CN116519039A - Monitoring management system for automatic glue line detection equipment - Google Patents
Monitoring management system for automatic glue line detection equipment Download PDFInfo
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- 239000003292 glue Substances 0.000 title claims abstract description 151
- 238000001514 detection method Methods 0.000 title claims abstract description 102
- 238000012544 monitoring process Methods 0.000 title claims abstract description 20
- 230000002159 abnormal effect Effects 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 47
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- 238000007689 inspection Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
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Abstract
The invention relates to the technical field of glue line detection, and particularly discloses a monitoring management system for glue line automatic detection equipment, which comprises the following components: the detection equipment parameter acquisition end is used for acquiring input parameters, operation parameters and detection result parameters of the equipment; the detection result checking module is used for checking the detection result parameters according to the input parameters and the operation parameters of the equipment, and executing a state judgment strategy when the check result is abnormal; the method comprises the steps of presetting a judgment glue path, wherein the judgment glue path is used as a working area of detection equipment when a state judgment strategy is executed; the judging and analyzing module is used for analyzing the process parameters of executing the state judging strategy and judging the state of the detection equipment according to the analysis result; the invention can adaptively select the corresponding time point to execute the state judgment strategy based on the actual running state of the equipment, thereby ensuring timeliness and avoiding the problem that the production process is influenced by higher frequency.
Description
Technical Field
The invention relates to the technical field of glue line detection, in particular to a monitoring management system for glue line automatic detection equipment.
Background
In the assembly process of electronic equipment and industrial equipment, dispensing is an important process in the product assembly process, and along with the development trend of miniaturization and densification of products, the dispensing machine has higher requirements on the position accuracy and the control accuracy of dispensing; in order to judge the state of the glue line, the glue dispensing process is detected through glue line automation equipment, and whether the problems of less glue, glue overflow and the like exist or not is judged, so that timely adjustment is carried out, and the quality of glue dispensing is ensured.
In the automatic glue line detection equipment in the prior art, sensor data and visual data are mainly utilized for analysis and judgment, and the judgment accuracy has certain errors along with the deviation of the judgment data, so that the judgment accuracy has errors; in the prior art, the monitoring process of the automatic glue line equipment mainly judges the working state of glue line detection by a method of timing automatic correction or manual correction.
However, in the existing method for automatically correcting the timing, the production progress is affected if the set time interval is too short, and the erroneous judgment risk exists if the set time interval is too long; for the manual correction mode, the comprehensiveness and accuracy of correction are based on the experience of personnel, so that unreliability exists.
Disclosure of Invention
The invention aims to provide a monitoring management system for automatic glue line detection equipment, which solves the following technical problems:
how to automatically adapt the correction interval duration and improve the comprehensiveness and accuracy of the operation monitoring of the automatic detection equipment.
The aim of the invention can be achieved by the following technical scheme:
a monitoring management system for a glue line automated inspection apparatus, the system comprising:
the detection equipment parameter acquisition end is used for acquiring input parameters, operation parameters and detection result parameters of the equipment;
the detection result checking module is used for checking the detection result parameters according to the input parameters and the operation parameters of the equipment, and executing a state judgment strategy when the check result is abnormal;
the method comprises the steps of presetting a judgment glue path, wherein the judgment glue path is used as a working area of detection equipment when a state judgment strategy is executed;
and the judging and analyzing module is used for analyzing the process parameters of executing the state judging strategy and judging the state of the detection equipment according to the analysis result.
In an embodiment, the input parameter includes a dispensing speed;
the operation parameters comprise the total glue amount used for 3D glue paths and glue dispensing obtained by scanning the product;
the detection result parameters comprise glue line identification data;
the working process of the detection result checking module comprises the following steps:
and predicting the total glue amount according to the glue dispensing speed, the 3D glue path and the glue line identification data, comparing and analyzing the predicted total glue amount with the actually used total glue amount, and judging whether the checking result is abnormal according to the comparison and analysis result.
In one embodiment, the process of comparison analysis includes:
dividing the 3D glue path once according to different width values of the 3D glue path;
dividing the 3D glue path for the second time according to the glue line identification data;
segmenting the 3D glue path according to the primary segmentation and secondary segmentation results;
by the formulaCalculating to obtain predicted total gel amount->；
Wherein n is the number of segments, i=1, 2, … …, n;a width value for the ith segment; />A detection height value for the i-th segment; />The dispensing speed is the dispensing speed; />The dispensing time of the ith section of the dispensing head is set; />、/>Is a reference coefficient, and->The method comprises the steps of carrying out a first treatment on the surface of the m is the number of turning points of the 3D glue path; />Fixing compensation quantity for the turning point;
the total glue amount will be predictedAnd the total glue quantity Q and error value +.>Comparing;
if it isAnd judging whether the checking result is abnormal or not.
In an embodiment, the preset judging glue path includes a stage, a radian section and a horizontal section, and each section is preset with a fixed glue amount;
the state judgment strategy comprises the following steps:
detecting a preset judging glue path through detection equipment to obtain first detection data;
and carrying out overlapping analysis on the first detection data and standard detection data corresponding to the preset judging glue path, and judging the state of the detection equipment according to an overlapping analysis result.
In one embodiment, the process of overlap analysis includes:
by the formulaCalculating to obtain overlapping coefficient->；
Wherein j=1, 2, 3;the detection height value of the j-th section from the position point of the length x of the starting point of the corresponding section is obtained; />The actual height value of the j-th section from the length position point x of the corresponding section starting point is obtained; />The total length of the j-th section; />The correction coefficient of the j-th section;
coefficient of coincidenceAnd a preset threshold->And (3) performing comparison:
if it isAnd judging that the state of the detection equipment is abnormal.
In an embodiment, the preset judging glue path is preset with z types of abnormal glue dispensing points, and the abnormal glue dispensing points of similar types are combined;
the process of overlap analysis further comprises:
by the formulaCalculating to obtain the differenceConstant point identification coefficient->；
Wherein k is [1, z ]]；For the characteristic coefficient of the kth abnormal point of dispensing, when the kth abnormal point of dispensing is identified, the number of the abnormal points of dispensing is increased>The method comprises the steps of carrying out a first treatment on the surface of the When the kth point is not identified, the adhesive dispensing abnormal point is left in the first part>The method comprises the steps of carrying out a first treatment on the surface of the When the kth abnormal point of dispensing is identified as wrong, if the identification result is of a similar type combined with the actual abnormal point of dispensing, then +.>；/>The method comprises the steps of carrying out a first treatment on the surface of the Otherwise, go (L)>；
When (when)And judging that the state of the detection equipment is abnormal.
In one embodiment, the types of abnormal dispensing points include, but are not limited to, a missing, a spilled, a flying glue, and a path deviation point.
In an embodiment, the system further includes a detecting device fault tracing module, where the detecting device fault tracing module is configured to trace a cause of the abnormality when it is determined that the detecting device has the abnormality;
the process of tracing the cause of the abnormality comprises the following steps:
each segment of the preset judging glue path is calculated according to the unit interval distance length to obtainIs a numerical value of (2);
pressing the buttonThe values of the segments are ordered from large to small, the ordering serial number is the x axis, the corresponding ordering value is the y axis, and a characteristic distribution diagram of the j segment is established;
and carrying out similarity comparison on the characteristic distribution diagram and a distribution diagram corresponding to the preset abnormal reason, and matching the corresponding preset abnormal reason according to the similarity comparison result.
The invention has the beneficial effects that:
(1) The method triggers the execution of the state judgment strategy based on the checking result, and the corresponding time point can be adaptively selected to execute the state judgment strategy based on the actual equipment running state, so that the problem that the production process is influenced by higher frequency is avoided while timeliness is ensured; in addition, a preset judgment gel path is also arranged in the system, so that unified and comprehensive reference can be provided when a state judgment strategy is executed, and further, the accuracy and the comprehensiveness of a judgment result can be ensured when the judgment analysis module is used for analyzing.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a logical block diagram of a monitoring management system in accordance with the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, in one embodiment, a monitoring management system for a glue line automatic detection device is provided, the system comprising:
the detection equipment parameter acquisition end is used for acquiring input parameters, operation parameters and detection result parameters of the equipment;
the detection result checking module is used for checking the detection result parameters according to the input parameters and the operation parameters of the equipment, and executing a state judgment strategy when the check result is abnormal;
the method comprises the steps of presetting a judgment glue path, wherein the judgment glue path is used as a working area of detection equipment when a state judgment strategy is executed;
and the judging and analyzing module is used for analyzing the process parameters of executing the state judging strategy and judging the state of the detection equipment according to the analysis result.
Through the technical scheme, the embodiment provides a monitoring management system for carrying out real-time monitoring management on automatic glue line detection equipment, firstly, in the execution of a state judgment strategy, compared with a mode of executing correction at fixed time intervals in the prior art, the embodiment triggers the execution of the state judgment strategy based on a checking result, the checking result is based on an input parameter, an operation parameter and a detection result parameter of the detection equipment parameter acquisition end, the detection result checking module checks the parameters to judge whether the state judgment strategy is executed, and obviously, the mode can adaptively select a corresponding time point to execute the state judgment strategy based on the actual equipment operation state, so that the problem that the production process is influenced by higher frequency can be avoided while timeliness is ensured; in addition, the system in this embodiment further sets a preset judgment glue path, which can provide a unified and comprehensive reference when executing the state judgment policy, so as to ensure the accuracy and comprehensiveness of the judgment result when analyzing by the judgment analysis module.
As one embodiment of the present invention, the input parameter includes a dispensing speed;
the operation parameters comprise the total glue amount used for 3D glue paths and glue dispensing obtained by scanning the product;
the detection result parameters comprise glue line identification data;
the working process of the detection result checking module comprises the following steps:
and predicting the total glue amount according to the glue dispensing speed, the 3D glue path and the glue line identification data, comparing and analyzing the predicted total glue amount with the actually used total glue amount, and judging whether the checking result is abnormal according to the comparison and analysis result.
Through the technical scheme, the embodiment provides a specific acquisition process of the checking result, the 3D glue path of the product and the total glue amount used by the glue dispensing completion are acquired by taking the glue dispensing speed as input parameters, then the total glue amount used is predicted according to the glue dispensing speed, the 3D glue path and the glue line identification data, and the comparison analysis is carried out according to the predicted total glue amount and the actually used total glue amount, so that when the predicted total glue amount and the actually used total glue amount have larger differences, the difference between the judging result and the actual situation is indicated, and therefore, the detection result of the automatic detection equipment has certain error, and the accurate monitoring process of the glue line automatic detection equipment is realized.
As one embodiment of the present invention, the process of comparison analysis includes:
dividing the 3D glue path once according to different width values of the 3D glue path;
dividing the 3D glue path for the second time according to the glue line identification data;
segmenting the 3D glue path according to the primary segmentation and secondary segmentation results;
by the formulaCalculating to obtain predicted total gel amount->；
Wherein n is the number of segments, i=1, 2, … …, n;a width value for the ith segment; />A detection height value for the i-th segment; />The dispensing speed is the dispensing speed; />The dispensing time of the ith section of the dispensing head is set; />、/>Is a reference coefficient, and->The method comprises the steps of carrying out a first treatment on the surface of the m is the number of turning points of the 3D glue path; />Fixing compensation quantity for the turning point;
the total glue amount will be predictedAnd the total glue quantity Q and error value +.>Comparing;
if it isAnd judging whether the checking result is abnormal or not.
Through the technical scheme, the specific process of comparison analysis is provided in the embodiment, firstly, the 3D glue paths of the product are irregular, so that the 3D glue paths are required to be divided, firstly, the 3D glue paths are divided once according to the width values, and secondly, the 3D glue paths are divided twice according to the glue line identification data, and the glue line identification data refer to the detection height values of the glue; therefore, the glue consumption of each section is calculated and accumulated after the sections are segmented, and then the formula is adoptedObtaining a predicted total gum mass, wherein ∈>Mainly to eliminate errors caused by transition positions, based on the detection result +.>Dot gel status data->The accuracy of the detection result can be judged, and meanwhile, the specific running state of the dispensing equipment can be judged, so that the judgment of multiple problems is realized by predicting and comparing the total glue amount with the total glue amount Q actually used; if only->And the fact that the actual glue consumption is greatly different from the detected and predicted glue consumption is explained, so that whether the checking result is abnormal or not is judged.
Reference coefficient、/>Selecting and setting according to experience data, wherein the weights of different judging results are reflected by the experience data>And->Error value->The specific proportionality coefficient is set according to empirical data in proportion to the total amount of glue Q actually used, and will not be described in detail here.
As an implementation mode of the invention, the preset judging glue path comprises a stage, a radian section and a horizontal section, and each section is preset with a fixed glue amount;
the state judgment strategy comprises the following steps:
detecting a preset judging glue path through detection equipment to obtain first detection data;
and carrying out overlapping analysis on the first detection data and standard detection data corresponding to the preset judging glue path, and judging the state of the detection equipment according to an overlapping analysis result.
Through the technical scheme, the preset judging glue path in the embodiment comprises, but is not limited to, a stage, a radian section and a horizontal section, and each section is preset with a fixed glue amount; in a state judgment strategy, detecting a preset judgment rubber path through detection equipment to obtain first detection data; and carrying out overlapping analysis on the first detection data and standard detection data corresponding to the preset judging glue path, wherein when the data difference value of the first detection data and the standard detection data is smaller, the detection result is accurate, so that the state of the detection equipment can be judged according to the overlapping analysis result.
As one embodiment of the present invention, the overlapping analysis includes:
by the formulaCalculating to obtain overlapping coefficient->；
Wherein j=1, 2, 3;the detection height value of the j-th section from the position point of the length x of the starting point of the corresponding section is obtained; />The actual height value of the j-th section from the length position point x of the corresponding section starting point is obtained; />The total length of the j-th section; />The correction coefficient of the j-th section;
coefficient of coincidenceAnd a preset threshold->And (3) performing comparison:
if it isAnd judging that the state of the detection equipment is abnormal.
Through the above technical solution, the embodiment provides a specific process of overlap analysis, determines through overlap coefficient, and in order to accurately evaluate the accuracy of determining the position of each glue line, in this embodiment, by means of segmentation, according to the length x from the start point of each segment as a variable, uses the formulaCalculating to obtain overlapping coefficient->Comprehensive judgment is carried out according to the overall difference value condition of each segment, wherein, correction coefficient is +.>According to the type of each segment, the selection setting is carried out according to the empirical data in advance, for example, the judgment precision of the horizontal segment is higher, so the corresponding +.>Greater than the corresponding +.>The method comprises the steps of carrying out a first treatment on the surface of the Thus by means of the overlap factor->And a preset threshold->Comparing, and presetting a threshold valueObtained by fitting according to empirical data, thus at +.>When the state of the detection device is abnormal, the detection device is indicated.
As an implementation mode of the invention, the preset judging glue path is preset with z types of abnormal point glue dispensing, and the abnormal point glue dispensing points of similar types are combined; the abnormal dispensing point types include, but are not limited to, a glue shortage point, a glue overflow point, a glue flying point and a glue path deviation point.
The process of overlap analysis further comprises:
by the formulaCalculating to obtain abnormal point identification coefficient->；
Wherein k is [1, z ]]；For the characteristic coefficient of the kth abnormal point of dispensing, when the kth abnormal point of dispensing is identified, the number of the abnormal points of dispensing is increased>The method comprises the steps of carrying out a first treatment on the surface of the When the kth point is not identified, the adhesive dispensing abnormal point is left in the first part>The method comprises the steps of carrying out a first treatment on the surface of the When the kth abnormal point of dispensing is identified as wrong, if the identification result is of a similar type combined with the actual abnormal point of dispensing, then +.>；/>The method comprises the steps of carrying out a first treatment on the surface of the Otherwise, go (L)>；
When (when)And judging that the state of the detection equipment is abnormal.
Through the above technical solution, in this embodiment, z types of abnormal dispensing points are preset on the preset determination glue pathThe type is used for judging the running state of the detection equipment through the accuracy of the identification result, namely, the abnormal point identification coefficient is obtained through calculationAnd judging by numerical value when +.>When the detection error condition of the detection device exceeds the normal value, the detection device state is judged to be abnormal.
The system also comprises a detection equipment fault tracing module, wherein the detection equipment fault tracing module is used for tracing the cause of the abnormality when judging that the detection equipment is abnormal;
the process of tracing the cause of the abnormality comprises the following steps:
each segment of the preset judging glue path is calculated according to the unit interval distance length to obtainIs a numerical value of (2);
pressing the buttonThe values of the segments are ordered from large to small, the ordering serial number is the x axis, the corresponding ordering value is the y axis, and a characteristic distribution diagram of the j segment is established;
and carrying out similarity comparison on the characteristic distribution diagram and a distribution diagram corresponding to the preset abnormal reason, and matching the corresponding preset abnormal reason according to the similarity comparison result.
Through the above technical solution, the system of this embodiment further sets a detecting device fault tracing module to trace the source of the abnormal cause, so as to correspondingly adjust the detecting device, specifically, when the obtained overlapping coefficient is too large, there is a larger difference value of the partial point location detection result, or there is an error in the whole, so this embodiment is based onDistribution of values by the method according to +.>The values of the segments are ordered from large to small, the order sequence number is the x axis, the corresponding order value is the y axis, and then a characteristic distribution diagram of the j-th segment is established, obviously, the characteristic distribution diagram reflects the characteristic of the data distribution, when the error exists in the whole, the characteristic distribution diagram is in a slowly descending state, and when the larger error exists in part of the point positions or part of the segments, the characteristic distribution diagram is in a rapidly descending state, so that the corresponding distribution diagram is preset according to the preset abnormal reason, the similarity comparison is carried out through the characteristic distribution diagram and the distribution diagram corresponding to the preset abnormal reason, and the corresponding preset abnormal reason is matched according to the similarity comparison result.
It should be noted that, in the similarity comparison process in the above scheme, the characteristic distribution diagram and the distribution diagrams corresponding to a plurality of preset abnormal reasons are placed in the same coordinate system, the sum of absolute values of differences corresponding to different sequencing numbers is calculated and compared, and the preset corresponding to the minimum distribution diagram is selected as a matching result.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (8)
1. A monitoring management system for a glue line automated inspection apparatus, the system comprising:
the detection equipment parameter acquisition end is used for acquiring input parameters, operation parameters and detection result parameters of the equipment;
the detection result checking module is used for checking the detection result parameters according to the input parameters and the operation parameters of the equipment, and executing a state judgment strategy when the check result is abnormal;
the method comprises the steps of presetting a judgment glue path, wherein the judgment glue path is used as a working area of detection equipment when a state judgment strategy is executed;
and the judging and analyzing module is used for analyzing the process parameters of executing the state judging strategy and judging the state of the detection equipment according to the analysis result.
2. A monitoring and management system for an automated inspection apparatus for glue lines according to claim 1, wherein the input parameters include a glue dispensing speed;
the operation parameters comprise the total glue amount used for 3D glue paths and glue dispensing obtained by scanning the product;
the detection result parameters comprise glue line identification data;
the working process of the detection result checking module comprises the following steps:
and predicting the total glue amount according to the glue dispensing speed, the 3D glue path and the glue line identification data, comparing and analyzing the predicted total glue amount with the actually used total glue amount, and judging whether the checking result is abnormal according to the comparison and analysis result.
3. A monitoring and management system for a glue line automated inspection apparatus according to claim 2, wherein the process of alignment analysis comprises:
dividing the 3D glue path once according to different width values of the 3D glue path;
dividing the 3D glue path for the second time according to the glue line identification data;
segmenting the 3D glue path according to the primary segmentation and secondary segmentation results;
by the formulaCalculating to obtain predicted total gel amount->；
Wherein n is the number of segments, i=1, 2, … …, n;a width value for the ith segment; />A detection height value for the i-th segment;the dispensing speed is the dispensing speed; />The dispensing time of the ith section of the dispensing head is set; />、/>Is a reference coefficient, and->The method comprises the steps of carrying out a first treatment on the surface of the m is the number of turning points of the 3D glue path; />Fixing compensation quantity for the turning point;
the total glue amount will be predictedAnd the total glue quantity Q and error value +.>Comparing;
if it isAnd judging whether the checking result is abnormal or not.
4. The monitoring and management system for automatic glue line detection equipment according to claim 3, wherein the preset judging glue path comprises a stage, an arc section and a horizontal section, and each section is preset with a fixed glue amount;
the state judgment strategy comprises the following steps:
detecting a preset judging glue path through detection equipment to obtain first detection data;
and carrying out overlapping analysis on the first detection data and standard detection data corresponding to the preset judging glue path, and judging the state of the detection equipment according to an overlapping analysis result.
5. The monitoring and management system for an automated inspection device of glue lines of claim 4, wherein the process of overlap analysis comprises:
by the formulaCalculating to obtain overlapping coefficient->；
Wherein j=1, 2, 3;the detection height value of the j-th section from the position point of the length x of the starting point of the corresponding section is obtained; />The actual height value of the j-th section from the length position point x of the corresponding section starting point is obtained; />The total length of the j-th section; />The correction coefficient of the j-th section;
coefficient of coincidenceAnd a preset threshold->And (3) performing comparison:
if it isAnd judging that the state of the detection equipment is abnormal.
6. The monitoring and management system for automatic glue line detection equipment according to claim 5, wherein z types of abnormal glue dispensing points are preset in the preset judging glue path, and similar types of abnormal glue dispensing points are combined;
the process of overlap analysis further comprises:
by the formulaCalculating to obtain abnormal point identification coefficient->；
Wherein k is [1, z ]]；As the characteristic coefficient of the kth abnormal point of dispensing, when the kth abnormal point of dispensing is identified,the method comprises the steps of carrying out a first treatment on the surface of the When the kth point is not identified, the adhesive dispensing abnormal point is left in the first part>The method comprises the steps of carrying out a first treatment on the surface of the When the kth abnormal point of dispensing is identified as wrong, if the identification result is of a similar type combined with the actual abnormal point of dispensing, then +.>；/>The method comprises the steps of carrying out a first treatment on the surface of the Otherwise, go (L)>；
When (when)And judging that the state of the detection equipment is abnormal.
7. The system of claim 6, wherein the types of abnormal dispensing points include, but are not limited to, a missing, a spilled, a flying glue, and a lane departure.
8. The monitoring and management system for automatic glue line detection equipment according to claim 5, wherein the system further comprises a detection equipment fault tracing module, wherein the detection equipment fault tracing module is used for tracing an abnormality reason when judging that the detection equipment is abnormal;
the process of tracing the cause of the abnormality comprises the following steps:
each segment of the preset judging glue path is calculated according to the unit interval distance length to obtainIs a numerical value of (2);
pressing the buttonThe values of the segments are ordered from large to small, the ordering serial number is the x axis, the corresponding ordering value is the y axis, and a characteristic distribution diagram of the j segment is established;
and carrying out similarity comparison on the characteristic distribution diagram and a distribution diagram corresponding to the preset abnormal reason, and matching the corresponding preset abnormal reason according to the similarity comparison result.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116758719A (en) * | 2023-08-23 | 2023-09-15 | 深圳市磐锋精密技术有限公司 | Online monitoring system for production workshop equipment environment |
| CN117273553A (en) * | 2023-11-22 | 2023-12-22 | 青州市华康生物科技有限公司 | Production anomaly monitoring system based on syrup concentration detection |
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