CN116519801A - Method and device for detecting defect position, electronic equipment and storage medium - Google Patents

Method and device for detecting defect position, electronic equipment and storage medium Download PDF

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Publication number
CN116519801A
CN116519801A CN202310285498.XA CN202310285498A CN116519801A CN 116519801 A CN116519801 A CN 116519801A CN 202310285498 A CN202310285498 A CN 202310285498A CN 116519801 A CN116519801 A CN 116519801A
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China
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acoustic signal
wave velocity
detected
arrival time
acoustic
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CN202310285498.XA
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胡彦坤
王世超
张存瑞
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Qingdao Haier Refrigerator Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
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Qingdao Haier Refrigerator Co Ltd
Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
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Application filed by Qingdao Haier Refrigerator Co Ltd, Qingdao Haier Smart Technology R&D Co Ltd, Haier Smart Home Co Ltd filed Critical Qingdao Haier Refrigerator Co Ltd
Priority to CN202310285498.XA priority Critical patent/CN116519801A/en
Publication of CN116519801A publication Critical patent/CN116519801A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

The application relates to the technical field of nondestructive testing, and discloses a method for detecting a defect position, wherein an acoustic emission source and a plurality of acoustic emission sensors are arranged at a position to be detected; an acoustic emission sensor for emitting an acoustic signal, the acoustic emission sensor for receiving the acoustic signal emitted by an acoustic emission source, the method comprising: and acquiring an acoustic signal, and acquiring arrival time and wave velocity information of the acoustic signal. And determining the defect position of the part to be detected according to the arrival time and the wave velocity information. Thus, by providing an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected, the wave velocity may vary significantly due to the acoustic signals upon structural defects. The method for determining the defect position according to the arrival time and wave speed information of the acoustic signal is more accurate than a manual observation method by transmitting the acoustic signal to propagate in the part to be detected, thereby realizing nondestructive detection and improving the detection accuracy of the defect position. The application also discloses a device for detecting the defect position, electronic equipment and a storage medium.

Description

Method and device for detecting defect position, electronic equipment and storage medium
Technical Field
The present application relates to the field of non-destructive testing technologies, for example, to a method and apparatus for detecting a defect position, an electronic device, and a storage medium.
Background
Currently, in the household industry and the refrigerator industry, there is no good way to judge and locate potential defects of structural components such as injection molding parts, sheet metal parts, foaming materials and the like and the whole machine structure. The refrigerator can be subjected to delivery detection before delivery, and the structure inside the refrigerator is an assembled structure.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
in the related art, when detecting structural defects of a refrigerator, destructive modes such as disassembling and even splitting structural parts and the like are generally required for an assembled structure, and research and development engineers and production line workers with abundant experience are relied on to judge whether defects exist and positions of the defects through manual observation. Moreover, the manual observation mode has low precision and large error, and it is difficult to accurately judge whether the defect exists or not and the defect position. It is difficult to realize nondestructive detection and improve the detection accuracy of the defect position.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a method and a device for detecting a defect position, electronic equipment and a storage medium, so that nondestructive detection can be realized, and meanwhile, the detection accuracy of the defect position is improved.
In some embodiments, the method for detecting a defect location, where an acoustic emission source and a plurality of acoustic emission sensors are disposed; the acoustic emission sensor is used for emitting acoustic signals, the acoustic emission sensor is used for receiving the acoustic signals emitted by the acoustic emission source, and the method comprises the following steps: and acquiring an acoustic signal, acquiring arrival time and wave velocity information of the acoustic signal, and determining the defect position of the part to be detected according to the arrival time and the wave velocity information.
In some embodiments, the acquiring the acoustic signal comprises: and receiving an acoustic signal to be processed, and filtering the acoustic signal to be processed to obtain an acoustic signal.
In some embodiments, the acoustic emission sensor includes a first sensor disposed at one end of the site to be detected and a second sensor disposed at the other end of the site to be detected; acquiring an arrival time of the acoustic signal, comprising: a first arrival time of the acoustic signal received by the first sensor and a second arrival time of the acoustic signal received by the second sensor are determined as arrival times of the acoustic signals.
In some embodiments, the acoustic signal is composed of a transverse wave and a longitudinal wave, the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and acquiring the wave velocity information of the acoustic signal includes: and acquiring material information of the part to be detected and type information of the acoustic signal. Matching wave speed information which corresponds to the material information and the type information together from a preset wave speed information database; and the wave velocity information database stores the corresponding relation among the material information, the type information and the wave velocity information.
In some embodiments, the acoustic signal is composed of a transverse wave and a longitudinal wave, the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and acquiring the wave velocity information of the acoustic signal includes: and acquiring the installation distance between the first sensor and the second sensor, acquiring the time difference between the second arrival time and the first arrival time, and acquiring wave speed information according to the installation distance and the time difference.
In some embodiments, determining the defect position of the part to be detected according to the arrival time and the wave velocity information includes: and acquiring a waveform diagram of the acoustic signal propagating at the part to be detected. And determining whether the part to be detected has defects according to the oscillogram. And under the condition that the part to be detected has defects, determining the defect positions of the part to be detected according to the arrival time and the wave velocity information.
In some embodiments, the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and determining the defect position of the to-be-detected part according to the arrival time and the wave velocity information includes: a time difference between the second arrival time and the first arrival time is obtained. And acquiring the distance between the second sensor and the tail part of the defect edge according to the time difference, the transverse wave velocity and the longitudinal wave velocity. And determining the distance between the second sensor and the tail part of the defect edge as the defect position of the part to be detected.
In some embodiments, the means for detecting the location of the defect comprises: a processor and a memory storing program instructions, the processor being configured to perform the above-described method for detecting a defect location when executing the program instructions.
In some embodiments, the electronic device comprises: an electronic device body; the device for detecting a defective position as described above is mounted to the electronic apparatus body.
In some embodiments, the storage medium stores program instructions that, when executed, perform the method for detecting a defect location described above.
The method and device for detecting the defect position, the electronic device and the storage medium provided by the embodiment of the disclosure can realize the following technical effects: by acquiring the acoustic signal, arrival time and wave velocity information of the acoustic signal are acquired. And determining the defect position of the part to be detected according to the arrival time and the wave velocity information. Thus, by providing an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected, the wave velocity may vary significantly due to the acoustic signals upon structural defects. By transmitting the acoustic signal to propagate in the part to be detected, the mode of determining the defect position according to the arrival time and wave velocity information of the acoustic signal is more accurate than the mode of manual observation, and structural disassembly is not needed. The nondestructive detection is realized, and meanwhile, the detection accuracy of the defect position is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
FIG. 1 is a schematic diagram of a method for detecting defect locations provided by embodiments of the present disclosure;
FIG. 2 is a schematic illustration of one application provided by an embodiment of the present disclosure;
FIG. 3 is another application schematic provided by an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an acoustic signal waveform of a first sensor after filtering according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of an acoustic signal waveform of a second sensor after filtering according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram showing waveforms of acoustic signals passing through different size defects according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of an apparatus for detecting defect locations provided by an embodiment of the present disclosure.
Reference numerals: 1: a first sensor; 2: a second sensor; 3: defects; 4: an acoustic emission source; 5: the part to be detected; 6: defect edge tails.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
The term "corresponding" may refer to an association or binding relationship, and the correspondence between a and B refers to an association or binding relationship between a and B.
In the embodiment of the disclosure, nondestructive detection is performed on the structure by an AE (Acoustic Emission) technology, so that the quality of a product in a production line can be further ensured, and the overhaul efficiency is improved. By arranging an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected. In some embodiments, a first sensor is disposed at one end of the site to be detected, and the acoustic emission sensor is configured to receive an acoustic signal emitted by the acoustic emission source. And a second sensor is arranged at the other end of the part to be detected, and the defect is positioned between the first sensor and the second sensor. An acoustic signal is emitted by the acoustic emission source, propagates in the part to be detected, and passes through the first sensor, the defect and the second sensor in order. Since the acoustic signal is composed of transverse and longitudinal waves, wherein the transverse wave is substantially unaffected by structural defects, the longitudinal wave will have a significant change in wave velocity when encountering different types of structural defects. The distance between the first sensor and the tail of the defect edge is at the longitudinal wave speed, and the distance between the tail of the defect edge and the second sensor is at the transverse wave speed. Therefore, by comparing the arrival time and wave velocity information of the acoustic signals received by the respective acoustic emission sensors, it is possible to determine whether or not a defect exists. The defect position can be determined through multi-point positioning by integrating the data of the acoustic emission sensors in multiple directions. The AE technology is utilized to carry out nondestructive testing accurately, rapidly and with low cost, structural members do not need to be split, and damage to the product structure is not easy to occur. The method can be used for real-time monitoring and is applied to defect detection of large-batch refrigerator structures. The defect position can be accurately fed back, the defect that the hiding is not well detected can be detected under the condition of no damage, and the cost is low.
Referring to fig. 1, an embodiment of the present disclosure provides a method for detecting a defect position, where an acoustic emission source and a plurality of acoustic emission sensors are disposed at a portion to be detected; an acoustic emission sensor for emitting an acoustic signal, the acoustic emission sensor for receiving the acoustic signal emitted by an acoustic emission source, the method comprising:
in step S101, the electronic device acquires an acoustic signal.
In step S102, the electronic device acquires arrival time and wave velocity information of the acoustic signal.
Step S103, the electronic equipment determines the defect position of the part to be detected according to the arrival time and the wave velocity information.
By adopting the method for detecting the defect position, which is provided by the embodiment of the disclosure, the arrival time and wave velocity information of the acoustic signal are obtained by obtaining the acoustic signal. And determining the defect position of the part to be detected according to the arrival time and the wave velocity information. Thus, by providing an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected, the wave velocity may vary significantly due to the acoustic signals upon structural defects. By transmitting the acoustic signal to propagate in the part to be detected, the mode of determining the defect position according to the arrival time and wave velocity information of the acoustic signal is more accurate than the mode of manual observation, and structural disassembly is not needed. The nondestructive detection is realized, and meanwhile, the detection accuracy of the defect position is improved.
In some embodiments, the acoustic signal is a lamb wave and the acoustic emission source is a piezoelectric transducer.
In some embodiments, an acoustic emission source and a plurality of acoustic emission sensors are provided at the site to be detected. The acoustic emission sensor is configured to receive acoustic signals emitted by the acoustic emission source, and the plurality of emission sensors are capable of receiving acoustic signals from different orientations. Therefore, the part to be detected can be covered comprehensively, and the defect position can be positioned more accurately.
Further, the electronic device obtains an acoustic signal, including: and the electronic equipment receives the acoustic signal to be processed, and performs filtering processing on the acoustic signal to be processed to obtain an acoustic signal. Thus, by filtering the acoustic signal to be processed, noise in the acoustic signal to be processed can be filtered, and feature analysis can be realized, so that features in the acoustic signal to be processed are highlighted.
In some embodiments, a lamb wave with a center frequency of 90kHz, which is formed by 5 sin functions modulated by a hanning window, is emitted from the part to be detected through an acoustic emission source. This facilitates finding and locating waveforms of acoustic signals after propagation in the site to be detected.
Further, the electronic device performs filtering processing on the acoustic signal to be processed to obtain an acoustic signal, including: the electronic equipment performs noise filtering processing on the to-be-processed acoustic signal by using a preset first filter, and performs feature analysis on the to-be-processed acoustic signal subjected to the noise filtering processing by using a preset second filter to obtain the acoustic signal. The first filter is a chebyshev filter, and the second filter is a gabor filter. Thus, noise and environmental noise generated in a part of the propagation process can be filtered by performing noise filtering processing on the acoustic signal to be processed. And then, carrying out characteristic analysis on the acoustic signal to be processed after noise filtering processing, and simultaneously displaying the frequency domain characteristic and the time domain characteristic of the lamb wave by utilizing the short-time Fourier transform of the gabor filter so as to highlight the characteristics of surrounding waves with the frequency of 90 kHz.
Further, the acoustic emission sensor includes a first sensor and a second sensor, the first sensor is disposed at one end of the portion to be detected, and the second sensor is disposed at the other end of the portion to be detected. The electronic device obtaining an arrival time of the acoustic signal, comprising: the electronic device determines a first arrival time of the acoustic signal received by the first sensor and a second arrival time of the acoustic signal received by the second sensor as arrival times of the acoustic signals.
Referring to fig. 2, fig. 2 is a schematic diagram of an application provided by an embodiment of the disclosure. In fig. 2, a portion 5 to be detected has a defect 3, and a first sensor 1, a second sensor 2, and an acoustic emission source 4 are provided on the portion 5 to be detected. By means of the acoustic emission source 4, an acoustic signal is emitted, which propagates in the region 5 to be detected, passing through the first sensor 1, the defect 3 and the second sensor 2 in sequence. The electronic device determines as arrival times a first arrival time at which the acoustic signal is received by the first sensor 1 and a second arrival time at which the acoustic signal is received by the second sensor 2. In some embodiments, the defect 3 is a blind hole, the set distance between the first sensor 1 and the second sensor 2 is 150mm, the set distance between the first sensor 1 and the acoustic emission source 4 is 100mm, and the distance between the acoustic emission source 4 and the lower edge of the part to be detected is 100mm. The length of the part to be detected is 450mm, and the width is 324mm.
Further, the acoustic signal is composed of a transverse wave and a longitudinal wave, the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and the electronic device obtains the wave velocity information of the acoustic signal, including: the electronic device acquires material information of the part to be detected and type information of the sound signal. And matching wave speed information which corresponds to the material information and the type information together from a preset wave speed information database. The wave velocity information database stores the corresponding relation among the material information, the type information and the wave velocity information.
In some embodiments, the acoustic signal is comprised of a transverse wave that is substantially unaffected by the structural defect and a longitudinal wave that undergoes a significant change in wave velocity when it encounters the structural defect.
In some embodiments, the material information includes stainless steel material, PVC polyvinyl chloride material, or tempered glass material, among others. The type information includes lamb waves and the like. In some embodiments, the material information of the part to be detected is stainless steel material, the type information of the acoustic signal is lamb wave, and the wave speed information which corresponds to the stainless steel material and the lamb wave together is matched from a preset wave speed information database.
Further, the electronic device obtains wave velocity information of the acoustic signal, including: the electronic device obtains an installation distance between the first sensor and the second sensor. And acquiring a time difference between the second arrival time and the first arrival time, and acquiring wave speed information according to the installation distance and the time difference. The first arrival time comprises a first transverse wave arrival time and a first longitudinal wave arrival time, and the second arrival time comprises a second transverse wave arrival time and a second longitudinal wave arrival time.
Further, the time difference includes a first time difference and a second time difference, and the electronic device obtains wave velocity information according to the installation distance and the time difference, including: the electronic device obtains a transverse wave velocity by dividing the installation distance by the first time difference, and obtains a longitudinal wave velocity by dividing the installation distance by the second time difference. The first time difference is a difference between the arrival time of the first transverse wave and the arrival time of the second transverse wave, and the second time difference is a difference between the arrival time of the first longitudinal wave and the arrival time of the second longitudinal wave.
Further, the electronic device determining a defect position of the part to be detected according to the arrival time and the wave velocity information includes: the electronic equipment acquires a waveform diagram of the propagation of the acoustic signal at the part to be detected, and determines whether the part to be detected has defects according to the waveform diagram. And under the condition that the part to be detected has defects, determining the defect positions of the part to be detected according to the arrival time and the wave velocity information.
Further, the electronic device determining whether the part to be detected has a defect according to the waveform diagram includes: and under the condition that the wave peaks in the waveform diagram are the preset number, the electronic equipment determines that the part to be detected has no defects. Wherein the preset number is 2.
Further, the electronic device determining whether the part to be detected has a defect according to the waveform diagram includes: and under the condition that the wave peaks in the waveform diagram exceed the preset number, the electronic equipment determines that the part to be detected has defects. Wherein the preset number is 2.
Further, the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and the electronic device determines a defect position of the part to be detected according to the arrival time and the wave velocity information, including: the electronic device obtains a time difference between the second arrival time and the first arrival time. And obtaining the distance between the second sensor and the tail part of the defect edge according to the time difference, the transverse wave velocity and the longitudinal wave velocity. And determining the distance between the second sensor and the tail part of the defect edge as the defect position of the part to be detected.
Further, the first arrival time includes a first transverse wave arrival time and a first longitudinal wave arrival time, and the second arrival time includes a second transverse wave arrival time and a second longitudinal wave arrival time. The electronic device obtaining a time difference between the second arrival time and the first arrival time, comprising: the electronic device determines a difference between the second longitudinal wave arrival time and the first longitudinal wave arrival time as a time difference.
Further, the electronic device obtains a distance between the second sensor and the tail of the defect edge according to the time difference, the transverse wave velocity and the longitudinal wave velocity, and the method comprises the following steps: and the electronic equipment calculates by utilizing the time difference, the transverse wave velocity and the longitudinal wave velocity according to a preset algorithm to obtain the distance between the second sensor and the tail part of the defect edge.
Further, the electronic equipment calculates the time difference, the transverse wave velocity and the longitudinal wave velocity according to a preset algorithm to obtain the distance between the second sensor and the tail of the defect edge, and the method comprises the following steps: by calculation of electronic devicesA distance between the second sensor and the tail of the defective edge is obtained. Wherein T is 2 For the second longitudinal wave arrival time, T 1 Is the first longitudinal wave arrival time. T (T) 2 -T 1 For the time difference, z is the longitudinal wave velocity, h is the transverse wave velocity, and x is the distance between the second sensor and the tail of the defect edge. 150-x is the distance between the first sensor and the tail of the defect edge.
Referring to fig. 3, fig. 3 is another application schematic provided in an embodiment of the disclosure. In fig. 3, a first sensor 1 and a second sensor 2 are disposed on a portion 5 to be detected, and a defect 3 is located between the first sensor 1 and the second sensor 2. The distance between the defective edge tail 6 and the second sensor 2 is determined as the defective position. In some embodiments, the acoustic signal comprises a transverse wave and a longitudinal wave, the longitudinal wave traveling at a longitudinal wave velocity between the first sensor 1 and the defect edge tail 6, the longitudinal wave velocity at the defect edge tail 6 being changed to a transverse wave velocity, and the longitudinal wave traveling at a transverse wave velocity between the defect edge tail 6 and the second sensor 2.
Referring to fig. 4 to 5, fig. 4 is a schematic diagram of an acoustic signal waveform of a first sensor after a filtering process according to an embodiment of the present disclosure, and fig. 5 is a schematic diagram of an acoustic signal waveform of a second sensor after a filtering process according to an embodiment of the present disclosure. In fig. 4, the acoustic signal is a lamb wave, which includes a transverse wave and a longitudinal wave, the transverse wave having the slowest speed and the longitudinal wave having the fastest speed. In some embodiments, after the piezoelectric transducer emits the lamb wave, a wave slower than the transverse wave may appear after A0' in fig. 4 due to the piezoelectric transducer not being turned off, the wave slower than the transverse wave is irrelevant to the scheme, and the scheme only focuses on the wave between the transverse wave and the longitudinal wave. In fig. 4, time is plotted on the abscissa and Gabor coefficients are plotted on the ordinate. Gabor coefficients are used to characterize amplitude or energy. S0' is used to characterize the maximum amplitude point of the longitudinal wave at the first sensor. A0' is used to characterize the maximum amplitude point of the transverse wave at the first sensor. In fig. 5, the acoustic signal is a lamb wave, which includes a transverse wave and a longitudinal wave, the transverse wave having the slowest speed and the longitudinal wave having the fastest speed. In some embodiments, after the piezoelectric transducer emits the lamb wave, the wave slower than the transverse wave speed appears after A0 "in fig. 5 due to the piezoelectric transducer not being turned off in time, the wave slower than the transverse wave speed is irrelevant to the scheme, and the scheme only focuses on the wave between the transverse wave and the longitudinal wave. The abscissa is time and the ordinate is Gabor coefficient. Gabor coefficients are used to characterize amplitude or energy. S0 "is used to characterize the maximum amplitude point of the longitudinal wave at the second sensor. A0 "is used to characterize the maximum amplitude point of the transverse wave at the second sensor.
Referring to fig. 6, fig. 6 is a schematic diagram showing waveforms of acoustic signals passing through defects of different sizes according to an embodiment of the present disclosure. In fig. 6, the acoustic signal is a lamb wave, which includes a transverse wave and a longitudinal wave, the transverse wave having the slowest speed and the longitudinal wave having the fastest speed. In some embodiments, after the piezoelectric transducer emits the lamb wave, the wave slower than the transverse wave speed appears after A0S0 in fig. 6 due to the fact that the piezoelectric transducer is not turned off in time, the wave slower than the transverse wave speed is irrelevant to the scheme, and the scheme only focuses on the wave between the transverse wave and the longitudinal wave. In fig. 6, time is plotted on the abscissa and Gabor coefficients are used to characterize amplitude or energy. The waveform diagram of the second sensor with defects is the waveform diagram of the second sensor with defects of 36mm blind holes, the waveform diagram of the second sensor with defects of 24mm blind holes and the waveform diagram of the second sensor with defects of 12mm blind holes from top to bottom. S0 is used to characterize the maximum amplitude point of the original longitudinal wave. A0S0 is the maximum amplitude point of the transition from the tail of the defect encountered by the longitudinal wave to the transverse wave. It can be seen that, in the case where there is a defect at the portion to be detected, there is a waveform change at the A0S0 position, although the defect size is different from that of the waveform schematic diagram without the defect.
As shown in connection with fig. 7, an embodiment of the present disclosure provides an apparatus 700 for detecting a defect location, including a processor (processor) 704 and a memory (memory) 701. Optionally, the apparatus may further comprise a communication interface (Communication Interface) 702 and a bus 703. The processor 704, the communication interface 702, and the memory 701 may communicate with each other through the bus 703. The communication interface 702 may be used for information transfer. The processor 704 may invoke logic instructions in the memory 701 to perform the method for detecting defect locations of the above-described embodiments.
By adopting the device for detecting the defect position, which is provided by the embodiment of the disclosure, the arrival time and wave velocity information of the acoustic signal are obtained by obtaining the acoustic signal. And determining the defect position of the part to be detected according to the arrival time and the wave velocity information. Thus, by providing an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected, the wave velocity may vary significantly due to the acoustic signals upon structural defects. By transmitting the acoustic signal to propagate in the part to be detected, the mode of determining the defect position according to the arrival time and wave velocity information of the acoustic signal is more accurate than the mode of manual observation, and structural disassembly is not needed. The nondestructive detection is realized, and meanwhile, the detection accuracy of the defect position is improved.
Further, the logic instructions in the memory 701 may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand alone product.
The memory 701 is used as a computer readable storage medium for storing a software program, a computer executable program, and program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 704 executes the functional applications and data processing by executing the program instructions/modules stored in the memory 701, i.e., implements the method for detecting the defect location in the above-described embodiments.
Memory 701 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, at least one application program required for a function; the storage data area may store data created according to the use of the terminal device, etc. In addition, the memory 701 may include a high-speed random access memory, and may also include a nonvolatile memory.
The embodiment of the disclosure provides an electronic device, comprising: the electronic equipment body and the device for detecting the defect position. The means for detecting the location of the defect is mounted to the electronic device body. The mounting relationship described herein is not limited to being placed inside the electronic device body, but includes mounting connections with other components of the electronic device body, including but not limited to physical connections, electrical connections, or signal transmission connections, etc. Those skilled in the art will appreciate that the means for detecting the location of defects may be adapted to a viable electronic device body, thereby enabling other viable embodiments.
By adopting the electronic equipment provided by the embodiment of the disclosure, the arrival time and wave velocity information of the acoustic signal are obtained by obtaining the acoustic signal. And determining the defect position of the part to be detected according to the arrival time and the wave velocity information. Thus, by providing an acoustic emission source and a plurality of acoustic emission sensors at the site to be detected, the wave velocity may vary significantly due to the acoustic signals upon structural defects. By transmitting the acoustic signal to propagate in the part to be detected, the mode of determining the defect position according to the arrival time and wave velocity information of the acoustic signal is more accurate than the mode of manual observation, and structural disassembly is not needed. The nondestructive detection is realized, and meanwhile, the detection accuracy of the defect position is improved.
Optionally, the electronic device comprises a computer or a server or the like.
The disclosed embodiments provide a storage medium storing program instructions that, when executed, perform the above-described method for detecting a defect location.
The disclosed embodiments provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the above-described method for detecting a defect location.
The computer readable storage medium may be a transitory computer readable storage medium or a non-transitory computer readable storage medium.
Embodiments of the present disclosure may be embodied in a software product stored on a storage medium, including one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of a method according to embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium including: a plurality of media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or a transitory storage medium.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. Moreover, the terminology used in the present application is for the purpose of describing embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a," "an," and "the" (the) are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, when used in this application, the terms "comprises," "comprising," and/or "includes," and variations thereof, mean that the stated features, integers, steps, operations, elements, and/or components are present, but that the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof is not precluded. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of other like elements in a process, method or apparatus comprising such elements. In this context, each embodiment may be described with emphasis on the differences from the other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method sections disclosed in the embodiments, the description of the method sections may be referred to for relevance.
Those of skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. The skilled artisan may use different methods for each particular application to achieve the described functionality, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.
In the embodiments disclosed herein, the disclosed methods, articles of manufacture (including but not limited to devices, apparatuses, etc.) may be practiced in other ways. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the units may be merely a logical function division, and there may be additional divisions when actually implemented, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form. The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to implement the present embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than that disclosed in the description, and sometimes no specific order exists between different operations or steps. For example, two consecutive operations or steps may actually be performed substantially in parallel, they may sometimes be performed in reverse order, which may be dependent on the functions involved. Each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Claims (10)

1. A method for detecting a defect position, characterized in that an acoustic emission source and a plurality of acoustic emission sensors are arranged at a part to be detected; the acoustic emission sensor is used for emitting acoustic signals, the acoustic emission sensor is used for receiving the acoustic signals emitted by the acoustic emission source, and the method comprises the following steps:
acquiring an acoustic signal;
acquiring arrival time and wave velocity information of the acoustic signals;
and determining the defect position of the part to be detected according to the arrival time and the wave velocity information.
2. The method of claim 1, wherein the acquiring the acoustic signal comprises:
receiving an acoustic signal to be processed;
and filtering the acoustic signal to be processed to obtain an acoustic signal.
3. The method of claim 1, wherein the acoustic emission sensor comprises a first sensor disposed at one end of the site to be detected and a second sensor disposed at the other end of the site to be detected; acquiring an arrival time of the acoustic signal, comprising:
a first arrival time of the acoustic signal received by the first sensor and a second arrival time of the acoustic signal received by the second sensor are determined as arrival times of the acoustic signals.
4. The method of claim 1, wherein the acoustic signal is comprised of shear waves and longitudinal waves, the wave velocity information comprises shear wave velocities and longitudinal wave velocities, and obtaining the wave velocity information of the acoustic signal comprises:
acquiring material information of the part to be detected and type information of the acoustic signal;
matching wave speed information which corresponds to the material information and the type information together from a preset wave speed information database; and the wave velocity information database stores the corresponding relation among the material information, the type information and the wave velocity information.
5. A method according to claim 3, wherein the acoustic signal is comprised of transverse and longitudinal waves, the wave velocity information comprises transverse and longitudinal wave velocities, and acquiring the wave velocity information of the acoustic signal comprises:
acquiring the installation distance between the first sensor and the second sensor;
acquiring a time difference between the second arrival time and the first arrival time;
and acquiring wave speed information according to the installation distance and the time difference.
6. The method of claim 1, wherein determining the defect location of the part to be inspected based on the arrival time and the wave velocity information comprises:
acquiring a waveform diagram of the acoustic signal transmitted at the part to be detected;
determining whether the part to be detected has a defect according to the oscillogram;
and under the condition that the part to be detected has defects, determining the defect positions of the part to be detected according to the arrival time and the wave velocity information.
7. A method according to claim 3, wherein the wave velocity information includes a transverse wave velocity and a longitudinal wave velocity, and determining the defect location of the part to be detected based on the arrival time and the wave velocity information includes:
acquiring a time difference between the second arrival time and the first arrival time;
acquiring the distance between the second sensor and the tail part of the defect edge according to the time difference, the transverse wave velocity and the longitudinal wave velocity;
and determining the distance between the second sensor and the tail part of the defect edge as the defect position of the part to be detected.
8. An apparatus for detecting a defect location comprising a processor and a memory storing program instructions, wherein the processor is configured to perform the method for detecting a defect location of any of claims 1 to 7 when the program instructions are run.
9. An electronic device, comprising:
an electronic device body;
the apparatus for detecting a defective position according to claim 8, mounted to the electronic device body.
10. A storage medium storing program instructions which, when executed, perform the method for detecting a defect location of any one of claims 1 to 7.
CN202310285498.XA 2023-03-22 2023-03-22 Method and device for detecting defect position, electronic equipment and storage medium Pending CN116519801A (en)

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