CN116519797A - Package evaluation method, analysis device, and computer-readable storage medium - Google Patents

Package evaluation method, analysis device, and computer-readable storage medium Download PDF

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Publication number
CN116519797A
CN116519797A CN202310187105.1A CN202310187105A CN116519797A CN 116519797 A CN116519797 A CN 116519797A CN 202310187105 A CN202310187105 A CN 202310187105A CN 116519797 A CN116519797 A CN 116519797A
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CN
China
Prior art keywords
interface
heat dissipation
defect
scanning
package
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Pending
Application number
CN202310187105.1A
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Chinese (zh)
Inventor
韩俊
宁福英
郭瑞亮
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Suzhou Tongfu Chaowei Semiconductor Co ltd
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Suzhou Tongfu Chaowei Semiconductor Co ltd
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Application filed by Suzhou Tongfu Chaowei Semiconductor Co ltd filed Critical Suzhou Tongfu Chaowei Semiconductor Co ltd
Priority to CN202310187105.1A priority Critical patent/CN116519797A/en
Publication of CN116519797A publication Critical patent/CN116519797A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/0681—Imaging by acoustic microscopy, e.g. scanning acoustic microscopy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique

Abstract

The application discloses a package evaluation method, analytical equipment and computer readable storage medium, this package includes chip, heat dissipation material and the heat dissipation lid of range upon range of setting, and there is first interface corresponding between heat dissipation material and the heat dissipation lid, and there is the second interface corresponding between heat dissipation material and the chip, and this method includes: respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body; wherein, the first interface, the second interface and the packaging body are correspondingly provided with respectively matched ultrasonic scanning modes; obtaining a defect position of the heat dissipation material with a defect in the package body based on the first scanning image, the second scanning image and the third scanning image; and evaluating the filling effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result. Through the mode, the accuracy of evaluating the filling effect of the heat dissipation material can be improved.

Description

Package evaluation method, analysis device, and computer-readable storage medium
Technical Field
The present disclosure relates to the field of semiconductor testing technology, and in particular, to a package evaluation method, an analysis device, and a computer readable storage medium.
Background
Along with the development of moore's law, the size of the flip chip and the packaging size are continuously increased, so that the power density of the packaging body is increased, the heating problem is also increased, and in order to meet the heat dissipation requirement of the packaging body with larger thickness, the contact area is increased by filling heat dissipation materials, so that the heat dissipation efficiency can be effectively improved. Therefore, the heat dissipation material is used as a core component for heat dissipation of the package, which is important for evaluating the filling effect of the heat dissipation material, and in the prior art, a single evaluation standard is generally selected for evaluation, and such an evaluation manner is not accurate enough for evaluating the filling effect of the heat dissipation material in the package with a larger thickness.
In view of this, how to improve the accuracy of evaluating the filling effect of the heat dissipation material is a problem to be solved.
Disclosure of Invention
The application provides a package evaluation method, an analysis device and a computer readable storage medium, which can improve the accuracy of evaluating the filling effect of a heat dissipation material.
An embodiment of the present application provides a method for evaluating a package, where the package includes a chip, a heat dissipation material, and a heat dissipation cover that are stacked, a first interface is corresponding between the heat dissipation material and the heat dissipation cover, and a second interface is corresponding between the heat dissipation material and the chip, and the method includes: respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body; wherein the first interface, the second interface and the package are respectively matched with an ultrasonic scanning mode; obtaining a defect position where the heat dissipation material has a defect in the package body based on the first scan pattern, the second scan pattern, and the third scan pattern; and evaluating the filling effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result.
A second aspect of the embodiments of the present application provides an analysis device, where the analysis device includes a processor, a memory, and a communication circuit, where the processor is respectively coupled to the memory and the communication circuit, where program data is stored in the memory, and the processor implements the steps in the method according to any one of the preceding claims by executing the program data in the memory.
A third aspect of the embodiments provides a computer readable storage medium storing a computer program executable by a processor to implement steps in a method as described in any one of the above.
According to the scheme, the junction of the heat dissipation material and the heat dissipation cover is defined as a first interface, the junction of the heat dissipation material and the chip is defined as a second interface, the first interface, the second interface and the packaging body are scanned by utilizing ultrasonic waves in an ultrasonic scanning mode matched with the first interface, the second interface and the packaging body respectively, a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body are obtained, the first scanning image, the second scanning image and the third scanning image are analyzed, the defect position of the heat dissipation material with defects in the packaging body is determined, the filling effect of the heat dissipation material is evaluated by utilizing the defect position, and the evaluation result of the filling effect of the heat dissipation material is obtained. Therefore, under the condition that the packaging body is not damaged, the method of the application respectively scans the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain corresponding first scanning images, second scanning images and third scanning images, and determines the defect positions and evaluates the filling effect of the heat dissipation material by analyzing the first scanning images, the second scanning images and the third scanning images, so that the accuracy of evaluating the filling effect of the heat dissipation material is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structure of an embodiment of a package of the present application;
FIG. 2 is a flow chart of an embodiment of a package evaluation method according to the present application;
fig. 3 is a schematic structural diagram of a first scan pattern of the present application;
fig. 4 is a schematic structural view of a second scan pattern of the present application;
fig. 5 is a schematic structural view of a third scan pattern of the present application;
FIG. 6 is a flow chart of another embodiment of a package evaluation method according to the present application;
fig. 7 is a schematic structural view of a fourth scan pattern of the present application;
FIG. 8 is a flow chart of another embodiment of a package evaluation method according to the present application;
FIG. 9 is a schematic diagram of a prior art mechanical cut package;
FIG. 10 is a schematic view of the water jet cutting package of the present application;
FIG. 11 is a schematic structural view of an embodiment of the analysis device of the present application;
fig. 12 is a schematic structural diagram of an embodiment of a computer-readable storage medium of the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms "system" and "network" are often used interchangeably herein. The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. Further, "a plurality" herein means two or more than two.
Referring to fig. 1, in an embodiment of the present application, a package evaluation method is used for evaluating a filling effect of a heat dissipation material in a package, where the package includes a chip, a heat dissipation material, and a heat dissipation cover that are stacked, a first interface is corresponding between the heat dissipation material and the heat dissipation cover, and a second interface is corresponding between the heat dissipation material and the chip. The heat dissipation material may be any single kind of metal, alloy or other non-metal material, and the execution body of the package evaluation method provided in the present application is a processor capable of executing program data.
Referring to fig. 2, in one embodiment, a method for evaluating a package includes:
s101: and respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body, wherein the first interface, the second interface and the packaging body are corresponding to respectively matched ultrasonic wave scanning modes.
Specifically, the junction of the heat dissipation material and the heat dissipation cover is defined as a first interface, the junction of the heat dissipation material and the chip is defined as a second interface, and the first scan pattern corresponding to the first interface, the second scan pattern corresponding to the second interface and the third scan pattern corresponding to the package body are obtained by scanning the first interface, the second interface and the package body through ultrasonic waves by utilizing ultrasonic scanning modes respectively matched with the first interface, the second interface and the package body.
In one embodiment, the respective matched ultrasonic scanning modes refer to acquiring ultrasonic images of the first interface and the second interface, i.e., a first scan image and a second scan image, by using an ultrasonic scanning microscope in a reflection mode, and acquiring ultrasonic images of the package, i.e., a third scan image, in a transmission mode.
It will be appreciated that the principle of ultrasonic scanning is: the ultrasonic wave can be reflected at any interface, air is hit, layering can be reflected, a gray value picture is formed through a series of data acquisition and calculation, the method can be used for analyzing the internal condition of the package body to detect defects such as layering, cracks or hollows in the package body, so that a scanning image of a plurality of positions is obtained, and the scanning image of each position is obtained based on the ultrasonic scanning mode matched with each other, so that the precision of the scanning image is improved.
In another embodiment, the first interface is scanned with ultrasound matching the depth of the first interface to obtain a first scan, the second interface is scanned with ultrasound matching the depth of the second interface to obtain a second scan, and the package is scanned with a perspective mode to obtain a third scan.
Specifically, the ultrasonic wave with matched depth refers to controlling the ultrasonic wave to be respectively transmitted to the first interface and the second interface by utilizing ultrasonic scanning, so that the precision of a first scanning image corresponding to the first interface and the precision of a second scanning image corresponding to the second interface are improved, and the ultrasonic scanning mode can be selected to be the C mode. In other embodiments, other scan modes of ultrasound may be selected.
Further, a third scan of the heat sink material in a region intermediate the first interface and the second interface is obtained when using the ultrasonography mode, thereby improving the accuracy of the third scan corresponding to the intermediate region.
S102: and obtaining a defect position of the heat dissipation material with a defect in the package body based on the first scanning image, the second scanning image and the third scanning image.
Specifically, the first scan, the second scan, and the third scan are analyzed to determine a defect location where a heat sink material has a defect in the package.
In one embodiment, the first scan, the second scan, and the third scan are analyzed sequentially, a defect location on the first interface is determined on the first scan, a defect location on the second interface is determined on the second scan, and a defect location between the first interface and the second interface is determined on the third scan.
In another embodiment, the defect location on the first interface is determined based on the first scan, the defect location on the second interface is determined based on the second scan, and the first scan, the second scan, and the third scan are compared to reject defects on the first interface and on the second interface, thereby determining the defect location between the first interface and the second interface.
Specifically, referring to fig. 3 and 4, fig. 3 and 4 are a first scan and a second scan obtained in an ultrasonic reflection mode, respectively, and since the ultrasonic reflectivity of a region with defects such as a cavity and a crack is high, the image of the region with the cavity and the crack is lighter in color and higher in brightness, i.e. white is a defect position.
Further, referring to fig. 5, fig. 5 is a third scan obtained in the ultrasonic transmission mode, and because the area with the defects such as holes and cracks transmits less ultrasonic waves, the image of the area with the holes and cracks is darker and has lower brightness, i.e. black is the defect position.
In an implementation scenario, obtaining a defect location where the heat dissipating material has a defect in the package based on the first scan, the second scan, and the third scan includes: determining a first defect position of the heat dissipation material at the first interface on the first scan, and determining a first coverage rate of the heat dissipation material at the first interface based on the first defect position; determining a second defect position of the heat dissipating material at the second interface on the second scan, determining a second coverage of the heat dissipating material at the second interface based on the second defect position; and comparing the first scanning image, the second scanning image and the third scanning image, determining a third defect position of the heat dissipation material between the first interface and the second interface, and determining a third coverage rate of the heat dissipation material between the first interface and the second interface based on the third defect position.
Specifically, referring to fig. 3-5, the first defect location refers to a white location on the first scan, the first coverage rate refers to a percentage of an area of the heat sink material covered on the first interface minus an area of the first defect location, the second defect location refers to a white location on the second scan, and the second coverage rate refers to a percentage of an area of the heat sink material covered on the second interface minus an area of the second defect location.
Further, the third scanning pattern obtained by scanning the package body in the transmission mode includes the first defect position and the second defect position, so that the third defect position is obtained by comparing the first scanning pattern, the second scanning pattern and the third scanning pattern, the first defect position and the second defect position are removed from the third scanning pattern, the third coverage rate refers to the area of the heat dissipation material between the first interface and the second interface minus the percentage of the area of the third defect position, and therefore the first defect position and the first coverage rate corresponding to the first interface, the second defect position and the second coverage rate corresponding to the second interface, and the third defect position and the third coverage rate corresponding to the first interface and the second interface are respectively obtained, and the accuracy of the defect position and the coverage rate is improved.
S103: and evaluating the effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result.
Specifically, the filling effect of the heat dissipation material is evaluated by utilizing the defect positions, and an evaluation result of the filling effect of the heat dissipation material is obtained.
Further, the heat sink material coverage is a percentage of the heat sink material coverage area minus the defect location area, requiring the heat sink material coverage to be greater than a pass threshold, where the pass threshold can be custom set. The heat sink material filling effect can be evaluated by the defect position.
Optionally, in other embodiments, the evaluation criteria of the filling effect of the heat dissipating material further include a defect type and a thickness of the heat dissipating material.
In an embodiment, a first coverage rate of the heat dissipating material at the first interface, a second coverage rate at the second interface, and a third coverage rate between the first interface and the second interface are determined based on the defect location, and the effect of the heat dissipating material is evaluated based on a magnitude relation of the first coverage rate, the second coverage rate, and the third coverage rate with respect to the pass threshold, to obtain an evaluation result. And when the first coverage rate, the second coverage rate and the third coverage rate are all larger than the qualification threshold, the evaluation result is qualified, otherwise, the evaluation result is unqualified.
In another embodiment, a first coverage rate of the heat dissipation material at the first interface, a second coverage rate at the second interface and a third coverage rate between the first interface and the second interface are determined based on the defect positions, the first coverage rate, the second coverage rate and the third coverage rate are respectively converted into a first score, a second score and a third score, wherein the scores are positively correlated with the numerical value of the coverage rate, the first score, the second score and the third score are weighted and summed to obtain a total score, if the total score is larger than a score threshold value, the evaluation result is qualified, and otherwise the evaluation result is unqualified.
In an implementation scenario, the method for evaluating the filling effect of the heat dissipation material by using the defect position to obtain an evaluation result includes: and based on the first coverage rate, the second coverage rate and the third coverage rate, evaluating the filling effect of the heat dissipation material to obtain an evaluation result.
Specifically, the gas generated during filling of the heat dissipation material can cause defects such as holes due to the fact that no channel escapes, and the filling effect of the heat dissipation material can be evaluated through the first coverage rate, the second coverage rate and the third coverage rate.
Further, the heat dissipation material filling effect is qualified, that is, the first coverage rate, the second coverage rate and the third coverage rate all reach the corresponding qualified threshold values, or any at least two items are larger than the corresponding total threshold value, or the fixed two items are larger than the specified threshold value, so that the heat dissipation material filling effect is suitable for different scenes, and the suitability of the evaluation method is improved.
According to the scheme, the junction of the heat dissipation material and the heat dissipation cover is defined as a first interface, the junction of the heat dissipation material and the chip is defined as a second interface, the first interface, the second interface and the packaging body are scanned by utilizing ultrasonic waves in an ultrasonic scanning mode matched with the first interface, the second interface and the packaging body respectively, a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body are obtained, the first scanning image, the second scanning image and the third scanning image are analyzed, the defect position of the heat dissipation material with defects in the packaging body is determined, the filling effect of the heat dissipation material is evaluated by utilizing the defect position, and the evaluation result of the filling effect of the heat dissipation material is obtained. Therefore, under the condition that the packaging body is not damaged, the method of the application respectively scans the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain corresponding first scanning images, second scanning images and third scanning images, and determines the defect positions and evaluates the filling effect of the heat dissipation material by analyzing the first scanning images, the second scanning images and the third scanning images, so that the accuracy of evaluating the filling effect of the heat dissipation material is improved.
Referring to fig. 6, in another embodiment, a method for evaluating a package includes:
s501: and respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body, wherein the first interface, the second interface and the packaging body are corresponding to respectively matched ultrasonic wave scanning modes.
Specifically, the step S501 is the same as the step S101 in the previous embodiment, and the present application will not be repeated herein.
S502: and obtaining a defect position of the heat dissipation material with a defect in the package body based on the first scanning image, the second scanning image and the third scanning image.
Specifically, the first scan, the second scan, and the third scan are analyzed to determine a defect location where a heat sink material has a defect in the package.
In an embodiment, a first defect location of the heat sink material at the first interface is determined on the first scan, and a first coverage of the heat sink material at the first interface is determined based on the first defect location; determining a second defect position of the heat dissipating material at the second interface on the second scan, determining a second coverage of the heat dissipating material at the second interface based on the second defect position; and comparing the first scanning image, the second scanning image and the third scanning image, determining a third defect position of the heat dissipation material between the first interface and the second interface, and determining a third coverage rate of the heat dissipation material between the first interface and the second interface based on the third defect position.
Specifically, please combine fig. 3-5, through analyzing the black-and-white area change on the first scan, determine the first defect position of the heat dissipating material at the first interface, determine the first coverage rate of the heat dissipating material at the first interface based on the area of the first defect position, improve the accuracy of the first coverage rate, through analyzing the black-and-white area change on the second scan, determine the second defect position of the heat dissipating material at the second interface, determine the second coverage rate of the heat dissipating material at the second interface based on the area of the second defect position, improve the accuracy of the second coverage rate, reject the defects on the first interface and the second interface by comparing the first scan, the second scan and the third scan, determine the third coverage rate of the heat dissipating material between the first interface and the second interface based on the area of the third defect position, thereby improving the accuracy of the third coverage rate, facilitate the subsequent filling effect of the heat dissipating material with the coverage rate evaluation, and improve the accuracy of the evaluation result.
S503: and scanning the packaging body by utilizing X-rays to obtain a fourth scanning image, and determining the defect type of the defect position on the fourth scanning image, wherein the defect type at least comprises a cavity.
Specifically, referring to fig. 7, the package is scanned in the 3D mode by using X-rays, a two-dimensional image of the heat dissipation material, that is, a fourth scan, is obtained, and the defect type and size of the defect position are determined, so that the accuracy of the fourth scan is improved.
It should be noted that, after comparing the fourth scan obtained by the X-ray with the first scan, the second scan, and the third scan, a specific defect type of the defect scanned by the ultrasonic wave can be determined, so that the filling effect of the heat dissipation material can be more comprehensively evaluated based on the area of the defect and the type of the defect.
In an implementation scenario, the heat dissipation material is metal, the heat dissipation material is arranged between the chip and the heat dissipation cover through welding, the fourth scanning image is obtained after the package body is scanned by utilizing X-rays, the fourth scanning image is compared with the first scanning image, the second scanning image and the third scanning image, the defect type of point defects in a scanning result obtained by ultrasonic waves is determined to be a cavity or a dent, and the defect type of linear defects in the scanning result obtained by the ultrasonic waves is determined to be pollutants or cracks.
S504: and evaluating the filling effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result.
Specifically, based on the first coverage rate, the second coverage rate, the third coverage rate, the corresponding qualification rate of the third coverage rate and the number of defect positions with the defect type being a cavity, the filling effect of the heat dissipation material is evaluated, and an evaluation result is obtained.
It can be understood that the heat dissipation material evaluation effect is qualified, that is, the first coverage rate, the second coverage rate and the third coverage rate all reach the corresponding qualification rate and the number of voids is smaller than the qualification threshold, that is, that any at least two of the first coverage rate, the second coverage rate and the third coverage rate are larger than the corresponding qualification rate and the number of voids is smaller than the qualification threshold, or that two of the first coverage rate, the second coverage rate and the third coverage rate are fixed and the number of voids is larger than the qualification rate and smaller than the qualification threshold, so that the heat dissipation material evaluation method is suitable for different scenes and improves the suitability of the evaluation method. The heat dissipation material qualification rate is generally required to be greater than 90%, and the qualification threshold of the cavity may be, for example, 5, 6, etc., which is not limited in this application.
Referring to fig. 8, in yet another embodiment, a method for evaluating a package includes:
s701: and respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body, wherein the first interface, the second interface and the packaging body are corresponding to respectively matched ultrasonic wave scanning modes.
S702: and obtaining a defect position of the heat dissipation material with a defect in the package body based on the first scanning image, the second scanning image and the third scanning image.
S703: and scanning the packaging body by utilizing X-rays to obtain a fourth scanning image, and determining the defect type of the defect position on the fourth scanning image, wherein the defect type at least comprises a cavity.
Specifically, the steps S701 to S703 are the same as the steps S501 to S503 in the previous embodiment, and the present application will not be repeated herein.
S704: and cutting the defect position to obtain a cutting surface of the heat dissipation material, wherein the cutting mode is water jet cutting.
S705: based on the cut surface, a defect level of the defect location is determined.
Specifically, referring to fig. 9 and 10, fig. 9 is a schematic structural diagram of a mechanical cutting package in the prior art, and it can be seen that the cutting surfaces formed by mechanical cutting are uneven, and fig. 10 is a schematic structural diagram of a water jet cutting package, and it can be seen that the cutting surfaces formed by water jet cutting are flat. The water jet cutting is also called water jet cutting, which uses a booster to pressurize water, the water is sprayed from a tiny nozzle after obtaining pressure energy, and the pressure energy is converted into kinetic energy, so that high-speed jet is formed to accurately impact and destroy the packaging body, and the purposes of cutting off and forming are achieved.
The water jet cutting has no thermal deformation, the quality of the cutting surface is good, compared with the mechanical cutting and other modes, the original shape of the material can be greatly reserved, the introduction of analysis noise points is reduced, and the analysis efficiency is improved. The water jet cutting equipment has the advantages that the abrasion problem of the cutter does not exist, the equipment is simple, the processing cost is low, vibration and noise caused in the processing process are small, the chip quantity is lower than that of the mechanical cutting and other modes, chips flow away along with water, and the safety of operators is not damaged. And polishing the cutting surface after cutting the defect position, and analyzing the cutting surface by using a scanning microscope to determine the defect degree of the defect position.
The defect type, the defect size and the like are obtained by the same analysis after the destructive analysis is carried out on the packaging body, and compared with the evaluation result of the packaging body which is not damaged, so that the accuracy of the analysis on the filling effect of the heat dissipation material is higher.
S706: and evaluating the filling effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result.
Specifically, after the first coverage rate, the second coverage rate, the third coverage rate and the defect types are the number of holes and the defect degree of the cutting surface, the first coverage rate, the second coverage rate, the third coverage rate, the number of holes and the defect degree of the cutting surface corresponding to the defect positions are utilized to more comprehensively evaluate the filling effect of the heat dissipation material, so that an evaluation result with higher precision is obtained.
In an embodiment, a first score corresponding to the first coverage rate, a second score corresponding to the second coverage rate, and a third score corresponding to the third coverage rate are obtained; obtaining a fourth score based on the number of defect positions for which the defect type is a hole; obtaining a fifth score based on the defect level of the defect location; and carrying out weighted summation on the first score, the second score, the third score, the fourth score and the fifth score to obtain a total score, and evaluating the filling effect of the heat dissipation material by using the total score to obtain an evaluation result.
Specifically, the scoring method may be set to 100 points in full scale, and the first coverage rate, the second coverage rate, etc. are respectively scored and then weighted and summed to obtain a total score; the method can also be interval sectional scoring, different intervals correspond to different scores, for example, the first coverage rate is less than 90% and is 0 score, the first coverage rate is 50 score in the interval of 90% -92%, the first coverage rate is 70 score in the interval of 92% -95%, more than 95% is 100 score, and the total score is obtained by weighting and summing the obtained corresponding interval scores of the first coverage rate, the second coverage rate and the like.
Further, the total score is compared with a score threshold, so that whether the filling effect of the heat dissipation material is qualified or unqualified is determined, wherein the score threshold can be any value of 60-100 points, and the application is not particularly limited.
The coverage rate, defect type, defect number and defect position of the heat dissipation material are comprehensively evaluated by the scoring method, so that the method is effective and rapid.
Referring to fig. 11, the analysis device 200 includes a processor 210, a memory 220 and a communication circuit 230, wherein the processor 210 is coupled to the memory 220 and the communication circuit 230, respectively, the memory 220 stores program data, and the processor 210 executes the program data in the memory 220 to implement steps in any of the above methods, wherein detailed steps are omitted herein.
Referring to fig. 12, a computer readable storage medium 301 stores a computer program 302, the computer program 302 being executable by a processor to implement steps in a method as described in any of the above.
The computer readable storage medium 301 may be a device such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, which may store the computer program 302, or may be a server storing the computer program 302, which may send the stored computer program 302 to another device for running, or may also run the stored computer program 302 by itself.
The units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in part or all or part of the technical solution contributing to the prior art or in the form of a software product stored in a storage medium, including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) to perform all or part of the steps of the methods of the embodiments of the present application.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (10)

1. A package evaluation method, wherein the package includes a chip, a heat dissipation material, and a heat dissipation cover stacked together, the heat dissipation material and the heat dissipation cover having a first interface therebetween, and the heat dissipation material and the chip having a second interface therebetween, the method comprising:
respectively scanning the first interface, the second interface and the packaging body by utilizing ultrasonic waves to obtain a first scanning image corresponding to the first interface, a second scanning image corresponding to the second interface and a third scanning image corresponding to the packaging body; wherein the first interface, the second interface and the package are respectively matched with an ultrasonic scanning mode;
obtaining a defect position where the heat dissipation material has a defect in the package body based on the first scan pattern, the second scan pattern, and the third scan pattern;
and evaluating the filling effect of the heat dissipation material by utilizing the defect positions to obtain an evaluation result.
2. The package evaluation method according to claim 1, wherein the scanning the first interface, the second interface, and the package with ultrasonic waves to obtain a first scan corresponding to the first interface, a second scan corresponding to the second interface, and a third scan corresponding to the package, respectively, includes:
and scanning the first interface by utilizing ultrasonic waves matched with the depth of the first interface to obtain a first scanning image, scanning the second interface by utilizing ultrasonic waves matched with the depth of the second interface to obtain a second scanning image, and scanning the packaging body by utilizing a perspective ultrasonic mode to obtain a third scanning image.
3. The package evaluation method according to claim 1, wherein the obtaining a defect position where the heat dissipation material has a defect in the package based on the first scan, the second scan, and the third scan includes:
determining a first defect location of the heat sink material at the first interface on the first scan, determining a first coverage of the heat sink material at the first interface based on the first defect location;
determining a second defect location of the heat sink material at the second interface on the second scan, determining a second coverage of the heat sink material at the second interface based on the second defect location;
comparing the first scan pattern, the second scan pattern and the third scan pattern, determining a third defect position of the heat dissipating material between the first interface and the second interface, and determining a third coverage rate of the heat dissipating material between the first interface and the second interface based on the third defect position.
4. The package evaluation method according to claim 3, wherein evaluating the filling effect of the heat dissipation material using the defect position to obtain the evaluation result includes:
and based on the first coverage rate, the second coverage rate and the third coverage rate, evaluating the filling effect of the heat dissipation material to obtain an evaluation result.
5. The package evaluation method according to claim 3, wherein the evaluating the filling effect of the heat dissipation material using the defect position, before obtaining the evaluation result, comprises:
scanning the packaging body by utilizing X rays to obtain a fourth scanning image, and determining the defect type of the defect position on the fourth scanning image;
wherein the defect type includes at least a void.
6. The package evaluation method according to claim 5, wherein the evaluating the filling effect of the heat dissipation material using the defect position to obtain the evaluation result includes:
and evaluating the filling effect of the heat dissipation material based on the first coverage rate, the second coverage rate, the third coverage rate and the corresponding qualification rate thereof, and the number of defect positions with defect types being the holes, so as to obtain an evaluation result.
7. The package evaluation method according to claim 5, wherein the scanning the package with X-rays to obtain a fourth scan, after determining the defect type of the defect position on the fourth scan, includes:
cutting the defect position to obtain a cutting surface of the heat dissipation material; wherein the cutting mode is water jet cutting;
and determining the defect degree of the defect position based on the cutting surface.
8. The package evaluation method according to claim 7, wherein the evaluating the filling effect of the heat dissipation material using the defect position to obtain an evaluation result includes:
acquiring a first score corresponding to the first coverage rate, a second score corresponding to the second coverage rate and a third score corresponding to the third coverage rate;
obtaining a fourth score based on the number of defect positions for which the defect type is the void;
obtaining a fifth score based on the defect level of the defect location;
and carrying out weighted summation on the first score, the second score, the third score, the fourth score and the fifth score to obtain a total score, and evaluating the filling effect of the heat dissipation material by using the total score to obtain an evaluation result.
9. An analysis device, characterized in that it comprises a processor, a memory and a communication circuit, the processor being coupled to the memory and the communication circuit, respectively, the memory having stored therein program data, the processor implementing the steps in the method according to any of claims 1-8 by executing the program data in the memory.
10. A computer readable storage medium, characterized in that it stores a computer program executable by a processor to implement the steps in the method according to any one of claims 1-8.
CN202310187105.1A 2023-03-01 2023-03-01 Package evaluation method, analysis device, and computer-readable storage medium Pending CN116519797A (en)

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CN202310187105.1A CN116519797A (en) 2023-03-01 2023-03-01 Package evaluation method, analysis device, and computer-readable storage medium

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CN202310187105.1A CN116519797A (en) 2023-03-01 2023-03-01 Package evaluation method, analysis device, and computer-readable storage medium

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CN116519797A true CN116519797A (en) 2023-08-01

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