the linkage frame 907 to move when sliding in the movable hole 911, so when the rotating rod 910 rotates for a circle, the linkage frame 907 can be driven to move back and forth once, when the linkage frame 907 moves back and forth, the support base 904 can be driven to rotate through the linkage shaft 908, the support base 904 can drive the turnover plate 901 to rotate through the support shaft 905, and when the linkage frame 907 moves back and forth once, the turnover plate 901 can be driven to turn back and forth once, so that the copper-clad plate can drop along with the rotation of the turnover plate 901, and further the problem that the copper-clad plate is damaged due to mutual collision caused by direct dropping is avoided.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. The circuit board processing equipment is characterized by comprising an etching machine, wherein a feeding table and a discharging table are respectively arranged on two sides of the etching machine, a plurality of rotating shafts are rotatably arranged on the etching machine, the feeding table and the discharging table, a plurality of conveying wheels are equidistantly arranged on the rotating shafts, a plurality of spray pipes are arranged in the etching machine, and a spray head is arranged on the bottom side of each spray pipe;
the spray pipe is provided with a valve which is used for adjusting the flow and opening and closing of the spray pipe; a plurality of automatic adjusting devices are arranged in the etching machine at equal intervals, the automatic adjusting devices are positioned between the two rotating shafts at corresponding positions, the automatic adjusting devices are respectively positioned on one sides of the spray pipes, and the automatic adjusting devices are used for adjusting the valves;
the positioning device is positioned above the conveying wheel and used for righting and positioning the copper-clad plate conveyed in the etching machine, and the positioning device is arranged on the inner walls of the two sides of the etching machine;
the copper-clad plate conveying device is arranged on one side of the discharging table and is used for buffering the copper-clad plate conveyed by the discharging table;
the automatic adjusting device comprises an adjusting frame, an adjusting rod is arranged on the top side of the adjusting frame, a telescopic sleeve is movably sleeved on the adjusting rod, the top side of the telescopic sleeve is arranged on the inner wall of the top side of the etching machine, and two extrusion blocks are arranged on the adjusting frame;
a sliding plate is arranged at the top end of the adjusting rod, a return spring is arranged at the top side of the sliding plate, and the top end of the return spring is arranged on the inner wall of the top side of the telescopic sleeve;
a driving hole is formed in the adjusting frame, a driving shaft is movably installed in the driving hole, a handle is movably sleeved on the driving shaft, and the handle is installed on an adjusting rod of the valve;
when the adjusting frame moves, the driving hole is driven to drive the driving shaft to move, the driving shaft drives the handle to move, so that the handle can open the valve, and the valve can be adjusted according to the gravity of the copper-clad plate.
2. The circuit board processing device according to claim 1, wherein the positioning device comprises two positioning plates, and an adjusting frame is arranged on one side of each positioning plate, which is close to each other, and is used for adjusting the position of the copper-clad plate in the etching machine;
two sliding holes are formed in the positioning plate, sliding rods are slidably arranged in the two sliding holes, and the sliding rods are arranged on the inner wall of the etching machine.
3. The circuit board processing device according to claim 2, wherein two moving holes are formed in the positioning plate, extrusion rods are movably installed in the two moving holes, and the extrusion rods are installed on the adjusting frame;
the outside of extrusion pole has cup jointed spring and sheath, the spring is located in the sheath, the spring with the both sides of sheath are installed respectively the locating plate with the alignment jig is close to on one side each other.
4. The circuit board processing device according to claim 2, wherein the top sides of the two positioning plates are provided with driving frames, one of the rotating shafts close to the middle position of the positioning plate is provided with two driving grooves, the bottom ends of the driving frames extend into the driving grooves, and the driving grooves are obliquely arranged in a ring shape;
the rotating shaft drives the driving frame to move back and forth through the driving groove.
5. The circuit board processing device according to claim 1, wherein the buffer conveying device comprises a turnover plate, the turnover plate is used for receiving the copper-clad plate sent out by the discharging table, a plurality of buffer springs are mounted on the top side of the turnover plate, and one buffer plate is mounted on the plurality of buffer springs.
6. The circuit board processing device according to claim 5, wherein supporting seats are arranged on both sides of the turnover plate, the supporting seats are arranged on the discharging table, supporting shafts are rotatably arranged on the supporting seats, and the supporting shafts are arranged on one side of the turnover plate;
one side slidable mounting of ejection of compact platform has the link frame, the rotating turret is installed in the last rotation of link frame, the rotating turret cup joints on the back shaft, the last linkage shaft of rotating installation of link frame, the linkage shaft rotates and installs on the link frame.
7. The circuit board processing device according to claim 6, wherein a motor is installed at the bottom side of the discharging table, a motor shaft is installed on an output shaft of the motor, a rotating rod is installed on the motor shaft, a movable hole is formed in the linkage frame, a movable shaft is movably installed in the movable hole, and the movable shaft is installed on the rotating rod.
8. The circuit board processing device according to claim 6, wherein a flat sliding groove is formed in one side of the discharging table, a flat sliding block is slidably mounted in the flat sliding groove, and the flat sliding block is mounted on the linkage frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310621900.7A CN116528488B (en) | 2023-05-30 | 2023-05-30 | Circuit board processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310621900.7A CN116528488B (en) | 2023-05-30 | 2023-05-30 | Circuit board processing equipment |
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| CN116528488A CN116528488A (en) | 2023-08-01 |
| CN116528488B true CN116528488B (en) | 2023-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310621900.7A Active CN116528488B (en) | 2023-05-30 | 2023-05-30 | Circuit board processing equipment |
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| CN (1) | CN116528488B (en) |
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| JPH07241497A (en) * | 1994-03-07 | 1995-09-19 | Enomoto Giken:Kk | Solvent coating nozzle, its nozzle unit and coater using the nozzle and unit |
| KR20010054557A (en) * | 1999-12-07 | 2001-07-02 | 이형도 | Automatic control device for etching quantity of pcb |
| JP2006080439A (en) * | 2004-09-13 | 2006-03-23 | Koki Tec Corp | Solder jet flow nozzle |
| JP2006332300A (en) * | 2005-05-26 | 2006-12-07 | Tokyo Kakoki Kk | Etching device of plated substrate |
| CN204761845U (en) * | 2015-07-07 | 2015-11-11 | 深圳市翔宇电路有限公司 | Can improve PCB board etching machine of etching homogeneity |
| CN211240335U (en) * | 2020-03-03 | 2020-08-11 | 深圳市点石源水处理技术有限公司 | High-efficiency automatic micro-etching system |
| CN113423187A (en) * | 2021-06-17 | 2021-09-21 | 厦门市腾盛兴电子技术有限公司 | PCB etching method and spraying etching machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW579664B (en) * | 2000-01-11 | 2004-03-11 | Matsushita Electric Ind Co Ltd | Apparatus and method for manufacturing printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5002627A (en) * | 1988-08-12 | 1991-03-26 | International Business Machines Corporation | Spray etching apparatus with automatic individually controllable etching jets |
| JPH06173040A (en) * | 1992-12-02 | 1994-06-21 | Sharp Corp | Etching device |
| JPH079454U (en) * | 1993-07-20 | 1995-02-10 | 大阪アサヒ化学株式会社 | Control device for spray coating amount |
| JPH07241497A (en) * | 1994-03-07 | 1995-09-19 | Enomoto Giken:Kk | Solvent coating nozzle, its nozzle unit and coater using the nozzle and unit |
| KR20010054557A (en) * | 1999-12-07 | 2001-07-02 | 이형도 | Automatic control device for etching quantity of pcb |
| JP2006080439A (en) * | 2004-09-13 | 2006-03-23 | Koki Tec Corp | Solder jet flow nozzle |
| JP2006332300A (en) * | 2005-05-26 | 2006-12-07 | Tokyo Kakoki Kk | Etching device of plated substrate |
| CN204761845U (en) * | 2015-07-07 | 2015-11-11 | 深圳市翔宇电路有限公司 | Can improve PCB board etching machine of etching homogeneity |
| CN211240335U (en) * | 2020-03-03 | 2020-08-11 | 深圳市点石源水处理技术有限公司 | High-efficiency automatic micro-etching system |
| CN113423187A (en) * | 2021-06-17 | 2021-09-21 | 厦门市腾盛兴电子技术有限公司 | PCB etching method and spraying etching machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116528488A (en) | 2023-08-01 |
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Denomination of invention: A PCB processing equipment Granted publication date: 20230922 Pledgee: Weihai Commercial Bank Co.,Ltd. Guangming sub branch Pledgor: Weihai Yiyan Automation Technology Co.,Ltd. Registration number: Y2024980004638 |