CN116507191A - Flexible piezoelectric sensor - Google Patents
Flexible piezoelectric sensor Download PDFInfo
- Publication number
- CN116507191A CN116507191A CN202310508259.6A CN202310508259A CN116507191A CN 116507191 A CN116507191 A CN 116507191A CN 202310508259 A CN202310508259 A CN 202310508259A CN 116507191 A CN116507191 A CN 116507191A
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- packaging
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 46
- 238000005538 encapsulation Methods 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 10
- 230000006355 external stress Effects 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- -1 organosilicon Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a flexible piezoelectric sensor, which belongs to the technical field of piezoelectric sensors and comprises a piezoelectric sheet and a packaging structure; the piezoelectric sheet comprises a first electrode, a piezoelectric layer and a second electrode; the packaging structure comprises a first packaging layer and a second packaging layer; the piezoelectric sheet is arranged in an encapsulation space formed between the first encapsulation layer and the second encapsulation layer; the packaging layer is provided with a first wire and a second wire; the first wire is in non-fixed contact with the first electrode, and the second wire is in non-fixed contact with the second electrode. The piezoelectric thin sheet is arranged in the packaging space formed between the first packaging layer and the second packaging layer, the first lead and the second lead are respectively in non-fixed contact with the first electrode and the second electrode by utilizing the connection of the first packaging layer and the second packaging layer, and the contact conduction between the lead and the electrode can be ensured by adopting a non-fixed contact connection mode, and the influence on measurement caused by the generation of external stress between the lead and the electrode is avoided.
Description
Technical Field
The invention relates to the technical field of piezoelectric sensors, in particular to a flexible piezoelectric sensor.
Background
Piezoelectric sensors are used to measure various dynamic forces, mechanical shocks and vibrations, convert the forces or deformations into electrical signals, and have been widely used in acoustic, medical, mechanical, navigation and other fields.
The structure of the existing piezoelectric sensor measuring part is that two electrodes are respectively arranged on the front surface and the rear surface of a sensor element, and welding spots formed by welding are fixedly connected together between the electrodes and a wire, and the mode can realize the fixed connection between the electrodes and the wire, but high temperature can be generated during welding, so that materials shrink to generate welding stress; moreover, since the electrode and the lead are made of different materials, when the external environment of the two materials is changed, external stress can be generated, for example, when thermal expansion phenomenon occurs, thermal stress can be generated between the electrode and the lead; because the compression modulus of the electrode and the wire is different, when the flexible piezoelectric sensor is deformed due to measurement, the tensile degrees of the two materials are different, additional stress is generated, the wire is easy to drop off under the action of external force, and the service life is influenced.
The organic piezoelectric film has the characteristics of good flexibility and suitability for measuring the surface of an irregular object, so that the sensor element of the conventional flexible piezoelectric sensor usually adopts the organic piezoelectric film. However, the organic piezoelectric film needs to remove the solvent in the stock solution in the manufacturing process, so that the thickness of the cured organic piezoelectric film is uneven, the measurement accuracy is affected, and the organic piezoelectric film has poor heat resistance and is difficult to apply in a high-temperature environment.
Disclosure of Invention
The present invention is directed to a flexible piezoelectric sensor, which solves one or more of the above-mentioned problems.
To achieve the purpose, the invention adopts the following technical scheme:
a flexible piezoelectric sensor comprises a piezoelectric sheet and a packaging structure;
the piezoelectric sheet comprises a first electrode and a piezoelectric layer second electrode;
the packaging structure comprises a first packaging layer and a second packaging layer;
the piezoelectric sheet is arranged in an encapsulation space formed between the first encapsulation layer and the second encapsulation layer;
the packaging layer is provided with a first wire and a second wire;
the first wire is in non-fixed contact with the first electrode, and the second wire is in non-fixed contact with the second electrode.
Preferably, the piezoelectric sheet comprises a substrate layer, and the first electrode, the piezoelectric layer and the second electrode are sequentially arranged on the same side of the substrate layer.
Preferably, an adhesive layer is disposed on the surface of the first packaging layer, the first conductive wire and the second conductive wire are on the second packaging layer, and the second packaging layer is covered on the surface of the first packaging layer through adhesion of the adhesive layer on the surface of the first packaging layer.
Preferably, the first encapsulation layer is bonded to the substrate layer of the piezoelectric sheet.
Preferably, an insulating layer is arranged between the first lead and the edge of the piezoelectric sheet.
Preferably, the piezoelectric layer is made of an inorganic piezoelectric material.
Preferably, the piezoelectric sheet has a thickness of 5 μm to 60 μm.
Preferably, the piezoelectric layer has a thickness of < 10 μm.
Preferably, the encapsulation layer is made of an organic material.
The beneficial effects of the invention are as follows: the first electrode, the piezoelectric layer and the second electrode are sequentially overlapped in the packaging space formed between the first packaging layer and the second packaging layer, the first lead and the second lead are respectively in non-fixed contact with the first electrode and the second electrode by utilizing the connection of the first packaging layer and the second packaging layer, the contact conduction between the lead and the electrode can be ensured by adopting a non-fixed contact connection mode, and the influence of external stress generated between the lead and the electrode on measurement is avoided, so that the flexible piezoelectric sensor can truly reflect signals of a measurement object, and the measurement accuracy is ensured. The first lead and the first electrode and the second lead and the second electrode are connected in a non-fixed contact manner, so that the situation that the lead and the electrode are pulled to fall off when the flexible piezoelectric sensor is bent in the measurement process is avoided, and the service life of the piezoelectric sensor is prolonged.
Drawings
The present invention is further illustrated by the accompanying drawings, which are not to be construed as limiting the invention in any way.
FIG. 1 is a schematic view of the internal structure of one embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure of one embodiment of the present invention.
Wherein: the first encapsulation layer 11, the second encapsulation layer 12, the first electrode 21, the piezoelectric layer 22, the second electrode 23, the first wire 31, the second wire 32, the adhesive layer 111, the substrate layer 4, the etched portion 221, the contact conductive portion 231, and the insulating layer 5.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1 and 2, a flexible piezoelectric sensor of this embodiment includes a piezoelectric sheet and a packaging structure, where the piezoelectric sheet includes a first electrode 21, a piezoelectric layer 22 and a second electrode 23, the packaging structure includes a first packaging layer 11 and a second packaging layer 12, a first conductive wire 31 and a second conductive wire 32 are disposed on the packaging layer, a packaging space is formed between the first packaging layer 11 and the second packaging layer 12, the first electrode 21, the piezoelectric layer 22 and the second electrode 23 are sequentially stacked and disposed in the packaging space, the first conductive wire 31 and the second conductive wire 32 are disposed on the second packaging layer 12, one end of the first conductive wire 31 is attached to the first electrode 21 to form non-fixed contact, and one end of the second conductive wire 32 is attached to the second electrode 23 to form non-fixed contact.
By sequentially overlapping the first electrode 21, the piezoelectric layer 22 and the second electrode 23 in the packaging space formed between the first packaging layer 11 and the second packaging layer 12, the connection between the first packaging layer 11 and the second packaging layer 12 is utilized to realize the non-fixed contact between the first wire 31 and the second wire 32 and the first electrode 21 and the second electrode 23 respectively, the connection mode of non-fixed contact can ensure the contact conduction between the wires and the electrodes, and avoid the influence on the measurement caused by the external stress generated between the wires and the electrodes. The first lead 31 and the first electrode 21 and the second lead 32 and the second electrode 23 are connected in a non-fixed contact manner, so that the situation that the lead and the electrode are pulled and fall off when the flexible piezoelectric sensor is bent in the measurement process is avoided, and the service life of the piezoelectric sensor is prolonged.
Preferably, the piezoelectric element further comprises a substrate layer 4, and the first electrode 21, the piezoelectric layer 22 and the second electrode 23 are sequentially arranged on the same side of the substrate layer 4. Since the piezoelectric layer 22 made of an inorganic piezoelectric material is adopted in the present embodiment, the thickness of the piezoelectric layer 22 is thin in order to secure the flexibility of the piezoelectric layer 22, and thus the substrate layer 4 is provided to play a supporting role for the piezoelectric layer 22.
Preferably, the surface of the first encapsulation layer 11 is provided with an adhesive layer 111, and the second encapsulation layer 12 covers the surface of the first encapsulation layer 11 by adhesion with the adhesive layer 111 on the surface of the first encapsulation layer 11. By providing the adhesive layer 111 on the surface of the first encapsulation layer 11, the adhesive connection between the first encapsulation layer 11 and the second encapsulation layer 12 is achieved, so that an encapsulation space accommodating the first electrode 21, the piezoelectric layer 22 and the second electrode 23 is formed between the first encapsulation layer 11 and the second encapsulation layer 12, and the first conductive wire 31 and the second conductive wire 32 fixed on the second encapsulation layer 12 are respectively bonded with the first electrode 21 and the second electrode 23 to maintain non-fixed contact.
Preferably, the first encapsulation layer 11 is bonded to the substrate layer 4 of the piezoelectric sheet.
Preferably, an insulating layer 5 is provided between the first wire 31 and the edge of the piezoelectric sheet. At the edge of the piezoelectric sheet, damage or burrs are formed at the edge of the device during cutting, so that the first electrode 21 is exposed on the surface, and in order to avoid contact between the first wire 31 and the first electrode 21 and short circuit between the first electrode 21 and the second electrode 23, at least one insulating layer 5 is required to cover the position where the short circuit between the first wire 31 and the edge of the piezoelectric sheet may occur during packaging, so as to ensure isolation of electrical signals between the first wire 31 and the second electrode 23 of the piezoelectric sheet. The insulating layer 5 may be selected from organic insulating materials such as reline (Parylene), epoxy resin, polychloroprene, organosilicon, polyacrylate, etc., or may be made of one or more inorganic insulating materials such as silicon dioxide, silicon nitride, etc. In this embodiment, the insulating layer is made of silicone resin.
Preferably, the piezoelectric layer 22 is made of an inorganic piezoelectric material. In the embodiment, the piezoelectric layer 22 made of the inorganic piezoelectric material is used as a sensor element, and compared with the organic piezoelectric film adopted in the prior art, the thickness of the inorganic piezoelectric layer 22 is more uniform, so that the measurement accuracy is improved; and the inorganic piezoelectric layer 22 has better heat resistance and can be applied to environments such as high temperature.
Preferably, the thickness of the piezoelectric sheet is between 5 μm and 60 μm, more preferably between 10 and 40 μm. If the piezoelectric sheet is too thick, the device lacks flexibility and the sensitivity is reduced; if the piezoelectric sheet is too thin, damage can be easily introduced into the piezoelectric layer 22 during fabrication, causing leakage or even conduction, thereby affecting the performance and lifetime of the device.
Preferably, the thickness of the piezoelectric layer 22 is < 10 μm, more preferably the thickness is chosen to be between 1 and 2 μm. When the thickness of the piezoelectric layer 22 is less than 1 μm, the device sensitivity is low accordingly; when the thickness of the piezoelectric layer 22 is greater than 2 μm, the sensitivity response of the device is not increased greatly, but the cost of the device is increased greatly, and the flexibility of the device is reduced.
Preferably, the encapsulation structure is made of an organic material, preferably Polyimide (PI).
Preferably, the piezoelectric layer 22 is provided with a corrosion portion 221, the second electrode 23 is provided with a contact conductive portion 231, the corrosion portion 221 corresponds to the contact conductive portion 231 vertically, and the contact conductive portion 231 is bonded to one end of the second wire 32. The corrosion part 221 is formed by etching a part of the piezoelectric layer 22, so that the contact conductive part 231 of the second electrode 23 can be exposed from the upper surface of the second electrode 23 through the corrosion part 221, and the first wire 31 and the second wire 32 can be arranged on the second encapsulation layer 12, and the first wire 31 and the first electrode 21 and the second wire 32 and the second electrode 23 can be kept in contact conduction by the adhesion of the first encapsulation layer 11 and the second encapsulation layer 12, so that the non-fixed contact of the wires and the electrodes is realized.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (9)
1. A flexible piezoelectric sensor is characterized by comprising a piezoelectric sheet and a packaging structure;
the piezoelectric sheet comprises a first electrode, a piezoelectric layer and a second electrode;
the packaging structure comprises a first packaging layer and a second packaging layer;
the piezoelectric sheet is arranged in an encapsulation space formed between the first encapsulation layer and the second encapsulation layer;
the packaging layer is provided with a first wire and a second wire;
the first wire is in non-fixed contact with the first electrode, and the second wire is in non-fixed contact with the second electrode.
2. A flexible piezoelectric transducer according to claim 1, wherein the piezoelectric sheet comprises a substrate layer, and the first electrode, piezoelectric layer and second electrode are disposed on the same side of the substrate layer in that order.
3. The flexible piezoelectric sensor according to claim 1, wherein the surface of the first encapsulation layer is provided with an adhesive layer, the first conductive wire and the second conductive wire are on the second encapsulation layer, and the second encapsulation layer covers the surface of the first encapsulation layer by adhesion with the adhesive layer on the surface of the first encapsulation layer.
4. A flexible piezoelectric sensor according to claim 2, wherein the first encapsulation layer and the substrate layer are bonded.
5. A flexible piezoelectric sensor according to claim 1, wherein an insulating layer is provided between the first wire and the edge of the piezoelectric sheet.
6. A flexible piezoelectric sensor according to claim 1, wherein the piezoelectric layer is made of an inorganic piezoelectric material.
7. A flexible piezoelectric transducer according to claim 1, wherein the piezoelectric sheet has a thickness of between 5 μm and 60 μm.
8. A flexible piezoelectric sensor according to claim 1, wherein the piezoelectric layer has a thickness of < 10 μm.
9. A flexible piezoelectric transducer according to claim 1, wherein the encapsulation structure is made of an organic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310508259.6A CN116507191A (en) | 2023-05-08 | 2023-05-08 | Flexible piezoelectric sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310508259.6A CN116507191A (en) | 2023-05-08 | 2023-05-08 | Flexible piezoelectric sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116507191A true CN116507191A (en) | 2023-07-28 |
Family
ID=87318061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310508259.6A Pending CN116507191A (en) | 2023-05-08 | 2023-05-08 | Flexible piezoelectric sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116507191A (en) |
-
2023
- 2023-05-08 CN CN202310508259.6A patent/CN116507191A/en active Pending
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