CN116515431A - High-resistance Wen Xingre melt pressure-sensitive adhesive - Google Patents
High-resistance Wen Xingre melt pressure-sensitive adhesive Download PDFInfo
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- CN116515431A CN116515431A CN202310171042.0A CN202310171042A CN116515431A CN 116515431 A CN116515431 A CN 116515431A CN 202310171042 A CN202310171042 A CN 202310171042A CN 116515431 A CN116515431 A CN 116515431A
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- sensitive adhesive
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 100
- 239000012943 hotmelt Substances 0.000 claims abstract description 78
- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 59
- 229920001971 elastomer Polymers 0.000 claims abstract description 45
- 239000003208 petroleum Substances 0.000 claims abstract description 38
- 239000000654 additive Substances 0.000 claims abstract description 24
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 21
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 21
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 21
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003921 oil Substances 0.000 claims description 28
- 239000000843 powder Substances 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- 230000000996 additive effect Effects 0.000 claims description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 12
- 229920001568 phenolic resin Polymers 0.000 claims description 12
- 239000004615 ingredient Substances 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000006004 Quartz sand Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 5
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 3
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-temperature-resistant Wen Xingre melt pressure-sensitive adhesive, which belongs to the technical field of hot-melt pressure-sensitive adhesives, and comprises the specific formula components of 10-15 parts of naphthenic oil, 5-10 parts of maleic anhydride modified petroleum resin, 10-20 parts of petroleum resin, 15-25 parts of esterified rosin resin, 5-15 parts of SBS rubber, 20-30 parts of SIS rubber and 0.5-2 parts of additives.
Description
Technical Field
The invention relates to the technical field of hot-melt pressure-sensitive adhesives, in particular to a high-temperature-resistant Wen Xingre melt pressure-sensitive adhesive.
Background
The hot melt pressure sensitive adhesive is one kind of pressure sensitive adhesive and is one kind of adhesive tape with low cost and its advantages, and its viscosity is obviously affected by temperature. The packaging box is mainly used for various box seals, paper product packages, beverage bottle labels, sealing aluminum foils, waterproof coiled materials, express face sheets, flexible packages, other packaging and environment-friendly paper pallets and the like, and is suitable for various materials.
The hot-melt pressure-sensitive adhesive is generally applied to normal-temperature label adhesive tapes and the like. In some special packaging fields, the packaged product (such as new energy battery powder) is in a temperature state, and in this case, the adhesive tape needs to have certain high temperature resistance.
The product solves the problem of adhesion of the new energy battery packaging ton bag in high-temperature use, and ensures the adhesion reliability in the process of product packaging, transportation and use.
Based on the above, the present inventors found that:
at that time, when the conventional hot-melt pressure-sensitive adhesive is used, due to poor heat resistance of the hot-melt pressure-sensitive adhesive, when the adhesive is used for bonding under a higher temperature condition or bonding of objects which possibly generate temperature rise in the process of packaging, transporting and using the product, the adhesive effect is difficult to maintain for a long time, so that the practical use utility of the hot-melt pressure-sensitive adhesive is affected.
Accordingly, in view of the above, research and improvement are made on the existing structure, and a high Wen Xingre-resistant melt pressure-sensitive adhesive is provided to achieve the purpose of higher practical value.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a high Wen Xingre resistant pressure-sensitive adhesive, which can ensure that the generated hot-melt pressure-sensitive adhesive has high viscosity and glass strength at 50 ℃, and ensures the viscous effect and good performance of the hot-melt pressure-sensitive adhesive when the hot-melt pressure-sensitive adhesive is adhered under higher temperature conditions or adhered to objects possibly heated in the process of packaging, transporting and using products, thereby ensuring the practical use utility of the hot-melt pressure-sensitive adhesive.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The specific formula components of the high Wen Xingre-resistant melt pressure-sensitive adhesive comprise naphthenic oil, maleic anhydride modified petroleum resin, esterified rosin resin, SBS rubber, SIS rubber, additives and high-temperature-resistant powder, and the specific formula components of the high-temperature-resistant melt pressure-sensitive adhesive are as follows in mass ratio range:
naphthenic oil: 10-15 parts;
maleic anhydride modified petroleum resin: 5-10 parts;
petroleum resin: 10-20 parts;
esterified rosin resin: 15-25 parts;
SBS rubber: 5-15 parts;
SIS rubber: 20-30 parts;
additive: 0.5-2 parts;
high temperature resistant powder: 1-3 parts;
when the hot-melt pressure-sensitive adhesive is prepared according to a specific formula: adding the prepared naphthenic oil, SBS rubber, SIS rubber and additives into a reaction kettle, heating the heat conduction oil to 200 ℃ until the materials are heated, stirred and melted, adding maleic anhydride modified petroleum resin, petroleum resin and esterified rosin resin after the SBS/SIS rubber is melted, stirring and vacuumizing, controlling the material temperature to be 140-160 ℃ during stirring, stirring and melting for 30-45 min, and discharging after the materials are melted and mixed uniformly without obvious bubbles to form a hot-melt pressure-sensitive adhesive;
taking a container, adding distilled water for cleaning, drying the container when the cleaning is finished, adding 50 parts of hot-melt pressure-sensitive adhesive, heating, continuously stirring, adding 1 part of high-temperature-resistant powder, continuously stirring until the high-temperature-resistant powder is uniformly distributed in the hot-melt pressure-sensitive adhesive, and then carrying out staged cooling;
the high-temperature resistant powder is quartz sand powder and silicon carbide powder, and the adding mass ratio of the quartz sand powder to the silicon carbide powder is as follows:
quartz sand powder: silicon carbide powder=7:3.
Further, the hot-melt pressure-sensitive adhesive comprises the following ingredients in percentage by mass: 10 parts of naphthenic oil, 5 parts of maleic anhydride modified petroleum resin, 10 parts of petroleum resin, 15 parts of esterified rosin resin, 5 parts of SBS rubber, 20 parts of SIS rubber and 0.5 part of additive.
Further, the hot-melt pressure-sensitive adhesive comprises the following ingredients in percentage by mass: 12 parts of naphthenic oil, 10 parts of maleic anhydride modified petroleum resin, 15 parts of petroleum resin, 22 parts of esterified rosin resin, 10 parts of SBS rubber, 25 parts of SIS rubber and 1.2 parts of additive.
Further, when the hot-melt pressure-sensitive adhesive is produced and formula debugged, the blended naphthenic oil, SBS rubber, SIS rubber and additives are put into a reaction kettle, the heat conduction oil temperature is set to be 200 ℃, until the mixture is heated, stirred and melted, and the melting is judged as the standard: the metal spoon with 100 meshes and specification of 1mm is used for containing the blend, and the metal spoon does not contain the blend when lifted.
Further, the viscosity performance of the hot-melt pressure-sensitive adhesive is that the continuous viscosity is not lower than 12 hours at 50 ℃.
Further, the peel strength of the hot-melt pressure-sensitive adhesive is not lower than 20N at 50 ℃.
Further, during production and formula debugging, the hot-melt pressure-sensitive adhesive is stirred and melted for 45min, and the materials are melted and mixed uniformly, and when no obvious bubbles exist, the hot-melt pressure-sensitive adhesive is subjected to standing, cooling and molding.
Further, the additive is an antioxidant 1010 or an antioxidant 168.
Further, when the hot-melt pressure-sensitive adhesive is prepared from the ingredients:
adopting phenol formaldehyde resin to replace esterified rosin resin, and proportioning 15 parts by mass;
adopting phenolic resin to replace petroleum resin, and proportioning 20 parts by mass ratio;
when the maleic anhydride modified petroleum resin, the phenolic resin and the phenol formaldehyde resin are added, the low molecular weight polyisobutene is added as a viscosity reducing agent, and the viscosity of the finally produced hot melt pressure-sensitive adhesive is regulated.
Further, when the hot-melt pressure-sensitive adhesive is prepared from the ingredients:
the time of the stepwise cooling after adding the high temperature resistant powder is divided into:
preserving heat at 300 ℃ within 1min, cooling to 150 ℃ within 3min, cooling to 80 ℃ within 10min, and finally standing and cooling.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
according to the scheme, naphthenic oil, maleic anhydride modified petroleum resin, esterified rosin resin, SBS rubber, SIS rubber and additives are used as components of the hot-melt pressure-sensitive adhesive, then the stirring is carried out by regulating and controlling the processing temperature, the stirring time is controlled, the finally generated hot-melt pressure-sensitive adhesive is ensured to be kept in a uniform state, the generated hot-melt pressure-sensitive adhesive can have high viscosity and glass strength at 50 ℃, and when the hot-melt pressure-sensitive adhesive is bonded under a higher temperature condition or is used for bonding objects which possibly generate temperature rise in the process of product packaging, transportation and use, the viscous effect and good performance of the hot-melt pressure-sensitive adhesive are ensured, and the practical use utility of the hot-melt pressure-sensitive adhesive is further ensured.
Drawings
FIG. 1 is a schematic diagram of a system for hot melt adhesive production according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
Examples:
referring to fig. 1, the specific formulation components of the high Wen Xingre-resistant pressure-sensitive adhesive comprise naphthenic oil, maleic anhydride modified petroleum resin, esterified rosin resin, SBS rubber, SIS rubber, additives and high-temperature-resistant powder, and the specific formulation components of the high-temperature-resistant pressure-sensitive adhesive are as follows in mass ratio:
| naphthenic oil | 10 to 15 parts |
| Maleic anhydride modified petroleum resin | 5-10 parts |
| Petroleum resin | 10-20 parts |
| Esterified rosin resin | 15-25 parts |
| SBS rubber | 5-15 parts |
| SIS rubber | 20-30 parts |
| Additive agent | 0.5 to 2 parts |
| High temperature resistant powder | 1 to 3 parts of |
Referring to fig. 1, when the hot-melt pressure-sensitive adhesive is produced and formula debugged, adding the blended naphthenic oil, SBS rubber, SIS rubber and additives into a reaction kettle, conducting heat oil and setting the temperature to 200 ℃, until the materials are heated, stirred and melted, adding maleic anhydride modified petroleum resin, petroleum resin and esterified rosin resin after the SBS/SIS rubber is melted, stirring and vacuumizing, controlling the material temperature to be 140-160 ℃ during stirring, stirring and melting for 30-45 min, and discharging after the materials are melted and mixed uniformly without obvious bubbles to form the hot-melt pressure-sensitive adhesive.
Referring to fig. 1, the mass ratio of ingredients in the hot-melt pressure-sensitive adhesive is as follows: 10 parts of naphthenic oil, 5 parts of maleic anhydride modified petroleum resin, 10 parts of petroleum resin, 15 parts of esterified rosin resin, 5 parts of SBS rubber, 20 parts of SIS rubber and 0.5 part of additive.
Referring to fig. 1, the mass ratio of ingredients in the hot-melt pressure-sensitive adhesive is as follows: 12 parts of naphthenic oil, 10 parts of maleic anhydride modified petroleum resin, 15 parts of petroleum resin, 22 parts of esterified rosin resin, 10 parts of SBS rubber, 25 parts of SIS rubber and 1.2 parts of additive.
Referring to fig. 1, when the hot-melt pressure-sensitive adhesive is produced and formula debugged, adding the blended naphthenic oil, SBS rubber, SIS rubber and additives into a reaction kettle, setting the heat conduction oil temperature to be 200 ℃, and until the mixture is heated, stirred and melted, wherein the melting is judged as the standard: the metal spoon with 100 meshes and the specification of 1mm is used for containing the blend, and the interior of the metal spoon does not contain the blend when lifted;
and a metal spoon with 100 meshes and a specification of 1mm is adopted to test whether the blend is completely melted, so that the subsequent feeding is carried out in a state that the blend is completely melted, and the components of the finally-generated hot pain pressure-sensitive adhesive are ensured to be uniform.
Referring to FIG. 1, the adhesive performance of the hot-melt pressure-sensitive adhesive is that the continuous adhesive is not lower than 12 hours at 50 ℃;
the common hot-melt pressure-sensitive adhesive is difficult to ensure continuous adhesion at 50 ℃ when in use, and the hot-melt pressure-sensitive adhesive under the formula can be suitable for adhesion work under higher temperature conditions or adhesion of heat-generating articles such as batteries and the like.
Referring to fig. 1, the hot-melt pressure-sensitive adhesive has a peel strength of not less than 20N at 50 ℃;
the peel strength of the conventional hot-melt pressure-sensitive adhesive can be improved by more than 30% compared with the peel strength of the conventional hot-melt pressure-sensitive adhesive which can be corresponding to about 14N when in use.
Referring to fig. 1, during production and formula debugging, the hot-melt pressure-sensitive adhesive is stirred and melted for 45min, and the materials are melted and mixed uniformly, and when no obvious bubbles exist, the hot-melt pressure-sensitive adhesive is subjected to standing, cooling and molding;
the mixed material is formed by adopting a static cooling forming mode, so that the temperature reduction is avoided to be too fast, and the uniformity of material forming is ensured.
Referring to fig. 1, the additive is an antioxidant 1010 or an antioxidant 168;
referring to fig. 1, the hot-melt pressure-sensitive adhesive formulation is prepared by:
adopting phenol formaldehyde resin to replace esterified rosin resin, and proportioning 15 parts by mass;
adopting phenolic resin to replace petroleum resin, and proportioning 20 parts by mass ratio;
when maleic anhydride modified petroleum resin, phenolic resin and phenol formaldehyde resin are added, low molecular weight polyisobutene is added as a viscosity reducing agent, and the viscosity of the finally produced hot melt pressure-sensitive adhesive is regulated;
by changing the ingredients in the hot-melt pressure-sensitive adhesive, the reaction effect of the hot-melt pressure-sensitive adhesive on heat during actual preparation and use is improved, meanwhile, the viscosity of the hot-melt pressure-sensitive adhesive is regulated, the hot-melt pressure-sensitive adhesive is ensured to be used under proper viscosity, and the practicability of the hot-melt pressure-sensitive adhesive is improved.
Referring to fig. 1, the hot-melt pressure-sensitive adhesive formulation is prepared by:
the time of the stepwise cooling after adding the high temperature resistant powder is divided into:
preserving heat at 300 ℃ within 1min, cooling to 150 ℃ within 3min, cooling to 80 ℃ within 10min, and finally standing and cooling.
When in use:
selecting 10 parts of naphthenic oil, 5 parts of SBS rubber, 20 parts of SIS rubber and 1 part of additive according to the mass ratio in the process of producing the hot-melt pressure-sensitive adhesive, adding into a reaction kettle, heating the heat conduction oil to 200 ℃ until the heat conduction oil is heated, stirring and melting, at the moment, using a metal spoon with 100 meshes and the specification of 1mm to contain the blend, lifting the metal spoon without the blend, adding 5 parts of maleic anhydride modified petroleum resin, 10 parts of petroleum resin, 15 parts of esterified rosin resin, stirring and vacuumizing, controlling the material temperature at 140-160 ℃ in stirring, stirring and melting for 30-45 min, uniformly melting and mixing the materials, and standing, cooling and forming to obtain the hot-melt pressure-sensitive adhesive when no obvious bubbles exist;
then taking a container, adding distilled water for cleaning, drying the container when cleaning is finished, adding 50 parts of hot-melt pressure-sensitive adhesive, heating, continuously stirring, and then adding quartz sand powder with the mass ratio of: 1 part of high-temperature resistant powder of silicon carbide powder=7:3, continuing stirring until the high-temperature resistant powder is uniformly distributed in the hot-melt pressure-sensitive adhesive, and then carrying out staged cooling to generate the final high-temperature resistant hot-melt pressure-sensitive adhesive;
when the hot-melt pressure-sensitive adhesive is used, the generated hot-melt pressure-sensitive adhesive has the viscosity performance of not lower than 12 hours under the condition of 50 ℃, the peeling strength of not lower than 20N under the condition of 50 ℃, and the adhesive effect and good performance of the hot-melt pressure-sensitive adhesive are ensured when the hot-melt pressure-sensitive adhesive is adhered under the condition of higher temperature or adhered to objects possibly heated in the process of packaging, transporting and using the products, so that the practical use utility of the hot-melt pressure-sensitive adhesive is ensured;
thus, the production and the use of the hot-melt pressure-sensitive adhesive can be completed.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (10)
1. A high Wen Xingre melt pressure sensitive adhesive, characterized in that: the specific formula components of the hot-melt pressure-sensitive adhesive comprise naphthenic oil, maleic anhydride modified petroleum resin, esterified rosin resin, SBS rubber, SIS rubber, additives and high-temperature-resistant powder, and the specific formula components of the hot-melt pressure-sensitive adhesive are in the following mass ratio range:
naphthenic oil: 10 to 15 parts
Maleic anhydride modified petroleum resin: 5-10 parts
Petroleum resin: 10-20 parts
Esterified rosin resin: 15-25 parts
SBS rubber: 5-15 parts
SIS rubber: 20-30 parts
Additive: 0.5 to 2 parts
High temperature resistant powder: 1-3 parts;
when the hot-melt pressure-sensitive adhesive is prepared according to a specific formula: adding the prepared naphthenic oil, SBS rubber, SIS rubber and additives into a reaction kettle, heating the heat conduction oil to 200 ℃ until the materials are heated, stirred and melted, adding maleic anhydride modified petroleum resin, petroleum resin and esterified rosin resin after the SBS/SIS rubber is melted, stirring and vacuumizing, controlling the material temperature to be 140-160 ℃ during stirring, stirring and melting for 30-45 min, and discharging after the materials are melted and mixed uniformly without obvious bubbles to form a hot-melt pressure-sensitive adhesive;
taking a container, adding distilled water for cleaning, drying the container when the cleaning is finished, adding 50 parts of hot-melt pressure-sensitive adhesive, heating, continuously stirring, adding 1 part of high-temperature-resistant powder, continuously stirring until the high-temperature-resistant powder is uniformly distributed in the hot-melt pressure-sensitive adhesive, and then carrying out staged cooling;
the high-temperature resistant powder is quartz sand powder and silicon carbide powder, and the adding mass ratio of the quartz sand powder to the silicon carbide powder is as follows:
quartz sand powder: silicon carbide powder=7:3.
2. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: the hot-melt pressure-sensitive adhesive comprises the following ingredients in percentage by mass: 10 parts of naphthenic oil, 5 parts of maleic anhydride modified petroleum resin, 10 parts of petroleum resin, 15 parts of esterified rosin resin, 5 parts of SBS rubber, 20 parts of SIS rubber and 0.5 part of additive.
3. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: the hot-melt pressure-sensitive adhesive comprises the following ingredients in percentage by mass: 12 parts of naphthenic oil, 10 parts of maleic anhydride modified petroleum resin, 15 parts of petroleum resin, 22 parts of esterified rosin resin, 10 parts of SBS rubber, 25 parts of SIS rubber and 1.2 parts of additive.
4. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: when the hot-melt pressure-sensitive adhesive is produced and formula debugged, adding the blended naphthenic oil, SBS rubber, SIS rubber and additives into a reaction kettle, setting the heat conduction oil temperature to be 200 ℃, and judging that the melting is standard as follows: the metal spoon with 100 meshes and specification of 1mm is used for containing the blend, and the metal spoon does not contain the blend when lifted.
5. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: the viscosity performance of the hot-melt pressure-sensitive adhesive is that the continuous viscosity is not lower than 12 hours at 50 ℃.
6. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: the peel strength of the hot-melt pressure-sensitive adhesive is not lower than 20N at 50 ℃.
7. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: when the hot-melt pressure-sensitive adhesive is produced and formula debugged, stirring and melting are carried out for 45min, materials are melted and mixed uniformly, and when no obvious bubbles exist, standing, cooling and forming are carried out.
8. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: the additive is an antioxidant 1010 or an antioxidant 168.
9. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: when the hot-melt pressure-sensitive adhesive is prepared from the ingredients:
adopting phenol formaldehyde resin to replace esterified rosin resin, and proportioning 15 parts by mass;
adopting phenolic resin to replace petroleum resin, and proportioning 20 parts by mass ratio;
when the maleic anhydride modified petroleum resin, the phenolic resin and the phenol formaldehyde resin are added, the low molecular weight polyisobutene is added as a viscosity reducing agent, and the viscosity of the finally produced hot melt pressure-sensitive adhesive is regulated.
10. The high Wen Xingre melt pressure sensitive adhesive of claim 1, wherein: when the hot-melt pressure-sensitive adhesive is prepared from the ingredients:
the time of the stepwise cooling after adding the high temperature resistant powder is divided into:
preserving heat at 300 ℃ within 1min, cooling to 150 ℃ within 3min, cooling to 80 ℃ within 10min, and finally standing and cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310171042.0A CN116515431A (en) | 2023-02-27 | 2023-02-27 | High-resistance Wen Xingre melt pressure-sensitive adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310171042.0A CN116515431A (en) | 2023-02-27 | 2023-02-27 | High-resistance Wen Xingre melt pressure-sensitive adhesive |
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| Publication Number | Publication Date |
|---|---|
| CN116515431A true CN116515431A (en) | 2023-08-01 |
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|---|---|---|---|
| CN202310171042.0A Pending CN116515431A (en) | 2023-02-27 | 2023-02-27 | High-resistance Wen Xingre melt pressure-sensitive adhesive |
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| Country | Link |
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| CN (1) | CN116515431A (en) |
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2023
- 2023-02-27 CN CN202310171042.0A patent/CN116515431A/en active Pending
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